JP2007335762A - Light-emitting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting apparatus which is excellent in heat radiation performance and hardly causes deformation or damage due to an external force in manufacturing processes or when it is mounted on a circuit board. <P>SOLUTION: The apparatus has a package provided with a recess having an internal wall and a bottom surface on its upper surface, and a lead terminal exposed on the bottom surface of the recess and protruding from the side surface of the package. The lead terminal has a first lead terminal receiving a semiconductor light-emitting device to be arranged, and having a thick film region exposed also from the rear surface of the package; and a second lead terminal to be conducted to the semiconductor light-emitting device. In the first lead terminal, the rear surface of the thick film region is on the same plane as that of the rear surface of a protruding region protruding from the side surface of the package. The rear surface of the package has a first rear surface on the same plane as those of the rear surface of the thick film region and the rear surface of the protruding region, and a second rear surface contacting the thick film region and recessed from the first rear surface. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light-emitting device that can be used for a lighting source, a display, a backlight source of a liquid crystal display, and the like.

  As a light emitting device using a semiconductor light emitting element, a light emitting device mounted on a resin package or a ceramic package is known. These packages include a conductive member that can be electrically connected to the outside, and these are electrically connected to the electrodes of the semiconductor light emitting element. Furthermore, the light emitting device is electrically connected to the mounting substrate electrically and mechanically by being soldered to the conductor wiring provided on the mounting substrate.

  In recent years, there has been a demand for higher output of the light emitting device, and a light emitting device having a structure capable of withstanding the heat generated at the time of high output has been studied. In particular, a ceramic package is suitable for a high-power light-emitting device because the material itself is superior in heat resistance compared to a resin package. However, there are problems such as a low degree of freedom in molding and weakness to impact, and it is necessary to solve them. On the other hand, the resin package has a problem in heat resistance as compared with the ceramic package, but has good moldability and excellent mass productivity. Furthermore, the material itself is cheaper than a ceramic package, and the yield is high, so that productivity is excellent.

  In order to solve the above problems, light-emitting devices with improved heat resistance using a highly heat-dissipating member in a resin package have been studied (for example, Patent Documents 1 to 3). Specifically, it has a structure in which a conductive frame (lead terminal) is provided as a conductive member, and a thermally connected portion (heat radiating member) manufactured separately is inserted and coupled to a support portion (package). It has been. With such a structure, the support portion only needs to hold the conductor frame and the thermal connection portion, and heat is released to the outside by the connection portion. In this way, by separating the conductor frame and the thermal connection part, the absorption and release of a larger amount of heat loss can be optimized significantly better than the integrated conductor frame.

Further, the heat dissipation member is exposed so as to occupy most of the back surface of the package, and the heat dissipation member and the lead terminal are in contact with the mounting substrate. Alternatively, the bottom surface of the package and the bottom surface of the heat dissipation member are the same surface, and the entire bottom surface is mounted so as to be in contact with the mounting substrate.
JP 2004-521506 A. Japanese Patent Application Laid-Open No. 2004-343059. JP 2005-33194 A

  However, in the package as described above, the conductor frame (lead terminal) and the thermal connection portion (heat radiating member) are configured as separate members, so that the support component (package) tends to be large. For this reason, the light emitting device itself tends to be large, and it is difficult to cope with downsizing. In addition, when the support component is inserted from the back side after molding, a gap is likely to be generated between the support component and the thermal connection portion, resulting in poor stability. In addition, the support component is deformed or damaged by the load applied at the time of insertion, and the yield tends to decrease. In addition, the positional relationship between the concave portion of the support member serving as the reflector and the thermal connection portion on which the light emitting element is placed has a great influence on the light distribution characteristics of the light emitting device. In the case where the connecting portion is provided as a separate member, quality adjustment is likely to occur, for example, the accuracy of height adjustment is difficult and the optical characteristics are not stable.

  In addition, when the proportion of the heat dissipation member is large compared to the size of the package, as described in Patent Document 1, the heat dissipation member alone is stably mounted, but when the heat dissipation member is relatively small, It lacks stability and heat dissipation is also reduced.

  Furthermore, in the case of the package as described above, it is necessary to bend the lead terminal protruding from the side surface in order to join the mounting substrate on the same surface as the heat radiating member, but depending on the thickness, shape, and size of the lead terminal In some cases, there is a gap between the package and the lead terminal. When such a gap is generated, moisture tends to enter from there, and this may cause deterioration in the life characteristics of the light emitting device.

  In order to achieve the above object, a light emitting device according to the present invention includes a package having a recess having an inner wall and a bottom surface on the top surface, and a lead terminal exposed from the bottom surface of the recess and protruding from the side surface of the package. The lead terminal has a first lead terminal on which the semiconductor light emitting element is mounted and a thick film region exposed from the back surface of the package, and a second lead terminal electrically connected to the semiconductor light emitting element. In the first lead terminal, the back surface of the thick film region and the back surface of the protruding region protruding from the side surface of the package are on the same surface, and the back surface of the package is the same surface as the back surface of the thick film region and the back surface of the protruding region It has the 1st back surface which is on, and the 2nd back surface which contacted the thick film area | region and was recessed from the 1st back surface, It is characterized by the above-mentioned.

  As a result, the lead terminal for supplying power from the outside can also be used for the function of releasing heat from the semiconductor light emitting element to the outside, so the number of components can be reduced and the light emitting device can be downsized. It becomes possible. Furthermore, it is possible to reduce the displacement of each component.

  In addition, since the second back surface of the package is provided in a region in contact with the thick film region of the first lead terminal having a heat dissipation function, a space is formed around the thick film region. This makes it possible to efficiently release heat to the outside. Furthermore, the package around the thick film region is not deformed or deteriorated by heat, and a light emitting device having excellent life characteristics can be obtained.

  The light emitting device according to claim 2 of the present invention is characterized in that the thick film region of the first lead terminal is separated from the side surface of the package. As a result, when the light emitting device is mounted on a mounting substrate or the like, a region around which a joining member such as solder can be secured can be achieved, so that the mounting substrate can be reduced in size. In addition, since it is possible to make it difficult for the solder to reach other adjacent electronic components or the like, problems such as short circuits can be made difficult to occur.

  In the light-emitting device according to claim 3 of the present invention, the thick film region of the first lead terminal is formed on the back surface of the first thick film region on the same surface as the first back surface of the package, and on the outer periphery thereof. And a second thick film region back surface which is on the same surface as the second back surface. Thereby, adhesiveness with a mounting board | substrate can be improved more. In addition, when forming a package using a mold, the molding resin flows into the gap between the thick film region (first lead terminal) and the mold, and an unnecessary portion (burr) is formed after molding. It is possible to make it difficult for defects to occur.

  The light emitting device according to claim 4 of the present invention is characterized in that the back surface of the protruding region of the first lead terminal is in contact with the first back surface of the package. As a result, the protruding region protruding from the package can be mounted on the mounting substrate without being bent.

  In the light emitting device according to claim 5 of the present invention, the first lead terminal has a through hole in a region in contact with the side surface of the package among the protruding regions protruding from the side surface of the package, and the through hole is a side surface of the package. It is filled with the outside protrusion part which protrudes from. By providing the through hole in this way, even a relatively thick lead terminal can be easily bent. Further, by providing the outer protrusion that fills the through hole, the adhesion with the package can be improved.

  According to the present invention, a light-emitting device that has excellent heat dissipation and can be miniaturized can be obtained. In addition, when mounted on a mounting substrate or the like, not only the back surface of the lead terminal but also the back surface (first slope surface) of the package is in contact with the mounting substrate, so that it can be mounted with good stability. In addition, since the back surface of the package that contacts the thick film region of the lead terminal has a back surface (second back surface) that is recessed so as not to contact the mounting surface, heat is efficiently released from the thick film region to the outside. Promptly.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the light emitting device for embodying the technical idea of the present invention, and the present invention does not limit the light emitting device to the following.

  Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. The dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the description unless otherwise specified. It is just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members, and detailed description will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.

  FIG. 1A is a perspective view illustrating a light emitting device 100 of the present invention. Moreover, FIG. 1B is sectional drawing in the XX 'cross section of FIG. 1A, FIG. 1C is the perspective view which looked at FIG. 1A from the back surface side. FIG. 2A is a perspective view illustrating a light emitting device of the present invention. 2B is a cross-sectional view taken along the line X-X ′ of FIG. 2A, FIG. 2C is a perspective view of FIG. 2A viewed from the back side, and FIG. 2D is a perspective view illustrating a lead terminal of the light emitting device of FIG. FIG. 3A is a cross-sectional view illustrating a modification of the light emitting device.

  Referring to FIG. 1A, a package 101 includes a first lead terminal 102 and a second lead terminal 103 that have a concave portion 106 having an inner wall and a bottom surface on the top surface, and a part of which is included in the package. ing. These lead terminals have the bottom exposed regions 102 a and 103 a of the recess exposed at the bottom of the recess 106, and protruding regions 102 b and 103 b that protrude from the side surface of the package 101. A plurality of semiconductor light emitting elements 104 are mounted on the recessed bottom exposed region 102 a of the first lead terminal 102, and a conductive wire 105 is bonded to each semiconductor light emitting element 104. The other end of the conductive wire 105 is connected to the second lead terminal, whereby conduction between the semiconductor light emitting element 104 and the second lead terminal is achieved. Further, a sealing member 110 is filled in the recess so as to cover the semiconductor light emitting element 104 and the conductive wire 105. Further, as shown in FIG. 1B, the first lead terminal 102 has a thick film region 102c so that a part of the first lead terminal 102 is also exposed from the back surface of the package 101. The back surface of the thick film region 102c is adjusted so as to be positioned substantially on the same plane as the back surfaces of the protruding regions 102b and 103b of the first and second lead terminals.

  In the present invention, the back surface of the package is in contact with the thick film region and the first back surface 101b on the same plane as the back surface of the thick film region of the first lead terminal and the back surface of the protruding region. The second back surface 101c is recessed from the back surface. Thereby, it can be set as the light-emitting device which can be mounted to a mounting board | substrate accurately and stably. In addition, since the thick lead region 102c is provided in a part of the first lead terminal 102 for supplying electric power from the outside, the function of directly releasing the heat from the semiconductor light emitting element 104 to the outside can also be used. it can. Therefore, the number of parts can be reduced and the light emitting device can be downsized. Furthermore, the positional deviation of each component can be reduced. Hereinafter, the present invention will be described in detail with reference to the drawings.

(package)
In the present invention, the package is used to protect the semiconductor light emitting element and to integrally form the first and second lead terminals. The shape of the package is preferably a quadrangle or a shape close to this, but is not particularly limited to this, and may be a triangle, a quadrangle, a polygon, or a shape close to these in plan view. For example, as shown in FIG. 1A, the planar view may be a substantially square shape, and the corners may be rounded and chamfered. The upper surface of the package is preferably a substantially flat surface. However, as shown in FIG. 1A, a stepped portion 101a that is lowered by one step can also be provided at a corner portion that is separated from the opening of the recessed portion. The stepped portion 101a can be used as a pin pushing area when taking out from the mold during package molding, and also used as a cathode mark indicating the polarity of the lead terminal by making the shape of each corner different. be able to. Such stepped portions can be provided at all four corners of a substantially rectangular package as shown in FIG. 1A, or at only one corner of the package. Furthermore, it can also be provided in an arbitrary portion such as a region other than the corner portion depending on the shape and size of the package. When a lens or the like is provided, a portion that functions as a fitting portion such as a hole, a groove, or a protrusion can be provided.

  As shown in FIG. 1B, the side surface of the package 101 is preferably formed by a substantially vertical plane from the upper surface to the lower surface, but is not limited thereto, and may be slightly inclined. In addition, the connecting portions (portions corresponding to substantially square corners) of each side surface of the package are formed so as to be rounded as shown in FIG. 1A, so that they can be easily taken out from the mold during molding. However, the present invention is not limited to this, and it is also possible to have a shape that is cut out on a plane.

  As will be described later, the first lead terminal and the second lead terminal may be provided with a through hole in a region in contact with the side surface of the package, and an outer protrusion may be provided so as to fill the through hole. For example, as shown in FIG. 2B and FIG. 2C, an outer protrusion 201d can be provided. As shown in FIGS. 2B and 2D, the first lead terminal 201 has a concave bottom surface exposed region 202 a and a protruding region 202 b that have different thicknesses, so that the back surface is made substantially the same surface by bending. Then, by providing the through hole 202d in the bent portion, even a lead terminal having a relatively large thickness can be easily bent. Moreover, the adhesiveness of a lead terminal and a package can be improved by enclosing this bending part in package resin.

  As shown in FIGS. 1B and 1C, the back surface of the package is formed so that the back surface of the thick film region 102c of the first lead terminal and the back surface of the protruding region 102b are on the same surface. have. Furthermore, it has the 2nd back surface 101c dented from this 1st back surface 101b, and this 2nd back surface 101c is provided in the position which contact | connects the thick film area | region 102c. In this way, since a joining member such as solder can be wrapped around the thick film region 102c of the first lead terminal, the adhesive strength can be improved and it can be placed more stably. In addition, heat dissipation can be improved.

  As shown in FIG. 1C, the first back surface and the second back surface can be provided so that the proportion of the first back surface is increased, or the second back surface is occupied as shown in FIG. 2C. It can also be provided such that the ratio increases. These can be appropriately selected according to the size and shape of the light emitting device.

  As a specific material of the package, an insulating member is preferable, and a member that does not easily transmit light from the semiconductor light emitting element or external light is preferable. Further, it has a certain degree of strength, and a thermosetting resin, a thermoplastic resin, or the like can be used. More specifically, a phenol resin, a glass epoxy resin, a BT resin, PPA, or the like can be given.

(Concave)
The recess formed in the package is formed so as to have an opening on the upper surface of the package, and an electronic component such as a semiconductor light emitting element or a protection element is accommodated in the recess. And the opening part of this recessed part becomes the light emission part (light emission window) in a light-emitting device.

  As described above, the recesses in which various electronic components are stored must have a bottom surface having an area necessary for placing them, and lead terminals exposed on the bottom surfaces of the recesses, and these It is necessary to have a size and shape that can secure a bonding region such as a conductive wire that conducts electrical components. Further, the depth of the concave portion needs to be a depth at which the electronic component can be sealed by a sealing member filled later. However, the case where a sealing member is not required, such as when a lens is provided in a later process, is not limited thereto.

  Further, the shape of the opening of the recess is preferably a substantially circular shape as shown in FIG. 1A, but is not particularly limited to this, and depending on the shape of the package, particularly the shape of the upper surface of the package, The light distribution characteristics can be selected as appropriate. In FIG. 1A, since the upper surface of the package 100 is substantially square, it is preferable that the recess 106 has a substantially circular opening shape. However, if the light emitting area is to be further increased, it is substantially rectangular as in the case of the package upper surface. It is also possible to provide two or more recesses instead of one large recess.

  The first lead terminal and the second lead terminal are exposed on the bottom surface of the recess, and in the present invention, the semiconductor light emitting element is placed on at least the exposed first lead terminal. The first lead terminal and the second lead terminal are preferably exposed so as to be substantially flush with the bottom surface of the recess, but may be exposed so as to be on different surfaces such as by providing a step. In addition, an insulating member (resin or the like) constituting the package is exposed from the bottom of the recess so as to insulate the first lead terminal from the second lead terminal. It is preferable that all the members constituting the bottom surface are on the same surface, but a step may be provided if desired.

  The inner wall of the recess is preferably provided so that the inner wall of the recess is inclined toward the opening so that the light from the semiconductor light emitting element is reflected and efficiently emitted from the opening. In that case, the angle can be selected as desired, and the inner wall can be partially inclined without being inclined. Moreover, you may provide an inner side protrusion part. Specifically, as shown in FIG. 2A, inner protrusions 207A, 207B, and 207C that protrude inward are formed on the inner wall of the recess 206. In this way, by projecting a part of the inner wall of the recess, rather than projecting the entire inner wall, the strength of the package can be improved without reducing the area of the light emitting unit. It is possible to suppress a decrease in the holding force between the first lead terminal having the package and the package. Only one inner protrusion may be provided, or two or more inner protrusions may be provided as shown in FIG. 2A depending on the size and shape of the package. Moreover, when providing an inner side protrusion part in a part of inner wall in this way, it is preferable to adjust the inclination angle of an inner wall so that it may become respectively substantially equal. For example, in FIG. 2B, the angles of the inner protrusions 207A and 207B are formed to be substantially equal. Further, for example, a protective element 209 can be provided between the inner protrusions.

  The inner protrusion may be formed so as to reach the upper surface of the package, but it is preferable to have the upper surface of the inner protrusion between the upper surface of the package and the bottom surface of the recess. For example, as shown in FIG. 2B, the inner protrusions 207A and 207B are provided, and the upper surfaces thereof are provided at positions lower than the upper surface of the package. Thus, the package 201 and the first lead terminal can be stably held while maintaining the size of the light emitting unit. Furthermore, when the sealing member is filled in the concave portion, by adopting such a shape, the contact area between the sealing member and the package can be further increased, so that the adhesion can be improved. It is preferable that the inner wall between the upper surface of the inner projecting portion and the bottom surface of the concave portion is an inclined surface as in other regions. Further, a slope between the upper surface of the inner projecting portion and the upper surface of the package may be an inclined surface or a vertical surface as shown in FIG. 2B. Further, the upper surface of the inner projecting portion may be a single surface, or may be provided with a step as shown in FIG. 1B and the like.

(First lead terminal)
The lead terminal is a conductive member for supplying an electric current from the outside to electronic components such as a semiconductor light emitting element and a protective element placed in the recess of the package, and a metal member having excellent conductivity is suitable. is there. In the present invention, the first lead terminal is exposed at the bottom surface of the concave portion of the package and is also provided so as to protrude from the side surface of the package, and further has a thick film region exposed from the back surface of the package. It has a simple structure. That is, as shown in FIG. 1B, unlike the second lead terminal which is made of a metal member having substantially the same thickness and is partially bent, the first lead terminal has a thickness that is partially different. A film region 102c is provided. The thick film region 102c is exposed from both the bottom surface of the recess and the back surface of the package. In this way, by exposing the first lead terminal from the back surface of the package, heat generated from the semiconductor light emitting element placed immediately above can be efficiently released to the outside. In order to efficiently release heat from the thick film region 102c to the outside, the back surface of the thick film region 102c is positioned substantially on the same plane as the back surfaces of the protruding regions 102b and 103b of the first and second lead terminals during mounting. It is preferable to adjust so as to. Alternatively, in consideration of the thickness of solder or the like, the back surface of the thick film region may be adjusted slightly lower than the back surface of the protruding region. That is, if the thick film region of the lead terminal protrudes from the projecting region on the back side of the package, the stability at the time of mounting is deteriorated and the bonding property of the projecting region for conducting is deteriorated. Because there is a fear. Further, the thick film region 102c is a part of the first lead electrode, and the thick film region 102c is substantially rectangular according to the shape of the protruding region of the REIT terminal protruding from the side surface of the package. Thus, on the back surface of the light emitting device, the back surface shape of the first lead terminal (and the shape of the back surface of the second lead terminal) that is the same surface as the back surface of the package is substantially rectangular, and the long side is respectively By providing them in parallel, it is possible to reduce a shift during mounting on a circuit board or the like.

  As shown in FIGS. 1B and 1C, the first lead terminal is bent in a region other than the thick film region 102c of the first lead terminal, and the back surface of the protruding region 102b is the same as the back surface of the thick film region 102c. Try to be on the same plane. In FIG. 1B, the first lead terminal is bent inside the package, so that the protruding region 102b becomes flat. This facilitates handling within the work process. Further, it may be bent at a region exposed from the package. For example, as shown in FIG. 3, the protruding regions 302b and 303b of the lead terminal are bent at a portion exposed from the package so as to be flush with the back surface of the thick film region 302c. Even when a bent portion is provided in the protruding region of the lead terminal in this way, it is difficult to form a gap between the package and the lead terminal by bending the package after bending in advance, instead of bending after forming the package. Can do. This projecting region is a portion that is connected to a circuit board or the like by using a conductive joining member such as solder, but is relatively thick by making the package need not be bent after molding. It can be provided as a lead terminal. In particular, since the present invention has a thick film region in a part of the lead terminal, it is preferable to thicken other regions so as not to bend by its own weight when integrally molded with the package, By setting it as such a shape, a bending process can be abbreviate | omitted after package shaping | molding.

  The first lead terminal is preferably provided so that the back surface of the protruding region is in contact with the first back surface of the package. For example, as shown in FIG. 1B, the back surface of the protruding region is flush with the first back surface 101b of the package by bending the package so as to reach the first back surface 101b of the package. Can do. By doing in this way, it becomes possible to mount on the mounting substrate without bending the protruding region protruding from the package.

  The first lead terminal has a through hole in a region in contact with the side surface of the package among the protruding regions protruding from the side surface of the package, and the through hole is filled with an outer protruding portion protruding from the side surface of the package. Can do. For example, as shown in FIGS. 2B and 2C, the package 201 has an outer protrusion 201 d from the side surface. The outer projecting portion is provided so as to fill the through holes provided in the first lead terminal and the second lead terminal. As described above, by providing the first lead terminal and the second lead terminal with the through holes, even a relatively thick lead terminal can be easily bent. And the adhesiveness with a package can also be improved by providing the outer side protrusion part which fills this through-hole.

  The material of the first lead terminal is preferably formed of a material having a relatively large thermal conductivity, whereby heat generated in the semiconductor light emitting element can be efficiently released to the outside. For example, a material having a thermal conductivity of about 200 W / (m · K) or more, a material having a relatively large mechanical strength, and a material that can be easily stamped or etched are preferred. Specifically, a metal such as copper, aluminum, gold, silver, tungsten, iron, nickel or an alloy such as nickel alloy and phosphor bronze can be used. Further, the thickness, shape, and the like can be appropriately adjusted in consideration of the size, shape, and the like of the light-emitting device to be obtained. Of these materials, those that easily absorb light preferably have a laminated structure such as a member that easily reflects light on the surface. For example, it is preferable to have a laminated structure in which silver is plated on a conductive member made of tungsten or copper.

  The thick film region of the first lead terminal is preferably provided in a region of the first lead terminal that is exposed on the bottom surface of the concave portion of the package, and is particularly provided in a region where the semiconductor light emitting element is placed. Is preferred. In this way, part of the lead terminal can function as a heat radiating portion, so that heat from the semiconductor light emitting element can be efficiently released to the outside. The shape, size, etc. of the thick film region can be appropriately adjusted in consideration of the size, shape, etc. of the light emitting device to be obtained.

  Further, an opening may be provided so that the package is exposed in the exposed region of the first lead terminal. For example, as shown in FIG. 2A, by providing an opening 208 in the vicinity of the semiconductor light emitting element mounting region, the package 201 exposed from the opening and the sealing member 210 filled in the recess are in direct contact with each other. Therefore, the adhesion of the sealing member can be further improved. The size and shape of the opening are not particularly limited, but a region that does not hinder the bonding of the semiconductor light emitting element or the conductive wire is preferable, and the region between the lead terminals with the mounting region of the semiconductor light emitting element interposed therebetween It is preferable to provide such a shape and symmetry.

(Second lead terminal)
Similar to the first lead terminal, the second lead terminal is exposed on the bottom surface of the concave portion of the package and is also provided so as to protrude from the side surface of the package, and is placed on the first lead terminal. The semiconductor light emitting element is electrically connected to a conductive wire or the like. On the bottom surface of the recess of the package, as shown in FIG. 1A, the exposed region 103a of the second lead terminal is provided so as to be separated from the exposed region 102a of the first lead terminal 102 at a substantially constant interval. In this figure, the exposed region 103a of the second lead terminal is formed smaller than the exposed region 102a of the first lead terminal. However, the present invention is not limited to this, and can be exposed in a desired shape and area. . For example, when a protective wire is mounted as shown in FIG. 2A, the conductive wire is preferably exposed so that the mounting region can be secured. In addition, a semiconductor light emitting element can also be placed on the second lead terminal, similarly to the first lead terminal. In that case, similarly to the first lead terminal, a thick film region may be provided so that the second lead terminal is also exposed from the back surface of the package.

  Further, the protruding region protruding from the side surface of the package is protruded so that the back surface of the protruding region is substantially flush with the back surface of the package, like the first lead terminal. That is, as shown in FIG. 1B, the back surface of the protruding region 102 b that is bent inside the package and protrudes from the side surface of the package is formed to be substantially flush with the back surface of the package 101.

  As the material of the second lead terminal, the same material as that of the first lead terminal can be used.

(Die bond member)
The die bond member is a bonding member for placing a semiconductor light emitting element, a protection element, or the like on the lead terminal, and it is possible to select either a conductive die bond member or an edge die bond member depending on the substrate of the element to be placed. it can. For example, in the case of a semiconductor light emitting device in which a nitride semiconductor layer is laminated on sapphire, which is an insulating substrate, it can be used either insulating or conductive. When a conductive substrate such as a SiC substrate is used, a conductive die bond Conduction can be achieved by using a member. As the insulating die bond member, an epoxy resin, a silicone resin, or the like can be used. In the case of using these resins, a metal layer having a high reflectance such as an Al film can be provided on the back surface of the semiconductor light emitting element in consideration of deterioration due to light or heat from the semiconductor light emitting element. In this case, a method such as vapor deposition, sputtering, or bonding a thin film can be used. In addition, as the conductive die bond member, a conductive paste such as silver, gold, or palladium, solder such as Au—Sn eutectic, or a brazing material such as a low melting point metal can be used. Further, among these die bond members, in particular, when a translucent die bond member is used, a fluorescent member that absorbs light from the semiconductor light emitting element and emits light of a different wavelength can be contained therein.

(Sealing member)
The sealing member is a member that protects the semiconductor light-emitting element or conductive wire placed in the recess of the package from dust, moisture, external force, etc., and is a translucent material that can transmit light from the semiconductor light-emitting element Those having the following are preferred. Specific examples of the material include silicone resin, epoxy resin, and urea resin. In addition to such materials, a colorant, a light diffusing agent, a filler, a fluorescent member, and the like can be contained as desired. Moreover, although it is preferable to provide so that the whole recessed part may be filled, it can also be filled to the middle of a recessed part according to the objective. Further, when a mounted electronic component or the like can be protected by a member other than the sealing member, such as when a lens is provided, the sealing member can be omitted.

(Semiconductor light emitting device)
A semiconductor light emitting device having an arbitrary wavelength can be selected. For example, as blue and green light emitting elements, those using ZnSe or a nitride semiconductor (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) are used. it can. As the red light emitting element, GaAs, InP, or the like can be used. Furthermore, a semiconductor light emitting element made of a material other than this can also be used. The composition, emission color, size, number, and the like of the light-emitting element to be used can be appropriately selected depending on the purpose. For example, as shown in FIG. 1A, a plurality of semiconductor light emitting elements having the same emission color can be mounted, such as mounting six semiconductor light emitting elements using a nitride semiconductor capable of emitting blue light.

In the case of a light-emitting device having a fluorescent material, a nitride semiconductor (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferable. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal.

  Further, a light-emitting element that outputs not only light in the visible light region but also ultraviolet rays and infrared rays can be obtained. In addition to the semiconductor light emitting element, a light receiving element, a protective element (for example, a Zener diode or a capacitor) that protects the semiconductor element from destruction due to overvoltage, or a combination thereof can be mounted.

(Conductive wire)
The conductive wire that connects the electrode of the semiconductor light emitting element to the first lead terminal and the second lead terminal has good ohmic properties, mechanical connectivity, electrical conductivity and thermal conductivity with the lead terminal. Desired. Preferably ^{0.01cal / (s) (cm 2} ) (℃ / cm) or higher as heat conductivity, and more preferably ^{0.5cal / (s) (cm 2} ) (℃ / cm) or more. In consideration of workability and the like, the diameter of the conductive wire is preferably Φ10 μm or more and Φ45 μm or less. Specific examples of such conductive wires include conductive wires using metals such as gold, copper, platinum, and aluminum, and alloys thereof. Such a conductive wire can easily connect the wire bonding region formed in the conductor wiring and the electrode of the semiconductor element by a wire bonding apparatus.

(Fluorescent material)
The sealing member may contain a fluorescent material that emits light having different wavelengths by absorbing at least part of light from the semiconductor light emitting element. In particular, it is more efficient to convert light from a semiconductor light emitting element into a longer wavelength. The fluorescent member may be formed of a single type of fluorescent material or the like, or may be formed of a single layer in which two or more types of fluorescent material are mixed, or contains one type of fluorescent material, etc. Two or more single layers may be stacked, or two or more single layers each of which is mixed with two or more kinds of fluorescent substances may be stacked.

  Any fluorescent member may be used as long as it absorbs light from a semiconductor light emitting device having a nitride semiconductor as a light emitting layer and converts the light to light of a different wavelength. For example, nitride phosphors / oxynitride phosphors mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid phosphors such as Eu, and alkalis mainly activated by transition metal elements such as Mn Earth halogen apatite phosphor, alkaline earth metal borate halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate, alkaline earth silicon nitride At least selected from organic and organic complexes mainly activated by lanthanoid elements such as germanate or lanthanoid elements such as Ce, rare earth aluminate, rare earth silicate or Eu Any one or more are preferable. As specific examples, the following phosphors can be used, but are not limited thereto.

A nitride phosphor mainly activated by a lanthanoid element such as Eu or Ce is M ₂ Si ₅ N ₈ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn). There is.) In addition to M ₂ Si ₅ N ₈ : Eu, MSi ₇ N ₁₀ : Eu, M _1.8 Si ₅ O _0.2 N ₈ : Eu, M _0.9 Si ₇ O _0.1 N ₁₀ : Eu (M Is at least one selected from Sr, Ca, Ba, Mg, and Zn.

Nitride phosphors activated by rare earth elements such as Eu and containing Group II elements M, Si, Al, and N, absorb ultraviolet or blue light and emit light in the yellow-red to red range. To do. The nitride phosphor has the general formula _{M w Al x Si y N (} (2/3) w + x + (4/3) y): shown by Eu, rare earth elements and tetravalent element to an additional element, 3 At least one element selected from valent elements. M is at least one selected from the group consisting of Mg, Ca, Sr, and Ba.

  In the above general formula, the ranges of w, x, and y are preferably 0.04 ≦ w ≦ 9, x = 1, 0.056 ≦ y ≦ 18. The range of w, x, and y may be 0.04 ≦ w ≦ 3, x = 1, 0.143 ≦ y ≦ 8.7, more preferably 0.05 ≦ w ≦ 3, x = 1, 0. 167 ≦ y ≦ 8.7.

The nitride phosphor is generally added boron B formula _{M w Al x Si y B z} N ((2/3) w + x + (4/3) y + z): can also be Eu. Also in the above, M is at least one selected from the group consisting of Mg, Ca, Sr, and Ba, and 0.04 ≦ w ≦ 9, x = 1, 0.056 ≦ y ≦ 18, 0.0005 ≦ z ≦ 0.5. When boron is added, the molar concentration z is set to 0.5 or less as described above, preferably 0.3 or less, and further set to be greater than 0.0005. More preferably, the molar concentration of boron is set to 0.001 or more and 0.2 or less.

  Further, these nitride phosphors are further at least one selected from the group of La, Ce, Pr, Gd, Tb, Dy, Ho, Er, Lu, or any one of Sc, Y, Ga, In, Alternatively, any one of Ge and Zr is contained. By containing these, luminance, quantum efficiency, or peak intensity equal to or higher than Gd, Nd, and Tm can be output.

The oxynitride phosphor mainly activated by a lanthanoid element such as Eu or Ce is MSi ₂ O ₂ N ₂ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn) .)and so on.

Alkaline earth halogen apatite phosphors mainly activated by lanthanoid elements such as Eu and transition metal elements such as Mn include M ₅ (PO ₄ ) ₃ X: R (M is Sr, Ca, Ba, At least one selected from Mg and Zn, X is at least one selected from F, Cl, Br, and I. R is at least one selected from Eu, Mn, Eu and Mn. Etc.).

The alkaline earth metal borate phosphor has M ₂ B ₅ O ₉ X: R (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is F, Cl , Br, or I. R is Eu, Mn, or any one of Eu and Mn.).

Alkaline earth metal aluminate phosphors include SrAl ₂ O ₄ : R, Sr ₄ Al ₁₄ O ₂₅ : R, CaAl ₂ O ₄ : R, BaMg ₂ Al ₁₆ O ₂₇ : R, BaMg ₂ Al ₁₆ O ₁₂ : R, BaMgAl ₁₀ O ₁₇ : R (R is one or more of Eu, Mn, Eu and Mn).

The alkaline earth silicate _{phosphor, (Sr 1-a-b} -x Ba a Ca b Eu x) 2 SiO 4 (0 ≦ a ≦ 1,0 ≦ b ≦ 1,0.005 ≦ x ≦ 0 .1).

Examples of the alkaline earth sulfide phosphor include La ₂ O ₂ S: Eu, Y ₂ O ₂ S: Eu, and Gd ₂ O ₂ S: Eu.

Examples of rare earth aluminate phosphors mainly activated with lanthanoid elements such as Ce include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y _{3 (Al 0.8 Ga 0.2) 5 O} 12: Ce, and the like (Y, Gd) 3 (Al , Ga) YAG -based phosphor represented by the compositional formula of _{5 O 12.} Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu, or the like.

Other phosphors include ZnS: Eu, Zn ₂ GeO ₄ : Mn, MGa ₂ S ₄ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is At least one selected from F, Cl, Br, and I).

  The phosphor described above contains at least one selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni, and Ti instead of Eu or in addition to Eu as desired. You can also.

The Ca—Al—Si—O—N-based oxynitride glass phosphor is expressed in terms of mol%, CaCO ₃ is converted to CaO, 20 to 50 mol%, Al ₂ O ₃ is 0 to 30 mol%, SiO 25 to 60 mol% of Al, 5 to 50 mol% of AlN, 0.1 to 20 mol% of rare earth oxide or transition metal oxide, and a base material of an oxynitride glass in which the total of five components is 100 mol% This is a phosphor. In addition, in the phosphor using oxynitride glass as a base material, the nitrogen content is preferably 15 wt% or less, and other rare earth element ions serving as a sensitizer in addition to rare earth oxide ions are used as rare earth oxides. It is preferable to contain as a co-activator in content in the range of 0.1-10 mol% in fluorescent glass.

  Moreover, it is fluorescent substance other than the said fluorescent substance, Comprising: The fluorescent substance which has the same performance, an effect | action, and an effect can also be used.

  The present invention can be used for a lighting device, a display, a backlight light source of a liquid crystal display, and the like.

FIG. 1A is a perspective view of a light emitting device of the present invention. 1B is a cross-sectional view taken along the line X-X ′ of FIG. 1A. FIG. 1C is a perspective view of the light emitting device of FIG. 1A viewed from the back side. FIG. 2A is a perspective view of the light emitting device of the present invention. FIG. 2B is a cross-sectional view taken along the line Y-Y ′ of FIG. 2A. FIG. 2C is a perspective view of the light emitting device of FIG. 2A viewed from the back side. 2D is a perspective view illustrating a lead terminal of the light emitting device of FIG. 2A. FIG. 3 is a cross-sectional view of the light emitting device of the present invention.

Explanation of symbols

100, 200, 300... Light emitting device 101, 201... Package 101a .. Stepped portions 101b, 201b, 301b... First back surface 101c, 201c, 301c. Outer protrusions 102, 202... First lead terminals 102a, 202a... First lead terminal recess bottom exposed areas 102b, 202b, 302b... First lead terminal protrusion areas 102c, 202c , 302c ... thick film region 202d of the first lead terminal ... through holes 103, 203 ... second lead terminals 103a, 203a ... concave parts of the second lead terminal Bottom exposed area 103b, 203b, 303b ... second lead terminal protruding area 203d ... second lead terminal through-hole 104, 204 ... semiconductor Light emitting elements 105, 205... Conductive wires 106, 206... Package recesses 207A, 207B, 207C... Inner protrusion 208. 210 ... Sealing member

Claims (5)

A package comprising a recess having an inner wall and a bottom surface on the top surface;
A lead terminal exposed from the bottom surface of the recess and protruding from a side surface of the package;
The lead terminal includes a first lead terminal on which a semiconductor light emitting element is mounted and a thick film region exposed from the back surface of the package, and a second lead terminal electrically connected to the semiconductor light emitting element. Have
In the first lead terminal, the back surface of the thick film region and the back surface of the protruding region protruding from the side surface of the package are on the same surface,
The back surface of the package includes a first back surface that is flush with a back surface of the thick film region and a back surface of the protruding region, and a second back surface that is in contact with the thick film region and is recessed from the first back surface. A light-emitting device comprising: The light emitting device according to claim 1, wherein the thick film region of the first lead terminal is separated from a side surface of the package. The thick film region of the first lead terminal is on the same surface as the second back surface of the package on the outer periphery of the first thick film region back surface on the same surface as the first back surface of the package. The light emitting device according to claim 1, further comprising: a second thick film region back surface. 4. The light emitting device according to claim 1, wherein the back surface of the projecting region is in contact with the first back surface of the package. The first lead terminal has a through hole in a region in contact with the side surface of the package among the protruding regions protruding from the side surface of the package, and the through hole is filled with an outer protruding portion protruding from the side surface of the package. The light emitting device according to claim 1, wherein the light emitting device is used.

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