JP2007306036A - 発光装置の製造方法 - Google Patents
発光装置の製造方法 Download PDFInfo
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- JP2007306036A JP2007306036A JP2007214639A JP2007214639A JP2007306036A JP 2007306036 A JP2007306036 A JP 2007306036A JP 2007214639 A JP2007214639 A JP 2007214639A JP 2007214639 A JP2007214639 A JP 2007214639A JP 2007306036 A JP2007306036 A JP 2007306036A
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- Prior art keywords
- light emitting
- submount
- light
- glass
- emitting element
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Devices (AREA)
Abstract
【解決手段】LED素子1はサブマウント3に搭載され、このサブマウント3がリードフレームのリード部4A,4Bの先端部に実装される。この先端部、LED素子1、及びサブマウント3は、ガラス材による封止部材5によって所定の形状に封止される。封止部材5には、低融点であると共にリード部4A,4B等の熱膨脹率に近似した熱膨脹率を有するガラス材が用いられる。
【選択図】図1
Description
2 バンプ
3 サブマウント
3A 傾斜部
4 リードフレーム
4A リード部
4B リード部
5 封止部材
5A レンズ
6 リードフレーム
7 ガラスシート
8 ガラスシート
10 発光装置
11 上金型
11A 凹部
12 下金型
12A 凹部
31A 電極
31B 電極
32A 電極
32B 電極
33 ビアホール
40 発光装置
41 LED素子
42 ワイヤ
42A ワイヤ接続部
50 放熱部
51 溝部
52 ガラス材
53 配線パターン
60 シリコンコート部
Claims (3)
- 発光素子と、前記発光素子をマウントするサブマウント部と、前記サブマウントが配設される窪み部分を有し前記発光素子に電力を供給するための金属からなる給電部と、前記発光素子と前記サブマウント部と前記給電部の一部とを封止する透光性ガラス部とを有し、前記サブマウント部には前記給電部から供給される電力を前記発光素子に給電するための電気回路が形成され、前記給電部および前記透光性ガラス部は前記発光素子あるいは前記サブマウント部に対し熱膨張率の大なる材料によって形成され、前記発光素子および前記サブマウント部は前記給電部を含め前記透光性ガラス部によって全体が包囲されている発光装置を製造するにあたり、
前記サブマウントに搭載された前記発光素子を、前記給電部の前記窪み部分に配置し、
前記発光素子の上方及び下方にガラスシートを配置し、
上側の前記ガラスシートを覆うようにして上金型を配置し、
下側の前記ガラスシートを覆うようにして下金型を配置し、
上側及び下側の前記ガラスシートを加熱して軟化させた状態で、前記上金型及び前記下金型を前記発光素子へ向かう方向へ移動させることによって、上側及び下側の前記ガラスシートに圧力をかけることを特徴とする発光装置の製造方法。 - 前記サブマウント部は、熱伝導率が100W・m -1 ・K -1 以上の材料であることを特徴とする請求項1に記載の発光装置の製造方法。
- 前記給電部の前記窪み部分は、前記給電部の他の部分より1段低く加工されていることを特徴とする請求項1または2に記載の発光装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007214639A JP4165610B2 (ja) | 2007-08-21 | 2007-08-21 | 発光装置の製造方法 |
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JP2007214639A JP4165610B2 (ja) | 2007-08-21 | 2007-08-21 | 発光装置の製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004010385A Division JP4029843B2 (ja) | 2003-03-10 | 2004-01-19 | 発光装置 |
Related Child Applications (1)
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JP2008123298A Division JP4775403B2 (ja) | 2008-05-09 | 2008-05-09 | 発光装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007306036A true JP2007306036A (ja) | 2007-11-22 |
JP4165610B2 JP4165610B2 (ja) | 2008-10-15 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007214639A Expired - Fee Related JP4165610B2 (ja) | 2007-08-21 | 2007-08-21 | 発光装置の製造方法 |
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JP (1) | JP4165610B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014064021A (ja) * | 2008-05-30 | 2014-04-10 | Sharp Corp | 発光装置、面光源および液晶表示装置 |
-
2007
- 2007-08-21 JP JP2007214639A patent/JP4165610B2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014064021A (ja) * | 2008-05-30 | 2014-04-10 | Sharp Corp | 発光装置、面光源および液晶表示装置 |
US9634203B2 (en) | 2008-05-30 | 2017-04-25 | Sharp Kabushiki Kaisha | Light emitting device, surface light source, liquid crystal display device, and method for manufacturing light emitting device |
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Publication number | Publication date |
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JP4165610B2 (ja) | 2008-10-15 |
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