JP2008023471A - Paste applicator and paste application method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form a paste pattern even on a substrate having projecting and recessed parts formed by ribs or the like with high precision to improve productivity by precisely measuring the waving of the substrate. <P>SOLUTION: The substrate K is provided with stripe like ribs Ra or lattice like ribs Rb as shown by figure 3 to form the projecting and recessed parts. A nozzle for applying the paste on spaces between the ribs Ra of the substrate K is provided with a distance sensor (for example, non-contact type triangulate sensor) 19. Before the paste is applied to form the paste pattern, the measurement of the waving of the substrate K by the distance sensor 19 is carried out by measuring the distance between the distance sensor 19 and the substrate K along a passage near to the paste application passage (in this case, between the ribs) while tilting to the lib Ra at a slight angle. The measured resultant distance data is processed to determine a plane formed by connecting the peaks of the ribs Ra to detect the waving of the substrate K and the application is carried out by using a nozzle 18 having a size capable of covering all display area of the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a paste application machine, and in particular, a nozzle having a plurality of paste discharge ports is opposed to a substrate placed on a substrate holding table, and paste filled in a paste storage container is transferred from each discharge port onto the substrate. The present invention relates to a paste applicator and a coating method thereof for simultaneously forming a plurality of paste patterns of a desired shape on a substrate by changing the relative position between the substrate and the nozzle while continuously or intermittently discharging.

  In the manufacturing process of a plasma display (hereinafter abbreviated as PDP), phosphors emitting red (R), green (G), and blue (B) (hereinafter, these phosphors are referred to as R phosphor, G, respectively). As a paste coating machine used for forming a phosphor or a B phosphor), there is an apparatus described in Patent Document 1 or the like. In this coating apparatus, a plurality of paste discharge ports are provided in the nozzle so that a plurality of paste patterns having the same form can be simultaneously coated and drawn on the same substrate.

  In this paste applicator, a paste discharge port at the tip of a nozzle is opposed to a substrate placed on a table, and an arbitrary distance is provided between the paste discharge port and the substrate in a direction perpendicular to the main surface of the substrate. (Hereinafter, this distance is referred to as a gap), and while the paste of the R, G, B phosphor is ejected from the paste ejection port onto the substrate, the relative positional relationship between the gap and the direction parallel to the main surface of the substrate (hereinafter referred to as the gap) The relative position between the nozzle tip and the substrate is changed, and a phosphor paste pattern having a desired shape is applied onto the substrate.

In particular, a large number of barrier ribs (hereinafter referred to as ribs) made of glass that is opaque to ultraviolet rays are provided on a PDP substrate, and R, G, B phosphor paste is applied on the substrate between these ribs. Is done.

  In such a paste applicator, the relative positional relationship between the nozzle and the substrate is changed on the substrate by moving the nozzle up and down following the distance between the nozzle tip and the substrate measured in advance and the distance between the nozzle tip and the rib. A phosphor paste pattern is applied. The distance between the nozzle tip and the substrate and the distance between the nozzle tip and the rib are measured at three points set on the surface of the substrate and the rib. Patent Document 2 describes that a virtual curved surface passing through these three points detected for each is set and the nozzle is moved in parallel with the corresponding virtual curved surface on the surface of the substrate or on the rib.

  Further, in Patent Document 3, a nozzle tip is set at an arbitrary height position from above the substrate, a guide is hung from the nozzle tip onto the substrate, and a phosphor paste is dripped onto the guide so that the gap between the ribs is reduced. It is described that it is applied on the substrate. That is, the distance between the nozzle tip and the substrate is not significantly adjusted.

  Since the distance between the ribs is about 150 μm, these conventional techniques are dedicated to accurately applying the phosphor paste between the ribs.

  Further, in Patent Document 4, a stripe structure is the mainstream in the conventional rib type. However, in recent years, with a high-definition display, a partition is provided in a grid pattern with a partition for each pixel having high brightness and high quality. It is disclosed that the display of the partition structure is increasing.

  As still another example of the paste applicator, in Patent Document 5, a preceding sensor in a positional relationship preceding the nozzle and a trailing sensor in a following positional relationship are provided, and the leading sensor has a gap between ribs. The distance from the surface of the substrate to the tip of the nozzle is measured, and the position of the tip of the nozzle between the ribs is measured by a subsequent sensor, while the paste is discharged from the nozzle and applied between the ribs.

  Patent Document 6 discloses a coating apparatus having a multi-nozzle structure arranged in a horizontal row.

  Furthermore, Patent Document 7 discloses that a nozzle having a large discharge amount difference between discharge ports located at both ends of a large number of discharge ports arranged therein is disclosed.

Japanese Patent Laid-Open No. 11-314061 Japanese Patent Laid-Open No. 10-27543 JP-A-10-223138 Japanese Patent Laid-Open No. 2002-50280 JP 2001-87793 A Japanese Patent Laid-Open No. 11-314061 JP 2000-33289 A

  However, the plasma display panel has a large screen, and its substrate is thicker than the substrate for liquid crystal display, and when it is placed on a table with a flat surface, the surface of the substrate does not become flat but undulates. This is especially the case when a panel is formed by multiple chamfering from a single large substrate.

  For this reason, as in the case of the paste application machine described in Patent Document 2, the height position of the nozzle tip is changed by following the undulation of the surface of the substrate to the extent that the distance is measured in advance at three points. The distance between the substrates cannot be kept constant. Therefore, it is conceivable to increase the number of measurement points, but if this is done, irregularities are formed by ribs on the surface of the substrate, and this irregularity becomes an obstacle to measuring the distance between the nozzle tip and the substrate. This measurement becomes very difficult.

  The invention described in Patent Document 4 measures the distance between the nozzle tip and the substrate between the ribs with the preceding sensor while applying the paste by moving the nozzle along the ribs based on the measurement result of the following sensor. However, in the case of a substrate having a cross-shaped rib, the rib is provided so as to cross the paste application direction. Therefore, the invention described in Patent Document 4 cannot be applied as it is.

  In the case of the paste applicator described in Patent Document 3, the gap between the nozzle tip and the substrate is set to be large regardless of the surface state of the substrate. For this reason, it is necessary to guess the amount of paste dripping at the start and end of application, and it is difficult to control the start and end of the discharge of the paste, and there is a possibility that the paste cannot be applied in a desired shape.

  In addition, as described in Patent Document 5, in order to intermittently apply R, G, B phosphor paste by a dispensing method in a cell having a barrier rib structure such as a cross-girder, the horizontal direction described in Patent Document 6 or the like is used. The multi-nozzle structure arranged in a single row has problems such as coating tact corresponding to the coating response cycle.

  Furthermore, as described in Patent Document 7, when a substrate is repeatedly applied with a nozzle having a large discharge amount difference between the discharge ports located at both ends of the array of discharge ports, Luminance unevenness occurs.

  As a means to eliminate this luminance unevenness, it is possible to minimize variations in paste discharge amount by partially changing the nozzle discharge port diameter and the nozzle flow path length in the discharge direction. It is a difficult and very time consuming method to implement.

  Further, when applying repeatedly to the substrate, a slight amount of application position shift may occur due to a dimensional error of the rib formed on the main surface of the substrate, and luminance unevenness may occur.

  In addition, in general, there is a needle valve type dispenser (for example, manufactured by Nordson Asymtec Co., Ltd.), which has a high viscosity characteristic of the phosphor and can easily adjust the high-speed discharge response in order to speed up the discharge tact.

  However, in this case, when the needle valve is repeatedly shut off, the micron (μm) level average particle size component contained in the discharge paste is destroyed, and dust is generated from the mechanism of the valve itself.

  Furthermore, in the needle valve type dispenser, the management of the residual paste from the valve to the discharge port when the valve is shut off must rely on the surface tension of the paste itself, and when the tension of the paste liquid discharged during paste discharge is high, In some cases, stringing of the paste and accumulation of the paste at the tip of the nozzle occur, which may adversely affect the next discharge.

  The object of the present invention has been made in view of the above points. The object of the present invention is to solve such a problem and paste a paste at a desired position even on a substrate provided with a cross-shaped rib or the like. The pattern can be formed with high definition, and the number of paste discharge ports of the nozzle can be increased to increase the number of paste patterns that can be drawn at once, reducing the production time and increasing the productivity through stable application. Another object of the present invention is to provide a paste applicator and a coating method.

  In order to achieve the above object, the present invention provides a syringe provided with a nozzle having a plurality of discharge ports, a substrate holding table for placing a substrate so as to face the discharge ports, and a paste filled in the syringe. A detector for detecting the amount of paste in the syringe in order to apply and draw a paste pattern of a desired shape on the substrate by changing the relative positional relationship between the substrate and the nozzle while discharging from the outlet onto the substrate; And a mechanism for supplying paste into the syringe based on the detection result of the detector, and a nozzle syringe calibration mechanism is provided so that the attachment position of the syringe can be finely adjusted.

  In addition, a height position calibration mechanism for calibrating the height position of the nozzle in the vertical direction is provided at one end of the substrate holding table on which the substrate is placed. A pressure sensor is provided on the side, and the nozzle syringe calibration mechanism is operated using the detection value of the pressure sensor to adjust the position of the syringe.

  According to the present invention, it is possible to accurately detect the waviness even on a substrate having uneven portions such as stripes or cross-shaped ribs, and a paste pattern can be placed in a desired position on the substrate in a short time. It can be formed with high accuracy, and productivity is greatly improved.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing an appearance of an embodiment of a paste applicator according to the present invention. FIG. 2 shows an overview of the coating head 7. Substrate transport conveyors 2 a and 2 b are provided on the gantry 1. Between the substrate transfer conveyors 2a and 2b, the substrate K that has been transferred is received, and the substrate holding mechanism 3 that is a substrate holding table provided with a holding mechanism for holding the substrate K, and the substrate holding mechanism 3 are rotated by θ. A θ-axis moving table 4 is provided. Furthermore, portal-shaped Y-axis movement tables 5a and 5b for moving the X-axis movement table 6 in the Y-axis direction are provided on both ends of the gantry 1 in the X-axis direction. Further, the X-axis moving table 6 is attached to the Z-axis moving table support base 2 so that the coating head 7 can move in the X-axis direction. The Z-axis moving table support base 2 is provided with a Z-axis drive motor 20 for moving the coating head 7 in the Z-axis direction.

Further, a main control unit 8, a pneumatic unit 9, a monitor 10, a keyboard (operation panel) 11 and the like are provided on the lower side and the side of the gantry 1. Further, adjacent to the substrate holding mechanism 3 at the top of the gantry 1, a height position calibration mechanism 80 for calibrating the height position in the Z-axis direction of the nozzle 18 provided in the syringe 17 that is a paste storage container, the nozzle 18. A paste recovery mechanism 81 for recovering the paste discharged from the nozzle, a nozzle cleaning mechanism 82, and a nozzle clogging detection mechanism 83 are provided.

  In the same figure, the board | substrate conveyance conveyors 2a and 2b are provided with the raising / lowering means which is not shown in figure. The substrate K for plasma display manufacture is transported to the substrate holding mechanism 3 in the X-axis direction, and the substrate K is placed on the substrate holding mechanism 3 by lowering the substrate transport conveyors 2a and 2b. Moreover, the board | substrate conveyance conveyors 2a and 2b are raised, the board | substrate K after paste application | coating is received from the board | substrate holding mechanism 3, and it discharges | emits outside by conveying in the X-axis direction. Although not shown in FIG. 1, a plurality of ribs Ra parallel to the Y-axis direction as shown in FIG. 5A and lattice-like ribs Rb as shown in FIG. Is formed.

  The θ-axis moving table 4 rotates the substrate holding mechanism 3 about the θ-axis and aligns the loaded substrate in the θ direction. The Y-axis moving tables 5a and 5b move the X-axis moving table 6 in the Y-axis direction and determine the application position in the Y-axis direction. The Y-axis moving tables 5a and 5b are driven by a linear motor. A guide mechanism is provided. Similarly, the X-axis moving table 6 determines the application position in the X-axis direction on the substrate by driving the Z-axis moving table support base 2 and the coating head 7 in the X-axis direction, and is driven by a linear motor. However, it has a linear motor and a guide mechanism for ensuring support rigidity. The application position of the nozzle 18 on the substrate can be changed by driving the X-axis movement table 6 and the Z-axis movement table support base 2.

  The monitor 10 displays a display of the driving state and an image input state captured by an image recognition camera (not shown), and the keyboard 11 inputs various driving data used in the main control unit 8 and operates the apparatus. Input data from the keyboard 11 is stored and stored in a storage medium such as a hard disk or a floppy disk which is a storage device of a sub-control unit (not shown). An air pressure unit 9 used for pressurization control of a syringe or the like is disposed at the lower part of the gantry 1.

  Two image recognition cameras 40 a and 40 b for positioning not shown in FIG. 1 are installed on the gantry 1, and the positioning mark positions patterned on the substrate K are read, and the θ-axis moving table 4 reads the positioning mark positions. The edge of the substrate K is made parallel to the X and Y axes, and the position of the substrate K on the substrate holding mechanism 3 is confirmed. When these image recognition cameras interfere with the movement range of the coating head 7, an image recognition camera is installed below the substrate holding mechanism 3, and image recognition positioning is performed through the substrate holding mechanism 3. Also good. Alternatively, an image recognition camera may be mounted on the syringe holding base 14 (FIG. 2) to recognize the alignment mark of the substrate K held by the substrate holding mechanism 3 and the shape of the paste application pattern. Alternatively, nozzle clogging may be recognized by a nozzle clogging detection mechanism 83 described later. Note that as many image recognition cameras as the number of alignment marks may be provided.

The configuration of the coating head 7 will be described with reference to FIG. A syringe holding base 14 is attached to a Z-axis moving table 21 mounted on the Z-axis moving table support base 2. A syringe 17 having a plurality of nozzles 18 attached thereto is installed on the syringe holding base 14. The syringe holding base 14, the syringe 17, and the nozzle 18 move up and down by forward and reverse rotation of the Z-axis drive motor 20 provided on the Z-axis movement table 21. The syringe lid 12 of the syringe 17 has an air pressure supply pipe 13 for applying a paste filled in the syringe 17 with a nozzle 18, a paste supply pipe 15 for supplying the paste into the syringe, and an inside of the syringe. A liquid level detection sensor 16 for detecting the amount of the filling paste is installed. The Z-axis moving table 21 incorporates a mechanical element such as a ball screw and a guide mechanism for converting the forward / reverse motion of the Z-axis drive motor 20 in the Z-axis direction. Further, in the syringe holding base 14, actuators 14a to 14h of a nozzle syringe calibration mechanism for adjusting the position (XYZ direction) of the nozzle 18 and a distance sensor 19 are incorporated. In order to finely adjust the position of the syringe 17 relative to the syringe holding base 14 in the XYZ directions, the nozzle syringe calibration mechanism has a configuration in which actuators are arranged substantially symmetrically in the front and rear, left and right, and up and down of the syringe.

FIG. 3 shows a nozzle syringe calibration mechanism. As shown in FIG. 3, on the syringe holding base 14, the syringe 17 and the nozzle 18 in the coating head 7 are minutely moved in six directions with degrees of freedom (X, Y, Z, θ _X , θ _Y , θ _Z ). Nozzle syringe calibration mechanism actuator 14a-
14h (see FIGS. 3A and 3B). Actuators 14a to 14h are driven at the time of correcting the height position of the nozzle 18 in the Z-axis direction, which will be described later. That is, the nozzle position is calibrated in conjunction with the nozzle height position calibration mechanism 80 provided on the gantry 1 side. The nozzle syringe calibration mechanism is configured such that a piezoelectric element is attached to the syringe holding base 14 side as a drive source, a ball bearing is provided on the piezoelectric element, and a portion that comes into contact with the syringe can make point contact. As shown in FIG. 3A, when the actuators 14a and 14b are driven, the syringe 17 can be moved in the Y direction by an amount of maximum t, and when the actuators 14c and 14d are driven, the syringe 17 is moved by a maximum w in the X direction. be able to. Further, as shown in FIG. 3B, the Z-axis direction can be adjusted by driving the actuators 14e to 14h. As shown in the figure, the direction adjustment actuators can be adjusted in the rotational direction by disposing actuators of the same configuration at substantially the target positions. In the present embodiment, the piezoelectric element is provided in the drive source. However, the present invention is not limited to this as long as it is attached to the syringe holding base 14 and can be moved minutely.

FIG. 4 shows an example in which the number and diameter of the pneumatic supply pipe 13 and the paste supply pipe 15 provided on the syringe lid are changed. The air pressure supply pipe 13 provided in the syringe lid 12 is a regulator that controls the printing pressure for discharging the paste (not shown) as large as possible in order to eliminate the delay in discharge response due to the high viscosity characteristics of the paste. The pneumatic valve is preferably one that can flow a large flow rate at high speed. The example of FIG. 2 shows an example in which three pneumatic supply pipes 13 are provided, but the number and arrangement of pipes may be changed in consideration of pneumatic responsiveness, pressure balance in the syringe, and the like. . FIG. 4A shows an example in which nine pneumatic supply pipes are provided. FIG. 4B shows an example in which 13 pneumatic supply pipes 13 are provided. By increasing the number of pneumatic supply pipes in this way, it is possible to prevent the pressure supplied into the syringe from becoming uneven depending on the location. FIG.
In (c), a single pneumatic supply pipe 13 is provided and the paste supply pipe 15 is a pipe having a large diameter so that the amount of paste supplied can be increased.

  Moreover, the liquid level detection sensor 16 installed in the syringe lid 12 detects the remaining amount of paste in the syringe 17. When it is found by the liquid level detection sensor that the remaining amount of the paste is less than the reference amount, the paste is transferred from the paste tank 28 via the valve 29 and the paste supply pipe 15 as shown in FIG. 17 is pumped. When the paste is not supplied, the paste supply path is blocked by the valve 29.

  The nozzle 18 has a paste discharge port 18A (hereinafter also simply referred to as a discharge port), and the paste discharge port has a shape that is applied from the start of application of paste to the end of application when repeatedly applied to the substrate K. In order to stabilize the amount, it is desirable to protrude from the base material of the nozzle 18. Therefore, the paste discharge port 18A has a conical shape, a rectangular shape or a cylindrical shape as shown in FIGS. 8 (a) to 8 (c), and a paste discharge port portion with a cut-out shape. It is good to make it a shape where an exit is separated independently.

  Further, since the paste to be applied generally has a high viscosity, water repellent treatment (coating; not shown) having a uniform film thickness on the surface of the paste discharge port 18A of the nozzle 18 to improve the releasability of the paste. It is possible to stabilize the paste application shape during repeated continuous application.

  FIG. 9 shows a cross-sectional view of the nozzle height position calibration mechanism. As an example of the height position calibration mechanism 80, FIG. 9A includes a recess that can contain all the paste discharge ports 18 A of the nozzle 18, and a portion where the end of the nozzle 18 contacts the height position calibration mechanism 80 (high A configuration in which pressure-sensitive sensors are provided on both ends of the position calibration mechanism 80 is shown. As another example in FIG. 9B, a portion where the discharge ports at both ends of the plurality of paste discharge ports 18 </ b> A provided in the nozzle 18 contact the height position calibration mechanism 80 without providing a recess. Is provided with a pressure-sensitive sensor 80A.

  Adjustment of the height position of the nozzle using the height position calibration mechanism 80 is performed by adjusting the flat surface of the nozzle 18 or the nozzle tip portion protection rib 18B so that the tip portion of the paste discharge port 18A is not crushed. The actuator 14a to 14h of the nozzle syringe calibration mechanism is operated and adjusted so as to be parallel to the substrate holding mechanism 3 or the substrate K when it is abutted against the surface 80. At that time, the height position in the Z-axis direction with respect to the distance sensor 19 described later is also calibrated. The heights of the nozzle tip (paste discharge port 18A) and the nozzle tip protection rib 18B are substantially uniform, but if it is to be described, [height of paste discharge port 18A] ≦ [nozzle tip protection rib 18B]. Is preferred. Or if it is a form provided with the recessed part like Fig.9 (a), it is not necessary to form the nozzle front-end | tip part protection rib 18B in the nozzle 18. FIG.

Next, the end timing of the height position calibration operation of the nozzle 18 in the Z-axis direction is determined according to the pressure sensor 80A (the pressure sensor 80A is a height sensor provided at a location in contact with the nozzle flat portion of the height position calibration mechanism 80). The nozzle flat surface portion is in contact with the end of the position calibration mechanism in the X and Y directions), and the distance sensor 19 provided on the coating head side can recognize the height position calibration mechanism surface. The calibration operation is terminated. When the syringe 17 and the nozzle 18 are removed for cleaning the syringe or replacing the nozzle, the difference in the tightening condition of the screw for fixing the nozzle, which is not shown in the figure, is not shown in FIG. 14 and the syringe 17, and the wear of the joint portion between the syringe 17 and the nozzle 18, the original ideal position is not necessarily obtained. The actuators 14a to 14h of the nozzle syringe calibration mechanism provided on the syringe holding base 14 adjust the inclinations of the syringe 17 and the nozzle 18 by moving the diagonally opposing mechanisms slightly in the X, Y, and Z directions. Then, the paste discharge port is driven so as to be parallel and perpendicular to the main surface direction of the substrate K to which the paste is applied. The pressure sensor 80A may be a non-contact type displacement sensor. Further, if the distance sensor 19 provided in the coating head 7 can recognize the calibration mechanism surface, the pressure sensitive sensor 80A may not be installed.

  Further, the discharge ports 18A are arranged in accordance with the coating pattern on the upper surface of the substrate K, and the interval P between the centers of the adjacent discharge ports 18A is about 0.1 (0.6) to 1.2 mm. In the present embodiment, FIG. 7A shows an example in which a nozzle 18 having about 256 paste discharge ports is connected, and FIG. 7B shows an example in which two nozzles are connected. The nozzle 18 is provided with a nozzle tip protection rib 18B across a nozzle row formed in the X-axis direction. At this time, the joining portion 18C of the nozzle 18 is desirably joined at an arbitrary intermediate position where the discharge ports 18A are continuously arranged. The number of parts of the nozzle 18 formed by joining, that is, [the number of joining parts 18C + 1] may be any number. FIG. 7C shows an example in which three rows of discharge ports are provided between the nozzle tip protection ribs 18B, and FIG. 7D shows a case where the nozzles of FIG. The configuration is shown.

  Other examples include a configuration in which a plurality of rows of discharge ports 18A are provided and the intervals between adjacent discharge ports are narrowed, and similarly, a plurality of rows of discharge ports are arranged with the discharge port positions shifted in the X-axis direction for each row. That is, a configuration in which paste discharge ports are arranged in a staggered manner can be realized. In addition, although the method of using welding or an adhesive agent etc. can be considered for joining between nozzles, highly accurate joining can be performed by using a friction diffusion joining method. As a base material of the nozzle 18 that covers the display area of the substrate K, it is desirable to use a low thermal expansion material that is less affected by thermal expansion.

  This embodiment relates to the application of one color of phosphor paste on a plasma display panel and black stripes, electrodes, barrier ribs and the like. For example, this embodiment is applied to a step of simultaneously forming phosphors for three colors. When using the example, three syringes 17 are mounted in the syringe holding base 14 so that the arrangement direction of the nozzles 18 is in the pattern order of the coating paste of each color so as to be orthogonal to the longitudinal direction of the rib Ra on the substrate K. A method of arranging and applying is also possible. In addition, what narrowed the paste discharge port 18A interval of the nozzle 18 or arranged the paste discharge ports in a staggered manner is mainly suitable for dot (intermittent) coating, and the paste is continuously applied to the substrate K as shown in FIG. )-(D) As in the case of (d), when the desired discharge rate is not satisfied by a single application, an application method in which pastes with adjusted physical properties such as viscosity and thixo value are sequentially laminated with the same paste is also possible. It is.

  In addition, the paste to be applied generally contains fine particles with a high hardness (particle size of about several μm), and when the paste is repeatedly discharged repeatedly, the inner surface of the discharge port 18A of the nozzle 18 and the fine particles come into contact with each other. As a result, it has been found by the present inventors that the discharge port diameter of the nozzle 18 is increased due to the wear of the discharge port 18A due to fine particles. Therefore, when the paste is discharged, the releasability of the paste is good and the plating thin film treatment (coating; not shown) with a high strength (abrasion resistance) and uniform film thickness is applied to the paste-containing fine particles. Thus, the paste application shape can be stabilized and the service life of the nozzle 18 can be extended.

  In actual application, in FIGS. 7B and 7D, there is a risk of leakage of paste from the joint 18C. However, as described above, the viscosity characteristics of the panel-forming coating liquid are generally high. The present inventors have confirmed that paste leakage does not occur if there is no gap in the joint 18C and a very small gap (several tens of μm or less).

  The distance sensor 19 measures the distance from the nozzle tip (discharge port 18A) to the surface (upper surface) of the substrate K (FIG. 1). That is, the amount of reflected light from the surface of the substrate K is detected, and the distance is calculated from the difference in the amount of received light. That is, the distance sensor 19 includes a light emitting element and a light receiving element therein, the laser light emitted from the light emitting element is reflected at a measurement point on the substrate K, and the reflected light is received by the light receiving element, The distance is calculated from the ratio between the light emission amount of the light emitting element and the light reception amount of the light receiving element. If the distance is short, this ratio is high, and if the distance is long, this ratio decreases. Further, the measurement point (reflection point) of the laser beam on the substrate K and the position immediately below the ejection port 18A of each nozzle 18 are slightly separated in the horizontal direction (about 10 to 100 μm) on the substrate K. However, with this slight distance deviation, there is no significant error in the unevenness of the surface of the substrate K, so the measurement result of the distance sensor 19 is the distance from the tip of the nozzle 18 to the surface of the substrate K (upper surface of the convex portion). There is no problem.

  In addition, when the paste clogging mechanism 81 (not shown) detects clogging of the nozzle 18 in the clogging detection mechanism 83 described later, the syringe 17 is moved onto the paste collection mechanism 81 to increase the pressure in the syringe 17. The pressure is applied and the paste is discharged from the paste discharge port to eliminate clogging. It should be noted that countless fine particles having a particle size of several μm are dispersed innumerably in the paste, and a nozzle clogging prevention mesh (not shown) is attached between the syringe 17 and the nozzle 18. The gel-like solid content and dust are trapped. Furthermore, the paste discharged by the paste recovery mechanism 81 may be returned to the paste tank 28 (FIG. 6) that supplies the paste to the syringe 17 and reused.

  Furthermore, the nozzle cleaning mechanism 82 is a mechanism that cleanly wipes the paste adhering to the nozzle tip 18A before and after application to the substrate K and after discharging the clogging. In this embodiment, a sponge having good sustained absorption is installed in the mechanism, the sponge 7 is moved up and down repeatedly about 1 mm in the Z-axis direction, and is shifted by a small pitch in the Y-axis or X-axis direction. The nozzle tip 18A is pressed against the nozzle to absorb the paste adhering to the tip. As the nozzle cleaning mechanism 82, a method of automatically winding a used tape after repeated contact with an adhesive tape or a suction-type mechanism such as a vacuum cleaner may be used.

  The nozzle clogging detection mechanism 83 is to inspect the substrate K before being applied to the substrate K or the substrate K on which the paste carried out from the substrate holding mechanism 3 is applied with an image recognition camera. From this appearance inspection result, it is confirmed whether or not a desired amount of paste is discharged from the nozzle 18. In this embodiment, a stage for applying paste from the nozzle 18, an image recognition camera for checking the shape of the applied paste (not shown), and a paste cleaning mechanism (not shown) for cleaning the paste after checking the shape are provided. As the image recognition camera, a camera for positioning the substrate K may be used, or a dedicated image recognition camera may be mounted on the syringe holding base 14.

  FIG. 6 is a configuration diagram showing a specific example of the control system and the piping system of the embodiment shown in FIG. A microcomputer 8a is provided inside the main control unit 8, and an image input unit 8b, an external interface unit 8c, and a drive control unit 8d are connected via a data bus 8e. Servo motors 31 to 34, encoders 35 to 39, and actuators 14a to 14h of a syringe calibration mechanism are connected to the drive control unit 8d. The image input unit 8b is connected with image recognition cameras 40a and 40b for positioning and an image recognition camera 24 for confirming the shape of the applied paste. In addition to the monitor 10 and the keyboard 11, a distance sensor 19 and an external personal computer 47 are connected to the external interface unit 8c. Further, a positive pressure regulator 43 and a negative pressure regulator 44 are connected to the external interface unit 8c.

  Paste is supplied to the syringe 17 from the paste tank 28 through the pipe 15 through the valve 29. The pneumatic supply pipe 13 is connected to the syringe 17, and the positive pressure or negative pressure is supplied from the positive pressure source 41 or the negative pressure source 42 to the positive pressure regulator 43 or the negative pressure regulator 44 via the valve unit 45. Pressure is supplied.

  In the figure, linear motors 33 and 34 drive Y-axis movement tables 5a and 5b (FIG. 1), linear motor 32 drives an X-axis movement table 6 (FIG. 1), and servomotor 31. Is for driving the θ-axis moving table 4 (FIG. 1). Encoders 35 to 39 detect the positions of the motors. Furthermore, the actuators 14a to 14h are drive sources for the nozzle syringe calibration mechanism mounted on the syringe holding base 14 shown in FIG. The external personal computer 46 and the printer 47 are appropriately connected.

  FIG. 6 shows a specific configuration example of the main control unit 8 and the air pressure control system of the syringe 17 and the control system of the coating head 7 in FIG. 1, but in FIG. Although the drive control system of the board | substrate conveyance conveyors 2a and 2b is also included, it is not illustrated here. Further, although not shown, the microcomputer 8a includes a ROM that stores the main processing unit and the operation processing program, processing results in the main processing unit, input data from each device connected to the main control unit 8, and information on the device. A RAM for storing operating condition data, an input / output unit for exchanging data, and the like are provided.

  In addition, operation condition data such as application shape data and application condition data, and production management data such as the number of produced substrates K transferred from the apparatus, etc. from an externally connected personal computer 47 and keyboard 11 or a network (not shown), etc. Is entered. Various types of input data are stored and stored from the RAM in the microcomputer 8a to an internal storage medium (not shown) such as a hard disk in the external personal computer 47 and an external storage medium such as a floppy disk. Information can be printed from the printer 46.

Based on data input from the keyboard 11, the external personal computer 47, a network (not shown) or the like, the X-axis movement table 6 arranged on the Y-axis movement tables 5a and 5b is driven by the linear motors 33 and 34 to move the X-axis. The Z-axis moving table support base 2 arranged on the table 6 is driven by the servo motor 32, and the Z-axis driving motor 20 on the Z-axis moving table 21 is driven, whereby the substrate is generated by the negative pressure distributed from the negative pressure source 42. The nozzle 18 moves an arbitrary distance in the X, Y, and Z axis directions via the syringe holding base 14 (FIGS. 2 and 3) with respect to the substrate K that is vacuum-sucked to the holding mechanism 3 or fixed with a jig. . During the movement, the microcomputer 8a controls the valve unit 45, so that a slight air pressure is applied from the positive pressure source 41 to the syringe 17 via the positive pressure regulator 43 and the valve unit 45. A paste is discharged from 18A and applied to the substrate K in a desired pattern.

  Further, the motors 20, 32, 33, and 34 are driven based on the input data, and the nozzle 18 moves with respect to the substrate K by an arbitrary distance in the X, Y, and Z axis directions. The substrate K is fixed to the substrate holding mechanism 3 by suction or by a jig with a negative pressure divided from the negative pressure source 42. During the movement, the microcomputer 8 a controls the valve unit 45 to apply a slight air pressure to the syringe 17 from the positive pressure source 41 through the positive pressure regulator 43 and the valve unit 45. With this air pressure, the phosphor paste P is discharged from the nozzle tip 18A of the nozzle 18 and a desired pattern is applied to the substrate K.

  FIG. 10 is a flowchart showing a specific example of the paste application operation of the paste applicator shown in FIG. 1, and the substrate K is assumed to have a multi-chamfering specification having a number of display units during panel assembly.

  In the figure, the power is first turned on (step 100), and then the initial setting process of the apparatus is executed (step 200).

  In this initial setting, the Z-axis movement table support base 2 provided with the Z-axis on the coating head 7 is moved in the X-axis direction by the Y-axis movement tables 5a and 5b and the X-axis movement table 6 (FIG. 1). Thereby, the paste discharge port of the nozzle 18 is moved to the discharge start position (paste application start point) of the phosphor paste. When the nozzle 18 is positioned at a predetermined reference position on the substrate K to be paste pattern drawn (set to the origin position), data for one or more paste patterns to be applied to the substrate K (paste pattern data) ) And the position data of the substrate K, and the relative speed between the substrate K and the nozzle 18 when the paste is actually applied to the substrate K (this relative speed is referred to as the application speed. The height from the surface of the substrate K to the nozzle 18 discharge port (this is equal to the distance between the nozzle 18 and the substrate K, and determines the height of the paste pattern drawn on the surface of the substrate K). Therefore, in the following description, the application height is referred to as the initial setting application height), and the syringe 17 that determines the amount of paste discharged from the nozzle 18 is marked. Data such as applied pressure (this pressure is referred to as application pressure, especially in this case the application pressure is referred to as initial setting application pressure), position data indicating the paste discharge end position, measurement position data of the applied paste pattern, etc. Settings are made. In this embodiment, the substrate K is provided with the rib Ra or the rib Rb shown in FIG. 5, and the paste is applied between the ribs. The coating height refers to the height from the substrate surface. These data are input from the keyboard 11 (FIGS. 1 and 6), and these input data are stored in a RAM built in the microcomputer 8a (FIG. 6).

  When the initial setting operation (step 200) is completed, the substrate K is then mounted on the substrate holding mechanism 3 (FIG. 1) and held by suction (step 300).

  In this substrate loading operation, in FIG. 1, the substrate K is carried from the outside to the upper side of the substrate holding mechanism 3 by the substrate conveying conveyors 2a and 2b, and is lowered by the lifting means (not shown). By doing so, the substrate K is placed on the substrate holding mechanism 3. During this time, the nozzle 18 uses the nozzle cleaning mechanism 82 to (I) clean the paste discharge port 18A, or (II) use the nozzle clogging detection mechanism 83 to check the state of the paste applied from the paste discharge port 18A with an image. Then, clogging of the paste discharge port is detected. In addition, when clogging is confirmed, the nozzle 18 is a nozzle discharging mechanism for removing clogging by the paste collecting mechanism 81 and a cleaning mechanism dedicated to the nozzle clogging detection mechanism 83 (not shown in the nozzle clogging detection mechanism 83). Part of the paste is removed. The operations (I) and (II) are repeated, and the operation is performed up to the device operating condition limit set in the microcomputer 8a.

  Next, preliminary positioning of the substrate K is performed (step 400).

  In this processing, rough positioning of the substrate K in the X and Y axis directions is performed by a positioning chuck (not shown in FIG. 1). Then, the positioning marks of the substrate K placed on the substrate holding mechanism 3 are photographed by the image recognition cameras 40a and 40b (FIG. 6), and image processing is performed to detect the inclination of the substrate K in the θ direction. By driving the θ-axis moving table 4 by the servo motor 31 (FIG. 6) according to this detection result, the inclination in the θ direction is also corrected and accurate alignment with respect to the X and Y axis directions is performed.

Next, the orientation of the substrate K positioned in step 400 in the θ direction is determined by the servo motor 31.
By driving the θ-axis movement table 4 in FIG. 6, a process of slightly shifting by the shift set angle Δθ is performed (step 500).

  In this process, by slightly shifting the direction of the substrate K in the θ direction, the top of the rib Ra is always aligned even if the measurement point position of the distance sensor 19 does not exactly match the top position of the fine rib Ra of several tens of μm. The purpose is to enable detection. This detects a change in the height of the top of the rib Ra, thereby detecting the undulation of the substrate K.

  In the test conducted by the inventors, in FIG. 5A or FIG. 14, when the length of the rib Ra is 500 mm, a scan that follows the Y axis direction by 500 mm is performed with the θ direction of the substrate K tilted by 1 °. It has been found that the top of the rib Ra can be detected about 30 times. Of course, the shift setting angle Δθ may be adjusted in accordance with the interval between the ribs Ra and the required accuracy of waviness detection.

  Next, the waviness measurement process of the substrate K is performed (step 600). This will be described with reference to FIG.

  First, since the paste application position by the nozzle 18 and the measurement point of the distance sensor 19 are separated, the Y-axis movement is performed so that the measurement point of the distance sensor 19 becomes the application position by the nozzle 18 (nozzle position at the time of application). The distance sensor 19 is positioned in the horizontal direction by the tables 5a and 5b and the X-axis moving table 6 to give an offset for correcting the displacement (601).

Next, the Z-axis moving table 21 (syringe holding base 14) is lowered, and the distance sensor 19 is lowered to the measurable range, thereby positioning the distance sensor 19 in the height direction (step 602).

Next, the Y-axis movement tables 5a and 5b and the X-axis movement table 6 are set so that the measurement point of the distance sensor 19 moves, that is, scans, along the movement path based on the paste pattern data read and set in step 200. Then, the substrate waviness measurement operation by the distance sensor 19 is started (step 603).

  The measurement result of the distance sensor 19 obtained during the measurement operation is stored in the RAM built in the microcomputer 8a (steps 604 and 605). As described above, since the substrate K is tilted by the shift setting angle Δθ with respect to the normal direction, the θ of the measurement point by the distance sensor 19 on the substrate K is a slight value. The amount of undulation detected in the path of the measurement point by the sensor 19 substantially matches the amount of undulation in the path of the paste pattern that is actually formed.

  The above processing is repeated until the measurement point by the distance sensor 19 reaches the end point based on the paste pattern data (step 606), and the measurement is continued. When this end point is reached (step 606), the next measurement operation from step 601 is performed based on the registered next paste pattern data, and the height detection of all registered paste patterns is completed. Until this is done, this undulation measurement operation is repeated (step 607).

  Next, in FIG. 10, the waviness data for all paste pattern data obtained by the above measurement in step 600 is converted (step 700). Hereinafter, this conversion process will be described.

  FIG. 12A schematically shows the undulation data obtained by the above undulation measurement shown in FIG. 11, and each vertex is obtained by measuring the rib Ra of the substrate K. FIG. is there.

  The substrate K is uneven by the rib Ra, and the substrate was rotated in the θ direction in step 500 to tilt the rib Ra from the Y-axis direction so that the measurement path of the distance sensor 19 crossed the rib Ra. The swell data is disturbed. For this reason, although it is inappropriate as height control data, the apex of the convex portion (rib Ra) can be grasped as a peak. In addition, since the laser beam L1 (FIG. 14) is blocked at the convex portion on the substrate K, the edge portion of the concave portion, or the like, the waviness data may include noise-like data.

  The waviness data is converted so that it can be used as height control data by filtering.

In the conversion procedure, first, a moving average process is performed on the waviness data to convert it into data as shown in FIG. Next, a threshold value is provided, and data having a lower value is deleted. FIG.
FIG. 12C shows the processing results when the height of the rib Ra is 0.1 mm and the threshold value is 0.05 mm for the data shown in FIG.

  Next, the data processed in this way is extracted with vertex data for each block, with a period crossing the rib Ra in the Y-axis direction and the X-axis direction as one block, and interpolation processing is performed for them as shown in FIG. Waviness data of the rib Ra on the substrate K as shown in (d) is generated.

  The waviness data can be used as control data for controlling the height of the nozzle 18 when applying the paste. That is, the coordinate position of the height change point of the nozzle 18 due to the undulation on the paste application path based on the paste pattern data is set from the control data of the height, and when the nozzle 18 reaches this coordinate position, the undulation data is converted into the undulation data. Originally, the distance (gap) between the nozzle 18 and the substrate K is changed. In this case, the change in the height of the nozzle 18 corresponds to the difference between the height control data immediately before the coordinate position of the height change point and the height control data with respect to the coordinate position of the height change point. It is.

  In FIG. 10, when the data conversion process in step 700 is completed, the substrate K is returned to the original θ direction by the amount corresponding to the shift set angle Δθ and rotated in the θ direction in step 500. That is, the substrate K is returned to the positioning state executed in step 400 so that the longitudinal direction of the rib Ra on the substrate K and the paste application direction on the substrate K have a predetermined relationship (step 800).

  Then, the pattern application of the paste is performed in order from the first paste pattern data in the preset application order (step 900). This pattern coating process will be described with reference to FIG.

  In the figure, application conditions are first set (step 901). That is, since the RAM built in the microcomputer 8a (FIG. 6) has a storage table for setting application conditions, the application speed of the first paste pattern to be applied and drawn, application pressure, It is set like the coating height. Such setting is performed up to the final paste pattern. In addition, application pattern movement data, start point coordinates, end point coordinates, suck back pressure (negative pressure that accumulates at the tip of the nozzle or sucks dripping paste into the nozzle), the amount of nozzle rise after application is completed, etc. The For these settings, data necessary for application is selected from the data preset in step 200 of FIG. 10 and copied to the storage table of the RAM as application conditions.

  Next, in order to position the paste discharge port of the nozzle 18 at the set application start position, the Y-axis movement tables 5a and 5b and the X-axis movement table 6 are driven (step 902), and the Z-axis movement table support base 2 ( 2) is moved to move the nozzle 18 over the drawing (coating) start point.

  Next, the height of the nozzle 18 is set by the Z-axis drive motor 20 (FIG. 2) (step 903). This set height is the coating height already stored in the RAM, and the gap between the nozzle 18 and the substrate K is made equal to this coating height.

  When the above processing is completed, the Y-axis movement tables 5a and 5b and the X-axis movement table 6 are driven based on the paste pattern data stored in the RAM in the microcomputer 8a. With the outlet facing the substrate K, it moves in the X and Y axis directions according to the paste pattern data (step 904).

  In FIG. 6, the air pressure adjusted to the application pressure by the positive pressure regulator 43 is applied from the positive pressure source 41 to the syringe 17 via the valve unit 45, and the paste starts to be discharged from the paste discharge port of the nozzle 18 ( Step 905).

  At this time, the negative pressure adjusted to the suck back pressure by the negative pressure regulator 44 from the negative pressure source 42 to the syringe 17 immediately before the paste is discharged is applied through the valve unit 45 for a short time, and the paste of the nozzle 18 is applied. Inhale the paste accumulated in the discharge port. As a result, the paste can be applied without causing paste accumulation at the starting end of the paste pattern.

  Along with the start of the coating drawing operation, the microcomputer 8a monitors the position of the nozzle 18 from the coordinate positions of the Y-axis movement tables 5a and 5b and the X-axis movement table 6. Then, it is determined whether or not the height change point is set by the swell control data obtained in step 700 (step 906).

  When the coordinate position of this height change point is reached, the microcomputer 8a reads the height control data immediately before this coordinate position and the height control data at this coordinate position from the RAM (step 907). By driving the Z-axis drive motor 20 based on the read control data, the height of the nozzle 18 is controlled by the amount corresponding to the difference between the height control data as described above. Thus, the paste pattern is applied and drawn so that the set height of the nozzle 18 from the surface of the substrate K is constant, that is, the set application height is obtained (step 908). It should be noted that the set amount of the gap from the rib bottom of the substrate K to the paste discharge port tip surface of the nozzle 18 is preferably about 1.2 to 5 times the rib height.

In this way, the paste pattern application drawing proceeds. Whether the paste pattern application drawing operation is continued or finished is determined whether the application point is the end of the paste pattern to be applied determined by the paste pattern data. If it is not determined to end (step 909), and if it is not the end, the operation of steps 906 and 909 (if it is not the height change point) or the processing operation of steps 906 to 909 is executed, and the paste application continues.

  Thereafter, when the application end of the paste pattern is reached (step 909), in FIG. 6, the application of the air pressure adjusted to the application pressure by the positive pressure regulator 43 from the positive pressure source 41 to the syringe 17 through the valve unit 45. And the discharge of the paste from the paste discharge port of the nozzle 18 is stopped (step 910).

  Then, the Z-axis drive motor 20 is driven to raise the nozzle 18 by a preset amount of increase (step 911).

  The paste pattern application operation from step 901 to step 913 is performed until all of the set paste pattern data is used up, that is, until all paste patterns to be applied have been applied (step 913). When the end of the pattern is reached, the pattern application (step 900) is terminated (step 913).

When the application and drawing of the paste pattern on one substrate K is completed as described above, the process proceeds to the substrate discharge process (step 1000) in FIG. That is, in FIG. 1, the suction of the substrate K by the substrate holding mechanism 3 is released, and the substrate K is discharged out of the apparatus by moving the substrate transport conveyors 2a and 2b in the Y direction. At this time, when the liquid level detection sensor 16 mounted on the coating head 7 detects that the remaining amount of paste in the syringe 17 has decreased, the paste tank 28 through the valve 29 and the paste supply pipe 15 The paste is pumped into the syringe 17 by the supply amount set in the microcomputer 8a.

  Then, it is determined whether or not all the above processes are completed (step 1100), and when a paste pattern is applied and drawn on a plurality of substrates K using the same paste pattern data, another substrate K is applied. Returning to the substrate mounting process (step 300), the operation (process) described above is repeated.

  When the series of processes for all the substrates K is completed, all the operations are completed (step 1200).

  As mentioned above, although one Example of this invention was described, this invention is not limited only to this Example. For example, the substrate K may have a single display portion during panel assembly.

  For example, in the above embodiment, the nozzle 18 is movable and the substrate K is fixed at the time of drawing the paste pattern. However, the present invention is not limited to this, and the nozzle 18 is fixed and the substrate K is movable. Also good.

  Further, as a method for transporting the substrate K, the substrate transport conveyors 2a and 2b are transported in the X-axis direction to above the substrate holding mechanism 3. However, the substrate transport conveyors 2a and 2b are arranged in parallel to the Y-axis direction. However, the substrate K may be transported in the Y-axis direction. Further, cleaning of the nozzle 18 and detection of clogging of the nozzle may also be performed when the substrate is carried out.

  In the above-described embodiment, the waviness measurement is performed by shifting the substrate K in the θ direction at the time of waviness measurement. However, a moving mechanism for moving the distance sensor 19 by a minute distance in the X-axis direction orthogonal to the scanning direction is provided. When the operation of step 600 in FIG. 10 is performed by the distance sensor 19, a paste pattern is formed by moving the distance sensor 19 in a direction perpendicular to the scanning direction by such a moving mechanism. Alternatively, scanning may be performed in the vicinity of the paste application path and along a path oblique to the paste application path. In FIG. 2, only one distance sensor 19 is described. However, two or more distance sensors 19 may be mounted, and the measurement data may be averaged for application.

  Further, in the above embodiment, the case where the drawing coating is performed on the substrate K of the striped rib Ra as shown in FIG. 5A has been described as an example, but the cross-shaped rib as shown in FIG. 5B. Waviness of the substrate of Rb is measured by a drawing operation, and the coating height of the nozzle 18 is adjusted so that the gap between the nozzle 18 and the substrate K becomes a set height based on the obtained waviness data, and the rib Rb A dot application operation may be performed for each of the enclosed regions, or in order to further reduce the processing time, a drawing application may be applied to the substrate K of the striped rib Ra.

1 is a perspective view showing an overall configuration of an embodiment of a paste applicator according to the present invention. It is a perspective view which expands and shows the part of the application | coating head part in FIG. It is a figure which shows one specific example of the nozzle syringe calibration mechanism in the Example shown in FIG. It is a figure which shows one specific example of the pneumatic supply piping in the Example shown in FIG. It is a perspective view which shows the specific example of the board | substrate in the Example shown in FIG. It is a block diagram which shows one specific example of the control system of the Example shown in FIG. It is a figure which shows one specific example of the nozzle of the paste applicator in this invention. It is a figure which shows one specific example of the nozzle front-end | tip part (paste discharge port) in FIG. It is a figure which shows one Example of the nozzle height position structure mechanism in FIG. 1, and the Z-axis direction height position calibration of the nozzle in FIG. 2 is a flowchart showing a specific example of a paste application operation in the embodiment shown in FIG. It is a flowchart which shows a specific example of step 600 in FIG. It is explanatory drawing of a specific example of step 700 in FIG. It is a flowchart which shows one specific example of step 900 in FIG. It is explanatory drawing of the measurement operation | movement of the distance (gap) between the nozzle and a board | substrate by the non-contact triangulation sensor as a distance sensor shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Stand, 2 ... Z-axis movement table support base, 2a, 2b ... Substrate conveyance conveyor, 3 ... Substrate holding mechanism, 4 ... θ-axis movement table, 5a, 5b ... Y-axis movement table, 6 ... X-axis movement table, DESCRIPTION OF SYMBOLS 7 ... Coating head, 8 ... Main control part, 8a ... Microcomputer, 8b ... Image input part, 8c ... External interface part, 8d ... Drive control part, 8e ... Data bus, 9 ... Pneumatic unit, 10 ... Monitor, 11 ... Keyboard, 12 ... Syringe lid, 13 ... Pneumatic supply pipe, 14 ... Syringe holding base, 14a-14h ... Actuator, 15 ... Paste supply pipe,
DESCRIPTION OF SYMBOLS 16 ... Liquid level detection sensor, 17 ... Syringe (paste storage cylinder), 18 ... Nozzle, 19 ... Distance sensor, 20 ... Z-axis drive motor, 21 ... Z-axis movement table, 28 ... Tank, 29 ... Valve, 80 ... Nozzle Height position calibration mechanism, 81 ... paste recovery mechanism, 82 ... nozzle cleaning mechanism,
83: Nozzle clogging detection mechanism, K: Substrate.

Claims (7)

A syringe having a nozzle having a plurality of discharge ports, a substrate holding table on which a substrate is placed so as to face the discharge ports, and a paste filled in the syringe being discharged onto the substrate from the discharge ports, In a paste applicator for applying and drawing a paste pattern of a desired shape on the substrate by changing the relative positional relationship between the substrate and the nozzle,
A detector for detecting the amount of paste in the syringe; and a mechanism for supplying paste into the syringe based on the detection result of the detector; and a nozzle syringe calibration mechanism for adjusting the mounting position of the syringe. Feature paste applicator. In the paste applicator according to claim 1,
The nozzles provided on the syringe are arranged in a vertical or horizontal row or two-dimensionally in a plurality of vertical and horizontal rows, and provided with a nozzle tip protection rib for protecting the tip of the nozzle so as to sandwich the nozzle row. Feature paste applicator. In the paste applicator according to claim 2,
A height position calibration mechanism for calibrating the height position of the nozzle in the vertical direction is provided at one end portion of the substrate holding table on which the substrate is placed, and the height position calibration mechanism has both ends in the nozzle row direction. A paste applicator characterized in that a pressure-sensitive sensor is provided on the part side.   2. The paste applicator according to claim 1, wherein a low thermal expansion material is used as the nozzle material.   3. The paste applicator according to claim 1, wherein a water repellent thin film coating treatment or a plating thin film treatment is applied to a nozzle surface portion. 4.   The paste applicator according to any one of claims 1 to 3, further comprising a cleaning mechanism for a nozzle discharge hole tip and a mechanism for detecting nozzle clogging. A syringe having a nozzle having a plurality of discharge ports; a table on which a substrate is placed so as to face the discharge ports; and a substrate filled with the syringe while discharging paste from the discharge ports onto the substrate; In a paste application method for applying and drawing a paste pattern of a desired shape on the substrate by changing the relative positional relationship with the nozzle,
The syringe position is adjusted by operating the nozzle syringe calibration mechanism provided on the syringe holding base using the measurement value measured by the nozzle height position calibration mechanism provided adjacent to the substrate holding table before starting the application or at the time of changing the syringe. Calibrate,
After measuring the waviness of the substrate in advance, coating is performed while controlling the ejection hole surface at the tip of the nozzle to the desired substrate coating height position, and a paste pattern of the desired shape is being drawn on the substrate. In addition, the paste application method is characterized in that the application is performed while correcting the application position from the amount of change in the positional deviation of the concavo-convex pattern formed on the substrate.

Images