JP2007299967A5 - - Google Patents

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Publication number
JP2007299967A5
JP2007299967A5 JP2006127167A JP2006127167A JP2007299967A5 JP 2007299967 A5 JP2007299967 A5 JP 2007299967A5 JP 2006127167 A JP2006127167 A JP 2006127167A JP 2006127167 A JP2006127167 A JP 2006127167A JP 2007299967 A5 JP2007299967 A5 JP 2007299967A5
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JP
Japan
Prior art keywords
component
mounting
workpiece
driving unit
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006127167A
Other languages
English (en)
Japanese (ja)
Other versions
JP4592637B2 (ja
JP2007299967A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006127167A priority Critical patent/JP4592637B2/ja
Priority claimed from JP2006127167A external-priority patent/JP4592637B2/ja
Publication of JP2007299967A publication Critical patent/JP2007299967A/ja
Publication of JP2007299967A5 publication Critical patent/JP2007299967A5/ja
Application granted granted Critical
Publication of JP4592637B2 publication Critical patent/JP4592637B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006127167A 2006-05-01 2006-05-01 電子部品装着装置 Expired - Fee Related JP4592637B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006127167A JP4592637B2 (ja) 2006-05-01 2006-05-01 電子部品装着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006127167A JP4592637B2 (ja) 2006-05-01 2006-05-01 電子部品装着装置

Publications (3)

Publication Number Publication Date
JP2007299967A JP2007299967A (ja) 2007-11-15
JP2007299967A5 true JP2007299967A5 (de) 2009-04-02
JP4592637B2 JP4592637B2 (ja) 2010-12-01

Family

ID=38769212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006127167A Expired - Fee Related JP4592637B2 (ja) 2006-05-01 2006-05-01 電子部品装着装置

Country Status (1)

Country Link
JP (1) JP4592637B2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4336732B1 (ja) 2008-04-11 2009-09-30 Ｔｄｋ株式会社 超音波実装装置
JP2010131680A (ja) * 2008-12-02 2010-06-17 Ueno Seiki Kk 保持手段駆動装置
JP5755361B1 (ja) 2014-07-02 2015-07-29 株式会社新川 実装装置
KR102555582B1 (ko) * 2021-07-08 2023-07-17 주식회사 엠아이이큅먼트코리아 플립칩 본딩을 위한 정밀 가압장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3961162B2 (ja) * 1999-08-25 2007-08-22 松下電器産業株式会社 電子部品装着装置および電子部品装着方法
JP2001332586A (ja) * 2000-05-24 2001-11-30 Toshiba Corp 半導体装置の製造方法及びその装置
JP4367740B2 (ja) * 2000-07-26 2009-11-18 芝浦メカトロニクス株式会社 電子部品圧着装置

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