JP2007053218A - Chip resistor - Google Patents

Chip resistor Download PDF

Info

Publication number
JP2007053218A
JP2007053218A JP2005237095A JP2005237095A JP2007053218A JP 2007053218 A JP2007053218 A JP 2007053218A JP 2005237095 A JP2005237095 A JP 2005237095A JP 2005237095 A JP2005237095 A JP 2005237095A JP 2007053218 A JP2007053218 A JP 2007053218A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
terminal electrodes
chip resistor
narrowed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005237095A
Other languages
Japanese (ja)
Other versions
JP4641229B2 (en
Inventor
Torayuki Tsukada
虎之 塚田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2005237095A priority Critical patent/JP4641229B2/en
Priority to US11/990,405 priority patent/US7755467B2/en
Priority to KR1020087004020A priority patent/KR20080027951A/en
Priority to PCT/JP2006/315289 priority patent/WO2007020802A1/en
Priority to CN2006800298118A priority patent/CN101243524B/en
Priority to TW095128720A priority patent/TW200741758A/en
Publication of JP2007053218A publication Critical patent/JP2007053218A/en
Application granted granted Critical
Publication of JP4641229B2 publication Critical patent/JP4641229B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Non-Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To improve heat radiation properties when soldering and packaging a chip resistor to a printed circuit board 7, or the like in the chip resistor, where a resistant film 3 and a cover coat 4 for covering the resistant film 3 are formed on one surface of a chip-type insulating substrate 2, a pair of terminal electrodes 5, 6 to the resistant film is provided at both the ends of the insulating substrate, and both the terminal electrodes are soldered to a printed circuit board 9, or the like while the resistant film faces the side of the printed circuit board. <P>SOLUTION: Auxiliary electrodes 7, 8 are provided on the pair of terminal electrodes so that they overlap with the surface of the cover coat, and the auxiliary electrode 7 in one terminal electrode 5 in the pair of terminal electrodes is extended to a part in which width dimensions are narrowed at one portion in the longitudinal direction by providing a trimming groove 3a, or the like in the resistant film. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は，チップ型に構成した絶縁基板の片面に抵抗膜とそのカバーコートとを形成して成るチップ抵抗器のうち，プリント基板等に対して，前記抵抗膜をプリント基板側に向けて半田付け実装するように構成して成るチップ抵抗器に関するものである。   The present invention provides a chip resistor in which a resistive film and its cover coat are formed on one side of an insulating substrate configured in a chip shape, and solders the resistive film toward the printed circuit board with respect to a printed circuit board. The present invention relates to a chip resistor configured to be mounted.

従来，このように，抵抗膜をプリント基板側に向けて半田付け実装するように構成したチップ抵抗器は，例えば，特許文献１等に記載されているように，チップ型にした絶縁基板における片面に，抵抗膜を両端の方向に延びるように形成するとともに，この抵抗膜を被覆するカバーコートを形成する一方，前記絶縁基板の両端に，前記抵抗膜の両端に対する一対の端子電極を，当該端子電極における一部が前記カバーコートにおける表面よりも突出するように形成し，この両端子電極をプリント基板等に対して，前記抵抗膜をプリント基板側に向けた状態で半田付けするように構成している。
特開２００４−２５９８６３号公報 Conventionally, a chip resistor configured such that a resistive film is soldered and mounted toward the printed circuit board side as described above is disclosed in, for example, a single-sided chip-shaped insulating substrate as described in Patent Document 1 and the like. In addition, the resistance film is formed so as to extend in the direction of both ends, and a cover coat for covering the resistance film is formed, while a pair of terminal electrodes for both ends of the resistance film are provided on both ends of the insulating substrate. A part of the electrode is formed so as to protrude from the surface of the cover coat, and both terminal electrodes are soldered to a printed circuit board or the like with the resistance film facing the printed circuit board side. ing.
JP 2004-259863 A

そして，前記した構成による従来のチップ抵抗器を，プリント基板等に対して，その抵抗膜をプリント基板側に向けて半田付け実装したときにおいて，前記抵抗膜を被覆するカバをコートと前記プリント基板との間に隙間が形成される。   When a conventional chip resistor having the above-described configuration is soldered and mounted on a printed circuit board or the like with the resistance film facing the printed circuit board side, a cover covering the resistance film is coated with the printed circuit board. A gap is formed between the two.

ところで，チップ抵抗器においては，従来から良く知られていように，その抵抗膜のうち長さ方向の一部に，幅寸法を狭くするようにした切り込み部又はトリミング溝を設けることによって，その抵抗値が所定の許容範囲内に入るように構成しており，この抵抗膜の通電時における発熱は，当該抵抗膜のうち幅寸法を狭くした部分において主として発生するものである。   By the way, as is well known in the art, a chip resistor is provided with a notch or trimming groove whose width is narrowed in a part of its length in the length direction. The value is configured to fall within a predetermined allowable range, and the heat generation when the resistance film is energized mainly occurs in a portion of the resistance film having a narrow width dimension.

従って，前記従来のチップ抵抗器のように，プリント基板に対して半田付け実装したときに，カバーコートのプリント基板との間に隙間が形成されるという構成である場合には，前記抵抗膜のうち幅寸法を狭くした部分において主として発生した熱のプリント基板等への放熱性が低くて，前記抵抗膜の温度が高くなるという問題があった。   Accordingly, when the gap is formed between the cover coat and the printed circuit board when soldered to the printed circuit board as in the conventional chip resistor, the resistance film Among them, there is a problem that heat generated mainly in a portion having a narrow width dimension is low in heat dissipation to a printed circuit board or the like, and the temperature of the resistance film is increased.

本発明は，この問題を解消した放熱性の高いチップ抵抗器を提供することを技術的課題とするものである。   It is a technical object of the present invention to provide a chip resistor with high heat dissipation that solves this problem.

この技術的課題を達成するため本発明の請求項１は，
「チップ型に構成した絶縁基板の片面に，抵抗膜とこれを被覆するカバーコートを形成する一方，前記絶縁基板の両端に，前記抵抗膜に対する一対の端子電極を設けて，この両端子電極をプリント基板等に対して，前記抵抗膜をプリント基板側に向けた状態で半田付けするように構成して成るチップ抵抗器において，
前記一対の端子電極に，前記カバーコートの表面に重なるようにした補助電極を設け，前記一対の端子電極のうち一方の端子電極における補助電極を，前記抵抗膜のうち長さ方向の一部において幅寸法を狭くした部分まで延長する。」
ことを特徴としている。 In order to achieve this technical problem, claim 1 of the present invention provides:
“A resistance film and a cover coat covering the resistance film are formed on one side of an insulating substrate configured in a chip shape, and a pair of terminal electrodes for the resistance film are provided on both ends of the insulating substrate. In a chip resistor configured to be soldered to a printed circuit board or the like with the resistance film facing the printed circuit board side,
An auxiliary electrode is provided on the pair of terminal electrodes so as to overlap the surface of the cover coat, and the auxiliary electrode on one terminal electrode of the pair of terminal electrodes is disposed on a part of the resistance film in the length direction. Extend to the narrowed width. "
It is characterized by that.

また，本発明の請求項２は，
「前記請求項１の記載において，前記抵抗膜における幅寸法を狭くした部分を，当該抵抗膜における長さ方向の二カ所に設ける一方，前記一対の端子電極のうち一方の端子電極ににおける補助電極を，前記二つの幅寸法を狭くした部分のうち一方の部分まで延長し，他方の端子電極における補助電極を，前記二つの幅寸法を狭くした部分のうち他方の部分まで延長する。」
ことを特徴としている。
更にまた、本発明の請求項３は，
「前記請求項１又は２の記載において，前記抵抗膜の幅寸法を狭くした部分を，前記端子電極に近づけた部位に設ける。」
ことを特徴としている。 Further, claim 2 of the present invention is
“In the first aspect of the present invention, the width of the resistive film is narrowed at two locations in the length direction of the resistive film, while the auxiliary electrode on one of the pair of terminal electrodes is provided. Is extended to one of the two narrowed portions, and the auxiliary electrode on the other terminal electrode is extended to the other of the two narrowed portions. "
It is characterized by that.
Furthermore, claim 3 of the present invention provides
“In the first or second aspect of the present invention, a portion in which the width of the resistive film is narrowed is provided in a portion close to the terminal electrode.”
It is characterized by that.

前記したように，一対の端子電極に，前記カバーコートの表面に重なるようにした補助電極を設け，前記一対の端子電極のうち一方の端子電極における補助電極を，前記抵抗膜のうち長さ方向の一部において幅寸法を狭くした部分まで延長することにより，抵抗膜をプリント基板側に向けて半田付け実装した状態において，前記両端子電極における補助電極がプリント基板に対して接触又は近接して，前記抵抗膜のうち幅寸法を狭くした部分において発生した熱は，前記一方の端子電極における補助電極のうち前記幅寸法を狭くした部分にまで延長した部分を介して速やかにプリント基板側に熱伝達することになるから，前記抵抗膜のうち幅寸法を狭くした部分において主として発生した熱のプリント基板への放熱性を，前記従来の場合に比べて，大幅に向上できて，前記抵抗膜を低い温度に維持できる。   As described above, an auxiliary electrode is provided on the pair of terminal electrodes so as to overlap the surface of the cover coat, and the auxiliary electrode in one terminal electrode of the pair of terminal electrodes is arranged in the length direction of the resistance film. In the state where the resistive film is soldered and mounted toward the printed circuit board side, the auxiliary electrode in both terminal electrodes is in contact with or close to the printed circuit board. The heat generated in the narrowed portion of the resistance film is quickly transferred to the printed circuit board through the portion of the auxiliary electrode of the one terminal electrode that extends to the narrowed portion. Therefore, the heat dissipation of the heat generated mainly in the narrowed portion of the resistive film to the printed circuit board is compared with the conventional case. Te, and it can be greatly improved, and maintain the resistance film to a low temperature.

この場合において，請求項２に記載した構成にすることにより，抵抗膜における発熱を二カ所の幅寸法を狭くした部分に分散できるとともに，この熱を，絶縁基板を挟んでその真下に位置する下面電極を介して素早くプリント基板等に放熱することができるから，前記抵抗膜における温度をより低くすることができる。   In this case, with the configuration described in claim 2, the heat generation in the resistance film can be distributed to the portions where the width dimensions of the two portions are narrowed, and the heat is transferred to the bottom surface located directly below the insulating substrate. Since heat can be quickly radiated to the printed circuit board or the like via the electrodes, the temperature in the resistance film can be further lowered.

また，請求項３に記載した構成にすることにより，補助電極における抵抗膜の長さ方向への長さ寸法を，抵抗膜における幅寸法を狭くした部分を端子電極に近づけた分だけ短くすることができるから，軽量化と，低価格化とを達成できる。   According to the configuration described in claim 3, the length of the auxiliary electrode in the length direction of the resistive film is shortened by an amount corresponding to the portion where the width dimension of the resistive film is narrowed closer to the terminal electrode. Therefore, weight reduction and price reduction can be achieved.

以下，本発明の実施の形態を図面ついて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１及び図２は，第１の実施の形態によるチップ抵抗器１を示す。   1 and 2 show a chip resistor 1 according to a first embodiment.

このチップ抵抗器１は，チップ型に構成した絶縁基板２の下面に，少なくとも一つの抵抗膜３を両端の方向に延びるように形成するとともに，この抵抗膜３を被覆するガラス等によるカバーコート４を形成する一方，前記絶縁基板２の両端に，前記抵抗膜３の両端に対する一対の端子電極５，６を設け，この端子電極５，６を，絶縁基板２の下面に抵抗膜３に導通するように形成した上面電極５ａ，６ａと，絶縁基板２の左右両端面２ａ，２ｂに形成した側面電極５ｂ，６ｂとで構成して成る構造である。   The chip resistor 1 includes at least one resistance film 3 formed on the lower surface of an insulating substrate 2 configured in a chip shape so as to extend in both directions, and a cover coat 4 made of glass or the like covering the resistance film 3. On the other hand, a pair of terminal electrodes 5 and 6 for both ends of the resistance film 3 are provided at both ends of the insulating substrate 2, and the terminal electrodes 5 and 6 are electrically connected to the resistance film 3 on the lower surface of the insulating substrate 2. The upper surface electrodes 5a and 6a formed as described above and the side electrodes 5b and 6b formed on the left and right end surfaces 2a and 2b of the insulating substrate 2 are configured.

前記抵抗膜３には，その長さ方向の一部に幅寸法を狭くするようにしたトリミング溝３ａを当該抵抗膜３を形成した後において刻設するか，或いは，幅寸法を狭くするようにした切り込み溝を当該抵抗膜３をスクリーン印刷にて形成するとき同時に設けることによって，その抵抗値が所定の許容範囲内に入るように構成されている。   The resistance film 3 is engraved with a trimming groove 3a whose width is narrowed in a part of the length direction after the resistance film 3 is formed, or so that the width is narrowed. By providing the cut groove at the same time when the resistance film 3 is formed by screen printing, the resistance value falls within a predetermined allowable range.

前記両端子電極５，６には，補助電極７，８を，前記上面電極５ａ，６ａ及び前記カバーコート４の表面に重なるように設けて，前記チップ抵抗器１を，プリント基板９に対して，その抵抗膜３をプリント基板９側に向けて半田付け実装したとき，前記両補助電極７，８のうち少なくとも前記カバーコート４の表面に重なる部分が，プリント基板９における電極パッド９ａ，９ｂに接触するか近接するように構成する。   Auxiliary electrodes 7 and 8 are provided on both terminal electrodes 5 and 6 so as to overlap the surfaces of the upper surface electrodes 5a and 6a and the cover coat 4, and the chip resistor 1 is connected to the printed circuit board 9. When the resistance film 3 is soldered and mounted toward the printed circuit board 9 side, at least portions of the auxiliary electrodes 7 and 8 that overlap the surface of the cover coat 4 are formed on the electrode pads 9a and 9b on the printed circuit board 9. Configure to touch or close.

そして，前記端子電極５，６のうち一方の端子電極５における補助電極７を，前記抵抗膜３のうちトリミング溝３ａ等を設けることによって幅寸法を狭くした部分にまで延長するように，その抵抗膜３の長さ方向への長さ寸法Ｌを長くするという構成にした。   Then, the resistance of the auxiliary electrode 7 in one of the terminal electrodes 5 and 6 is extended so that the width of the auxiliary electrode 7 is reduced by providing the trimming groove 3a or the like in the resistance film 3. The length L in the length direction of the film 3 is increased.

なお，前記両端子電極５，６の表面，及び，これらに設けた補助電極の表面には，図示していないが，半田付けを容易にするための半田等の金属メッキ層を形成している。   Although not shown, a metal plating layer such as solder for facilitating soldering is formed on the surfaces of the terminal electrodes 5 and 6 and the surface of the auxiliary electrode provided thereon. .

この構成にしたチップ抵抗器１は，図２に示すように，その抵抗膜３を下向きにした状態にして，両端における端子電極５，６においてプリント基板９における電極パッド９ａ，９ｂに対して半田付けすることにより，プリント基板９に実装される。   As shown in FIG. 2, the chip resistor 1 having this configuration is soldered to the electrode pads 9a and 9b on the printed circuit board 9 at the terminal electrodes 5 and 6 at both ends with the resistance film 3 facing downward. By attaching, it is mounted on the printed circuit board 9.

この半田付け実装した状態で，前記両端子電極のうち少なくとも前記カバーコート４の表面に重なる部分がプリント基板９に対して接触又は近接することにより，前記抵抗膜３のうちトリミング溝３ａを設けることによって幅寸法を狭くした部分において発生した熱は，前記一方の端子電極５における補助電極７のうち前記幅寸法を狭くした部分にまで延長した部分を介して速やかにプリント基板９側に熱伝達することになるから，前記抵抗膜３のうち幅寸法を狭くした部分において主として発生した熱のプリント基板９への放熱性を，前記従来の場合に比べて，大幅に向上できる。   In this soldered and mounted state, a trimming groove 3a of the resistance film 3 is provided by bringing at least a portion of the two terminal electrodes overlapping or contacting the surface of the cover coat 4 with respect to the printed circuit board 9. The heat generated in the portion whose width dimension is narrowed by the heat is quickly transferred to the printed circuit board 9 side through the portion of the auxiliary electrode 7 in the one terminal electrode 5 that extends to the portion whose width dimension is narrowed. As a result, the heat dissipation to the printed circuit board 9 of the heat generated mainly in the portion of the resistance film 3 having a narrow width can be greatly improved as compared with the conventional case.

なお，前記プリント基板９における両電極パッド９ａ，９ｂのうち，前記両端子電極５，６のうち一方の端子電極５における補助電極７に対する電極パッド９ａにおける大きさを，図２に示すように，前記補助電極７の全体が接触するように広い面積に構成することにより，プリント基板９への放熱性をより向上できる。   As shown in FIG. 2, the size of the electrode pad 9a with respect to the auxiliary electrode 7 in one terminal electrode 5 of the both terminal electrodes 5 and 6 among the electrode pads 9a and 9b on the printed circuit board 9 is as shown in FIG. By configuring the auxiliary electrode 7 to have a large area so that the whole of the auxiliary electrode 7 is in contact, the heat dissipation to the printed circuit board 9 can be further improved.

次に，図３は，第２の実施の形態によるチップ抵抗器１′を示す。   Next, FIG. 3 shows a chip resistor 1 'according to the second embodiment.

このチップ抵抗器１′は，前記抵抗膜３のうちトリミング溝３ａ等を設けることによって幅寸法を狭くした部分を，両端子電極５，６のうち一方の端子電極５に近づけた部位に設ける一方，一対の端子電極５，６のうち一方の端子電極５における補助電極７を，前記前記抵抗膜３のうちトリミング溝３ａ等を設けることによって幅寸法を狭くした部分にまで延長するという構成にしたものであり，その他の構成は，前記第１の実施の形態と同様である。   In this chip resistor 1 ′, a portion of the resistance film 3 whose width is narrowed by providing a trimming groove 3 a or the like is provided at a portion close to one of the terminal electrodes 5 and 6. The auxiliary electrode 7 in one terminal electrode 5 of the pair of terminal electrodes 5 and 6 is configured to extend to a portion having a reduced width by providing the trimming groove 3a and the like in the resistance film 3. The other configurations are the same as those of the first embodiment.

この第２の実施の形態によると，前記一方の端子電極５の補助電極７における抵抗膜３の長さ方向の長さ寸法を，前記第１の実施の形態におけるＬからＬ１に，抵抗膜３における幅寸法を狭くした部分を一方の端子電極５に近づけた分だけ短くすることができるから，材料を節減できて，軽量化と低価格化とを達成できる。   According to the second embodiment, the length dimension in the length direction of the resistive film 3 in the auxiliary electrode 7 of the one terminal electrode 5 is changed from L to L1 in the first embodiment. Since the portion whose width is narrowed can be shortened by the amount close to the one terminal electrode 5, the material can be saved, and weight reduction and cost reduction can be achieved.

そして，図４は，第３の実施の形態によるチップ抵抗器１″を示す。   FIG. 4 shows a chip resistor 1 ″ according to the third embodiment.

この第３の実施の形態によるチップ抵抗器１″は，前記抵抗膜３のうちトリミング溝３ａ等を設けることによって幅寸法を狭くした部分を，抵抗膜３における長さ方向の二カ所に設ける一方，一対の端子電極４，５のうち一方の端子電極５における補助電極７を，前記二カ所の幅寸法を狭くした部分のうち一方の部位にまで延長し，他方の端子電極６における補助電極８を，前記二カ所の幅寸法を狭くした部分のうち他方の部位にまで延長するという構成にしたものであり，その他の構成は，前記第１の実施の形態と同様である。   In the chip resistor 1 ″ according to the third embodiment, the resistance film 3 is provided with two portions in the length direction of the resistance film 3 which are narrowed by providing the trimming groove 3a and the like. , The auxiliary electrode 7 in one terminal electrode 5 of the pair of terminal electrodes 4, 5 is extended to one part of the two narrowed portions and the auxiliary electrode 8 in the other terminal electrode 6. Is extended to the other part of the portions where the width dimension of the two places is narrowed, and the other configuration is the same as that of the first embodiment.

この第３の実施の形態によると，抵抗膜２における発熱を二カ所の幅寸法を狭くした部分に分散できるとともに，この熱を，カバーコート４を挟んでプリント基板９との間に位置する両補助電極７，８によって素早くプリント基板９に放熱することができるから，前記抵抗膜３における温度をより低くすることができる。   According to the third embodiment, the heat generated in the resistance film 2 can be distributed to the portions where the width dimensions of the two places are narrowed, and this heat is distributed between the printed circuit board 9 and the cover coat 4. Since heat can be quickly radiated to the printed circuit board 9 by the auxiliary electrodes 7 and 8, the temperature of the resistance film 3 can be further lowered.

なお，この第３の実施の形態においても，前記第２の実施の形態のように，抵抗膜のうちトリミング溝等を設けることによって幅寸法を狭くした部分を，両端子電極に近づけた部位に設けることを適用できることはいうまでもない。   In the third embodiment as well, as in the second embodiment, the portion of the resistive film whose width is narrowed by providing a trimming groove or the like is placed close to both terminal electrodes. It goes without saying that the provision can be applied.

前記各実施の形態は，一つの絶縁基板に一つの抵抗膜と，その両端に対する一対の端子電極とを設けて成るチップ抵抗器であったが，本発明は，これに限らず，一つの絶縁基板に複数個の抵抗膜と，この各抵抗膜の両端に対する一対の端子電極とを形成して成る多連のチップ抵抗器に対しても同様に適用することができる。   Each of the above embodiments is a chip resistor in which one insulating film is provided with one resistive film and a pair of terminal electrodes at both ends thereof. However, the present invention is not limited to this, and one insulating film is provided. The present invention can be similarly applied to a multiple chip resistor formed by forming a plurality of resistive films on a substrate and a pair of terminal electrodes at both ends of each resistive film.

第１の実施の形態によるチップ抵抗器を示す縦断正面図である。It is a vertical front view which shows the chip resistor by 1st Embodiment. 図１の一部切欠底面図である。It is a partially cutaway bottom view of FIG. 第２の実施の形態によるチップ抵抗器を示す縦断正面図である。It is a vertical front view which shows the chip resistor by 2nd Embodiment. 第３の実施の形態によるチップ抵抗器を示す縦断正面図である。It is a vertical front view which shows the chip resistor by 3rd Embodiment. 図４の一部切欠底面図である。FIG. 5 is a partially cutaway bottom view of FIG. 4.

符号の説明Explanation of symbols

１，１′，１″ チップ抵抗器
２ 絶縁基板
３ 抵抗膜
３ａ トリミング溝
４ カバーコート
５，６ 端子電極
５ａ，６ａ 上面電極
５ｂ，６ｂ 側面電極
７，８ 補助電極
９ プリント基板
９ａ，９ｂ 電極パッド 1,1 ′, 1 ″ Chip resistor 2 Insulating substrate 3 Resistive film 3a Trimming groove 4 Cover coat 5,6 Terminal electrode 5a, 6a Upper surface electrode 5b, 6b Side surface electrode 7, 8 Auxiliary electrode 9 Printed circuit board 9a, 9b Electrode pad

Claims (3)

チップ型に構成した絶縁基板の片面に，抵抗膜とこれを被覆するカバーコートを形成する一方，前記絶縁基板の両端に，前記抵抗膜に対する一対の端子電極を設けて，この両端子電極をプリント基板等に対して，前記抵抗膜をプリント基板側に向けた状態で半田付けするように構成して成るチップ抵抗器において，
前記一対の端子電極に，前記カバーコートの表面に重なるようにした補助電極を設け，前記一対の端子電極のうち一方の端子電極における補助電極を，前記抵抗膜のうち長さ方向の一部において幅寸法を狭くした部分まで延長することを特徴とするチップ抵抗器。 A resistive film and a cover coat covering the resistive film are formed on one side of a chip-shaped insulating substrate, and a pair of terminal electrodes for the resistive film are provided on both ends of the insulating substrate, and both terminal electrodes are printed. In a chip resistor configured to be soldered to a printed circuit board side with respect to a substrate or the like,
An auxiliary electrode is provided on the pair of terminal electrodes so as to overlap the surface of the cover coat, and the auxiliary electrode on one terminal electrode of the pair of terminal electrodes is disposed on a part of the resistance film in the length direction. A chip resistor characterized by extending to a narrowed width dimension. 前記請求項１の記載において，前記抵抗膜における幅寸法を狭くした部分を，当該抵抗膜における長さ方向の二カ所に設ける一方，前記一対の端子電極のうち一方の端子電極ににおける補助電極を，前記二つの幅寸法を狭くした部分のうち一方の部分まで延長し，他方の端子電極における補助電極を，前記二つの幅寸法を狭くした部分のうち他方の部分まで延長することを特徴とするチップ抵抗器。   In the first aspect of the present invention, the width of the resistive film is narrowed at two locations in the length direction of the resistive film, and the auxiliary electrode is provided on one of the pair of terminal electrodes. , Extending to one of the two narrowed portions, and extending the auxiliary electrode on the other terminal electrode to the other of the two narrowed portions Chip resistor. 前記請求項１又は２の記載において，前記抵抗膜の幅寸法を狭くした部分を，前記端子電極に近づけた部位に設けることを特徴とするチップ抵抗器。   3. The chip resistor according to claim 1, wherein a portion where the width of the resistive film is narrowed is provided in a portion close to the terminal electrode.
JP2005237095A 2005-08-18 2005-08-18 Chip resistor Active JP4641229B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005237095A JP4641229B2 (en) 2005-08-18 2005-08-18 Chip resistor
US11/990,405 US7755467B2 (en) 2005-08-18 2006-08-02 Chip resistor
KR1020087004020A KR20080027951A (en) 2005-08-18 2006-08-02 Chip resistor
PCT/JP2006/315289 WO2007020802A1 (en) 2005-08-18 2006-08-02 Chip resistor
CN2006800298118A CN101243524B (en) 2005-08-18 2006-08-02 Chip resistor
TW095128720A TW200741758A (en) 2005-08-18 2006-08-04 Chip resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005237095A JP4641229B2 (en) 2005-08-18 2005-08-18 Chip resistor

Publications (2)

Publication Number Publication Date
JP2007053218A true JP2007053218A (en) 2007-03-01
JP4641229B2 JP4641229B2 (en) 2011-03-02

Family

ID=37917465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005237095A Active JP4641229B2 (en) 2005-08-18 2005-08-18 Chip resistor

Country Status (2)

Country Link
JP (1) JP4641229B2 (en)
CN (1) CN101243524B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU175488U1 (en) * 2017-04-06 2017-12-06 Акционерное общество "Финансово-промышленная компания "Энергия" Resistor

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503849B (en) 2009-09-08 2015-10-11 Cyntec Co Ltd Micro resistor
CN102024538B (en) * 2009-09-11 2013-02-13 乾坤科技股份有限公司 Microresistor assembly
JP5787362B2 (en) * 2012-02-02 2015-09-30 アルプス電気株式会社 Resistive substrate and manufacturing method thereof
US8823483B2 (en) * 2012-12-21 2014-09-02 Vishay Dale Electronics, Inc. Power resistor with integrated heat spreader
JP6398749B2 (en) * 2015-01-28 2018-10-03 三菱マテリアル株式会社 Resistor and manufacturing method of resistor
KR101792366B1 (en) * 2015-12-18 2017-11-01 삼성전기주식회사 Resistor element and board having the same mounted thereon
US9953749B2 (en) * 2016-08-30 2018-04-24 Samsung Electro-Mechanics Co., Ltd. Resistor element and resistor element assembly
WO2018061961A1 (en) * 2016-09-27 2018-04-05 パナソニックＩｐマネジメント株式会社 Chip resistor
JP7085378B2 (en) * 2018-03-23 2022-06-16 Koa株式会社 Chip resistor
WO2022133674A1 (en) * 2020-12-21 2022-06-30 深圳顺络电子股份有限公司 Load sheet and preparation method therefor
CN113284687B (en) * 2021-04-25 2022-07-26 广东风华高新科技股份有限公司 Chip resistor and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57201801U (en) * 1981-06-19 1982-12-22
JP2003282301A (en) * 2002-03-26 2003-10-03 Koa Corp Chip resistor and its manufacturing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57201801U (en) * 1981-06-19 1982-12-22
JP2003282301A (en) * 2002-03-26 2003-10-03 Koa Corp Chip resistor and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU175488U1 (en) * 2017-04-06 2017-12-06 Акционерное общество "Финансово-промышленная компания "Энергия" Resistor

Also Published As

Publication number Publication date
CN101243524B (en) 2011-07-27
JP4641229B2 (en) 2011-03-02
CN101243524A (en) 2008-08-13

Similar Documents

Publication Publication Date Title
JP4641229B2 (en) Chip resistor
JP4358664B2 (en) Chip resistor and manufacturing method thereof
JP6302877B2 (en) Metal strip resistor and manufacturing method thereof
US7089652B2 (en) Method of manufacturing flip chip resistor
WO2019087725A1 (en) Chip resistor
US11187724B2 (en) Current measuring device and current sensing resistor
KR20060002939A (en) Chip resistor and method for manufacturing same
JP2007073693A (en) Chip resistor and method of manufacturing same
JP6408758B2 (en) Jumper element
US7755467B2 (en) Chip resistor
EP1950771A1 (en) Chip resistor and its manufacturing method
JP4814553B2 (en) Current detection resistor
JP7013517B2 (en) Chip type fuse with metal wire type fuse element and its manufacturing method
JP2004311939A (en) Thermistor with symmetrical structure
JP4203499B2 (en) Chip resistor and manufacturing method of chip resistor
JP2006310277A (en) Chip type fuse
JP2006318896A (en) Chip type fuse
KR101075664B1 (en) Chip resister and method of manufacturing the same
JP5096672B2 (en) Chip resistor and manufacturing method thereof
JP5908508B2 (en) Printed board
JP4707500B2 (en) Chip resistor
JP2002280687A (en) Metal substrate
JP4685660B2 (en) Wiring structure of semiconductor parts
KR101771822B1 (en) Chip resistor and chip resistor assembly
JP4812390B2 (en) Chip resistor and manufacturing method thereof

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080522

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20101124

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20101126

R150 Certificate of patent or registration of utility model

Ref document number: 4641229

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131210

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250