JP2008034828A - Multilayer ceramic substrate used for integrated circuit (ic) inspection jig device, and manufacturing method of multilayer ceramic substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of multilayer ceramic substrate by which a multilayer ceramic substrate having high dimensional accuracy can be manufactured, and to provide a multilayer ceramic substrate used for an integrated circuit (IC) inspection jig device. <P>SOLUTION: A first green sheet 21 is sintered into a first sintered substrate 3. Then a via hole 23 is formed in the first sintered substrate 3. Then the via hole 23 is filled with electrically conductive paste 25. Then a via 9 is formed by sintering the electrically conductive paste 25. Then a first laminate 31 is obtained by laminating three second green sheets 27 on one side surface of the first sintered substrate 3. Then a second laminate 35 is formed by laminating a contraction suppression sheet 33 on upper and under surfaces of the first laminate 31 respectively. Then a sintered laminate 36 is obtained by pressing and sintering the second laminate 35. Then, inorganic composition remaining on upper and under surfaces of the sintered laminate 36 is removed and both the surfaces of the laminate 36 are polished. Then an electrode 11 is formed on both the polished surfaces respectively. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention manufactures a multilayer ceramic substrate using a multilayer ceramic substrate used in an IC inspection jig and a so-called “non-shrinkable firing process” that substantially prevents shrinkage in the planar direction during firing. The present invention relates to a method for manufacturing a multilayer ceramic substrate.

2. Description of the Related Art Conventionally, in order to inspect the function of an IC, a ceramic IC inspection jig that performs inspection by bringing an electrode into contact with each terminal of the IC has been used.
As this kind of IC inspection jig, for example, a multi-layer ceramic substrate made of alumina is provided with a large number of electrodes, and the back and front electrodes are connected by vias.

As techniques for manufacturing the multilayer ceramic substrate described above, for example, the following techniques (1) and (2) have been proposed.
(1) For example, in the technique of Patent Document 1, the first green sheet is fired to form a sintered ceramic body, a conductor is formed on the sintered ceramic body, and then the second green sheet is laminated. A multilayer body is formed, and the multilayer body is fired to produce a multilayer ceramic substrate.

(2) Also, in the technique of Patent Document 2, a laminate is formed by laminating an unfired ceramic green sheet on one or both sides of a fired ceramic substrate, and the surface of the outermost ceramic green sheet of the laminate is made. A constraining green sheet is laminated, and the laminate is fired with or without pressurization, and after firing, the residue of the constraining layer is removed to produce a multilayer ceramic substrate.
JP 2002-344138 A JP 2003-158375 A

However, the above-described technique has the following problems and is not necessarily preferable.
That is, in the technique of Patent Document 1, firing is performed after forming a via hole in the first green sheet. Therefore, since the first green sheet is sintered while contracting in the plane direction, high dimensional accuracy cannot be obtained. As a result, there is a problem that the dimensional accuracy of the obtained substrate is not always sufficient even when the second green sheet to be bonded is laminated and fired.

  On the other hand, in the technique of Patent Document 2, thick film conductors and thick film resistors are formed by simultaneous firing or retrofitting on a fired substrate, but there is no description about a manufacturing method for forming a via hole in the fired substrate. . Further, peeling of the sintered layers of the fired substrate and the unfired green sheet and deformation of the cavity portion are described, but there is no mention of dimensional accuracy of the fired substrate itself.

  The present invention has been made in view of the above problems, and a multilayer ceramic substrate manufacturing method capable of manufacturing a multilayer ceramic substrate with high dimensional accuracy, and a multilayer used in an IC inspection jig manufactured by the manufacturing method and the like. An object is to provide a ceramic substrate.

  (1) The invention according to claim 1 (a multilayer ceramic substrate used for an IC inspection jig) includes a first fired substrate and a second firing made of a material having a sintering temperature lower than that of the first fired substrate. A multilayer ceramic substrate in which the first fired substrate is laminated on at least one surface of both surfaces of the second fired substrate, wherein at least one of the first fired substrates is provided. The surface roughness Ra of the outer surface on the non-laminated side among both surfaces of the baked substrate is 0.02 μm to 1.00 μm, and an electrode is provided on the outer surface.

  In the present invention, the surface roughness Ra of the outer surface of the first fired substrate laminated on one side or both sides of the second fired substrate is 0.02 μm to 1.00 μm, and the smooth outer surface thereof Therefore, when the inspection is performed by bringing the IC terminal into contact with the electrode on the outer surface, the electrical connection between the electrode and the terminal can be ensured.

Moreover, since the surface roughness Ra of the outer surface is as smooth as 0.02 μm to 1.00 μm, the adhesion strength of an electrode formed of a thin film conductor is particularly high and suitable.
In the present invention, the first baked substrate is laminated on one side or both sides of the second baked substrate. In particular, the first baked substrate is laminated on both sides. This is preferable because it is less deformed and is easy to manufacture (for example, a step such as removal of a shrinkage suppression sheet is unnecessary). In addition, when the first baked substrates are stacked on both sides, electrodes can be formed on the outer surfaces of both the first baked substrates.

(2) The invention of claim 2 is characterized in that vias electrically connected to the electrodes are formed in the first baked substrate.
In the present invention, the first baked substrate has a via electrically connected to the electrode on the outer surface (outer electrode), and therefore the outer electrode and the opposite side (substrate) through the via. The electrode on the back side can be electrically connected.

Therefore, the IC can be easily inspected by connecting the IC terminal to the outer electrode and connecting the inspection device to the back electrode.
(3) The invention of claim 3 is characterized in that the first baked substrate is provided with a restricting portion for restricting the movement of the via to the outer surface to prevent the via from being dropped.

  In the present invention, the first baked substrate is provided with a restricting portion (for example, a portion having a smaller diameter than the outer diameter of the via) that restricts the movement of the via toward the outer surface side (the direction of dropping from the outer surface). Therefore, the via can be prevented from falling off the outer surface.

(4) The invention of claim 4 is characterized in that the first baked substrate has a thickness of 1.0 mm or less.
The present invention exemplifies the thickness of the first baked substrate. When the thickness of the substrate is 1.0 mm or less, processing for forming a via hole by mechanical processing, laser processing, or the like is easy.

  (5) In the invention of claim 5, the electrode is composed of a single layer or a plurality of layers using different conductive metals for each layer, and the base layer in contact with the first baked substrate among the layers has a thickness. Is 0.02 μm to 0.8 μm.

In the present invention, since the thickness of the base layer which is a layer made of a conductive metal in contact with the first fired substrate is 0.02 μm to 0.8 μm, there is an advantage that the bonding strength of the electrode itself is high.
Here, in the case of a single layer (made of one kind of conductive metal), the single layer is a base layer, and in the case of a plurality of layers made of different conductive metals, the lowermost layer is a base layer.

  In addition, as an electrode, the lower conductive layer (laminated body of Ti layer, Cu layer, etc.) sequentially formed on the first fired substrate, for example, by sputtering or the like, and the lower conductive layer, for example, by electrolytic plating The structure of the upper conductive layer (lamination body, such as Cu layer, Ni layer, Au layer) formed sequentially is mentioned.

  (6) The invention of claim 6 (a method for producing a multilayer ceramic substrate) includes a step of firing a first green sheet to form a first fired substrate, and forming a via hole in the first fired substrate. A step of filling the via hole with a conductive paste, and bonding a first fired substrate filled with the conductive paste or fired after filling onto both surfaces of the second green sheet. Forming a laminated fired body by firing the first laminated body, and subjecting the first fired substrate in the laminated fired body to surface treatment for scraping the substrate surface. And a step of forming an electrode on the surface-treated surface of the first baked substrate.

  The present invention is a method of manufacturing a multilayer ceramic substrate having a first fired substrate on both sides of a second fired substrate. Here, since the via hole is formed in the first baked substrate, the first baked substrate itself (in particular, the position and shape of the via hole) has high dimensional accuracy. Furthermore, since the first fired substrate with high dimensional accuracy is laminated and fired on both sides of the second green sheet, it is difficult to deform as a whole, and thus the obtained multilayer ceramic substrate also has high dimensional accuracy.

As the second green sheet, one green sheet or a laminate of a plurality of green sheets can be employed (the same applies hereinafter).
(7) The invention of claim 7 (a method for producing a multilayer ceramic substrate) comprises a step of firing a first green sheet to form a first fired substrate, and a step of forming the first green sheet on both sides of the second green sheet. Laminating a first fired substrate to form a first laminated body, firing the first laminated body to form a laminated fired body, and the first surface of the laminated fired body. Forming a via hole in the fired substrate, a step of filling the via hole with a conductive paste, a step of firing a laminated fired body filled with the conductive paste, and the step of firing the conductive paste in the laminated fired body A step of performing a surface treatment on the first baked substrate, and a step of forming an electrode on the surface-treated surface of the first baked substrate. Multilayer ceramic Method of manufacturing the plate.

  The present invention is a method of manufacturing a multilayer ceramic substrate having a first fired substrate on both sides of a second fired substrate. Here, since the via hole is formed in the first fired substrate in the laminated fired body, the first fired substrate itself (especially the position and shape of the via hole) has a high dimensional accuracy as in the invention of claim 6. In addition, the finally obtained multilayer ceramic substrate also has high dimensional accuracy.

  (8) The invention of claim 8 (a method for producing a multilayer ceramic substrate) includes the step of forming a via hole in the first fired substrate, the step of filling the via hole with a conductive paste, and the filling of the conductive paste. Or a step of laminating a second green sheet on one surface of the first fired substrate fired after filling to form a first laminate, and at least a second of both surfaces of the first laminate. A step of laminating a shrinkage suppression sheet on the surface of the green sheet to form a second laminated body, a step of firing the second laminated body to form a laminated fired body, and the laminated fired body from Removing the unfired shrinkage suppression sheet, performing a surface treatment on the first fired substrate in the laminated fired body from which the shrinkage suppression sheet has been removed, cutting the substrate surface, 1 baked And forming an electrode on the surface treated surface of the substrate, characterized by comprising a.

  In the present invention, since the via hole is formed in the first baked substrate, the first baked substrate itself (in particular, the position and shape of the via hole) has high dimensional accuracy. Furthermore, since the second green sheet is laminated and fired on the first baked substrate with high dimensional accuracy, it is difficult to deform as a whole, and thus the obtained multilayer ceramic substrate also has high dimensional accuracy.

  (9) The invention of claim 9 (a method for producing a multilayer ceramic substrate) includes a step of firing a first green sheet to form a first fired substrate, and one surface of the first fired substrate. A step of laminating a second green sheet to form a first laminate, and laminating a shrinkage suppression sheet on at least the second green sheet side of both surfaces of the first laminate. A step of forming a second laminate, a step of firing the second laminate to form a laminate fired body, a step of removing the unfired shrinkage suppression sheet from the laminate fired body, and the shrinkage A step of forming a via hole in the first fired substrate in the laminated fired body from which the suppression sheet has been removed, a process of filling the via hole with a conductive paste, and a process of firing the laminated fired body filled with the conductive paste And said A step of surface-treating the surface of the first fired substrate in the laminated fired body after the electric paste is fired, and forming an electrode on the surface-treated surface of the first fired substrate. And a step of performing.

  In the present invention, since the via hole is formed in the first fired substrate in the laminated fired body, the first fired substrate itself (especially the position and shape of the via hole) has high dimensional accuracy as in the invention of claim 8. In addition, the finally obtained multilayer ceramic substrate also has high dimensional accuracy.

  (10) In the invention of claim 10, when the second laminate is formed, the shrinkage suppression sheet is laminated on the surface of the first baked substrate via a third green sheet. Features.

  In the present invention, since the third green sheet is disposed between the first baked substrate and the shrinkage suppression sheet, the first fired substrate and the shrinkage suppression sheet have high adhesion. This has the effect of preventing deformation and cracking of the fired substrate.

  (11) The invention of claim 11 is characterized in that the surface treatment method is at least one of abrasive grain polishing, grindstone polishing, barrel polishing, buffing, chemical etching, and heat treatment.

The present invention exemplifies a preferable surface treatment method.
In addition, when the difference in thermal expansion coefficient between the first baked substrate and the second baked substrate is 3 ppm / ° C. or less, at the interface between the first baked substrate and the second baked substrate. It is preferable because peeling does not easily occur.

  As a conductor (via conductor) used for the vias of the first fired substrate and the second fired substrate, for example, any of Ag-based, Ag / Pd-based, Ag / Pt-based, Cu-based, Cu / W-based Can be adopted.

As the first baked substrate or the second baked substrate, for example, any of Al ₂ O ₃ , ZrO ₂ , Si ₃ N ₄ , SiC, AlN, glass, glass and a ceramic filler composite material can be adopted. . Note that in the case where the first baked substrate is arranged on both sides of the second baked substrate, it is preferable that the first baked substrates on both sides have the same composition.

Embodiments of the present invention will be described below with reference to the drawings.
[First Embodiment]
a) First, a multilayer ceramic substrate obtained by the multilayer ceramic substrate manufacturing method of the present embodiment will be described with reference to FIG. FIG. 1 schematically shows a cross-sectional structure of a multilayer ceramic substrate.

  As shown in FIG. 1A, a multilayer ceramic substrate 1 is a laminated substrate used for an IC inspection jig, for example, and is mainly one of a first baked substrate 3 and a first baked substrate 3. And a second fired substrate 5 laminated on the surface (lower side of the figure).

  The second fired substrate 5 is composed of a plurality of ceramic layers 5A to 5C, and a wiring layer 7 is formed therein (surfaces of the ceramic layers 5A to 5C), and different ceramic layers are formed. A via 9 is formed so as to connect the wiring layers 7 of 5A to 5C. Similar vias 9 are also formed in the first baked substrate 3.

  Also, pads (electrodes) 11 electrically connected to specific vias 9 are formed on the front and back surfaces of the multilayer ceramic substrate 1. In the case of the multilayer ceramic substrate 1 for an IC inspection jig, a specific electrode 11 among the upper and lower electrodes 11 is electrically connected.

  The first fired substrate 3 is made of alumina (95% by weight), for example, and the second fired substrate 5 is a material having a lower sintering temperature (and hence firing temperature) than the first fired substrate 3. Made of low-temperature fired glass ceramic. The second fired substrate (low temperature fired glass ceramic) 5 is obtained by firing a mixture of a glass component and a ceramic component at a low temperature of about 800 to 1050 ° C., for example. The first baked substrate 3 is baked at a high temperature, for example, 1300 to 1600 ° C., which is higher than the baking temperature of the second baked substrate 5.

  In addition, the wiring layer 7 and the via 9 are formed from a conductor obtained by baking an Ag-based paste, for example, and the electrode 11 is formed by sputtering, vapor deposition, electrolytic plating, electroless plating, etc., for example, Ti, Mo, It consists of different conductive metals (thin film conductors) such as Cu, Ni and Au.

  As shown in FIG. 1B, the electrode 11 is formed on the first fired substrate 3 by the lower conductive layer 13 formed by sputtering and on the lower conductive layer 13 by electrolytic plating. The upper conductive layer 15 is formed. Specifically, the lower conductive layer 13 is formed in the order of the Ti layer 13A and the Cu layer 13B (from the lower side), and the upper conductive layer 15 is formed of the Cu layer 15A, the Ni layer 15B, and the Au layer 15C (from the lower side). It is formed in order. Here, the Ti layer 13A as the base layer in the lower conductive layer 13 is in contact with the first fired substrate 3, and the thickness of the lowermost Ti layer 13A is 0.02 μm to 0.8 μm.

  In particular, in the present embodiment, the first baked substrate 3 has a thickness of 1.0 mm or less, and the surface roughness Ra of the outer surface (upper side in the figure) on the non-laminated side among the surfaces is: It is processed very smoothly from 0.02 μm to 1.00 μm by polishing.

b) Next, the manufacturing method of the multilayer ceramic substrate 1 of this embodiment is demonstrated in detail based on FIG.
First, as shown in FIG. 2A, alumina powder (average particle size: 3 μm, specific surface area: 1.0 m ² / g) is prepared as a raw material powder for manufacturing the first fired substrate 3 did. Also,
As a binder component and a plasticizer component for forming a ceramic green sheet, an acrylic binder and DOP (di-octyl phthalate) were prepared.

  Then, in order to obtain the first baked substrate 3 of 95% by weight of alumina, appropriate amounts of acrylic resin (binder), solvent, and plasticizer (DOP) are added to the predetermined amount of the alumina powder, and the alumina pot is added to the alumina pot. The ceramic slurry was obtained by mixing for 5 hours.

A first green sheet 21 was obtained by the doctor blade method using the obtained ceramic slurry.
Next, as shown in FIG. 2B, the first green sheet 21 was fired at 1500 ° C. to produce a first fired substrate 3 of 95% by weight of alumina. The thickness is 0.5 mm.

Next, as shown in FIG. 2C, a via hole 23 that is a through hole was formed in the first baked substrate 3. The via hole 23 can be formed by, for example, a CO ₂ laser, a YAG laser, blast processing, or mechanical processing.

Next, as shown in FIG. 2D, the via hole 23 was filled with a conductive paste 25 made of, for example, an Ag-based paste.
Next, as shown in FIG. 2 (e), the first baked substrate 3 filled with the conductive paste 25 was heated to 800 to 900 ° C., and the conductive paste 25 was baked to form the vias 9. Note that this step can be omitted when the conductive paste 25 is fired in a later step.

Next, as shown in FIG. 2 (f), three second green sheets 27 </ b> A to 27 </ b> C (generally referred to as 27) are provided on one surface (lower side of the figure) of the first fired substrate 3. Laminated.
Specifically, first, as a raw material powder for forming the second fired substrate 5, a borosilicate glass powder containing SiO ₂ , Al ₂ O ₃ , and B ₂ O ₃ as main components (average particle diameter: 3 μm, specific surface area: 1.0 m ² / g) and alumina powder (average particle size: 3 μm, specific surface area: 1.0 m ² / g) were prepared. In addition, an acrylic binder and DOP (di-optical phthalate) were prepared as a binder component and a plasticizer component.

  Then, the borosilicate glass powder and the alumina powder are weighed so that the weight ratio is 50:50 and the total amount is 1 kg, and the acrylic resin (binder), solvent, and plasticizer (DOP) An appropriate amount was added and mixed for 5 hours in an alumina pot to obtain a ceramic slurry.

  Three green sheets (green sheets for low-temperature firing) 27A to 27C were obtained by the doctor blade method using the obtained ceramic slurry. Then, through holes (via holes) 23 were formed in these green sheets 27 </ b> A to 27 </ b> C by punching, and conductive paste 25 was filled in the via holes 23.

  Further, on the surface of each of the green sheets 27 </ b> A to 27 </ b> C, a wiring pattern 29 (which will later become the wiring layer 7) is printed by printing so as to cover the surface of the conductive paste 25 or the like using a printing paste similar to the conductive paste 25. Formed.

  And each green sheet 27A-27C is laminated | stacked to make the 2nd green sheet 27, and this 2nd green sheet 27 is laminated | stacked on one surface of the 1st baking completed board | substrate 3, and the 1st laminated body 31 was obtained. The green sheets 27 </ b> A to 27 </ b> C may be sequentially stacked on the first fired substrate 3.

  Next, as shown in FIG. 2G, shrinkage suppression sheets 33 </ b> A and 33 </ b> B (collectively referred to as 33) having vertical and horizontal dimensions similar to those of the first laminate 31 are formed on the upper and lower surfaces of the first laminate 31. Were stacked to form a second stacked body 35. The upper surface side shrinkage suppression sheet 33A may be omitted.

  The shrinkage suppression sheet 33 is manufactured by substantially the same material and process as the second green sheet 27, but the sintering temperature of the shrinkage suppression sheet 33 is higher than the sintering temperature of the second green sheet 27. The ingredients are slightly different. Specifically, the ratio of the acrylic resin is adjusted so that the shrinkage suppression sheet 33 is reduced so that the alumina component becomes 99% by weight or more.

  As a result, the shrinkage suppression sheet 33 does not sinter even at the temperature at which the second green sheet 27 is sintered, so that the shrinkage suppression sheet 33 can suppress shrinkage during the sintering of the second green sheet 27. Become.

Next, as shown in FIG. 2 (h), the second laminated body 35 was subjected to pressure firing under the conditions of temperature: 860 ° C. and pressure: 2 kg / cm ² to produce a laminated fired body 36. In this case, firing is possible without applying pressure.

  Next, as shown in FIG. 2 (i), the inorganic composition (residue of the shrinkage suppression sheet 33) remaining on the upper and lower surfaces of the laminated fired body 36 is removed by, for example, sandblasting, ultrasonic cleaning, brush cleaning, etc. Removed. Here, the laminate fired body 37 is obtained by removing the shrinkage suppression sheet 33.

Next, as shown in FIG. 2 (j), both surfaces of the laminated fired body 37 (or the surface of the first fired substrate 3) are polished, and the surface roughness Ra of the polished surface is 0.02 μm to It was 1.00 μm.
In addition, as this grinding | polishing method (surface treatment method), at least 1 sort (s) can be employ | adopted among abrasive grain grinding | polishing, grinding stone grinding | polishing, barrel grinding | polishing, buff grinding | polishing, chemical etching, and heat processing.

  Among these, as the abrasive polishing, a method of performing lapping polishing, dry blasting, or wet blasting using alumina abrasive grains or diamond abrasive grains can be employed. As the grinding wheel polishing, it is possible to employ a method of using an alumina grinding wheel and performing polishing with a surface grinding apparatus. As the barrel polishing, it is possible to employ a method of using an alumina polishing stone and performing a polishing process with a barrel polishing apparatus. As buffing, a method of using an alumina fiber buff and processing with a buffing machine can be employed. As chemical etching, a method of using hydrofluoric acid and performing surface processing by etching can be employed. As the heat treatment, a method of surface processing by heating to a predetermined temperature can be adopted.

  Next, as shown in FIG. 2 (k), sputtering, vapor deposition, electrolytic plating, electroless plating, etc. are performed on both surfaces of the polished laminated fired main body 37 (or the surface of the polished first fired substrate 3). The electrode 11 made of Ti, Mo, Cu, Ni, Au or the like was formed to complete the multilayer ceramic substrate 1.

  Specifically, as shown in FIG. 1B, a lower conductive layer 13 is formed by sputtering, and an electrode 11 is formed on the lower conductive layer 13 by forming an upper conductive layer 15 by electrolytic plating. did. In this case, the thickness of the Ti layer 13A as the base layer was set to 0.02 μm to 0.8 μm.

c) Next, a method of using the multilayer ceramic substrate 1 will be described with reference to FIG.
As schematically shown in FIG. 3, the multilayer ceramic substrate 1 described above is used as a substrate of an IC inspection jig 43 used for the inspection of the IC 41, and a terminal 45 is provided on the electrode 11 on one surface thereof. It has been.

  When the IC 41 is inspected using the IC inspection jig 43, the terminal 47 of the IC 41 is connected to the terminal 45 of the IC inspection jig 43. Then, an IC electrical characteristic inspection device 49 is connected to the electrode 11 on the other surface of the multilayer ceramic substrate 1 to inspect the IC 41.

  d) As described above, in the present embodiment, since the via hole 23 is formed in the first baked substrate 3 by mechanical processing, laser processing, or the like, the first baked substrate 3 itself (in particular, the position of the via 9 or Shape) has high dimensional accuracy. Furthermore, since the second green sheet 27 is laminated and fired on the first fired substrate 3 with high dimensional accuracy, the resulting multilayer ceramic substrate 1 also has high dimensional accuracy.

  Further, the surface roughness Ra of the outer surface of the first baked substrate 3 is 0.02 μm to 1.00 μm, and the electrode 11 is provided on the smooth outer surface. When the terminal 47 is contacted and inspected, the electrical connection between the electrode 11 and the terminal 47 can be ensured.

Furthermore, since the surface roughness Ra of the outer surface is as smooth as 0.02 μm to 1.00 μm, the adhesion strength of the electrode 11 formed of a thin film conductor is particularly high and suitable. Moreover, since the thickness of the Ti layer 13A that is the base layer of the electrode 11 is 0.02 μm to 0.8 μm, there is also an advantage that the bonding strength of the electrode is high from this point.
[Second Embodiment]
Next, the manufacturing method of the multilayer ceramic substrate of 2nd Embodiment is demonstrated based on FIG. The description of the same contents as in the first embodiment is omitted.

This embodiment is a method for manufacturing a multilayer ceramic substrate in which a third green sheet is disposed on the outer surface of the first fired substrate, and a shrinkage suppression sheet is disposed on the surface.
First, as shown in FIG. 4A, the first green sheet 51 was manufactured using the same material as in the first embodiment.

Next, as shown in FIG. 4 (b), the first green sheet 51 was fired to produce a first fired substrate 53.
Next, as shown in FIG. 4C, via holes 55 were formed in the first baked substrate 53.

Next, as shown in FIG. 4 (d), the via hole 55 was filled with a conductive paste 57.
Next, as shown in FIG. 4E, the first baked substrate 53 filled with the conductive paste 57 was heated, and the conductive paste 57 was baked to form the vias 59.

  Next, as shown in FIG. 4 (f), three second green sheets 61A to 61C (61 and 61) are formed on one surface of the first baked substrate 53, as in the first embodiment. 1st laminated body 63 was formed by laminating.

  Next, as shown in FIG. 4G, a third green sheet 65 made of the same material as the second green sheet 61 is formed on the surface of the first fired substrate 53 of the first laminate 63. Were laminated. The thickness of the third green sheet 65 is the same as that of the second green sheet 61A for one sheet.

  Then, shrinkage suppression sheets 67 </ b> A and 67 </ b> B (collectively referred to as 67) were laminated on the upper and lower surfaces of the first laminated body 63 in which the third green sheet 65 was laminated to form the second laminated body 69.

Next, as shown in FIG. 4H, the second laminate 69 was fired under pressure to produce a laminate fired body 70.
Next, as shown in FIG. 4 (i), the inorganic composition remaining on the upper and lower surfaces of the laminated fired body 70 was removed to obtain a laminated fired body 71.

  Next, as shown in FIG. 4 (j), both surfaces of the laminated fired body 71 (or the surface on the first fired substrate 53 side) were polished. By polishing the first fired substrate 53 side, the fired third green sheet 65 is completely removed, and a part of the outer surface of the first fired substrate 53 is removed.

  Next, as shown in FIG. 4 (k), electrodes 71 are formed on both surfaces of the polished laminated fired main body 71 (or the surface of the ground first fired substrate 53) to complete the multilayer ceramic substrate 73. did.

Also according to the present embodiment, the same effect as in the first embodiment is obtained, and the third green sheet 65 is disposed on the outer surface of the first baked substrate 53. The third green sheet 65 has an advantage of being firmly attached to the first stacked body 63.
[Third Embodiment]
Next, the manufacturing method of the multilayer ceramic substrate of 3rd Embodiment is demonstrated based on FIG. The description of the same contents as in the first embodiment is omitted.

The present embodiment is a method for manufacturing a multilayer ceramic substrate in which a via hole is formed after forming a laminated fired body.
First, as shown in FIG. 5A, a first green sheet 75 was manufactured using the same material as in the first embodiment.

Next, as shown in FIG. 5B, the first green sheet 75 was fired to produce a first fired substrate 77.
Next, as shown in FIG. 5C, three second green sheets 79A to 79C (79 and 79) are formed on one surface of the first baked substrate 77 in the same manner as in the first embodiment. 1st laminated body 81 was formed by laminating.

Next, as shown in FIG. 5D, the second laminate 85 is formed by laminating shrinkage suppression sheets 83A and 83B (referred to generically as 83) on the upper and lower surfaces of the first laminate 81. did.
Next, as shown in FIG. 5E, the second laminate 85 was fired under pressure to produce a laminate fired body 84.

Next, as shown in FIG. 5 (f), the inorganic composition remaining on the upper and lower surfaces of the laminated fired body 84 was removed to obtain a laminated fired body 86.
Next, as shown in FIG. 5G, via holes 87 were formed in the first baked substrate 77 on the surface of the laminated baked main body 86.

Next, as shown in FIG. 5H, the conductive paste 88 was filled in the via hole 87.
Next, as shown in FIG. 5I, the laminated fired body 86 filled with the conductive paste 88 was heated, and the conductive paste 88 was fired to form a via 89.

Next, as shown in FIG. 5 (j), both surfaces of the laminated fired body 86 (or the surface on the first fired substrate 77 side) were polished.
Next, as shown in FIG. 5 (k), electrodes 90 are formed on both surfaces of the polished laminated fired body 86 (or the surface of the ground first fired substrate 77), thereby completing the multilayer ceramic substrate 91. did.

Also according to the present embodiment, the same effects as those of the first embodiment can be obtained.
[Fourth Embodiment]
Next, the manufacturing method of the multilayer ceramic substrate of 4th Embodiment is demonstrated based on FIG. The description of the same contents as in the second embodiment will be omitted.

  In this embodiment, the third green sheet is disposed on the outer surface of the first fired substrate, the shrinkage suppression sheet is further disposed on the surface, and the multilayer ceramic is formed with the via hole after the laminated fired body is formed. A method for manufacturing a substrate.

First, as shown in FIG. 6A, a first green sheet 92 was manufactured using the same material as in the second embodiment.
Next, as shown in FIG. 6 (b), the first green sheet 92 was fired to produce a first fired substrate 93.

  Next, as shown in FIG. 6 (c), three second green sheets 95A to 95C (95 and 95) are formed on one surface of the first baked substrate 93 as in the second embodiment. 1st laminated body 97 was formed by laminating.

  Next, as shown in FIG. 6D, a third green sheet 98 made of the same material as the second green sheet 95 is formed on the surface of the first fired substrate 93 of the first laminate 97. Were laminated. The thickness of the third green sheet 98 is the same as that of the second green sheet 95A for one sheet.

  And the shrinkage | contraction suppression sheet | seat 99A, 99B (it is named generically 99) was laminated | stacked on the upper and lower surfaces of the 1st laminated body 97 which laminated | stacked this 3rd green sheet 98, and the 2nd laminated body 101 was formed.

Next, as shown in FIG. 6 (e), the second laminate 101 was subjected to pressure firing to produce a laminate fired body 102.
Next, as shown in FIG. 6 (f), the inorganic composition remaining on the upper and lower surfaces of the laminated fired body 102 was removed to obtain a laminated fired main body 103.

Next, as shown in FIG. 6 (g), the via hole 105 was formed from the surface of the laminated fired main body 103 until it penetrated the first fired substrate 93.
Next, as shown in FIG. 6 (h), the conductive paste 107 was filled into the via hole 105.

Next, as shown in FIG. 6 (i), the laminated fired main body 103 filled with the conductive paste 107 was heated, and the conductive paste 107 was fired to form a via 109.
Next, as shown in FIG. 6 (j), both surfaces of the laminated fired main body 103 (or the surface on the first fired substrate 93 side) were polished.

By polishing the first fired substrate 93, the fired third green sheet 98 is completely removed, and a part of the outer surface of the first fired substrate 93 is removed.
Next, as shown in FIG. 6 (k), electrodes 111 are formed on both surfaces of the polished laminated fired main body 103 (or the surface of the ground first fired substrate 93), and the multilayer ceramic substrate 113 is completed. did.

Also according to the present embodiment, the same effects as those of the second embodiment can be obtained. That is, since the third green sheet 98 is disposed on the outer surface of the first baked substrate 93, the shrinkage suppression sheet 99A on the upper surface side has an advantage that the first laminate 97 is tightly adhered.
[Fifth Embodiment]
Next, a multilayer ceramic substrate and a manufacturing method thereof according to the fifth embodiment will be described. The description of the same contents as in the first embodiment is omitted.

a) First, the multilayer ceramic substrate of this embodiment will be described with reference to FIG.
As shown in FIG. 7, the multilayer ceramic substrate 121 is obtained by laminating first fired substrates 125 </ b> A and 125 </ b> B (collectively referred to as 125) on both sides of a second fired substrate 123.

  The second fired substrate 123 is composed of a plurality of ceramic layers 123A to 123C, and a wiring layer 127 and a via 129 are formed therein. In addition, similar vias 129 are formed in the first baked substrate 125, and electrodes 131 connected to the vias 129 are formed on the outer surfaces of the first baked substrates 125.

b) Next, the manufacturing method of the multilayer ceramic substrate 121 of this embodiment is demonstrated in detail based on FIG.
-First, as shown to Fig.8 (a), the 1st green sheet 141 was manufactured using the material similar to 1st Embodiment.

Next, as shown in FIG. 8B, the first green sheet 141 was fired to produce the first fired substrate 125.
Next, as shown in FIG. 8C, a via hole 143 was formed in the first baked substrate 125.

Next, as shown in FIG. 8D, the via paste 145 was filled in the via hole 143.
Next, as shown in FIG. 8E, the first baked substrate 125 filled with the conductive paste 145 was heated, and the conductive paste 145 was baked to form a via 129.

  Next, as shown in FIG. 8 (f), the first fired substrates 125 </ b> A and 125 </ b> B are disposed on both sides of the second green sheet 147, respectively, to form the first stacked body 149. The second green sheet 147 is formed by stacking three second green sheets 147A to 147C.

Next, as shown in FIG. 8 (g), the first laminate 149 was pressure fired to produce a laminate fired body 151.
Next, as shown in FIG. 8H, both surfaces of the laminated fired body 151, that is, the outer surfaces of the first fired substrates 125A and 125B were polished.

Next, as shown in FIG. 8 (i), electrodes 131 were formed on both surfaces of the polished laminated fired body 151 to complete the multilayer ceramic substrate 121.
Also according to the present embodiment, the same effects as those of the first embodiment can be obtained. In particular, in the embodiment, since the first fired substrate 125 is disposed on both sides of the second green sheet 147 and fired, there is an effect that deformation during firing is small. Moreover, since a shrinkage | contraction suppression sheet | seat is not used, there exists an advantage that a manufacturing process can be simplified.
[Sixth Embodiment]
Next, the manufacturing method of the multilayer ceramic substrate of 6th Embodiment is demonstrated based on FIG. The description of the same contents as in the first embodiment is omitted.

The present embodiment is a method for manufacturing a multilayer ceramic substrate in which a via hole is formed after forming a laminated fired body.
First, as shown in FIG. 9A, a first green sheet 161 was manufactured using the same material as in the first embodiment.

Next, as shown in FIG. 9B, the first green sheet 161 was fired to produce a first fired substrate 163.
Next, as shown in FIG. 9C, first fired substrates 167A and 167B (collectively referred to as 167) are laminated on both sides of the second green sheet 165, and the first laminated body 169 is formed. Formed. The second green sheet 165 is a laminate of three second green sheets 165A to 165C.

Next, as shown in FIG. 9 (d), the first laminate 169 was fired under pressure to produce a laminate fired body 171.
Next, as shown in FIG. 9E, via holes 173 were formed in the first baked substrates 167A and 167B on both surfaces of the laminated fired body 171, respectively.

Next, as shown in FIG. 9 (f), the via hole 173 was filled with a conductive paste 175.
Next, as shown in FIG. 9G, the laminated fired body 171 filled with the conductive paste 175 was heated, and the conductive paste 175 was fired to form a via 177.

Next, as shown in FIG. 9H, both surfaces of the laminated fired body 171, that is, the outer surfaces of the first fired substrates 167A and 167B were polished.
Next, as shown in FIG. 9 (i), electrodes 179 were formed on both surfaces of the polished laminated fired body 171 to complete a multilayer ceramic substrate 181.

  Also according to the present embodiment, the same effects as those of the fifth embodiment can be obtained.

Next, an experiment conducted for confirming the effect of the present invention will be described.
[Experimental Example 1]
In this experimental example, the dimensional variation of the via hole due to the difference in the manufacturing method was examined.

In this experimental example, the material of each substrate is the same as that in each of the above embodiments, and the formation timing of the via hole is greatly different.
As an example of the scope of the present invention, in the manufacturing method of the first to fourth embodiments, as shown in FIG. 10, a φ ₂ mm via hole is formed on the first baked substrate by a CO ₂ laser. They were formed at a pitch of 0.5 mm. Then, the total pitch (total pitch) was measured, and the deviation (%) from the design value (100 mm) of the total pitch was determined to evaluate the dimensional variation.

  In addition, a second green sheet (which becomes a low-temperature fired glass ceramic substrate) is laminated on the same first fired substrate, and the total pitch of via holes is similarly measured on the fired laminate. Thus, the dimensional variation was evaluated.

  On the other hand, as a comparative example outside the scope of the present invention, a via hole was formed before firing the first green sheet (alumina sheet) and then fired to produce a first fired substrate. Then, the total pitch of the first fired substrate was measured to evaluate the dimensional variation.

  Further, the second green sheet was laminated on the same first baked substrate, and the dimensional variation was evaluated by measuring the total pitch of the via holes in the same manner for the laminated body.

  The results of the experiment described above are shown in Table 1 below. In the examples within the scope of the present invention, the dimensional variation of the total pitch of the via holes is preferably as small as 0.035% or less, but in the comparative example, the dimensional variation is 0. .35% or more, large and undesirable.

［実験例２］
本実験例は、ビアホールの形状の違いによるビア導体の脱落の有無を調べたものである。

[Experiment 2]
In this experimental example, the presence or absence of the via conductor being dropped due to the difference in the shape of the via hole was examined.

  As shown in FIG. 11, 100 via holes 203 having various shapes are formed on a first fired substrate 201 made of alumina by a drill or the like, and the via holes 203 are filled with a conductive paste and fired to form via holes. 205 was formed.

  Here, in FIG. 11A, the diameter of the via 205 is the same cylindrical shape, and in FIG. 11B, the diameter on the front side (upper side in the figure: drop-off side) is smaller than the opposite side (lower side in the figure: back side). It is a truncated cone shape, in FIG. 11 (c) is a truncated cone shape whose diameter on the front side is larger than that on the back side, and in FIG. 11 (d) is a cylindrical shape with a step on the surface side smaller than the back side, In FIG. 11 (e), the diameter on the front surface side is a cylindrical shape having a step larger than that on the back surface side, in FIG. 11 (f), the diameter on the front surface side is smaller than that on the back surface side, and in FIG. The diameter of the side is a cylindrical shape larger than the back side.

  For example, as shown in FIG. 11B, the front side of the first fired substrate 201 protrudes toward the center of the via 205, and the outer diameter of the via 205 is smaller on the front side than on the back side. The part which becomes is the control part 209 which prevents the via conductor 207 from dropping out.

In this experimental example, whether or not the via conductor 207 falls off was examined using the first baked substrate 201 on which each via 205 was formed by the method shown in FIG.
Specifically, the IC chip 213 is bonded to the lower surface of the pulling jig 211 with an adhesive, and each via 205 of the first fired substrate 201 and the IC chip 213 (specifically, its terminals) are respectively soldered 215. It joined via. Then, with the first fired substrate 201 fixed to a base (not shown), the pulling jig 211 was pulled upward, and the state of the via 205 at that time was observed.

  As a result, the via 205 had no abnormality and the via conductor 207 and the solder 215 were separated from each other as “no dropout”. On the other hand, the via 205 is broken inside and a part of the via conductor 207 adheres to the solder 215 or is separated, or the entire via conductor 207 is integrated with the solder 215 and comes off from the first fired substrate 201. This was called “with dropout”.

  The results of this experiment are shown in Table 2 below, and those with the restricting portion 209 are preferable because the via conductor 207 does not drop out.

［実験例３］
本実験例は、ビアホールの加工性を調べたものである。

[Experiment 3]
In this experimental example, workability of the via hole was examined.

  In this experimental example, various types of processing were performed on the first fired substrate made of alumina (length 50 mm × width 50 mm × thickness 0.1-1.2 mm) by three types of processing, that is, normal drill, laser, and sandblasting. Twenty via holes each having a diameter of 20 mm were formed, and the shape of the via hole after processing was observed.

  The results of this experiment are shown in Table 3 below, and it can be seen that the thinner the first fired substrate (especially in the case of 1.0 mm or less), the better the via shape. Here, a material free from burrs, burrs and cracks was considered good. In addition, when the via shape is bad, the via shape can be improved by devising the processing such as processing with higher accuracy.

［実験例４］
本実験例は、電極を構成する薄膜導体の密着強度を調べたものである。

[Experimental Example 4]
In this experimental example, the adhesion strength of the thin film conductor constituting the electrode was examined.

  In this experimental example, the surface roughness Ra of the first baked substrate made of alumina (length 50 mm × width 50 mm × thickness 0.5 mm) was changed depending on the degree of polishing. Then, 20 thin film conductors (length 0.1 mm × width 0.1 mm × thickness 10 μm) made of Cu, Ni, Au are formed on the surface of each first fired substrate by sputtering and electrolytic plating. The adhesion strength of the thin film conductor was evaluated.

  The adhesion strength is evaluated by a test that applies a shear stress of 0.015 g / □ 1 μm with a shear strength tester. When all the sample conductors are not peeled off, it is judged as “good” and even one piece is peeled off. In this case, it was assumed that there was “peeling”.

  The results of this experiment are shown in Table 4 below. When the surface roughness Ra of the first baked substrate is 0.02 μm to 1.00 μm, the adhesion strength of the conductor is high and suitable.

［実験例５］
本実験例は、第１の焼成済み基板と第２の焼成済み基板との接合面の接合性を調べたものである。

[Experimental Example 5]
In this experimental example, the bondability of the bonding surface between the first baked substrate and the second baked substrate was examined.

In this experimental example, as shown in Table 5 below, as a sample, 100 laminates each having different materials (thus, thermal expansion coefficients) of the first fired substrate and the second fired substrate were used. Produced.
As in the first embodiment, this laminate is obtained by laminating and firing a second green sheet (to be a second fired substrate) on the surface of the first fired substrate. In addition, the dimension of the 1st and 2nd baked board | substrate is length 100mm * width 100mm * thickness 0.5mm.

  And bondability was evaluated by the presence or absence of peeling between the 1st baked board | substrate and the 2nd baked board | substrate. In addition, evaluation of bondability was performed by observing the board | substrate cross section after a temperature cycle test (-40 to 150 degreeC: 100 cycles).

Here, in Table 5 below, when the material is Al ₂ O ₃ , the substrate contains 96% by weight of alumina. The glass era is a glass ceramic substrate similar to that of the first embodiment, and the coefficient of thermal expansion is adjusted by changing the glass component of the glass ceramic. In the case of ZrO _2, the substrate contains 99% by weight of zirconia. In the case of Si ₃ N _4, the substrate contains 99% by weight of silicon nitride. In the case of SiC, it is a substrate containing 99% by weight of silicon carbide. In the case of AlN, the substrate contains 99% by weight of aluminum nitride.

  The results of this experiment are shown in Table 5 below, and the difference in coefficient of thermal expansion is 3.3 ppm / ° C. or less. There is no peeling at all.

［実験例６］
本実験例は、第１の焼成済み基板のビアと（低温焼成ガラスセラミック基板である）第２の焼成済み基板のビアとの接合性を調べたものである。

[Experimental Example 6]
In this experimental example, the bondability between the vias of the first fired substrate and the vias of the second fired substrate (which is a low-temperature fired glass ceramic substrate) was examined.

  In this experimental example, in the laminate of the first baked substrate and the second baked substrate, the first baked substrate and the second baked substrate have the shape shown in FIG. A total of 25 vias were formed using the materials shown in Table 6 below.

As in the first embodiment, this laminate is obtained by laminating and firing a second green sheet (to be a second fired substrate) on the surface of the first fired substrate.
The dimensions of the first and second baked substrates are 50 mm long × 50 mm wide × 0.5 mm thick. The via dimensions of the first and second baked substrates are 0.2 mm in diameter.

  Here, the Ag-based composition of the via conductor is a composition containing 60 wt% or more of Ag, and the Ag / Pd-based composition is a composition containing 60 wt% or more of Ag and 0.5 wt% or more of Pd, The Ag / Pt composition is a composition containing 60 wt% or more of Ag and 0.1 wt% or more of Pt, and the Cu composition is a composition containing 60 wt% or more of Cu and a Cu / W composition. Is a composition containing 20 wt% or more Cu and 50 wt% or more W.

And the electrical connection between the vias of the first baked substrate and the second baked substrate was examined by a tester.
The results of this experiment are shown in Table 6 below, all of which had good bondability.

［実験例６］
本実験例は、第１の焼成済み基板上に形成された薄膜導体（電極）の密着強度を調べたものである。

[Experimental Example 6]
In this experimental example, the adhesion strength of the thin film conductor (electrode) formed on the first fired substrate was examined.

  In this experimental example, a first baked substrate made of alumina (length 50 mm × width 50 mm × thickness 0.5 mm) was prepared, and as shown in Tables 7 and 8 below, the surface roughness Ra was determined by polishing. Changed by. Then, an electrode made of Ti or Cr (length 0.1 mm × width 0.1 mm × thickness 10 μm) was formed on the surface of each first fired substrate by sputtering and electrolytic plating.

  Specifically, a Ti layer (base layer) having a different thickness is formed by sputtering, a Cu layer having a thickness of 0.5 μm is formed thereon, and a Cu layer having a thickness of 6.0 μm is formed thereon by electrolytic plating. A layer, a 3.0 μm Ni layer, and a 3.0 μm Au layer were formed.

In addition, 20 samples were prepared for each experiment, and the adhesion strength of the electrodes was examined and evaluated in the same manner as in Experimental Example 4.
The results are shown in Table 7 and Table 8 below, and in the case of the surface roughness Ra within the range of the present invention, there was no peeling, which was preferable.

尚、本発明は前記実施形態や実施例になんら限定されるものではなく、本発明を逸脱しない範囲において種々の態様で実施しうることはいうまでもない。

In addition, this invention is not limited to the said embodiment and Example at all, and it cannot be overemphasized that it can implement with a various aspect in the range which does not deviate from this invention.

(A) is typical sectional drawing of the multilayer ceramic substrate of 1st Embodiment, (b) is typical sectional drawing of the electrode. It is sectional drawing which shows typically the manufacturing method of the multilayer ceramic substrate of 1st Embodiment. It is explanatory drawing which shows the usage method of the jig | tool for IC test | inspection using a multilayer ceramic substrate. It is sectional drawing which shows typically the manufacturing method of the multilayer ceramic substrate of 2nd Embodiment. It is sectional drawing which shows typically the manufacturing method of the multilayer ceramic substrate of 3rd Embodiment. It is sectional drawing which shows typically the manufacturing method of the multilayer ceramic substrate of 4th Embodiment. It is typical sectional drawing of the multilayer ceramic substrate of 5th Embodiment. It is sectional drawing which shows typically the manufacturing method of the multilayer ceramic substrate of 5th Embodiment. It is sectional drawing which shows typically the manufacturing method of the multilayer ceramic substrate of 6th Embodiment. It is a top view which shows the alumina substrate used for Experimental example 1. FIG. It is sectional drawing which shows the shape of the various via | veer of Experimental example 2. FIG. It is explanatory drawing which shows the experimental method of Experimental example 2. FIG.

Explanation of symbols

1, 73, 91, 113, 121, 181 ... multilayer ceramic substrate 3, 53, 77, 93, 125, 167, 201 ... first fired substrate 5, 5A, 5B, 5C, 123, 123A, 123B, 123C ... second baked substrate 9, 59, 89, 109, 129, 177, 205 ... via 11, 90, 111, 131, 179 ... electrode 13A ... base layer (Ti layer)
21, 51, 75, 92, 141, 161 ... first green sheets 23, 55, 87, 105, 143, 173, 203 ... via holes 25, 88, 145, 175 ... conductive paste 27, 27A, 27B, 27C, 61, 61A, 61B, 61C, 79, 79A, 79B, 31, 63, 81, 97, 149, 169... First laminated body 33, 33A, 33B, 33C, 67, 67A, 67B, 67C, 83, 83A , 83B, 35, 69, 85, 101 ... second laminated body 36, 70, 84, 102 ... laminated fired body 43 ... IC inspection jig 65, 98 ... third green sheets 79C, 95, 95A, 95B , 95C, 147, 147A, 147B, 147C, 165, 165A, 165B, 165C ... second green sheets 83C, 99, 99A, 99B, 9C ... shrinkage suppression sheet 209 ... restricting portion

Claims (11)

A first baked substrate and a second baked substrate made of a material having a sintering temperature lower than that of the first baked substrate, and at least one of both surfaces of the second baked substrate. A multilayer ceramic substrate having a surface on which the first fired substrate is laminated,
Of both surfaces of at least one of the first fired substrates, the surface roughness Ra of the outer surface on the non-laminated side is 0.02 μm to 1.00 μm,
A multilayer ceramic substrate used for an IC inspection jig, wherein an electrode is provided on the outer surface.   The multilayer ceramic substrate used for an IC inspection jig according to claim 1, wherein a via electrically connected to the electrode is formed in the first fired substrate.   3. The IC inspection jig according to claim 2, wherein the first fired substrate is provided with a restricting portion that restricts movement of the via to the outer surface and prevents falling-off. Multilayer ceramic substrate used.   The multilayer ceramic substrate used for the IC inspection jig according to any one of claims 1 to 3, wherein the first fired substrate has a thickness of 1.0 mm or less.   The electrode comprises a single layer or a plurality of layers using different conductive metals for each layer, and the base layer in contact with the first fired substrate among the layers has a thickness of 0.02 μm to 0.8 μm. A multilayer ceramic substrate used for an IC inspection jig according to any one of claims 1 to 4. Firing a first green sheet to produce a first fired substrate;
Forming a via hole in the first fired substrate;
Filling the via hole with a conductive paste;
Bonding a first fired substrate filled with the conductive paste or fired after filling to both surfaces of the second green sheet to form a first laminate;
Firing the first laminate to form a laminate fired body;
A step of performing a surface treatment on the first fired substrate in the laminated fired body to scrape the substrate surface;
Forming an electrode on the surface-treated surface of the first fired substrate;
A method for producing a multilayer ceramic substrate, comprising: Firing a first green sheet to produce a first fired substrate;
Forming the first laminate by laminating the first fired substrate on both sides of the second green sheet;
Firing the first laminate to form a laminate fired body;
Forming a via hole in the first fired substrate on the surface of the laminated fired body;
Filling the via hole with a conductive paste;
Firing the laminated fired body filled with the conductive paste;
A step of performing a surface treatment on the first fired substrate in the laminated fired body after firing the conductive paste;
Forming an electrode on the surface-treated surface of the first fired substrate;
A method for producing a multilayer ceramic substrate, comprising: Firing a first green sheet to produce a first fired substrate;
Forming a via hole in the first fired substrate;
Filling the via hole with a conductive paste;
Forming a first laminate by laminating a second green sheet on one surface of a first fired substrate filled with the conductive paste or fired after filling;
Forming a second laminate by laminating a shrinkage suppression sheet on at least a second green sheet side surface of both surfaces of the first laminate;
Firing the second laminate to form a laminate fired body;
Removing the unfired shrinkage suppression sheet from the laminated fired body,
Performing a surface treatment for scraping the substrate surface on the first fired substrate in the laminated fired body from which the shrinkage suppression sheet has been removed;
Forming an electrode on the surface-treated surface of the first fired substrate;
A method for producing a multilayer ceramic substrate, comprising: Firing a first green sheet to produce a first fired substrate;
Forming a first laminate by laminating a second green sheet on one surface of the first fired substrate;
Forming a second laminate by laminating a shrinkage suppression sheet on at least a second green sheet side surface of both surfaces of the first laminate;
Firing the second laminate to form a laminate fired body;
Removing the unfired shrinkage suppression sheet from the laminated fired body,
Forming a via hole in the first fired substrate in the laminated fired body from which the shrinkage suppression sheet has been removed;
Filling the via hole with a conductive paste;
Firing the laminated fired body filled with the conductive paste;
A step of performing a surface treatment on the first fired substrate in the laminated fired body after firing the conductive paste;
Forming an electrode on the surface-treated surface of the first fired substrate;
A method for producing a multilayer ceramic substrate, comprising:   The said shrinkage | contraction suppression sheet | seat is laminated | stacked through the 3rd green sheet on the surface of the said 1st baking completed board | substrate when forming the said 2nd laminated body. The manufacturing method of the multilayer ceramic substrate of description.   The multilayer according to any one of claims 6 to 10, wherein the surface treatment method is at least one of abrasive polishing, grindstone polishing, barrel polishing, buff polishing, chemical etching, and heat treatment. A method for manufacturing a ceramic substrate.

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