JP2008046070A - Object detection system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an object detection system capable of inhibiting production cost from increasing, low in price, little in affection from installation position and easy in execution of detection part. <P>SOLUTION: On one side of the film base material 1, a conductor layer 2 is formed and on the other side of the same the holding part 5 is joined and on the other side of holding part 5 to the film base material 1, the electrode for coupling 4 is fixed. This electrode for coupling 4 is connected to the detection circuit by the conductor 6, the electrode for coupling 4 and the conductor layer 2 are acting as a capacitor of the parallel flat plate capacitor type. In the detection circuit, the variation of static capacitance between the reference electrode (frame 7 etc.) and the detection electrode (conductive layer 2) is manually detected using the AC signal. Consequently, the whole conductive layer 2 can be simply made to act as detection electrode of the detection circuit part without directly attaching lead conductor to the conductor layer 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an object detection system that detects that various objects have approached, and more particularly to a structure of a capacitance sensor that detects the presence of an object or human body that approaches or contacts a substrate having a conductive layer.

  Conventionally, as a technique for detecting the capacitance of a window glass, for example, a capacitance sensor that forms a transparent electrode directly on the window glass and detects rain or condensation has been known. Furthermore, a glass sensor having a detection circuit for detecting a change in capacitance between the conductive film and a grounded window frame has been proposed (see, for example, Patent Document 1).

On the other hand, for recent crime prevention, multilayer laminates and multilayer extruded films have been used. The background may be a significant increase in intrusion from windows. According to the “Crime Situation in the First Half of 2005” announced by the National Police Agency, the ratio of “Glass Break” is the highest in terms of crimes for burglary and this trend has continued for several years.
WO01 / 004857

By the way, the above-mentioned conventional method is very well considered as a capacitance glass sensor, and since the counter electrode of the conductive film serving as the detection electrode is determined to be a grounded glass window frame, the detection stability is improved. However, in terms of the structure on the side of the conductive film serving as the detection electrode, it is necessary to electrically draw it from the conductive portion on the film to the detection circuit with an electric wire or the like.
Therefore, it is necessary to separately form an electrode part for extracting an electric signal on the film base material, and a process for forming an electrode part for connecting an electric signal is necessary in addition to the process for forming the conductive film in the production of the conductive film. It leads to cost increase. In addition, since there are lead wires for electrical signals, there are many factors that cause connection failures such as strength at the connection points on the film, fixing methods, routing methods, etc. The connection point may be damaged due to the careless operation.

  Therefore, the present invention can realize a touch sensor that suppresses an increase in manufacturing cost, is inexpensive, has little influence on the installation location, and is easy to construct the detection unit, and a film sensor that is bonded to easily installable glass. An object of the present invention is to provide an object detection system capable of realizing a film sensor having a high crime prevention property corresponding to “glass breaking” which is a high percentage of crimes of burglary and theft.

In order to achieve the above object, an object detection system according to the present invention includes a conductive layer functioning as a detection electrode disposed on one surface of a substrate, a reference electrode disposed around the conductive layer, and the reference electrode. A detection circuit unit that detects that an external object has approached the conductive layer by detecting a change in capacitance between the substrate and the conductive layer; and a coupling electrode unit disposed on the other surface of the substrate; And a coupling means for coupling a signal for detection in an alternating manner using another electrostatic capacitance generated between the conductive layer and the coupling electrode section.
In the object detection system of the present invention, a conductive frame functioning as the reference electrode is disposed around the substrate, and the detection circuit unit and the frame are electrically coupled by an AC signal. As a means, another coupling electrode part is provided and coupled via a capacitance.

In the object detection system of the present invention, a first conductive layer formed in a frame shape is disposed around the substrate, and a second conductive layer is disposed in an insulated state inside the first conductive layer. As a means for coupling the detection circuit unit and the first and second conductive layers, a coupling electrode unit formed on the other surface of the substrate and connected to the detection circuit unit is provided, The second conductive layer is coupled to the second conductive layer via a capacitance.
In the object detection system of the present invention, the first conductive layer and the second conductive layer formed in a comb shape on the substrate are provided in an insulated state, and the comb teeth of the first conductive layer are provided. The second conductive layer is disposed in a state where the comb teeth of the second conductive layer are inserted between the detection circuit portion and the first and second conductive layers, and is formed on the other surface of the substrate. And a coupling electrode unit connected to the detection circuit unit, and coupled to the first and second conductive layers via capacitances, respectively.

According to the object detection system of the present invention, a conductive layer functioning as a detection electrode unit, a reference electrode disposed around the conductive layer, and a change in capacitance between the reference electrode and the conductive layer are detected. Due to this, the detection circuit unit for detecting that an external object has approached the conductive layer, the coupling electrode unit disposed on the other surface of the substrate, and another generated between the conductive layer and the coupling electrode unit Since it has coupling means that couples signals for detection in an AC manner using electrostatic capacity, it is directly drawn out from the conductive part on the substrate to the detection circuit by electric wires or the like as in the prior art. There is no need to provide the electrode portion.
Therefore, in the manufacturing process of the glass or film substrate having the conductive layer, only the coating process of the conductive layer is required, the electrode part forming operation is unnecessary, the entire process is simplified, and the cost is lower than that of the prior art. Can be manufactured. In addition, since the electrical signal line from the detection circuit section is not directly connected to the conductive layer of the substrate via the electrode section, there is no disconnection or breakage in the connection electrode section due to construction mistakes or maintenance problems. The reliability of the entire object detection system is greatly improved.

  Also, for example, a film base material having a conductive layer can be attached to a holding part such as glass to form a substrate, and an electrode part can be attached to the surface opposite to the glass film base material. However, since the electric signal line from the detection circuit section is not directly connected to the conductive layer of the substrate via the electrode section, there is no disconnection or breakage in the connection electrode section due to construction errors or maintenance troubles. The reliability of the entire object detection system is greatly improved.

  For example, when a film base material having a conductive layer is attached to a holding portion such as glass and the surrounding conductive frame supporting the holding portion is configured as a reference electrode in the detection circuit portion, in the present invention, the conventional technique Unlike the method in which the detection circuit unit and the frame body are directly electrically connected as described above, the AC indirect coupling method simplifies the construction and disconnects the frame body and the detection circuit unit during construction or maintenance. / Eliminates damage and improves reliability.

  Further, in a substrate having a conductive layer, two conductive portions (reference electrodes) are provided to detect a change in capacitance generated between the conductive portions, and a substrate in a part of each conductive portion. By adopting a method in which the detection circuit unit is indirectly connected indirectly with the detection circuit unit on the opposite surface, a conductive frame for the surrounding reference electrode is not required, and a sensing function can be provided only on the substrate surface. Operation is possible even if the body is made of resin. In addition, since the detection circuit portion only needs to be attached to the substrate surface or the holding portion, the construction can be simplified.

  And by setting it as the structure which improved transparency, such as a board | substrate, a conductive layer, and also the electrode part for a coupling | bonding, the internal visibility after construction is not deteriorated. Therefore, in the crime prevention film field corresponding to the “glass breaking” crime that breaks the glass and intrudes into the building by pasting it on the window for ordinary houses, it is conventional by using the conductive film according to the present invention. It is possible to have an alarm function in addition to the entry prevention function. In addition, the detection circuit unit can be configured to be affixed on the substrate or the holding unit, and the construction can be greatly simplified. Furthermore, it can also have a high prevention function against glass scattering that occurs during an earthquake disaster.

In addition, since the conductive layer contains a substance having a carrier density of 2 × 10 ²¹ cm ⁻³ or more, light having a wavelength of about 800 nm or more, which is near infrared light, is caused by plasma resonance vibrations, and free electrons (carriers) inside the substance. ) And is reflected, it is possible to provide a heat ray shielding function.

  In addition, low-e glass, which has been popular in recent years, includes a conductive layer in order to provide a heat ray shielding function. If this conductive layer is not at the same potential as the reference potential (if it is a floating potential), it is possible to provide a sensing function by simply attaching the detection circuit portion to the glass surface without forming a conductive layer again. .

  Also, by using the conductive film according to the present invention, it functions as a touch sensor that detects when touched and attached to an exhibition shelf or a showcase with a transparent window in addition to a security film for residential windows. It can also be used as a switch function to start a variety of controls by detecting the contact of a human hand by providing guidance such as announcements, crime prevention such as warnings, or being incorporated in a part of the wallpaper of a house.

Embodiments of an object detection system according to the present invention will be described below with reference to the drawings.
FIG. 1 is a sectional view showing a basic configuration of an object detection system according to an embodiment of the present invention.
In the figure, a conductive layer 2 is formed on one surface of a film substrate 1 by utilizing a film forming technique such as a dry coating method or a wet coating method. Although not essential, in the illustrated example, a protective layer 3 is applied to the surface of the conductive layer 2 for the purpose of protecting the conductive layer 2.
The holding part 5 is bonded to the other side of the film substrate 1 via an adhesive layer (not shown). The holding unit 5 is a glass plate or the like, and the substrate 11 is constituted by the film base 1 and the holding unit 5.
And the electrode part 4 for a coupling | bonding is attached to the surface opposite to the film base material 1 of this holding | maintenance part 5 via the adhesive agent which is not shown in figure. The coupling electrode portion 4 is connected to a detection circuit portion (not shown in FIG. 1) by an electric wire 6, and the conductive layer 2 functions as a detection electrode when viewed from the detection circuit portion.

  Here, there is a holding part 5 between the coupling electrode part 4 and the conductive layer 2, and it operates as a parallel plate type capacitor composed of the coupling electrode part 4 and the conductive layer 2 using the holding part 5 as a dielectric. To do. In the detection circuit unit, an AC signal is used as an electric signal for detecting a change in capacitance between a reference electrode (to be described later) and the detection electrode (conductive layer 2). Therefore, the AC signal applied from the detection circuit unit to the coupling electrode unit 4 via the electric wire 6 is coupled to the conductive layer 2 via the capacitor composed of the coupling electrode unit 4 and the conductive layer 2, and the conductive layer 2 as a whole operates as a detection electrode for the reference electrode. In this way, the entire conductive layer 2 can be easily operated as the detection electrode of the detection circuit unit without attaching an electrical signal lead line directly from the conductive layer 2 as in the prior art.

FIG. 2 is a schematic view of a film substrate having a conductive layer in this example applied to a window glass and applied to a sensor for detecting contact or approach of a person or the like.
The film substrate 1 having the conductive layer 2 described in FIG. 1 is attached to a holding part 5 such as glass, and the holding part 5 is fixed by a conductive frame 7. The detection circuit unit 8 is connected to the coupling electrode unit 4 via the electric wire 6, and the coupling electrode unit 4 is on the surface opposite to the surface of the holding unit 5 on which the conductive layer 2 is applied by an adhesive or the like. The entire conductive layer 2 functions as a detection electrode through a parallel plate type capacitor that is pasted and includes the coupling electrode portion 4 and the conductive layer 2.
On the other hand, the reference electrode of the detection circuit unit 8 is drawn out by another electric wire 6 and directly connected to the frame 7 having conductivity. Therefore, an electrostatic capacity exists between the conductive layer 2 and the frame body 7. When a dielectric substance such as a person or a conductor such as a metal approaches or contacts the conductive layer 2 and the frame 7, a slight change occurs in the capacitance. As an actual detection method, an AC signal is applied between the conductive layer 2 serving as a detection electrode and the frame body 7 serving as a reference electrode, and a change occurs in the AC signal when a person or the like approaches or touches. . Detection is possible by amplifying / determining the weak change.

Next, FIG. 3 shows the structure of the film substrate 1 having the conductive layer on the detection electrode side, which is the same as that in FIG. 2, but with the conductive frame 7 on the reference electrode side of the detection circuit unit 8. This is an example in which the connection method is devised.
In FIG. 2, the detection circuit unit 8 is directly connected to the frame body 7 via the electric wire 6. However, in the method shown in FIG. 3, a relatively thin insulator unit 9 is disposed on a part of the frame body 7. The coupling electrode portion 10 on the reference electrode side is provided on the insulator portion 9 and connected to the detection circuit portion 8 through the electric wire 6 from here. FIG. 4 shows a cross-sectional structure. That is, the parallel plate type capacitor structure in which the insulator portion 9 is formed as a dielectric also on the reference electrode side allows the frame body 7 and the coupling electrode portion 10 to be connected in an alternating manner, so that the frame body 7 is connected to the detection circuit portion. 8 is operated as the reference electrode side.
As a result, the connection method of the detection circuit unit 8 is such that each coupling electrode unit (the coupling electrode unit 4 on the detection electrode side and the coupling electrode unit 10 on the reference electrode side) is opposite to the conductive layer 2 of the holding unit 5. It is only necessary to affix on the surface and the insulator part 9 of the frame body 7, and the construction is simplified.

FIG. 5 is a further advancement of the concept in FIG. 3, which is a system that eliminates the need to dispose a conductive frame 7 serving as a reference electrode around the film substrate 1 having a conductive layer. The material 1 alone is configured to have a sensing function.
The film substrate 1 has two conductive portions (first and second conductive layers). The conductive layer 2b is arranged so that one of them forms a ring in a portion close to the outer periphery of the film substrate 1. The other conductive portion is located inside the annular conductive layer 2b and exists as a large-area conductive layer 2a. The two conductive layers 2a and 2b are not conductive.
The coupling electrode portions 4a and 4b are provided on the opposite side of the holding portion 5 at the closest position in a part of each of the conductive layers 2a and 2b. The coupling electrode portions 4a and 4b are integrated with the detection circuit portion 8, and the electric wire 6 in FIGS. 2 and 3 is unnecessary.

A cross-sectional view of this part as viewed from above is shown in FIG. Here, the coupling electrode portion 4a side coupled with the conductive layer 2a is the detection electrode side in the detection circuit portion 8, and the side where the conductive layer 2b and coupling electrode portion 4b are coupled is the reference electrode side in the detection circuit portion 8. It is. That is, the conductive layer 2b functions in the same manner as the frame 7 having conductivity in the system shown in FIG.
Therefore, when a dielectric substance such as a person or a conductor such as a metal approaches or contacts the conductive layer 2a and the conductive layer 2b, a slight change occurs in the capacitance, and the conductive layer 2a on the detection electrode side If an AC signal is applied between the conductive layers 2b on the reference electrode side, a change occurs in the AC signal when a person or the like approaches or touches. By amplifying / determining this weak change, it is possible to detect a change in the surrounding situation. By adopting this method, the film base with a conductive layer that can be sensed even for resin-made window frames that have recently appeared to prevent heat dissipation from the window frame, improve heat retention, prevent condensation, and reduce weight. It can be used as a material.

Next, FIG. 7 is basically the same idea as FIG. 5, and two conductive portions (first and second conductive layers) are arranged on the film substrate, and the capacitance change between them is changed. Although it is a detection method, the shape of the conductive portion is changed.
First, the conductive layer 2 a is formed in a comb shape on the film substrate 1, and the conductive layer 2 b is also formed in a comb shape on the film substrate 1. However, the arrangement position is a positional relationship in which the comb teeth of the conductive layer 2b exist in the gaps of the comb teeth in the conductive layer 2a, and further, the conductive layers 2a and 2b are arranged so as not to conduct. Yes. Similarly to FIG. 5, coupling electrode portions 4a and 4b are provided on the opposite side of the holding portion 5 at the closest position in a part of each of the conductive layers 2a and 2b. The coupling electrode portions 4a and 4b are integrated with the detection circuit portion 8, and the electric wire 6 in FIGS. 2 and 3 is unnecessary.
The detection principle is the same as in FIG. 5, but the method of FIG. 7 has more opposing sides of the conductive layer 2a on the detection electrode side and the conductive layer 2b on the reference electrode side. It can be detected relatively uniformly.
5 and 7 show an example of a system in which two conductive layers are provided on the film substrate 1, and other arrangement patterns are included in the intended scope of the present invention.

In addition, in the thin film layer such as the film base 1, the conductive layer 2, the coupling electrode 4, and the protective layer 3 formed as necessary, the internal structure after the construction is improved. Visibility is not degraded. Therefore, in the crime prevention film field corresponding to the “glass breaking” crime that breaks the glass and intrudes into the building by pasting it on the window for ordinary houses, it is conventional by using the conductive film according to the present invention. It is possible to have an alarm function in addition to the entry prevention function. In addition, the detection circuit unit can be configured to be affixed on the film substrate, and the construction can be made very simple.
Furthermore, by using the conductive film according to the present invention, it functions as a touch sensor that is detected when touched and attached to an exhibition shelf or a showcase with a transparent window in addition to a security film for residential windows. It can also be used as a switch function for giving announcements and warnings.

  Next, a method for capturing a change in capacitance that occurs between the detection electrode side and the reference electrode side will be described. Various detection methods are used in the actual system. For example, it is conceivable to detect a change in the oscillation frequency of the oscillator accompanying a change in capacitance, or to detect a change in impedance at the electrode portion, but it is not particularly limited.

In the present embodiment, as shown in FIG. 8, a bridge circuit 81, which is the simplest and general method as a detection method, is applied. This is a circuit in which a resistance element is replaced with a capacitor in a resistance bridge circuit, and an applied signal source is an AC signal oscillation unit 82. Here, Cs is a total capacity of the bridge circuit in the normal state (when the intruder is not approaching or not in contact) and the film substrate 1 side that is the detection electrode side is viewed as Cs. The capacitance values arranged on each side are C1, C2, and C4 as shown in FIG. Moreover, the impedance of these capacitors is expressed as follows.
Capacitance: C1 impedance Z1 = 1 / ωC1
Capacitance: C2 impedance Z2 = 1 / ωC2
Capacitance: C4 impedance Z4 = 1 / ωC4
Capacitance: Cs impedance Zs = 1 / ωCs
Where ω is the angular frequency of the AC signal vibration.
When the signal level at point A and point B of the bridge circuit is equal in Cs in a normal state (when an intruder is not approaching or in contact), that is, when the bridge circuit is in an equilibrium state, The relationship between each impedance is Z1 · Zs = Z2 · Z4. This is also C1 · Cs = C2 · C4. Therefore, the values may be selected so that the above-described relationship is established for the capacitors C1, C2, and C4 in Cs in the normal state.

Further, when the intruder approaches or comes into contact with the film substrate 1 on the detection electrode side, the stray capacitance of the intruder is added to the capacitance Cs0 between the detection and the reference electrode in the normal state, and the total capacitance Cs is increased. As a result, the equilibrium state of the bridge circuit is lost, and a difference occurs in the signal levels at points A and B of the bridge circuit. This difference level is amplified by a differential amplifier 83 at the next stage, and direct current and level determination processing are performed by a subsequent stage (not shown) to determine whether an intruder is approaching or contacting.
An alarm system (not shown) can be configured by combining with a controller or an alarm device based on the determination result, and can function as a crime prevention system.

FIG. 9 is equivalent to FIG. 8 in the present embodiment in consideration of capacitance components at each portion on the detection electrode side by the film substrate 1 having the conductive layer and on the reference electrode side by the conductive frame 7. It is a circuit.
Here, Cs is the total capacity of the bridge substrate viewed from the film substrate 1 side, which is the detection electrode side.
Further, the detection electrode side coupling capacitance constituted by the conductive layer 2 and the coupling electrode portion 4 on the detection electrode side in FIG. 3 is Cs1, and is arranged via the frame body 7 and the insulator portion 9 on the reference electrode side. A reference electrode side coupling capacitance constituted by the coupling electrode portion 10 is Cs2, and a detection electrode-reference electrode capacitance generated between the detection electrode side by the conductive layer 2 and the reference electrode side by the frame 7 is Cs0.

These three capacitors are equivalently connected in series and have a relationship of (1 / Cs) = (1 / Cs1) + (1 / Cs2) + (1 / Cs0). In the present embodiment, the frequency of the AC signal oscillating unit 82 that is a signal source applied to the bridge circuit 81 is about 100 KHz, and the values of the capacitors in the bridge circuit are C1 = C2 = 180 pF and C4 = 30 pF.
Further, the coupling electrode portion 4 on the detection electrode side uses a copper plate of 100 mm × 100 mm, the thickness of the holding portion is 5 mm, the relative dielectric constant is about 7, and the coupling electrode portion 10 on the reference electrode side is 50 mm × 50 mm. The thickness of the insulator was 0.2 mm and the relative dielectric constant was about 2.
At this time, when these conditions are used to calculate the detection electrode side coupling capacitance: Cs1 and the reference electrode side coupling capacitance: Cs2 using the capacitance calculation formula, Cs1≈124 pF and Cs2≈220 pF. Therefore, in a normal state (when an intruder is not approaching or in contact), the bridge circuit 81 is in a balanced state, so Cs = C4 = 30 pF. By substituting these numerical values into the above-described equation and obtaining the capacitance Cs0 between the detection electrode and the reference electrode in the normal state, it is about 48 pF.
From this, it can be seen that the larger the detection electrode side coupling capacitance: Cs1 and the reference electrode side coupling capacitance: Cs2, the closer the detection electrode-reference electrode capacitance: Cs0 approaches the value of the capacitor C4.

<Transparent film substrate>
Next, the film substrate will be described. Examples of the base film base material include transparent film-like inorganic compound moldings and organic compound moldings, and organic compounds are preferred from the viewpoint of flexibility and light weight, and above all, processability. The shape of the molded product is not particularly limited as long as the surface is smooth. Moreover, if the transparent substrate has transparency, a homogeneous structure of a single organic compound molded product (for example, no optical anisotropy) is possible. On the other hand, in order to reinforce the strength of the film, a laminated film in which the same or different organic compound molded products are formed into a laminated structure with an adhesive / adhesive, or a film having a multilayer structure when the film is molded can be used.

  Examples of the organic compound having transparency include polyamide, polyimide, polypropylene, polyethylpentene, polyvinyl chloride, polyvinyl acetal, polyurethane, polyethyl methacrylate, polycarbonate, polystyrene, polyethylene sulfide, polyether sulfone, polyarylate, and polyether. Examples thereof include plastics such as ether ketone, polyethylene terephthalate, polyethylene naphthalate, and triacetyl cellulose. In particular, plastic films such as polyethylene terephthalate, polyethylene naphthalate, and polycarbonate are preferable from the viewpoint of transparency, strength, price, and the like. The thickness of the plastic film is appropriately selected from the range of 25 to 300 μm depending on the intended use, and further, depending on the intended use, an ultraviolet absorbent, an infrared absorbent, a plasticizer, a lubricant, a colorant, and an antioxidant. Even if an agent, a flame retardant, or the like is added, there is no particular limitation and no limitation is imposed.

<Transparent conductive layer>
The transparent conductive layer constituting the object detection system is not particularly limited as long as it has electrical conductivity, but is a composite oxide composed of oxides of indium, tin, zinc, titanium, niobium, cerium, antimony, etc., and two or more elements. Things are preferred. Titanium nitride is also applicable. Furthermore, a multilayer film in which silver and a silver alloy are narrowly supported with a transparent oxide can also be used. Although the formation method is not particularly limited, the dry method includes a vacuum deposition method, an ion plating method, a plasma activated deposition method, a sputtering method, a CVD method, and the like, and the wet method uses sol-gel or conductive particles. There is a method of dispersing and applying a coating liquid.

The conductive layer not only functions as a detection electrode, but also exhibits heat ray shielding properties. The heat ray shielding is achieved by reflecting infrared rays. Specifically, it is necessary to suppress the light transmittance of infrared rays (wavelength of about 800 nm or more).
Such optical behavior is an interaction between light and free electrons (carriers) inside the material constituting the transparent conductive layer, and the relationship between the carrier density of electrical characteristics and the reflection of optical characteristics can be used. . The interaction is called plasma resonance vibration, and the vibration frequency is called plasma vibration frequency ωp. Light having a frequency lower than the plasma oscillation frequency ωp resonates and reflects with free electrons (carriers) inside the substance.
The plasma oscillation frequency ωp is
ωp2 = nq2 / εm *
(Where n: carrier density, q: carrier charge, ε: dielectric constant, m *: effective mass of carrier).
The wavelength λp of light at the plasma oscillation frequency ωp is obtained by λp = c / ωp from the relational expression c = ωp · λp with respect to the speed of light c. From the relational expression, in order to efficiently reflect infrared light having a wavelength of about 800 nm or more, which is in the near infrared region, the carrier density is calculated to be about 2 × 10 ²¹ cm ⁻³ for λp = 800 nm. When the infrared shielding function is imparted to the present invention, it is necessary to put at least one substance having a carrier density of the above value or more in the conductive layer.

<Adhesive layer / adhesive layer>
The pressure-sensitive adhesive layer or the adhesive layer is used for bonding substrates and bonding to glass. Although it is not clearly distinguished at the time of use, the surface to be bonded to glass is preferably an adhesive. The reason is that when the adhesive and glass are in contact with each other, the adhesive is effective against “glass breaking” to prevent the glass from scattering when the glass is broken, and the crime prevention performance is improved. The number of multilayers can also be appropriately determined according to the required characteristics. Adhesives include acrylic adhesives based on polyacrylic acid esters, silicone adhesives based on silicone resins, and rubber-based adhesives consisting mainly of natural rubber and synthetic rubber elastic bodies and tackifiers. There are agents. Although there is no restriction | limiting in the adhesive which can be used, As an adhesive in this invention, an acrylic type or silicone type adhesive is preferable. As the adhesive, epoxy resin, urethane resin, unsaturated polyester resin, vinyl ester resin and the like can be used.

<Insulation protective layer>
The protective layer shown in FIG. 1 is applied for the purpose of protecting the conductive layer formed on the surface of the film substrate, and the purpose is to increase the surface hardness of the entire film substrate. The effect is a weather-resistant treatment that does not cause scratches such as pencils and scratches caused by steel wool. The material for forming the insulating treatment layer may be any material having transparency, appropriate hardness, and mechanical strength, and examples thereof include resin materials such as acrylic resins, organic silicone resins, and polysiloxanes. In addition, when applying an insulating treatment layer, it is possible to increase the hardness by mixing a resin filler or an inorganic filler in the coating liquid, or to make the film itself opaque and to provide a privacy protection function. You can use it.

<Ultraviolet absorbing layer / infrared absorbing layer>
Further, although not shown as a method of providing an additional function, an ultraviolet absorbing layer and an infrared absorbing layer may be provided in the adhesive layer / adhesive layer or the insulating treatment layer. The ultraviolet absorption layer and the infrared absorption layer have a function of reducing the incidence of ultraviolet rays and infrared rays in sunlight into the room. As the method, a film containing ultraviolet rays or an infrared absorber may be formed, or each layer may be formed by mixing with an adhesive layer and an adhesive layer or an insulating treatment layer. The formation method is not particularly limited. UV absorbers include salicylic acid-based, benzophenone-based, benzotriazole-based, cyanoacrylate-based organic systems, and inorganic fine-particle systems such as iron oxide, zinc oxide, titanium oxide, and indium oxide. Or may be used in combination.

As the infrared absorber, there are an organic type such as an infrared absorbing dye and an inorganic type such as conductive inorganic fine particles, which can be used according to demands. Examples of the organic type include phthalocyanine type and cyanine type organic dyes. Examples of the inorganic system include tin oxide, indium oxide, zinc oxide, tungsten oxide, chromium oxide, molybdenum oxide, antimony-containing tin oxide, and indium-containing tin oxide fine particles. Among these, a material that does not absorb light in the visible light region is preferable. In general, thermoplastic resins such as acrylic resins, polyester resins, alkyd resins, polyurethane resins, epoxy resins, amino resins, and vinyl resins are generally used as resins for fixing ultraviolet rays or infrared absorbers. In addition, the transparent oxide material used in the transparent conductive layer of the film sensor has an absorption performance due to electrical conductivity in the infrared region and an absorption performance due to the band gap in the ultraviolet region. It is possible to provide both the effects of ultraviolet rays and infrared absorbing layers.
Further, as the transparent substrate, it is also possible to use a plastic film transparent in the visible range containing the ultraviolet absorber and the infrared absorber as described above.

<Glass window>
Although the glass structure, the window glass, and the glass-like building structure were mentioned as the holding part 5 of this example, it is not particularly limited as long as it is transparent and strong and can be used as a window or a show window. A synthetic resin plate or the like is also possible. Further, in order to prevent malfunction of the formed object detection system, it is possible to prepare an operation permission signal and restrict the operation. As an example, it is preferable to install a microswitch on a window glass or the like.

It is sectional drawing which shows the object detection system by the 1st Embodiment of this invention. It is a front view of the object detection system shown in FIG. It is a front view which shows the object detection system by the 2nd Embodiment of this invention. It is sectional drawing of the object detection system shown in FIG. It is a front view which shows the object detection system by the 3rd Embodiment of this invention. It is sectional drawing of the object detection system shown in FIG. It is a front view which shows the object detection system by the 4th Embodiment of this invention. It is a circuit diagram which shows the structure of the detection part used by embodiment of this invention. It is a circuit diagram which shows the equivalent circuit of the detection part shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Film base material, 2 ... Conductive layer, 3 ... Protective layer, 4, 10 ... Coupling electrode part, 5 ... Holding part, 6 ... Electric wire, 7 ... Frame, 8 ... Detection Circuit part, 9 ... insulator part, 11 ... substrate, 81 ... bridge circuit, 82 ... AC signal oscillation part, 83 ... differential amplifier, C1, C2, C4 ... capacitor.

Claims (8)

A conductive layer functioning as a detection electrode disposed on one surface of the substrate;
A reference electrode disposed around the conductive layer;
A detection circuit unit for detecting that an external object has approached the conductive layer by detecting a capacitance change between the reference electrode and the conductive layer;
A coupling electrode portion disposed on the other surface of the substrate;
Coupling means for coupling a signal for detection in an alternating manner using another electrostatic capacitance generated between the conductive layer and the coupling electrode section;
An object detection system comprising:   As another means for electrically connecting the detection circuit unit and the frame by an alternating current signal, a conductive frame that functions as the reference electrode is disposed around the substrate. The object detection system according to claim 1, wherein a part is provided and coupled via a capacitance.   A first conductive layer formed in a frame shape is disposed around the substrate, and a second conductive layer is disposed in an insulated state inside the first conductive layer, and the detection circuit unit and the first conductive layer As a means for coupling the first and second conductive layers, a coupling electrode portion formed on the other surface of the substrate and connected to the detection circuit portion is provided, and each of the first and second conductive layers is statically connected. The object detection system according to claim 1, wherein the object detection system is coupled via a capacitance.   A first conductive layer and a second conductive layer, which are each formed in a comb shape on the substrate, are provided in an insulated state, and the second conductive layer is formed between the comb teeth of the first conductive layer. Comb teeth are arranged in a state of entering, and are formed on the other surface of the substrate and connected to the detection circuit unit as means for coupling the detection circuit unit and the first and second conductive layers. The object detection system according to claim 1, wherein a coupling electrode unit is provided and coupled to the first and second conductive layers via capacitances.   The object detection system according to claim 1, wherein the substrate and the conductive layer have transparency.   The object detection system according to claim 5, wherein the coupling electrode portion has transparency.   The object detection system according to claim 1, wherein the substrate is formed in a film shape, and the conductive layer is attached to the substrate via an adhesive or an adhesive. The object detection system according to claim 1, wherein the conductive layer includes a substance having a carrier density of 2 × 10 ²¹ cm ⁻³ or more.

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