JP2008044144A - Mold and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold which can rapidly and homogeneously control the temperature of a molding surface (cavity) and efficiently obtain a homogeneous molding and a method for producing the mold. <P>SOLUTION: A main part 1 having the molding surface S and a prescribed three-dimensional shape is composed, so that the first-tenth thin plates P1-P10 having the first-eighth through holes H1-H8 having a prescribed shape are laminated to make the outside shape as a whole have a three-dimensional shape, and the first-eighth through holes H1-H8 in the first-eighth thin plates P1-P8 as a whole form a fluid passage W communicating three-dimensionally with the inside of the main part 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a mold and a method for manufacturing the mold, and more specifically, a mold and a method for manufacturing the mold that can quickly and uniformly control a molding surface (cavity) and efficiently obtain a uniform molded product. About.

  As a mold used for molding various molded products, rapid and uniform temperature control of the molding surface (cavity) is required in order to efficiently obtain a uniform molded product.

In response to such a request, for example, a general image of a mold in which a thin plate cut by a laser is laminated (diffusion bonding) to form a flow path is disclosed (see Patent Document 1). Further, a blow molding die is disclosed in which a flow path is formed by forming a rib between the mold surface and the opposite surface (see Patent Document 2).
Japanese Patent Laid-Open No. 11-314229 Japanese Patent Application Laid-Open No. 07-314543

  The present invention has been made in view of the above-described background art, and is capable of rapid and homogeneous temperature control of a molding surface (cavity), and a mold capable of efficiently obtaining a uniform molded product and its manufacture. It aims to provide a method.

  In order to achieve the above object, the present invention provides the following mold and a method for producing the same.

[1] It is composed of a main body having a molding surface and a predetermined three-dimensional shape. The main body is formed by laminating a plurality of thin plates having through holes of a predetermined shape, and the outer shape of the main body is as a whole. A mold having the three-dimensional shape and configured so that the through-hole of the thin plate forms a fluid channel that communicates three-dimensionally with the interior of the main body as a whole. .

[2] The mold according to [1], wherein the fluid channel is disposed in the vicinity of the molding surface of the main body.

[3] The mold according to [1], wherein the fluid flow path has a fluid inlet and a fluid outlet that open to the outside.

[4] The mold according to [3], wherein the fluid mixing means is disposed in the vicinity of the fluid inlet.

[5] The mold according to [2], wherein the fluid flow path is configured by two or more kinds of mutually independent paths.

[6] The mold according to [1], which is formed from a hard material that is difficult to mechanically process.

[7] The mold according to [6], wherein the hard material is a carbon-based material or tungsten carbide (WC).

[8] Having through holes of a predetermined shape and being laminated, the through hole has a three-dimensional communication with the inside so that the outer shape has a predetermined three-dimensional shape as a whole and has a molding surface. A first step of forming a plurality of thin plates constituting the main body so as to form a fluid flow path; and a second step of forming the fluid flow path by laminating the thin plates having the through holes. A process for producing a mold, comprising the steps of:

[9] In the first step, a thin plate forming substrate is prepared, a thin plate forming member is disposed on the thin plate forming substrate, the through hole having a predetermined shape is formed in the thin plate forming member, and a thin plate is formed. In the second step, a counter substrate is prepared, and a plurality of the thin plates are sequentially transferred and bonded from the thin plate forming substrate to the counter substrate in a vacuum or an inert gas atmosphere. The method for producing a mold according to [8], characterized in that it is characterized in that

[10] The method for manufacturing a mold according to [8], wherein the thin plate is formed of a hard material that is difficult to mechanically process.

[11] The method for manufacturing a mold according to [10], wherein the hard material is a carbon-based material or tungsten carbide (WC).

  With the mold according to claim 1 of the present invention, the temperature of the molding surface (cavity) can be quickly and uniformly controlled, and a homogeneous molded product can be obtained efficiently.

  The molding die according to claim 2 of the present invention makes it possible to control the temperature of the molding surface (cavity) more quickly and uniformly.

  With the molding die according to claim 3 of the present invention, the fluid can be smoothly recirculated through the flow path, and the temperature of the molding surface (cavity) can be controlled quickly and reliably.

  With the mold according to claim 4 of the present invention, the molding surface (cavity) can be quickly and uniformly controlled within a desired temperature range.

  With the molding die according to claim 5 of the present invention, for example, two kinds of fluids for cooling and heating can be appropriately refluxed, and fine temperature control of the molding surface (cavity) becomes possible.

  In the case of the mold according to claim 6 of the present invention, the fluid flow path is not formed by mechanical processing, and therefore the fluid flow path can be formed easily and reliably. Therefore, the mold according to claim 6 of the present invention is particularly effective when the mold is formed from such a hard material that is difficult to machine. Note that the present invention is effective even when the mold is not made of a hard material. That is, when forming a three-dimensional fluid flow path by mechanical processing, for example, batch continuous processing such as vertical and horizontal is difficult, and thus an operation to close holes is necessary, but in the case of the present invention, This is effective because mechanical processing is not required.

  In the case of the mold according to claim 7 of the present invention, that is, when the above-mentioned hard material is specifically a carbon-based material or tungsten carbide (WC), the fluid flow path is easily and reliably formed. be able to.

  By the method for manufacturing a mold according to claim 8 of the present invention, it is possible to quickly and uniformly control the temperature of the molding surface (cavity), and efficiently obtain a mold capable of manufacturing a homogeneous molded product. be able to.

  By the method for manufacturing a mold according to claim 9 of the present invention, the above-described mold can be obtained easily and reliably.

  In the case of the mold manufacturing method according to the tenth aspect of the present invention, since the fluid flow path is not formed by mechanical processing, the fluid flow path can be formed easily and reliably. Therefore, the present invention is particularly effective when forming a mold from such a hard material that is difficult to machine.

  In the case of the mold manufacturing method according to the eleventh aspect of the present invention, that is, when a carbon-based material or tungsten carbide (WC) is specifically used as the hard material, the fluid flow path can be simply and reliably. Can be formed.

  The mold according to the present embodiment includes a main body portion having a molding surface and a predetermined three-dimensional shape, and the main body portion is formed by laminating a plurality of thin plates having through holes of a predetermined shape, thereby forming an outer shape of the main body portion. The thin plate has a three-dimensional shape as a whole, and the thin plate through hole forms a fluid flow channel that communicates three-dimensionally with the interior of the main body as a whole, preferably in the vicinity of the molding surface. It is possible to configure so that the path is arranged, the temperature of the molding surface (cavity) can be quickly and uniformly controlled, and a homogeneous molded product can be efficiently manufactured.

[First Embodiment]
FIG. 1 is a perspective view showing a mold according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of FIG.

  As shown in FIG. 1, the molding die 10 of the present embodiment includes a main body 1 having a molding surface S and a predetermined three-dimensional shape. Moreover, as shown in FIG. 2, the main-body part 1 does not have eight through the 1st-8th through-holes H1-H8 (1st-8th thin plates P1-P8) of a predetermined shape, and a through-hole. A total of ten 1st to 10th thin plates P1 to P10 of 2 sheets (9th to 10th thin plates P9 to P10) are laminated so that the outer shape of the main body 1 has a three-dimensional shape as a whole. And it is comprised so that the 1st-8th through-hole H1-H8 in the 1st-8th thin plates P1-P8 may form the fluid flow path W which communicates the inside of the main-body part 1 as a whole. ing.

  In the present embodiment, the fluid flow path W is configured to be disposed in the vicinity of the molding surface S in the main body 1 and has a fluid inlet 11 and a fluid outlet 12 that open to the outside. For example, the shortest distance between the molding surface of the mold 10 and the fluid flow path W is preferably 0.1 mm or less, and the diameter of the fluid path W is preferably 0.1 mm or less. Here, “in the vicinity of the molding surface S” means that the distance from the molding surface is preferably 0.1 mm or less as described above. When this “near the molding surface S” is expressed by the number of laminated thin plates, depending on the thickness of the thin plate, if the thickness of the thin plate is several tens of μm, about 1 to 3 sheets of the thin plate from the molding surface S It means a separated area. Furthermore, it is preferable that the shaping | molding die 10 of this Embodiment can endure a high voltage | pressure (for example, 50-80 Mpa).

  In this case, of the first to eighth through holes H1 to H8 formed in the first to eighth thin plates P1 to P8, for example, the upper and lower ends of the fluid flow path (for example, The eighth through hole H8) or the like may be a recess without being completely penetrated. Moreover, it is good also as a through-hole of the structure which added the recessed part to the one part periphery of the through-hole. Further, the first to tenth thin plates P1 to P10 are preferably bonded by room temperature bonding. Here, “room temperature bonding” refers to direct bonding of atoms at room temperature. According to the room temperature bonding, there is little change in the shape and thickness of the first to tenth thin plates P1 to P10, and a highly accurate mold can be obtained.

  As materials for the first to tenth thin plates P1 to P10, metals such as Al, Ni, and Cu, and nonmetals such as ceramics and silicon can be used. Among non-metals, it is most effective when formed from a hard material (for example, carbon-based material, tungsten carbide (WC), etc.) that is difficult to machine. Before joining the first to tenth thin plates P1 to P10, it is preferable to clean the surfaces by irradiating the surfaces with a neutral atom beam, an ion beam or the like. By cleaning, the surface is activated and a strong bond can be obtained.

(Manufacturing method of the first embodiment)
The manufacturing method of the shaping | molding die 10 which concerns on 1st Embodiment is demonstrated with reference to FIG.3 and FIG.4. 3A and 3B show a process of arranging a thin plate on a thin plate forming substrate, wherein FIG. 3A is a plan view and FIG. 3B is a cross-sectional view taken along line BB in FIG. 4A and 4B are explanatory views showing a thin plate transfer process using a bonding apparatus, wherein FIG. 4A shows a FAB treatment process, FIG. 4B shows a thin plate joining process, and FIG. 4C shows a thin plate peeling process.

(First step)
As shown in FIGS. 3A and 3B, first, a thin plate forming substrate 21 made of an iron-based metal such as stainless steel or a non-ferrous metal such as copper is prepared. The thickness of the thin plate forming substrate 21 is usually 0.1 to 5 mm, preferably 0.5 to 1 mm.

  Next, the surface of the thin plate forming substrate 21 is mirror-polished. This polishing is performed in a plurality of steps from rough polishing to final polishing using electrolytic polishing, mechanical polishing with loose abrasive grains, or the like. Finally, the surface roughness (arithmetic mean roughness Ra) is usually 10 nm or less, preferably 5 nm or less. The smaller the surface roughness, the lower the adhesion after pattern formation, and the yield of subsequent bonding transfer is improved. However, if it is too small, unexpected film detachment may occur during electroforming growth, cleaning after growth, or resist stripping process. Accordingly, the surface roughness is preferably about 3 to 5 nm.

  The surface roughness can be measured using an atomic force microscope (AFM), a white interferometer, a stylus type surface profiler, or the like.

  Next, a thick film resist is applied to a thickness of, for example, 30 μm on the mirror-polished surface of the thin plate forming substrate 21 to form a resist film (not shown).

  Next, a photomask (not shown) having a predetermined pattern is placed on the resist film. Next, the resist film is exposed through the opening of the photomask by exposure means (not shown). As a result, a resist pattern (not shown) by positive / negative reversal is formed corresponding to the cross-sectional pattern of the target mold.

  Next, as shown in FIGS. 3A and 3B, the thin plate forming substrate 21 is immersed in a plating bath, and the first to eighth through holes H1 to H8 are formed by nickel by electrolytic plating. Ten thin plates P1 to P10 are grown to a thickness of 25 μm, for example. The first to tenth thin plates P1 to P10 may be formed using nickel alloy, copper, copper alloy or the like instead of nickel.

(Second step)
First, as shown in FIG. 4A, the thin plate forming substrate 21 is fixed to the flat stage 35 in the vacuum chamber 31, and the counter substrate 37 is fixed to the counter stage 36. A vacuum pump (not shown) is driven in the vacuum chamber 31 to exhaust from the exhaust port 32 to make a vacuum of 10 ⁻⁵ Pa. Next, a FAB (Fast Atom Beam) made of Ar neutral beam is applied from the FAB source 34A to the counter substrate 37, and from the FAB source 34B to the first thin plate P1 on the thin plate forming substrate 21 (stacked in the lowermost layer). Irradiate to clean and activate the surface.

  Next, as shown in FIG. 4B, the vertical stage 38 is lowered, and the flat stage 35 is moved in the horizontal x direction, the y direction, and the θ direction around the vertical z axis, and the counter substrate 37 and the first stage are moved. The thin plate P1 is aligned. A goniometer mechanism or a ball joint mechanism can be used as the alignment mechanism.

Next, the counter substrate 37 and the first thin plate P1 are brought into contact with each other, and further pressed with a load of 50 kgf / cm ² for 5 minutes to bond the counter substrate 37 and the first thin plate P10. At this time, the bonding strength is 50 to 100 MPa.

  Next, as shown in FIG. 4C, when the vertical stage 38 is raised, the first thin plate P <b> 1 is transferred onto the counter substrate 37. The first thin plate P1 can be transferred from the thin plate forming substrate 21 (release layer 22) side to the counter substrate 37 side in this manner because the adhesive force between the first thin plate P1 and the release layer 22 is greater than that of the first thin plate P1. This is because the adhesive force between the thin plate P1 and the counter substrate 37 is larger. Next, the same operation is sequentially performed on the second to tenth thin plates P2 to P10. The mold 10 shown in FIG. 1 can be obtained by performing the transfer 10 times.

[Second Embodiment]
FIG. 5: shows the shaping | molding die concerning the 2nd Embodiment of this invention, (a) is a top view, (b) is CC sectional view taken on the line of (a), (c) is (a). It is the DD sectional view taken on the line. FIG. 6 is a plan view showing the shape of the thin plate on the thin plate forming substrate, where (a) is the first to third thin plates (all can be the same shape), and (b) is the fourth. (C) shows the shape of the fifth thin plate, and (d) shows the shape of the sixth thin plate.

  As shown in FIG. 5, the molding die 50 of the present embodiment includes a main body 1 having a molding surface S and a predetermined three-dimensional shape. The main body 1 is formed by laminating six first to sixth thin plates P1 to P6 having first to fourth through holes H1 to H4 (see FIG. 6) having a predetermined shape. A fluid flow path in which the first to fourth through holes H1 to H4 (see FIG. 6) communicate with each other in a three-dimensional manner as a whole so as to have the three-dimensional shape shown in FIG. 5 as a whole. It is comprised so that W may be formed.

  In the present embodiment, the fluid flow path W is configured to be disposed in the vicinity of the molding surface S in the main body 1 and has a fluid inlet 11 and a fluid outlet 12 that open to the outside.

  Thus, in the mold 50 according to the second embodiment, the main path of the fluid flow path W is the fourth through hole H4 in the fourth thin plate P4 (FIGS. 5B and 6B). Reference) is different from the mold 10 according to the first embodiment in that it is concentrated in a planar manner, but the other components are configured in the same manner.

(Manufacturing method of the second embodiment)
About the manufacturing method of the shaping | molding die 50 which concerns on 2nd Embodiment, it can be made to be the same as that of the case of the shaping | molding die 10 which concerns on 1st Embodiment. That is, on the thin plate forming substrate 21 (release layer 22), the first to fourth through holes H1 to H4 (these first to fourth through holes H1 to H4 communicate three-dimensionally as a whole. The first to sixth thin plates P1 to P6 having the fluid flow path W to be formed are disposed (see FIG. 3B and FIG. 6). Next, the first thin plate P1 is transferred from the thin plate forming substrate 21 (release layer 22) side to the counter substrate 37 side, and the same operations are sequentially performed on the second to sixth thin plates P2 to P6. A mold 50 shown in FIG. 5 can be obtained by performing the transfer six times.

[Other embodiments]
The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. Moreover, it is possible to combine arbitrarily the component of each embodiment within the range which does not change the summary of this invention.

  For example, a fluid mixing means (for example, a three-way valve) may be disposed in the vicinity of the fluid inlet 11. By comprising in this way, it becomes possible to control a molding surface (cavity) rapidly and uniformly to a desired temperature range.

  FIG. 7 is an explanatory view showing an embodiment in which a fluid flow path is constituted by two kinds of mutually independent paths. As shown in FIG. 7, the fluid flow path W includes two kinds of mutually independent paths (cooling fluid flow path Wa and heating fluid flow path Wb). The fluid in the cooling fluid flow path Wa flows in from the cooling inlet 11a and flows out of the cooling outlet 12a. Moreover, the fluid in the case of the heating fluid flow path Wb flows in from the heating inlet 11b and flows out from the heating outlet 12b. With this configuration, for example, two kinds of fluids for cooling and heating can be appropriately refluxed, and fine temperature control of the molding surface (cavity) can be achieved.

  Further, in the transfer step, it is possible to enclose other component gases at an arbitrary pressure by performing bonding in a different gas atmosphere without bonding the thin plates in a vacuum atmosphere. Any gas can be used as long as it is inert with respect to the activated surface. In particular, since the rare gas is inert with respect to any material, it can be sealed regardless of the material. Further, when Ar gas used also in the neutral atom beam source is sealed, the gas inlet can be omitted by substituting the neutral atom beam source as the gas inlet.

  The thin plate forming substrate 21 and the counter substrate 37 may be wafer-shaped or chip-shaped, and the two types of substrates do not need to have the same shape. The thin plate forming substrate 21 may be provided on the vertical stage side.

  In the above embodiment, the adhesive force of the thin plate is adjusted on the thin plate forming substrate 21 side, but may be performed on both the thin plate forming substrate 21 side and the counter substrate 37 side, or may be performed only on the counter substrate 37 side. Further, when the thin plate forming substrate 21 is a metal, the thin plate forming substrate 21 in which the adhesion is controlled by controlling the electroforming conditions may be manufactured.

  INDUSTRIAL APPLICABILITY The present invention is effectively used in various industrial fields that require a mold used for molding various molded products, particularly a mold composed of a hard material that is difficult to machine.

It is a perspective view which shows the shaping | molding die concerning the 1st Embodiment of this invention. It is the sectional view on the AA line of FIG. The process of arrange | positioning a thin plate on a thin plate formation board | substrate is shown, (a) is a top view, (b) is the BB sectional drawing of (a). It is explanatory drawing which shows the transfer process of the thin plate using a joining apparatus, (a) shows the FAB process, (b) shows the joining process of a thin plate, (c) shows the peeling process of a thin plate, respectively. The shaping | molding die concerning the 2nd Embodiment of this invention is shown, (a) is a top view, (b) is CC sectional view taken on the line of (a), (c) is DD of (a). It is line sectional drawing. It is a top view which shows the shape of the thin plate on a thin plate formation board | substrate, (a) is the 1st-3rd thin plate, (b) is the 4th thin plate, (c) is the 5th thin plate, (d) is the 1st 6 shows the shape of each thin plate. It is explanatory drawing which shows embodiment which comprised the fluid flow path from 2 types of mutually independent paths | routes.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Main-body part 10 Mold 11 Fluid inlet 11a Cooling inlet 11b Heating inlet 12 Fluid outlet 12a Cooling outlet 12b Heating outlet 21 Thin plate formation board 30 Joining device 31 Vacuum tank 32 Exhaust port 34A, 34B FAB source 35 Planar stage 36 Opposite stage 37 Opposite Substrate 38 Vertical stage 50 Mold D S Forming surface P1 First thin plate P2 Second thin plate P3 Third thin plate P4 Fourth thin plate P5 Fifth thin plate P6 Sixth thin plate P7 Seventh thin plate P8 Eightth thin plate P9 9th thin plate P10 10th thin plate H1 1st through-hole H2 2nd through-hole H3 3rd through-hole H4 4th through-hole H5 5th through-hole H6 6th through-hole H7 7th Through hole H8 Eighth through hole H9 Ninth through hole H10 Tenth through hole W Fluid channel Wa Cooling fluid channel Wb Heating fluid channel

Claims (11)

Consists of a main body having a molding surface and a predetermined three-dimensional shape,
The main body is formed by laminating a plurality of thin plates having through holes of a predetermined shape so that the outer shape of the main body has the three-dimensional shape as a whole, and the through holes of the thin plate as a whole A molding die configured to form a fluid flow path that three-dimensionally communicates with the inside of the main body.   The molding die according to claim 1, wherein the fluid flow path is disposed in the vicinity of the molding surface of the main body.   The mold according to claim 1, wherein the fluid flow path has a fluid inlet and a fluid outlet that are open to the outside.   4. The mold according to claim 3, wherein the fluid mixing means is disposed in the vicinity of the fluid inlet.   3. The mold according to claim 2, wherein the fluid flow path is composed of two or more kinds of mutually independent paths.   The mold according to claim 1, wherein the mold is made of a hard material that is difficult to machine.   The mold according to claim 6, wherein the hard material is a carbon-based material or tungsten carbide (WC). A fluid flow path having a through hole of a predetermined shape and having a molding surface and an outer shape having a predetermined three-dimensional shape as a whole and the through hole communicating three-dimensionally inside as a whole by being laminated. A first step of forming a plurality of thin plates that will constitute the main body so as to form
And a second step of forming the fluid flow path by laminating thin plates having the through-holes.   In the first step, a thin plate forming substrate is prepared, a thin plate forming member is disposed on the thin plate forming substrate, the through hole having a predetermined shape is formed in the thin plate forming member, and the thin plate is formed. In step 2, a counter substrate is prepared, and a plurality of the thin plates are sequentially transferred from the thin plate forming substrate to the counter substrate in a vacuum or in an inert gas atmosphere, and laminated by bonding. The manufacturing method of the shaping | molding die of Claim 8.   The method for manufacturing a mold according to claim 8, wherein the thin plate is formed of a hard material that is difficult to mechanically process.   The method for manufacturing a mold according to claim 10, wherein the hard material is a carbon-based material or tungsten carbide (WC).

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