JP2007527122A - 背面薄化処理した固体イメージデバイス - Google Patents
背面薄化処理した固体イメージデバイス Download PDFInfo
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- JP2007527122A JP2007527122A JP2007501764A JP2007501764A JP2007527122A JP 2007527122 A JP2007527122 A JP 2007527122A JP 2007501764 A JP2007501764 A JP 2007501764A JP 2007501764 A JP2007501764 A JP 2007501764A JP 2007527122 A JP2007527122 A JP 2007527122A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/26—Image pick-up tubes having an input of visible light and electric output
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14629—Reflectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Solid State Image Pick-Up Elements (AREA)
Abstract
【選択図】図1
Description
Claims (7)
- 第1及び第2ダイを有する固体イメージデバイスであって、
前記第1ダイは正面及び背面を有し、前記第1ダイは、前記第1ダイの第1領域部分内の前記正面に実質的に配置された画素アレイと、選択された間隔pを有する画素と、前記第1ダイの他の領域部分に配置された前記画素アレイを読み出すための回路と、前記画素アレイと正反対にある前記背面の領域と、から成り、
前記第2ダイは、コリメータ構造のアレイを有し、各コリメータは長さhの視準軸及び前記画素アレイの画素を受容するのに十分な断面を有し、前記断面及び前記画素は同様の幾何形状により特徴付けられており、
前記第1ダイと前記第2ダイを接着するために、前記第1ダイの前記背面の選択された部分に接着媒体が挿入され、
前記コリメータ構造は前記画素アレイに関してわずかに許容ミスアライメントして方向付けられている、
ことを特徴とする固体イメージデバイス。 - 請求項1に記載の固体イメージデバイスであって、前記画素アレイの要素は選択された幾何学的分布を有し、前記コリメータ構造のアレイは実質的に類似の幾何学的分布を有する、ところの固体イメージデバイス。
- 請求項2に記載の固体イメージデバイスであって、前記画素アレイの各要素の境界は間隔t>pだけ離隔され、コリメータの前記アレイのコリメータ構造は側壁を有し、前記側壁はtよりも薄い、ところの固体イメージデバイス。
- 請求項3に記載の固体イメージデバイスであって、コリメータの前記アレイの各コリメータ要素は視準軸を横切る内部領域を有し、前記内部領域は画素のサブアレイを実質的に収容し、前記画素のサブアレイは共通の感応面を形成するよう一緒に結合されている、ところの固体イメージデバイス。
- 請求項4に記載の固体イメージデバイスであって、前記サブアレイは単一の画素から成る、ところの固体イメージデバイス。
- 請求項5に記載の固体イメージデバイスであって、各画素は正方形の感応領域を有する、ところの固体イメージデバイス。
- 請求項1に記載の固体イメージデバイスであって、比率h/pは1から75の範囲にある、ところの固体イメージデバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/795,040 US20040169248A1 (en) | 2003-01-31 | 2004-03-05 | Backside thinning of image array devices |
US10/795,040 | 2004-03-05 | ||
PCT/US2004/035238 WO2005096393A1 (en) | 2004-03-05 | 2004-10-25 | Backside thinning of image array devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007527122A true JP2007527122A (ja) | 2007-09-20 |
JP4976277B2 JP4976277B2 (ja) | 2012-07-18 |
Family
ID=35064083
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007501764A Expired - Fee Related JP4976277B2 (ja) | 2004-03-05 | 2004-10-25 | 背面薄化処理した固体イメージデバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | US20040169248A1 (ja) |
EP (1) | EP1741143B1 (ja) |
JP (1) | JP4976277B2 (ja) |
DE (1) | DE602004030951D1 (ja) |
WO (1) | WO2005096393A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007538367A (ja) * | 2004-05-19 | 2007-12-27 | ボルボ ラストバグナー アーベー | 磁気スイッチ構成、及び差動磁気スイッチを得るための方法 |
JP2011071505A (ja) * | 2009-08-31 | 2011-04-07 | Sumco Corp | 固体撮像素子用半導体ウェーハの薄膜化制御方法 |
JP2013529356A (ja) * | 2010-04-21 | 2013-07-18 | インテヴァック インコーポレイテッド | コリメータ結合構造及びコリメータ結合方法 |
JP7466699B2 (ja) | 2020-05-22 | 2024-04-12 | イオテック,エルエルシー | 小型近接合焦イメージセンサ |
US12002834B2 (en) | 2023-03-03 | 2024-06-04 | Eotech, Llc | Compact proximity focused image sensor |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8482639B2 (en) * | 2008-02-08 | 2013-07-09 | Omnivision Technologies, Inc. | Black reference pixel for backside illuminated image sensor |
US8531565B2 (en) | 2009-02-24 | 2013-09-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Front side implanted guard ring structure for backside illuminated image sensor |
US9142586B2 (en) | 2009-02-24 | 2015-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pad design for backside illuminated image sensor |
US8233066B2 (en) * | 2010-02-18 | 2012-07-31 | Omnivision Technologies, Inc. | Image sensor with improved black level calibration |
US8338856B2 (en) | 2010-08-10 | 2012-12-25 | Omnivision Technologies, Inc. | Backside illuminated image sensor with stressed film |
NL2011905C2 (en) * | 2013-12-06 | 2015-06-09 | Photonis Netherlands B V | Electron-bombarded image sensor device. |
CN112086474A (zh) * | 2020-08-28 | 2020-12-15 | 清华大学深圳国际研究生院 | 荧光探测用图像传感器件 |
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JPH08160145A (ja) * | 1994-12-06 | 1996-06-21 | Toshiba Corp | X線検出器 |
JPH11337646A (ja) * | 1998-05-29 | 1999-12-10 | Toshiba Corp | 放射線半導体検出器、放射線半導体検出器アレイおよびコリメータ設置装置 |
WO2005057603A2 (en) * | 2003-12-03 | 2005-06-23 | Itt Manufacturing Enterprises, Inc. | Surface structures for halo reduction in electron bombarded devices |
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US4348690A (en) | 1981-04-30 | 1982-09-07 | Rca Corporation | Semiconductor imagers |
JPS59108461A (ja) * | 1982-12-14 | 1984-06-22 | Olympus Optical Co Ltd | 固体撮像装置 |
JP2578774B2 (ja) * | 1986-09-02 | 1997-02-05 | 日本板硝子株式会社 | レンズ付きモジュ−ルの製造方法 |
US5688715A (en) | 1990-03-29 | 1997-11-18 | The United States Of America As Represented By The Secretary Of The Navy | Excimer laser dopant activation of backside illuminated CCD's |
US5244817A (en) | 1992-08-03 | 1993-09-14 | Eastman Kodak Company | Method of making backside illuminated image sensors |
US5500540A (en) * | 1994-04-15 | 1996-03-19 | Photonics Research Incorporated | Wafer scale optoelectronic package |
DE59611314D1 (de) * | 1995-05-19 | 2006-01-26 | Heidenhain Gmbh Dr Johannes | Strahlungsempfindliches detektorelement |
US6307586B1 (en) | 1999-07-20 | 2001-10-23 | Intevac, Inc. | Electron bombarded active pixel sensor camera incorporating gain control |
US20020020846A1 (en) * | 2000-04-20 | 2002-02-21 | Bo Pi | Backside illuminated photodiode array |
JP2002319669A (ja) * | 2001-04-23 | 2002-10-31 | Hamamatsu Photonics Kk | 裏面入射型ホトダイオード及びホトダイオードアレイ |
-
2004
- 2004-03-05 US US10/795,040 patent/US20040169248A1/en not_active Abandoned
- 2004-10-25 DE DE602004030951T patent/DE602004030951D1/de active Active
- 2004-10-25 JP JP2007501764A patent/JP4976277B2/ja not_active Expired - Fee Related
- 2004-10-25 EP EP04821873A patent/EP1741143B1/en active Active
- 2004-10-25 WO PCT/US2004/035238 patent/WO2005096393A1/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08160145A (ja) * | 1994-12-06 | 1996-06-21 | Toshiba Corp | X線検出器 |
JPH11337646A (ja) * | 1998-05-29 | 1999-12-10 | Toshiba Corp | 放射線半導体検出器、放射線半導体検出器アレイおよびコリメータ設置装置 |
WO2005057603A2 (en) * | 2003-12-03 | 2005-06-23 | Itt Manufacturing Enterprises, Inc. | Surface structures for halo reduction in electron bombarded devices |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007538367A (ja) * | 2004-05-19 | 2007-12-27 | ボルボ ラストバグナー アーベー | 磁気スイッチ構成、及び差動磁気スイッチを得るための方法 |
JP2011071505A (ja) * | 2009-08-31 | 2011-04-07 | Sumco Corp | 固体撮像素子用半導体ウェーハの薄膜化制御方法 |
JP2013529356A (ja) * | 2010-04-21 | 2013-07-18 | インテヴァック インコーポレイテッド | コリメータ結合構造及びコリメータ結合方法 |
KR101752150B1 (ko) | 2010-04-21 | 2017-06-29 | 인테벡, 인코포레이티드 | 콜리메이터 본딩 구조 및 방법 |
KR101783594B1 (ko) | 2010-04-21 | 2017-10-10 | 인테벡, 인코포레이티드 | 콜리메이터 본딩 구조 및 방법 |
JP7466699B2 (ja) | 2020-05-22 | 2024-04-12 | イオテック,エルエルシー | 小型近接合焦イメージセンサ |
US12002834B2 (en) | 2023-03-03 | 2024-06-04 | Eotech, Llc | Compact proximity focused image sensor |
Also Published As
Publication number | Publication date |
---|---|
EP1741143B1 (en) | 2011-01-05 |
US20040169248A1 (en) | 2004-09-02 |
WO2005096393A1 (en) | 2005-10-13 |
EP1741143A1 (en) | 2007-01-10 |
EP1741143A4 (en) | 2007-07-11 |
DE602004030951D1 (de) | 2011-02-17 |
JP4976277B2 (ja) | 2012-07-18 |
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