JP2008060402A - Substrate support apparatus and method, substrate treating apparatus, aligner, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate support apparatus capable of securing the reproducibility of substrate movement without inviting the decline of guide accuracy due to wear. <P>SOLUTION: A lift mechanism 70 for supporting a wafer W and elevating and lowering it in a vertical direction comprises: a plurality of lift pins 77 capable of holding, elevating and lowering the wafer W; a base 71 where the lift pins 77 are erected; a guide device (elastic hinge device) 72 provided on the lower part of the base 71; and a voice coil motor 73 for driving the lift pins 77 in the vertical direction through the guide device 72 and the base 71. The guide device 72 is constituted of a pair of leaf springs 72a and 72b piled up and disposed so as to be continued in the vertical direction, and the leaf springs 72a and 72b are formed by an elastically deformable material and thickness for a stroke amount of the lift pin 77 to move between a sinking position and a projecting position. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate support apparatus, a substrate support method, a substrate processing apparatus, an exposure apparatus, and a device manufacturing method.

  In a lithography process, which is one of the manufacturing processes of devices such as semiconductor elements, liquid crystal display elements, imaging devices (CCD, etc.), thin film magnetic heads, etc., a reticle pattern as a mask is used as a substrate through a projection optical system. An exposure apparatus is used to transfer and expose a wafer (or glass plate or the like) coated with a photoresist. As this exposure apparatus, a batch exposure type (stationary exposure type) projection exposure apparatus such as a stepper or a scanning exposure type projection exposure apparatus (scanning type exposure apparatus) such as a scanning stepper is used.

In such an exposure apparatus, the photosensitive substrate is transferred onto the substrate holder of the substrate stage using the substrate transfer arm, and the substrate holder holds the photosensitive substrate by suction. The substrate holder is provided with a lift-up mechanism capable of moving up and down to support the photosensitive substrate by lifting a certain amount from the substrate mounting surface in order to transfer the photosensitive substrate between the substrate transfer arm and the substrate holder. (See Patent Documents 1 and 2).
Japanese Patent Laid-Open No. 1-214042 JP 2003-258071 A

However, the following problems exist in the conventional technology as described above.
The lift-up mechanism is provided with a linear motion guide (for example, a linear guide, a ball spline, an air guide) for guiding with high accuracy in the driving direction.
However, with the recent increase in throughput of the exposure apparatus, the number of times the lift-up mechanism is driven increases dramatically, so that linear guide mechanisms such as linear guides and ball splines, which have mechanical wear, are mechanically There is a possibility that the accuracy of the guide is reduced due to wear, and the reproducibility when the wafer is put on the wafer stage, for example, is significantly deteriorated.

  The present invention has been made in consideration of the above points, and an object of the present invention is to provide a substrate support apparatus, a substrate support method, a substrate processing apparatus, an exposure apparatus, and a device manufacturing method that can ensure reproducibility during driving. And

In order to achieve the above object, the present invention adopts the following configuration corresponding to FIGS. 1 to 7 showing the embodiment.
The substrate support apparatus of the present invention is a substrate support apparatus (70) that supports a substrate (W) and moves it in a predetermined direction, and is an elastic hinge that restricts the movement direction of the substrate (W) to the predetermined direction by elastic deformation. The apparatus (72) is provided.

  Therefore, in the substrate support device of the present invention, the elastic hinge device (72) guides the movement of the substrate (W) by elastic deformation without friction, so that no wear occurs even when the number of times of driving increases. Therefore, it is possible to prevent the guide characteristic of the substrate movement from being deteriorated and to ensure reproducibility during driving.

  The processing apparatus of the present invention includes a processing unit (WST) that performs a predetermined process on the substrate (W), and a support unit (70) that moves while supporting the substrate (W). (70) is provided with the substrate support apparatus described above.

  Therefore, in the processing apparatus of the present invention, even when the number of times of driving is increased with respect to the movement of the substrate (W), wear does not occur, and therefore it is possible to prevent the guide characteristic of the movement of the substrate from being deteriorated, and the reproducibility during driving is improved. It becomes possible to secure. Therefore, substrate processing in the processing unit (WST) can be performed with high reproducibility.

The exposure apparatus of the present invention is an exposure apparatus (EX) that performs an exposure process using a substrate (W), and supports the substrate described above as a substrate support apparatus that supports and moves the substrate (W). A device (70) is provided.
Therefore, in the exposure apparatus of the present invention, even when the number of times of driving is increased with respect to the movement of the substrate (W), it is possible to prevent wear and therefore to prevent the guide characteristic of the movement of the substrate from being deteriorated. It becomes possible to secure. Therefore, substrate processing in the processing unit (WST) can be performed with high reproducibility.

Further, the substrate support method of the present invention is a substrate support method for supporting the substrate (W) and moving it in a predetermined direction, and by the elastic deformation of the elastic hinge device (72) when the substrate (W) is moved. The step of regulating the movement direction of the substrate (W) in the predetermined direction is provided.
Therefore, in the substrate support method of the present invention, since the elastic hinge device (72) guides the movement of the substrate (W) by elastic deformation without friction, no wear occurs even when the number of times of driving increases. Therefore, it is possible to prevent the guide characteristic of the substrate movement from being deteriorated and to ensure reproducibility during driving.

The device manufacturing method of the present invention is characterized in that the substrate (W) is supported by using the substrate supporting method described above.
Therefore, in the present invention, since the substrate processing can be performed with high reproducibility, a high-quality device without variations can be manufactured.

  In order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals of the drawings showing one embodiment, but it goes without saying that the present invention is not limited to the embodiment.

In the present invention, the reproducibility of the movement of the substrate can be ensured without degrading the guide accuracy due to wear.
Further, according to the present invention, the reproducibility of the substrate mounting is improved, and it is possible to obtain a high-quality substrate (device) having high pattern accuracy.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a substrate support apparatus, a substrate support method, a substrate processing apparatus, an exposure apparatus, and a device manufacturing method according to the present invention will be described below with reference to FIGS.
Here, a description will be given using an example in which a substrate support apparatus according to the present invention is applied to a wafer stage that holds and moves a wafer in an exposure apparatus that exposes a pattern image of a reticle onto a wafer.

(First embodiment)
First, an exposure apparatus on which the substrate support apparatus is mounted will be described.
FIG. 1 is a view showing a schematic configuration of an exposure apparatus EX of the present embodiment.
The exposure apparatus EX transfers the pattern PA formed on the reticle R to each shot area on the wafer W via the projection optical system PL while moving the reticle R and the wafer (substrate) W synchronously in a one-dimensional direction. This is a step-and-scan type scanning exposure apparatus, that is, a so-called scanning stepper.

  The exposure apparatus EX includes an illumination optical system IL that illuminates the reticle R with exposure light EL, a reticle stage RST that can move while holding the reticle R, and projection optics that projects the exposure light EL emitted from the reticle R onto the wafer W. A system PL, a wafer stage (processing unit) WST that can move while supporting the wafer W via the wafer holder WH, a control unit CONT that comprehensively controls the exposure apparatus EX, and the like are provided.

  In the following description, the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction, and the synchronous movement direction (scanning direction) between the reticle R and the wafer W in the plane perpendicular to the Z-axis direction is the X-axis. The direction perpendicular to the direction, the Z-axis direction, and the Y-axis direction (non-scanning direction) is defined as the Y-axis direction. In addition, the rotation (inclination) directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

  The illumination optical system IL illuminates the reticle R supported by the reticle stage RST with the exposure light EL. The illumination light source emits the exposure light EL, and the illuminance of the exposure light EL emitted from the exposure light source. A uniform optical integrator, a condenser lens that collects the exposure light EL from the optical integrator, a relay lens system, a variable field stop that sets the illumination area on the reticle R by the exposure light EL in a slit shape, etc. (all not shown) Is provided. The predetermined illumination area on the reticle R is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL.

  As the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, DUV light), vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F2 laser light (wavelength 157 nm), or the like is used.

The reticle stage RST is movable while holding the reticle R, and, for example, the reticle R is fixed by vacuum suction (or electrostatic suction). Reticle stage RST can be moved two-dimensionally in a plane perpendicular to optical axis AX of projection optical system PL, that is, in the XY plane, and can be slightly rotated in the θZ direction.
The reticle stage RST is driven by a reticle stage drive unit RSTD such as a linear motor. Reticle stage driving unit RSTD is controlled by control unit CONT.

  A movable mirror 51 is provided on the reticle stage RST. A laser interferometer 52 is provided at a position facing the movable mirror 51. Thus, the position of the reticle R on the reticle stage RST in the two-dimensional direction (XY direction) and the rotation angle in the θZ direction (including rotation angles in the θX and θY directions in some cases) are measured by the laser interferometer 52 in real time. Is done. And the measurement result of the laser interferometer 52 is output to the control apparatus CONT. The control device CONT controls the position of the reticle R supported by the reticle stage RST by driving the reticle stage drive unit RSTD based on the measurement result of the laser interferometer 52.

The projection optical system PL projects and exposes the pattern of the reticle R onto the wafer W at a predetermined projection magnification β. The projection optical system PL is composed of a plurality of optical elements including optical elements provided at the front end portion on the wafer W side, and these optical elements are supported by a lens barrel PK. The projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4, 1/5, or 1/8.
Note that the projection optical system PL may be either an equal magnification system or an enlargement system. Further, the optical element at the tip of the projection optical system PL is detachably (replaceable) with respect to the lens barrel PK.

  Wafer stage WST moves while supporting wafer W to perform exposure processing, and holds wafer W via wafer holder WH in three degrees of freedom in the Z-axis direction, θX direction, and θY direction. While supporting the Z table 61 and the Z table 61 that are finely driven, the wafer surface plate 63 that supports the XY table 62 and the XY table 62 that are continuously moved in the Y-axis direction and stepped in the X-axis direction so as to be movable in the XY plane. Etc.

  Wafer stage WST is driven by a wafer stage drive unit WSTD such as a linear motor. Wafer stage drive unit WSTD is controlled by control unit CONT. Then, by driving the Z table 61, the position in the Z-axis direction (focus position) of the wafer W held by the wafer holder WH provided on the Z table 61 is controlled. Further, by driving the XY table 62, the position of the wafer W in the XY direction (position in a direction substantially parallel to the image plane of the projection optical system PL) is controlled.

The wafer holder WH has a shape corresponding to the wafer W, and is formed in, for example, a substantially circular shape in plan view. On the upper surface of the wafer holder WH, a convex seal portion formed in an annular shape (endless shape) having a predetermined width in the vicinity of the outer peripheral portion, and a plurality of protruding pin portions provided at a predetermined interval in the inner region of the seal portion (Both are not shown, and in the drawing, the upper surface of the wafer holder WH is shown as a plane for convenience).
The upper end surfaces of the plurality of pin portions and the upper end surface of the seal portion are formed so as to be flat and on the same plane. That is, a holding surface (upper surface) for holding the wafer W is formed by the plurality of pin portions and the seal portion. In this way, the wafer W can be held flat on the upper ends of the pin portion and the seal portion.
Note that the seal portion is formed to have an outer diameter slightly smaller than the outer diameter of the wafer W placed thereon.

  The lower surface of the wafer holder plate WH is formed flat and is mounted on the Z table 61 by a suction mechanism (not shown). Since the Z table 61 is also formed flat, even if the wafer holder WH is mounted on the Z table 61, the upper surface is hardly deformed.

In addition, air supply / exhaust holes (not shown) are formed at a plurality of predetermined positions on the upper surface of the wafer holder WH. For example, a plurality of air supply / exhaust holes are formed in the radial direction from the center of the upper surface. The air supply / exhaust hole is a hole that penetrates the wafer holder WH in the vertical direction, and is connected to the air supply / exhaust device via a flow path formed in the Z table 61 on which the wafer holder WH is placed. Also, a plurality of exhaust holes are formed in the radial direction from the center of the upper surface, for example.
With such a configuration, when the air supply / exhaust device performs an exhaust operation (suction operation), air between the wafer W and the upper surface of the wafer holder WH is sucked from the air supply / exhaust hole through the flow path. ing. As a result, the space surrounded by the wafer W and the seal portion becomes negative pressure, and the wafer W is attracted to the upper surface of the wafer holder WH.

Wafer holder WH is formed of ceramic, for example, silicon carbide ceramics (SiC: silicon carbide). Since silicon carbide ceramics have high thermal conductivity and a low coefficient of linear expansion, the temperature can be transmitted without thermal deformation. Moreover, since workability is favorable, the upper surface and the lower surface can be formed with high flatness.
The wafer stage WST is provided with a lift mechanism for driving the wafer W in the Z-axis direction and an actuator for driving the Z table 61 (wafer holder WH) with respect to the XY table 62. The configuration will be described later.

  A movable mirror 53 is provided on wafer stage WST (Z table 61). A laser interferometer 54 is provided at a position facing the moving mirror 53. Thus, the position and rotation angle of wafer W on wafer stage WST in the two-dimensional direction are measured in real time by laser interferometer 54, and the measurement result is output to control unit CONT. Then, the control device CONT drives the wafer stage WST via the wafer stage drive unit WSTD based on the measurement result of the laser interferometer 54, so that the X axis and Y axis of the wafer W supported on the wafer stage WST. Positioning in the direction and θZ direction.

Further, the exposure apparatus EX includes a focus detection system 56 that detects the position (focus position) of the surface of the wafer W with respect to the image plane of the projection optical system PL. The focus detection system 56 includes a light projecting unit 56A that projects detection light on the surface of the wafer W from an oblique direction, and a light receiving unit 56B that receives detection light (reflected light) reflected from the surface of the wafer W.
The light reception result of the light receiving unit 56B is output to the control device CONT. Then, the control device CONT drives the wafer stage WST (Z table 61) via the wafer stage drive unit WSTD based on the detection result of the focus detection system 56, thereby determining the position of the surface of the wafer W of the projection optical system PL. Keep within the depth of focus. In other words, the Z table 61 controls the focus position and the tilt angle of the wafer W to adjust the surface of the wafer W to the image plane of the projection optical system PL by the auto focus method and the auto leveling method.

Next, a detailed configuration of the drive mechanism and actuator provided on wafer stage WST will be described.
FIG. 2 is a side sectional view of wafer stage WST.
The wafer stage WST includes a lift mechanism (substrate support device, support unit) 70 that supports the wafer W and moves up and down in the Z-axis direction, and an actuator 80 that drives the Z table 61 (wafer holder WH) with respect to the XY table 62. And are provided.

  The lift mechanism 70 includes a plurality of (three in this case) lift pins 77 that can move up and down while holding the wafer W, a base 71 on which the lift pins 77 are erected, and a guide device (on the −Z side of the base 71). (Elastic hinge device) 72, and a voice coil motor (hereinafter referred to as VCM) 73 that drives the lift pin 77 in the Z-axis direction via the guide device 72 and the base 71.

  Each of the lift pins 77 extends along the Z-axis direction and is disposed at a position that forms a vertex of a triangle in plan view. Further, the tip end side of the lift pin 77 is inserted through a hole WHa formed in the wafer holder WH and a hole 61a formed in the Z table 61, and is immersed from the upper surface of the wafer holder WH during the exposure process shown in FIG. It is driven to a position (height), and is driven to a position protruding from the upper surface of the wafer holder WH during the substrate transfer process shown in FIG.

  Further, the lift pin 77 is formed with a suction path that is open on the top surface of the tip and connected to a vacuum suction source, and the wafer W is placed on the top surface, and the negative pressure is sucked through the suction path. The wafer W can be held from below. Further, the holding on the wafer W can also be released by releasing the negative pressure suction of the suction path.

The guide device 72 includes a pair of leaf springs 72a and 72b that extend in the X-axis direction (second direction) and are arranged so as to be continuous in the Z-axis direction. Both end portions of the leaf springs 72a and 72b are supported so that the position in the Z-axis direction is constant. The above-described base 71 is fixed to the leaf spring 72a disposed on the + Z side with a screw or the like at a substantially central portion in the X-axis direction. A movable element 73a of the VCM 73 is fixed to the leaf spring 72b located on the −Z side from the lower side (−Z side) at a substantially central portion in the X-axis direction. These leaf springs 72a and 72b are formed of a material and a thickness that allow the lift pin 72 to move elastically between the immersion position shown in FIG. 2 and the protruding position shown in FIG.
In the VCM 73, a stator 73b is disposed on the XY table 62, and drives the movable element 73a in the Z-axis direction under the control of the control device CONT.

  Note that the position of the lift pin 77 in the Z direction is measured by a rotary encoder when the rotation of the linear scale sensor or the rotation motor is converted into a linear motion (such as a rack and pinion), and is output to the control device CONT.

  The actuator 80 is provided between the XY table 62 and the Z table 61 and adjusts the position of the Z table 61 (wafer W) with respect to the imaging plane of the projection optical system PL. The actuator 80 is provided on the XY table 62. The voice coil motor includes a stator 80A and a mover 80B provided on the Z table 61 and movable in the Z direction. Actuators 80 are provided at three locations, and each actuator 80 is driven with the same amount of movement, thereby adjusting the position of the Z table 61 in the Z-axis direction, and by driving each actuator 80 with a different amount of movement, The position (posture) of the Z table 61 in the θX direction and the θY direction is adjusted. That is, the Z table 61 is finely driven in the direction of three degrees of freedom by driving the actuator 80 (note that the actuator 80 is not shown for convenience in FIG. 3 and subsequent figures).

Next, an operation when the wafer W is supported and moved by the lift mechanism 70 will be described.
As shown in FIG. 2, in a state where the wafer W is attracted and held by the wafer holder WH, the movable element 73b of the VCM 73 protrudes to the + Z side with respect to the stator 73a, and the pair of leaf springs 72a and 72b apply force from the VCM 73. Each of the lift pins 77 is placed in a position recessed from the upper surface of the wafer holder WH.

Next, when the wafer W is moved in the + Z direction, the control device CONT first stops the suction operation by the air supply / exhaust device to release the suction and holding of the wafer W from the wafer holder WH, and to the suction path of the lift pins 77. The connected vacuum suction source is actuated so that the wafer W can be sucked.
Thereafter, the control device CONT drives the mover 73a in the VCM 73 in the −Z direction. At this time, the leaf spring 72b positioned below is pulled in the −Z direction, and is bent so as to be elastically deformed by the deforming portion H and bulge to the −Z side, as shown in FIG. As the leaf spring 72b is elastically deformed, both end portions approach each other, so that the leaf spring 72a located above (+ Z side) is also elastically deformed by the deformation portion H and bulges to the + Z side. To bend.

  As a result, the base 71 and the lift pins 77 connected to the plate spring 72a rise according to the deformation amount of the plate spring 72a, and the wafer holder WH is held while adsorbing and holding the wafer W at the tip of the lift pin 77 as shown in FIG. Separate from. Here, in the VCM 73, the position of the mover 73a is not restricted in the direction along the XY plane, but the deformed portion H of the leaf springs 72a and 72b functions as an elastic hinge portion when it is raised to the + Z side. The position in the direction along the XY plane is restricted. That is, the leaf springs 72a and 72b restrict the XY direction in the Z-axis direction by restricting the movement direction of the lift pin 77, and thus constitute a virtual linear motion guide mechanism that guides the movement in the Z-axis direction. Will do.

  On the other hand, when the wafer W (lift pins 77) descends in the −Z direction, the control unit CONT drives the mover 73a in the VCM 73 in the + Z direction, contrary to the above. Thereby, the elastic deformation is eliminated by the elastic restoring force of the leaf spring 72b, and the plate spring 72b returns to the flat plate shape. Accordingly, the elastic deformation of the leaf spring 72a is also eliminated, and the base 71 and the lift pin 77 are lowered. Since the elastic deformation of the leaf springs 72a and 72b is maintained until just before returning to the flat plate shape, the above-described virtual linear motion guide mechanism by the elastic hinge is also maintained, and the movement direction of the lift pin 77 is lowered in the Z-axis direction. Regulated by

  As described above, in this embodiment, since the movement of the lift pin 77 is guided by the elastic hinge that is non-contact and does not involve mechanical wear, even if the number of times the lift pin 77 is driven increases, the guide accuracy is reduced due to wear. Reproducibility can be ensured without inviting. Therefore, in this embodiment, the reproducibility of mounting the wafer W on the wafer holder WH is improved, and a high-quality wafer (device) having high pattern accuracy can be obtained.

Moreover, in this embodiment, since this guide apparatus 72 is comprised with the simple member called leaf | plate spring 72a, 72b, it can contribute to size reduction and price reduction of an apparatus.
Furthermore, in the present embodiment, the guide device 72 is configured by the pair of leaf springs 72a and 72b, so that the movement stroke of the lift pin 77 can be easily increased (doubled) with a slight increase in thickness. is there.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. 4 (a) and 4 (b).
In the first embodiment, the VCM 73 for driving the lift pin 77 is configured to drive the mover 73a in the Z-axis direction. However, in the second embodiment, the VCM 73 is driven in a direction orthogonal to the Z-axis direction. explain.
In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and the description thereof is omitted.

As shown in FIG. 4A, in this embodiment, VCMs 73 are provided at both ends of the leaf springs 72a and 72b, respectively. In each VCM 73, the mover 73 a is disposed so as to abut against the end portions of the leaf springs 72 a and 72 b and apply thrust along the X-axis direction.
Other configurations are the same as those of the first embodiment.

  In the guide device 72 having the above-described configuration, the lift pin 77 is located at a position where the lift pin 77 is recessed from the upper surface of the wafer holder WH, and the plate springs 72a and 72b are formed in a flat plate shape. When the 73a is driven, the resistance is not easily deformed in the directions approaching each other, and as a result, as shown in FIG. As a result, as in the first embodiment, the base 71 and the lift pins 77 connected to the plate spring 72a are raised according to the deformation amount of the plate spring 72a, and the wafer W is sucked and held at the tip of the lift pin 77 while holding the wafer holder. Separate from WH.

When the wafer W (lift pins 77) is lowered in the −Z direction, the control device CONT drives the movers 73a in the VCM 73 in the X direction, which is a distance from each other, contrary to the above. As a result, the elastic deformation is eliminated by the elastic restoring force of the leaf springs 72a and 72b, and the plate spring 72a returns to a flat plate shape. Accordingly, the base 71 and the lift pin 77 are lowered.
As described above, in this embodiment, in addition to obtaining the same operation and effect as the first embodiment, the VCM 73 is disposed at substantially the same Z position (height) as the leaf springs 72a and 72b. It becomes possible to reduce the size in the Z-axis direction, and it is possible to contribute to reducing the thickness of the device.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG.
In the present embodiment, as shown in FIG. 5, a plurality (four pairs in this case) of pairs of leaf springs 72 a and 72 b are stacked in the Z-axis direction. At both ends of the pair of leaf springs 72a and 72b, VCMs 73 that are driven to move toward and away from each other in the X-axis direction are provided independently of each other. Adjacent pairs of leaf springs 72a and 72b are connected by screws or the like at the center.
Other configurations are the same as those of the second embodiment.

  In this embodiment, in addition to obtaining the same operation and effect as in the second embodiment, since a plurality of pairs of leaf springs 72a and 72b are provided, the lift pins 77 (that is, the wafer W) can be moved with a large moving stroke. In addition to being able to drive, it is also possible to set a fine movement pattern (movement speed or the like) for the lift pins 77 by individually driving the VCMs 73.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG.
In the first embodiment, the VCM 73 is configured to move the base 71 and the lift pin 77 up and down via the springs 72a and 72b. However, in the present embodiment, the VCM 73 is configured to directly contact the base 71 and drive it.
In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and the description thereof is omitted.

In the present embodiment, as shown in FIG. 6, the mover 73 a of the VCM 73 is fixed to the lower surface (the surface on the −Z side) of the base 71. Further, the leaf springs 72a and 72b are divided into two in the X-axis direction so as to straddle the VCM 73, respectively. The ends of the leaf springs 72a on the VCM 73 side are fastened and fixed to the base 71 by screws or the like. Further, the end of the leaf spring 72b on the VCM 73 side is fastened and fixed to the XY table 62 by screws or the like.
Other configurations are the same as those of the first embodiment.

  In the above configuration, the base 71 and the lift pins 77 (and the wafer W) are raised by driving the mover 73a of the VCM 73 in the + Z direction. At this time, the leaf spring 72a coupled to the base 71 and the leaf spring 72b coupled to the leaf spring 72a are elastically deformed, and the deformed portion H functions as an elastic hinge portion. A virtual linear motion guide mechanism that guides the movement to is constructed. This is the same when the base 71 and the lift pin 77 are lowered.

  As described above, in the present embodiment, in addition to obtaining the same operation and effect as in the first embodiment, the base 71 is directly driven by the VCM 73, so that the position of the base 71 (that is, the lift pins 77 and the wafer W). ) Position and motion reproducibility can be controlled with high accuracy.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to FIG.
In the first to fourth embodiments, the position of the lift pin 77 is measured using a linear scale sensor or a rotary encoder. In the present embodiment, a case where measurement is performed using a strain sensor will be described.
In this figure, the same components as those of the fourth embodiment shown in FIG. 6 are denoted by the same reference numerals, and the description thereof is omitted.

In the present embodiment, as shown in FIG. 7, a strain sensor (measuring device) 85 is attached to the surface of one leaf spring 72 a, more specifically, to the position of the deformed portion H. The strain sensor 85 outputs a resistance value associated with the deformation of the leaf spring 72a to the control device CONT. The control device CONT calculates the bending amount (strain amount) of the leaf spring 72a as an arithmetic device based on the change amount of the resistance value output from the strain sensor 85, and uses the beam bending equation to calculate the Z of the lift pin 77. Calculate the position of the direction.
Other configurations are the same as those in the fourth embodiment.

In the above configuration, when the base 71 is moved by driving the VCM 73, the leaf spring 72a is elastically deformed as an elastic hinge device to guide the movement of the lift pin 77 in the Z direction.
At this time, the change in the resistance value of the strain sensor 85 caused by the elastic deformation of the leaf spring 72a is measured as a deflection amount by the control device CONT, and the position of the lift pin 77 in the Z direction is calculated using the beam deflection formula.・ Measured. Then, the control device CONT controls the drive of the VCM 73 (the movable element 73a) so that the lift pin 77 moves to a predetermined position based on the calculated position of the lift pin 77 in the Z direction.

As described above, in this embodiment, in addition to obtaining the same operation and effect as the fourth embodiment, the Z direction of the lift pin 77 can be achieved with a simple configuration using the strain sensor 85 attached to the leaf spring 72a. Therefore, it is possible to contribute to simplification of the device configuration and cost reduction. In the present embodiment, the number of wirings can be reduced as compared with the linear scale sensor and the rotary encoder, and as a result, it is possible to suppress disturbances caused by the wiring such as vibrations, which has an adverse effect on the exposure accuracy. Can be reduced.
Furthermore, since the heat generation of the strain sensor 85 itself is reduced as compared with the linear scale sensor and the rotary encoder, the number of electrical wirings is reduced, so that the heat generation from the wirings can be suppressed, thereby suppressing the occurrence of air fluctuations and the like. Further, it is possible to suppress a decrease in exposure accuracy.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in the above-described embodiment, the leaf springs 72a and 72b are provided as a pair in order to ensure the movement stroke of the lift pin 77. However, when a leaf spring having a large elastic deformation amount is appropriately selected, or when the lift pin 77 moves. When the stroke is small, the plate spring may be provided alone.
Moreover, in the said embodiment, although it was set as the structure which uses VCM for the drive force provision of the lift pin 77, it is not limited to this, For example, it is good also as a structure which uses other actuators, such as an air cylinder.

  In the above embodiment, the substrate support apparatus according to the present invention is described as being applied to an exposure apparatus. However, the present invention is not limited to this. For example, the pattern accuracy (pattern line width or pattern line) formed on the substrate (wafer) is not limited thereto. The present invention can be widely applied to a processing apparatus that performs various processes on a substrate, such as a measuring apparatus that performs measurement processing of a position) or an apparatus that supports a substrate in a coater developer.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise. The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the substrate P.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

The light source of the exposure apparatus to which the present invention is applied includes not only KrF excimer laser (248 nm), ArF excimer laser (193 nm), F ₂ laser (157 nm), but also g-line (436 nm) and i-line (365 nm). ) Can be used. Further, the magnification of the projection optical system may be not only a reduction system but also an equal magnification or an enlargement system. In the above embodiment, the catadioptric projection optical system is exemplified, but the present invention is not limited to this, and the optical axis (reticle center) of the projection optical system and the center of the projection area are set at different positions. It can also be applied to a refraction type projection optical system.

  The present invention can also be applied to a so-called immersion exposure apparatus in which a liquid is locally filled between the projection optical system and the substrate, and the substrate is exposed through the liquid. The immersion exposure apparatus is disclosed in International Publication No. 99/49504 pamphlet. Further, in the present invention, the entire surface of the substrate to be exposed as disclosed in JP-A-6-124873, JP-A-10-303114, US Pat. No. 5,825,043 and the like is in the liquid. The present invention is also applicable to an immersion exposure apparatus that performs exposure while being immersed.

  The present invention can also be applied to a twin stage type exposure apparatus provided with a plurality of substrate stages (wafer stages). The structure and exposure operation of a twin stage type exposure apparatus are described in, for example, Japanese Patent Laid-Open Nos. 10-163099 and 10-214783 (corresponding US Pat. Nos. 6,341,007, 6,400,441, 6,549). , 269 and 6,590,634), JP 2000-505958 (corresponding US Pat. No. 5,969,441) or US Pat. No. 6,208,407. Furthermore, the present invention may be applied to the wafer stage disclosed in Japanese Patent Application No. 2004-168482 filed earlier by the present applicant.

An exposure apparatus to which the present invention is applied assembles various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus.
The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

Next, an embodiment of a manufacturing method of a micro device using the exposure apparatus and the exposure method according to the embodiment of the present invention in the lithography process will be described. FIG. 22 is a flowchart illustrating a manufacturing example of a micro device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, or the like).
First, in step S10 (design step), function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and pattern design for realizing the function is performed. Subsequently, in step S11 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S12 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.
Next, in step S13 (wafer processing step), using the mask and wafer prepared in steps S10 to S12, an actual circuit or the like is formed on the wafer by lithography or the like, as will be described later. Next, in step S14 (device assembly step), device assembly is performed using the wafer processed in step S13. This step S14 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S15 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S14 are performed. After these steps, the microdevice is completed and shipped.

FIG. 9 is a diagram illustrating an example of a detailed process of step S13 in the case of a semiconductor device.
In step S21 (oxidation step), the surface of the wafer is oxidized. In step S22 (CVD step), an insulating film is formed on the wafer surface. In step S23 (electrode formation step), an electrode is formed on the wafer by vapor deposition. In step S24 (ion implantation step), ions are implanted into the wafer. Each of the above steps S21 to S24 constitutes a pre-processing process at each stage of the wafer processing, and is selected and executed according to a necessary process at each stage.
At each stage of the wafer process, when the above pre-process is completed, the post-process is executed as follows. In this post-processing process, first, in step S25 (resist formation step), a photosensitive agent is applied to the wafer. Subsequently, in step S26 (exposure step), the circuit pattern of the mask is transferred to the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step S27 (development step), the exposed wafer is developed, and in step S28 (etching step), exposed members other than the portion where the resist remains are removed by etching. In step S29 (resist removal step), the resist that has become unnecessary after the etching is removed. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the wafer.

  Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., from mother reticles to glass substrates and The present invention can also be applied to an exposure apparatus that transfers a circuit pattern to a silicon wafer or the like. Here, in an exposure apparatus using DUV (deep ultraviolet), VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used. As a reticle substrate, quartz glass, fluorine-doped quartz glass, fluorite, Magnesium fluoride or quartz is used. In proximity-type X-ray exposure apparatuses, electron beam exposure apparatuses, and the like, a transmissive mask (stencil mask, membrane mask) is used, and a silicon wafer or the like is used as a mask substrate. Such an exposure apparatus is disclosed in WO99 / 34255, WO99 / 50712, WO99 / 66370, JP-A-11-194479, JP-A2000-12453, JP-A-2000-29202, and the like. .

FIG. 2 is a view showing an embodiment of the present invention, and is a view showing a schematic configuration of an exposure apparatus EX. It is a sectional side view of wafer stage WST. It is a sectional side view of wafer stage WST at the time of wafer rising. It is a sectional side view of wafer stage WST in 2nd Embodiment. It is a sectional side view of wafer stage WST in 3rd Embodiment. It is a sectional side view of wafer stage WST in 4th Embodiment. It is a sectional side view of wafer stage WST in 5th Embodiment. It is a flowchart figure which shows an example of the manufacturing process of a microdevice. It is a figure which shows an example of the detailed process of step S13 in FIG.

Explanation of symbols

CONT ... control device (arithmetic unit), EX ... exposure device, W ... wafer (substrate), WST ... wafer stage (processing unit), 70 ... lift mechanism (substrate support device, support unit), 72 ... guide device (elastic hinge) Device) 73 ... VCM (drive device), 85 ... strain sensor (measuring device)

Claims (12)

A substrate support device for supporting a substrate and moving it in a predetermined direction,
An apparatus for supporting a substrate, comprising: an elastic hinge device for restricting a moving direction of the substrate to the predetermined direction by elastic deformation. The substrate support apparatus according to claim 1,
The elastic hinge device has a leaf spring, and the substrate support device. The substrate support apparatus according to claim 2, wherein
A substrate supporting apparatus, comprising a plurality of the leaf springs, wherein the leaf springs are arranged in a row in the predetermined direction. The substrate support apparatus according to claim 3, wherein
A plurality of the pair of leaf springs are stacked in the predetermined direction. The substrate supporting apparatus according to any one of claims 1 to 4,
A substrate supporting apparatus comprising a driving device that moves the substrate by elastically deforming the elastic hinge device. The substrate support apparatus according to claim 5, wherein
The elastic hinge device is provided to extend in a second direction substantially orthogonal to the moving direction of the substrate,
The substrate support device, wherein the driving device applies a thrust force in the second direction to the elastic hinge device. In the board | substrate support apparatus in any one of Claim 1 to 6,
A measuring device for measuring information on deformation of the elastic hinge device;
A substrate support device comprising: an arithmetic device that calculates a position of the substrate in the predetermined direction based on a measurement result of the measurement device. A processing unit for performing predetermined processing on the substrate;
A support unit that supports and moves the substrate;
A processing apparatus, comprising the substrate support apparatus according to claim 1 as the support section. An exposure apparatus that performs an exposure process using a substrate,
An exposure apparatus comprising the substrate support apparatus according to claim 1 as a substrate support apparatus that moves while supporting the substrate. A substrate support method for supporting a substrate and moving it in a predetermined direction,
A substrate support method comprising the step of restricting the moving direction of the substrate to the predetermined direction by elastic deformation of an elastic hinge device when the substrate is moved. The substrate supporting method according to claim 10,
Measuring information relating to deformation of the elastic hinge device;
And a step of calculating a position of the substrate in the predetermined direction based on the deformation. A device manufacturing method, comprising: supporting a substrate using the substrate supporting method according to claim 10.

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