JP2008011312A - Piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that a support base composed of a heat-fusible substance is arranged on a container for surely fix a piezoelectric vibrating element in a conventional piezoelectric device, but when the support base is fused by heat, the fused support base material is moved on the surface of space in a depression part or stuck to the surface of the piezoelectric vibrating element, causing instabilization in the vibrating characteristic of the piezoelectric vibrating element and the generation of defects in the piezoelectric device. <P>SOLUTION: In the piezoelectric device, the support base is formed by a thermoplastic substance whose melting temperature is higher than the thermal solidification temperature of a conductive adhesive and the support base is formed so as to be partially inserted into a recess formed in a bottom in the space of the depression part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a piezoelectric device that is one of electronic components used in electronic equipment such as portable communication equipment, and more particularly to a piezoelectric device having a support base that supports a piezoelectric vibration element mounted in the piezoelectric device. .

  Conventionally, a piezoelectric vibrator in which various electrodes are formed on the surface of a piezoelectric base plate and mounted in an airtight state inside a container body, an integrated circuit element in which this piezoelectric vibrator or a piezoelectric vibrator and an oscillation circuit are built-in, etc. Are widely used in electronic devices such as portable communication devices and electronic computers, such as piezoelectric oscillators that are mounted in the same container or piezoelectric filters that separate specific frequency bands. .

  As an example of such a conventional piezoelectric device, FIG. 6 shows an embodiment of a piezoelectric vibrator. The piezoelectric vibration element 61 used for the piezoelectric vibrator 60 is formed on the front and back main surfaces of the piezoelectric element plate 62 in an excitation electrode 63 for exciting the piezoelectric element plate 62 and a container body 66 that houses the piezoelectric vibration element 61. A container body connection electrode 64 for connecting to the element connection electrode pad 67 to be connected, and an extraction electrode 65 for electrically connecting the excitation electrode 63 and the container body connection electrode 64 are formed. . With the downsizing of the piezoelectric vibrator 60, a small strip shape has become mainstream as the shape of the piezoelectric base plate 62.

  The piezoelectric vibration element 61 configured as described above is disposed in a recessed space 69 having an opening in one main surface of the container body 66 formed in the container body 66, and is substantially parallel to the inner bottom surface of the recessed space 69. Arrange so that At that time, the conductive connection material 68 containing conductive metal filler such as silver is electrically connected between the container body connection electrode 64 of the piezoelectric vibration element 61 and the element connection electrode pad 67 of the container body 66. In addition, the piezoelectric vibration element 61 is fixed.

  The conductive adhesive 68 is applied between the container body connection electrode 64 of the piezoelectric vibration element 61 and the element connection electrode pad 67 of the container body 66 and then subjected to heat solidification treatment. The adhesive adhesive 68 can hold the piezoelectric vibration element 61 in the container body 66 after being heated and solidified. However, since the conductive adhesive 68 before solidification is a soft body having fluidity, the piezoelectric vibration element 61 is vibrated. It is difficult to hold the element in a desired posture for a certain time. Therefore, the posture of the piezoelectric vibration element 61 is between the piezoelectric vibration element 61 and the bottom surface in the recess space 69 on the free end opposite to the fixed end fixed by the conductive adhesive 68 of the piezoelectric vibration element 61. Is formed in a posture that is substantially parallel to the inner bottom surface of the recess space 69.

  The support portion 70 is made of a heat-meltable substance, and contacts the lower surface of the free end side of the piezoelectric vibration element 61 before the conductive adhesive 68 is solidified to support the posture of the piezoelectric vibration element 61 in a desired state. Then, after the conductive adhesive 68 is heated and solidified, the support portion 70 is heated and melted to be separated from the free end side of the piezoelectric vibration element 61.

  In such a form, a metal lid 71 is disposed in the opening of the container body 66 in which the piezoelectric vibration element 61 is mounted in the recessed space 69, and the internal space of the container body 66 is hermetically sealed, so A child 60 is formed.

  In addition, as a piezoelectric device other than the above-described piezoelectric vibrator, an integrated circuit including a piezoelectric vibration element and an oscillation circuit electrically connected to the piezoelectric vibration element in the concave space in the container as described above. There are a piezoelectric oscillator in which an element is mounted together, a piezoelectric filter in which a piezoelectric vibration element mounted inside functions as a filter, and the like.

Moreover, the following prior art documents are disclosed about the piezoelectric vibrator of the above forms.
JP 2006-80599 A

  In addition, the applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the above prior art document information.

  However, in the conventional piezoelectric device as described above, the support portion 70 made of a hot-melt material is disposed on the container body in order to securely fix the piezoelectric vibration element. When melted by the above, there is a possibility that the melted support material adheres to the surface of the piezoelectric vibration element, and the vibration characteristics and the like of the piezoelectric vibration element become unstable.

  Further, in the conventional form of the piezoelectric device, since the melted support part material easily flows out into the inner surface of the recess space of the container body, the support part material is a metal material having conductivity. In such a case, the element connection electrode pads and other conductive wires formed on the inner surface of the concave space of the container body may be unnecessarily short-circuited, resulting in a defective product as a piezoelectric device.

  The present invention has been conceived in view of the above-described drawbacks. Therefore, the object of the present invention is to solidify the conductive adhesive while supporting the mounting posture of the piezoelectric vibration element mounted inside the device in a desired state. In addition, since it has a container structure and a support portion structure that does not support after solidification, does not flow out to the inner surface of the recess space, and does not adhere to the piezoelectric vibration element, there is no occurrence of product defects as a piezoelectric device. Another object of the present invention is to provide a piezoelectric device in which the vibration characteristics of the piezoelectric vibration element mounted in the piezoelectric device are not changed.

The present invention has been made to solve the above-described problems, and one form of the present invention is that a recessed space opened on one main surface of the container body is formed in the container body formed of an insulating material. A pair of element connection electrode pads and a support base are formed in the recessed space, and at least the main surface shape is substantially square on the element connection electrode pads and the support base, and the front and back sides thereof. A piezoelectric vibration element having an excitation electrode on each of the main surfaces and a container connection electrode extending from the excitation electrode to one edge of each main surface is formed by the container connection electrode and the element connection. In the piezoelectric device having at least a configuration in which the electrode pads are arranged in opposition, and the element connection electrode pad and the container body connection electrode are housed and fixed by mechanically and electrically connecting with a conductive adhesive,
The support base is formed of a thermoplastic material having a melting temperature higher than the thermal solidification temperature of the conductive adhesive, and the support base is provided in a form in which a part is inserted into a recess formed in the bottom surface of the recessed space. It is the piezoelectric device characterized by the above.

As another form, a recessed space opened in one main surface of the container body is formed in the container body made of an insulating material, and a pair of element connecting electrode pads is formed in the recessed space. A support base is formed on the element connection electrode pad and the support base, and at least the main surface shape is a substantially quadrangular shape. A piezoelectric vibration element in which a container body connection electrode extending on one edge of the surface is formed is disposed in such a manner that the container body connection electrode and the element connection electrode pad face each other, and the element connection electrode pad and In the piezoelectric device having at least a form in which the container body connecting electrode is housed and fixed by mechanically and electrically connecting with the electrode for connecting the container body,
The support base is provided in a form in which a part is inserted into a recess formed in the bottom surface of the recess space, and the support base is a laminated structure of at least two layers, and a first layer portion in contact with the inner surface of the recess is provided. The laminated portion formed of a thermoplastic material having a melting temperature higher than the heat solidification temperature of the conductive adhesive and formed on the first layer portion and the uppermost layer portion being in contact with the piezoelectric vibration element is the first layer. The piezoelectric device is characterized by being formed of a thermoplastic material or a heat-resistant material having a melting temperature higher than the melting temperature of the part.

Further, as another embodiment, an insulating substrate having a pair of element connection electrode pads and a support base formed on one main surface, and at least the main surface shape of the element connection electrode pad and the support base is substantially rectangular. And a piezoelectric vibration element having a container body connecting electrode formed on each of the front and back main surfaces, and an electrode for container body extending from the excitation electrode to one edge of each main surface. The electrode and the element connection electrode pad are arranged in a facing state, and the element connection electrode pad and the container body connection electrode are stored and fixed at least by mechanically and electrically connecting with a conductive adhesive. In a piezoelectric device having
The support base is formed of a thermoplastic material having a melting temperature higher than the heat-setting temperature of the conductive adhesive, and the support base is provided in a form in which a part is inserted into a recess formed in the bottom surface of the concave space. It is a piezoelectric device characterized by being made.

Furthermore, as another embodiment, an insulating substrate having a pair of element connection electrode pads and a support base formed on one main surface, and at least a main surface shape on the element connection electrode pad and the support base. A piezoelectric vibration element having a substantially rectangular shape and formed with an excitation electrode on each of the front and back main surfaces thereof and a container body connection electrode extending from the excitation electrode to one edge of each main surface is formed in a container body. The connection electrode and the element connection electrode pad are arranged so as to face each other, and the element connection electrode pad and the container body connection electrode are housed and fixed by mechanically and electrically connecting with a conductive adhesive. In a piezoelectric device having at least
The support base is provided in a form in which a part is inserted into a recess formed in the bottom surface of the recess space, and the support base is a laminated structure of at least two layers, and a first layer portion in contact with the inner surface of the recess is provided. The laminated portion formed of a thermoplastic material having a melting temperature higher than the heat solidification temperature of the conductive adhesive and formed on the first layer portion and the uppermost layer portion being in contact with the piezoelectric vibration element is the first layer. A piezoelectric device characterized in that it is formed of a thermoplastic material or a heat-resistant material having a melting temperature higher than the melting temperature of the part.

  In the piezoelectric device according to the above paragraphs (0015) and (0017), the shape of the support base is such that the shape of the upper and lower main surfaces of the first layer part constituting the support base is above the first layer part. The area of the upper and lower main surfaces of the first layer portion constituting the support base is similar to the shape of the main surface joined to the first layer portion of the laminated portion formed on the first layer portion. It is smaller than the area of the main surface joined to the first layer part of the formed laminated part, the height of the first layer part is higher than the depth of the recessed part, and further, the opening part shape of the recessed part Is similar to the shape of the main surface of the stacked portion, and the opening area of the recess is larger than the lower main surface area of the first layer portion and smaller than the main surface area of the stacked portion. But there is.

  In the present invention, the support base is formed of a thermoplastic material having a melting temperature higher than the heat solidification temperature of the conductive adhesive, and the support base is partially inserted into a recess formed in the bottom surface of the recess space. Even if the support base is melted by applying the melting temperature of the support base after the conductive adhesive is heated and solidified, the melted support base material remains in the indented portion and is on the inner surface of the recess space. Will not leak.

  Further, the support base is made of a laminated structure of at least two layers, and the first layer portion in contact with the inner surface of the recess portion is formed of a thermoplastic material having a melting temperature higher than the heat solidification temperature of the conductive adhesive. The laminated portion formed on the first layer portion and the uppermost layer portion in contact with the piezoelectric vibration element is formed of a thermoplastic material or a heat resistant material having a melting temperature higher than the melting temperature of the first layer portion. Even if the first adhesive layer is melted by heating, the melting temperature of the first layer portion of the support base is applied to melt the first layer portion of the support base. It does not flow out onto the inner surface of the recess space. In addition, the laminated part formed on the first layer part of the support base has a melting temperature higher than the melting temperature of the first layer part. Therefore, even if the first layer part melts, the laminated part does not melt. The molten support base material does not adhere to the surface of the piezoelectric vibration element. The unmelted portion of the support base is fixed when the melted first layer portion material is cooled and solidified in the recessed portion, so that it does not move unnecessarily in the recessed space.

  Furthermore, the shape of the upper and lower main surfaces of the first layer portion constituting the support base is similar to the shape of the main surface joined to the first layer portion of the stacked portion formed on the first layer portion. And the area of the upper and lower main surfaces of the first layer part constituting the support base is smaller than the area of the main surface joined to the first layer part of the laminated part formed on the first layer part, The height of the layer portion is higher than the depth of the recessed portion, and the opening shape of the recessed portion is similar to the main surface shape of the laminated portion, and the opening area of the recessed portion is the first layer. The first layer portion is melted by the support base in a form that is larger than the lower principal surface area of the portion and smaller than the principal surface area of the stacked portion, and the melted first layer portion is stopped. Even if the first layer part material melted by the impact from the outside is damaged, it can be blocked by the lower surface of the laminated part that has settled, and the fragments Is discharged to the recess outer never adhere to the piezoelectric vibrating element. Further, the non-molten laminated portion of the support base is configured to cover the opening of the dent portion, and is fixed when the molten first layer material adhering to the surface of the laminated portion is cooled and solidified in the dent portion. Therefore, it does not move unnecessarily in the recess space.

  Due to the above-described action, the piezoelectric device according to the present invention holds the piezoelectric vibration element horizontally by the support base, does not cause a product defect as a piezoelectric device, and vibrates the piezoelectric vibration element mounted in the piezoelectric device. There is an effect that it is possible to provide a piezoelectric device having no variation in characteristics.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object. For the sake of clarity, part of the structure is not shown. Further, the dimensions of the illustrated components are partially exaggerated.

  FIG. 1 is a cross-sectional view illustrating an example of a structure before heating of a support base that supports a piezoelectric vibration element according to an embodiment of the present invention, using a piezoelectric vibrator as one of piezoelectric devices. The piezoelectric vibrator 10 shown in FIG. 1 is generally composed of a piezoelectric vibration element 11, a container body 12, a support base 13, and a lid body 14.

  The container body 12 is formed by laminating a plurality of insulating layers made of a ceramic material such as alumina ceramics or glass-ceramic, for example, and the container body 12 has a rectangular shape in the central region on the upper main surface. A concave space 15 having an opening is formed with an annular sealing conductor pattern 16 on the opening side top surface of the side wall portion surrounding the opening of the concave space 15, and an input terminal and an output on the lower main surface A plurality of external connection electrode terminals 17 including a terminal and a ground terminal are provided. The container body 12 is for accommodating the plate-like piezoelectric vibration element 11 made of quartz, which is one of piezoelectric materials, in the recessed space 15 opened on the upper surface thereof. Excitation electrodes formed on the front and back main surfaces of the piezoelectric vibration element 15 and a pair of element mounting pads 18 that are electrically connected to each other are attached and formed on the bottom surface. The pair of element mounting pads 18 are electrically connected to the excitation electrode of the piezoelectric vibration element 11 via the conductive adhesive 19 on the upper surface side exposed in the concave space 15 and are in contact with the surface of the container body 12. On the side, it is electrically connected to the input / output terminals (input terminals / output terminals) of the external connection electrode terminals 17 through wiring conductors, via-hole conductors, and the like inside the container body 12.

  Further, the container body 11 has a piezoelectric vibration element 11 on the side opposite to the fixed end side that is fixedly conductive by the conductive adhesive 19 of the piezoelectric vibration element 11 when the piezoelectric vibration element 11 is disposed at a desired position in the concave space 15. A recess 20 is formed in the bottom surface of the recess space 15 below the center of the free end. Further, a support portion 13 that supports the piezoelectric vibration element 11 in the recess space 15 in a posture that is substantially parallel to the bottom surface in the recess space 15 is formed on the bottom surface in the recess portion 20. The support base 13 is formed of a thermoplastic material having a melting temperature higher than the heat solidification temperature of the conductive adhesive 19.

  The piezoelectric vibration element 11 is disposed on the element mounting pad 18 and the support base 13 so as to be positioned on the container mounting electrode 21 formed on the piezoelectric vibration element 11 on the element mounting pad 18. The conductive adhesive 19 is applied between the container connecting electrode 21 and the container body connecting electrode 21, and the posture of the piezoelectric vibration element 11 is held by the conductive adhesive 19 and the support base 13.

  In the piezoelectric vibration element 11 having a desired posture, the conductive adhesive 19 that holds the posture is heated to solidify the conductive adhesive 19. By solidifying the conductive adhesive 19, the piezoelectric vibration element 11 and the element mounting pad 18 are electrically and mechanically connected, and the posture of the piezoelectric vibration element 11 can be maintained with only the conductive adhesive 19.

  After the conductive adhesive 11 is solidified, a melting temperature of the support base 13 higher than the temperature applied when the conductive adhesive 11 is thermally solidified is added to the support base 13, the support base 13 is melted, and the molten support base 13 A raw material is accumulated in the hollow part 20, and the raw material of the support stand 13 which was melt | dissolved after that is cooled and solidified. In addition to the cooling by natural heat radiation, this cooling may be forcedly performed by bringing the cooling medium into contact with the molten material of the support base 13.

  For example, when the piezoelectric vibration element 11 accommodated in the recessed space 15 of the container body 12 uses quartz as the material of the piezoelectric material constituting the piezoelectric vibration element 11, the crystal base plate is made from a synthetic lens. It is cut out at a cut angle and has an external shape. It is roughly flat and the main surface is circular or quadrangular, and a pair of excitation electrodes are attached and formed on both the front and back main surfaces of the quartz base plate. When a fluctuating voltage is applied to the quartz base plate via the excitation electrode, excitation occurs in a predetermined vibration mode and frequency.

  FIG. 2 is a partial cross-sectional view showing another structure before heating of a support base that supports a piezoelectric vibration element in a piezoelectric vibrator as another embodiment of the piezoelectric device of the present invention. This figure shows the same place as the dotted circle A shown in FIG. The structure of the piezoelectric vibrator other than the structure of the support base 30 in FIG. 2 is the same as the structure of the piezoelectric vibrator shown in FIG. 1 or FIG. That is, the container body 11 has a piezoelectric vibration element 11 on the opposite side of the fixed end side that is fixedly conductive by the conductive adhesive 19 of the piezoelectric vibration element 11 when the piezoelectric vibration element 11 is disposed at a desired position in the concave space 15. A recess 20 is formed in the bottom surface of the recess space 15 below the center of the free end. Further, on the bottom surface in the recess portion 20, a support portion 30 that supports the piezoelectric vibration element 11 in the recess space 15 in a posture that is substantially parallel to the bottom surface in the recess space 15 is formed. This support base 30 has a laminated structure of two layers, and the first layer portion 30a in contact with the inner surface of the recess portion is formed of a thermoplastic material having a melting temperature higher than the heat solidification temperature of the conductive adhesive material 19, The second layer portion 30b formed on the first layer portion 30a and having the uppermost portion in contact with the piezoelectric vibration element 11 is made of a thermoplastic material or a heat resistant material having a melting temperature higher than the melting temperature of the first layer portion 30b. Is formed.

  The support 30 and the element mounting pad (not shown in FIG. 2, but having the same form as the element mounting pad 18 shown in FIG. 1. Hereinafter, the container connecting electrode and the conductive adhesive are also the same). The piezoelectric vibration element 11 is disposed on the element mounting pad so as to be positioned on the container body connecting electrode formed on the piezoelectric vibration element 11, and is electrically conductive between the element mounting pad and the container body connecting electrode. A conductive adhesive is applied, and the posture of the piezoelectric vibration element 11 is held by the conductive adhesive and the support base 30.

  In the piezoelectric vibration element 11 having a desired posture, the conductive adhesive holding the posture is heated to solidify the conductive adhesive. By solidifying the conductive adhesive, the piezoelectric vibration element 11 and the element mounting pad are electrically and mechanically connected, and the posture of the piezoelectric vibration element 11 can be maintained with only the conductive adhesive.

  After the conductive adhesive 11 is solidified, the melting temperature of the first layer portion 30a of the support base 30 higher than the temperature applied when the conductive adhesive 11 is thermally solidified is added to the support base 30, and the first layer portion 30a is melted. Then, the material of the melted first layer part 30 b is stored in the recessed part 20. At this time, the second layer portion 30b formed on the upper portion of the first layer portion 30a is not melted because the melting temperature of the first layer portion 30a is high, and the first layer is melted while keeping the original shape. The part 30a sinks into the recessed part 20 where the material is accumulated. Since the second layer portion 30b does not melt, there is no concern that the melted support base material adheres to the surface of the piezoelectric vibration element 11.

  Thereafter, the melted material of the first layer portion 30a is cooled and solidified. In addition to this cooling by natural heat radiation, this cooling may be forcedly performed by bringing the cooling medium into contact with the material of the first layer portion 30a. By solidifying the melted first layer portion 30 a, the second layer portion 30 b that has settled in the melted first layer portion 30 a is also fixed in the recessed portion 20. Further, although the above-described form of the support base 30 is disclosed as a two-layer structure having the simplest structure, the second layer portion 30b may be a laminated portion formed by laminating materials having a melting point higher than that of the first layer portion 30a. Absent.

  FIG. 3 is a partial cross-sectional view showing another structure before heating of a support base that supports a piezoelectric vibration element in a piezoelectric vibrator as another embodiment of the piezoelectric device of the present invention. This figure shows the same place as the dotted circle A shown in FIG. The structure of the piezoelectric vibrator other than the structure of the support base 40 in FIG. 3 is the same as the structure of the piezoelectric vibrator shown in FIG. 1 or FIG. That is, the container body 11 has a piezoelectric vibration element 11 on the opposite side of the fixed end side that is fixedly conductive by the conductive adhesive 19 of the piezoelectric vibration element 11 when the piezoelectric vibration element 11 is disposed at a desired position in the concave space 15. A recess 20 is formed in the bottom surface of the recess space 15 below the center of the free end. Further, a support portion 40 that supports the piezoelectric vibration element 11 in the recess space 15 in a posture that is substantially parallel to the bottom surface in the recess space 15 is formed on the inner bottom surface of the recess portion 20.

  The support base 40 has a laminated structure of two layers, and the first layer portion 40a in contact with the inner surface of the recess portion is formed of a thermoplastic material having a melting temperature higher than the heat solidification temperature of the conductive adhesive material 19, The second layer portion 40b formed on the first layer portion 40a and having the uppermost portion in contact with the piezoelectric vibration element 11 is made of a thermoplastic material or a heat resistant material having a melting temperature higher than the melting temperature of the first layer portion 40b. Is formed. Further, the external form of the support base 40 is such that the shape of the upper and lower main surfaces of the first layer part 40a constituting the support base 40 is the first of the second layer part 40b formed on the first layer part 40a. It is similar to the shape of the main surface joined to the layer portion 40a, and the area of the upper and lower main surfaces of the first layer portion 40a constituting the support base 40 is the second formed on the first layer portion 40a. The area of the main surface of the layer portion 40b that is joined to the first layer portion 40a is smaller, the height of the first layer portion 40a is higher than the depth of the recessed portion 20, and the opening of the recessed portion 20 The shape of the part is similar to the shape of the main surface of the second layer part 40b, the opening area of the recess 20 is larger than the area of the lower main surface of the first layer part 40a, and the main surface of the second layer part 40b. The form is smaller than the area.

  The piezoelectric vibration element 11 is placed on the support base 40 and the element mounting pad (not shown in FIG. 3 but having the same form as the element mounting pad 18 shown in FIG. 1), and the piezoelectric vibration element 11 is placed on the element mounting pad. The conductive adhesive is applied between the element mounting pad and the container connection electrode, and a piezoelectric material is applied by the conductive adhesive and the support base 40. The posture of the vibration element 11 is maintained.

  In the piezoelectric vibration element 11 having a desired posture, the conductive adhesive holding the posture is heated to solidify the conductive adhesive. By solidifying the conductive adhesive, the piezoelectric vibration element 11 and the element mounting pad are electrically and mechanically connected, and the posture of the piezoelectric vibration element 11 can be maintained with only the conductive adhesive.

  After the conductive adhesive material 11 is solidified, the melting temperature of the first layer portion 40a of the support base 40 higher than the temperature applied when the conductive adhesive material 11 is thermally solidified is added to the support base 40 to melt the first layer portion 40a. Then, the material of the melted first layer portion 40 a is accumulated in the hollow portion 20. At this time, the second layer portion 40b formed on the upper portion of the first layer portion 40a is not melted because the melting temperature of the first layer portion 40a is high, and the first layer is melted while keeping the original shape. The portion 40a moves onto the bottom surface in the recessed space 15 so as to cover the opening of the recessed portion 20 where the material is accumulated. In addition, since the second layer portion 40b is not melted, there is no concern that the melted material of the support base adheres to the surface of the piezoelectric vibration element 11, and the action of suppressing the unnecessary behavior of the first layer portion 40a in the hollow portion 20 is eliminated. Also made.

  Thereafter, the melted material of the first layer portion 40a is cooled and solidified. In addition, this cooling may be forcibly cooled by bringing the cooling medium into contact with the material of the first layer portion 40a in addition to cooling by natural heat dissipation. By solidifying the melted first layer portion 40a, the second layer portion 40b that has moved to the opening of the recess portion 20 with the melted first layer portion 40a attached to the surface is also fixed on the recess portion 20. The Moreover, although the form of the support base 40 described above is disclosed as a two-layer structure having the simplest structure, the second layer portion 40b may be a laminated portion formed by laminating materials having a melting point higher than that of the first layer portion 40a. Absent.

  In FIG. 4, the forms before and after heating and melting of the support tables 13, 30, and 40 described above are shown in the case of the support table 13 (a), the case of the support table 30 (b), and the support table 40. The case is illustrated in FIG.

  Note that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, a piezoelectric vibrator having a box-shaped container body in which a piezoelectric vibration element is mounted in a recessed space in the container body and the recessed space opening is hermetically sealed with a flat lid. However, the present invention is not limited to the above-described embodiment, and a pair of element connection electrode pads 18 and a recess 20 are formed on one main surface as shown in FIG. In addition, on the insulating substrate 51 in which the support base 13 is formed in the hollow portion 20, and on the element connection electrode pad 18 and the support base 13, at least the main surface shape is substantially square and the front and back main surfaces Each of the piezoelectric vibrating elements 11 formed with an excitation electrode and a container body connection electrode extending from the excitation electrode to one edge of each main surface is formed into a container body connection electrode 21 and an element connection electrode. Pads 18 are arranged in the form of facing each other The element connection electrode pad 18 and the container body connection electrode 21 are housed and fixed by mechanically and electrically connecting with the conductive adhesive 19, and the box-shaped lid body 52 is used to store and fix the piezoelectric vibration element 11. The present invention can also be applied to the piezoelectric vibrator 50 having the mounting space 53 hermetically sealed.

  Furthermore, in the above-described embodiment, the piezoelectric vibrator, which is one of the piezoelectric devices, has been described as an example, but instead of this, the piezoelectric vibration element 11 and the piezoelectric vibration are placed in the recessed space formed in the container body. A form in which an integrated circuit element incorporating an oscillation circuit electrically connected to the element 11 is mounted together, or as illustrated in FIG. 6, a separate recessed space is formed in the container body 55, and the recessed space The present invention is also applicable to other piezoelectric devices such as a piezoelectric oscillator having a configuration in which the piezoelectric vibration element 11 and the integrated circuit element 56 are separately mounted, and a piezoelectric filter in which the piezoelectric vibration element mounted inside functions as a filter. Is possible.

  Furthermore, in the above-described embodiment, one recess is formed on the bottom surface in the recessed space below the center of the side of the free end opposite to the fixed end that is fixedly conducted by the conductive adhesive of the piezoelectric vibration element. Has been. Furthermore, although one support portion for supporting the piezoelectric vibration element in the recess space and in a posture substantially parallel to the bottom surface in the recess space is formed on the inner bottom surface of the recess portion, the support base is provided with the piezoelectric vibration. The position where the element is supported is not limited to the center of the free end side of the piezoelectric vibration element. If the piezoelectric vibration element can be supported in a desired posture before solidifying the conductive adhesive, Other support platform formation modes such as a two-point support configuration in which a support platform is formed below each of the two corners may be used.

FIG. 1 is a schematic cross-sectional view showing an embodiment of a piezoelectric device according to the present invention, taking as an example a piezoelectric vibrator that is one of the piezoelectric devices. FIG. 2 is a partial cross-sectional view showing another embodiment of the piezoelectric device according to the present invention, showing a portion at the same position as the dotted circle A portion shown in FIG. FIG. FIG. 3 is a partial sectional view showing another embodiment of the piezoelectric device according to the present invention, taking a piezoelectric vibrator as an example of the piezoelectric device as an example, and a portion at the same position as the dotted circle A portion shown in FIG. FIG. FIG. 4 shows the change in form before and after heating and melting of each support table shown in FIGS. 1, 2 and 3 in the case of the support table shown in FIG. It is explanatory drawing which showed the case of the support stand in (b) and the case of the support stand of FIG. FIG. 5 is a schematic cross-sectional view showing another embodiment of the piezoelectric device according to the present invention, taking as an example a piezoelectric vibrator which is one of the piezoelectric devices. (The form of the support base is the same as in FIG. 1) FIG. 6 is a schematic cross-sectional view showing another embodiment of the piezoelectric device according to the present invention, taking as an example a piezoelectric oscillator which is one of the piezoelectric devices. (The form of the support base is the same as in FIG. 1) FIG. 7 is a schematic cross-sectional view showing an example of a conventional piezoelectric device, taking as an example a piezoelectric vibrator that is one of the piezoelectric devices.

Explanation of symbols

10 ... Piezoelectric vibrator (piezoelectric device)
DESCRIPTION OF SYMBOLS 11 ... Piezoelectric vibration element 12 ... Container body 13 ... Supporting base 14 ... Cover body 15 ... Recessed space 18 ... Electrode pad for element connection 19 ... Conductive adhesive material 20 ..Depression part 21 ... Container body connection electrode

Claims (5)

A container space formed of an insulating material has a recessed space opened on one main surface of the container body, and a pair of element connection electrode pads and a support base are formed in the recessed space. On the element connection electrode pad and the support base, at least the main surface has a substantially quadrangular shape, and each of the front and back main surfaces extends from the excitation electrode and the excitation electrode to one edge of each main surface. The piezoelectric vibration element on which the container body connection electrode is formed is disposed in a form in which the container body connection electrode and the element connection electrode pad face each other, and the element connection electrode pad and the container body connection In the piezoelectric device having at least a form in which the electrode is housed and fixed by mechanically and electrically connecting the electrode with a conductive adhesive,
The support base is formed of a thermoplastic material having a melting temperature higher than the thermal solidification temperature of the conductive adhesive, and the support base is partially inserted into a recess formed in the bottom surface of the concave space. A piezoelectric device characterized by being provided. A container space formed of an insulating material has a recessed space opened on one main surface of the container body, and a pair of element connection electrode pads and a support base are formed in the recessed space. On the element connection electrode pad and the support base, at least the main surface has a substantially quadrangular shape, and each of the front and back main surfaces extends from the excitation electrode and the excitation electrode to one edge of each main surface. The piezoelectric vibration element on which the container body connection electrode is formed is disposed in a form in which the container body connection electrode and the element connection electrode pad face each other, and the element connection electrode pad and the container body connection In a piezoelectric device having at least a form in which the electrode is housed and fixed by mechanically and electrically connecting the electrode with a conductive adhesive,
The support base is provided in a form in which a part is inserted into a recess formed in the bottom surface of the recess space, and the support base is a laminated structure of at least two layers, and is a first layer portion in contact with the inner surface of the recess Is formed of a thermoplastic material having a melting temperature higher than the thermal solidification temperature of the conductive adhesive, and a laminated portion formed on the first layer portion and having the uppermost layer portion in contact with the piezoelectric vibration element comprises: A piezoelectric device characterized by being formed of a thermoplastic material or a heat-resistant material having a melting temperature higher than the melting temperature of the first layer portion. An insulating substrate in which a pair of element connection electrode pads and a support base are formed on one main surface, and at least a main surface shape of the element connection electrode pad and the support base is substantially square and its front and back main surfaces Piezoelectric vibration elements each having a surface formed with an excitation electrode and a container body connection electrode extending from the excitation electrode to one edge of each main surface are connected to the container body connection electrode and the element connection The electrode electrode pads are arranged in a form facing each other, and at least the piezoelectric element has a form in which the element connection electrode pad and the container body connection electrode are housed and fixed by mechanically and electrically connecting with a conductive adhesive. On the device
The support base is formed of a thermoplastic material having a melting temperature higher than the thermal solidification temperature of the conductive adhesive, and the support base is partially inserted into a recess formed in the bottom surface of the concave space. A piezoelectric device characterized by being provided. An insulating substrate in which a pair of element connection electrode pads and a support base are formed on one main surface, and at least a main surface shape of the element connection electrode pad and the support base is substantially square and its front and back main surfaces Piezoelectric vibration elements each having a surface formed with an excitation electrode and a container body connection electrode extending from the excitation electrode to one edge of each main surface are connected to the container body connection electrode and the element connection The electrode electrode pads are arranged in a form facing each other, and at least the piezoelectric element has a form in which the element connection electrode pad and the container body connection electrode are housed and fixed by mechanically and electrically connecting with a conductive adhesive. On the device
The support base is provided in a form in which a part is inserted into a recess formed in the bottom surface of the recess space, and the support base has a laminated structure of at least two layers, and is a first layer portion in contact with the inner surface of the recess Is formed of a thermoplastic material having a melting temperature higher than the thermal solidification temperature of the conductive adhesive, and a laminated portion formed on the first layer portion and having the uppermost layer portion in contact with the piezoelectric vibration element comprises: A piezoelectric device comprising a thermoplastic material or a heat-resistant material having a melting temperature higher than the melting temperature of the first layer portion.   5. The structure of claim 2, wherein the shape of the support base is such that the shape of the upper and lower main surfaces of the first layer portion constituting the support base is the first of the stacked portions formed on the first layer portion. It is similar to the shape of the main surface joined to the layer portion, and the area of the upper and lower main surfaces of the first layer portion constituting the support base is the same as that of the stacked portion formed on the first layer portion. It is smaller than the area of the main surface joined to the first layer part, the height of the first layer part is higher than the depth of the hollow part, and the opening shape of the hollow part is the laminated part And the opening area of the recess is larger than the lower main surface area of the first layer portion and smaller than the main surface area of the stacked portion. Item 5. The piezoelectric device according to Item 2 or Item 4.

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