JP2008053609A - Defective data processor, defective data processing system, and defective data processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a defective data processor which can effectively evaluate error of inspection results by a plurality of inspection apparatus, a defective data processing system, and a defective data processing method. <P>SOLUTION: Multiple observation information obtained by observing defect by means of an observation device 2 is input based on multiple inspection information obtained by inspecting defect on the same inspection objects by inspection devices 1A, 1B, and position information of defect obtained for each inspection. Multiple defect distributions 31A, 31B shown by a plot point 48 disposed based on position information of defect obtained for each inspection are displayed simultaneously on a screen 30, in a display which shows treatment results using the input multiple inspection information and multiple observation information. When an arbitrary plot point on a screen of a display 5c is selected by an input part 5d, inspection information and observation information of defect corresponding to the selected plot points 48a, 48b are shown in the display 5c. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a defect data processing apparatus, a defect data processing system, and a defect data processing method for processing data obtained when inspecting a semiconductor wafer or the like.

  Foreign materials, scratches, pattern defects, etc. that adhere to the surface of work-in-process products or products in the manufacturing process of semiconductor wafers, photomasks, magnetic disks, and liquid crystal substrates, etc., cause product defects. Work for inspecting and observing the appearance with an inspection device and an observation device is performed. Based on the results, the cause of the defect is investigated and fed back to the manufacturing process to improve the product yield.

  In this type of system, generally, an inspected part (for example, a pattern of a chip formed on a semiconductor wafer) is used by using a so-called SEM observation apparatus to which a scanning electron microscope (SEM) is applied. A device has been devised to reduce the burden on the operator when observing (see Patent Document 1, etc.).

JP-A-10-135288

  By the way, when replacing an existing inspection device with another one or adding an inspection device to an existing line due to a failure of the inspection device or line expansion, the manufacturer of the inspection device It is necessary to pay attention to the error of the test result caused by differences and individual differences. In order to maintain and improve inspection efficiency by unifying the management standards of each inspection device and continuously using inspection information accumulated from the past, the inspection results from newly introduced inspection devices This is because it is required to be substantially the same as the inspection result of the existing inspection apparatus (for example, when the same inspection object is inspected, the number of detected defects, the size of the defect, etc. are substantially the same). . In order to know the error of the inspection result, it is necessary to perform the comparative evaluation (matching evaluation) of the inspection result by each inspection apparatus.

  However, at present, analysis of inspection results for each defect necessary for performing matching evaluation must be performed manually by the operator, such as the task of determining the same defect from different inspection results (so-called “matching”) and matching. It took an enormous amount of time to correct the coordinates on the basis of the defect and to know the degree of error.

  An object of the present invention is to provide a defect data processing apparatus, a defect data processing system, and a defect data processing method capable of efficiently evaluating errors in inspection results from a plurality of inspection apparatuses.

  In order to achieve the above object, the present invention provides a defect data processing apparatus for processing data relating to defects on an object to be inspected, which is obtained by inspecting defects on the same object by a plurality of inspection apparatuses. A plurality of pieces of inspection information each including defect position information obtained for each inspection, and defects on the inspected object based on the defect position information obtained for each inspection by an observation device A plurality of pieces of observation information obtained by observing each of the plurality of pieces of observation information respectively including defect image information obtained for each observation and corresponding to the plurality of pieces of inspection information are input. Displayed by plot points arranged on the basis of defect position information obtained for each inspection on the display unit that displays the processing information using the inspection information and the plurality of observation information. A plurality of defect distributions displayed on the same screen, and when an arbitrary plot point on the screen of the display unit is selected by the input unit for instructing the processing content, the defect inspection corresponding to the selected plot point is inspected Information and observation information are displayed on the display unit.

  According to the present invention, since defect data processing suitable for matching evaluation can be performed, errors in inspection results by a plurality of inspection apparatuses can be efficiently evaluated.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Here, an example in which the present invention is applied to a semiconductor production line will be described. In the following, it occurs due to foreign matter adhering to the surface of an object to be inspected (for example, semiconductor wafer, photomask, magnetic disk, liquid crystal substrate, etc.), abnormal pattern shape, and defects in the previous process. Pattern anomalies (such as foreign matter buried under the pattern) are collectively described as “defects”.

  FIG. 1 is a diagram showing a schematic configuration of a defect data processing system according to an embodiment of the present invention.

  The defect data processing system shown in the figure inspects the appearance of a product wafer (inspected object), and includes defect feature quantities, which are information indicating defect features, including defect positions and numbers, and defect inspection images. Appearance inspection apparatus (inspection apparatus) 1A and appearance inspection apparatus (inspection apparatus) 1B for detecting inspection information composed of image information, etc. (inspection images), and inspection information (mainly for defects) Observation (review) of defects based on (position information), observation consisting of defect feature quantities such as defect size, shape, and type, and image information that is an observation image (observation image) of the defect An observation apparatus 2 for detecting information, a probe inspection apparatus 3 for probing a product wafer, an internal environment is kept clean, and inspection apparatuses 1A and 1B, an observation apparatus 2 and a probe inspection apparatus 3 are provided. Have a clean roo 4 and defect information processing apparatus (including inspection information and observation information) from the inspection apparatuses 1A and 1B, the observation apparatus 2, the probe inspection apparatus 3, etc. are input, and the input defect information is processed ( Data processing device) 5 is mainly provided.

  The defect data processing device 5 stores a processing unit 5a (for example, a central processing unit) that performs data processing based on a program that processes defect information, a defect information processing program, defect information, and the like. A storage unit 5b (for example, a storage device such as a hard disk or a RAM (Random Access Memory)), a display unit 5c (for example, a monitor) for displaying a processing result by the processing unit 5a, and an instruction to the processing unit 5a such as an operator An input unit 5d (for example, a mouse and a keyboard) for inputting by operation and a communication unit 5e for inputting / outputting data to / from other devices are provided.

  In the data processing system configured as described above, a wafer as a product flows through a plurality of manufacturing processes 8 in units of lots, and an operator or a transfer machine after a process that is predetermined to be inspected is completed. Is carried to the inspection apparatus 1 for inspection processing. The wafer that has undergone the appearance inspection is returned to the lot for observation of appearance defects and is carried to the observation apparatus 2, and a predetermined wafer is taken out from the lot and reviewed.

  The appearance inspection apparatuses 1A and 1B, the observation apparatus 2 and the probe inspection apparatus 3 are connected to the communication unit 5e of the data processing apparatus 5 via the communication line 9, respectively. The detected defect information is transmitted to the data processing device 5 and data transmitted from the data processing device 5 is received.

  FIG. 2 is a diagram showing a data flow in the defect data processing system according to the embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same part as the previous figure, description is abbreviate | omitted, and it is the same also in a later figure.

  In FIG. 2, the defect data processing system according to the embodiment of the present invention includes inspection information 21 transmitted from the inspection apparatuses 1A and 1B to the data processing apparatus 5, and inspection transmitted from the data processing apparatus 5 to the observation apparatus 2. Information 22 and observation information 23 transmitted from the observation device 2 to the data processing device 5 are mainly used.

  The inspection information 21 is information related to defects detected by the appearance inspection apparatus 1, and includes, for example, basic identification information (ID (Identification) of the wafer, such as lot number, wafer number, inspection process, inspection date and time). number)), the defect coordinates (position), inspection images (for example, defect images (ADR images) automatically recorded from the images at the defect coordinate positions), the size of the defect, etc. Defect feature amounts and the like are included. This defect feature is a function that automatically classifies defects (actual defects) that directly affect yield and defects (nuisance defects) that do not directly affect yield, depending on the defect attributes. Classification data (RDC information) obtained from (RDC (Real-Time Defect Classification) function) is included. For example, the maximum gray level difference and the reference image average listed on the screen 60 of FIG. Information such as gray level, defect image average gray level, polarity, inspection mode, and defect size is included. The inspection information 21 may be transmitted to the data processing device 5 by text data in a predetermined format.

  The inspection information 22 is transmitted to the observation apparatus 2 out of the inspection information 21 detected by the inspection apparatus 1 and mainly includes information such as basic information on the wafer, coordinates of the defect, and an inspection image of the defect. ing. When the inspection information 21 output by the inspection apparatus 1 has a huge amount of data, the data processing apparatus 5 transmits the inspection information 21 as inspection information 22 to the observation apparatus 2 from the inspection information 21. If necessary items are selected and transmitted as inspection information 22, the amount of transmission data can be reduced.

  The observation information 23 is information obtained by the observation device 2 observing the defect based on the inspection information 22. For example, the observation information (for example, ADR) of the defect detection unit obtained by the observation device 2 based on the inspection information 22. Image) and defect classification data obtained from a function (ADC (Automatic Defect Classification) function) for automatically classifying defects according to size, type, and the like based on the observed image.

  In the above description, the type of the appearance inspection apparatus 1 is not particularly limited. For example, a bright field inspection apparatus, a dark field inspection apparatus, or a so-called SEM (Scanning Electron Microscope) inspection apparatus may be used. Good. For the observation device 2, for example, an optical observation device, an SEM observation device, or the like may be used.

  Next, data processing performed by the defect data processing system according to the embodiment of the present invention will be described with reference to FIGS. 3 to 11 are diagrams showing screens displayed on the display unit 5c of the data processing device 5 in the defect data processing system of the present embodiment.

  FIG. 3 is a diagram of a defect analysis screen displayed on the display unit by the data processing system according to the embodiment of the present invention.

  The defect analysis screen 30 shown in the figure is a screen displayed on the display unit 5 c of the data processing device 5. The screen 30 includes a plurality of plot points 48 arranged based on defect position information (coordinate information) obtained for each inspection of the inspection apparatuses 1A and 1B, and a defect distribution 31 in which the plot points 48 are represented collectively. And a display frame 33 for displaying an image (inspection image or observation image) of the defect selected by the input unit 5d on the defect distribution 31 among the defects detected by the inspection apparatus 1A. A pull-down menu 34 for changing the defect image displayed in the display frame 33 to another inspection result or an observation result, and a display frame for displaying the feature amount (defect feature amount) of the defect displayed in the display frame 33 35, a display frame 36 in which an image of the defect selected by the input unit 5d on the defect distribution 31 among the defects detected by the inspection apparatus 1B is displayed, and a defect image displayed in the display frame 36 is displayed in the other frame. A pull-down menu 37 for changing to an inspection result or an observation result, a display frame 38 for displaying the feature amount of the defect displayed in the display frame 36, and a defect selected by the input unit 5d on the defect distribution 31 are corrected. Button 39 for registering as a reference point (correction reference point), a button 40 for displaying a screen 80 (to be described later) on which a coordinate list of defects registered as correction reference points with button 39 is displayed, display frame 35 and display frame A button 41 for displaying a screen 60 (to be described later) for selecting an item of defect feature values to be displayed on 37, and a screen 70 (to be described later) for displaying a coordinate list of defects detected by the inspection apparatus 1A and the inspection apparatus 1B are displayed. Button 42, a button 43 for printing the screen 30 with a printer, and a button 44 for returning to the screen displayed immediately before.

  The defect distribution 31 includes a defect distribution 31A obtained by the inspection apparatus 1A and a defect distribution 31B obtained by the inspection apparatus 1B. The defect distribution 31A and the defect distribution 31B are displayed with plot points of different colors (or patterns, etc.) so that it can be determined which inspection apparatus each defect distribution is obtained. In the present embodiment, the defect distribution 31A detected by the inspection apparatus 1A is a white plot point, and the defect distribution 31B detected by the inspection apparatus 1B is a black plot point, as shown in the display 45 that clearly indicates the color coding of the defect. It is shown. In the above description, the defect distribution 31A and the defect distribution 31B are displayed so as to overlap each other in the display frame 32. However, the defect distributions 31A and 31B may be displayed in separate display frames. In this case, the display range on the wafer in the display frame provided separately is always set to be the same in both display frames (for example, if the display position in one display frame is changed, the other display frame The display position is also set so as to follow it).

  The defect distribution 31 is a defect distribution that displays the entire inspection object, and in this embodiment, the entire semiconductor wafer is displayed. When a range on the defect distribution 31 is designated by the input unit 5d of the data processing device 5 (for example, a desired range on the defect distribution 31 is designated by dragging with a mouse), the designated range is enlarged and displayed. . As described above, when the defect distribution 31 is appropriately enlarged and displayed, it becomes easy to select a defect. The defect distribution 310 displayed in the display frame 32 of FIG. 4 is an enlarged display of the region 46 shown on the defect distribution 31 of FIG. Further, as will be described in detail later, the mark 47 attached to the defect on the defect distribution 31 is attached to the defect registered as the correction reference point by the button 39, whereby the operator registers the correction reference point. The situation can be visually recognized.

  FIG. 4 is a diagram of a defect analysis screen when the defect distribution 31 of FIG.

  The enlarged screen 30a shown in this figure has a reduced map 51 on which the entire defect distribution 31 is reduced and displayed in addition to the above-described elements constituting the screen 30. On this reduced map 51, an area display 52 showing a portion that is enlarged and displayed in the current display frame 32 is displayed. By this area display 52, the operator displays which of the defect distributions 310 that are enlarged and displayed. It is possible to determine whether it is located around. If the reduced map 51 is selected by the input unit 5d, the display in the display frame 32 can be returned to that of the screen 30.

  FIG. 5 is a diagram of a defect feature amount display selection screen displayed on the display unit by the data processing system according to the embodiment of the present invention.

  The feature quantity selection screen 60 shown in the figure is displayed on the display unit 5c when the button 41 on the screen 30, 30a is pressed. The screen 60 includes a list 61 of defect feature amount items obtained from each inspection and output to the data processing device 5, a plurality of check boxes 62 provided corresponding to each item of the list 61, and an input unit 5d. The button 63 for displaying the item of the feature amount selected by the check box 62 in the display frames 35 and 38, and the button 64 for returning to the screens 30 and 30a without reflecting the selection result on the screen 60.

  The list 61 includes, for example, a maximum gray level difference, a reference image average gray level, a defect image average gray level, a polarity, an inspection mode, a defect size, a number of defective pixels, a defect size width, and a defect size height as illustrated in FIG. The defect size ratio indicating the ratio of the height to the defect size width is included. In addition, what is used as the feature amount of the defect is not limited to that shown in FIG. 5, but may be information other than these as long as it is information obtained by the inspection result and is necessary for specifying each defect. . When the check box 62 is selected by the input unit 5d, a “tick” is added, and the check box 62 is displayed in the display frames 35 and 38 as a feature amount of the defect.

  FIG. 6 is a diagram of a defect coordinate list screen displayed on the display unit by the data processing system according to the embodiment of the present invention.

  A coordinate list screen 70 shown in the figure is a screen displayed on the display unit 5c when the button 42 on the screen 30, 30a is pressed. The screen 70 includes a coordinate display unit 71 that displays coordinates of all defects detected by the inspection apparatus 1A, a coordinate display unit 72 that displays coordinates of all defects detected by the inspection apparatus 1B, and these coordinates. A scroll bar 73 that is displayed when the display units 71 and 72 cannot be displayed on one screen and can be appropriately selected by moving up and down on the screen 70, and for printing the screen 70 with a printer. Button 74 and a button 75 for returning to the screen 30 or the screen 30a. With the screen 70 configured in this manner, the operator can confirm the identification numbers (IDs) and coordinates of the defects detected by the inspection apparatus 1A and the inspection apparatus 1B.

  FIG. 7 is a diagram of a coordinate list screen of correction reference points displayed on the display unit by the data processing system according to the embodiment of the present invention.

  A coordinate list screen 80 shown in the figure is a screen displayed on the display unit 5c when the button 40 on the screen 30, 30a is pressed. The screen 80 is a defect detected by the inspection apparatus 1A, the information display unit 81 displaying information on the defect registered as the correction reference point, and the defect detected by the inspection apparatus 1B, and the correction reference An information display unit 82 for displaying information of defects registered as points, a plurality of check boxes 83 provided for one set of defects displayed on the information display units 81 and 82, and the information display Scroll bar 84 that is displayed when the parts 81 and 82 cannot be displayed on one screen and can be appropriately selected by moving up and down on the screen 80 and the defect selected by the check box 83. A button 85 for executing calculation of coordinate correction using the coordinates, a button 86 for deleting information on the selected defect from the information display sections 81 and 82, and an image A button 87 for printing 80 to a printer and is mainly composed of a button 88. to return to the screen 30 or screens 30a.

  In the information display unit 81 and the information display unit 82, a defect identification number (Defect ID), an observation image (SEM image) of the defect by the observation apparatus 2, and coordinates of the defect detected by the inspection apparatus 1A or B (Coordinate), respectively. ), The size of the defect (D Size), and the like are displayed. Further, in the present embodiment, the information display units 81 and 82 include a set of defects (defects detected by the inspection apparatus 1A and the detection apparatus B) that have been matched on the screens 30 and 30a and registered as correction reference points. In order to facilitate understanding of the relationship between the detected defect and the combination), the set of defects is displayed on the left and right sides.

  In the check box 83, as a default setting, all of the “deleted points (checks)” are entered, and all registered defects are used for the coordinate correction process. When it is desired to remove a defect with a check mark from the target of the coordinate correction process, the check mark 83 with the check mark can be selected to remove the check mark. This makes it possible to appropriately select a defect to be used for the coordinate correction process.

  The button 86 is a button for designating a defect, for example, by selecting a defect identification number (Defect ID), and deleting the designated defect information from the information display portions 81 and 82. The means for designating the defect to be deleted is not limited to the selection of the identification number listed above. For example, other information such as an observation image and coordinates may be selected and designated, or a dedicated check box is separately provided on the screen 80, and when a button 86 is pressed, defect information with a check mark is displayed. You may comprise so that it may be deleted.

  FIG. 8 is a diagram of a correction processing result screen displayed on the display unit by the data processing system according to the embodiment of the present invention.

  The correction processing result screen 100 shown in the figure is a screen that is displayed on the display unit 5c when the button 85 on the screen 80 is pressed, and is displayed when the correction processing is executed by the button 85 and the processing ends. The screen 100 includes a display frame 101 in which the calculated correction value is displayed, a coordinate display unit 102 in which the coordinates of a defect registered as a correction reference point in the defect distribution 31A obtained by the inspection apparatus 1A, and an inspection The coordinate display unit 103 for displaying the coordinates before and after the correction of the defect registered as the correction reference point in the defect distribution 31B obtained by the apparatus 1B, and the coordinates of the defect registered as the correction reference point in the defect distribution 31A And an error display unit 104 for displaying an error between the coordinates after defect correction processing registered as a correction reference point in the defect distribution 31B, a display frame 105 for displaying an average value (average error) of the error, Displayed when the coordinate display unit 102, the coordinate display unit 103, and the error display unit 104 cannot be displayed in one screen. In order to calculate a coincidence rate, which is an index for determining the coincidence state between the defect distribution 31A and the defect distribution 31B after the correction process, using the scroll bar 106 that can appropriately select the information to be displayed and the result of the correction process. The degree of error between the button 107 and the coordinates of the defect registered as the correction reference point in the defect distribution 31A and the coordinates after the defect correction processing registered as the correction reference point in the defect distribution 31B is indicated by the distance from the origin. It mainly includes a button 108 for displaying a coordinate error distribution diagram 121 (described later), a button 109 for printing the screen 100 with a printer, and a button 110 for returning to the screen 80.

  FIG. 9 is a diagram of an error distribution diagram screen displayed on the display unit by the data processing system according to the embodiment of the present invention.

  A coordinate error distribution diagram screen 120 shown in the figure is a screen displayed on the display unit 5c when the button 108 on the screen 100 is pressed. The screen 120 shows an error distribution diagram 121 between the coordinates of the defect registered as the correction reference point in the defect distribution 31A and the coordinates after the defect correction processing registered as the correction reference point in the defect distribution 31B, and A display setting unit 122 that sets a display method is mainly configured.

  The error distribution diagram 121 shows an X-axis 123 indicating the magnitude of the error in the X-axis direction, a Y-axis 124 indicating the magnitude of the error in the Y-axis direction, and a plane formed by the X-axis 123 and the Y-axis 124. It is composed of a plurality of plot points 125 plotted according to the error value.

  The display setting unit 122 includes a range setting unit 126 that sets display ranges of the X axis and the Y axis in the distribution map 121, a marker size setting unit 127 that sets the display size of plot points, a range setting unit 126, and a marker size setting. Mainly composed of a button 128 for reflecting a value input to the section 127 to the distribution chart 121, a button 129 for printing the screen 120 with a printer, and a button 130 for returning to the screen 100.

  The range setting unit 126 is provided with an X-axis setting unit 126a that sets an X-axis display range and a Y-axis setting unit 126b that sets a Y-axis display range. The setting units 126a and 126b are configured to input the maximum value and the minimum value of the display range of each axis, and each input value becomes a value at both ends of the axis on the distribution diagram 121. When the range setting unit 126 is used in this way, the display range of the distribution chart 121 can be set as appropriate, so that the error distribution status can be easily known.

  FIG. 10 is a diagram of a match rate display screen displayed on the display unit by the data processing system according to the embodiment of the present invention.

  The match rate display screen 135 shown in the figure is a screen displayed on the display unit 5c when the button 107 on the screen 100 is pressed. The screen 135 is corrected after the defect distribution by the reference inspection apparatus (defect distribution 31A obtained by the inspection apparatus 1A) and the defect distribution by another inspection apparatus so as to approach the reference defect distribution. The display frame 138 for displaying the defect distribution (defect distribution 137B after the correction process is performed on the defect distribution 31B obtained by the inspection apparatus 1B) and the defect distribution obtained by a different inspection apparatus are used for matching determination. A setting unit 139 that sets a threshold value (coordinate comparison radius) and a ratio of defects that match a defect in a defect distribution (defect distribution 31A) serving as a reference among defects in the corrected defect distribution (defect distribution 137B). It is mainly composed of a result determination unit 140 in which an evaluation value of a correction processing result such as a matching rate is shown.

  Here, the threshold value (coordinate comparison radius) is a distance between a defect on the reference defect distribution (on the defect distribution 31A) and a defect on the corrected defect distribution (on the defect distribution 137B). If it is within the threshold value, both defects are numerical values that are considered to match, and are set by inputting an arbitrary numerical value to the setting unit 139 through the input unit 5d.

  Similarly to the defect distribution 31 on the screen 30, the defect distribution 31A and the defect distribution 137B are displayed with plot points of different colors (or patterns, etc.), and each inspection apparatus detects each defect. Can be determined. Further, since it has been described in the explanation part of the screen 30, detailed description is omitted, but even if an arbitrary range in the display frame 138 is designated by the input unit 5d, the designated range can be enlarged and displayed.

  In the setting unit 139, an input unit 141 for inputting a coordinate comparison radius by the input unit 5d, a button 142 for reflecting the value input to the input unit 141 in calculation of the match rate, and a screen 135 for printing with a printer. Button 143 is provided.

  The result determination unit 140 returns to the screen 30 a match rate display unit 144 that displays the match rate between the defect distribution 31A and the defect distribution 137B, a Venn diagram display unit 145 that displays the ratio of the matched defects in a Venn diagram, and the screen 30. Button 146 is provided. The Venn diagram display unit 145 indicates a portion 148 indicating the number of defects in the defect distribution 31A that do not match the defects in the defect distribution 137B and the number of defects in the defect distribution 31A and the defect distribution 137B that match each other. A portion 149 and a portion 150 indicating the number of defects in the defect distribution 137B that do not match the defects in the defect distribution 31A are shown. Below the Venn diagram display portion 145, defects in the defect distributions 31A and 137B are formed. The total number of each is displayed.

  FIG. 11 is a diagram of a feature amount distribution diagram screen displayed on the display unit by the data processing system according to the embodiment of the present invention.

  The feature amount distribution screen 155 shown in the figure is obtained by an inspection device (inspection device 1A) and an observation device 2 that are arbitrarily selected from a plurality of inspection devices out of defect information that is considered to be matched on the match rate display screen 135. A graph represented by arranging a plurality of plot points 159 based on the obtained defect feature amount and the defect feature amount obtained by the remaining inspection apparatus (inspection apparatus 1B) and observation apparatus 2, A defect feature obtained by an inspection apparatus (inspection apparatus 1A) and observation apparatus 2 arbitrarily selected from a plurality of inspection apparatuses is assigned to one shaft 156, and obtained by the remaining inspection apparatus (inspection apparatus 1B) and observation apparatus 2. A feature amount distribution graph 158 in which the assigned defect feature amount is assigned to the other axis 157 is displayed.

  The feature quantity distribution diagram screen 155 further includes a display frame 160 in which the feature quantity distribution graph 158 is displayed, and the inspection apparatus 1A and the observation apparatus 2 for the defect 159a selected from the plurality of plot points 159 by the input unit 5d. A display frame 161 in which a defect image (inspection image or observation image) is displayed, a pull-down menu 162 for changing the defect image displayed in the display frame 161 to another inspection / observation result, and the selected defect 159a A display frame 163 that displays the feature values obtained by the inspection apparatus 1A and the observation apparatus 2, a display frame 164 that displays a defect image of the selected defect 159a by the inspection apparatus 1B and the observation apparatus 2, and a display frame 164 A pull-down menu 165 for changing the defect image displayed on the screen to another inspection / observation result, and the inspection device 1B and the observation device for the selected defect 159a. The display frame 166. the feature amount obtained by 2 is displayed is mainly composed.

  The display frame 160 has a pull-down menu 167 for selecting one to be assigned to the axis 156 of the graph 158 from the defect feature amounts obtained from the inspection apparatus 1A and the observation apparatus 2, and the defect obtained from the inspection apparatus 1B and the observation apparatus 2. A pull-down menu 168 for selecting a feature amount to be assigned to the axis 157 is provided. The operator can easily recognize the feature amount distribution for each defect inspection apparatus that matches as a result of the correction process by selecting an arbitrary feature amount from the pull-down menus 167 and 168. Although the method for displaying the screen 155 is not particularly described, it is preferable to provide a separate button in the match rate display screen 135 and set it to be displayed by pressing it with the input unit 5d.

  Next, the operation and action of the defect data processing system configured as described above will be described.

  The operator analyzes the inspection result by each inspection apparatus on the defect analysis screen 30. When an analysis is performed, if an arbitrary plot point is selected from the defect distributions 31A and 31B, an image and a feature amount of the selected defect are displayed in the display frames 33 and 36 and the display frames 35 and 38. Thereby, since the image and feature quantity of the defect arbitrarily selected from the defects detected by each inspection apparatus can be confirmed on the same screen, the efficiency of the inspection result analysis work is improved. Further, in the feature quantity selection screen 60 displayed by pressing the button 41, if the defect feature quantity to be displayed on the display units 35 and 38 is appropriately selected, the defect feature quantity to be displayed on the screen can be appropriately selected. The efficiency of analysis work is improved. Furthermore, if a defect image to be displayed on the display units 33 and 36 is appropriately selected using the pull-down menus 34 and 37, the defect image to be displayed is changed to another inspection image or observation image, or a plurality of inspections are performed. Can be easily changed to other defect images obtained, and the identification number (ID) and coordinates of all the defects detected by the defect coordinate list screen 70 displayed by pressing the button 41 can be confirmed. As a result, work efficiency is further improved. Further, as shown in FIG. 4, since the defect analysis screen 30 can be enlarged and displayed, it is possible to easily select adjacent plot points that are difficult to discriminate when the entire image is displayed. The efficiency is further improved.

  When performing more detailed matching evaluation based on the analysis of the above inspection results, register multiple reference defects from each defect distribution, perform correction processing based on the registered defects, and measure errors. , Evaluate matching quantitatively. When registering a defect as a reference for correction processing, first, a so-called matching operation for discriminating the same defect from defect distributions obtained from different inspection results is performed. In other words, the correction processing for bringing another defect distribution closer to the arbitrarily selected defect distribution is performed with reference to the defect. In addition, the said effect acquired in the case of an analysis operation | work by the said structure has an effect also when performing a matching operation | work. That is, since the matching operation can be performed while simultaneously displaying the defect information obtained by each inspection apparatus on the screen at the same time, not only the efficiency of the matching operation is improved, but also the occurrence of a matching error can be suppressed. it can. Needless to say, the effects obtained by the operations of the feature quantity selection screen 60, the coordinate list screen 70, the pull-down menus 34, 37, and the like can also be obtained in the matching operation.

  Subsequently, the operator registers, using the button 39, a defect serving as a reference point for correction processing from among the plot points that are recognized as indicating the same defect as a result of the matching operation. Of course, this registration operation may be performed simultaneously with the above-described matching operation. When registering defects as correction processing reference points, defects on different defect distributions are selected one by one and then registered by pressing the button 39. In the present embodiment, one defect is selected from the defect distribution 31A, one defect is selected from the defect distribution 31B, and the button 39 is pressed. When the button 39 is pressed, the selected set of defects is registered as a correction processing reference point. In the screens 30 and 30a, since the registered defect is marked 47 (see FIG. 3), the registered defect on the defect distribution 31 can be visually recognized.

  When the correction process is performed using the registered defect as described above, the coordinate list screen 80 is displayed by pressing the button 40. The operator appropriately selects the defect to be used for the correction process from the registered defects using the check box 83. The information display sections 81 and 82 display the registered defect observation image (for example, SEM image), the size of the defect, and the like, so that the final confirmation of the registered defect can be performed. When deleting a defect once registered and returning it to unregistered, selecting a defect identification number (Defect ID) and pressing a button 86 erases the selected set of defects. When the defect used for the correction process is determined, the button 85 is pressed to execute the correction process. Since all the registered defects are displayed on the screen 80, it may be used when confirming the registration status of defects.

  The correction processing performed by the data processing system of the present embodiment is a defect registered as a correction reference from a defect distribution (defect distribution 31A) obtained by an inspection apparatus (inspection apparatus 1A) arbitrarily selected from a plurality of inspection apparatuses. This is a process of trying to bring the arrangement of the defect registered as the correction reference from the defect distribution (defect distribution 31B) obtained by the other inspection apparatus (inspection apparatus 1B) close to the arrangement of. When the button 85 is pressed, the data processor 5 starts the correction process as described above, and when the process ends, the correction process screen 100 is displayed on the display unit 5c. The correction value displayed in the display frame 101 on the screen 100 and the average error displayed in the display frame 105 are used for matching evaluation of the inspection results of both inspection apparatuses (inspection apparatuses 1A and 1B). It can be determined that the smaller the matching, the better the matching between the two inspection apparatuses. When more detailed matching evaluation is performed, a button 107 for executing a match rate calculation and a button 108 for displaying a coordinate error distribution diagram are used.

  When the button 108 is pressed, the data processor 5 creates the distribution map 121 and displays the coordinate error distribution map screen 120. The distribution map 121 displayed in this manner allows the operator to visually recognize how much the defect on the defect distribution 31B has an error with respect to the defect 31A. In the distribution diagram 121, the range setting unit 126 can set a range that can be displayed on the screen, so the operator can select an appropriate display range according to the degree of error distribution and needs. In addition, since the marker size setting unit 127 can change the display size of the plot points on the distribution map 121, it is possible to always select the optimal marker size for the display range.

  When the button 107 is pressed, the coincidence rate is calculated by the data processing device 5, and when the processing ends, the coincidence rate display screen 135 is displayed. When the coordinate comparison radius used for the match determination is changed and recalculated, an arbitrary numerical value is input to the input unit 141 and the button 142 is pressed. Can be calculated. By changing the coordinate comparison radius in this way, the matching accuracy between defect distributions can be evaluated. The match rate displayed on the result determination unit 140 indicates how close each defect on the defect distribution 137B approaches each defect on the defect distribution 31A by the correction processing performed based on the reference point as described above. It is something to evaluate. For this reason, the operator can quantitatively evaluate the matching of inspection equipment using this match rate, as well as the validity of defects registered as correction reference points in the previous procedure, and how much each inspection equipment matches by correction. It can also be evaluated whether it improves. Further, the details of the match can be grasped by the Venn diagram displayed on the Venn diagram display unit 145.

  The above-mentioned function is mainly to evaluate the error (coordinate error) of the position of the defect detected by the inspection apparatus, but the feature amount distribution diagram screen 155 shown in FIG. Among these, it is used when the inspection result by each inspection apparatus is evaluated by paying attention to the defect feature amount.

  If the pull-down menus 167 and 168 for assigning feature amounts to the axes 156 and 157 of the graph 158 are set to the same defect feature amount on the screen 155, the detection tendency of each of the inspection apparatuses 1A and 1B in the set feature amount is grasped. be able to. Here, for example, if the plot points are concentrated in the vicinity of the straight line 169 passing through the centers of the axes 156 and 158 in the graph 158, the defect feature amounts obtained by both the inspection apparatuses 1A and 1B tend to be similar, and the defect feature amount It can be determined that matching is good when focusing on the result. Further, since the defect information obtained by the inspection apparatus 1B can be displayed on the display frames 164 and 166 while the defect information obtained by the inspection apparatus 1A is displayed on the display frames 160 and 163, it is obtained for each inspection apparatus. The obtained defect information can be referred to at the same time. Thereby, the inspection result can be evaluated not only from the viewpoint of the defect distribution but also from the viewpoint of the defect feature amount.

  Next, effects of the embodiment of the present invention will be summarized.

  In the conventional technology, the analysis of the inspection result of each defect necessary for performing the matching evaluation of a plurality of inspection apparatuses must be performed manually by an operator, and the operation of discriminating the same defect from different inspection results (so-called Enormous amounts of time were required to perform “matching”) and the operation of correcting the coordinates based on the matched defect to obtain the degree of error.

  On the other hand, the embodiment of the present invention is a plurality of inspection information obtained by inspecting a defect on the same inspection object by a plurality of inspection apparatuses 1A and 1B, respectively, and the defect obtained for each inspection. A plurality of pieces of inspection information obtained by observing each of the defects on the inspected object by the observation device 2 based on the pieces of inspection information each including the position information of each, and the position information of the defects obtained in each inspection, A plurality of pieces of observation information each including image information of defects obtained for each observation are input, and are represented by plot points 48 arranged based on defect position information obtained for each inspection. When a plurality of defect distributions 31A and 31B are simultaneously displayed on the screen 30 of the display unit 5c and an arbitrary plot point on the screen of the display unit 5c is selected by the input unit 5d, the selected plot is selected. Tsu DOO point 48a, and a defect data processing device 5 and displaying the examination information and observation information of the corresponding defective on the display unit 5c to 48b. As a result, the operator can display defect information on an arbitrary defect from inspection information and observation information obtained by different inspection apparatuses on the same screen, so that inspection results obtained from a plurality of inspection apparatuses Can be efficiently performed based on the information on the screen. As described above, according to the present embodiment, defect data processing suitable for matching evaluation can be performed, so that the efficiency of analysis work accompanying matching evaluation is improved, and errors in inspection results by a plurality of inspection apparatuses are efficiently performed. Can be evaluated well.

  In addition, the defect data processing apparatus 5 of the present embodiment further refers to the defect inspection information and observation information corresponding to the selected plot points 48a and 48b on the display screen at the same time, thereby providing a plurality of defect distributions 31A, The remaining inspection apparatus 1B in the defect distribution 31A detected by the inspection apparatus 1A arbitrarily selected from the plurality of inspection apparatuses 1A and 1B on the basis of the positional information of the plot points determined to indicate the same defect in 31B. A correction process is performed to bring the defect distribution 31B detected by (1) closer. As a result, correction processing can be performed using a correction reference point determined based on a highly reliable matching operation, and more detailed matching evaluation can be performed efficiently.

  Furthermore, the defect data processing apparatus 5 of the present embodiment calculates the coincidence rate between the defect distribution 31A by the arbitrarily selected inspection apparatus 1A and the defect distribution 137B by the remaining inspection apparatus 1B after the correction process. As a result, it is possible to quantitatively evaluate how close all the defects on the defect distribution 137B subjected to the correction process are to the defect distribution 31A used as a reference for correction, so that more detailed matching evaluation can be performed. .

  In addition, the defect data processing device 5 according to the present embodiment includes the defect feature amount obtained by the arbitrarily selected inspection device 1A and the observation device 2 out of the defect information of the defect regarded as matched, and the remaining It is a graph represented by arranging a plurality of plot points 159 based on the defect feature quantities obtained by the inspection apparatus 1B and the observation apparatus 2, and is obtained by the arbitrarily selected inspection apparatus 1A and observation apparatus 2. A feature distribution diagram 158 in which the defect feature quantities assigned to one axis 156 and the defect feature quantities obtained by the remaining inspection apparatus 1B and observation apparatus 2 are assigned to the other axis 157 is displayed. As a result, detailed matching evaluation can be performed not only from the viewpoint of defect distribution but also from the viewpoint of defect feature amount, so that errors in inspection results by a plurality of inspection apparatuses can be efficiently evaluated.

  In the above description, the case where two inspection apparatuses are used has been described. However, when evaluating the inspection results of three or more inspection apparatuses, display frames for displaying defect images and feature quantities are also provided. By appropriately increasing it, it is possible to cope easily, and it can be applied in the same manner as described above.

The figure which shows schematic structure of the defect data processing system which is embodiment of this invention. The figure which shows the data flow in the defect data processing system which is embodiment of this invention. The figure of the defect analysis screen which the data processing system which is embodiment of this invention displays on a display part. FIG. 4 is a diagram of a defect analysis screen when the defect distribution 31 is enlarged and displayed on the display frame 32 in FIG. 3. The figure of the display selection screen of the defect feature-value which the data processing system which is embodiment of this invention displays on a display part. The figure of the coordinate list screen of the defect which the data processing system which is embodiment of this invention displays on a display part. The figure of the coordinate list screen of the correction | amendment reference point which the data processing system which is embodiment of this invention displays on a display part. The figure of the correction process result screen which the data processing system which is embodiment of this invention displays on a display part. The figure of the error distribution map screen which the data processing system which is embodiment of this invention displays on a display part. The figure of the coincidence rate display screen which the data processing system which is embodiment of this invention displays on a display part. The figure of the feature-value distribution map screen which the data processing system which is embodiment of this invention displays on a display part.

Explanation of symbols

1A, 1B Appearance inspection device 2 Observation device 5 Defect data processing device 5a Processing unit 5b Storage unit 5c Display unit 5d Input unit 9 Communication line 30 Defect analysis screens 31A, 31B Defect distribution 33 Display frame (defect image)
34 Pull-down menu 35 Display frame (defect feature)
36 Display frame (defect image)
37 Pull-down menu 38 Display frame (defect feature)
48 Plot Point 60 Defect Feature Amount Display Selection Screen 70 Defect Coordinate List Screen 80 Correction Reference Point Coordinate List Screen 81 Information Display Unit (Inspection Apparatus 1A)
82 Information Display Unit (Inspection Device 1B)
100 Correction processing result screen 103 Coordinate display unit 104 Error display unit 120 Coordinate error distribution diagram screen 121 Coordinate error distribution diagram 135 Match rate display screen 137B Defect distribution 141 Coordinate radius input unit 144 Match rate display unit 145 Venn diagram display unit 155 Feature quantity distribution Figure screen 158 Feature amount distribution graph 160 Display frame (defect image)
163 Display frame (defect feature)
164 Display frame (defect image)
166 Display frame (defect feature)
167 pull-down menu (Inspection device 1A)
168 Pull-down menu (Inspection device 1B)

Claims (22)

In a defect data processing apparatus for processing data relating to defects on an inspection object,
A plurality of pieces of inspection information obtained by inspecting defects on the same inspection object by a plurality of inspection devices, respectively, and a plurality of pieces of inspection information each including defect position information obtained for each inspection, and for each of the inspections A plurality of pieces of observation information obtained by observing each defect on the inspection object with an observation device based on the positional information of the obtained defects, each including image information of the defect obtained for each observation. Multiple pieces of observation information corresponding to the inspection information are input,
A plurality of points represented by plot points arranged based on position information of defects obtained for each of the inspections on the display unit that displays the processing results using the plurality of the inspection information and the plurality of observation informations input. Display the defect distribution on the same screen,
When an arbitrary plot point on the screen of the display unit is selected by the input unit instructing the processing content, defect inspection information and observation information corresponding to the selected plot point are displayed on the display unit. A featured defect data processing apparatus. In a defect data processing apparatus for processing data relating to defects on an inspection object,
A plurality of pieces of inspection information obtained by inspecting defects on the same inspection object by a plurality of inspection devices, respectively, and a plurality of pieces of inspection information each including defect position information obtained for each inspection, and for each of the inspections A plurality of pieces of observation information obtained by observing each defect on the inspection object with an observation device based on the positional information of the obtained defects, each including image information of the defect obtained for each observation. Multiple pieces of observation information corresponding to the inspection information are input,
A plurality of points represented by plot points arranged based on position information of defects obtained for each of the inspections on the display unit that displays the processing results using the plurality of the inspection information and the plurality of observation informations input. Display the defect distribution on the same screen,
When an arbitrary plot point on the screen of the display unit is selected by the input unit instructing the processing content, defect inspection information and observation information corresponding to the selected plot point are displayed on the display unit,
With reference to the position information of the plot points determined to indicate the same defect in the plurality of defect distributions by referring to the inspection information and observation information of the defect corresponding to the selected plot point, the plurality of A defect data processing apparatus, wherein correction processing is performed to bring the defect distribution detected by the remaining inspection apparatuses closer to the defect distribution detected by the inspection apparatus arbitrarily selected from the inspection apparatuses. The defect data processing apparatus according to claim 1,
The defect inspection information and observation information corresponding to the selected plot point includes at least either inspection image data obtained by the inspection apparatus or observation image data obtained by the observation apparatus. Defect data processing device. The defect data processing apparatus according to claim 1,
The screen on which defect inspection information and observation information corresponding to the selected plot point are displayed has a pull-down menu for changing the image information of the defect displayed on the screen to other image information. A defect data processing apparatus characterized by comprising: The defect data processing apparatus according to claim 1,
The defect inspection information and observation information corresponding to the selected plot point are defect feature quantities indicating defect characteristics obtained by the plurality of inspection apparatuses and the plurality of observation apparatuses, and include defect size information. A defect data processing apparatus including a feature amount. The defect data processing apparatus according to claim 5,
The defect feature amount displayed on the display unit as defect inspection information and observation information corresponding to the selected plot point is selected from the defect feature amounts obtained by the plurality of inspection devices and the plurality of observation devices. A defect data processing device selected by the input unit. The defect data processing apparatus according to claim 1,
A defect data processing apparatus, wherein a coordinate list of each defect created based on defect position information obtained for each inspection is displayed on the display unit. The defect data processing apparatus according to claim 2,
A defect data processing apparatus for displaying a coordinate list of defects used for correction processing created based on position information of plot points determined to indicate the same defect on the display unit. The defect data processing apparatus according to claim 8, wherein
A defect data processing apparatus, wherein correction processing is performed with reference to position information of a defect selected by the input unit in a defect coordinate list used for the correction processing. The defect data processing apparatus according to claim 8, wherein
A defect data processing apparatus, wherein the defect coordinate list used for the correction process has a display frame in which image information of each defect is displayed. The defect data processing apparatus according to claim 2,
Position information of plot points used as the reference for the correction process in the defect distribution by the arbitrarily selected inspection apparatus, and the correction point after the correction process for the plot point used as the reference for the correction process in the defect distribution by the remaining inspection apparatuses A defect data processing apparatus, wherein an error from the position information and an average error are displayed on the display unit. The defect data processing apparatus according to claim 11,
The defect data processing apparatus, wherein the error is displayed on the display unit by an error distribution diagram indicating a degree of error in distance from an origin. The defect data processing apparatus according to claim 2,
2. A defect data processing apparatus, comprising: calculating a coincidence rate that is an index for determining a coincidence state between a defect distribution by the arbitrarily selected inspection apparatus and a defect distribution by the remaining inspection apparatus after the correction process. The defect data processing apparatus according to claim 13, wherein
When calculating the match rate, a coordinate comparison radius that is a range in which the defect distribution after the correction process is considered to match the defect distribution by the arbitrarily selected inspection apparatus is input by the input unit. Defect data processing device. The defect data processing apparatus according to claim 13, wherein
A defect data processing apparatus, wherein the number of defects that match the defect distribution by the arbitrarily selected inspection apparatus and the number of defects that do not match are displayed on the display unit. The defect data processing apparatus according to claim 13, wherein
As a result of calculating the match rate, out of the defect information of defects regarded as matched, the defect feature amount obtained by the arbitrarily selected inspection device and the observation device, and the remaining inspection device and the observation FIG. 2 is a feature amount distribution diagram represented by arranging a plurality of plot points based on a defect feature amount obtained by an apparatus, and the defect feature amount obtained by the arbitrarily selected inspection apparatus and the observation apparatus. Is assigned to one of the axes, and a feature distribution diagram in which the defect feature obtained by the inspection device arbitrarily selected from the remaining inspection devices and the observation device is assigned to the other axis is displayed on the display unit. A defect data processing apparatus. The defect data processing apparatus according to claim 16, wherein
When an arbitrary plot point on the feature amount distribution diagram is selected by the input unit, inspection information obtained by the arbitrarily selected inspection device and the observation device of a defect corresponding to the selected plot point And a defect data processing apparatus for displaying the inspection information and the observation information obtained by the remaining inspection apparatus and the observation apparatus on the same screen of the display unit. The defect data processing apparatus according to claim 16, wherein
The feature amount distribution diagram includes a pull-down menu for changing a defect feature amount assigned to the one axis to another defect feature amount;
A defect data processing apparatus, comprising: a pull-down menu for changing a defect feature amount assigned to the other axis to another defect feature amount. In a defect data processing system for processing data relating to defects on an inspection object,
A plurality of inspection devices for inspecting defects on the same inspection object and obtaining a plurality of inspection information each including position information of the defects obtained for each inspection;
A plurality of pieces of observation information corresponding to the plurality of pieces of inspection information, each of which includes image information of defects obtained by observing defects on the inspection object based on position information of the defects obtained for each of the inspections and obtained for each observation. An observation device to obtain
A processing unit that processes the plurality of pieces of inspection information and the plurality of observation information; a display unit that displays a processing result of the processing unit; and an input unit that instructs processing content to the processing unit. A defect data processing apparatus connected to the apparatus and the observation apparatus,
The defect data processing device displays a plurality of defect distributions represented by plot points arranged on the basis of position information of defects obtained for each inspection on the same screen of the display unit, and the input unit displays the defect distribution When an arbitrary plot point on the screen of the display unit is selected, defect inspection information and observation information corresponding to the selected plot point are displayed on the display unit. In a defect data processing system for processing data relating to defects on an inspection object,
A plurality of inspection devices for inspecting defects on the same inspection object and obtaining a plurality of inspection information each including position information of the defects obtained for each inspection;
A plurality of pieces of observation information corresponding to the plurality of pieces of inspection information, each of which includes image information of defects obtained by observing defects on the inspection object based on position information of the defects obtained for each of the inspections and obtained for each observation. An observation device to obtain
A processing unit that processes the plurality of pieces of inspection information and the plurality of observation information; a display unit that displays a processing result of the processing unit; and an input unit that instructs processing content to the processing unit. A defect data processing apparatus connected to the apparatus and the observation apparatus,
The defect data processing device displays a plurality of defect distributions represented by plot points arranged on the basis of position information of defects obtained for each inspection on the same screen of the display unit, and the input unit displays the defect distribution When an arbitrary plot point on the screen of the display unit is selected, inspection information and observation information of the defect corresponding to the selected plot point are displayed on the display unit, and the defect corresponding to the selected plot point is displayed. Inspection apparatus arbitrarily selected from the plurality of inspection apparatuses based on the position information of the plot points determined to indicate the same defect in the plurality of defect distributions by referring to the inspection information and observation information of A defect data processing system, wherein correction processing is performed to bring the defect distribution detected by the remaining inspection apparatus closer to the defect distribution detected by. In a defect data processing method for processing data relating to defects on an inspection object,
A plurality of inspection devices for inspecting defects on the same inspection object and obtaining a plurality of inspection information each including position information of the defects obtained for each inspection;
A plurality of pieces of observation information corresponding to the plurality of pieces of inspection information, each of which includes image information of defects obtained by observing defects on the inspection object based on position information of the defects obtained for each of the inspections and obtained for each observation. An observation device to obtain
A display unit for displaying the results of data processing,
Displaying a plurality of defect distributions represented by plot points arranged based on defect position information obtained for each inspection on the same screen of the display unit,
When an arbitrary plot point on the screen of the display unit is selected, defect inspection processing and observation information corresponding to the selected plot point are displayed on the display unit. In a defect data processing method for processing data relating to defects on an inspection object,
A plurality of inspection devices for inspecting defects on the same inspection object and obtaining a plurality of inspection information each including position information of the defects obtained for each inspection;
A plurality of pieces of observation information corresponding to the plurality of pieces of inspection information, each of which includes image information of defects obtained by observing defects on the inspection object based on position information of the defects obtained for each of the inspections and obtained for each observation. An observation device to obtain
A display unit for displaying the results of data processing,
Displaying a plurality of defect distributions represented by plot points arranged based on defect position information obtained for each inspection on the same screen of the display unit,
When an arbitrary plot point on the screen of the display unit is selected, defect inspection information and observation information corresponding to the selected plot point are displayed on the display unit,
With reference to the position information of the plot points determined to indicate the same defect in the plurality of defect distributions by referring to the inspection information and observation information of the defect corresponding to the selected plot point, the plurality of A defect data processing method comprising: performing correction processing for bringing the defect distribution detected by the remaining inspection apparatuses closer to the defect distribution detected by the inspection apparatus arbitrarily selected from the inspection apparatuses.

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