JP2008072454A - Tray for frequency regulation, and frequency regulation apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the nonconformities of a conventional frequency regulation apparatus, such as deterioration in the frequency regulation accuracy due to the vibration of a tray and a mask, deterioration in frequency regulation accuracy caused by long distance between an ion gun and a piezoelectric resonance element, and complex works of alignment between a product holding tray and a frequency regulating mask. <P>SOLUTION: A tray 1 for frequency regulation comprises a holding concave section 2 and a beam incidence hole 3. The concave section 2 accommodates an insulated container 20 within an aperture, arranged at one surface, in a state where the aperture has been placed upside down. Wherein, the insulated container 20 holds a piezoelectric resonance element 25. The beam incidence hole penetrates the bottom of the concave section, and comprises a lower concave section 4 of small diameter formed at the bottom of the concave section in a shape of steps and a hole 6 for beam incidence of smaller diameter formed at a thin bottom 5 of the lower concave section 4. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a frequency adjustment tray and a frequency adjustment apparatus that can improve the accuracy of frequency adjustment work using an ion beam performed in the process of manufacturing a piezoelectric device.

A surface-mount type piezoelectric device having a structure in which a piezoelectric vibration element is hermetically sealed in a surface-mount package, such as a crystal resonator, is used as a reference frequency in communication devices such as mobile phones and pagers, and electronic devices such as computers. Although it is used as a generation source, a filter, etc., miniaturization of piezoelectric devices is also required in response to miniaturization of these various devices. Recently, a crystal unit having a package size of 5 × 3.2 mm or less (for example, 1.6 × 1.2 mm square) has been developed.
A piezoelectric vibration element constituting a surface-mount type piezoelectric device has a structure in which an excitation electrode and a metal film constituting a lead electrode are formed on the surface of a piezoelectric substrate. The piezoelectric vibration element is placed in an insulating container for surface mounting. A piezoelectric device is assembled by hermetically sealing the opening of the insulating container with a lid while being held on the element mounting pad using a conductive adhesive.
The work of adjusting the frequency of the piezoelectric vibration element is that an ion beam is applied to a part of the excitation electrode film on the surface of the piezoelectric vibration element before the opening is sealed with the lid after the piezoelectric vibration element is accommodated in the insulating container. It is carried out by transpiration.

As described above, when the area of the piezoelectric vibration element housed in the insulating container is reduced in accordance with the reduction in the size of the package, the excitation electrode film is also reduced in size, so that the frequency adjustment work by the ion beam is performed. There is an increasing need to perform the above with higher accuracy.
As disclosed in Japanese Patent Laid-Open No. 2006-100205 (Patent Document 1), when adjusting the frequency of a piezoelectric vibration element that constitutes a piezoelectric vibrator with a conventional ion beam, an insulating container in which the piezoelectric vibration element is mounted is provided. A product holding tray having a large number of receiving recesses on the upper surface, and a frequency adjustment mask having a number of openings processed with high precision to limit the irradiation range of the ion beam to the piezoelectric vibration element in each insulating container; The adjustment work was carried out in combination.
That is, FIGS. 6A and 6B are a configuration explanatory diagram and a main configuration configuration diagram of a frequency adjusting device using an ion beam in the conventional example, and a product holding tray made of stainless steel or the like and having a thickness of about 2 mm. A large number of receiving recesses 101 are formed in the upper surface of 100 to receive the insulating container 110 in which the piezoelectric vibration element 111 is accommodated and the opening is opened. The insulating container 110 is housed in the housing recess 101 with the opening facing downward, and the beam incident hole 102 formed through the bottom of the housing recess 101 is in communication with the opening of the insulating container. Yes.

The frequency adjustment mask 120 made of stainless steel or the like has a thickness of about 0.2 mm, and an opening 121 for allowing the ion beam 131 emitted from the ion gun 130 disposed below is provided on the product holding tray 100 side. It has a configuration in which it is formed so as to penetrate at a position corresponding to each receiving recess 101. The opening 121 is processed with high accuracy so as to have a shape that matches the contour shape of the excitation electrode film formed on the surface of the piezoelectric vibration element.
At the time of frequency adjustment, the plate-shaped product holding tray 100 is superimposed and positioned on the upper surface of the thin plate-shaped mask 120 whose outer peripheral edge is supported by a support frame of the frequency adjusting device main body (not shown), and both are fixed in parallel.
Probes 116 extending from the frequency measuring device 115 are disposed above the product holding tray 100, and a plurality of probe pins 117 protruding from the tip of the probe 116 are attached to the same number of mounting terminals 112 disposed on the back surface of the insulating container 100. On the other hand, the piezoelectric vibration element 111 is excited by being pressed from above and energized. The resonance frequency output by exciting the piezoelectric vibration element 111 is measured by the frequency measuring device 115. When the measured resonance frequency is lower than a specified value, the ion beam 131 is emitted from the ion gun 130 to thereby generate the piezoelectric vibration. The frequency is adjusted by evaporating a predetermined amount of the excitation electrode film formed on the piezoelectric substrate surface of the element 111.

  As described above, the conventional frequency adjusting device uses the opening 121 formed in the mask 120 separate from the product holding tray as means for determining the irradiation range of the ion beam for adjusting the frequency, It is necessary to fix the mask 120 after accurately aligning it with the lower surface side of the product holding tray 100. Therefore, it is sufficient to form a large beam incident hole 102 with low dimensional accuracy on the product holding tray 100 side. Further, even if a high-precision opening 121 is formed on a mask with low manufacturing cost, the cost of the mask can be kept relatively low, and the piezoelectric vibrator having different specifications by the same product holding tray 100 When frequency adjustment is performed with the insulating container held, there is an advantage that only the mask can be replaced with one having a different shape such as an opening.

On the other hand, a gap G is formed between the product holding tray 100 and the mask 120, and the product holding tray 100 and the mask 120, in which only the outer peripheral edge is supported by the support frame, is easily bent and deformed in the center in the thickness direction. It has a structure. In particular, since the mask 120 is thin, it is easier to bend and deform.
In the frequency measurement operation, the probe pin 117 protruding from the tip of the probe 116 is pressed against the mounting terminal 112 provided on the back surface of the insulating container 110 to conduct electricity while ensuring conduction. At this time, the product holding tray 100 and the mask 120 are moved downward. Therefore, vibration is generated due to a large deformation and the frequency measurement value is likely to vary. In particular, frequency measurement by the probe is performed on each piezoelectric vibration element while moving the probe. Therefore, when the probe pin is separated from the back surface of the insulating container, the product holding tray and the mask vibrate due to the reaction, and therefore the frequency measurement varies. Becomes even larger. That is, the vibration of the product holding tray fluctuates the irradiation range and irradiation amount of the ion beam in order to bring about the vibration of the held piezoelectric vibration element, thereby increasing the adverse effect on the frequency adjustment work. In addition, since the mask is thinner and easier to vibrate than the product holding tray, the mask continues to vibrate even when the product holding tray 100 finishes oscillating. Therefore, the vibration of the mask is transmitted to the tray side to insulate the tray. The vibration of the container will also be prolonged. Further, when the mask vibrates, there is a risk that the irradiation range of the beam fluctuates due to interference by the peripheral edge of the aperture when the ion beam passes through the aperture processed in the mask with high accuracy. Further, since a gap G is inevitably formed between the product holding tray 100 and the mask 120, the distance between the ion gun 130 and the piezoelectric vibration element 111 in the housing recess 101 is increased. The position accuracy of the spot where the beam reaches decreases, and the frequency adjustment accuracy decreases.
In addition, if the frequency adjustment is performed in a state where there is even a slight deviation in the alignment between the product holding tray 100 and the mask 120, an accurate and efficient frequency adjustment becomes impossible. Therefore, the alignment operation prior to the measurement operation is extremely difficult. It becomes complicated.
JP 2006-100205 A

  As described above, in the conventional frequency adjusting device, the frequency adjusting mask as a separate member is arranged close to the product holding tray that holds the insulating container constituting the surface mount type piezoelectric device. The surface of the piezoelectric vibration element in the insulating container is irradiated with an ion beam through the formed high-precision opening and the low-precision beam incident hole formed in the product holding tray. For this reason, the product holding tray and the mask vibrate due to the pressure when the probe pin is brought into contact with the mounting terminal on the back surface of the insulating container and the reaction when the probe pin is separated, and the measured frequency varies. There was a problem. In particular, when the product holding tray vibrates, the piezoelectric vibration element supported by the tray swings, so that the irradiation range and irradiation amount of the ion beam vary, and the frequency adjustment effect is likely to vary. Further, since a gap is formed between the product tray and the mask, there is a problem that the distance between the ion gun and the surface of the piezoelectric vibration element increases, and the frequency adjustment accuracy decreases accordingly. In addition, the product holding tray and the frequency adjustment mask, which are performed prior to the frequency adjustment work, need to be accurately aligned, resulting in a decrease in productivity.

  The present invention has been made in view of the above, and in a state where the product holding tray and the frequency adjustment mask are overlapped, the frequency is obtained by irradiating the piezoelectric vibrating element in the insulating container held by the tray with an ion beam. Decrease in frequency adjustment accuracy due to tray and mask vibration, which is a disadvantage of conventional frequency adjustment devices that perform adjustment, and decrease in frequency adjustment accuracy caused by a long distance between the ion gun and the piezoelectric vibration element, as well as products It is an object of the present invention to provide a frequency adjustment tray and a frequency adjustment device that can solve various problems such as complicated positioning work between the holding tray and the frequency adjustment mask.

In order to achieve the above object, the frequency adjustment tray according to the first aspect of the present invention can accommodate an insulating container that accommodates a piezoelectric vibration element in an opening with the opening facing downward. A tray for frequency adjustment provided with a recess, wherein the bottom of the accommodating portion has a through hole for allowing a beam to enter.
Conventionally, an ion beam is applied to the excitation electrode on the surface of the piezoelectric vibration element with high accuracy through a tray as a means for holding an insulating container containing a piezoelectric vibration element as a frequency adjustment object and a beam incident hole provided in the tray. Since the mask is provided separately from the mask provided with the opening, the workability is lowered due to the complicated work of aligning the two, and the probe pin is brought into contact with and separated from the mounting terminal provided on the back surface of the insulating container. There are problems such as variations in the frequency adjustment effect due to vibrations generated by this, and a decrease in frequency adjustment accuracy caused by a long distance between the ion gun and the piezoelectric vibration element. On the other hand, in the present invention, the thickness of the frequency adjusting tray is maintained at the same level as that of the conventional product holding reply, and the bottom of the receiving recess for supporting the insulating container is provided at the bottom of the tray, thereby providing the bottom of the tray. Since a thin bottom is formed in the lower part, it is possible to form a small hole (mask opening) for high-precision beam incidence by performing high-precision cutting using the thin bottom. Therefore, it is possible to solve various problems that have occurred due to the separate configuration of the tray and the mask. In particular, the housing recess, the lower recess, and the small holes for beam incidence can be formed by cutting from one side of the tray, so that productivity can be increased.

Further, in the frequency adjusting tray according to the second aspect of the present invention, the through hole is formed in a lower recess formed in a bottom portion of the receiving recess and a bottom portion of the lower recess, and from the lower recess. And a small hole for beam incidence having a small diameter.
According to the present invention, it is possible to obtain substantially the same effect as the first aspect of the present invention.
Further, in the frequency adjustment tray of the present invention, the through hole is formed in a beam incident small hole formed in a bottom portion of the receiving recess, and in a bottom portion of the beam incident small hole, and the beam incident small hole is formed. And a lower recess having a diameter larger than that of the hole.
According to the present invention, it is possible to obtain substantially the same effect as the first aspect of the present invention.

The frequency adjusting device of the present invention is a frequency provided with a frequency adjusting tray in each of the above inventions and a probe pin that comes into contact with the mounting terminal of the insulating container accommodated in the accommodating recess of the frequency adjusting tray. A measuring instrument and an ion gun that irradiates the surface of the piezoelectric vibration element through the small hole for beam incidence with an ion beam are provided.
According to the present invention, positioning can be completed and measurement can be started simply by setting the frequency adjusting tray at a predetermined position of the frequency adjusting device. Even when the probe pin is brought into contact with or separated from the mounting terminal of the insulating container in the housing recess, the vibration of the frequency adjustment tray is eliminated in a short time and the adjustment accuracy is not deteriorated. In particular, when a mask having a separate structure is supported by the same support frame as the tray as in the prior art, the vibration of the mask made of a thin plate material vibrates the piezoelectric vibration element supported by the tray for a long time. However, such a problem disappears. Further, since the distance between the ion gun and the surface of the piezoelectric vibration element in the housing recess can be shortened, the adjustment accuracy can be increased.

Hereinafter, the frequency adjustment tray according to the present invention will be described in detail with reference to the embodiments shown in the drawings. FIGS. 1A and 1B are a plan view and a front view of a frequency adjustment tray according to an embodiment of the present invention. FIGS. 2A, 2B, and 2C are housing recesses and beams. It is the longitudinal cross-sectional view which shows the structure of an incident hole, a top view, and the top view of the state which accommodated the insulating container.
When the resonance frequency is adjusted by irradiating the excitation electrode film of the piezoelectric vibration element constituting the piezoelectric vibrator such as the surface-mounted crystal vibrator, the frequency adjusting tray 1 with the ion beam, the piezoelectric vibration element 25 is used. An ion beam is applied to the housing recess 2 that supports the insulating container 20 that houses the electrode, and the excitation electrode film of the piezoelectric vibration element 25 housed inside the housing recess 2 from the opening 21 of the insulating container 20 in the housing recess 2. And a beam incident hole 3 for this purpose.

The surface-mount piezoelectric vibrator has an opening 21 on one surface and an insulating container 20 made of ceramic or the like having a mounting terminal 22 on the other surface (bottom surface), and conductive bonding on an element mounting pad inside the insulating container 20. A piezoelectric vibration element 25 connected by an agent and a lid (not shown) that hermetically seals the opening 21 are provided. The piezoelectric vibration element 25 has a configuration in which excitation electrode films and lead electrodes are formed on both main surfaces of a piezoelectric substrate made of a piezoelectric material such as quartz. The insulating container 20, the mounting terminal 22, and the lid body (not shown) constitute a package.
The frequency adjusting tray 1 has a large number of receiving recesses 2 on the upper surface for storing the insulating container 20 with the opening 21 facing downward, and beam incidence that penetrates the bottom 5 of each receiving recess 2 to the lower surface side. The structure provided with the holes 3 is characteristic.

  In a more characteristic configuration of the present invention, the beam incident hole 3 is formed in a lower-diameter lower recess 4 formed in a step shape at the bottom of the receiving recess 2 and a thin bottom 5 of the lower recess 4. Further, it is constituted by a small diameter beam entrance small hole 6. The diameters (opening areas) of the receiving recess 2, the lower recess 4, and the beam entrance small hole 6 are set so as to be sequentially reduced in steps. The beam entrance small hole 6 is cut with high precision so as to have a peripheral shape that matches the contour shape and position of the excitation electrode film (not shown) formed on the facing surface of the piezoelectric vibration element 25 disposed facing upward. Has been. Since the housing recess 2 and the lower recess 4 do not need to be processed with high accuracy, they are cut with a certain low accuracy.

  In the present embodiment, the lower recess 4 is formed at the bottom of the receiving recess without directly forming the small hole for beam incidence that requires high precision machining at the bottom of the receiving recess 2. The small hole 6 for beam incidence is formed in the thinned bottom portion 4 of 4 when the frequency adjustment tray is manufactured by cutting from the thick portion (the bottom portion of the housing recess 2). This is because high-precision machining is facilitated by cutting the thinned portion (the bottom portion 5 of the lower recess 4). That is, when cutting with high precision using a small diameter end mill, it takes more time than cutting with low precision using a large diameter end mill, so the processing range using a small diameter end mill is possible. This is because the narrower one is preferable, and the thinner the thickness of the part to be processed, the better the efficiency. The configuration of the receiving recess 2 and the beam incident hole 3 according to the present embodiment is a configuration that satisfies the above requirements. The beam entrance small hole 6 is a portion that becomes a mask opening substantially used for frequency adjustment.

The frequency adjustment tray 1 is made of a material having sufficient rigidity, such as titanium alloy, duralumin, stainless steel, etc., and the thickness thereof is an insulation having a vertical and horizontal dimension of 5 × 3.2 mm or less in the receiving recess 2. When accommodating a container, it is set to about 2 mm, for example. When the depth D1 of the housing recess 2 is 0.5 mm, the bottom 5 having a thickness T3 of 0.2 mm can be obtained by setting the depth D2 of the lower recess 4 to 1.3 mm. it can.
The total thickness 2 mm of the frequency adjusting tray 1 is equal to the thickness of the product holding tray in the conventional example shown in FIG. 6, and the thickness of the bottom 5 is 0.2 mm. Is equivalent.
Further, the frequency adjusting tray 1 is formed with TAlN (Titanium Aluminum Nitride) by surface treatment such as ion plating, for example, in order to ensure durability when a ceramic insulating container comes into contact with the frequency adjusting tray 1. .

As shown in the plan view of the cutting procedure in FIG. 3, the receiving recess 2 has a rectangular portion 2a having a vertical and horizontal dimension (for example, 2.61 × 2.06 mm) aligned with the outer shape of the insulating container 20 to be received. , Four corners of the rectangular portion, and R-shaped relief portions 2b provided at intermediate portions of the two long sides. Each escape portion 2b becomes a space when the insulating container accommodated in the rectangular portion 2a is gripped using a jig.
The housing recess 2 and the lower recess 4 can be formed by, for example, one-stroke continuous cutting using an end mill having a diameter of 1 mm. That is, the recess 2b having the required depth is formed while forming the outer contour of the rectangular portion 2a and the other relief 2b through the cutting path indicated by the broken line from the relief 2b in the upper left corner shown in FIG. Then, the lower recess 4 having a required depth is formed in a portion corresponding to the center of the bottom surface of the housing recess 2 while continuously using the same end mill. At this time, the bottom 5 of the lower recess 4 is simultaneously formed with a thin bottom 5. In this way, the cutting process for the housing recess 2 and the lower recess 4, which is a part less related to the frequency adjustment accuracy, is completed with low accuracy by a single continuous operation using an end mill having a relatively large diameter. Workability can be improved.

Next, after forming the lower recess 4, the thin bottom 5 is cut with high precision by an end mill having a small diameter (for example, a diameter of 0.5 to 0.7 mm), so that the short side dimension is 0.7 to 0.00. A small hole 6 for beam incidence of 8 mm is formed. High-accuracy cutting with a small-diameter end mill is an operation for cutting the thin bottom portion 5 in a narrow range, so that high-accuracy machining is possible and the machining time is short.
Since the operation of forming the accommodation recess 2, the lower recess 4, and the beam entrance small hole 6 by this cutting can be performed from the same surface side of the tray, the work efficiency is good and the productivity is improved. it can.

Next, FIG. 4 is a schematic configuration explanatory diagram of a frequency adjusting device using the frequency adjusting tray of the present invention. The frequency adjusting device 30 includes a support frame 31 that supports the outer peripheral edge of the frequency adjusting tray 1, and a back surface of the insulating container in the accommodation recess 2 on the frequency adjusting tray 1 that is disposed above the frequency adjusting tray 1. A probe 32 that advances and retreats up and down, left and right, a frequency measuring device 35 connected to the probe 32, and an ion gun 40 disposed below the probe 32 with the frequency adjustment tray 1 interposed therebetween. .
A plurality of probe pins 33 protruding from the tip of the probe 32 are pressed against the same number of mounting terminals disposed on the back surface of the insulating container from above to energize the piezoelectric vibration element. The resonance frequency output by exciting the piezoelectric vibration element is measured by the frequency measuring device 35. When the measured resonance frequency is lower than the specified value, the ion beam 41 is emitted from the ion gun 40 to thereby generate the piezoelectric vibration element. The required amount of the excitation electrode film formed on the surface of the piezoelectric substrate is evaporated to adjust the frequency.

According to the frequency adjusting tray 1 of the present invention, the thickness (2 mm) equivalent to that of the conventional product holding tray shown in FIG. Since the hole 6) is integrally provided, the function of holding the insulating container by a single component and the function of the mask during frequency adjustment by beam incidence (highly accurate limit function of the beam incidence range) can be exhibited simultaneously. Can do. Even if the operation of bringing the probe pin 33 of the probe 32 into contact with or separating from the mounting terminal on the bottom surface of the insulating container while the outer peripheral edge of the frequency adjusting tray 1 is supported by the support frame 31 constituting the frequency adjusting device 30 is repeated. The vibration time and amplitude generated in the frequency adjustment tray can be minimized. That is, when a thin plate-shaped mask is disposed close to the product holding tray as in the conventional case, the vibration time of the product holding tray is prolonged or the amplitude is increased due to the influence of the vibration of the mask. According to the present invention, since there is no separate mask that causes longer vibration and increased amplitude, the vibration time of the frequency adjusting tray is eliminated in a short time, and the amplitude of the tray is also reduced. Further, when there is a mask having a separate structure, the peripheral portion of the mask opening may interfere with the ion beam due to the vibration of the mask, but such a problem is eliminated.
Furthermore, since there is no separate mask, the distance until the ion beam 41 emitted from the ion gun 40 reaches the surface of the piezoelectric vibration element can be shortened, and the frequency adjustment accuracy can be improved.

Next, FIG. 5 is a longitudinal cross-sectional view showing a main part configuration (accommodating recess and beam incident hole) of a frequency adjusting tray according to another embodiment of the present invention.
The frequency adjusting tray 1 according to this embodiment includes a large number of receiving recesses 2 on the upper surface for storing the insulating container 20 with the opening 21 facing downward, and the bottom 5 of each receiving recess 2 is on the lower surface side. A beam incident hole 3 penetrating to is provided.
A characteristic configuration of the present embodiment is that the beam incident hole 3 is formed on the lower surface of the tray opposite to the receiving recess 2 on the upper surface side of the tray and has a small-diameter lower surface side recess (lower recess) 7 and a lower surface side. The small-diameter beam incident small hole 9 formed in the thin portion 8 between the concave portion 7 and the accommodating concave portion 2 is. The diameters (opening areas) of the receiving recess 2, the lower surface recess 7, and the beam entrance small hole 9 are different in steps. The beam entrance small hole 9 is cut with high accuracy so as to have a contour shape and a peripheral edge shape matching the position of the excitation electrode film (not shown) formed on the facing surface of the piezoelectric vibration element 25 disposed facing upward. Has been. Since the housing recess 2 and the lower surface side recess 7 do not need to be processed with high accuracy, they are cut with a certain low accuracy.
The material constituting the frequency adjusting tray 1 is the same as that in the embodiment of FIG. 1, and the same is true in that a surface treatment is performed to enhance durability as necessary.

When cutting the frequency adjusting tray 1 according to the present embodiment, the receiving recess 2 is formed on one surface of the tray with a low accuracy using a relatively large-diameter end mill, and the other surface facing the other. In addition, by using the same end mill to form the lower surface side recess (lower surface side recess) 7 with low accuracy, a thin wall portion 8 having a thickness of about 0.2 mm is formed between both the recesses 2 and 7. Further, a small diameter end mill is used to penetrate the thin portion 8 with a small diameter so as to penetrate the thin portion 8 with high accuracy. High precision machining can be facilitated by forming the small holes 9 for beam incidence having strict specifications regarding dimensional accuracy in the thin wall portion 8 formed between the two recesses. Therefore, the beam entrance small hole 9 is a portion that becomes a mask opening substantially used for frequency adjustment.
Also in the frequency adjustment tray 1 according to the present embodiment, a portion corresponding to a conventional mask while having a thickness (2 mm) equivalent to that of a conventional product holding tray, similarly to the frequency adjustment tray according to the above embodiment. (Thin portion 8 and beam entrance small hole 9) are integrally provided, so that the function of holding the insulating container with a single component and the function of the mask during frequency adjustment by beam irradiation can be exhibited simultaneously. it can. Even when the probe is brought into contact with or separated from the mounting terminal on the bottom surface of the insulating container while the outer periphery of the frequency adjusting tray 1 is supported by the frequency adjusting device, the vibration time and amplitude generated in the frequency adjusting tray can be reduced. Can be minimized. That is, when a thin mask is disposed close to the product holding tray as in the prior art, the vibration time of the product holding tray becomes longer or the amplitude increases due to the influence of the vibration of the mask. According to the above, since there is no separate mask that causes longer vibration and increased amplitude, the vibration time of the frequency adjusting tray is eliminated in a short time, and the tray amplitude is also reduced. Further, when there is a mask having a separate structure, the peripheral portion of the mask opening may interfere with the ion beam due to the vibration of the mask, but such a problem is eliminated. Further, since it is not necessary to set the product holding tray and the mask as separate members with high accuracy as in the prior art, it is not necessary to set the frequency adjusting device, so that the frequency adjustment work can be performed efficiently. Furthermore, since there is no separate mask, the distance and time until the ion beam emitted from the ion gun reaches the surface of the piezoelectric vibration element can be shortened, and the frequency adjustment accuracy can be improved.

As described above, according to each embodiment of the present invention, the ion beam is irradiated to the piezoelectric vibrating element in the insulating container held by the product holding tray in a state where the product holding tray and the frequency adjustment mask are overlapped. The frequency adjustment accuracy that occurs due to the decrease in frequency measurement accuracy due to vibration of the tray and mask during frequency measurement, and the long distance between the ion gun and the piezoelectric vibration element, which is a disadvantage of the conventional frequency adjustment device that performs frequency adjustment by It is possible to solve various problems such as a reduction and a complicated positioning operation of the product holding tray and the frequency adjustment mask.
The frequency adjusting tray of the present invention can be used not only for a piezoelectric vibrator but also for an oscillator in which a piezoelectric vibration element and an oscillation circuit component are housed in a package, and other piezoelectric devices.

(A) And (b) is the top view and front view of the tray for frequency adjustment which concern on one Embodiment of this invention. (A) (b) And (c) is the longitudinal cross-sectional view which shows the structure of an accommodation recess and a beam incident hole, a top view, and the top view of the state which accommodated the insulation container. It is a top view which shows the procedure which cuts an accommodation recess and a beam incident hole. It is schematic structure explanatory drawing of the frequency adjustment apparatus using the tray for frequency adjustment of this invention. It is a longitudinal cross-sectional view which shows the principal part structure of the tray for frequency adjustment which concerns on other embodiment of this invention. (A) And (b) is a schematic block diagram of the conventional frequency adjustment apparatus, and sectional drawing which shows a principal part structure.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Frequency adjustment tray, 2 ... Accommodating recess, 3 ... Beam entrance hole, 4 ... Lower recess, 5 ... Bottom, 6 ... Small hole for beam incidence, 7 ... Lower surface side recess (lower recess), 8 DESCRIPTION OF SYMBOLS ... Thin part, 9 ... Small hole for beam incidence, 20 ... Insulating container, 21 ... Opening part, 22 ... Mounting terminal, 25 ... Piezoelectric vibration element, 30 ... Frequency adjusting device, 31 ... Support frame, 32 ... Probe, 33 ... Probe pin, 35 ... frequency measuring device, 40 ... ion gun, 41 ... ion beam

Claims (4)

A frequency adjusting tray having an accommodation recess capable of accommodating an insulating container containing a piezoelectric vibration element in an opening with the opening facing downward,
The frequency adjustment tray, wherein the bottom of the accommodating portion has a through hole for allowing a beam to enter.   2. The frequency adjustment tray according to claim 1, wherein the through hole is formed in a bottom recess of the receiving recess and a bottom of the bottom recess and has a diameter larger than that of the bottom recess. A frequency adjusting tray having a small hole for small beam incidence.   2. The frequency adjustment tray according to claim 1, wherein the through hole is formed in a beam incident small hole formed in a bottom portion of the receiving recess, and in a bottom portion of the beam incident small hole, and the beam incident. And a lower recess having a diameter larger than that of the small hole.   A frequency measuring instrument comprising the frequency adjusting tray according to claim 1, a frequency measuring instrument comprising a probe pin that contacts a mounting terminal of the insulating container accommodated in the accommodating recess of the frequency adjusting tray, and the beam incidence An ion gun that irradiates an ion beam onto the surface of the piezoelectric vibration element through a small hole for use.

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