JP2008000997A - Composition forming for functional thin film for transfer, and manufacturing method for functional thin film coated resin molded article using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composition for preparing a molded article being covered with a functional thin film for imparting desired properties such as conductivity, insulating property and water repellence, and to provide a simple manufacturing method for a functional thin film coated resin molded article using the composition. <P>SOLUTION: This forming composition for the functional thin film for transfer which contains a functional material and a solvent or a dispersion medium is provided. By applying the composition on the surface of a die, a film containing the solvent or the dispersion medium is formed. Then, a resin is introduced to the die under a state in which the solvent or the dispersion medium is remaining on the film, and the molding is performed. Thus, this resin molded article having the functional thin film on at least a part of the surface is manufactured. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a composition for forming a functional thin film for transfer on a mold surface, a method for producing a functional thin film-coated resin molded body using the composition, and a molded body obtained by the method.

  In order to impart various properties to the resin molded body, for example, desired properties such as conductivity, insulation, and water repellency, a functional thin film is formed on the surface thereof. For example, in Patent Document 1, an aqueous dispersion containing an ionomer of an ethylene-unsaturated carboxylic acid copolymer and chitosan is imparted in order to impart water resistance to the surface of a substrate such as a resin molded article, thereby having water resistance. A functional thin film is formed. In the above method, first, a molded body such as a film is formed, and an aqueous dispersion is applied to the surface by means such as dip (dipping) coating or spray coating to form a thin film, and then dried. It is complicated because you need it.

Patent Document 2 describes a method for producing a molded body having an antireflection layer on the surface of a resin base material. In this method, an antireflective layer-providing sheet having an antireflective layer and a heat-fusible layer on the surface of the peelable sheet is set in a mold, a resin is introduced into the mold, and injection molding is performed. A molded body having an antireflection layer on the surface is obtained by fusing the heat-fusible layer to the resin. In this method, it is necessary to first prepare an antireflection layer-added sheet, set it in a mold, and transfer the heat-fusible layer and the antireflection layer from the sheet to the molded body, which makes the operation complicated. It is. Further, depending on the shape and molding conditions of the mold, the resin may not be sufficiently filled into the mold, and a molded body that conforms to the shape of the mold may not be obtained.
JP-A-9-31274 JP 2002-267816 A

  The present invention has been made to solve the above-described conventional problems, and its object is to obtain a molded body having a functional thin film for imparting desired properties such as conductivity, insulation, and water repellency. Another object of the present invention is to provide a composition for forming a functional thin film for transfer, a method for producing a functional thin film-coated resin molded body using the composition, and a molded body obtained by the method.

  The composition for forming a functional thin film for transfer of the present invention contains a functional material and a solvent or a dispersion medium.

  According to one embodiment, the functional material is a conductive polymer.

  According to one embodiment, the conductive polymer has the following formula (1):

(Wherein R ¹ and R ² each independently represent hydrogen or a C _1-4 alkyl group, or together represent a C _1-4 alkylene group which may be optionally substituted) This is a complex of poly (3,4-dialkoxythiophene) having a repeating structure of

  According to one embodiment, the solvent or dispersion medium contains a solvent or dispersion medium having a boiling point of 110 ° C. or higher.

  The method for producing a functional thin film-coated resin molded body of the present invention includes a step of applying the composition for forming a functional thin film for transfer to a mold surface to form a thin film containing a solvent or a dispersion medium, and the thin film In the state in which the solvent or the dispersion medium remains, molding is performed by introducing a resin into the mold to obtain a resin molded body having a functional thin film on at least a part of its surface.

  According to one embodiment, the molding is injection molding.

  The present invention includes a functional thin film-coated resin molded product obtained by the above production method.

  According to this invention, the composition used in order to manufacture the molded object which has a functional thin film of desired properties, such as electroconductivity, insulation, and water repellency, is provided. In the present invention, after forming a thin film by applying this composition to the mold surface, it is possible to obtain a molded body having a functional thin film by introducing a resin under predetermined conditions and performing molding. Become. Therefore, after obtaining the desired molded body, it is not necessary to form a thin film on the surface by a process such as coating and drying, or to prepare a transfer sheet in advance before the molding process, and it is easy to function. A molded body having a thin film can be obtained. The obtained functional thin film-coated resin molded article has desired functionality and can be used in a wide range of fields.

  The composition for forming a functional thin film for transfer of the present invention (hereinafter sometimes referred to as “composition for forming a thin film for transfer” or simply “composition”) comprises a functional material, a solvent or a dispersion medium, and If necessary, it contains a binder, a conductivity improver, a crosslinking agent, a leveling agent and the like. Hereinafter, components contained in the composition of the present invention, the composition of the present invention, and a method for producing a functional thin film-coated resin molded body using the composition will be described in order.

1. Functional material The functional material contained in the composition for forming a thin film for transfer of the present invention is a material for imparting desired functionality to the surface of the molded body. For example, if the target function is conductive, it is a conductive material such as a conductive polymer, metal, or metal oxide. If the target function is insulating, it is an insulating material such as an insulating resin. If the function is color, dyes, pigments, light emitters, and the like. These materials are not particularly limited as long as they are materials that can be dissolved in a solvent or dispersed in a dispersion medium. The amount of the functional material is not particularly limited as long as the amount of the functional material exhibits a target level when formed into a thin film. In consideration of workability and the like, it is generally contained in the composition at a ratio of 1 to 60% by mass.

  Hereinafter, the present invention will be described by taking as an example the case where the functional material is a conductive polymer.

  There is no restriction | limiting in particular in the kind of said conductive polymer. Preferred conductive polymers include polythiophene, polyaniline, polypyrrole and derivatives thereof, and mixtures thereof. Above all, the following formula (1)

(Wherein R ¹ and R ² each independently represent hydrogen or a C _1-4 alkyl group, or together represent a C _1-4 alkylene group which may be optionally substituted) A complex of poly (3,4-dialkoxythiophene) having a repetitive structure and a polyanion is particularly preferable.

2. Solvent or Dispersion Medium The solvent or dispersion medium contained in the composition of the present invention is not particularly limited as long as it can dissolve or disperse the functional material, and any of water, aqueous solvents, and organic solvents can be used. is there.

  In the case of an aqueous solvent, a mixed solvent of water and an organic solvent miscible with water can be used. The organic solvent miscible with water is not particularly limited, and examples thereof include the following solvents: alcohols such as methanol, ethanol, 2-propanol, 1-propanol, n-butanol; ethylene glycol, diethylene glycol, triethylene Ethylene glycols such as glycol and tetraethylene glycol; glycol ethers such as ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether and diethylene glycol dimethyl ether; ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, Glycol ethers such as diethylene glycol monobutyl ether acetate Acetates; propylene glycols such as propylene glycol, dipropylene glycol, tripropylene glycol; propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, propylene glycol dimethyl ether, dipropylene glycol Propylene glycol ethers such as dimethyl ether, propylene glycol diethyl ether, dipropylene glycol diethyl ether; propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether Propylene glycol ether acetates such as Tate; N- methylformamide, N, N- dimethylformamide, N- methylpyrrolidone, dimethylacetamide, dimethyl sulfoxide, acetone, acetonitrile and their blends.

  In the case where the solvent or dispersion medium is an organic solvent system, the above-mentioned solvents that are miscible with water and the solvents that are immiscible with water can be mentioned. The latter includes toluene, xylene (o-, m-, or p-xylene) ), Benzene, ethyl acetate, butyl acetate, methyl ethyl ketone, methyl isobutyl ketone, diethyl ether, diisopropyl ether, methyl-t-butyl ether, hexane, heptane, and the like. Normally, when the functional material and the additive contained as needed are completely dissolved in the solvent, the solvent is a “solvent” and any component is not dissolved but dispersed. If it is, it is described as “dispersion medium”.

  When the boiling point of the solvent or dispersion medium is 105 ° C. or lower, it is preferable that a solvent having a boiling point of 110 ° C. or higher is further contained. By containing such a solvent, evaporation of the solvent or the dispersion medium is suppressed. Therefore, when the composition for forming a transfer thin film is applied to the mold surface as described later and the resin is introduced into the mold with the solvent or dispersion medium remaining, the composition is applied onto the mold. It becomes easy to control the time from application to introduction of the resin to molding and the mold temperature, and the workability is excellent.

  As the solvent having a boiling point of 110 ° C. or higher, among the above solvents, toluene (boiling point: 110.6 ° C.), n-butanol (boiling point: 117.7 ° C.), ethylene glycol dimethyl ether (boiling point: 121 ° C.), o-xylene (Boiling point: 144.4 ° C), m-xylene (boiling point: 139.1 ° C), p-xylene (boiling point: 138.3 ° C), N, N-dimethylformamide (boiling point: 153 ° C), ethylene glycol (boiling point) 197.2 ° C.). In the present specification, such a high-boiling point solvent or dispersion medium may be referred to as an “evaporation inhibiting solvent or dispersion medium”.

3. Other ingredients in the composition
3.1 Binder The binder that can be contained in the composition of the present invention is usually suitably contained in the composition when the functional material itself has poor film formability and adhesion. Examples of such binders include homopolymers such as polyester, poly (meth) acrylate, polyurethane, polyvinyl acetate, polyvinylidene chloride, polyamide, polyimide; styrene, vinylidene chloride, vinyl chloride, and alkyl (meth) acrylate. A copolymer having a copolymer component selected from the group consisting of: 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane And alkoxysilane compounds. When the binder is contained, the amount is not particularly limited, but it is usually contained in the composition at a ratio of 95% by mass or less.

3.2 Conductivity improver When the functional material in the composition of the present invention is a conductive polymer, a conductivity improver can be contained for the purpose of improving conductivity. As such a conductivity improver, an organic solvent miscible with water is used. For example, ethylene glycol, diethylene glycol, propylene glycol, trimethylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, catechol, cyclohexanediol, diethylene glycol monoethyl Examples include ether, cyclohexanedimethanol, glycerin, dimethyl sulfoxide, N-methylpyrrolidone, N-methylformamide, N, N-dimethylformamide, γ-butyrolactone, isophorone, propylene carbonate, and cyclohexanone. These may be used individually by 1 type and may use 2 or more types together. These organic solvents may be used also as a solvent or a dispersion medium. When the conductivity improver is contained, the amount is not particularly limited, but it is usually contained in the composition at a ratio of 95% by mass or less.

3.3 Crosslinking agent The composition of the present invention may contain a crosslinking agent for the purpose of improving the strength of the functional thin film on the surface of the obtained molded article. Examples of such crosslinking agents include melamine crosslinking agents, polycarbodiimide crosslinking agents, polyoxazoline crosslinking agents, polyepoxy crosslinking agents, and polyisocyanate crosslinking agents. When the crosslinking agent is contained, the amount is not particularly limited, but it is usually contained in the composition at a ratio of 70% by mass or less.

3.4 Leveling Agent The composition of the present invention may contain a surfactant, alcohol, etc. as a leveling agent. Surfactant gives leveling improvement effect, and alcohol gives leveling improvement effect and drying improvement effect. When the leveling agent is contained, the amount is not particularly limited, but it is usually contained in the composition at a ratio of 20% by mass or less.

4). Resin used for molded body The resin forming the main body of the functional thin film-coated resin molded body of the present invention is not particularly limited as long as it is a moldable resin. For example, polyolefin resins such as polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-acrylic acid ester copolymer, ionomer copolymer, cycloolefin resin; polyethylene terephthalate, polybutylene terephthalate, polycarbonate, polyoxyethylene, Polyester resins such as modified polyphenylene and polyphenylene sulfide; polyamide resins such as nylon 6, nylon 6,6, nylon 9, semi-aromatic polyamide 6T6, semi-aromatic polyamide 6T66, semi-aromatic polyamide 9T; acrylic resin; polystyrene; acrylonitrile Examples thereof include styrene copolymers; acrylonitrile-butadiene-styrene copolymers, vinyl chloride resins, and the like.

5. Composition for forming functional thin film for transfer and method for producing functional thin film-coated resin molded body using the composition As described above, the composition of the present invention comprises a functional material, a solvent or a dispersion medium, and Depending on the case, it contains a binder, a conductivity improver, a crosslinking agent, a leveling agent and the like. This composition is usually used in the form of a solution or dispersion in which these components are mixed. This solution or dispersion is obtained by dissolving or dispersing the functional material and other materials in a solvent by stirring and mixing the above components using a normal stirrer or the like. The temperature at the time of stirring and mixing is not particularly limited, but is preferably a temperature not higher than the boiling point of each component contained. In the case of a dispersion, it is possible to obtain a dispersion in which insoluble components are dispersed in the form of nano-sized fine particles in a dispersion medium by the above method.

  In order to produce a functional thin film-coated resin molded article by the method of the present invention, first, a molding machine for producing a molded article having a desired shape is prepared. The molding machine is not particularly limited as long as it is a molding machine having a mold. For example, an injection molding machine, a blow molding machine, a press molding machine, etc. are mentioned.

  The composition (coating liquid) in the state of the above solution or dispersion is applied to the mold surface. The providing method is not particularly limited. For example, a thin film containing a solvent or a dispersion medium (a thin film in a wet state) is formed by applying a method such as spray coating or brush coating to a portion of the mold surface that is in contact with the resin introduced during molding. . This thin film is applied to the desired part of the mold. For example, when a thin film is formed over the entire surface of the target molded body, the entire mold interior and when a thin film is formed on a part of the molded body, the mold corresponding to the target portion is formed. A thin film is formed on the part. The film is then dried as needed. The temperature at which the coating liquid is applied and the temperature at the time of drying are not particularly limited, and may vary depending on the type and concentration of the coating liquid, the shape of the target molded body, the type of molding machine, and the like. In this case, the mold temperature is preferably 30 ° C to 150 ° C, and more preferably 80 ° C to 120 ° C. The drying time is not particularly limited, but is preferably 1 second to 10 minutes, more preferably 5 seconds to 2 minutes. It is necessary that the solvent or dispersion medium remain in the wet thin film or the dried thin film. The amount is not particularly limited, but is usually 3 to 5000 parts by mass, preferably 5 to 100 parts by mass when the solid content in the thin film is 100 parts by mass. For example, a tack-free (touch-drying) state and a state in which a solvent or a dispersion medium remains is preferable. The thickness of the thin film at this time is not particularly limited, but is preferably in the range of 0.02 μm to 1.00 μm, and more preferably in the range of 0.01 to 0.50 μm.

  Molding is performed by introducing a resin into the mold while the solvent or dispersion medium remains in the thin film on the mold. Specifically, in one process for obtaining a resin molded body, the thin film is formed on the surface of the mold, and in the subsequent molding process, the thin film is transferred to the surface of the resin molded body. It is formed. As an example, a method for producing a functional thin film-coated resin molded body by injection molding will be described below, but the method of the present invention is not limited thereto.

  First, a granular resin material (thermoplastic resin pellets) is introduced into an injection molding machine, and is sent into a heating cylinder by the rotation of a screw to melt the resin material. The temperature at which the resin is melted varies depending on the type of resin, but is usually in the range of 150 ° C to 350 ° C. Next, a coating liquid is applied to the mold surface of the injection molding machine by a technique such as spray coating, and a thin film in a wet state is formed as described above, and dried as necessary. The temperature of the mold at this time is a temperature range in which the resin can solidify when the molten resin is introduced into the mold, and is usually in the range of 30 ° C to 150 ° C. Next, in a state where the solvent or dispersion medium remains on the thin film on the mold surface, the mold is closed, and the screw is advanced and pressurized to inject the molten resin into the mold. To do. As a result, the molten resin flows into the mold, and the solvent or dispersion medium contained in the thin film of the mold is evaporated by the heat of the molten resin. Vapor generated by evaporation and air in the mold are discharged to the outside through a gas vent. When the injection of the resin is finished, the temperature of the molten resin decreases due to the mold temperature, and eventually solidifies. After the resin is solidified, the mold can be opened and the resin molded body whose surface is covered with the functional thin film can be taken out.

  The obtained molded body has a desired functional thin film on at least a part of its surface. In such a coated resin molded body, the adhesion of the thin film to the resin molded body is extremely high. This is considered because the resin melted at the time of molding is introduced into the mold and comes into contact with the coating film on the mold, and at this time, the surface portion of the thin film is compatible with the resin. In this way, according to the present invention, for example, by using a conductive polymer as a functional material, a resin molded body in which the entire surface or a part of the surface is conductive can be obtained. The functional thin film-coated molded body is suitably used for applications according to the purpose. For example, a molded article having a conductive surface is suitably used for a semiconductor transport container, a tray for packaging electronic components, and the like.

  EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples.

I. Materials and equipment used
I.1 Functional Material As an aqueous dispersion containing a functional material, an aqueous dispersion of a conductive polymer composed of a complex of poly (3,4-dialkoxythiophene) and polyanion is used. C. Baytron P manufactured by Starck Co. was used. This material is an aqueous dispersion having a solid content of 1.3% by mass, and the remaining 98.7% is water.

I.2 Dispersion medium Water was used as the dispersion medium. Most of this water is water contained in Baytron P, but the newly added water was used after ion exchange treatment. Further, ethylene glycol (reagent grade 1) manufactured by Nacalai Tesque Co., Ltd. was used as a dispersion medium for suppressing evaporation.

I.3 Binder Gabsen ES-210 manufactured by Nagase ChemteX Corporation was used as an aqueous dispersion containing a binder. This product is an aqueous dispersion with a solid content of 25%.

I.4 Conductivity improver and other materials N-methylpyrrolidone (reagent grade 1) manufactured by Nacalai Tesque Co., Ltd. was used as the conductivity improver. As a surfactant, Plus Coat RY-2 manufactured by Kyodo Chemical Industry Co., Ltd. was used.

I.5 Molding Resin As the polycarbonate, Iupilon S3000N manufactured by Mitsubishi Engineering Plastics Co., Ltd., which is a pellet-shaped polycarbonate, was used after removing moisture by vacuum drying at 110 ° C. for 12 hours. ZEONOR is a cycloolefin resin, and ZEONOR 1020R manufactured by Nippon Zeon Co., Ltd., which is a pellet-shaped resin, is used as it is.

I.6 Molding Machine As an injection molding machine, PLUS250 manufactured by Battenfeld was used. The size of the resin injection portion of the mold is 80 mm long × 50 mm wide × 3.2 mm thick (plate shape).

II. Evaluation methods
II.1 Functional thin film transfer rate The functional thin film transfer rate from the mold surface to the molded product was expressed as a percentage by visually evaluating the area of the functional thin film coating portion relative to the surface area of the obtained resin molded product. . For example, a transfer rate of 50% means that half of the surface area of the molded body is covered with a functional thin film, and the thin film corresponding to the remaining half remains on the mold.

II.2 Surface resistivity The surface resistivity was measured according to JIS K6911 using a Hirester UP (MCP-HT450) manufactured by Mitsubishi Chemical Corporation.

II.3 Total Light Transmittance and Haze Value The total light transmittance and haze value were measured using a haze computer HGM-2B manufactured by Suga Test Instruments Co., Ltd. according to JIS K7150.

II.4 Adhesiveness The adhesiveness of the thin film to the substrate was evaluated according to a cross-cut peel test of JIS K5400.

III. Preparation of coating liquid Each component shown in Table 1 was mixed to prepare three types of compositions (coating liquids) in a dispersion state for forming a functional thin film for transfer. The coating liquid A, the coating liquid B, and the coating liquid C were used for the following examples and comparative examples, respectively.

(Example 1)
A mold was set in an injection molding machine, and the coating liquid A was spray coated on the mold surface maintained at 100 ° C. to form a wet thin film. After drying this thin film for 10 seconds, polycarbonate resin melted at 250 ° C. was poured into the mold, held for 10 seconds, and then opened to obtain a plate-shaped coated resin molded body. The functional thin film transfer rate to the surface of the obtained molded body, the surface resistivity of the molded body, the total light transmittance and the haze value, and the adhesion of the thin film were evaluated.

  Table 2 shows the type of coating solution used, molding resin, and thin film drying time, and Table 3 shows the results of the test. In this example, after the thin film drying time of 10 seconds, the dispersion medium remained in the thin film.

  Table 2 also shows the types of coating solutions, molding resins, and thin film drying times of the following Examples and Comparative Examples, and Table 3 also shows the results of each test.

(Comparative Example 1)
The same operation as in Example 1 was performed except that the drying time of the thin film was 180 seconds. In this case, the thin film after drying was completely dried and the dispersion medium was not substantially present.

(Example 2)
Example 1 is the same as Example 1 except that the molding resin is ZEONOR.

(Comparative Example 2)
The same as in Example 1 except that the molding resin was ZEONOR and the drying time of the thin film was 180 seconds.

(Example 3)
The same as Example 1 except that the coating liquid B was used as the coating liquid.

(Comparative Example 3)
The same as Example 1 except that the coating liquid B was used as the coating liquid and the drying time of the thin film was set to 180 seconds.

Example 4
The same as Example 1 except that the coating liquid C was used as the coating liquid and the drying time of the thin film was 180 seconds.

(Example 5)
The same as Example 1 except that the coating liquid C was used as the coating liquid.

  Referring to Tables 2 and 3, when comparing Example 1 and Comparative Example 1, in the case of Example 1 in which molding was performed with the dispersion medium remaining on the thin film on the mold, the thin film had a transfer rate. It was transferred onto the compact at a high rate of 95%. On the other hand, in the case of Comparative Example 1 in which the thin film was completely dried, the transfer rate was a low value of 40%. This is considered to be because in Example 1, when the thin film was not completely dried, the thin film was not sufficiently adhered to the mold, and thus was easily transferred to the resin surface. . On the other hand, in the case of Comparative Example 1 in which the thin film is completely dried, it is considered that the thin film is firmly adhered to the mold, and thus it is difficult to transfer to the resin surface.

  The surface resistivity of the coated molded body obtained in Example 1 is 1.2E + 06Ω / □, and has sufficient antistatic performance. This coated molded article has a total light transmittance of 80% or more and a haze value of 19.0%, and sufficient transparency is maintained. This is considered to be because the transparency of the resin can be maintained because the thin film is thin. Furthermore, the adhesion of the thin film transferred to the resin was 10 points, which was a sufficient value.

  The zeonore resin used in Example 2 and Comparative Example 2 is a cycloolefin resin, which is known to be relatively poor in adhesiveness with other resins. In Example 2, the adhesion of the ZEONOR resin to the molded body was low, but it was found that the ZEONOR resin was transferred to the surface of the molded body at a sufficiently high transfer rate (70%). In contrast, in Comparative Example 2, the transfer rate was 0%.

  Example 3 and Comparative Example 3 are examples in which the binder component of the coating liquid of Example 1 and Comparative Example 1 was reduced from 22% by mass to 13% by mass, respectively. The evaluation of transfer rate, surface resistivity, total light transmittance, haze value and adhesion was almost the same as in Example 1 and Comparative Example 1, and the haze value was slightly low.

  In Example 4, although the drying time of the thin film is relatively long as in Comparative Example 1, the dispersion liquid contains 13% by mass of ethylene glycol having a boiling point of 197.2 ° C. (Ethylene glycol) remains in the thin film. As a result, the thin film was transferred to the surface of the molded body with a high transfer rate of 100%. This is an extremely high value compared to 40% of Comparative Example 1.

  In Example 5, only the drying time was shortened under the same conditions as in Example 4, but the transfer rate, surface resistivity, total light transmittance, haze value, and adhesion were substantially the same as in Example 4. It was a result.

  As described above, it can be seen that the thin film is transferred to the resin surface at a high transfer rate by the molding method in which the dispersion medium remains on the thin film on the mold.

  According to the present invention, a composition for preparing a molded body having a functional thin film having desired properties such as conductivity, insulation, and water repellency, a method for producing a functional thin film-coated resin molded body using the composition, and A functional thin film-coated resin molded product obtained by the method is provided. According to the above method, since the functional thin film is transferred from the mold to the surface of the molded body simultaneously with molding, a functional thin film-coated resin molded body can be easily obtained.

Claims (7)

  A composition for forming a functional thin film for transfer, comprising a functional material and a solvent or dispersion medium.   The composition according to claim 1, wherein the functional material is a conductive polymer. The conductive polymer has the following formula (1):

(Wherein R ¹ and R ² each independently represent hydrogen or a C _1-4 alkyl group, or together represent a C _1-4 alkylene group which may be optionally substituted) The composition according to claim 2, which is a complex of poly (3,4-dialkoxythiophene) having a repeating structure of the following and a polyanion.   The composition according to any one of claims 1 to 3, wherein the solvent or dispersion medium contains a solvent or dispersion medium having a boiling point of 110 ° C or higher. A step of applying a composition for forming a functional thin film for transfer according to any one of claims 1 to 4 to a mold surface to form a thin film containing a solvent or a dispersion medium, and a solvent or a dispersion medium on the thin film A step of obtaining a resin molded body having a functional thin film on at least a part of its surface by introducing a resin into the mold in a state where the resin remains, and performing molding,
A method for producing a functional thin film-coated resin molded body, comprising:   The manufacturing method according to claim 5, wherein the molding is injection molding.   A functional thin film-coated resin molded product obtained by the production method according to claim 5 or 6.