JP2007299967A5 - - Google Patents
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- Publication number
- JP2007299967A5 JP2007299967A5 JP2006127167A JP2006127167A JP2007299967A5 JP 2007299967 A5 JP2007299967 A5 JP 2007299967A5 JP 2006127167 A JP2006127167 A JP 2006127167A JP 2006127167 A JP2006127167 A JP 2006127167A JP 2007299967 A5 JP2007299967 A5 JP 2007299967A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- mounting
- workpiece
- driving unit
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (5)
実装すべき部品を前記実装対象ワークに押圧する第１の荷重駆動部と、
前記第１の荷重駆動部と固定側の間に介装されて前記第１の荷重駆動部の位置を前記押圧の方向に沿って昇降駆動する第２の荷重駆動部とを設けた
電子部品装着装置。 An electronic component mounting apparatus for pressing the held component on the mounting target workpiece,
A first load driving unit that presses a component to be mounted against the workpiece to be mounted;
Electronic component mounting provided with a second load drive unit interposed between the first load drive unit and the fixed side and driving the position of the first load drive unit up and down along the pressing direction apparatus.
実装すべき部品を前記実装対象ワークに押圧する第１の荷重駆動部と、
前記第１の荷重駆動部を介さずに実装すべき部品を前記実装対象ワークに押圧する方向に駆動するとともに前記第１の荷重駆動部とは押圧力が異なる第２の荷重駆動部と
を設けた
電子部品装着装置。 An electronic component mounting apparatus for pressing the held component on the mounting target workpiece,
A first load driving unit that presses a component to be mounted against the workpiece to be mounted;
There is provided a second load driving unit that drives a component to be mounted without going through the first load driving unit in a direction in which the component to be mounted is pressed against the mounting target workpiece and has a pressing force different from that of the first load driving unit. Electronic component mounting device.
保持した部品を実装対象ワークに押し付ける実装ヘッドを、
前記部品を保持する分離ヘッドと、前記分離ヘッドを介して前記部品を前記実装対象ワークに押し付ける荷重駆動部とに分割し、
前記分離ヘッドを、部品受け取り位置Ｓ２と、前記部品を保持して前記荷重駆動部と前記実装対象ワークとの間に挟まれる実装実行位置Ｓ３との間を移動可能に構成するとともに、
荷重駆動部は、
分離ヘッドを前記実装対象ワークに押圧する方向に駆動する第１の荷重駆動部と、
分離ヘッドを前記実装対象ワークに押圧する方向に駆動するとともに前記第１の荷重駆動部とは分離ヘッドに対する押圧力が異なる第２の荷重駆動部と
を有している
電子部品装着装置。 An electronic component mounting apparatus for pressing the held component on the mounting target workpiece,
A mounting head that presses the held parts against the workpiece to be mounted.
Dividing into a separation head that holds the component, and a load drive unit that presses the component against the workpiece to be mounted via the separation head,
The separation head is configured to be movable between a component receiving position S2 and a mounting execution position S3 that holds the component and is sandwiched between the load driving unit and the workpiece to be mounted.
The load drive unit
A first load driving unit that drives the separation head in a direction of pressing the separation target workpiece;
An electronic component mounting apparatus that drives a separation head in a direction in which the separation head is pressed against the workpiece to be mounted and has a second load drive unit that has a different pressing force from the first load drive unit.
部品受け取り位置Ｓ２と実装位置Ｓ３の方向に駆動される移動ブロックと前記分離ヘッドの間に介装されて前記分離ヘッドの前記押圧の方向の移動を許容して前記移動ブロックの移動方向の移動を規制する第２のガイド手段とを設け、第１のガイド手段と固定側の間に第２の荷重駆動部を介装した
請求項３記載の電子部品装着装置。 A first guide means that supports the separation head and guides movement in the direction of the component receiving position S2 and the mounting position S3, and a first load driving unit disposed at the mounting position S3;
It is interposed between the moving block driven in the direction of the component receiving position S2 and the mounting position S3 and the separating head, and allows the moving of the moving block in the moving direction while allowing the separating head to move in the pressing direction. 4. The electronic component mounting apparatus according to claim 3, wherein a second guide means for regulating is provided, and a second load driving unit is interposed between the first guide means and the fixed side.
出力軸が軸心周りに回転するモータと、
前記押圧の方向に配設されて一端が前記モータの出力軸に連結され、他端が前記第１のガイド手段に係合したネジ軸と
を有している
請求項４記載の電子部品装着装置。 The second load drive unit is
A motor whose output shaft rotates about its axis;
5. The electronic component mounting apparatus according to claim 4, further comprising: a screw shaft disposed in the pressing direction and having one end connected to the output shaft of the motor and the other end engaged with the first guide means. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006127167A JP4592637B2 (en) | 2006-05-01 | 2006-05-01 | Electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006127167A JP4592637B2 (en) | 2006-05-01 | 2006-05-01 | Electronic component mounting device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007299967A JP2007299967A (en) | 2007-11-15 |
| JP2007299967A5 true JP2007299967A5 (en) | 2009-04-02 |
| JP4592637B2 JP4592637B2 (en) | 2010-12-01 |
Family
ID=38769212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006127167A Expired - Fee Related JP4592637B2 (en) | 2006-05-01 | 2006-05-01 | Electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4592637B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4336732B1 (en) | 2008-04-11 | 2009-09-30 | Ｔｄｋ株式会社 | Ultrasonic mounting equipment |
| JP2010131680A (en) * | 2008-12-02 | 2010-06-17 | Ueno Seiki Kk | Holding means driver |
| JP5755361B1 (en) | 2014-07-02 | 2015-07-29 | 株式会社新川 | Mounting device |
| KR102555582B1 (en) * | 2021-07-08 | 2023-07-17 | 주식회사 엠아이이큅먼트코리아 | A precise pressing device for flip chip bonding |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3961162B2 (en) * | 1999-08-25 | 2007-08-22 | 松下電器産業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP2001332586A (en) * | 2000-05-24 | 2001-11-30 | Toshiba Corp | Method and apparatus for manufacturing semiconductor device |
| JP4367740B2 (en) * | 2000-07-26 | 2009-11-18 | 芝浦メカトロニクス株式会社 | Electronic component crimping equipment |
-
2006
- 2006-05-01 JP JP2006127167A patent/JP4592637B2/en not_active Expired - Fee Related
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