DE602004030951D1 - Rückseitendünnung von bild-array-einrichtungen - Google Patents
Rückseitendünnung von bild-array-einrichtungenInfo
- Publication number
- DE602004030951D1 DE602004030951D1 DE602004030951T DE602004030951T DE602004030951D1 DE 602004030951 D1 DE602004030951 D1 DE 602004030951D1 DE 602004030951 T DE602004030951 T DE 602004030951T DE 602004030951 T DE602004030951 T DE 602004030951T DE 602004030951 D1 DE602004030951 D1 DE 602004030951D1
- Authority
- DE
- Germany
- Prior art keywords
- facilities
- back end
- picture array
- picture
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/26—Image pick-up tubes having an input of visible light and electric output
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14629—Reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/795,040 US20040169248A1 (en) | 2003-01-31 | 2004-03-05 | Backside thinning of image array devices |
| PCT/US2004/035238 WO2005096393A1 (en) | 2004-03-05 | 2004-10-25 | Backside thinning of image array devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE602004030951D1 true DE602004030951D1 (de) | 2011-02-17 |
Family
ID=35064083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE602004030951T Active DE602004030951D1 (de) | 2004-03-05 | 2004-10-25 | Rückseitendünnung von bild-array-einrichtungen |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20040169248A1 (de) |
| EP (1) | EP1741143B1 (de) |
| JP (1) | JP4976277B2 (de) |
| DE (1) | DE602004030951D1 (de) |
| WO (1) | WO2005096393A1 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE527101C2 (sv) * | 2004-05-19 | 2005-12-20 | Volvo Lastvagnar Ab | Magnetbrytararrangemang och förfarande för att erhålla en differentialmagnetbrytare |
| US8482639B2 (en) * | 2008-02-08 | 2013-07-09 | Omnivision Technologies, Inc. | Black reference pixel for backside illuminated image sensor |
| US8531565B2 (en) | 2009-02-24 | 2013-09-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Front side implanted guard ring structure for backside illuminated image sensor |
| US9142586B2 (en) * | 2009-02-24 | 2015-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pad design for backside illuminated image sensor |
| TWI440169B (zh) * | 2009-08-31 | 2014-06-01 | Sumco Corp | 固態攝影元件用半導體晶圓的薄膜化控制方法 |
| US8233066B2 (en) | 2010-02-18 | 2012-07-31 | Omnivision Technologies, Inc. | Image sensor with improved black level calibration |
| US8698925B2 (en) | 2010-04-21 | 2014-04-15 | Intevac, Inc. | Collimator bonding structure and method |
| US8338856B2 (en) | 2010-08-10 | 2012-12-25 | Omnivision Technologies, Inc. | Backside illuminated image sensor with stressed film |
| NL2011905C2 (en) * | 2013-12-06 | 2015-06-09 | Photonis Netherlands B V | Electron-bombarded image sensor device. |
| US11621289B2 (en) | 2020-05-22 | 2023-04-04 | Eotech, Llc | Compact proximity focused image sensor |
| CN112086474A (zh) * | 2020-08-28 | 2020-12-15 | 清华大学深圳国际研究生院 | 荧光探测用图像传感器件 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4000503A (en) * | 1976-01-02 | 1976-12-28 | International Audio Visual, Inc. | Cold cathode for infrared image tube |
| US4348690A (en) | 1981-04-30 | 1982-09-07 | Rca Corporation | Semiconductor imagers |
| JPS59108461A (ja) * | 1982-12-14 | 1984-06-22 | Olympus Optical Co Ltd | 固体撮像装置 |
| JP2578774B2 (ja) * | 1986-09-02 | 1997-02-05 | 日本板硝子株式会社 | レンズ付きモジュ−ルの製造方法 |
| US5688715A (en) | 1990-03-29 | 1997-11-18 | The United States Of America As Represented By The Secretary Of The Navy | Excimer laser dopant activation of backside illuminated CCD's |
| US5244817A (en) | 1992-08-03 | 1993-09-14 | Eastman Kodak Company | Method of making backside illuminated image sensors |
| US5500540A (en) * | 1994-04-15 | 1996-03-19 | Photonics Research Incorporated | Wafer scale optoelectronic package |
| JPH08160145A (ja) * | 1994-12-06 | 1996-06-21 | Toshiba Corp | Ｘ線検出器 |
| US5852322A (en) * | 1995-05-19 | 1998-12-22 | Dr. Johannes Heidenhain Gmbh | Radiation-sensitive detector element and method for producing it |
| JPH11337646A (ja) * | 1998-05-29 | 1999-12-10 | Toshiba Corp | 放射線半導体検出器、放射線半導体検出器アレイおよびコリメータ設置装置 |
| US6307586B1 (en) | 1999-07-20 | 2001-10-23 | Intevac, Inc. | Electron bombarded active pixel sensor camera incorporating gain control |
| US20020020846A1 (en) * | 2000-04-20 | 2002-02-21 | Bo Pi | Backside illuminated photodiode array |
| JP2002319669A (ja) * | 2001-04-23 | 2002-10-31 | Hamamatsu Photonics Kk | 裏面入射型ホトダイオード及びホトダイオードアレイ |
| US7023126B2 (en) * | 2003-12-03 | 2006-04-04 | Itt Manufacturing Enterprises Inc. | Surface structures for halo reduction in electron bombarded devices |
-
2004
- 2004-03-05 US US10/795,040 patent/US20040169248A1/en not_active Abandoned
- 2004-10-25 DE DE602004030951T patent/DE602004030951D1/de active Active
- 2004-10-25 JP JP2007501764A patent/JP4976277B2/ja not_active Expired - Fee Related
- 2004-10-25 EP EP04821873A patent/EP1741143B1/de active Active
- 2004-10-25 WO PCT/US2004/035238 patent/WO2005096393A1/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1741143A4 (de) | 2007-07-11 |
| EP1741143B1 (de) | 2011-01-05 |
| EP1741143A1 (de) | 2007-01-10 |
| JP2007527122A (ja) | 2007-09-20 |
| JP4976277B2 (ja) | 2012-07-18 |
| US20040169248A1 (en) | 2004-09-02 |
| WO2005096393A1 (en) | 2005-10-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE602004020318D1 (de) | Abbildungseinrichtung | |
| DE602005001816D1 (de) | Farbbildröhre | |
| ITMI20041123A1 (it) | Fissaggio | |
| DE602004013543D1 (de) | Anschmiegsamer ohrpfropf | |
| DE602005011932D1 (de) | Mosaik-anzeige | |
| DE602005011883D1 (de) | Photoleitendes Bildelement | |
| DE602005020351D1 (de) | Bildprozessor | |
| FI20030261A (fi) | Iskulaite | |
| DE602004016590D1 (de) | Einspritzventil | |
| DE602004020345D1 (de) | Anzeige | |
| DE602004030951D1 (de) | Rückseitendünnung von bild-array-einrichtungen | |
| DE602005012474D1 (de) | Bilderzeugung | |
| DE602005008045D1 (de) | Werbehilfe | |
| NO20034599D0 (no) | Brokonstruksjon | |
| NO20034600D0 (no) | Brokonstruksjon | |
| DK1723626T3 (da) | Visningselement | |
| DE502004005095D1 (de) | Einspritzdüse | |
| DE502004009781D1 (de) | Einspritzventil | |
| NO20051321D0 (no) | Et forbedret teltutbygg | |
| DE502004005873D1 (de) | Einspritzdüse | |
| DE602005000482D1 (de) | Farbbildröhre | |
| ATA152004A (de) | Lesepult | |
| FR2861953B1 (fr) | Crible | |
| UA7805S (uk) | Рекламний іміджевий стілець | |
| ITGE20040085A1 (it) | Bacchetta antisisma |