JP2007515076A - 収縮フィルム上の印刷回路 - Google Patents

収縮フィルム上の印刷回路 Download PDF

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Publication number
JP2007515076A
JP2007515076A JP2006545637A JP2006545637A JP2007515076A JP 2007515076 A JP2007515076 A JP 2007515076A JP 2006545637 A JP2006545637 A JP 2006545637A JP 2006545637 A JP2006545637 A JP 2006545637A JP 2007515076 A JP2007515076 A JP 2007515076A
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JP
Japan
Prior art keywords
polymer film
conductive
surface area
film
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006545637A
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English (en)
Japanese (ja)
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JP2007515076A5 (enExample
Inventor
エル． ボス−ケール，ジェシカ
ジェイ． ハルバーソン，カート
エム． イリタロ，キャロライン
アール． リーマン，マシュー
ジェイ． ボツェット，スティーブン
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3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2007515076A publication Critical patent/JP2007515076A/ja
Publication of JP2007515076A5 publication Critical patent/JP2007515076A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0125—Shrinkable, e.g. heat-shrinkable polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2006545637A 2003-12-18 2004-11-05 収縮フィルム上の印刷回路 Pending JP2007515076A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/739,807 US7033667B2 (en) 2003-12-18 2003-12-18 Printed circuits on shrink film
PCT/US2004/037121 WO2005067356A1 (en) 2003-12-18 2004-11-05 Printed circuits on shrink film

Publications (2)

Publication Number Publication Date
JP2007515076A true JP2007515076A (ja) 2007-06-07
JP2007515076A5 JP2007515076A5 (enExample) 2007-12-06

Family

ID=34677719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006545637A Pending JP2007515076A (ja) 2003-12-18 2004-11-05 収縮フィルム上の印刷回路

Country Status (4)

Country Link
US (2) US7033667B2 (enExample)
EP (1) EP1695600A1 (enExample)
JP (1) JP2007515076A (enExample)
WO (1) WO2005067356A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015211032A (ja) * 2014-04-23 2015-11-24 ゼロックス コーポレイションＸｅｒｏｘ Ｃｏｒｐｏｒａｔｉｏｎ 銀ナノ粒子に基づく伸縮性導電性膜
JP2021526316A (ja) * 2018-07-06 2021-09-30 レイセオン カンパニー 収縮性ポリマーにより支持された微細構造を有する調整された伝導性相互接続構造

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* Cited by examiner, † Cited by third party
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US6943678B2 (en) 2000-01-24 2005-09-13 Nextreme, L.L.C. Thermoformed apparatus having a communications device
US7601406B2 (en) * 2002-06-13 2009-10-13 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7566360B2 (en) * 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7736693B2 (en) * 2002-06-13 2010-06-15 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US7033667B2 (en) * 2003-12-18 2006-04-25 3M Innovative Properties Company Printed circuits on shrink film
US20050136638A1 (en) * 2003-12-18 2005-06-23 3M Innovative Properties Company Low temperature sintering nanoparticle compositions
US7666494B2 (en) * 2005-05-04 2010-02-23 3M Innovative Properties Company Microporous article having metallic nanoparticle coating
JP5009907B2 (ja) * 2005-06-10 2012-08-29 シーマ ナノ テック イスラエル リミティド 向上透明導電性被膜及びそれらを作製する方法
WO2007038950A1 (en) * 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Method for generation of metal surface structures and apparatus therefor
US8293340B2 (en) * 2005-12-21 2012-10-23 3M Innovative Properties Company Plasma deposited microporous analyte detection layer
US7556774B2 (en) * 2005-12-21 2009-07-07 3M Innovative Properties Company Optochemical sensor and method of making the same
US20090082230A1 (en) * 2007-09-21 2009-03-26 Bj Services Company Well Treatment Fluids Containing Nanoparticles and Methods of Using Same
AU2008321027A1 (en) 2007-11-13 2009-05-22 The Regents Of The University Of California Processes for rapid microfabrication using thermoplastics and devices thereof
US8130438B2 (en) * 2008-07-03 2012-03-06 Ajjer Llc Metal coatings, conductive nanoparticles and applications of the same
US20100231672A1 (en) * 2009-03-12 2010-09-16 Margaret Joyce Method of improving the electrical conductivity of a conductive ink trace pattern and system therefor
US8886388B2 (en) 2009-06-29 2014-11-11 The Boeing Company Embedded damage detection system for composite materials of an aircraft
US9452564B2 (en) 2011-02-07 2016-09-27 The Regents Of The University Of California Multi-scale wrinkles for functional alignment of stem cells and cardiac derivatives
US8828302B2 (en) 2011-02-07 2014-09-09 The Regents Of The University Of California Preparation and use of nanowrinkles
US9625819B2 (en) 2011-05-27 2017-04-18 The Regents Of The University Of California Photolithography on shrink film
US20160007473A1 (en) * 2014-07-07 2016-01-07 Hamilton Sundstrand Corporation Method for fabricating printed electronics
US9832875B2 (en) * 2014-07-07 2017-11-28 Hamilton Sundstrand Corporation Method for manufacturing layered electronic devices
CN114683533B (zh) * 2022-04-15 2022-12-02 华中科技大学 制备任意纳米褶皱结构体的3d打印方法、产品以及应用

Citations (1)

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JPS6255993A (ja) * 1985-09-04 1987-03-11 ダブリユー・アール・グレイス・アンド・カンパニー−コネチカツト 印刷回路板の小型化方法

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US6241915B1 (en) * 1998-02-27 2001-06-05 Micron Technology, Inc. Epoxy, epoxy system, and method of forming a conductive adhesive connection
US6376619B1 (en) * 1998-04-13 2002-04-23 3M Innovative Properties Company High density, miniaturized arrays and methods of manufacturing same
US6395483B1 (en) * 1999-09-02 2002-05-28 3M Innovative Properties Company Arrays with mask layers
US6482638B1 (en) * 1999-12-09 2002-11-19 3M Innovative Properties Company Heat-relaxable substrates and arrays
US6881538B1 (en) 2000-03-05 2005-04-19 3M Innovative Properties Company Array comprising diamond-like glass film
JP4355436B2 (ja) 2000-10-25 2009-11-04 森村ケミカル株式会社 配線パターンの形成方法、回路基板の製造方法および遮光パターンの形成された透光体の製造方法
US6586483B2 (en) * 2001-01-08 2003-07-01 3M Innovative Properties Company Foam including surface-modified nanoparticles
US6467897B1 (en) * 2001-01-08 2002-10-22 3M Innovative Properties Company Energy curable inks and other compositions incorporating surface modified, nanometer-sized particles
JP2002266002A (ja) 2001-03-12 2002-09-18 Harima Chem Inc 金属微粒子含有組成物およびその製造方法
US20020142306A1 (en) 2001-03-28 2002-10-03 3M Innovative Properties Company Method of transferring molecules to a film laminate
JP3900248B2 (ja) 2001-03-30 2007-04-04 ハリマ化成株式会社 多層配線板およびその形成方法
JP3842580B2 (ja) 2001-04-13 2006-11-08 ハリマ化成株式会社 合金形成用金属粒子組成物
US6783838B2 (en) 2001-04-30 2004-08-31 3M Innovative Properties Company Coated film laminate having an ionic surface
US6924044B2 (en) 2001-08-14 2005-08-02 Snag, Llc Tin-silver coatings
IL161622A0 (en) 2001-11-01 2004-09-27 Yissum Res Dev Co Ink jet inks containing metal nanoparticles
US20030146019A1 (en) 2001-11-22 2003-08-07 Hiroyuki Hirai Board and ink used for forming conductive pattern, and method using thereof
US7033667B2 (en) * 2003-12-18 2006-04-25 3M Innovative Properties Company Printed circuits on shrink film
US20050136638A1 (en) * 2003-12-18 2005-06-23 3M Innovative Properties Company Low temperature sintering nanoparticle compositions

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JPS6255993A (ja) * 1985-09-04 1987-03-11 ダブリユー・アール・グレイス・アンド・カンパニー−コネチカツト 印刷回路板の小型化方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015211032A (ja) * 2014-04-23 2015-11-24 ゼロックス コーポレイションＸｅｒｏｘ Ｃｏｒｐｏｒａｔｉｏｎ 銀ナノ粒子に基づく伸縮性導電性膜
JP2021526316A (ja) * 2018-07-06 2021-09-30 レイセオン カンパニー 収縮性ポリマーにより支持された微細構造を有する調整された伝導性相互接続構造
JP7113917B2 (ja) 2018-07-06 2022-08-05 レイセオン カンパニー 収縮性ポリマーにより支持された微細構造を有する調整された伝導性相互接続構造
US11638348B2 (en) 2018-07-06 2023-04-25 Raytheon Company Patterned conductive microstructures within a heat shrinkable substrate

Also Published As

Publication number Publication date
US20050136231A1 (en) 2005-06-23
US20060141259A1 (en) 2006-06-29
US7033667B2 (en) 2006-04-25
EP1695600A1 (en) 2006-08-30
WO2005067356A1 (en) 2005-07-21

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