JP2008060225A5 - - Google Patents

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Publication number
JP2008060225A5
JP2008060225A5 JP2006233588A JP2006233588A JP2008060225A5 JP 2008060225 A5 JP2008060225 A5 JP 2008060225A5 JP 2006233588 A JP2006233588 A JP 2006233588A JP 2006233588 A JP2006233588 A JP 2006233588A JP 2008060225 A5 JP2008060225 A5 JP 2008060225A5
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JP
Japan
Prior art keywords
substrate
heat dissipation
heat sink
heat
rubber material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006233588A
Other languages
English (en)
Japanese (ja)
Other versions
JP4752684B2 (ja
JP2008060225A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006233588A priority Critical patent/JP4752684B2/ja
Priority claimed from JP2006233588A external-priority patent/JP4752684B2/ja
Publication of JP2008060225A publication Critical patent/JP2008060225A/ja
Publication of JP2008060225A5 publication Critical patent/JP2008060225A5/ja
Application granted granted Critical
Publication of JP4752684B2 publication Critical patent/JP4752684B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006233588A 2006-08-30 2006-08-30 ヒートシンク取付装置、及びそれを用いたディスク装置 Active JP4752684B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006233588A JP4752684B2 (ja) 2006-08-30 2006-08-30 ヒートシンク取付装置、及びそれを用いたディスク装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006233588A JP4752684B2 (ja) 2006-08-30 2006-08-30 ヒートシンク取付装置、及びそれを用いたディスク装置

Publications (3)

Publication Number Publication Date
JP2008060225A JP2008060225A (ja) 2008-03-13
JP2008060225A5 true JP2008060225A5 (zh) 2009-10-15
JP4752684B2 JP4752684B2 (ja) 2011-08-17

Family

ID=39242639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006233588A Active JP4752684B2 (ja) 2006-08-30 2006-08-30 ヒートシンク取付装置、及びそれを用いたディスク装置

Country Status (1)

Country Link
JP (1) JP4752684B2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5163585B2 (ja) * 2009-04-09 2013-03-13 船井電機株式会社 ディスク装置
JP2012230741A (ja) * 2011-04-27 2012-11-22 Funai Electric Co Ltd 光ピックアップ
JP5892691B2 (ja) * 2011-12-15 2016-03-23 太陽誘電株式会社 電子装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07183677A (ja) * 1993-12-24 1995-07-21 Ricoh Co Ltd 放熱装置
JP4147660B2 (ja) * 1998-12-25 2008-09-10 松下電器産業株式会社 放熱ユニットとこれを備えた回路ユニット
JP4300706B2 (ja) * 2000-12-21 2009-07-22 ソニー株式会社 電子機器の放熱装置

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