JP2007535136A - ケーシング装置 - Google Patents
ケーシング装置 Download PDFInfo
- Publication number
- JP2007535136A JP2007535136A JP2006549892A JP2006549892A JP2007535136A JP 2007535136 A JP2007535136 A JP 2007535136A JP 2006549892 A JP2006549892 A JP 2006549892A JP 2006549892 A JP2006549892 A JP 2006549892A JP 2007535136 A JP2007535136 A JP 2007535136A
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- Prior art keywords
- conduit
- distributor
- casing
- feed
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 230000008878 coupling Effects 0.000 claims description 12
- 238000010168 coupling process Methods 0.000 claims description 12
- 238000005859 coupling reaction Methods 0.000 claims description 12
- 230000000630 rising effect Effects 0.000 claims description 12
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 2
- 239000002826 coolant Substances 0.000 description 7
- 230000005484 gravity Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (7)
- 収容ケーシングを備えたケーシング装置であって、収容ケーシングの内室に冷却装置と、1つ又は複数の電気的なユニットとが収容されており、冷却装置が、収容ケーシングの底部域とルーフ域との間に少なくとも部分的に延在する送り導管及び戻し導管を有しており、これらの送り導管及び戻し導管から結合導管が分岐しており且つ1つ又は複数の電気的なユニットの冷却回路と三次元的に接続している形式のものにおいて、
送り導管(12)及び戻し導管(12)から各1つの分配器導管(14,15)が収容ケーシング(10)の内室(11)に保持された分配器(30)に通じており、該分配器(30)が複数の分配器接続部(31)を有しており、これらの分配器接続部(31)に、電気的な組込み部材(コンピュータユニット41)に通じている接続導管(42,43)が接続可能であることを特徴とする、ケーシング装置。 - 分配器(30)が、収容ケーシング(10)のフロント側(18)の範囲に保持されており且つ収容ケーシング(10)のフロント側の開口を介してアクセス可能であり、立上がり導管として形成された送り導管(12)及び戻し導管(13)が、収容ケーシング(10)の背面側の領域に配置されており、分配器導管(14,15)が、分配器(30)と立上がり導管との間でケーシング奥行き方向に延びている、請求項1記載のケーシング装置。
- 分配器導管(14,15)が、分配器(30)と送り導管(12)若しくは戻し導管(13)との間で傾斜されて設けられており、しかも、分配器導管(14,15)が送り導管及び戻し導管に向かって上昇している、請求項1又は2記載のケーシング装置。
- 分配器(30)に接続された複数の電気的なユニットの少なくとも一部が、重力方向で見て分配器(30)の下位に配置されている、請求項1から3までのいずれか1項記載のケーシング装置。
- 分配器(30)が、送り導管(12)及び戻し導管(13)に対応配置された2つの室を有する中空成形部材として形成されているか、又は分配器(30)が、送り導管(12)及び戻し導管(13)に対応配置された2つの分離された中空成形区分を有している、請求項1から4までのいずれか1項記載のケーシング装置。
- 電気的なユニットがコンピュータ演算ユニット、特に挿入パワーブレードとして形成されており、この挿入パワーブレードが別のコンピュータ演算ユニットと一緒に1つのサーバ(10)、特にブレードサーバに組み込まれている、請求項1から5までのいずれか1項記載のケーシング装置。
- 接続導管(42,43)が、ドロップフリーで接合・分離可能なカップリングを介して分配器接続部(31)に接合可能であり且つ/又は分配器導管(14,15)が、ドロップフリーで接合・分離可能なカップリングを介して送り導管(12)及び戻し導管(13)に接合可能である、請求項1から6までのいずれか1項記載のケーシング装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004008461A DE102004008461A1 (de) | 2004-02-17 | 2004-02-17 | Gehäuseanordnung |
PCT/EP2004/013199 WO2005081604A1 (de) | 2004-02-17 | 2004-11-20 | Gehäuseanordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007535136A true JP2007535136A (ja) | 2007-11-29 |
JP4404910B2 JP4404910B2 (ja) | 2010-01-27 |
Family
ID=34877063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006549892A Active JP4404910B2 (ja) | 2004-02-17 | 2004-11-20 | ケーシング装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7466549B2 (ja) |
EP (1) | EP1719397B1 (ja) |
JP (1) | JP4404910B2 (ja) |
CN (1) | CN100452953C (ja) |
DE (2) | DE102004008461A1 (ja) |
ES (1) | ES2287791T3 (ja) |
RU (1) | RU2321975C2 (ja) |
WO (1) | WO2005081604A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011511361A (ja) * | 2008-01-31 | 2011-04-07 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー. | モジュラデータ処理構成要素及びシステム |
Families Citing this family (35)
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TW201004545A (en) * | 2008-07-02 | 2010-01-16 | Ming-Chang Lai | Pipe module of a cabinet for housing electronic equipment |
US7817423B2 (en) * | 2006-03-06 | 2010-10-19 | Graham Andrew Morehead | Peltier-assisted liquid-cooled computer enclosure |
DE202006007275U1 (de) * | 2006-05-06 | 2006-09-07 | Schroff Gmbh | Baugruppenträger mit einem Gehäuse zur Aufnahme von Steckbaugruppen |
CN100403223C (zh) * | 2006-09-04 | 2008-07-16 | 曙光信息产业(北京)有限公司 | 一种刀片服务器机箱 |
DE502007001183D1 (de) * | 2007-01-23 | 2009-09-10 | Schroff Gmbh | Schaltschrank zur Aufnahme elektronischer Steckbaugruppen mit einem Wärmetauscher |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
DE102007061593B4 (de) * | 2007-12-20 | 2012-02-16 | Siemens Ag | Elektronikeinrichtung eines Magnetresonanzgeräts sowie Magnetresonanzgerät mit einer solchen Elektronikeinrichtung |
US8164901B2 (en) * | 2008-04-16 | 2012-04-24 | Julius Neudorfer | High efficiency heat removal system for rack mounted computer equipment |
US7639499B1 (en) * | 2008-07-07 | 2009-12-29 | International Business Machines Corporation | Liquid cooling apparatus and method for facilitating cooling of an electronics system |
US7961475B2 (en) | 2008-10-23 | 2011-06-14 | International Business Machines Corporation | Apparatus and method for facilitating immersion-cooling of an electronic subsystem |
US7944694B2 (en) | 2008-10-23 | 2011-05-17 | International Business Machines Corporation | Liquid cooling apparatus and method for cooling blades of an electronic system chassis |
US7983040B2 (en) | 2008-10-23 | 2011-07-19 | International Business Machines Corporation | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
US7885070B2 (en) | 2008-10-23 | 2011-02-08 | International Business Machines Corporation | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow |
US7916483B2 (en) | 2008-10-23 | 2011-03-29 | International Business Machines Corporation | Open flow cold plate for liquid cooled electronic packages |
DE102009006924B3 (de) * | 2009-02-02 | 2010-08-05 | Knürr AG | Betriebsverfahren und Anordnung zum Kühlen von elektrischen und elektronischen Bauelementen und Moduleinheiten in Geräteschränken |
US7978472B2 (en) * | 2009-06-10 | 2011-07-12 | International Business Machines Corporation | Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof |
US8369091B2 (en) | 2010-06-29 | 2013-02-05 | International Business Machines Corporation | Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
US8351206B2 (en) | 2010-06-29 | 2013-01-08 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit |
US8179677B2 (en) | 2010-06-29 | 2012-05-15 | International Business Machines Corporation | Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
US8345423B2 (en) | 2010-06-29 | 2013-01-01 | International Business Machines Corporation | Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems |
US8184436B2 (en) | 2010-06-29 | 2012-05-22 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
TWI487473B (zh) * | 2011-05-06 | 2015-06-01 | Ind Tech Res Inst | 資料中心之冷卻系統 |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
US9016352B2 (en) | 2012-05-21 | 2015-04-28 | Calvary Applied Technologies, LLC | Apparatus and methods for cooling rejected heat from server racks |
JP5807718B2 (ja) * | 2012-05-31 | 2015-11-10 | 富士通株式会社 | ラック型情報処理装置 |
CN104770073B (zh) * | 2012-09-25 | 2018-04-10 | 液体冷却解决方案公司 | 控制用于液体浸没式电子器件阵列的冷却液压力和冷却液流的方法和装置 |
US8436246B1 (en) | 2012-10-19 | 2013-05-07 | Calvary Applied Technologies, LLC | Refrigerant line electrical ground isolation device for data center cooling applications |
US9049800B2 (en) * | 2013-02-01 | 2015-06-02 | Dell Products L.P. | Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet |
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US10364809B2 (en) | 2013-03-15 | 2019-07-30 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
CN104349638B (zh) | 2013-07-24 | 2017-04-26 | 华为技术有限公司 | 机柜液冷系统及机柜 |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
WO2021229365A1 (en) | 2020-05-11 | 2021-11-18 | Coolit Systems, Inc. | Liquid pumping units, and related systems and methods |
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-
2004
- 2004-02-17 DE DE102004008461A patent/DE102004008461A1/de not_active Withdrawn
- 2004-11-20 WO PCT/EP2004/013199 patent/WO2005081604A1/de active IP Right Grant
- 2004-11-20 EP EP04798024A patent/EP1719397B1/de active Active
- 2004-11-20 CN CNB2004800210574A patent/CN100452953C/zh active Active
- 2004-11-20 JP JP2006549892A patent/JP4404910B2/ja active Active
- 2004-11-20 ES ES04798024T patent/ES2287791T3/es active Active
- 2004-11-20 RU RU2006108384A patent/RU2321975C2/ru active
- 2004-11-20 US US10/576,425 patent/US7466549B2/en active Active
- 2004-11-20 DE DE502004004323T patent/DE502004004323D1/de active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011511361A (ja) * | 2008-01-31 | 2011-04-07 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー. | モジュラデータ処理構成要素及びシステム |
KR101434239B1 (ko) * | 2008-01-31 | 2014-08-26 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 모듈식 데이터 처리 컴포넌트 및 시스템 |
Also Published As
Publication number | Publication date |
---|---|
WO2005081604A1 (de) | 2005-09-01 |
US7466549B2 (en) | 2008-12-16 |
RU2006108384A (ru) | 2006-07-27 |
RU2321975C2 (ru) | 2008-04-10 |
US20070121287A1 (en) | 2007-05-31 |
DE502004004323D1 (de) | 2007-08-23 |
CN1826849A (zh) | 2006-08-30 |
DE102004008461A1 (de) | 2005-10-06 |
EP1719397B1 (de) | 2007-07-11 |
CN100452953C (zh) | 2009-01-14 |
EP1719397A1 (de) | 2006-11-08 |
ES2287791T3 (es) | 2007-12-16 |
JP4404910B2 (ja) | 2010-01-27 |
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