JP2008053314A - Circuit board and its manufacturing method - Google Patents
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本発明は、膜状抵抗体を有する回路基板及びその製法に関する。 The present invention relates to a circuit board having a film resistor and a method for manufacturing the circuit board.
図9に示すように、絶縁性の基板(1)と、基板(1)上に形成された一対の電極(2,3)と、電極(2,3)間で基板(1)上に形成された膜状の抵抗体(4)とを備える回路基板(20)は、公知である。抵抗体(4)は、回路上の抵抗として利用され、抵抗体(4)にレーザ光を照射して、抵抗体(4)の上面(4a)に線状の切欠部(13)を形成する(トリミング)ことにより、所望の抵抗値に調整される。回路基板(20)を製造する際に、所望の抵抗値よりも小さい抵抗値を有する抵抗体(4)が形成され、トリミング装置のレーザ光によってトリミングすることにより、切欠部(13)の長さに応じて抵抗体(4)の抵抗値が増加する。このように、抵抗値を調整して、精度の高い抵抗値を有する抵抗体(4)を形成することができる。 As shown in FIG. 9, an insulating substrate (1), a pair of electrodes (2,3) formed on the substrate (1), and an electrode (2,3) are formed on the substrate (1). A circuit board (20) provided with the film-like resistor (4) formed is known. The resistor (4) is used as a resistor on the circuit, and the resistor (4) is irradiated with laser light to form a linear notch (13) on the upper surface (4a) of the resistor (4). By (trimming), it is adjusted to a desired resistance value. When the circuit board (20) is manufactured, the resistor (4) having a resistance value smaller than a desired resistance value is formed, and the length of the notch (13) is trimmed by the laser beam of the trimming device. Accordingly, the resistance value of the resistor (4) increases. In this way, the resistance value can be adjusted to form the resistor (4) having a highly accurate resistance value.
回路基板(20)は、抵抗体(4)の一方の端部(4b)に接続される一方の配線導体(7)と、抵抗体(4)の他方の端部(4c)に接続される他方の配線導体(8)と、一方の配線導体(7)に電気的に接続される第1の端子(21)を有する一方の電流パッド部(27)と、他方の配線導体(8)に電気的に接続される第2の端子(22)を有する他方の電流パッド部(28)と、一方の配線導体(7)に電気的に接続される第3の端子(23)を有する一方の電圧パッド部(17)と、他方の配線導体(8)に電気的に接続される第4の端子(24)を有する他方の電圧パッド部(18)とを備える。図9に示す回路基板(20)では、一方の配線導体(7)と一方の電流パッド部(27)とによって、高電位のアノード電極(一方の電極)(2)を構成し、他方の配線導体(8)と他方の電流パッド部(28)とによって、アノード電極(2)から離間して且つアノード電極(2)より低電位のカソード電極(他方の電極)(3)を構成する。 The circuit board (20) is connected to one wiring conductor (7) connected to one end (4b) of the resistor (4) and the other end (4c) of the resistor (4). The other wiring conductor (8), one current pad portion (27) having a first terminal (21) electrically connected to one wiring conductor (7), and the other wiring conductor (8) The other current pad portion (28) having the second terminal (22) to be electrically connected, and the other having the third terminal (23) to be electrically connected to the one wiring conductor (7) A voltage pad portion (17) and the other voltage pad portion (18) having a fourth terminal (24) electrically connected to the other wiring conductor (8) are provided. In the circuit board (20) shown in FIG. 9, one wiring conductor (7) and one current pad part (27) constitute a high potential anode electrode (one electrode) (2), and the other wiring. The conductor (8) and the other current pad portion (28) constitute a cathode electrode (the other electrode) (3) that is separated from the anode electrode (2) and has a lower potential than the anode electrode (2).
例えば、抵抗体(4)の抵抗値を測定する図9に示す4端子測定法では、測定すべき抵抗体(4)の両端(4b,4c)に隣接する配線導体(7,8)の各内端に電圧パッド部(17,18)を接続して、第3の端子(23)及び第4の端子(24)に電圧計(9)の一対の電圧測定プローブを接触させる。また、配線導体(7,8)の各外端に電流パッド部(27,28)を接続して、第1の端子(21)及び第2の端子(22)に接触する定電流源装置(6)の一対の電流プローブ間に電流を流す。電圧計(9)の一対の電圧測定プローブで抵抗体(4)の両端(4b,4c)の電圧値を測定し、その電圧値及び定電流源装置(6)の一対の電流プローブ間に流れる電流値から抵抗体(4)の抵抗値を換算する。抵抗体(4)の抵抗値をリアルタイムで測定しながら、レーザ光により抵抗体(4)をトリミングして、所定の形状の切欠部(13)を形成することにより、抵抗体(4)を所望の抵抗値に調整することができる。 For example, in the four-terminal measurement method shown in FIG. 9 for measuring the resistance value of the resistor (4), each of the wiring conductors (7, 8) adjacent to both ends (4b, 4c) of the resistor (4) to be measured is measured. A voltage pad portion (17, 18) is connected to the inner end, and a pair of voltage measurement probes of the voltmeter (9) are brought into contact with the third terminal (23) and the fourth terminal (24). In addition, a constant current source device (which contacts the first terminal (21) and the second terminal (22) by connecting the current pad portion (27, 28) to each outer end of the wiring conductor (7, 8). Current is passed between the pair of current probes in 6). The voltage value of both ends (4b, 4c) of the resistor (4) is measured by a pair of voltage measurement probes of the voltmeter (9), and flows between the voltage value and the pair of current probes of the constant current source device (6). The resistance value of the resistor (4) is converted from the current value. While measuring the resistance value of the resistor (4) in real time, trimming the resistor (4) with a laser beam to form a notch (13) of a predetermined shape, thereby making the resistor (4) desired The resistance value can be adjusted.
この種の回路基板(20)では、抵抗体(4)のアノード電極(2)に近接する位置でレーザ光の照射を開始又は終了とすると、高電位のアノード電極(2)側に切欠部(13)の端部が形成される。抵抗体(4)にレーザ光を照射して切欠部(13)を形成すると、切欠部(13)周辺の抵抗体(4)がレーザ光により熱変質する。更に、抵抗体(4)に電流を流すと、切欠部(13)の端部で電流密度が集中して抵抗体(4)の切欠部(13)の端部が加熱される。その結果、熱変質した抵抗体(4)の切欠部(13)の端部にマイクロクラックが発生することがあった。高電位側で抵抗体(4)にマイクロクラックが発生すると、抵抗体(4)の抵抗値の経時変化が大きくなり、抵抗体(4)の抵抗値が不安定になる問題があった。 In this type of circuit board (20), when laser light irradiation is started or ended at a position close to the anode electrode (2) of the resistor (4), a notch portion (on the high potential anode electrode (2) side) The end of 13) is formed. When the notched portion (13) is formed by irradiating the resistor (4) with laser light, the resistor (4) around the notched portion (13) is thermally altered by the laser light. Further, when a current is passed through the resistor (4), the current density is concentrated at the end of the notch (13), and the end of the notch (13) of the resistor (4) is heated. As a result, microcracks may occur at the end of the notched portion (13) of the resistor (4) that has been thermally altered. When a microcrack occurs in the resistor (4) on the high potential side, there is a problem that the resistance value of the resistor (4) becomes unstable and the resistance value of the resistor (4) becomes unstable.
図9の回路基板(20)では、配線導体(7,8)の形成されない抵抗体(4)の側面(4e)の開放部をレーザ光の照射開始点(25a)とし、二点鎖線により示す軌跡(25)に沿ってレーザ光を照射してL字形の切欠部(13)を形成する。レーザ光の軌跡(25)を略直角に曲げてカソード電極(3)側に切欠部(13)を屈曲させることにより、L字形の切欠部(13)と抵抗体(4)の側面(4e)の開放部との間に、電流経路(29)にならない抵抗体(4)の無効領域(15)を形成できる。よって、抵抗体(4)の無効領域(15)により、図10に示すように、アノード電極(2)からカソード電極(3)に向かう抵抗体(4)の電流経路(29)の断面積を減少させて、抵抗体(4)の抵抗値を増加させることができる。図9の回路基板(20)によれば、容易に抵抗体(4)の抵抗値を所望する値に調整することができる。 In the circuit board (20) of FIG. 9, the open portion of the side surface (4e) of the resistor (4) where the wiring conductors (7, 8) are not formed is the laser beam irradiation start point (25a), and is indicated by a two-dot chain line. A laser beam is irradiated along the locus (25) to form an L-shaped notch (13). The L-shaped notch (13) and the side surface (4e) of the resistor (4) are bent by bending the laser beam locus (25) at a substantially right angle and bending the notch (13) toward the cathode electrode (3). An ineffective region (15) of the resistor (4) that does not become the current path (29) can be formed between the open portion and the open portion. Therefore, the cross-sectional area of the current path (29) of the resistor (4) from the anode electrode (2) to the cathode electrode (3) is reduced by the ineffective region (15) of the resistor (4) as shown in FIG. The resistance value of the resistor (4) can be increased by decreasing the resistance. According to the circuit board (20) of FIG. 9, the resistance value of the resistor (4) can be easily adjusted to a desired value.
レーザ光の照射終了点(25b)により、カソード電極(3)に近接して切欠部(13)に端部(13a)が形成されるが、低電位のカソード電極(3)側に形成された端部(13a)周辺の抵抗体(4)にマイクロクラックが生じても、抵抗体(4)の抵抗値が著しく不安定にならない。レーザ光により抵抗体(4)にL字形の切欠部(13)を形成する抵抗体のトリミング法は、例えば、下記特許文献1により公知である。
The end (13a) is formed in the notch (13) close to the cathode electrode (3) due to the end point (25b) of the laser light irradiation, but formed on the low potential cathode electrode (3) side. Even if a microcrack occurs in the resistor (4) around the end (13a), the resistance value of the resistor (4) does not become extremely unstable. A resistor trimming method for forming an L-shaped notch (13) in the resistor (4) by laser light is known, for example, from
しかしながら、図9の回路基板(20)では、切欠部(13)に形成される角部(13b)がアノード電極(2)側に電流経路(29)のエッジを形成し、抵抗体(4)に電流が流れた際に、図10に示すように、切欠部(13)の角部(13b)周辺の抵抗体(4)で電流密度が増大して発熱し、アノード電極(2)側で抵抗体(4)にマイクロクラックが生じ、抵抗体(4)の抵抗値が不安定となる虞があった。 However, in the circuit board (20) of FIG. 9, the corner (13b) formed in the notch (13) forms the edge of the current path (29) on the anode electrode (2) side, and the resistor (4) As shown in FIG. 10, the current density increases at the resistor (4) around the corner (13b) of the notch (13) and heat is generated, and the anode electrode (2) side generates heat. There is a possibility that micro-cracks occur in the resistor (4), and the resistance value of the resistor (4) becomes unstable.
そこで、本発明は、高電位電極側に端部又は角部のない切欠部を形成して、抵抗体の抵抗値を変化させる無効領域を形成できる回路基板及びその製法を提供することを目的とする。 Therefore, an object of the present invention is to provide a circuit board capable of forming an ineffective region in which a resistance value of a resistor is changed by forming a notched portion having no end or corner on the high potential electrode side, and a manufacturing method thereof. To do.
本発明の回路基板は、絶縁性の基板(1)と、基板(1)上に形成された一対の電極(2,3)と、電極(2,3)間で基板(1)上に形成された抵抗体(4)とを備える。電極(2,3)は、一方の電極(2)と、一方の電極(2)から離間して且つ一方の電極(2)より低電位の他方の電極(3)とを有し、抵抗体(4)は、基板(1)の一部を外部に露出する開口部(5)を有する。開口部(5)は、一方の電極(2)側に形成された第1の開口部(11)と、第1の開口部(11)より狭い幅を有し且つ第1の開口部(11)から他方の電極(3)に向って延伸する第2の開口部(12)とを備える。第1の開口部(11)より狭い幅を有し且つ第2の開口部(12)から離間して第1の開口部(11)から他方の電極(3)に向って延伸する切欠部(13)を形成する。第1の開口部(11)、第2の開口部(12)及び切欠部(13)によって形成される抵抗体(4)の無効領域により、一方の電極(アノード電極)(2)から他方の電極(カソード電極)(3)に向かう抵抗体(4)の電流経路の断面積を減少させ、抵抗体(4)の抵抗値を増加させることができる。高電位側で抵抗体(4)に第1の開口部(11)を形成し、第1の開口部(11)から第1の開口部(11)よりも幅の狭い第2の開口部(12)と切欠部(13)とをそれぞれ低電位側へ延伸させることによって、高電位側で切欠部(13)に端部又は角部を形成せずに、第1の開口部(11)、第2の開口部(12)及び切欠部(13)により抵抗体(4)の抵抗値を変化させる無効領域の面積を調整することができる。よって、抵抗体(4)に一方の電極(2)から他方の電極(3)に向って形成される円滑な電流経路に沿って抵抗体(4)に電流が流れ、電流密度の局部的増大よる発熱により高電位側で抵抗体(4)にマイクロクラックが発生するのを防止することができる。 The circuit board of the present invention is formed on the substrate (1) between the insulating substrate (1), the pair of electrodes (2, 3) formed on the substrate (1), and the electrodes (2, 3). A resistor (4). The electrode (2, 3) has one electrode (2) and the other electrode (3) which is separated from the one electrode (2) and has a lower potential than the one electrode (2). (4) has an opening (5) that exposes a part of the substrate (1) to the outside. The opening (5) has a first opening (11) formed on the one electrode (2) side, a width narrower than the first opening (11), and the first opening (11). ) To the other electrode (3) and a second opening (12). A notch (having a narrower width than the first opening (11) and spaced from the second opening (12) and extending from the first opening (11) toward the other electrode (3) 13) is formed. Due to the ineffective region of the resistor (4) formed by the first opening (11), the second opening (12) and the notch (13), one electrode (anode electrode) (2) to the other The cross-sectional area of the current path of the resistor (4) toward the electrode (cathode electrode) (3) can be reduced, and the resistance value of the resistor (4) can be increased. A first opening (11) is formed in the resistor (4) on the high potential side, and a second opening (narrower than the first opening (11) is narrower than the first opening (11). 12) and the notch (13) are each extended to the low potential side, so that the first opening (11), without forming an end or a corner in the notch (13) on the high potential side, The area of the ineffective region in which the resistance value of the resistor (4) is changed can be adjusted by the second opening (12) and the notch (13). Therefore, current flows through the resistor (4) along a smooth current path formed from the one electrode (2) to the other electrode (3) in the resistor (4), and the current density is locally increased. It is possible to prevent microcracks from occurring on the resistor (4) on the high potential side due to heat generation.
本発明の回路基板の製法は、絶縁性の基板(1)上に一方の電極(2)及び他方の電極(3)を形成する工程と、一方の電極(2)側に基板(1)の一部を外部に露出する開口部(5)を有する抵抗体(4)を電極(2,3)間で基板(1)上に形成する工程と、抵抗体(4)にレーザ光を照射して、開口部(5)内から他方の電極(3)に向って開口部(5)よりも幅が狭い切欠部(13)を抵抗体(4)に形成することにより、抵抗体(4)の抵抗値を調整する工程とを含む。開口部(5)内をレーザ光の開始点として他方の電極(3)に向って切欠部(13)を形成するので、一方の電極(2)側で切欠部(13)に端部又は角部を形成せずに、開口部(5)と切欠部(13)又は、開口部(5)と切欠部(13)と抵抗体(4)の側面(4d)の開放部により抵抗体(4)の抵抗値を変化させる無効領域を形成することができる。また、レーザ光により形成される切欠部(13)とは異なり、開口部(5)周辺の抵抗体(4)には、熱変質が生じないので、レーザ光によるトリミングの開始点を開口部(5)内とすることによって、レーザ光によるトリミングの開始点で抵抗体(4)にマイクロクラックが発生するのを防止することができる。開口部(5)は、抵抗体(4)の抵抗値を概括的に粗調整し、その後に切欠部(13)を形成して、切欠部(13)の長さにより、抵抗体(4)の無効領域の大きさを変更して、抵抗体(4)の抵抗値を高精度に微調整することができる。 The method for producing a circuit board of the present invention comprises a step of forming one electrode (2) and the other electrode (3) on an insulating substrate (1), and a step of forming the substrate (1) on the one electrode (2) side. A step of forming a resistor (4) having an opening (5) partially exposed to the outside on the substrate (1) between the electrodes (2, 3), and irradiating the resistor (4) with laser light The resistor (4) is formed in the resistor (4) by forming a notch (13) narrower than the opening (5) from the inside of the opening (5) toward the other electrode (3). Adjusting the resistance value. Since the notch (13) is formed toward the other electrode (3) with the inside of the opening (5) as the starting point of the laser beam, the end or corner of the notch (13) is formed on the one electrode (2) side. Without forming the opening, the opening (5) and the notch (13) or the opening (5), the notch (13) and the open part of the side surface (4d) of the resistor (4) (4) ) Ineffective regions for changing the resistance value can be formed. Also, unlike the notch (13) formed by the laser beam, the resistor (4) around the opening (5) does not undergo thermal alteration, so the trimming start point by the laser beam is the opening ( By setting the inside of 5), it is possible to prevent microcracks from occurring in the resistor (4) at the starting point of trimming by laser light. The opening (5) roughly adjusts the resistance value of the resistor (4), then forms a notch (13), and the length of the notch (13) determines the resistance (4) By changing the size of the ineffective area, the resistance value of the resistor (4) can be finely adjusted with high accuracy.
高電位側で抵抗体の局部的な電流密度の集中を生じる切欠部の端部又は角部が形成されるのを防止して、抵抗体の抵抗値が長期間略一定に保持される信頼性の高い回路基板を提供できる。 Reliability that the resistance value of the resistor is kept constant for a long period of time by preventing the formation of the end or corner of the notch that causes local current density concentration of the resistor on the high potential side High circuit board can be provided.
以下、本発明による回路基板及びその製法の実施の形態を図1〜図8について説明する。但し、図1〜図8では、図9及び図10に示す箇所と実質的に同一の部分には同一の符号を付し、その説明を省略する。また、実際の基板(1)上には、抵抗体(4)以外に半導体素子又はチップコンデンサ等の回路素子が配置されるが、便宜上、これらの図示を省略する。 Embodiments of a circuit board and its manufacturing method according to the present invention will be described below with reference to FIGS. However, in FIGS. 1-8, the same code | symbol is attached | subjected to the part substantially the same as the location shown in FIG.9 and FIG.10, and the description is abbreviate | omitted. In addition to the resistor (4), a circuit element such as a semiconductor element or a chip capacitor is disposed on the actual substrate (1), but these are not shown for convenience.
図1に示すように、本実施の形態の回路基板(10)では、抵抗体(4)は、基板(1)の一部を外部に露出する開口部(5)を抵抗体(4)の上面(4a)に有する。開口部(5)は、アノード電極(2)側に形成された第1の開口部(11)と、第1の開口部(11)より狭い幅を有し且つ第1の開口部(11)からカソード電極(3)に向って延伸する第2の開口部(12)とを備える。抵抗体(4)の一方の側面(4d)から他方の側面(4e)までを抵抗体(4)の幅方向とし、一方の配線導体(7)に接続される抵抗体(4)の一方の端部(4b)から他方の配線導体(8)に接続される抵抗体(4)の他方の端部(4c)までを抵抗体(4)の長さ方向とすると、第1の開口部(11)は、第2の開口部(12)よりも幅方向に大きく形成され、第2の開口部(12)は、第1の開口部(11)よりもカソード電極(3)に向って長さ方向に大きく形成される。具体的には、例えば、抵抗体(4)の幅を3.0mmとすると、第1の開口部(11)の幅は、0.9mm以上で且つ3.0mm未満に形成され、第2の開口部(12)の幅は、0.3mm以上で且つ0.9mm未満に形成される。 As shown in FIG. 1, in the circuit board (10) of the present embodiment, the resistor (4) has an opening (5) that exposes a part of the board (1) to the outside of the resistor (4). On the upper surface (4a). The opening (5) has a first opening (11) formed on the anode electrode (2) side, a width narrower than the first opening (11), and the first opening (11). And a second opening (12) extending toward the cathode electrode (3). The width direction of the resistor (4) is from one side surface (4d) to the other side surface (4e) of the resistor (4), and one side of the resistor (4) connected to one wiring conductor (7) When the length direction of the resistor (4) is from the end (4b) to the other end (4c) of the resistor (4) connected to the other wiring conductor (8), the first opening ( 11) is formed larger in the width direction than the second opening (12), and the second opening (12) is longer toward the cathode electrode (3) than the first opening (11). Largely formed in the vertical direction. Specifically, for example, if the width of the resistor (4) is 3.0 mm, the width of the first opening (11) is 0.9 mm or more and less than 3.0 mm. The width of the opening (12) is not less than 0.3 mm and less than 0.9 mm.
第1の開口部(11)は、略円形又は楕円形に形成される。角部のない湾曲形状の略円形又は楕円形に第1の開口部(11)を形成することにより、図2に示すように、円滑な電流経路(29)を形成して、電流集中を防止できる。また、第1の開口部(11)は、アノード電極(2)側の抵抗体(4)の端部(4b)に沿って形成される。第1の開口部(11)によりアノード電極(2)から流れる電流を抵抗体(4)の両側面(4d,4e)方向に分散して、抵抗体(4)の一部での電流集中を防止することができる。第2の開口部(12)は、第1の開口部(11)からカソード電極(3)まで略直線状に形成される。即ち、幅広の第1の開口部(11)が高電位側に形成され、幅狭の第2の開口部(12)が低電位側に形成され、開口部(5)は、抵抗体(4)の一方の端部(4b)から他方の端部(4c)まで形成される。 The first opening (11) is formed in a substantially circular or elliptical shape. By forming the first opening (11) in a substantially circular or elliptical shape with no corners, a smooth current path (29) is formed as shown in FIG. 2 to prevent current concentration. it can. The first opening (11) is formed along the end (4b) of the resistor (4) on the anode electrode (2) side. The current flowing from the anode electrode (2) through the first opening (11) is distributed in the direction of both sides (4d, 4e) of the resistor (4), thereby concentrating the current in a part of the resistor (4). Can be prevented. The second opening (12) is formed substantially linearly from the first opening (11) to the cathode electrode (3). That is, the wide first opening (11) is formed on the high potential side, the narrow second opening (12) is formed on the low potential side, and the opening (5) is formed of the resistor (4 ) From one end (4b) to the other end (4c).
本実施の形態では、第1の開口部(11)より狭い幅を有し且つ第2の開口部(12)から離間して第1の開口部(11)からカソード電極(3)に向って延伸する切欠部(13)を形成する。また、切欠部(13)は、第1の開口部(11)内から第2の開口部(12)と略平行にカソード電極(3)に向って延伸する。切欠部(13)は、レーザ光によるトリミングで形成され、基板(1)が外部に露出しない溝又は基板(1)が外部に露出する開口であり、レーザ光により切欠部(13)周辺の抵抗体(4)は、レーザ光によって熱変質する。 In the present embodiment, the first opening (11) has a narrower width and is spaced apart from the second opening (12) toward the cathode electrode (3) from the first opening (11). A notch (13) to be stretched is formed. The notch (13) extends from the first opening (11) toward the cathode electrode (3) substantially in parallel with the second opening (12). The notch (13) is formed by trimming with a laser beam and is a groove in which the substrate (1) is not exposed to the outside or an opening from which the substrate (1) is exposed to the outside, and the resistance around the notch (13) by the laser beam The body (4) is thermally altered by the laser beam.
第1の開口部(11)、第2の開口部(12)及び切欠部(13)の間に形成される抵抗体(4)の無効領域(15)は、抵抗体として寄与せず、無効領域(15)によりアノード電極(2)からカソード電極(3)に向かう抵抗体(4)の電流経路(29)の断面積を減少させて、抵抗体(4)の抵抗値を増加させることができる。従来の回路基板(20)では、高電位のアノード電極(2)側の切欠部(13)に角部(13b)が形成されるが、本実施の形態の回路基板(10)では、アノード電極(2)側に第1の開口部(11)を形成し、第1の開口部(11)から第1の開口部(11)よりも幅の狭い第2の開口部(12)と切欠部(13)とをそれぞれ低電位のカソード電極(3)側へ延伸させることにより、高電位側で切欠部(13)に端部又は角部を形成せずに、抵抗値を変化させる無効領域(15)を形成することができる。よって、図2に示すように、抵抗体(4)にアノード電極(2)からカソード電極(3)に向って円滑な電流経路(29)が形成され、高電位側で抵抗体(4)にマイクロクラックが発生するのを防止できる。その結果、抵抗体(4)の抵抗値を長期間にわたり安定させることができる。 The invalid region (15) of the resistor (4) formed between the first opening (11), the second opening (12), and the notch (13) does not contribute as a resistor and is invalid. By reducing the cross-sectional area of the current path (29) of the resistor (4) from the anode electrode (2) to the cathode electrode (3) by the region (15), the resistance value of the resistor (4) can be increased. it can. In the conventional circuit board (20), the corner (13b) is formed in the cutout part (13) on the high potential anode electrode (2) side, but in the circuit board (10) of the present embodiment, the anode electrode The first opening (11) is formed on the (2) side, and the second opening (12) and the notch are narrower than the first opening (11) from the first opening (11). (13) and extending to the low potential cathode electrode (3) side, respectively, by not forming an end or a corner in the notch (13) on the high potential side, the ineffective region to change the resistance value ( 15) can be formed. Therefore, as shown in FIG. 2, a smooth current path (29) is formed in the resistor (4) from the anode electrode (2) to the cathode electrode (3), and the resistor (4) is formed on the high potential side. The generation of microcracks can be prevented. As a result, the resistance value of the resistor (4) can be stabilized over a long period of time.
図3は、第1の端子(21)〜第4の端子(24)、電圧パッド部(17,18)、定電流源装置(6)及び電圧計(9)を省略した回路基板(10)の平面図を示し、図4は、図3のIV−IV線に沿う部分断面図を示す。 FIG. 3 shows a circuit board (10) in which the first terminal (21) to the fourth terminal (24), the voltage pad section (17, 18), the constant current source device (6), and the voltmeter (9) are omitted. FIG. 4 is a partial sectional view taken along the line IV-IV in FIG.
回路基板(10)を製造する際に、まず、図4(a)に示すように、アルミナ、エポキシ樹脂又はセラミックス等の材質から成る絶縁性の基板(1)を準備する。基板(1)の表面に電圧パッド部(17,18)、配線導体(7,8)及び電流パッド部(27,28)を形成する図示しないマスクが配置される。基板(1)上には、電圧パッド部(17,18)と、配線導体(7,8)及び電流パッド部(27,28)をそれぞれ有するアノード電極(2)並びにカソード電極(3)とが形成される。電圧パッド部(17,18)、配線導体(7,8)及び電流パッド部(27,28)は、例えば、銅及び銀を主成分とする金属ペーストを基板(1)上に印刷し、燃焼することにより、燃焼後に0.01〜0.02mm程度の厚みで形成される。通常、配線導体(7,8)及び電流パッド部(27,28)と共に、図示しない他の回路パターンが基板(1)上に形成される。 When manufacturing the circuit board (10), first, as shown in FIG. 4 (a), an insulating board (1) made of a material such as alumina, epoxy resin or ceramics is prepared. Masks (not shown) for forming the voltage pad portions (17, 18), the wiring conductors (7, 8), and the current pad portions (27, 28) are arranged on the surface of the substrate (1). On the substrate (1), there are a voltage pad portion (17, 18), an anode electrode (2) and a cathode electrode (3) each having a wiring conductor (7, 8) and a current pad portion (27, 28). It is formed. The voltage pad portion (17, 18), the wiring conductor (7, 8), and the current pad portion (27, 28) are printed on the substrate (1) with a metal paste mainly composed of copper and silver, for example, and burned By doing so, a thickness of about 0.01 to 0.02 mm is formed after combustion. Usually, other circuit patterns (not shown) are formed on the substrate (1) together with the wiring conductors (7, 8) and the current pad portions (27, 28).
次に、基板(1)の一部を外部に露出する開口部(5)を有する抵抗体(4)を電極(2,3)間で基板(1)上に形成する。本実施の形態では、周知のスクリーン印刷法により抵抗体(4)を形成すると共に、切欠部(13)より広い幅を有し且つアノード電極(2)側に形成される第1の開口部(11)と、第1の開口部(11)より狭い幅を有し且つ第1の開口部(11)からカソード電極(3)に向って延伸する第2の開口部(12)とを抵抗体(4)と同時に形成する。図4(b)に示すように、基板(1)上にマスク(19)が配置される。マスク(19)は、基板(1)上の抵抗体(4)を形成すべき領域に開口(19a)を有する。図4(c)に示すように、抵抗体(4)は、例えば、酸化ルテニウム系ガラス粉末と有機バインダとから成る抵抗ペーストを基板(1)上に塗布し、燃焼することにより、燃焼後に0.01mm程度の厚みで形成される。 Next, a resistor (4) having an opening (5) exposing a part of the substrate (1) to the outside is formed on the substrate (1) between the electrodes (2, 3). In the present embodiment, the resistor (4) is formed by a known screen printing method, and the first opening (having a width wider than the notch (13) and formed on the anode electrode (2) side ( 11) and a second opening (12) having a narrower width than the first opening (11) and extending from the first opening (11) toward the cathode electrode (3). (4) Form simultaneously. As shown in FIG. 4B, a mask (19) is disposed on the substrate (1). The mask (19) has an opening (19a) in a region where the resistor (4) is to be formed on the substrate (1). As shown in FIG. 4 (c), the resistor (4) is formed, for example, by applying a resistance paste made of ruthenium oxide glass powder and an organic binder on the substrate (1) and burning it, so that it becomes 0 after combustion. It is formed with a thickness of about 0.01 mm.
図4(d)に示すように、基板(1)上のマスク(19)により被覆された領域には、抵抗ペーストが塗布されないが、マスク(19)の開口(19a)には、抵抗ペーストが塗布されるため、マスク(19)を除去して、燃焼させると、第1の開口部(11)及び第2の開口部(12)を除いて基板(1)上の電極(2,3)間に抵抗体(4)を形成することができる。レーザ光により開口部を形成すると、開口部周辺の抵抗体(4)がレーザ光により熱変質するが、スクリーン印刷法により第1の開口部(11)及び第2の開口部(12)を形成するので、それらの周辺で熱変質が生じず、抵抗体(4)に電流が流れる際に、第1の開口部(11)及び第2の開口部(12)周辺の抵抗体(4)には、マイクロクラックが発生しない。また、第1の開口部(11)は、アノード電極(2)側の抵抗体(4)の端部(4b)に沿って形成される。レーザ光が配線導体(7)又は電流パッド部(27)に照射されると、配線導体(7)又は電流パッド部(27)が溶解して孔が形成され、配線導体(7)又は電流パッド部(27)に電流集中が生じる不具合が発生する。本実施の形態では、第1の開口部(11)をレーザ光ではなくスクリーン印刷法により形成するので、配線導体(7)に隣接して第1の開口部(11)を形成することができる。 As shown in FIG. 4 (d), the resistance paste is not applied to the region covered with the mask (19) on the substrate (1), but the resistance paste is applied to the opening (19a) of the mask (19). When the mask (19) is removed and burned to be applied, the electrodes (2, 3) on the substrate (1) except for the first opening (11) and the second opening (12) A resistor (4) can be formed therebetween. When the opening is formed by the laser light, the resistor (4) around the opening is thermally altered by the laser light, but the first opening (11) and the second opening (12) are formed by the screen printing method. Therefore, when the current flows through the resistor (4) without any thermal alteration around them, the resistor (4) around the first opening (11) and the second opening (12) Does not generate microcracks. The first opening (11) is formed along the end (4b) of the resistor (4) on the anode electrode (2) side. When the laser beam is irradiated to the wiring conductor (7) or the current pad portion (27), the wiring conductor (7) or the current pad portion (27) is melted to form a hole, and the wiring conductor (7) or the current pad is formed. There arises a problem that current concentration occurs in the part (27). In the present embodiment, since the first opening (11) is formed by screen printing instead of laser light, the first opening (11) can be formed adjacent to the wiring conductor (7). .
続いて、抵抗体(4)にレーザ光を照射して、第1の開口部(11)内からカソード電極(3)に向って第1の開口部(11)よりも幅が狭い切欠部(13)を抵抗体(4)に形成する。抵抗体(4)は、図示しないトリミング装置から照射されるYAGレーザ又はエキシマレーザ等のレーザ光によりトリミングされる。切欠部(13)は、レーザ光の強度を調節して、基板(1)が外部に露出しない溝状又は基板(1)が外部に露出する孔状に形成される。図4(e)に示すように、レーザ光の照射開始点(25a)は、第1の開口部(11)の内側とし、第1の開口部(11)からカソード電極(3)側に向かってレーザ光の軌跡(25)が形成されるように、トリミング装置を制御する。従って、レーザ光は、初めに第1の開口部(11)内で露出する基板(1)に照射されるが、配線導体(7)又は電流パッド部(27)とは異なり、電流が流れる部分ではないので、基板(1)にレーザ光を短時間照射しても、熱変質等による電気的不具合は生じない。4端子測定法を用いて抵抗体(4)の抵抗値を測定しながらレーザ光によるトリミングをするが、4端子測定法は、従来と同様であり、詳述を省略する。この後、抵抗体(4)を図示しないガラスコートによる保護膜により被覆し、基板(1)上に形成される他の回路パターンに抵抗体(4)以外の図示しない半導体素子又はチップコンデンサ等の所定の回路部品が実装され、回路基板(10)が完成する。 Subsequently, the resistor (4) is irradiated with a laser beam, and a notch (narrower than the first opening (11) is narrowed from the first opening (11) toward the cathode electrode (3). 13) is formed on the resistor (4). The resistor (4) is trimmed by a laser beam such as a YAG laser or an excimer laser emitted from a trimming device (not shown). The notch (13) is formed in a groove shape in which the substrate (1) is not exposed to the outside or a hole shape in which the substrate (1) is exposed to the outside by adjusting the intensity of the laser beam. As shown in FIG. 4E, the laser beam irradiation start point (25a) is located inside the first opening (11) and extends from the first opening (11) toward the cathode electrode (3). Thus, the trimming apparatus is controlled so that the locus (25) of the laser beam is formed. Therefore, the laser beam is first irradiated to the substrate (1) exposed in the first opening (11), but unlike the wiring conductor (7) or the current pad portion (27), the portion through which the current flows. Therefore, even if the substrate (1) is irradiated with a laser beam for a short time, an electrical failure due to thermal alteration or the like does not occur. Trimming with a laser beam is performed while measuring the resistance value of the resistor (4) using a four-terminal measurement method, but the four-terminal measurement method is the same as the conventional one, and detailed description thereof is omitted. Thereafter, the resistor (4) is covered with a protective film made of a glass coat (not shown), and other circuit patterns formed on the substrate (1) such as a semiconductor element (not shown) or a chip capacitor other than the resistor (4) Predetermined circuit components are mounted, and the circuit board (10) is completed.
本実施の形態では、第1の開口部(11)内をレーザ光の照射開始点(25a)として、カソード電極(3)に向って略直線状に切欠部(13)を形成するので、高電位のアノード電極(2)側で切欠部(13)に端部又は角部が形成されず、高電位側で抵抗体(4)にマイクロクラックが生じるのを防止することができる。レーザ光が0.05mm程度の幅で抵抗体(4)に切欠部(13)を形成するのに対し、スクリーン印刷法は、0.1mm以上の幅で抵抗体(4)に開口部(5)を形成する。第1の開口部(11)及び第2の開口部(12)は、抵抗体(4)の抵抗値を所望する抵抗値よりも低くなるよう概括的に粗調整し、その後に形成される切欠部(13)の長さにより、第1の開口部(11)、第2の開口部(12)及び切欠部(13)の間に形成される抵抗体(4)の無効領域(15)の大きさを変更して、抵抗体(4)の抵抗値を高精度に微調整することができる。よって、抵抗体(4)は、例えば、ハイブリットIC(混成集積回路)の回路上の基準抵抗又は電流制限検出抵抗として使用することができる。 In the present embodiment, since the laser beam irradiation start point (25a) is formed in the first opening (11), the notch (13) is formed in a substantially straight line toward the cathode electrode (3). An end or a corner is not formed in the notch (13) on the anode electrode (2) side of the potential, and it is possible to prevent microcracks from occurring in the resistor (4) on the high potential side. Whereas the laser beam forms a notch (13) in the resistor (4) with a width of about 0.05 mm, the screen printing method has an opening (5) in the resistor (4) with a width of 0.1 mm or more. ). The first opening (11) and the second opening (12) are roughly adjusted so that the resistance value of the resistor (4) is lower than a desired resistance value, and a notch formed thereafter Depending on the length of the portion (13), the ineffective region (15) of the resistor (4) formed between the first opening (11), the second opening (12) and the notch (13) The resistance value of the resistor (4) can be finely adjusted with high accuracy by changing the size. Therefore, the resistor (4) can be used as, for example, a reference resistor or a current limit detection resistor on a hybrid IC (hybrid integrated circuit) circuit.
本発明の実施の形態は、図1〜図4に示す実施の形態に限定されず、変更が可能である。例えば、第2の開口部(12)と切欠部(13)とを平行に形成せず、カソード電極(3)に向かうに従って切欠部(13)を第2の開口部(12)に近接させてもよい。図5に示すように、切欠部(13)を傾斜させて、第2の開口部(12)に接続させてもよい。レーザ光の照射終了点(25b)が第2の開口部(12)内に形成されるため、端部のない切欠部(13)を形成することができる。また、図6に示すように、切欠部(13)をカソード電極(3)側で折曲させて、第2の開口部(12)に接続してもよい。図示しないが、カソード電極(3)に向かうに従って第2の開口部(12)と切欠部(13)とを離間させてもよい。 The embodiment of the present invention is not limited to the embodiment shown in FIGS. 1 to 4 and can be changed. For example, the second opening (12) and the notch (13) are not formed in parallel, but the notch (13) is brought closer to the second opening (12) toward the cathode electrode (3). Also good. As shown in FIG. 5, the notch (13) may be inclined and connected to the second opening (12). Since the irradiation end point (25b) of the laser beam is formed in the second opening (12), a notch (13) having no end can be formed. Further, as shown in FIG. 6, the notch (13) may be bent on the cathode electrode (3) side and connected to the second opening (12). Although not shown, the second opening (12) and the notch (13) may be separated from each other toward the cathode electrode (3).
切欠部(13)及び開口部(11,12)の数は、限定されず、適宜に変更してもよく、図7に示すように、切欠部(13)から少なくとも一部が離間して第1の開口部(11)からカソード電極(3)に向って延伸する別の切欠部(13)を第2の開口部(12)の代わりに更に形成し、第1の開口部(11)及び2本の切欠部(13)により抵抗体(4)の無効領域(15)を形成してもよい。図8は、第1の開口部(11)を抵抗体(4)の一方の端部(4b)及び側面(4d)の開放部に隣接して形成することにより、第2の開口部(12)を省略して、第1の開口部(11)、切欠部(13)及び抵抗体(4)の側面(4d)の開放部によって抵抗体(4)の無効領域(15)を形成する。前記実施の形態では、第1の開口部(11)を抵抗体(4)の端部(4b)に沿って配線導体(7)に隣接して図示するが、第1の開口部(11)を配線導体(7)から離間させて抵抗体(4)内に形成してもよい。また、第1の開口部(11)は、円形又は楕円形に限定されず、角形等の他の形状に形成してもよい。 The number of the notches (13) and the openings (11, 12) is not limited, and may be changed as appropriate. As shown in FIG. 7, at least a part of the notches (13) is spaced apart from the notches (13). Another notch (13) extending from one opening (11) toward the cathode electrode (3) is further formed instead of the second opening (12), and the first opening (11) and The ineffective region (15) of the resistor (4) may be formed by the two notches (13). FIG. 8 shows that the first opening (11) is formed adjacent to one end (4b) of the resistor (4) and the opening of the side surface (4d), thereby forming the second opening (12 ) Is omitted, and the ineffective region (15) of the resistor (4) is formed by the first opening (11), the notch (13), and the open portion of the side surface (4d) of the resistor (4). In the above embodiment, the first opening (11) is illustrated adjacent to the wiring conductor (7) along the end (4b) of the resistor (4), but the first opening (11) May be formed in the resistor (4) at a distance from the wiring conductor (7). The first opening (11) is not limited to a circle or an ellipse, and may be formed in another shape such as a square.
回路基板(10)を製造する際に、周知のフォトリソグラフィ技術により、基板(1)上に開口部(5)を有する抵抗体(4)を形成してもよい。抵抗体(4)を形成すべき領域に開口を有するフォトマスクを基板(1)上に形成し、基板(1)上に抵抗ペーストを塗布して、抵抗ペーストを燃焼することにより、抵抗体(4)を形成することができる。フォトリソグラフィ技術によれば、前述したスクリーン印刷法と同様に、周辺部の抵抗体(4)が熱変質されない開口部(5)を抵抗体(4)に形成することができる。また、配線導体(7)に隣接して抵抗体(4)に第1の開口部(11)を形成できる。更に、抵抗体(4)、配線導体(7,8)、電流パッド部(27,28)及び電圧パッド部(17,18)を同一の材質により形成してもよく、これらを同時に形成してもよい。上記実施の形態では、本発明の回路基板及びその製法をハイブリットICに適用したが、チップ抵抗器等の他の電子部品に適用してもよい。 When manufacturing the circuit board (10), the resistor (4) having the opening (5) may be formed on the substrate (1) by a known photolithography technique. A resistor (4) is formed on the substrate (1) by forming a photomask having an opening in a region where the resistor (4) is to be formed, and the resistor paste is applied to the substrate (1), and the resistor paste is burned. 4) can be formed. According to the photolithography technique, the opening (5) in which the peripheral resistor (4) is not thermally altered can be formed in the resistor (4), as in the screen printing method described above. Further, the first opening (11) can be formed in the resistor (4) adjacent to the wiring conductor (7). Further, the resistor (4), the wiring conductor (7, 8), the current pad portion (27, 28) and the voltage pad portion (17, 18) may be formed of the same material, and these may be formed simultaneously. Also good. In the above embodiment, the circuit board of the present invention and the manufacturing method thereof are applied to the hybrid IC, but may be applied to other electronic components such as a chip resistor.
本発明は、例えば、増幅器の基準電位の決定及び検出結果に応じて電流を制限する電流制限検出抵抗に良好に適用でき、特に抵抗値が数オーム以下の抵抗器に有効である。 The present invention can be successfully applied to, for example, a current limit detection resistor that limits the current according to the determination of the reference potential of the amplifier and the detection result, and is particularly effective for a resistor having a resistance value of several ohms or less.
(1)・・基板、 (2)・・アノード電極(一方の電極)、 (3)・・カソード電極(他方の電極)、 (5)・・開口部、 (4)・・抵抗体、 (4b)・・端部、 (11)・・第1の開口部、 (12)・・第2の開口部、 (13)・・切欠部、 (15)・・無効領域、 (1) ・ ・ Board, (2) ・ ・ Anode electrode (one electrode), (3) ・ ・ Cathode electrode (the other electrode), (5) ・ ・ Opening, (4) ・ Resistor, ( 4b) ・ ・ End, (11) ・ ・ First opening, (12) ・ ・ Second opening, (13) ・ ・ Notch, (15) ・ ・ Invalid area,
Claims (6)
前記電極は、前記一方の電極と、該一方の電極から離間して且つ該一方の電極より低電位の他方の電極とを有し、
前記抵抗体は、前記基板の一部を外部に露出する開口部を有し、
前記開口部は、前記一方の電極側に形成された第1の開口部と、前記第1の開口部より狭い幅を有し且つ前記第1の開口部から前記他方の電極に向って延伸する第2の開口部とを備え、
前記第1の開口部より狭い幅を有し且つ前記第2の開口部から離間して前記第1の開口部から前記他方の電極に向って延伸する切欠部を形成したことを特徴とする回路基板。 An insulating substrate, a pair of electrodes formed on the substrate, and a resistor formed on the substrate between the electrodes,
The electrode has the one electrode and the other electrode spaced apart from the one electrode and having a lower potential than the one electrode,
The resistor has an opening that exposes a part of the substrate to the outside,
The opening has a first opening formed on the one electrode side, a width narrower than the first opening, and extends from the first opening toward the other electrode. A second opening,
A circuit having a narrower width than the first opening and spaced apart from the second opening and extending from the first opening toward the other electrode. substrate.
前記一方の電極側に前記基板の一部を外部に露出する開口部を有する抵抗体を前記電極間で前記基板上に形成する工程と、
前記抵抗体にレーザ光を照射して、前記開口部内から前記他方の電極に向って前記開口部よりも幅が狭い切欠部を前記抵抗体に形成することにより、前記抵抗体の抵抗値を調整する工程とを含むことを特徴とする回路基板の製法。 Forming one electrode and the other electrode on an insulating substrate;
Forming a resistor on the substrate between the electrodes, the resistor having an opening exposing a part of the substrate to the outside on the one electrode side;
The resistance value of the resistor is adjusted by irradiating the resistor with a laser beam and forming a notch in the resistor that is narrower than the opening from the inside of the opening toward the other electrode. And a process for manufacturing the circuit board.
スクリーン印刷又はフォトリソグラフィにより前記抵抗体及び前記開口部を同時に形成する工程を含む請求項4に記載の回路基板の製法。 The step of forming the resistor includes
The method for producing a circuit board according to claim 4, comprising a step of simultaneously forming the resistor and the opening by screen printing or photolithography.
前記抵抗体に前記切欠部を形成する工程は、
前記切欠部の長さにより、前記第1の開口部、第2の開口部及び切欠部の間に形成される抵抗体の無効領域の大きさを変更して、抵抗体の抵抗値を調整する工程を含む請求項4又は5に記載の回路基板の製法。 The opening has a width wider than the notch and is formed on the one electrode side, and has a width narrower than the first opening and the first opening. And a second opening extending toward the other electrode having a lower potential than the one electrode,
The step of forming the notch in the resistor includes:
The resistance value of the resistor is adjusted by changing the size of the ineffective region of the resistor formed between the first opening, the second opening, and the notch according to the length of the notch. The method for producing a circuit board according to claim 4, comprising a step.
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