JP2007310968A - 磁気ヘッドアッセンブリの半田接合方法 - Google Patents

磁気ヘッドアッセンブリの半田接合方法 Download PDF

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Publication number
JP2007310968A
JP2007310968A JP2006139896A JP2006139896A JP2007310968A JP 2007310968 A JP2007310968 A JP 2007310968A JP 2006139896 A JP2006139896 A JP 2006139896A JP 2006139896 A JP2006139896 A JP 2006139896A JP 2007310968 A JP2007310968 A JP 2007310968A
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JP
Japan
Prior art keywords
magnetic head
solder
suspension
slider
head slider
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006139896A
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English (en)
Japanese (ja)
Inventor
Masaki Yamaguchi
巨樹 山口
Takao Haino
孝雄 灰野
Isamu Hasegawa
勇 長谷川
Hideaki Abe
秀昭 阿部
Katsuhiko Nanba
克彦 南場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP2006139896A priority Critical patent/JP2007310968A/ja
Priority to CN2007101021772A priority patent/CN101075438B/zh
Publication of JP2007310968A publication Critical patent/JP2007310968A/ja
Withdrawn legal-status Critical Current

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  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
JP2006139896A 2006-05-19 2006-05-19 磁気ヘッドアッセンブリの半田接合方法 Withdrawn JP2007310968A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006139896A JP2007310968A (ja) 2006-05-19 2006-05-19 磁気ヘッドアッセンブリの半田接合方法
CN2007101021772A CN101075438B (zh) 2006-05-19 2007-04-29 磁头组件的焊锡接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006139896A JP2007310968A (ja) 2006-05-19 2006-05-19 磁気ヘッドアッセンブリの半田接合方法

Publications (1)

Publication Number Publication Date
JP2007310968A true JP2007310968A (ja) 2007-11-29

Family

ID=38843689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006139896A Withdrawn JP2007310968A (ja) 2006-05-19 2006-05-19 磁気ヘッドアッセンブリの半田接合方法

Country Status (2)

Country Link
JP (1) JP2007310968A (zh)
CN (1) CN101075438B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015121030A1 (de) * 2014-02-13 2015-08-20 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum erzeugen einer laserschweissnaht zwischen bauteilen mit einem kugeliges oder kugelähnlichen element, sowie entsprechende bauteilverbindung
US11626133B1 (en) 2022-03-30 2023-04-11 Sae Magnetics (H.K.) Ltd. Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive
US11749302B1 (en) 2022-05-12 2023-09-05 Sae Magnetics (H.K.) Ltd. Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive
US11763842B1 (en) 2022-05-12 2023-09-19 Sae Magnetics (H.K.) Ltd. Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive
US11887638B1 (en) 2022-11-04 2024-01-30 Sae Magnetics (H.K.) Ltd. Laser diode, thermally assisted magnetic head, head gimbal assembly, hard disk drive and method of manufacturing a head gimbal assembly

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3537409A1 (en) * 2018-03-07 2019-09-11 Seabery North America, S.L. Systems and methods to simulate joining operations

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5828031A (en) * 1996-06-27 1998-10-27 International Business Machines Corporation Head transducer to suspension lead termination by solder ball place/reflow
US5821494A (en) * 1996-09-27 1998-10-13 International Business Machines Corporation Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow
JP3634773B2 (ja) * 2001-06-08 2005-03-30 アルプス電気株式会社 磁気ヘッド及びその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015121030A1 (de) * 2014-02-13 2015-08-20 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum erzeugen einer laserschweissnaht zwischen bauteilen mit einem kugeliges oder kugelähnlichen element, sowie entsprechende bauteilverbindung
US10427243B2 (en) 2014-02-13 2019-10-01 Bayerische Motoren Werke Aktiengesellschaft Method for producing a laser weld seam between components by use of a spherical or sphere-like element, and corresponding component connection
US11626133B1 (en) 2022-03-30 2023-04-11 Sae Magnetics (H.K.) Ltd. Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive
US11749302B1 (en) 2022-05-12 2023-09-05 Sae Magnetics (H.K.) Ltd. Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive
US11763842B1 (en) 2022-05-12 2023-09-19 Sae Magnetics (H.K.) Ltd. Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive
US11887638B1 (en) 2022-11-04 2024-01-30 Sae Magnetics (H.K.) Ltd. Laser diode, thermally assisted magnetic head, head gimbal assembly, hard disk drive and method of manufacturing a head gimbal assembly

Also Published As

Publication number Publication date
CN101075438B (zh) 2010-06-23
CN101075438A (zh) 2007-11-21

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