JP4997870B2 - Object detection system - Google Patents

Description

  The present invention relates to an object detection system, and more particularly to an object detection system suitable for use as a capacitance sensor that detects the presence of an object or human body that approaches or contacts a substrate having a conductive layer.

  As a technique for detecting the capacitance of the window glass, a capacitance sensor that forms a transparent electrode directly on the window glass and detects rain or condensation is known. Furthermore, Japanese Patent Laid-Open No. WO01 / 004857 proposes a glass sensor including a detection circuit that detects a change in capacitance between a conductive film and a grounded window frame (see Patent Document 1).

On the other hand, for recent crime prevention, multilayer laminates and multilayer extruded films have been used. As a background to this, there is a significant increase in intrusion from windows. In the “crime situation in the first half of 2005” announced by the National Police Agency, the ratio of “breaking glass” is the highest in terms of crimes of burglary, and this trend has continued for several years.
Furthermore, for automobiles placed outdoors, there are more than 64,000 incidents in which the automobiles themselves are stolen per year, and more than 400,000 so-called car roughenings occur every year (2003). Of these, it is surmised that “glass breaking” is carried out in a large proportion.
JP 01/004857 A

  Therefore, in the object detection system proposed as a conventional glass sensor, since the counter electrode of the conductive film to be the detection electrode is determined to be a grounded glass window frame, the detection electrode has excellent detection stability. The electrical connection structure on the side of the conductive film that needs to be electrically drawn out from the conductive part on the film to the detection circuit by an electric wire or the like. For this reason, it is necessary to separately form an electrode part for drawing out an electric signal on the film substrate, and a process for forming an electrode part for connecting an electric signal is necessary in addition to the process of forming the conductive film in the production of the conductive film. Leads to cost increase. In addition, since there are lead wires for electrical signals, there are many factors that cause connection failures such as strength at the connection points on the film, fixing methods, routing methods, etc. There is a problem that the connection point is broken due to careless operation. In particular, when applied to a movable window glass of an automobile, there is a problem that the connection portion must be housed in a frame body due to the structure, and it is difficult to cope with a connection failure.

  An object of the present invention is to provide an object detection system that can suppress an increase in manufacturing cost, can be easily constructed, can eliminate the occurrence of disconnection or breakage of a connection portion, and can improve reliability.

As means for solving the problems, the invention according to claim 1 is a substrate comprising a holding part and a film base material bonded to one surface of the holding part, and the holding part of the film base material. a conductive layer serving as a detection electrode is formed on the opposite surface, and a reference electrode disposed around the conductive layer, the capacitance change arising between the reference electrode and the detection electrode in the detection to object detection systems, it is formed between the first and the coupling electrode portion, the first coupling electrode portion and the front Symbol conductive layer to the conductive layer are disposed with a predetermined gap state in which the alternating signal oscillating unit for supplying an AC signal, an AC signal from the AC signal oscillating unit is supplied for the object detection between the signal and through a supply capacitor the detection electrode and that the reference electrode in capacitance between the detection electrode and the reference electrode By detecting the reduction, and a detecting circuit for detecting that an external object approaches or contacts with the reference electrode and the conductive layer, the reference electrode, the arranged conductive around the substrate A second frame that is arranged on the frame via an insulating layer, and is connected to the detection circuit unit in an alternating manner via a signal supply capacitor formed between the frame and the frame. A coupling electrode section, and the detection circuit section includes a signal supply capacitor formed between the first coupling electrode section and the conductive layer, and the second coupling electrode section and the frame body. An AC signal is supplied from the AC signal oscillation unit to the detection electrode unit and the reference electrode via a signal supply capacitor formed between the detection electrode unit and the reference electrode. Capacitance change is detected .
Further, the invention according to claim 2 is the object detection system, wherein the substrate is composed of a holding part and a film base material bonded to one surface of the holding part, and is opposite to the holding part of the film base material. An annular first conductive layer pattern which is disposed on the surface and functions as a reference electrode, and the first conductive layer pattern positioned on the inner side of the first conductive layer pattern and on the surface opposite to the holding portion of the film substrate. A second conductive layer pattern that is disposed in an insulating state with the conductive layer pattern and functions as a detection electrode, and is disposed with a gap on a surface opposite to the film base of the first conductive layer pattern, and the holding A first coupling layer electrically coupled to the first conductive layer pattern by a signal supply capacitor formed between the first conductive layer pattern and the film substrate and the first conductive layer pattern through the gap An electrode portion and the second portion A signal formed between the holding portion, the film base material, and the second conductive layer pattern through the gap, with a gap on the surface of the electric layer pattern opposite to the film base material. For detecting an object between the second conductive layer pattern electrically coupled to the second conductive layer pattern by a supply capacitor and between the first conductive layer pattern and the second conductive layer pattern The AC signal oscillating unit for applying the AC signal is connected to the first coupling electrode unit and the second coupling electrode unit, and the AC signal is supplied from the AC signal oscillating unit in the state where the first signal is supplied. By detecting a capacitance change between the conductive layer pattern and the second conductive layer pattern, an external object approaches or contacts the first conductive layer pattern and the second conductive layer pattern. The detection circuit part to detect Characterized in that it.

According to the present invention, since it is not necessary to directly connect to the conductive layer on the substrate, only the conductive layer coating operation is required in the manufacturing process of the substrate having the conductive layer, and the electrode portion forming operation is unnecessary. The whole process is simplified and can be manufactured at low cost.
Further, since the detection circuit portion and the conductive layer of the substrate are not directly connected, there is no disconnection or breakage of the connection portion in the conductive layer, and there is an effect that the reliability is greatly improved.

(Embodiment 1)
Embodiment 1 of the object detection system of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view illustrating a basic configuration of the object detection system according to the first embodiment. The conductive layer 2 is formed on one surface of the film substrate 1 by utilizing a film forming technique such as a dry coating method or a wet coating method. In the first embodiment, a protective layer 3 is applied to the surface of the conductive layer 2 for the purpose of protecting the conductive layer 2 as shown in FIG. The other side of the film substrate 1 is fixed to the holding part 5 via an adhesive layer, although not shown. The holding unit 5 is, for example, glass. The film base 1 and the holding unit 5 constitute a substrate 11. Further, the coupling electrode part 4 is fixed to another holding part 5 ′ with a certain gap from the conductive layer 2. The coupling electrode part 4 and the other holding part 5 ′ may be provided on the opposite side of the holding part 5 with respect to the conductive layer 2.
The coupling electrode unit 4 is connected to a detection circuit unit, which will be described later, by an electric wire 6, and the conductive layer 2 functions as a detection electrode when viewed from the detection circuit unit. An AC signal is used as an electrical signal for detecting a change in capacitance between the reference electrode and the detection electrode in the detection circuit unit. Here, there is an air gap between the coupling electrode portion 4 and the conductive layer 2, and it operates as a parallel plate type capacitor composed of the coupling electrode portion 4 and the conductive layer 2. Therefore, the AC signal applied from the detection circuit unit to the coupling electrode unit 4 via the electric wire 6 is coupled to the conductive layer 2 via this capacitor, and the entire conductive layer 2 serves as a detection electrode for the reference electrode. Operate.
In this way, the electrical circuit lead wire is directly attached to the conductive layer 2 and the electrical signal lead wire is pulled out from the conductive layer 2, and the entire conductive layer 2 can be easily detected by the detection circuit unit. It can be operated as an electrode.

FIG. 2 shows an outline of the object detection system according to the first embodiment when a film substrate 1 having a conductive layer 2 is attached to a window glass and the present invention is applied to a sensor for detecting contact or approach of a person or the like. FIG. The film substrate 1 having the conductive layer 2 described with reference to FIG. 1 is attached to a holding portion 5 such as glass, and the holding portion 5 is disposed inside a conductive frame 7. The detection circuit unit 8 is connected to the coupling electrode unit 4 through the electric wire 6, and the coupling electrode unit 4 is attached to a position facing the conductive layer 2 of another holding unit 5 ′ with an adhesive or the like. The entire conductive layer 2 functions as a detection electrode through a parallel plate capacitor that is processed and includes the coupling electrode portion 4 and the conductive layer 2.
On the other hand, a frame 7 having conductivity is used as a reference electrode of the detection circuit unit 8, and another electric wire 6 drawn out from the detection circuit unit 8 is directly connected to the frame 7 having conductivity. ing. Therefore, an electrostatic capacity exists between the conductive layer 2 and the frame body 7. When a dielectric substance such as a person or a conductor such as a metal approaches or contacts the conductive layer 2 and the frame 7, a slight change occurs in the capacitance. As an actual detection method, an AC signal is applied between the conductive layer 2 serving as a detection electrode and the frame body 7 serving as a reference electrode, and a change occurs in the AC signal when a person or the like approaches or touches. . Detection is possible by amplifying / determining the weak change.

  Since the coupling electrode unit 4 and the holding unit 5 are in a non-contact state, only the holding unit 5 can be operated in the downward direction of the figure by connecting the power mechanism to the holding unit 5, for example. In this case, it functions as an object detection system only when the conductive layer 2 and the holding unit 5 are inside the frame body 7. For example, this system can be applied to a window glass for an automobile in which only the glass is movable, in which the frame 7 and the glass as the holding unit 5 are not integrated.

  As described above, according to the first embodiment, there is no need to provide the conductive layer 2 on the substrate 11 with an electrode portion for directly drawing out an electric wire or the like to the detection circuit portion 8. In the manufacturing process of the glass or film substrate 11, only the coating operation of the conductive layer 2 is required, the electrode portion forming operation is not required, the entire process is simplified, and the manufacturing process is performed at a lower cost than the prior art. I can do it. In addition, since the electric wire is not directly connected to the conductive layer 2 of the base material 11, an electrode part is formed in the conductive layer 2, and a construction error or maintenance time that tends to occur when the electric wire is directly connected to the electrode part. There is an effect that it is possible to provide an object detection system in which reliability is remarkably improved since there is no disconnection or breakage at the electrode portion due to trouble.

  It is also possible to attach the film substrate 1 having the conductive layer 2 to a holding part 5 such as glass to form a substrate 11. In this case, the electric wire from the detection circuit part 8 is directly connected. Because it is not connected to the conductive layer 2 via the electrode part of the above, there is no breakage or breakage in the electrode part due to construction mistakes or troubles during maintenance, and an object detection system that dramatically improves reliability There is an effect that can be provided.

(Embodiment 2)
FIG. 3 shows an outline of an object detection system according to a second embodiment when a film substrate 1 having a conductive layer 2 is attached to a window glass and the present invention is applied to a sensor for detecting contact or approach of a person or the like. FIG. In the object detection system according to the second embodiment, the configuration of the film substrate 1 having the conductive layer 2 on the detection electrode side is the same as that in FIG. 2, but has the conductivity on the reference electrode side of the detection circuit unit 8. The connection method with the frame body 7 is characterized. In FIG. 2, the electric wire 6 is pulled out from the detection circuit unit 8, and the electric wire 6 is electrically connected directly to the frame body 7. However, in the second embodiment, a relatively thin insulating portion 9 is formed on a part of the frame body 7. The coupling electrode portion 10 on the reference electrode side is formed on the insulating portion 9, and the coupling electrode portion 10 is connected to the detection circuit portion 8 via the electric wire 6. FIG. 4 is a cross-sectional structure diagram of the insulating portion 9 and the coupling electrode portion 10 in the object detection system of the second embodiment. That is, by using a parallel plate capacitor structure in which the insulating portion 9 is formed as a dielectric on the reference electrode side, the frame body 7 and the coupling electrode portion 10 are coupled in an AC manner, and the frame body 7 is connected to the detection circuit portion 8. It is operated as the reference electrode side.
In the second embodiment, the detection circuit unit 8 is connected by connecting each coupling electrode unit (the coupling electrode unit 4 on the detection electrode side and the coupling electrode unit 10 on the reference electrode side) to the conductive layer 2 with a certain gap. It is only necessary to affix on the holding part 5 ′ and the insulating part 9 of the frame body 7, and the construction becomes simple. In particular, the effect of providing an object detection system in which the disconnection / breakage trouble that may occur at the electrical connection between the frame body 7 and the detection circuit unit 8 during construction or maintenance is eliminated and the reliability is improved. There is.

(Embodiment 3)
FIG. 5 is a schematic diagram showing an object detection system according to Embodiment 3 when the present invention is applied to a sensor for detecting contact or approach of a person or the like. The object detection system according to the third embodiment is a method in which the conductive frame 7 serving as a reference electrode does not have to be disposed around the film substrate 1 having the conductive layer. It is configured to have a function. The film substrate 1 has two conductive portions. One conductive portion is a conductive layer pattern 2 b arranged in a ring shape at a portion close to the outer periphery of the film substrate 1. The other conductive portion is located inside the annular conductive layer pattern 2b and is configured as a large-area conductive layer pattern 2a. There is no conduction between the conductive layer pattern 2a and the conductive layer pattern 2b.

  The coupling electrode portion 4a is located at a position closest to a part of each conductive layer pattern 2a, 2b and facing the conductive layer pattern 2a, 2b having a certain gap with respect to the holding portion 5. 4b are provided. The coupling electrode portions 4a and 4b are integrated with the detection circuit portion 8, and the electric wire 6 in FIGS. 2 and 3 is unnecessary. FIG. 6 is a cross-sectional view showing a cross-sectional structure in the AA ′ direction in the coupling electrode portions 4a and 4b. Here, the coupling electrode portion 4a side coupled to the conductive layer pattern 2a is the detection electrode side in the detection circuit portion 8, and the side where the conductive layer pattern 2b and coupling electrode portion 4b are coupled is the reference in the detection circuit portion 8. On the electrode side. That is, the conductive layer pattern 2b has the same function as the frame 7 in FIG.

  Therefore, when a dielectric material such as a person or a conductor such as a metal approaches or contacts the conductive layer pattern 2a and the conductive layer pattern 2b, a slight change occurs in the capacitance, and the conductive layer on the detection electrode side. If an AC signal is applied between the pattern 2a and the conductive layer pattern 2b on the reference electrode side and a person or the like approaches or comes in contact, the AC signal changes. By amplifying / determining this weak change, it is possible to detect a change in the surrounding situation. By adopting this method, the film base with a conductive layer that can be sensed even for resin-made window frames that have recently appeared to prevent heat dissipation from the window frame, improve heat retention, prevent condensation, and reduce weight. It can be used as a material.

  In FIG. 5, when a mechanism for moving the holding portion 5 in the vertical direction is provided so that the conductive layer patterns 2a, 2b and the bonding electrode portions 4a, 4b always face each other, a frame body is provided for the conductive layer pattern 2a. Since the distance of the conductive layer 2 b closer to the reference electrode than 7 is shorter, the entire holding portion 5 does not need to be inside the frame body 7.

  Further, in the substrate having a conductive layer, two conductive portions are provided to detect a change in electrostatic capacitance generated between the conductive portions, and a detection circuit is located at a certain distance from the substrate. Since the coupling electrode part connected to the part is fixed, and a part of each conductive part and the coupling electrode are indirectly connected in an alternating current manner, the conductive frame for the surrounding reference electrode becomes unnecessary, and the substrate The sensing function can be provided only by the surface, and, for example, it can operate even if the frame is made of resin. Furthermore, sensing is possible even when the holding portion of the conductive portion moves relative to the frame.

(Embodiment 4)
FIG. 7 is a schematic diagram showing an object detection system according to Embodiment 4 when the present invention is applied to a sensor for detecting contact or approach of a person or the like. The object detection system of the fourth embodiment is basically the same concept as the third embodiment, and two conductive portions are arranged on the film substrate, and a change in capacitance between them is detected. However, the method is characterized in that the shape of the conductive portion is a comb shape.

  In the object detection system according to the fourth embodiment, the conductive layer pattern 2a that is the first conductive portion is formed in a comb shape on the film substrate 1, and the conductive layer pattern 2b that is the second conductive portion. Is also formed in a comb shape on the film substrate 1. However, the arrangement position is a positional relationship in which the comb of the conductive layer pattern 2b as the second conductive portion exists in the gap between the combs in the conductive layer pattern 2a as the first conductive portion. The first and second conductive layer patterns 2a and 2b are arranged so as not to conduct. Similarly to FIG. 5, the conductive layer patterns 2a and 2b are closest to each other, have a certain gap from the holding portion 5, and are located at positions facing the conductive layer patterns 2a and 2b. Is provided. The coupling electrode portions 4a and 4b are integrated with the detection circuit portion 8, and the electric wire 6 in FIGS. 2 and 3 is unnecessary.

  Although the detection principle is the same as that of the third embodiment shown in FIG. 5, the method of the fourth embodiment opposes the conductive layer pattern 2a on the detection electrode side and the conductive layer pattern 2b on the reference electrode side. Since there are many sides, the film substrate 1 can be detected relatively uniformly over the entire surface. Further, in FIG. 7, when a mechanism for moving the support 5 in the vertical direction is provided so that the conductive layer patterns 2a and 2b and the bonding electrode portions 4a and 4b always face each other, a frame body is provided for the conductive layer pattern 2a. By making the arrangement pattern such that the distance of the conductive layer pattern 2b closer to the reference electrode than 7 is always shorter, the support portion 5 can function even if most of the support portion 5 is outside the frame body 7.

5 and 7 show an example of a method of providing two conductive layer regions on the film substrate 1, and other arrangement patterns are also included in the intended scope of the present invention.
In addition, in the thin film layer such as the film base 1, the conductive layer 2, the coupling electrode 4, and the protective layer 3 formed as necessary, the internal structure after the construction is improved. Visibility is not degraded. Therefore, in the security film field corresponding to the “glass breaking” crime that breaks the glass and penetrates into the window by pasting it on the window for ordinary houses or automobiles, use the conductive film according to the present invention. Thus, in addition to the conventional approach prevention function, it is possible to have an alarm function.
Moreover, the detection circuit unit 8 can be configured to be fixed to the frame body, and the construction can be made very simple.
Furthermore, by using the conductive film according to the present invention, in addition to the security film for windows, it can be applied to display shelves and showcases with transparent windows, and functions as a touch sensor that detects when touched. It can also be used as a switch-like function for performing such guides and warnings.

(Embodiment 5)
Next, a method for capturing a change in capacitance that occurs between the detection electrode side and the reference electrode side will be described. Various detection methods are used in the actual system. For example, it is conceivable to detect a change in the oscillation frequency of the oscillator accompanying a change in capacitance, or to detect a change in impedance at the electrode portion, but it is not particularly limited.

In the fifth embodiment, a bridge circuit 81 which is the simplest and general method as a detection method is applied. FIG. 8 is an electric circuit diagram of the detection circuit unit 8 for capturing a change in capacitance that occurs between the detection electrode side and the reference electrode side in the fifth embodiment. The configuration of the detection circuit unit 8 shown in FIG. 8 is a circuit in which a resistance element is replaced with a capacitor in a resistance bridge circuit, and an applied signal source is an AC signal oscillation unit 82. Here, Cs is a total capacity of the bridge circuit in the normal state (when the intruder is not approaching or not in contact) and the film substrate 1 side that is the detection electrode side is viewed as Cs. The capacitance values arranged on each side are C1, C2, and C4 as shown in FIG. Moreover, the impedance of these capacitors is expressed as follows.
Capacitance: C1 impedance Z1 = 1 / ωC1
Capacitance: C2 impedance Z2 = 1 / ωC2
Capacitance: C4 impedance Z4 = 1 / ωC4
Capacitance: Cs impedance Zs = 1 / ωCs
ω is the angular frequency of the AC signal vibration.
When the signal level at point A and point B of the bridge circuit is equal in Cs in a normal state (when an intruder is not approaching or in contact), that is, when the bridge circuit is in an equilibrium state, The relationship between each impedance is Z1 · Zs = Z2 · Z4. This is also C1 · Cs = C2 · C4. Therefore, the values may be selected so that the above-described relationship is established for the capacitors C1, C2, and C4 in Cs in the normal state.

  When the intruder approaches or comes into contact with the film substrate 1 on the detection electrode side, the stray capacitance of the intruder is added to the detection-reference electrode capacitance Cs0 in the normal state, and the overall capacitance Cs changes. Therefore, the balanced state of the bridge circuit is lost, and a difference occurs in the signal levels at the points A and B of the bridge circuit. This difference level is amplified by the differential amplifier 83 at the next stage, and although not shown, direct current and level determination processing are performed at the subsequent stage to determine the approach or contact of the intruder. An alarm system (not shown) can be configured by combining with a controller or an alarm device based on the determination result, and can function as a crime prevention system.

FIG. 9 is an equivalent circuit diagram in consideration of capacitance components on the detection electrode side by the film substrate 1 having the conductive layer and the reference electrode side by the conductive frame 7 in the fifth embodiment.
Here, Cs is the total capacity of the bridge substrate viewed from the film substrate 1 side, which is the detection electrode side. Further, the detection electrode side coupling capacitance formed by the conductive layer 2 and the coupling electrode portion 4 on the detection electrode side in FIG. 3 is Cs1, and is arranged via the frame body 7 and the insulator portion 9 on the reference electrode side. A reference electrode side coupling capacitance constituted by the coupling electrode portion 10 is Cs2, and a detection electrode-reference electrode capacitance generated between the detection electrode side by the conductive layer 2 and the reference electrode side by the frame 7 is Cs0. These three capacitors are equivalently connected in series and have a relationship of (1 / Cs) = (1 / Cs1) + (1 / Cs2) + (1 / Cs0). In the present embodiment, the frequency of the AC signal oscillating unit 82 that is a signal source applied to the bridge circuit 81 is about 100 KHz, and the values of the capacitors in the bridge circuit are C1 = C2 = 180 pF and C4 = 30 pF. Further, the coupling electrode portion 4 on the detection electrode side uses a copper plate of 25 mm × 500 mm, the gap between the conductive layer 2 and the coupling electrode portion 4 is 5 mm, the relative dielectric constant is about 1, and the coupling on the reference electrode side The electrode unit 10 was a 50 mm × 50 mm copper plate, the insulator thickness was 0.2 mm, and the relative dielectric constant was about 2. At this time, when these conditions are used to calculate the detection electrode side coupling capacitance: Cs1 and the reference electrode side coupling capacitance: Cs2 using the capacitance calculation formula, Cs1≈111 pF and Cs2≈220 pF. Therefore, in a normal state (when an intruder is not approaching or in contact), the bridge circuit 81 is in a balanced state, so Cs = C4 = 30 pF. By substituting these numerical values into the above-described equation and obtaining the capacitance Cs0 between the detection electrode and the reference electrode in the normal state, it is about 74 pF.
From this, it can be seen that as the detection electrode side coupling capacitance: Cs1 and the reference electrode side coupling capacitance: Cs2 are increased, the detection electrode-reference electrode capacitance: Cs0 approaches the value of the capacitor C4.

(Embodiment 6)
Next, various materials used in the object detection system of the present invention will be described.
<Transparent film substrate>
Examples of the base film base material include transparent film-like inorganic compound moldings and organic compound moldings, and organic compounds are preferred from the viewpoint of flexibility and light weight, and above all, processability. The shape of the molded product is not particularly limited as long as the surface is smooth. Moreover, if the transparent substrate has transparency, a homogeneous structure of a single organic compound molded product (for example, no optical anisotropy) is possible. On the other hand, in order to reinforce the strength of the film, a laminated film in which the same or different organic compound molded products are formed into a laminated structure with an adhesive / adhesive, or a film having a multilayer structure when the film is molded can be used.

  Examples of the organic compound having transparency include polyamide, polyimide, polypropylene, polyethylpentene, polyvinyl chloride, polyvinyl acetal, polyurethane, polyethyl methacrylate, polycarbonate, polystyrene, polyethylene sulfide, polyether sulfone, polyarylate, polyether. Examples thereof include plastics such as ether ketone, polyethylene terephthalate, polyethylene naphthalate, and triacetyl cellulose. In particular, plastic films such as polyethylene terephthalate, polyethylene naphthalate, and polycarbonate are preferable from the viewpoint of transparency, strength, price, and the like. The thickness of the plastic film is appropriately selected from the range of 25 to 300 μm depending on the intended use, and further, depending on the intended use, an ultraviolet absorbent, an infrared absorbent, a plasticizer, a lubricant, a colorant, and an antioxidant. Even if an agent, a flame retardant, or the like is added, there is no particular limitation and no limitation is imposed.

<Transparent conductive layer>
The transparent conductive layer constituting the object detection system is not particularly limited as long as it has electrical conductivity, but is a composite oxide composed of oxides of indium, tin, zinc, titanium, niobium, cerium, antimony, etc., and two or more elements. Things are preferred. Titanium nitride is also applicable. Furthermore, a multilayer film in which silver and a silver alloy are narrowly supported with a transparent oxide can also be used. Although the formation method is not particularly limited, the dry method includes a vacuum deposition method, an ion plating method, a plasma activated deposition method, a sputtering method, a CVD method, and the like, and the wet method uses sol-gel or conductive particles. There is a method of dispersing and applying a coating liquid.

The conductive layer not only functions as a detection electrode, but also exhibits heat ray shielding properties. The heat ray shielding is achieved by reflecting infrared rays. Specifically, it is necessary to suppress the light transmittance of infrared rays (wavelength of about 800 nm or more).
Such optical behavior is an interaction between light and free electrons (carriers) inside the material constituting the transparent conductive layer, and the relationship between the carrier density of electrical characteristics and the reflection of optical characteristics can be used. . The interaction is called plasma resonance vibration, and the vibration frequency is called plasma vibration frequency ωp. Light having a frequency lower than the plasma oscillation frequency ωp resonates and reflects with free electrons (carriers) inside the substance. The plasma oscillation frequency ωp is

ωp ² = nq ² / ε _m ^*
(N: carrier density, q: carrier charge, ε: dielectric constant, m ^* : effective mass of carrier)

It is represented by The wavelength λp of the light at the plasma oscillation frequency ωp is obtained by λp = c / ωp from the relational expression c = ωp · λp with respect to the speed of light c. From the relational expression, in order to efficiently reflect infrared light having a wavelength of about 800 nm or more, which is in the near infrared region, the carrier density is calculated to be about 2 × 10 ²¹ cm ⁻³ for λp = 800 nm. When the infrared shielding function is imparted to the present invention, it is necessary to put at least one substance having a carrier density of the above value or more in the conductive layer.

<Adhesive layer / adhesive layer>
Although not shown, the pressure-sensitive adhesive layer or the adhesive layer is used for bonding substrates and bonding to glass. Although it is not clearly distinguished at the time of use, the surface to be bonded to glass is preferably an adhesive. The reason is that when the adhesive and glass are in contact with each other, the adhesive is effective against “glass breaking” to prevent the glass from scattering when the glass is broken, and the crime prevention performance is improved. The number of multilayers can also be appropriately determined according to the required characteristics. Adhesives include acrylic adhesives based on polyacrylic acid esters, silicone adhesives based on silicone resins, and rubber-based adhesives consisting mainly of natural rubber and synthetic rubber elastic bodies and tackifiers. There are agents. Although there is no restriction | limiting in the adhesive which can be used, As an adhesive in this invention, an acrylic type or silicone type adhesive is preferable. As the adhesive, epoxy resin, urethane resin, unsaturated polyester resin, vinyl ester resin and the like can be used.

<Insulation protective layer>
The protective layer shown in FIG. 1 is applied for the purpose of protecting the conductive layer formed on the surface of the film substrate, and the purpose is to increase the surface hardness of the entire film substrate. The effect is a weather-resistant treatment that does not cause scratches such as pencils and scratches caused by steel wool. The material for forming the insulating treatment layer may be any material having transparency, appropriate hardness, and mechanical strength, and examples thereof include resin materials such as acrylic resins, organic silicone resins, and polysiloxanes. In addition, when applying an insulating treatment layer, it is possible to increase the hardness by mixing a resin filler or an inorganic filler in the coating liquid, or to make the film itself opaque and to provide a privacy protection function. You can use it.

<Ultraviolet absorbing layer / infrared absorbing layer>
Further, although not shown as a method of providing an additional function, an ultraviolet absorbing layer and an infrared absorbing layer may be provided on the adhesive layer / adhesive layer or the insulating treatment layer. The ultraviolet absorption layer and the infrared absorption layer have a function of reducing the incidence of ultraviolet rays and infrared rays in sunlight into the room. As a method, each layer may be formed by forming a film containing ultraviolet rays or an infrared absorber, or mixing with an adhesive layer and an adhesive layer or an insulating treatment layer. The formation method is not particularly limited. UV absorbers include salicylic acid-based, benzophenone-based, benzotriazole-based, cyanoacrylate-based organic systems, and inorganic fine-particle systems such as iron oxide, zinc oxide, titanium oxide, and indium oxide. Or may be used in combination.

As the infrared absorber, there are an organic type such as an infrared absorbing dye and an inorganic type such as conductive inorganic fine particles, which can be used according to demands. Examples of the organic type include phthalocyanine type and cyanine type organic dyes. Examples of the inorganic system include tin oxide, indium oxide, zinc oxide, tungsten oxide, chromium oxide, molybdenum oxide, antimony-containing tin oxide, and indium-containing tin oxide fine particles. Among these, a material that does not absorb light in the visible light region is preferable. In general, thermoplastic resins such as acrylic resins, polyester resins, alkyd resins, polyurethane resins, epoxy resins, amino resins, and vinyl resins are generally used as resins for fixing ultraviolet rays or infrared absorbers. In addition, the transparent oxide material used in the transparent conductive layer of the film sensor has a reflection performance due to electrical conductivity in the infrared region and an absorption performance due to the band gap in the ultraviolet region. It can be formed to give both the ultraviolet and infrared absorption layers.
Moreover, it is also possible to use a plastic film transparent in the visible region containing the ultraviolet absorber and infrared absorber as described above as the transparent substrate.

<Glass window>
As the holding part 5 of the present invention, a glass structure, a window glass, and a glass-like building structure have been mentioned, but not limited thereto, as long as it is transparent and strong and can be used as a window or a show window. A synthetic resin plate or the like is also possible. Further, in order to prevent malfunction of the formed object detection system, it is possible to prepare an operation permission signal and restrict the operation. As an example, it is preferable to install a microswitch on a window glass or the like.

  As described above, the internal visibility after construction is not deteriorated by adopting a configuration in which the transparency of the substrate, the conductive layer, and the coupling electrode portion is increased. Therefore, in the crime prevention film field corresponding to the “glass breaking” crime that breaks the glass and penetrates into the inside by pasting it on the windows of ordinary houses and automobiles, by using the conductive film according to the present invention, In addition to the entry prevention function, it is possible to have an alarm function. Moreover, it can also have a high prevention function against glass scattering that occurs during an earthquake disaster.

In addition, since the conductive layer contains a substance having a carrier density of 2 × 10 ²¹ cm ⁻³ or more, light having a wavelength of about 800 nm or more, which is near infrared light, is caused by the action of plasma resonance vibration. ) And is reflected, it is possible to provide a heat ray shielding function.

  In addition, low-e glass, which has been popular in recent years, includes a conductive layer in order to provide a heat ray shielding function. If this conductive layer is not at the same potential as the reference potential (if it is a floating potential), the coupling electrode portion connected to the detection circuit portion on the glass surface is fixed from the substrate without forming a conductive layer again. By simply pasting it on, you can have a sensing function.

  Moreover, by using the conductive film according to the present invention, in addition to a crime prevention film for a house window, it is similarly installed on an exhibition shelf or a showcase having a transparent window, and a touch sensor that detects when touched. It can be used as a switch function to detect various human hand contacts and start various controls. .

It is sectional drawing which shows the basic composition of the object detection system of Embodiment 1 in this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the object detection system of Embodiment 1 when the present invention is applied to a sensor for detecting contact or approach of a person or the like. It is a schematic diagram which shows the object detection system of Embodiment 2 when the present invention is applied to a sensor for detecting contact or approach of a person or the like. FIG. 6 is a cross-sectional structure diagram of an insulating part and a coupling electrode part in the object detection system of the second embodiment. It is a schematic diagram which shows the object detection system of Embodiment 3 when the present invention is applied to a sensor for detecting contact or approach of a person or the like. FIG. 10 is a cross-sectional view showing a cross-sectional structure in the AA ′ direction in the coupling electrode portion of the object detection system of the third embodiment. It is a schematic diagram which shows the object detection system of Embodiment 4 when the present invention is applied to a sensor for detecting contact or approach of a person or the like. FIG. 10 is an electric circuit diagram of a detection circuit unit for capturing a change in capacitance that occurs between the detection electrode side and the reference electrode side in the fifth embodiment. It is an equivalent circuit diagram in consideration of the capacitance component on the detection electrode side by the film base material having the conductive layer and the reference electrode side by the conductive frame body in the fifth embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Film base material, 2 ... Conductive layer, 2a, 2b ... Conductive layer pattern, 3 ... Protective layer, 4a, 4b ... Coupling electrode part, 5, 5 '... Holding part, 6 ... Electric wire, 7 ... frame, 8 ... detection circuit part, 9 ... insulating part, 10 ... coupling electrode part, 11 ... substrate.

Claims (5)

A substrate made of the holding portion and the holding portion one surface to the bonded film substrate of a conductive layer serving as said are formed on the opposite surface and the holding portion detecting electrode portion of the film substrate, the conductive and a reference electrode disposed in surrounding layers, in the object detecting system for detecting a change in capacitance arising between the reference electrode and the detection electrode,
A first coupling electrode portion disposed with a certain gap with respect to the conductive layer ;
Supplying an alternating current signal for the object detection between said first of said detection electrode and the reference electrode and through the signal supply capacitor formed between the coupling electrode portion and the front Symbol conductive layer An AC signal oscillator,
An external object approaches or contacts the reference electrode and the conductive layer by detecting a change in capacitance between the reference electrode and the detection electrode in a state where an AC signal is supplied from the AC signal oscillation unit . and a detecting circuit for detecting that,
The reference electrode comprises a conductive frame disposed around the substrate,
A second coupling electrode portion that is arranged on the frame body via an insulating layer and that is connected to the detection circuit portion in an AC manner via a signal supply capacitor formed between the frame body and the frame body; Prepared ,
The detection circuit unit is formed between the signal coupling capacitor formed between the first coupling electrode unit and the conductive layer, and between the second coupling electrode unit and the frame. Supplying an AC signal from the AC signal oscillating unit to the detection electrode unit and the reference electrode via a signal supply capacitor, and detecting a change in capacitance generated between the detection electrode unit and the reference electrode;
An object detection system characterized by that . A substrate comprising a holding part and a film base material adhered to one surface of the holding part;
An annular first conductive layer pattern that is disposed on a surface opposite to the holding portion of the film base and functions as a reference electrode;
A second conductive layer located inside the first conductive layer pattern and disposed in an insulating state with the first conductive layer pattern on a surface opposite to the holding portion of the film base material and functioning as a detection electrode With patterns,
The first conductive layer pattern is disposed with a gap on the surface opposite to the film base, and between the holding part, the film base and the first conductive layer pattern via the gap. A first coupling electrode portion electrically coupled to the first conductive layer pattern by a signal supply capacitor formed;
The second conductive layer pattern is disposed with a gap on the surface opposite to the film base, and between the holding part, the film base and the second conductive layer pattern via the gap. A second coupling electrode portion electrically coupled to the second conductive layer pattern by a signal supply capacitor formed;
An AC signal oscillating unit that applies an AC signal for object detection between the first conductive layer pattern and the second conductive layer pattern;
The first conductive layer pattern and the second conductive layer pattern are connected to the first coupling electrode unit and the second coupling electrode unit, and an AC signal is supplied from the AC signal oscillation unit. A detection circuit unit that detects that an external object approaches or contacts the first conductive layer pattern and the second conductive layer pattern by detecting a capacitance change between the first conductive layer pattern and the second conductive layer pattern.
An object detection system characterized by that. Object detecting system according to claim 1, wherein said film substrate and the conductive layer has transparency. Object detection system according to claim 1 or 2, wherein said conductive layer comprises a material is a carrier density 2 × 10 ²¹ cm ^-3 or more. Object detection system of any one of claims 1 to 4, characterized in that the protective layer is formed on the conductive layer.

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