JP2008034384A - イオンビームガイドチューブ - Google Patents
イオンビームガイドチューブ Download PDFInfo
- Publication number
- JP2008034384A JP2008034384A JP2007182469A JP2007182469A JP2008034384A JP 2008034384 A JP2008034384 A JP 2008034384A JP 2007182469 A JP2007182469 A JP 2007182469A JP 2007182469 A JP2007182469 A JP 2007182469A JP 2008034384 A JP2008034384 A JP 2008034384A
- Authority
- JP
- Japan
- Prior art keywords
- guide tube
- wafer
- axis
- passage
- ion beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010884 ion-beam technique Methods 0.000 title claims abstract description 38
- 238000002513 implantation Methods 0.000 claims abstract description 21
- 230000001154 acute effect Effects 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 6
- 238000006386 neutralization reaction Methods 0.000 claims description 20
- 239000007943 implant Substances 0.000 claims description 5
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 abstract description 8
- 238000007872 degassing Methods 0.000 abstract description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 235000010627 Phaseolus vulgaris Nutrition 0.000 abstract 1
- 244000046052 Phaseolus vulgaris Species 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 230000000007 visual effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 63
- 150000002500 ions Chemical class 0.000 description 24
- 239000007789 gas Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 10
- 230000007935 neutral effect Effects 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 230000003472 neutralizing effect Effects 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000005591 charge neutralization Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/026—Means for avoiding or neutralising unwanted electrical charges on tube components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/004—Charge control of objects or beams
- H01J2237/0041—Neutralising arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
- H01J2237/0475—Changing particle velocity decelerating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/18—Vacuum control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
- H01J2237/31705—Impurity or contaminant control
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
【解決手段】ガイドチューブ16は、注入中のウェーハ中和に使用される帯電粒子を閉じ込めるために提供される。ガイドチューブは軸と、軸に沿ってイオンビームを受け取るための開放端と、軸に実質的に平行なチューブ壁と、ガイドチューブの内部から外部へのガス伝導通路を形成するチューブ壁を介する少なくとも1つの開口とを有し、通路は、ガイドチューブ軸に直交する通路を介する視線が実質的に閉ざされるように、ガイドチューブ軸に対してある鋭角で整列される長さと、長さを横断する最小寸法とを有する。
【選択図】図1
Description
Claims (5)
- 注入中のウェーハに隣接した注入器の場所に、注入中のウェーハ中和に使用される帯電粒子を閉じ込めるためのイオン注入器におけるイオンビーム用ガイドチューブであって、
軸と、前記軸に沿ってイオンビームを受け取るための開放端と、前記軸に実質的に平行なチューブ壁と、ガイドチューブの内部から外部にガス伝導通路を形成するチューブ壁を介する少なくとも1つの開口とを有しており、
前記通路が、前記ガイドチューブ軸に直交する通路を介する視線が実質的に閉ざされるように、前記ガイドチューブ軸に対してある鋭角で整列された長さと、前記長さを横断する最小寸法とを有するガイドチューブ。 - 前記通路の前記最小横断寸法が前記ガイドチューブ軸を含有する平面にある、請求項1に記載のガイドチューブ。
- 前記通路が、通路長を横断する主要寸法を有するチューブ壁を介するスロットとして形成され、これが前記ガイドチューブ軸を横断している、請求項2に記載のガイドチューブ。
- 注入中にウェーハに隣接する下流端と、イオンビームを受け取るための上流端とを有しており、前記通路が前記下流端から離れて向けられる、請求項1〜3のいずれか1項に記載のガイドチューブ。
- 先行する請求項のいずれか1項に記載のガイドチューブを有するイオン注入器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US83011706P | 2006-07-12 | 2006-07-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008034384A true JP2008034384A (ja) | 2008-02-14 |
Family
ID=38332206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007182469A Pending JP2008034384A (ja) | 2006-07-12 | 2007-07-11 | イオンビームガイドチューブ |
Country Status (6)
Country | Link |
---|---|
US (1) | US7573051B2 (ja) |
JP (1) | JP2008034384A (ja) |
KR (1) | KR20080006451A (ja) |
CN (1) | CN101140847B (ja) |
GB (1) | GB2440414B (ja) |
TW (1) | TW200807516A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI470674B (zh) * | 2012-04-04 | 2015-01-21 | Taiwan Semiconductor Mfg Co Ltd | 離子注入裝置、離子注入設備系統及離子注入方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7872247B2 (en) * | 2007-10-11 | 2011-01-18 | Applied Materials, Inc. | Ion beam guide tube |
TW201002841A (en) * | 2008-06-30 | 2010-01-16 | Shincron Co Ltd | Evaporation device and method of producing thin-film component |
US8242469B2 (en) * | 2009-07-15 | 2012-08-14 | Axcelis Technologies, Inc. | Adjustable louvered plasma electron flood enclosure |
US11830705B2 (en) * | 2020-08-20 | 2023-11-28 | PIE Scientific LLC | Plasma flood gun for charged particle apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02144841A (ja) * | 1988-11-26 | 1990-06-04 | Hitachi Ltd | イオン打込み装置 |
JPH0778587A (ja) * | 1993-09-09 | 1995-03-20 | Nissin Electric Co Ltd | イオン処理装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5101536A (en) * | 1988-12-23 | 1992-04-07 | Gabriele Joseph M | Self-supporting hinge assembly |
JP2716518B2 (ja) * | 1989-04-21 | 1998-02-18 | 東京エレクトロン株式会社 | イオン注入装置及びイオン注入方法 |
DE69012414T2 (de) * | 1989-05-09 | 1995-02-16 | Sumitomo Eaton Nova | Ionen-Implantationsgerät, in dem das elektrische Aufladen von Substraten vermieden wird. |
US5466929A (en) * | 1992-02-21 | 1995-11-14 | Hitachi, Ltd. | Apparatus and method for suppressing electrification of sample in charged beam irradiation apparatus |
JP3054302B2 (ja) | 1992-12-02 | 2000-06-19 | アプライド マテリアルズ インコーポレイテッド | イオン注入中の半導体ウェハにおける帯電を低減するプラズマ放出システム |
GB2344213B (en) | 1995-11-08 | 2000-08-09 | Applied Materials Inc | An ion implanter with improved field control |
JP3774539B2 (ja) | 1997-04-10 | 2006-05-17 | キヤノン株式会社 | 通信装置システム及び通信装置システム制御方法 |
GB2326971B (en) | 1997-07-03 | 2001-12-12 | Applied Materials Inc | Electron flood apparatus for neutralising charge build up on a substrate during ion implantation |
US5909031A (en) * | 1997-09-08 | 1999-06-01 | Eaton Corporation | Ion implanter electron shower having enhanced secondary electron emission |
US5903009A (en) * | 1997-09-08 | 1999-05-11 | Eaton Corporation | Biased and serrated extension tube for ion implanter electron shower |
US6313428B1 (en) * | 1999-10-12 | 2001-11-06 | Advanced Ion Beam Technology, Inc. | Apparatus and method for reducing space charge of ion beams and wafer charging |
DE10254416A1 (de) * | 2002-11-21 | 2004-06-09 | Infineon Technologies Ag | Vorrichtung zum Erzeugen von Sekundärelektronen, insbesondere Sekundärelektrode und Beschleunigungselektrode |
US7557364B2 (en) * | 2004-05-25 | 2009-07-07 | Panasonic Corporation | Charge neutralizing device |
-
2007
- 2007-06-15 GB GB0711647A patent/GB2440414B/en not_active Expired - Fee Related
- 2007-06-20 TW TW096122156A patent/TW200807516A/zh unknown
- 2007-06-26 KR KR1020070062945A patent/KR20080006451A/ko not_active Application Discontinuation
- 2007-07-09 US US11/822,738 patent/US7573051B2/en not_active Expired - Fee Related
- 2007-07-11 JP JP2007182469A patent/JP2008034384A/ja active Pending
- 2007-07-12 CN CN2007101362461A patent/CN101140847B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02144841A (ja) * | 1988-11-26 | 1990-06-04 | Hitachi Ltd | イオン打込み装置 |
JPH0778587A (ja) * | 1993-09-09 | 1995-03-20 | Nissin Electric Co Ltd | イオン処理装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI470674B (zh) * | 2012-04-04 | 2015-01-21 | Taiwan Semiconductor Mfg Co Ltd | 離子注入裝置、離子注入設備系統及離子注入方法 |
Also Published As
Publication number | Publication date |
---|---|
GB2440414A (en) | 2008-01-30 |
US7573051B2 (en) | 2009-08-11 |
TW200807516A (en) | 2008-02-01 |
CN101140847A (zh) | 2008-03-12 |
US20080054193A1 (en) | 2008-03-06 |
CN101140847B (zh) | 2011-06-01 |
KR20080006451A (ko) | 2008-01-16 |
GB2440414B (en) | 2010-10-27 |
GB0711647D0 (en) | 2007-07-25 |
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