JP2004260512A - Crystal oscillator for surface mounting - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface mounted oscillator the container main body of whichcan be used for various crystal pieces having different length dimensions. <P>SOLUTION: For a crystal oscillator for surface mounting, a step part is provided on an inner side wall on one end side in the length direction in the container main body having a recessed part, a bolster base is provided on the other end part, an IC chip is fixed to the inner bottom surface of the container main body, conducting wires are connected by wire bonding on both sides in the width direction on the inner bottom surface, both sides of one end part of the crystal piece are fixed to the step part on one end side of the recessed part and the other end part is positioned on the bolster base. The bolster base is provided on both inner side wall parts in the width direction in the recessed part of the container main body. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a surface-mounted crystal oscillator (hereinafter referred to as a surface-mounted oscillator) in an industrial technical field, and particularly relates to a surface-mounted oscillator in which quartz pieces having different lengths are accommodated and a container body is shared.
[0002]
[Prior art]
BACKGROUND OF THE INVENTION Due to their small size and light weight, surface mount oscillators are used as a frequency and time reference source especially in portable electronic devices. In recent years, the demand for crystal oscillators has expanded due to the development of electronics, and it has been desired to use a common container body for accommodating crystal blanks.
[0003]
(Example of Prior Art) FIGS. 4 (a) and 4 (b) are views for explaining a conventional example. FIG. 4 (a) is a sectional view of a surface mount oscillator, and FIG. 4 (b) is a plan view of a crystal blank.
[0004]
The surface-mounted oscillator includes an IC chip 2 and a crystal blank 3 housed in a container body 1, covered with a cover 4, and hermetically sealed. The container body 1 is made of a concave multilayer ceramic having a bottom wall 5 and two upper and lower frame walls 6 (ab). On the one end side and the other end side in the length direction of the concave portion, there are a divided step portion and a step portion from which the lower frame wall 6b protrudes.
[0005]
Electrode lands (referred to as IC lands and crystal lands) 7 and 8 for the IC chip are provided on the inner bottom surface of the concave portion and for the crystal piece in the divided steps. The outer surface has external terminals (not shown) for surface mounting, such as a power supply, an output, and a ground, which are electrically connected except for a pair of the plurality of IC lands 7.
[0006]
The IC chip 2 has an IC terminal (not shown) on one main surface, and the other main surface is fixed to the inner bottom surface of the recess by an adhesive. Then, the IC terminal on one main surface and the IC land 7 are electrically connected by wire bonding using a conductive wire 9 such as a gold wire.
[0007]
The crystal blank 3 has excitation electrodes 10 (ab) on both main surfaces, and extends extraction electrodes 11 (ab) on both sides of one end, for example. Then, the other end of the crystal blank 3 is placed on a step as a pillow bed on the other end, and both ends of the extended one end of the extraction electrode 11 (ab) are connected to the crystal land 8 with a conductive adhesive 12 or the like. Adhere (electrically and mechanically connected). The crystal land 8 is electrically connected to the pair of IC lands 7.
[0008]
The cover 4 is made of, for example, metal and is formed by seam or beam welding to a metal ring (not shown) provided on the upper surface of the side wall of the container body 1. Alternatively, the cover 4 is sealed using a resin or glass as a ceramic or the like.
[0009]
[Problems to be solved by the invention]
(Problems of the prior art) However, in the surface mount container having the above-described structure, it is necessary to change the outer shape, particularly the length, of the container body 1 according to the size of the crystal blank 3. However, if it exceeds the degree, there is a problem that parts cannot be shared and productivity is lowered.
[0010]
Note that the thickness of the external dimensions of the crystal blank 3 is determined by the vibration frequency, and for example, spurious vibrations are suppressed by the width and length. For this reason, if the vibration frequency is different, the spurious vibration is controlled by, for example, changing the length dimension while keeping the width constant. This results in different length dimensions.
[0011]
(Object of the Invention) It is an object of the present invention to provide a surface mount oscillator having a container body that can be used in common even if the lengths of the quartz pieces are different.
[00012]
[Means for Solving the Problems]
The present invention relates to a container body in a surface mount oscillator in which an IC chip formed by wire bonding is fixed to an inner bottom surface of a concave portion, and one end of a crystal blank is located on a step on one end and the other end is on a pillow on the other end. And a pillow bed is provided on both inner side walls in the width direction of the vehicle. Thus, when the length of the crystal blank is large, the other end of the crystal blank is positioned on the pillow at the other end, and when the length is small, it is positioned on the pillow provided on both inner side walls. Therefore, the container body can be shared.
[0013]
【Example】
FIG. 1 is a plan view of a surface mount oscillator excluding a cover and a crystal blank for explaining an embodiment of the present invention. The same parts as those in the prior art are denoted by the same reference numerals, and description thereof will be simplified or omitted.
[0014]
As described above, the surface mount oscillator mounts the IC chip 2 by wire bonding (gold wire 9) on the inner bottom surface of the container body 1 and places the other end of the crystal blank 3 on the step on the other end side. Is fixed to the dividing step. In this embodiment, the container main body 1 is provided with a step (a central step) 12 as a pillow on both inner side walls in the width direction of the recess. The central step 12 is formed by projecting the lower frame wall 6b into the recess. A crystal land 8 is formed on the divided step, and an IC land 7 is formed in a drawing area between the divided step on one end, the central step 12 and the step on the other end.
[0015]
In such a case, first, the IC chip 2 is fixed to the inner bottom surface of the container body 1 with an adhesive, and a conductive wire 9 such as a gold wire is electrically connected to the IC land provided in the drawing area by wire bonding. Next, when the length of the crystal blank 3 is small due to spurious or the like, the other end of the crystal blank 3 is placed on the central step 12 and both ends are electrically connected to the crystal land 8 of the divided step. FIG. 2 (a) for mechanical connection. When the length of the crystal blank 3 is large, the other end of the crystal blank 3 is placed on the step on the other end side, and both ends of the crystal blank 3 are connected to the crystal land 8 of the divided step. b) "
[0016]
In this way, even if the length of the crystal blank 3 is particularly different, the container body 1 can be applied as a common component after the gold wire 9 is connected by wire bonding. Therefore, productivity can be improved.
[0017]
[Other matters]
In the above embodiment, the dividing step portion is provided on one end side of the container body 1. However, as shown in FIG. 3, the projecting portion 13 which is continuous with the dividing step portion is provided, and the escape portion of the conductive adhesive 9 is provided. Is also good. Further, the step portion and the center step portion 12 as the pillow bed on the other end side are formed by projecting the lower layer 6b of the frame wall into the concave portion. For example, ceramic is applied on the bottom wall 5 by printing and integrally fired. Alternatively, it may be formed. In this case, it is not always necessary to connect to the inner wall surface of the concave portion, and it may be independent. Further, the pillow bed at the other end may be located at the center or both ends in the width direction.
[0018]
【The invention's effect】
The present invention relates to a container body in a surface mount oscillator in which an IC chip formed by wire bonding is fixed to an inner bottom surface of a concave portion, and one end of a crystal blank is located on a step on one end and the other end is on a pillow on the other end. Since the pillows are provided on both inner side walls in the width direction, a surface mount oscillator can be provided as a container body that can be used in common even if the lengths of the quartz pieces are different.
[Brief description of the drawings]
FIG. 1 is a plan view of a surface-mounted oscillator excluding a cover and a crystal blank for explaining an embodiment of the present invention.
FIG. 2 is a view for explaining an embodiment of the present invention, and FIG. 2 (ab) is a plan view of a surface mount oscillator without a cover.
FIG. 3 is a plan view illustrating another example of the embodiment of the present invention, excluding a cover and a crystal blank.
4A and 4B are diagrams illustrating a conventional example. FIG. 4A is a cross-sectional view of a surface mount oscillator, and FIG. 4B is a plan view of a crystal blank.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Surface mount container, 2 IC chip, 3 crystal pieces, 4 covers, 5 bottom walls, 6 frame walls, 7 IC lands, 8 crystal lands, 9 conductors, 10 excitation electrodes, 11 extraction electrodes, 12 central steps, 13 protrusions Department.

Claims (1)

The container body having the concave portion has a step on the inner wall on one end side in the length direction and a pillow table on the other end, and an IC chip is fixed to the inner bottom surface of the container body, and the width direction on the inner bottom surface is A conductive wire by wire bonding is connected to both sides of the concave portion, and both ends of the crystal piece are fixed to the step portion on one end side of the concave portion, and the other end portion is located on the pillow table. A crystal oscillator comprising a pillow provided on both inner side walls in a width direction in a concave portion of a container body.

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