JP2007305778A - Stage device, exposure device, manufacturing method of device and wiring method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stage device or the like capable of reducing a force given to a table by cables or the like attached to the table from outside of the table through wiring or piping. <P>SOLUTION: The stage device WST is provided with a moving member 63 movable into at least a first direction (X) and a second direction (Y) intersecting with the first direction; a linear member C whose one end is connected to a fixed unit FC through a bend C2 and the other end is connected to the moving member 63 through a substantially straight line C1 extended along the first direction; and a guide member provided independently from the moving member 63 and movable into the first direction, while retaining at least a part of the straight line C1 in the linear member C. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a stage apparatus, an exposure apparatus, a device manufacturing method, and a wiring method.

  Conventionally, in a lithography process for manufacturing an electronic device such as a semiconductor element (such as an integrated circuit) or a liquid crystal display element via a projection optical system, a mask (or reticle) pattern image is a wafer or glass plate coated with a photosensitive agent. A step-and-repeat reduction projection exposure apparatus (so-called stepper) that transfers to each of a plurality of shot areas on a photosensitive object such as a step-and-scan projection exposure apparatus (so-called scanning stepper ( Also called scanner))) is mainly used.

  In this type of projection exposure apparatus, a substrate coated with a mask or a photosensitive agent (resist) is placed on a table on a stage and moved. In these tables, for example, a vacuum suction check for sucking a mask or a substrate, a driving unit for driving the table, various sensors, and the like are arranged. Pipes, tubes, various cables, etc. (hereinafter referred to as cables) connected to these tables Are wired and piped between the table and the base.

Incidentally, in order to achieve high integration of integrated circuits and high productivity, there is a demand for higher accuracy and higher speed of table positioning. When realizing high positioning accuracy and high speed of the table, it is impossible to ignore the influence of cables wired and piped between the table and the base.
For this reason, for example, a technique is disclosed in which the force received by the table from the cables is detected by detecting the force received from the cables by a sensor and feedforward-controlling the drive unit.
JP 2000-208412 A

  However, in the above-described technique, even when the table is stopped, it is necessary for the motor or the like to continuously output the driving force for canceling the force received from the cables, so that the running cost (power consumption) is reduced. There is a problem of incurring an increase. In addition, a higher-performance motor is required to fully withstand the above output, which increases costs. In addition, an increase in apparatus cost due to the arrangement of a sensor for detecting the force received by the table from the cables is also a problem.

  The present invention has been made in view of the above-described circumstances, and a stage apparatus that can reduce the force exerted on the table by cables wired and piped from outside the table, an exposure apparatus using the same, and a device An object is to provide a manufacturing method and a wiring method.

  In order to solve the above problems, the stage apparatus, the exposure apparatus, the device manufacturing method, and the wiring method according to the present invention employ the following configurations corresponding to the respective drawings shown in the embodiments. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  The stage device (WST) according to the first aspect of the present invention includes a moving member (63) movable at least in a first direction (X) and a second direction (Y) intersecting the first direction, and a bending portion (C2). A linear member (C) having one end connected to the fixed portion (FC) via the first end and the other end connected to the moving member via a substantially linear portion (C1) extending along the first direction; A guide member (30) provided independently of the moving member and capable of moving in the first direction while holding at least a part of the linear portion of the linear member. .

A second invention is an exposure apparatus (EX) for forming a predetermined pattern on a substrate (W) held on a substrate stage (WST), wherein the stage apparatus of the first invention is used for the substrate stage. I made it.
An exposure apparatus (EX) for forming a mask pattern (PA) held on a mask stage (RST) on a substrate (W) held on a substrate stage (WST), the mask stage and the substrate The stage apparatus of the first invention is used for at least one of the stages.

  According to a third aspect of the present invention, in the device manufacturing method including the lithography step, the exposure apparatus (EX) of the second aspect is used in the lithography step.

  According to a fourth aspect of the present invention, there is provided a linear member (C) connected between at least the first direction (X) and the moving member (63) movable in the second direction (Y) intersecting the first direction. In the wiring method, the linear member is connected to the fixed portion (FC) at one end via the curved portion (C2), and the substantially linear portion (C1) extending along the first direction at the other end. Further, a part of the linear member is held by the guide member (30) which is connected to the moving member via the movable member and movable in the first direction provided independently of the moving member. And

According to the present invention, the following effects can be obtained.
When the linear member is wired / piped to the movable member that can move at least two-dimensionally, the guide member receives the force that the movable member receives from the linear member, so the linear member does not adversely affect the movable member. . Thereby, the position control of the moving member can be performed efficiently and with high accuracy. Moreover, since the driving force (output) of the motor can be suppressed, the cost of the motor can be suppressed.
Therefore, the exposure apparatus provided with such a stage apparatus can reduce the running cost. And it becomes possible to manufacture an inexpensive and high-performance device.

Embodiments of a stage apparatus, an exposure apparatus, a device manufacturing method, and a wiring method according to the present invention will be described below with reference to the drawings.
FIG. 1 is a view showing a schematic configuration of an exposure apparatus EX according to an embodiment of the present invention.
The exposure apparatus EX transfers the pattern PA formed on the reticle R to each shot area on the wafer W via the projection optical system PL while moving the reticle R and the wafer W synchronously in the one-dimensional direction. A scanning type exposure apparatus, that is, a so-called scanning stepper.
The exposure apparatus EX includes an illumination optical system IL that illuminates the reticle R with exposure light EL, a reticle stage RST that can move while holding the reticle R, and projection optics that projects the exposure light EL emitted from the reticle R onto the wafer W. The system PL, a wafer stage WST that can be moved while holding the wafer W via the wafer holder WH, a control device CONT that comprehensively controls the exposure apparatus EX, and the like are provided.
In the following description, the direction coinciding with the optical axis AX of the projection optical system PL is the Z direction, and the synchronous movement direction (scanning direction) between the reticle R and the wafer W in the plane perpendicular to the Z direction is the X direction. A direction (non-scanning direction) perpendicular to the direction and the X direction is defined as a Y direction. In addition, the rotation (inclination) directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

  The illumination optical system IL illuminates the reticle R supported by the reticle stage RST with the exposure light EL. The illumination light source emits the exposure light EL, and the illuminance of the exposure light EL emitted from the exposure light source. A uniform optical integrator, a condenser lens that collects the exposure light EL from the optical integrator, a relay lens system, a variable field stop that sets the illumination area on the reticle R by the exposure light EL in a slit shape, etc. (all not shown) Is provided. The predetermined illumination area on the reticle R is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL.

As the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, DUV light), vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm), or the like is used.

The reticle stage RST is movable while holding the reticle R, and holds the reticle R by vacuum suction with the reticle holder RH.
Reticle stage RST can be moved two-dimensionally in a plane perpendicular to optical axis AX of projection optical system PL, that is, in the XY plane, and can be slightly rotated in the θZ direction.
The reticle stage RST is driven by a reticle stage drive unit RSTD such as a linear motor. Reticle stage driving unit RSTD is controlled by control unit CONT.

  A movable mirror 51 is provided on the reticle stage RST. A laser interferometer 52 is provided at a position facing the movable mirror 51. Thus, the position of the reticle R on the reticle stage RST in the two-dimensional direction (XY direction) and the rotation angle in the θZ direction (including rotation angles in the θX and θY directions in some cases) are measured by the laser interferometer 52 in real time. Is done. And the measurement result of the laser interferometer 52 is output to the control apparatus CONT. The control device CONT controls the position of the reticle R supported by the reticle stage RST by driving the reticle stage drive unit RSTD based on the measurement result of the laser interferometer 52.

The projection optical system PL projects and exposes the pattern of the reticle R onto the wafer W at a predetermined projection magnification β. The projection optical system PL is composed of a plurality of optical elements including optical elements provided at the front end portion on the wafer W side, and these optical elements are supported by a lens barrel PK. The projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4, 1/5, or 1/8.
Note that the projection optical system PL may be either an equal magnification system or an enlargement system. Further, the optical element at the tip of the projection optical system PL is detachably (replaceable) with respect to the lens barrel PK.

Wafer stage WST moves while supporting wafer W. Z table 61 holds wafer W via wafer holder WH and finely drives it in three degrees of freedom in the Z, θX, and θY directions. An XY table 62 that supports the Z table 61 and moves continuously in the Y direction and moves stepwise in the X direction is provided.
Wafer stage WST (Z table 61, XY table 62) is driven by a wafer stage drive unit WSTD (linear motors 70, 82, 84, see FIG. 2) such as a linear motor. Wafer stage drive unit WSTD is controlled by control unit CONT. Then, by driving the Z table 61, the position in the Z direction (focus position) of the wafer W held by the wafer holder WH on the Z table 61 is controlled. Further, by driving the XY table 62, the position of the wafer W in the XY direction (position in a direction substantially parallel to the image plane of the projection optical system PL) is controlled.

  A wafer surface plate 63 or the like that supports the XY table 62 so as to be movable in the XY plane is levitated and supported on a base plate FC placed on the floor surface F via an air bearing (air pad) (not shown). The wafer surface plate 63 is levitated and supported on the base plate FC by the reaction force generated by the movement of the XY table 62 by moving the wafer surface plate 63 in the reverse direction (X direction, Y direction, θz direction) using the counter mass. This is to counteract this reaction force by the law of conservation of momentum.

  Actuators 90, 91, and 92 (such as a trim motor) that move the wafer surface plate 63 in the X direction, the Y direction, and the θZ direction within a predetermined range of the base plate FC are provided. The actuators 90 and 91 have movers 90A and 91A provided on the wafer surface plate 63 and stators 90B and 91B provided on the base plate FC, and can move the wafer surface plate 63 in the X direction. At the same time, the wafer surface plate 63 can be moved in the θZ direction. The actuator 92 has a mover 92A provided on the wafer surface plate 63 and a stator 92B provided on the base plate FC, and can move the wafer surface plate 63 in the Y direction. Actuators 90, 91, and 92 are controlled so that the movement of wafer surface plate 63 is returned to the original by the reaction force caused by movement of XY table 62 by driving linear motors 70, 82, and 84.

  A movable mirror 53 is provided on the Z table 61. A laser interferometer 54 is provided at a position facing the moving mirror 53. Thus, the position and rotation angle of wafer W on wafer stage WST in the two-dimensional direction are measured in real time by laser interferometer 54, and the measurement result is output to control unit CONT. The control unit CONT drives the wafer stage WST via the wafer stage drive unit WSTD based on the measurement result of the laser interferometer 54, so that the X axis and the Y direction of the wafer W supported on the wafer stage WST. And positioning in the θZ direction.

Further, the exposure apparatus EX includes a focus detection system 56 that detects the position (focus position) of the surface of the wafer W with respect to the image plane of the projection optical system PL. The focus detection system 56 includes a light projecting unit 56A that projects detection light on the surface of the wafer W from an oblique direction, and a light receiving unit 56B that receives detection light (reflected light) reflected from the surface of the wafer W.
The light reception result of the light receiving unit 56B is output to the control device CONT. Then, the control device CONT drives the wafer stage WST (Z table 61) via the wafer stage drive unit WSTD based on the detection result of the focus detection system 56, thereby determining the position of the surface of the wafer W of the projection optical system PL. Keep within the depth of focus. In other words, the Z table 61 controls the focus position and the tilt angle of the wafer W to adjust the surface of the wafer W to the image plane of the projection optical system PL by the auto focus method and the auto leveling method.

Next, wafer stage WST will be described in detail. FIG. 2 is a plan view showing the configuration of wafer stage WST. FIG. 3 is an enlarged perspective view of the cables C. FIG.
As described above, wafer stage WST includes Z table 61, XY table 62, and wafer surface plate 63. An opening (not shown) penetrating in the Y direction is provided on a side surface of the XY table 62, and a Y guide bar 72 is inserted into the opening. A plate-like permanent magnet is disposed on the wall surface of the opening that penetrates the XY table 62 in the Y direction. On the other hand, the Y guide bar 72 stores a plurality of coil windings (armatures) along the Y direction. ing. The permanent magnet and the Y guide bar 72 constitute a linear motor 70 that greatly moves the Z table 61 and the XY table 62 in the Y direction.

At both ends in the Y direction of the wafer surface plate 63, linear motors 82 and 84 for moving the Z table 61 and the XY table 62 in the X direction are provided.
The linear motors 82 and 84 are arranged at both ends of the Y guide bar 72 so as to face the Z-direction surface of the movers 82A and 84A (not shown) that store the coil windings, and the X and X of the movers 82A and 84A. It is configured by combining stators 82B and 84B made of plate-like permanent magnets stacked in the direction.
The stators 82B and 84B are fixed to the wafer surface plate 63. As described above, the wafer surface plate 63 reacts with the reaction force generated by driving the linear motors 70, 82, and 84 (the reaction force includes X, Y, and θZ directions). It has a counter mass function that moves in the X direction, Y direction, and θZ direction so as to cancel out.

Connected to the side surface of the wafer surface plate 63 on the linear motor 82 side are power / signal cables and pipes / tubes (hereinafter referred to as cables C) wired / piped (wiring / piping) toward the base plate FC. Has been.
For cables C, a tube that sends compressed air to an air bearing (air pad), a power cable that supplies power to linear motors 70, 82, 84, etc., and linear motors 70, 82, 84, etc. are temperature controlled (cooled). And a suction tube for vacuum suction of the holding surface of the wafer holder WH, a signal cable for transmitting signals from various sensors, and the like. Further, when the exposure apparatus EX is a liquid immersion type, pipes for flowing pure water are also included.

As shown in FIG. 3, the cables C wired / piped between the wafer surface plate 63 and the base plate FC are composed of a plurality of pipes, tubes, and cables, and these are bundled in a band shape in a row in the Z direction. ing. By bundling it in a strip shape in a row in the Z direction, it becomes easy to bend it into a U-shape, and the handling becomes easy. The band width of the cables C bundled in a band shape is, for example, about 300 mm.
The cables C are wired and piped while being fixed by the clamps 12 and 14 along the −X direction on the side surface of the wafer surface plate 63 on the linear motor 82 side. The clamps 12 and 14 are fixed to the wafer surface plate 63. Furthermore, the cables C are fixed by a clamp 16 provided on the base plate FC.
FIG. 2 is a plan view of the wafer surface plate 63 moving slightly in the + Y direction from the neutral position of the stroke, and the cables C are arranged extending in the −X direction so as to draw a loose S shape. (Hereinafter, this portion is referred to as a linear portion C1). The cables C are further arranged to extend in a straight line by a predetermined distance in the −X direction, and then bent into a U shape and further arranged to extend in a straight line in the + X direction as shown in FIG. (Hereinafter, the portion bent in the U shape is referred to as a curved portion C2).
Thereafter, the cables C are fixed by a clamp 18 provided on the base plate FC, and further wired and connected so as to be connected to various devices such as a compressor (not shown) and a control device CONT.

  The clamp 16 is provided on a linear guide member 30 (guide rail 31 and slider 32) extending in the X direction on the base plate FC. That is, the clamp 16 is fixed to the slider 32 that moves in the X direction along the guide rail 31. The linear guide member 30 preferably has wear resistance, impact resistance, and self-lubricating properties, and may be a shaft type in addition to a rail type. As will be described later, since the linear guide member 30 receives a force in the Y direction from the cables C, a member having a strong Y direction rigidity is used.

  The cables C have strong rigidity in the X direction (the length direction of the cables C), but are configured to be flexibly deformed in the Y direction (the direction intersecting the length direction of the cables C). Yes. The material is, for example, polyurethane. In the present embodiment, since the cables C are bundled in a line in the Z direction, even if a plurality of cables are bundled, they are flexibly deformed in the Y direction. When the wafer surface plate 63 moves in the Y direction due to a reaction force caused by the movement of the XY table 62 in the Y direction, the linear portion C1 of the cables C is flexibly deformed in the Y direction. At this time, the tension in the Y direction by the cables C is extremely smaller than the tension in the Y direction by the curved portion C2 of the cables C. As described above, if the restoring force is about 60 N, for example, the tension due to the curved portion C2 is reduced from about 1N to 1/20, from about 3N to 5N. For this reason, the cables C hardly have an adverse effect on the movement of the wafer surface plate 63. Further, since the tension in the Y direction of the linear portion C1 of the cables C is extremely small, the actuators 90, 91, and 92 that adjust the position of the wafer surface plate 63 can be made small and have a low output motor. As a result, it is possible to provide a motor that is inexpensive and has little influence of heat generation and little control disturbance.

On the other hand, when the wafer surface plate 63 moves in the X direction as the XY table 62 moves, the force in the X direction is transmitted to the clamp 16 via the linear portion C1 of the cables C, and the clamp 16 is connected to the cables. The linear guide member 30 is moved in the X direction together with C. The clamp 16 moves smoothly in the X direction along the guide rail 31. At this time, the curved portion C2 of the cables C moves in the X direction, but moves flexibly because it is bundled in a band shape in a row in the Z direction. For this reason, the cables C hardly have an adverse effect on the movement of the wafer surface plate 63.
By the way, the bending part C2 in the cables C, that is, a portion bent at a predetermined radius, generates a large restoring force for returning the bending. For example, a restoring force of about 60 N is generated in the Y direction. This restoring force increases as the bending radius of the cables C decreases. However, both ends of the curved portion C2 in the cables C are fixed by clamps 16 and 18 provided on the base plate FC. The clamp 16 is supported on the base plate FC with high rigidity in the Y direction. Therefore, the restoring force of the cables C is not transmitted to the wafer surface plate 63.

As described above, the wafer surface plate 63 is supported to float on the base plate FC via an air bearing (not shown). Further, actuators 90, 91, and 92 (voice coil motor (VCM), three-phase linear motor, rotary motor, etc.) are attached to the wafer surface plate 63, and are controlled so as to move within a predetermined range of the base plate FC. is doing.
Conventionally, the cables C wired and piped between the wafer surface plate 63 and the base plate FC have given force to the wafer surface plate 63 to hinder its movement. It was necessary to continue driving an actuator (such as a voice coil motor (VCM)).
However, according to the present embodiment, the cables C wired / piped between the base plate FC and the wafer surface plate 63 hardly inhibit the movement of the wafer surface plate 63. Particularly, since the restoring force in the Y direction generated in the curved portion C2 of the cables C is not transmitted to the wafer surface plate 63, an actuator (not shown) that moves the wafer surface plate 63 within a predetermined range of the base plate FC is always driven. There is no need to do it. As a result, it is possible to reduce the running cost (power consumption) of wafer stage WST and thus exposure apparatus EX.

  When performing maintenance of wafer stage WST, it is necessary to move wafer surface plate 63 largely in the X direction. In the present apparatus, since the air bearing guide for levitating the wafer surface plate 63 from the base plate FC extends in the X direction to the end of the base plate FC, the wafer surface plate 63 can be moved on the base plate FC. Also in this case, since the cables C do not hinder the movement of the wafer surface plate 63 in this case, the wafer surface plate 63 is largely moved in the X direction (drawn from below the projection optical system PL). ) Maintenance is easy.

Further, as shown in FIG. 2, a buckling prevention shaft 35 may be provided between the clamp 16 and the clamp 14 in order to prevent the straight portion C <b> 1 of the cables C from buckling. The buckling prevention shaft 35 is a rigid metal shaft, and both ends of the buckling prevention shaft 35 are pin-coupled to the clamp 14 and the slider 32 (clamp 16), respectively, and are rotatable in the θZ direction. It is supported by. As a result, the distance in the X direction between the clamp 16 on the linear guide member 30 and the clamp 14 fixed to the wafer surface plate 63 is kept substantially constant.
In particular, when the wafer surface plate 63 moves in the −X direction, a force in the −X direction is transmitted from the clamp 14 to the slider 32 (clamp 16) via the buckling prevention shaft 35. A compressive force is applied to the linear portion C1 in the class C to prevent buckling.
Further, since the buckling prevention shaft 35 is supported so as to be rotatable in the θZ direction with respect to the clamp 14 and the slider 32 (clamp 16), the movement of the wafer surface plate 63 in the Y direction is not hindered.

The cable for the linear motor 82 is included in the cable of the linear portion C1 connected to the wafer surface plate 63. In order that the tension of the cable branched for the linear motor 82 after being connected to the wafer surface plate 63 does not adversely affect the XY table 62, the linear motor 82 moves linearly as the mover 82A moves in the X direction. A motor cable moving mechanism that moves cables (not shown) for the motor 82 in the X direction may be added. Considering the space, a partition plate may be provided on the upper part of the guide 31 for moving the cables C, and the cable moving mechanism for the motor 82 may be disposed thereon.
In the above-described embodiment, the cables C are fixed by the clamps 16 provided on the base plate FC. However, the cables C may be fixed to the stator 82B of the linear motor 82 or the XY table 62.

FIG. 4 shows an example in which the cables C are fixed to the XY table 62.
One end of the cables C is connected to a clamp 12 a fixed to the XY table 62. The other end of the cables C is connected to the clamp 18 fixed to the base plate FC via the clamps 101 and 100 and the clamp 16a fixed to the slider 32.
As shown in FIG. 4, a straight line portion C2 between the clamp 12a and the clamp 101, a straight line portion C4 between the clamp 101 and the clamp 100, and a straight line portion C5 between the clamp 100 and the clamp 16a are formed. The clamps 100 and 101 are not fixed to the wafer surface plate 63 or the base plate FC, and the entire linear portions C3, C4, and C5 correspond to the linear portion C1 in FIG. Also in this embodiment, both ends of the curved portion C2 are fixed by clamps 16a and 18 provided on the base plate FC. A buckling prevention shaft 35 a may be provided between the clamp 101 and the clamp 100.

Although the embodiment of the present invention has been described above, the operation procedure shown in the above-described embodiment, or the shapes and combinations of the constituent members are examples, and the process is within the scope not departing from the gist of the present invention. Various changes can be made based on conditions and design requirements.
For example, the present invention includes the following modifications.

  As the cables C, the clamp 14 to the clamp 18 have been described as being connected continuously, but may be connected in the middle. It is preferable to use a bending resistant cable or the like between the clamp 14 and the clamp 18. For this reason, a plurality of cables C may be connected via connectors so that the portion of the cables C between the clamp 14 and the clamp 18 can be replaced during maintenance.

  Although the wafer surface plate 63 provided between the wafer stage WSTD and the base plate FC is used as a counter mass, the frame-shaped counter mass and the wafer stage WSTD are used as a frame-shaped counter mass surrounding the wafer stage WSTD. You may make it move on the baseplate FC. Further, the frame-shaped counter mass and wafer stage WSTD may be moved on different base plates.

In the embodiment described above, the wiring and piping of the cables C from the base plate FC to the wafer surface plate 63 has been described. However, the wiring and piping of the cables C from the wafer surface plate 63 to the XY table 62 can also be applied. It is.
The present invention may also be applied to reticle stage RST. Furthermore, although the exposure apparatus EX has been described in the above-described embodiment, it can also be applied to a stage apparatus such as a machine tool.

The exposure apparatus EX may be an immersion type exposure apparatus that exposes the wafer W by disposing the liquid between the projection optical system PL and the wafer W and solving the liquid.
The use of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor or an exposure apparatus for liquid crystal that exposes a liquid crystal display element pattern on a square glass plate, but exposure for manufacturing a thin film magnetic head. Widely applicable to devices.
Further, the present invention can also be applied to a so-called maskless exposure apparatus that directly transfers a pattern onto the wafer W using a digital pixel device (DMD) or the like instead of using a reticle.

The exposure apparatus EX of the present embodiment is manufactured by assembling various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy.
The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus.
The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  Then, as shown in FIG. 5, the semiconductor device includes a step 201 for designing the function and performance of the device, a step 202 for producing a mask (reticle) based on the design step, and a substrate (wafer, Glass plate) step 203, substrate processing step 204 for exposing the pattern of the reticle R onto the wafer W by the exposure apparatus of the above-described embodiment, device assembly step (including dicing process, bonding process, and packaging process) 205, inspection It is manufactured through step 206 and the like.

It is a figure which shows schematic structure of the exposure apparatus EX which concerns on embodiment of this invention. It is a top view which shows the structure of the wafer stage WST which concerns on embodiment of this invention. 3 is an enlarged perspective view of cables C. FIG. It is a top view which shows the example which fixed the cables C to the XY table 62. FIG. It is a flowchart figure which shows an example of the manufacturing process of the microdevice which concerns on embodiment of this invention.

Explanation of symbols

14 ... Clamp (connection part)
16 ... Clamp (holding part)
18 ... Clamp 30 ... Linear guide member (guide member)
31 ... Guide rail (second member)
32 ... Slider (third member)
35 ... Buckling prevention shaft (first member)
63 ... Wafer surface plate (moving member)
FC ... Base plate (fixed part)
C: Cables (linear members)
C1 ... Linear portion C2 ... Curved portion EX ... Exposure apparatus R ... Reticle (mask)
PA ... Pattern (mask pattern)
RST ... Reticle stage (mask stage)
W ... Wafer (substrate)
WST ... Wafer stage (stage device, substrate stage)

Claims (14)

A movable member movable in at least a first direction and a second direction intersecting the first direction;
A linear member having one end connected to the fixed portion via the curved portion and the other end connected to the moving member via a substantially linear portion extending along the first direction;
A guide member that is provided independently of the moving member and is movable in the first direction while holding at least a part of the linear portion of the linear member;
A stage apparatus comprising: The moving member includes a table movable in the first direction and the second direction, and a counter mass that moves in a direction opposite to the moving direction of the table by a reaction force generated by the movement of the table,
The stage apparatus according to claim 1, wherein the other end of the linear member is connected to one of the table and the counter mass.   The stage apparatus according to claim 1, wherein the guide member is provided in the fixing portion.   The stage device according to any one of claims 1 to 3, wherein the guide member is restricted from moving in the second direction.   The guide member is connected to a connection portion of the linear member with the moving member and a holding portion that holds a part of the linear member in the guide member, and the distance between the connection portion and the guide member is increased. The stage apparatus according to claim 1, further comprising a first member that is maintained substantially constant. The guide member includes a second member installed in the fixed portion, and a third member that holds the linear member and is movable with respect to the second member,
The stage device according to any one of claims 1 to 5, wherein the first member is rotatably connected to the connection portion and the second member.   2. The counter mass is movable in the first direction and the second direction, and is rotatable about a third direction orthogonal to the first direction and the second direction. The stage apparatus according to claim 6.   The stage device according to any one of claims 1 to 7, wherein the fixed portion is a base on which at least a part of the moving member is mounted.   The stage apparatus according to any one of claims 1 to 8, wherein the linear member includes a cable connected to the moving member.   The linear portion is formed by bundling a plurality of linear members in a strip shape in a direction crossing the first direction and the second direction. The stage apparatus according to item. An exposure apparatus for forming a predetermined pattern on a substrate held on a substrate stage,
An exposure apparatus using the stage apparatus according to any one of claims 1 to 10 as the substrate stage. An exposure apparatus for forming a mask pattern held on a mask stage on a substrate held on a substrate stage,
An exposure apparatus using the stage apparatus according to any one of claims 1 to 10 for at least one of the mask stage and the substrate stage.   13. A device manufacturing method including a lithography process, wherein the exposure apparatus according to claim 11 or 12 is used in the lithography process. It is a wiring method of a linear member connected between at least a first direction and a moving member movable in a second direction intersecting the first direction,
One end of the linear member is connected to the fixed portion via the curved portion, the other end is further connected to the moving member via a substantially linear portion extending along the first direction, and
A wiring method, wherein a part of the linear member is held by a guide member that is provided independently of the moving member and is movable in the first direction.

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