JP2008042512A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008042512A5 JP2008042512A5 JP2006214054A JP2006214054A JP2008042512A5 JP 2008042512 A5 JP2008042512 A5 JP 2008042512A5 JP 2006214054 A JP2006214054 A JP 2006214054A JP 2006214054 A JP2006214054 A JP 2006214054A JP 2008042512 A5 JP2008042512 A5 JP 2008042512A5
- Authority
- JP
- Japan
- Prior art keywords
- glass
- metal
- electronic component
- glass substrate
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 2
- 239000007769 metal material Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000005422 blasting Methods 0.000 claims 1
- 238000005219 brazing Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 230000000149 penetrating Effects 0.000 claims 1
- 230000002093 peripheral Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000001629 suppression Effects 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006214054A JP2008042512A (ja) | 2006-08-07 | 2006-08-07 | 電子部品用パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006214054A JP2008042512A (ja) | 2006-08-07 | 2006-08-07 | 電子部品用パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008042512A JP2008042512A (ja) | 2008-02-21 |
JP2008042512A5 true JP2008042512A5 (fr) | 2009-07-23 |
Family
ID=39177047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006214054A Pending JP2008042512A (ja) | 2006-08-07 | 2006-08-07 | 電子部品用パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2008042512A (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5230330B2 (ja) * | 2008-09-30 | 2013-07-10 | シチズンファインテックミヨタ株式会社 | 圧電デバイス |
WO2010097900A1 (fr) * | 2009-02-25 | 2010-09-02 | セイコーインスツル株式会社 | Procédé de production de boîtier, procédé de fabrication de transducteur piézoélectrique, oscillateur, dispositif électronique et appareil horaire radiopiloté |
JP5577671B2 (ja) * | 2009-10-23 | 2014-08-27 | 富士通株式会社 | 圧電振動子の製造方法 |
JP5499651B2 (ja) * | 2009-11-20 | 2014-05-21 | セイコーエプソン株式会社 | 圧電素子用のパッケージ、圧電部品 |
KR101609888B1 (ko) * | 2010-04-22 | 2016-04-06 | 엘지전자 주식회사 | 휴대용 디스플레이 장치 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5438791A (en) * | 1977-09-01 | 1979-03-23 | Seiko Instr & Electronics Ltd | Piezoelectroc vibrator containing case |
JPH01209810A (ja) * | 1988-02-17 | 1989-08-23 | Matsushita Electric Ind Co Ltd | 圧電振動子およびその周波数微調整方法 |
JPH02137511A (ja) * | 1988-11-18 | 1990-05-25 | Nippon Electric Glass Co Ltd | 気密シール用パッケージ |
JP2002124845A (ja) * | 2000-08-07 | 2002-04-26 | Nippon Sheet Glass Co Ltd | 水晶振動子パッケージ及びその製造方法 |
JP2003209198A (ja) * | 2001-11-09 | 2003-07-25 | Nippon Sheet Glass Co Ltd | 電子部品パッケージ |
JP2004096721A (ja) * | 2002-07-10 | 2004-03-25 | Seiko Epson Corp | 圧電振動子用パッケージ並びに圧電振動子および圧電デバイス |
JP2005057520A (ja) * | 2003-08-05 | 2005-03-03 | Matsushita Electric Ind Co Ltd | 超小型水晶振動子パッケージ |
-
2006
- 2006-08-07 JP JP2006214054A patent/JP2008042512A/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4456503B2 (ja) | 電子部品の製造方法 | |
JP2003086737A5 (fr) | ||
TW200701275A (en) | Ceramic electronic component and manufacturing method thereof | |
TW200721410A (en) | Integrated circuit device incorporating metallurigacal bond to enhance thermal conduction to a heat sink | |
US8933386B2 (en) | Optical sensor device and method of manufacturing the same | |
TW200731431A (en) | Semiconductor device and manufacturing method therefor | |
JP2008042512A5 (fr) | ||
JP4134893B2 (ja) | 電子素子パッケージ | |
EP1906452A4 (fr) | Dispositif semi-conducteur et procédé pour le fabriquer | |
JP2006245382A (ja) | 機能素子実装モジュール及び機能素子実装モジュールの実装方法 | |
EP2009971A4 (fr) | Couche de brasage, substrat pour jonction de dispositif utilisant ladite couche, et processus de fabrication du substrat | |
CN111128912A (zh) | 封装结构及其制备方法 | |
JP2006517348A5 (fr) | ||
TW200802658A (en) | Manufacturing method of wiring substrate | |
TW200729368A (en) | Method of manufacturing electronic circuit device | |
TW201818480A (zh) | 半導體器件封裝及製造其之方法 | |
JP2006512765A5 (fr) | ||
JP2009260049A5 (fr) | ||
JP2004318074A5 (fr) | ||
JP2009077341A5 (fr) | ||
JP2005286284A (ja) | 機能素子実装モジュール並びに光機能素子実装モジュール及びその製造方法 | |
JP2010093675A5 (fr) | ||
JP2007214307A5 (fr) | ||
JP2007080884A5 (fr) | ||
JP4471015B2 (ja) | 電子素子パッケージ |