JP2007295330A - Piezoelectric vibration chip, manufacturing method thereof, and piezoelectric vibration device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To restrain a shape pattern from being displaced in manufacturing a piezoelectric vibration chip. <P>SOLUTION: There are provided a second layer B (simultaneous forming layer) for simultaneously forming shape patterns of a contour pattern D of a substrate 21, and a groove pattern E of a groove 25; and a third layer C (discrimination layer) for discriminating the contour pattern D of the substrate 21 from the groove pattern E of the groove part 25. Using these layers, the shape patterns of the contour pattern D and the groove pattern E are simultaneously formed by the second layer B, and thereafter the contour pattern D and the groove pattern E are discriminated by the third layer C. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a piezoelectric vibrating piece, a piezoelectric vibrating piece, and a piezoelectric vibrating device.

  Currently, examples of the piezoelectric vibration device include a crystal oscillator and a crystal resonator. In this type of piezoelectric vibration device, the main body casing is formed of a rectangular parallelepiped package. This package includes a base and a lid, and at least a piezoelectric vibrating piece such as a quartz vibrating piece is held and bonded to the base by a conductive bonding material. The base and the lid are bonded with a bonding material, whereby the piezoelectric vibrating reed inside the package is hermetically sealed.

  Examples of the piezoelectric vibrating piece include a tuning fork type quartz vibrating piece and an AT-cut quartz vibrating piece. For example, in the case of a tuning-fork type crystal vibrating piece, the substrate is composed of a base portion and two leg portions protruding from one end surface of the base portion, and groove portions are formed on both main surfaces of the leg portion. In addition, the base and the leg (including the groove) include an excitation electrode configured with a different potential, and an extraction electrode extracted from the excitation electrode in order to electrically connect the excitation electrode to the external electrode at the base. (For example, refer to Patent Document 1).

  In the method of manufacturing a piezoelectric vibrating piece (quartz vibrating piece) of Patent Document 1 described below, a quartz base plate is used as a substrate, and an outer pattern for forming the outer shape of the quartz vibrating piece and a groove pattern for forming a groove portion are separately formed. This process is performed. Specifically, a method of manufacturing a piezoelectric vibrating piece (quartz vibrating piece) of Patent Document 1 described below will be described below with reference to FIGS.

  A plurality of plate-like crystal base plates 90 are cut out from an artificial crystal (not shown) (see FIG. 13A), and a plurality of crystal vibrating piece substrates 91 are formed from the crystal base plate 90 (FIG. 15). (See (m)).

  First, as shown in FIG. 13B, a metal layer 95 is formed on both main surfaces 92 of the quartz base plate 90 shown in FIG. Then, as illustrated in FIG. 13C, a photoresist layer 96 (positive resist layer) is formed on the metal layer 95.

  In this state, in order to form the outer shape 93 (see FIG. 15 (m)) of the shape of the substrate 91 of the crystal vibrating piece, the photoresist layer 96 is exposed as shown in FIG. The exposed portion exposed by development is removed, and an external pattern 97 of the crystal vibrating piece in the photoresist layer 96 is formed. Then, the metal layer 95 exposed by forming the external pattern 97 of the substrate 91 in the photoresist layer 96 is removed by metal etching (see FIG. 14E), and the crystal element in the portion where the metal layer 95 is removed by etching is removed. The plate 90 is exposed. After exposing a portion of the quartz base plate 90 (the portion from which the metal layer 95 has been removed by etching), as shown in FIG. 14F, all the photoresist layers 96 are stripped using a stripping solution.

  Subsequently, in order to form the groove 94 (see FIG. 15 (m)) in the shape of the substrate 91, as shown in FIG. 14 (g), both main surfaces 92 (non-peeled metal layer 95) of the substrate 91 are formed. A photoresist layer 98 (positive resist layer) is formed on the substrate. Then, in order to form the groove 94, a part of the photoresist layer 98 (a part corresponding to the groove 94) is exposed, developed with a developer, and the exposed portion is removed, and the crystal vibration in the photoresist layer 98 is removed. A single groove pattern 99 is formed (see FIG. 14H). At this time, a portion of the photoresist layer 98 corresponding to the outer shape pattern 97 of the substrate 91 is also exposed and developed and peeled off.

After the outer pattern 97 and the groove pattern 99 of the substrate 91 are formed, the outer shape 93 of the substrate 91 is formed by etching as shown in FIG. Then, after the outer shape 93 of the substrate 91 is formed by etching, the metal layer 95 on the groove pattern 99 is removed by metal etching (see FIG. 15 (j)).

  After removing the metal film 95 on the groove pattern 99, the photoresist layer 98 is removed (peeled) from the quartz base plate 90 using a stripping solution (see FIG. 15 (k)).

Then, after removing the photoresist layer 98, a groove portion 94 is formed by etching as shown in FIG. 15 (l). After the groove portion 94 is formed by etching, the metal layer 95 is etched away from the quartz base plate 90 by metal etching. A substrate 91 of the crystal vibrating piece shown in FIG. 15 (m) is formed.
Japanese Patent No. 3729249

  As described above, in Patent Document 1, the exposure and development steps of the photoresist layers 96 and 98 for forming the outer pattern 97 and the groove pattern 99 of the substrate 91 are performed twice separately. That is, first, the outer shape pattern 97 of the substrate 91 in the photoresist layer 96 is formed. After the outer shape pattern 97 is formed, the entire photoresist layer 96 is peeled off and the photoresist layer 98 is again formed on the entire main surfaces 92 of the substrate 91. Newly formed. Using the photoresist layer 98 formed here, a groove pattern 99 in the photoresist layer 98 is formed. Therefore, in mass production of piezoelectric vibrating reeds (quartz vibrating reeds), when the groove pattern 99 is formed on the substrate 91 in a state where the outer shape pattern 97 is formed, the pattern deviation of the groove pattern 99 with respect to the outer shape pattern 97 may occur. is there. This pattern deviation of the shape pattern causes a defective shape of the piezoelectric vibrating piece (quartz crystal vibrating piece) and variations in the oscillation frequency.

  Therefore, in order to solve the above-described problems, the present invention provides a method for manufacturing a piezoelectric vibrating piece, a piezoelectric vibrating piece, and a piezoelectric vibrating device that suppress a pattern shift of a shape pattern when the piezoelectric vibrating piece is manufactured. With the goal.

  In order to achieve the above object, a method of manufacturing a piezoelectric vibrating piece according to the present invention includes stacking a plurality of forming layers on both main surfaces of a substrate base plate, and using the stacked forming layers, In the method of manufacturing a piezoelectric vibrating piece for forming an outer shape of a substrate and forming at least one groove on at least one main surface of the substrate, at least the outer shape as the forming layer for forming the shape of the substrate A simultaneous formation layer for simultaneously forming the shape pattern of the outer shape pattern and the groove pattern of the groove portion, and a distinction layer for distinguishing the outer shape pattern from the groove pattern, The shape pattern of the outer shape pattern and the groove pattern is simultaneously formed, and then the outer shape pattern and the groove pattern are distinguished by the distinction layer.

  According to the present invention, the simultaneous formation layer and the distinction layer are used as the formation layer, and after the shape pattern of the outer shape pattern and the groove pattern is simultaneously formed by the simultaneous formation layer, the distinction layer causes the Since the outer pattern and the groove pattern are distinguished from each other, it is possible to suppress the pattern deviation of the shape pattern of the substrate when the piezoelectric vibrating piece is manufactured. As a result, it is possible to suppress the shape defect of the piezoelectric vibrating piece and the variation in the oscillation frequency caused by the pattern deviation of the shape pattern. In particular, when forming the outer shape pattern and the groove pattern, when position detection of the outer shape pattern and the groove pattern is performed by a known image recognition process, the position detection is shifted and the outer shape pattern and the groove pattern are shifted. In many cases, it is impossible to detect the exact position. In this case, in the known piezoelectric vibrating piece manufacturing method, the position detection shift directly affects the pattern shift of the shape pattern. However, according to the present invention, even if the position detection shifts, the shape pattern Pattern deviation does not occur.

  In addition, in order to achieve the above object, a method for manufacturing a piezoelectric vibrating piece according to the present invention includes stacking a plurality of forming layers on both main surfaces of a substrate base plate, and using the stacked forming layers to perform piezoelectric vibration. In the method of manufacturing a piezoelectric vibrating piece for forming the outer shape of the substrate of the piece and forming at least one groove portion on at least one main surface of the substrate, as the forming layer for forming the shape of the substrate, at least, A first layer for exposing the substrate base plate to perform etching formation of the outer shape and the groove portion, and a second layer for simultaneously forming a shape pattern of the outer shape pattern of the outer shape and the groove pattern of the groove portion And the third layer for distinguishing between the outer pattern and the groove pattern, and simultaneously forming the shape pattern of the outer pattern and the groove pattern by the second layer, In order to form the outer shape and the groove portion by using the first layer, the outer shape and the groove portion on the substrate base plate are exposed while distinguishing the outer shape pattern and the groove pattern. A substrate forming step of etching the outer shape and the groove.

  According to the present invention, since the first layer, the second layer, and the third layer are used as the forming layer and the substrate forming step is included, the shape pattern of the substrate when the piezoelectric vibrating piece is manufactured It is possible to suppress the pattern deviation. As a result, it is possible to suppress the shape defect of the piezoelectric vibrating piece and the variation in the oscillation frequency caused by the pattern deviation of the shape pattern. In particular, when forming the outer shape pattern and the groove pattern, when position detection of the outer shape pattern and the groove pattern is performed by a known image recognition process, the position detection is shifted and the outer shape pattern and the groove pattern are shifted. In many cases, it is impossible to detect the exact position. In this case, in the known piezoelectric vibrating piece manufacturing method, the position detection shift directly affects the pattern shift of the shape pattern. However, according to the present invention, even if the position detection shifts, the shape pattern Pattern deviation does not occur. Further, according to the present invention, since the substrate forming step is performed using three layers of the first layer, the second layer, and the third layer as the forming layer, the outer shape pattern by the second layer and When forming the groove pattern, and when distinguishing the outer shape pattern and the groove pattern by the third layer, it is possible to cover the substrate base plate with the first layer, and the shape pattern and the groove It is possible to prevent unnecessary etching of the substrate base plate when forming and distinguishing from the pattern.

  In the method, in the substrate forming step, the outer shape and the groove portion may be individually formed by etching.

  In this case, in the substrate forming step, the outer shape and the groove portion are individually etched and formed, so that the etching amount when etching the outer shape of the substrate and the etching amount when etching the groove portion are variable. Thus, the outer shape of the substrate and the groove can be formed in arbitrary shapes.

  In the method, the substrate forming step includes a first layer forming step of forming the first layer on a main surface of the substrate base plate, and the second layer on the first layer after the first layer forming step. A second layer forming step for forming a pattern, and a pattern forming for simultaneously forming a shape pattern of the outer shape pattern and the groove pattern on the second layer based on a preset shape of the substrate after the second layer forming step. A third layer forming step of forming the third layer on the exposed first layer and the second layer after the pattern forming step, and the outer pattern and the groove after the third layer forming step. In order to distinguish the pattern, a first removal step of removing the third layer on the outline pattern and removing the first layer; and after the first removal step, etching the outline, And the first on the groove pattern A second removal step for removing a layer; a third removal step for removing the first layer on the groove pattern after the second removal step; and a groove formation for etching the groove after the third removal step. And a fourth removal step of removing the first layer and the second layer from the substrate after the third removal step.

  In this case, the substrate formation step includes the first layer formation step, the second layer formation step, the pattern formation step, the third layer formation step, the first removal step, the second removal step, and the third. Since the removal step, the groove portion formation step, and the fourth removal step are included, it is possible to make the interval between the outer shape pattern and the groove pattern constant in the pattern formation step, and the groove pattern with respect to the outer shape pattern. It is possible to suppress occurrence of misalignment (or misalignment of the outer shape pattern with respect to the groove pattern). In addition, since the third layer is covered on the groove pattern by the third layer forming step and the first removing step after the pattern forming step, the etching of the groove is completely performed in the second removing step. Without this, it becomes possible to reliably perform the etching formation of only the outer shape.

  In the method, the first layer may be a metal layer, the second layer may be a negative resist layer, and the third layer may be a positive resist layer.

  In this case, since the first layer is a metal layer, the second layer is a negative resist layer, and the third layer is a positive resist layer, only the corresponding portion of the second layer is formed in the pattern forming step. It is possible to remove only the corresponding portion of the first layer and the third layer in the first removal step, and only the corresponding portion of the third layer in the second removal step. It is possible to remove only the corresponding portion of the first layer in the third removal step, and it is possible to remove the first and second layers in the fourth removal step. This is due to the following action. The stripping solution used when removing (stripping and removing) the second resist layer removes not only the negative resist layer but also the third layer positive resist layer (stripping and removing). On the other hand, the stripper used when removing (stripping) the positive resist layer as the third layer cannot remove the negative resist layer as the second layer. This is related to the fact that the material of the negative resist layer is a rubber-based material having a higher adhesive strength than the material of the positive resist layer, and the first and second removal steps can be performed using the difference in the adhesive strength. It becomes possible. The first layer is a metal layer made of a material different from that of the second and third layers, and the first layer is removed by a removal method (metal etching) different from that of the second and third layers. Therefore, according to this configuration, the pattern forming step and the first to fourth removing steps can be performed.

  In the method, the first layer may be a metal layer, the second layer may be a metal layer having a lower hardness than the first layer, and the third layer may be a negative resist layer.

  In this case, since the first layer is a metal layer, the second layer is a metal layer having a lower hardness than the first layer, and the third layer is a negative resist layer, the pattern forming step In the first removal step, only the corresponding portion of the second layer can be removed. In the first removal step, only the corresponding portion of the first layer and the third layer can be removed, and the second removal step. In the third removal step, only the corresponding portion of the first layer can be removed, and in the third removal step, only the corresponding portion of the first layer can be removed. In the fourth removal step, the first and second portions can be removed. The layer can be removed. This is due to the following action. Since the metal layers which are the first and second layers have different hardnesses, the removal amount (etching amount) of the first and second layers is different even when the same removal method (metal etching) is used. In this case, the removal amount of the second layer is larger than that of the first layer. Further, the third layer is a negative resist layer made of a material different from that of the first and second layers, and the third layer is removed by a removal method (removal using a stripping solution) different from that of the first and second layers. . Therefore, according to this configuration, the pattern forming step and the first to fourth removing steps can be performed. In this case, it is possible to set the removal amount (peeling amount) easily by setting one of the removal amount standards as the hardness of the first and second layers.

  In the method, the first layer may be a metal layer, the second layer may be a metal layer having a lower hardness than the first layer, and the third layer may be a positive resist layer.

  In this case, since the first layer is a metal layer, the second layer is a metal layer having a lower hardness than the first layer, and the third layer is a positive resist layer, the pattern forming step In the first removal step, only the corresponding portion of the second layer can be removed. In the first removal step, only the corresponding portion of the first layer and the third layer can be removed, and the second removal step. In the third removal step, only the corresponding portion of the first layer can be removed, and in the third removal step, only the corresponding portion of the first layer can be removed. In the fourth removal step, the first and second portions can be removed. The layer can be removed. This is due to the following action. Since the metal layers which are the first and second layers have different hardnesses, the removal amount (etching amount) of the first and second layers is different even when the same removal method (metal etching) is used. In this case, the removal amount of the second layer is larger than that of the first layer. The third layer is a positive resist layer made of a material different from that of the first and second layers, and the third layer is removed by a different removal method (removal with a stripping solution) from the first and second layers. . Therefore, according to this configuration, the pattern forming step and the first to fourth removing steps can be performed. In this case, it is possible to set the removal amount (peeling amount) easily by setting one of the removal amount standards as the hardness of the first and second layers.

  In the method, the first layer may be a metal layer, the second layer may be a positive resist layer, and the third layer may be a positive resist layer having a lower adhesive strength than the second layer. .

  In this case, the first layer is a metal layer, the second layer is a positive resist layer, and the third layer is a positive resist layer having a lower adhesive strength than the second layer. It is possible to remove only the corresponding part of the second layer in the forming process, and it is possible to remove only the corresponding part of the first layer and the third layer in the first removing process. It is possible to remove only the corresponding portion of the third layer in the removing step, and it is possible to remove only the corresponding portion of the first layer in the third removing step, and the first portion in the fourth removing step. , Two layers can be removed. This is due to the following action. Since the adhesive strength of the positive resist layer which is the second and third layers is different, the removal amount (peeling amount) of the second and third layers is the same even when the same removal method (removal with a stripping solution) is used. In contrast, in this configuration, the third layer has a larger removal amount than the second layer. The first layer is a metal layer made of a material different from that of the second and third layers, and the first layer is removed by a removal method (metal etching) different from that of the second and third layers. Therefore, according to this configuration, the pattern forming step and the first to fourth removing steps can be performed. In this case, it is possible to set the removal amount (peeling amount) easily by setting one of the removal amount standards as the adhesion amount of the second and third layers.

  In the method, the first layer is a metal layer, the second layer is a metal layer whose hardness is lower than that of the first layer, and the third layer is harder than that of the second layer. It may be a low metal layer.

  In this case, the first layer is a metal layer, the second layer is a metal layer having a lower hardness than the first layer, and the third layer has a lower hardness than the second layer. Since it is a metal layer, it becomes possible to remove only the corresponding portion of the second layer in the pattern forming step, and only the corresponding portion of the first layer and the third layer is removed in the first removing step. It becomes possible to remove only the corresponding portion of the third layer in the second removal step, it is possible to remove only the corresponding portion of the first layer in the third removal step, In the fourth removal step, the first and second layers can be removed. This is due to the following action. The metal layers that are the first to third layers have different hardnesses, so even if the same removal method (metal etching) is used, the removal amount (etching amount) of the first to third layers is different. In the configuration, the second layer has a larger removal amount than the first layer, and the third layer has a larger removal amount than the second layer. Therefore, according to this configuration, the pattern forming step and the first to fourth removing steps can be performed. In this case, the removal amount (etching amount) can be easily set by setting the removal amount reference to the hardness of the first to third layers.

  In the method, in the second removing step, the third layer on the groove pattern may be removed after the outer shape is formed by etching. Alternatively, in the method, in the second removal step, the outer shape may be formed by etching after removing the third layer on the groove pattern.

  In the method, the piezoelectric vibrating piece may be a tuning fork type piezoelectric vibrating piece. Alternatively, in the above method, the piezoelectric vibrating piece may be a thickness-shear vibration type vibrating piece.

  In the method, the first layer may be a metal film, and the first layer may be used as at least a part of the extraction electrode.

  In this case, since the first layer is a metal film and the first layer is used as at least a part of the extraction electrode, an important portion of the extraction electrode (for example, an electrode pad of a base that is external to the piezoelectric vibrating piece and It is possible to reliably form the portion in direct contact without any trouble.

  The method further includes an image recognition step for detecting a position of the outer pattern and the groove pattern, and the first layer is a metal film, and the first layer May be used as an image recognition unit in the image recognition step.

  In this case, the method further includes the image recognition step, the first layer is a metal film, and the first layer is used as an image recognition unit in the image recognition step, so that the image recognition unit is newly formed. As a result, the manufacturing process can be shortened.

  In order to achieve the above object, a piezoelectric vibrating piece according to the present invention is manufactured by the method for manufacturing a piezoelectric vibrating piece described above.

  According to the present invention, since it is manufactured by the above-described method for manufacturing a piezoelectric vibrating piece, it has the same effect as the above-described method for manufacturing a piezoelectric vibrating piece, and as a result, the piezoelectric vibrating piece is manufactured when the piezoelectric vibrating piece is manufactured. It becomes possible to suppress the pattern shift of the shape pattern. That is, it is possible to obtain a piezoelectric vibrating piece that suppresses the shape failure of the piezoelectric vibrating piece and the variation in oscillation frequency caused by the pattern deviation of the shape pattern.

  In order to achieve the above object, the piezoelectric vibration device according to the present invention is such that at least the above-described piezoelectric vibration piece is hermetically sealed on the base in the internal space of the main body casing formed by joining the lid and the base. It is characterized by being stopped.

  According to the present invention, at least the above-described piezoelectric vibrating piece is hermetically sealed on the base in the internal space of the main body casing formed by joining the lid and the base. As a result, it is possible to suppress the pattern deviation of the shape pattern when the piezoelectric vibrating piece is manufactured. That is, it is possible to obtain a piezoelectric vibrating device that suppresses the shape defect of the piezoelectric vibrating piece and the variation in the oscillation frequency caused by the pattern deviation of the shape pattern.

  According to the method for manufacturing a piezoelectric vibrating piece, the piezoelectric vibrating piece, and the piezoelectric vibrating device according to the present invention, it is possible to suppress the pattern deviation of the shape pattern when the piezoelectric vibrating piece is manufactured.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, a case where the present invention is applied to a crystal resonator as a piezoelectric vibration device is shown.

  As shown in FIGS. 1 and 2, in the crystal resonator 1 according to the first embodiment (hereinafter also referred to as the present embodiment), a tuning-fork type crystal vibrating piece 2 (piezoelectric vibrating piece referred to in the present invention) and the crystal A base 3 for holding the vibration piece 2 and a lid 4 for hermetically sealing the crystal vibration piece 2 held on the base 3 are provided.

  In this crystal unit 1, a main body housing 5 is composed of a base 3 and a lid 4. The base 3 and the lid 4 are bonded via a main body casing bonding material 61 (hereinafter also referred to as a bonding material 61) to form an internal space of the main body casing 5. The crystal resonator element 2 is held and bonded onto the base 3 via a crystal resonator element conductive bonding material 62 (hereinafter also referred to as a conductive bonding material), and the internal space of the body housing 5 is hermetically sealed. ing. At this time, as shown in FIGS. 1 and 2, the base 3 and the crystal vibrating piece 2 are ultrasonically bonded and electromechanically bonded by an FCB (Flip Chip Bonding) method using a conductive bonding material 62. Yes. The conductive bonding material 62 used in the present embodiment is a connection bump made of a metal material such as gold. In this embodiment, a low melting point material made of gold (or silver) and tin is used for the bonding material 61. Next, each configuration of the crystal resonator 1 will be described.

  As shown in FIGS. 1 and 2, the base 3 is formed in a box-like body including a bottom portion 31 and a bank portion 32 extending upward from the bottom portion 31. The base 3 is formed by laminating a rectangular parallelepiped of a ceramic material on a single plate having a rectangular shape in a plan view made of a ceramic material, and integrally firing in a concave shape. Moreover, the bank part 32 is shape | molded along the surface outer periphery of the bottom part 31 shown in FIG. The upper surface of the bank portion 32 is a bonding area with the lid 4, and a metallized layer (not shown) for bonding with the lid 4 is provided in the bonding area. The metallized layer has, for example, a structure in which nickel and gold are plated in this order on a tungsten metallized layer or a molybdenum metallized layer.

  The base 3 is formed with a plurality of electrode pads 34 that are electromechanically bonded to the excitation electrodes 26 of the crystal vibrating piece 2. These electrode pads 34 are each electromechanically bonded to terminal electrodes 35 formed on the outer peripheral back surface of the base 3. These terminal electrodes 35 are connected to external parts and external devices. The electrode pads 34 and the terminal electrodes 35 are formed by printing integrally with the base 3 after printing a metallized material such as tungsten or molybdenum. Some of these electrode pads 34 and terminal electrodes 35 are formed by forming nickel plating on the upper portion of the metallization and forming gold plating on the upper portion thereof.

  The lid 4 is made of a metal material and is formed into a single plate having a rectangular shape in plan view as shown in FIG. A bonding material 61 made of a brazing material is formed on the lower surface of the lid 4. The lid 4 is mechanically joined to the base 3 via a joining material 61 by a technique such as seam welding or beam welding, so that the body housing 5 of the crystal unit 1 is constituted by the lid 4 and the base 3. . The lid 4 is made of, for example, four layers of metal materials having different thermal expansion coefficients. Specifically, from the lower surface of the lid 4 serving as a joint surface with the base 3, tin and gold as the joining material 61 (the ratio of tin and gold is about 2 to 8), a tin and silver layer, or a nickel layer The Kovar layer and the nickel layer are sequentially laminated. In the present embodiment, the bonding material 61 is formed into an annular layer along the outer peripheral edge of the lower surface of the lid 4.

  As shown in FIG. 1, the quartz crystal vibrating piece 2 is a tuning fork type quartz crystal vibrating piece, and is a quartz crystal Z plate formed by etching from a quartz base plate 20 (see FIGS. 3 to 5) made of anisotropic material. The substrate 21 of the crystal vibrating piece 2 has an outer shape 28 composed of two leg portions 22 and a base portion 23, and the two leg portions 22 are formed so as to protrude from the base portion 23. Further, in both main surfaces 24 of the two leg portions 22, a groove portion 25 is formed in order to improve a series resonance resistance value that deteriorates due to the miniaturization of the crystal vibrating piece 2. On both main surfaces 24 of the quartz crystal vibrating piece 2, two excitation electrodes 26 configured with different potentials, and lead electrodes 27 for electromechanically joining these excitation electrodes 26 to the electrode pads 34 of the base 3. And are formed. The extraction electrode 27 is extracted from the excitation electrode 26 to the base 23. The lead electrode 27 formed on the base 23 and the electrode pad 34 of the base 3 are joined by the conductive joining material 62, and the excitation electrode 26 and the electrode pad 34 are joined electromechanically. The excitation electrode 26 and the extraction electrode 27 of the quartz crystal resonator element 2 are, for example, laminated thin films composed of a chromium base electrode layer and a gold upper electrode layer. This thin film is formed on the entire surface by a technique such as vacuum deposition or sputtering, and then formed into a desired shape by metal etching by photolithography.

  By the way, out of the shape of the substrate 21 of the crystal resonator element 2 described above, the outer shape 28 and the groove 25 have three formation layers A, B, and C (first to third layers shown in FIGS. 3 to 5) on both main surfaces 24. Are formed using the laminated first to third layers A, B, and C. In the present embodiment, as the formation layers A, B, and C for forming the shape of the substrate 21, a first layer for etching the outer shape 28 and the groove 25 of the substrate 21 by exposing the substrate 21. A, a second layer B (simultaneously formed layer in the present invention) for simultaneously forming the shape pattern of the outer shape pattern D of the substrate 21 and the groove pattern E of the groove portion 25, and the outer shape pattern D and the groove portion 25 of the substrate 21. The third layer C (the distinguishing layer in the present invention) for distinguishing from the groove pattern E is used. In this embodiment, a metal layer made of Cr (chromium) and Au (gold) is used as the first layer A, a negative resist layer mainly containing xylene is used as the second layer B, and the third layer C is used. A positive resist layer mainly composed of ethyl lactate and butyl acetate is used.

  And in the formation process of the board | substrate 21 of the crystal vibrating piece 2, after forming the shape pattern of the external shape pattern D and the groove pattern E by the 2nd layer B simultaneously using the above-mentioned formation layers A, B, and C, the first While distinguishing the outer pattern D and the groove pattern E by the three layers C, the substrate portion corresponding to the outer shape 28 and the groove portion 25 of the substrate 21 is exposed using the first layer A, and the outer shape 28 and the groove portion 25 of the substrate 21 are exposed. Are separately formed by etching (substrate forming step referred to in the present invention) to form the substrate 21 of the crystal vibrating piece 2.

  The substrate forming process will be described in more detail. The artificial quartz crystal (not shown) is cut and formed into a plurality of plate-like quartz base plates 20 (substrate base plate in the present invention) (see FIG. 3A). The board | substrate 21 of the some crystal vibrating piece 2 is formed from the board 20 (refer FIG.5 (m)). 3 to 5 are partial side views of the quartz base plate 20 and the substrate 21 and correspond to the cross-sectional view taken along the line A3-A3 of the substrate 21 shown in FIG. The quartz base plate 20 is a quartz Z plate, which is obtained by inclining an XY plane composed of the X axis and the Y axis in the orthogonal coordinate system around the X axis when cut out from the artificial quartz crystal.

  First, as shown in FIG. 3B, the first layer A is formed on both main surfaces 24 of the quartz base plate 20 shown in FIG. 3A (first layer forming step in the present invention). Then, on the first layer A formed as shown in FIG. 3B, a second layer B is formed as shown in FIG. 3C (second layer forming step in the present invention).

  After the second layer forming step, as shown in FIG. 4D, based on the preset shape of the substrate 21, the shape patterns of the outer shape pattern D and the groove pattern E are simultaneously formed on the second layer B (this book). Pattern forming step referred to in the invention). Specifically, in order to form the outer shape 28 and the groove portion 25 of the substrate 21, the second layer B of the portion (corresponding portion) corresponding to the outer shape 28 and the groove portion 25 of the substrate 21 on the crystal base plate 20 is exposed and developed. The portion exposed by developing with a liquid is removed, and the external pattern D and the groove pattern E of the crystal vibrating piece 2 in the second layer B are formed. In this embodiment, the shape of the outer shape 28 and the groove portion 25 of the substrate 21 is set as the shape of the substrate 21.

  After the pattern forming step, as shown in FIG. 4E, a third layer C is formed on the exposed first layer A and second layer B (third layer forming step in the present invention).

  After the third layer forming step, the third layer C on the outer pattern D is exposed and developed in order to distinguish the outer pattern D and the groove pattern E in the second layer B, as shown in FIG. The portion exposed by development using a liquid is removed, and the third layer C on the groove pattern E in the second layer B is formed without being removed. In this state, as shown in FIG. 4G, the exposed first layer A is removed by metal etching (first removal step referred to in the present invention).

After the first removal step, as shown in FIGS. 4 (h) and 4 (i), the outer shape 28 is formed by etching, and the third layer C on the groove pattern E is removed (the second layer in the present invention). Removal step). The second removal step according to the present embodiment will be described in detail. First, the third layer C on the groove pattern E is removed (peeled) using a stripping solution (see FIG. 4H), and then the outer shape 28 is removed. Is formed by etching (see FIG. 4I).

  After the second removal step, as shown in FIG. 5 (j), the first layer A on the groove pattern E is removed by metal etching (third removal step in the present invention).

  After the third removal step, the second layer B is removed (peeled) from the quartz base plate 20 using a stripping solution (see FIG. 5 (k)), and after removing the second layer B, the groove 25 is formed by etching ( After the groove 25 is formed by etching, the first layer A is etched away from the quartz base plate 20 by metal etching to form the substrate 21 of the crystal vibrating piece 2 shown in FIG. (Groove formation step and fourth removal step) in the present invention).

  In the present embodiment, the peeling solution or developer used for peeling (developing) the second layer B is different from the peeling solution or developing solution used for peeling (developing) the third layer C. Use materials. Specifically, the stripping solution (developer) used when removing the negative resist layer as the second layer B is a material for removing not only the negative resist layer but also the positive resist layer as the third layer C. On the other hand, the stripping solution (developer) used when removing the positive resist layer which is the third layer C is a material which cannot remove the negative resist layer which is the second layer B.

  The metal etching for the first layer A includes wet etching, dry etching, electric field etching, and the like.

  As described above, according to the method for manufacturing the quartz crystal vibrating piece 2 according to the present embodiment, the simultaneous formation layer is formed by using the simultaneous formation layer (second layer B) and the distinction layer (third layer C) as the formation layer. After the shape pattern of the outer shape pattern D and the groove pattern E is formed at the same time, the outer shape pattern D and the groove pattern E are discriminated by the distinction layer, so that the pattern of the shape pattern of the substrate 21 when manufacturing the crystal vibrating piece 2 Deviation can be suppressed. As a result, it is possible to suppress the shape defect of the crystal vibrating piece 2 and the variation in the oscillation frequency caused by the pattern deviation of the shape pattern. In particular, when the outer pattern D and the groove pattern E are formed, when position detection of the outer pattern D and the groove pattern E is performed by a known image recognition process, the position detection is shifted and the outer pattern D and the groove pattern E In many cases, it is not possible to detect the exact position of. In this case, in the conventional (well-known) crystal vibrating piece manufacturing method as shown in FIGS. 13 to 15 described above, the position detection deviation directly affects the pattern deviation of the shape pattern. Even if they are shifted, pattern displacement of the shape pattern does not occur.

  In addition, according to the method for manufacturing the quartz crystal vibrating piece 2 according to the present embodiment, the first layer A, the second layer B, and the third layer C are used as the formation layers, and the substrate forming step is included. In addition, when forming the outer shape pattern D and the groove pattern E by the second layer B and when distinguishing the outer shape pattern D and the groove pattern E by the third layer C, the crystal element plate 20 is formed by the first layer A. Thus, unnecessary etching of the quartz base plate 20 can be prevented when forming and distinguishing the shape pattern D and the groove pattern.

  Further, in the substrate forming step, the outer shape 28 and the groove portion 25 are individually etched and formed, so that the etching amount when the outer shape 28 of the substrate 21 is formed by etching and the etching amount when the groove portion 25 is formed by etching are varied. The outer shape 28 and the groove 25 of the substrate 21 can be formed in arbitrary shapes.

  The substrate forming process includes a first layer forming process, a second layer forming process, a pattern forming process, a third layer forming process, a first removing process, a second removing process, a third removing process, a groove forming process, and a fourth. And the removal step, the interval between the outer shape pattern D and the groove pattern E can be made constant in the pattern formation step, and the positional deviation of the groove pattern E with respect to the outer shape pattern D (or the outer shape pattern D with respect to the groove pattern E) It is possible to suppress occurrence of misalignment. Further, since the third layer C is covered on the groove pattern E by the third layer forming step and the first removing step after the pattern forming step, the outer shape is formed without performing the etching of the groove 25 in the second removing step. Only 28 etching formation can be performed reliably.

  Further, since the first layer is a metal layer, the second layer is a negative resist layer, and the third layer is a positive resist layer, only the corresponding portion of the second layer B can be removed in the pattern forming process. In the first removal step, only the corresponding portion of the first layer A and the third layer C can be removed, and in the second removal step, only the corresponding portion of the third layer C can be removed. Only the corresponding part of the first layer A can be removed in the process, and the first, second layers A and B can be removed in the fourth removal process. This is due to the following action. The stripping solution used for removing (stripping and removing) the negative resist layer as the second layer B removes (stripping and removing) the positive resist layer as the third layer C as well as the negative resist layer. On the other hand, the stripper used when removing (stripping) the positive resist layer as the third layer C cannot remove the negative resist layer as the second layer B. This is related to the fact that the material of the negative resist layer is a rubber-based material that has a higher adhesive strength than the material of the positive resist layer, and the first and second removal steps can be performed using this difference in adhesive strength. . The first layer A is a metal layer made of a different material from the second and third layers B and C, and the first layer A is removed by a removal method (metal etching) different from that of the second and third layers B and C. To do. Therefore, according to the present Example, a pattern formation process and the 1st-4th removal process can be performed.

  Further, according to the quartz crystal resonator element 2 according to the present embodiment, the quartz crystal resonator element 2 is manufactured by the above-described method for manufacturing the quartz crystal oscillator piece 2, and thus has the same effects as the above-described method for manufacturing the quartz crystal oscillator piece 2. Further, it is possible to suppress the pattern shift of the shape pattern when manufacturing the crystal vibrating piece 2. That is, it is possible to obtain a crystal resonator element that suppresses the shape defect of the crystal resonator element 2 and the variation in the oscillation frequency caused by the pattern deviation of the shape pattern.

  Further, according to the crystal resonator 1 according to the present embodiment, at least the above-described crystal resonator element 2 is hermetically sealed on the base 3 in the internal space of the main body housing 5 formed by joining the lid 4 and the base 3. Therefore, the same effect as that of the method for manufacturing the quartz crystal vibrating piece 2 described above can be obtained. As a result, the pattern deviation of the shape pattern when the quartz crystal vibrating piece 2 is manufactured can be suppressed. That is, it is possible to obtain the crystal resonator 1 in which the shape defect of the crystal vibrating piece 2 and the variation in the oscillation frequency caused by the pattern deviation of the shape pattern are suppressed.

  In the present embodiment, the quartz crystal resonator element 2 is provided in a state of being hermetically sealed on the base 3 in the internal space of the main body housing 5, but the members provided on the base 3 in the internal space of the main body housing 5 are The crystal vibrating piece 2 is not limited to a single unit, and an electronic component such as an integrated circuit element or another crystal vibrating piece may be provided.

  In this embodiment, as shown in FIGS. 1 and 2, a lid 4 formed in a rectangular parallelepiped on a rectangular plate in plan view and a base 3 formed in a concave shape are used. It is not limited to. If the crystal vibrating piece 2 can be hermetically sealed by the base 3 and the lid 4, the shapes of the base 3 and the lid 4 may be arbitrarily set. That is, the joining region of the base 3 is not limited to the bank portion 32 formed along the outer periphery of the surface of the bottom portion 31, but the lid 4 and the base 3 are joined and the internal space of the main body housing 5 is formed. In addition, any design may be used as long as the internal space can be hermetically sealed.

  In the present embodiment, the bonding material 61 is provided on the lid 4, but is not limited thereto, and may be provided on the base 3. Further, it may be used when joining the lid 4 and the base 3 without being provided on either the lid 4 or the base 3.

  In the present embodiment, the crystal vibrating piece 2 is directly bonded to the base 3 by the conductive bonding material 62. However, the present invention is not limited to this, and the crystal vibrating piece 2 is connected to the base 3 via another member. You may join indirectly. For example, the crystal vibrating piece 2 may be joined to the base 3 via a support material in order to reduce external stress on the crystal vibrating piece 2.

  Further, in the above-described crystal resonator 1 according to the present embodiment, only the connection bump made of a metal material such as gold is used as the conductive bonding material 62, but it may be made of a connection bump of another metal material. Moreover, you may use the conductive resin adhesive which consists of not only a connection bump but a silicone resin.

In this embodiment, after the first removal step, the second removal step is performed as shown in FIGS. 4 (h) and 4 (i). However, the outer shape 28 is not limited to this step. Etching is performed and the third layer C on the groove pattern E may be removed. For example, FIG. 6 (h ′), FIG.
As shown in FIG. 6 (a), first, the outer shape 28 may be formed by etching (see FIG. 6 (h ′)), and then the third layer C on the groove pattern E may be removed (see FIG. 6 (i ′)). ).

  In this embodiment, after the third removal step, the groove forming step and the fourth removing step are performed as shown in FIG. 5, but the groove forming step and the fourth removing step are limited to this. Instead, the groove forming process and the fourth removing process may be performed after the third removing process. Therefore, the order of the groove portion forming step and the fourth removing step may be arbitrarily changed. For example, the groove portion 25 is first formed by etching after the third removing step, and the groove portion 25 is formed by etching and then the second portion is removed from the substrate 21. The substrate 21 of the crystal vibrating piece 2 may be formed by removing the layer B and removing the second layer B from the substrate 21 and then removing the first layer A from the substrate 21.

  In this embodiment, the groove portions 25 are formed on both main surfaces 24 of the substrate 21, but the present invention is not limited to this, and at least one groove portion may be formed on at least one main surface of the substrate 21.

  In this embodiment, the groove portions 25 are formed on both main surfaces 24 of the substrate 21. However, the definition of the groove portions 25 in the present invention is not limited to this, and the recesses are formed from both the main surfaces 24 to the inside of the substrate 21. For example, it may be a through-hole penetrating both main surfaces 24 of the substrate 21.

  In the present embodiment, only the first to third layers A, B, and C are used as the formation layer for forming the shape of the substrate 21, but the present invention is not limited to this. It may be a formation layer composed of four or more layers including layers A, B, and C.

  Further, in this embodiment, as shown in FIG. 4F, the groove pattern in the second layer B is distinguished from the outer pattern D in the second layer B and the groove pattern E after the third layer forming step. However, the present invention is not limited to this, and the outer layer pattern D in the second layer B is covered with the groove pattern E in the second layer B. If the third layer C is formed so as not to cover the surface, the portion where the third layer C is not removed may be arbitrarily set. For example, the portion where the third layer C is not removed may be on the groove pattern E and the second layer B in the second layer B, and in this case, the hydrofluoric acid resistance can be improved.

  In the present embodiment, the first layer A is entirely removed by metal etching. However, the present invention is not limited to this, and the first layer A is removed from the extraction electrode 27 while leaving a part of the first layer A. It may be used as at least a part. In this case, it is possible to reliably form an important portion of the extraction electrode 27 (for example, a portion that is in direct contact with the electrode pad 34 of the base 3 that is external as viewed from the quartz crystal vibrating piece 2) without any problem.

In this embodiment, the first layer A is entirely removed by metal etching. However, the present invention is not limited to this, and the first layer A and the outer pattern D are left with a part of the first layer A remaining. You may use as an image recognition part for detecting the position of these patterns D and E (image recognition process) in forming the groove pattern E. In this case, a process for forming a new image recognition unit is not required, and as a result, the manufacturing process can be shortened.

In this embodiment, a metal layer is used as the first layer A, a negative resist layer is used as the second layer B, and a positive resist layer is used as the third layer C. The materials of B and C are not limited to these, and specific examples are shown below.

  As a first example, a metal layer may be used for the first layer A, a metal layer having a lower hardness than the first layer A may be used for the second layer B, and a negative resist layer may be used for the third layer C. In this case, only the corresponding portion of the second layer B can be removed in the pattern forming step, and only the corresponding portion of the first layer A and the third layer C can be removed in the first removing step. Only the corresponding part of the third layer C can be removed in the removing process, only the corresponding part of the first layer can be removed in the third removing process, and the first, second layers A and B can be removed in the fourth removing process. Can be removed. This is due to the following action. Since the hardness of the first and second layers A and B is different, the removal amount (etching amount) of the first and second layers A and B is the same even when the same removal method (metal etching) is used. In contrast, in this configuration, the removal amount of the second layer B is larger than that of the first layer A. The third layer C is a negative resist layer made of a material different from that of the first and second layers A and B, and the third layer C is a removal method different from that of the first and second layers A and B (removal by a stripping solution). ) To remove. Therefore, according to this structure, a pattern formation process and the 1st-4th removal process can be performed. In this case, one of the removal amount standards can be set to the hardness of the first and second layers to facilitate the setting of the removal amount (peeling amount).

  As a second example, a metal layer may be used for the first layer A, a metal layer having a lower hardness than the first layer A may be used for the second layer B, and a positive resist layer may be used for the third layer C. In this case, it is possible to remove only the corresponding portion of the second layer in the pattern forming step, and it is possible to remove only the corresponding portion of the first layer and the third layer in the first removing step. It is possible to remove only the corresponding part of the third layer in the process, it is possible to remove only the corresponding part of the first layer in the third removing process, and the first and second layers are removed in the fourth removing process. It becomes possible. This is due to the following action. Since the hardness of the first and second metal layers is different, the removal amount (etching amount) of the first and second layers is different even when the same removal method (metal etching) is used. The removal amount of the second layer is larger than that of the first layer. The third layer is a positive resist layer made of a material different from that of the first and second layers, and the third layer is removed by a different removal method (removal with a stripping solution) from the first and second layers. Therefore, according to this structure, it becomes possible to perform a pattern formation process and the 1st-4th removal process. In this case, it is possible to easily set the removal amount (peeling amount) by setting one of the removal amount standards to the hardness of the first and second layers.

  As a third example, a metal layer may be used for the first layer A, a positive resist layer may be used for the second layer B, and a positive resist layer having a lower adhesive strength than the second layer B may be used for the third layer C. Good. In this case, only the corresponding portion of the second layer B can be removed in the pattern forming step, and only the corresponding portion of the first layer A and the third layer C can be removed in the first removing step. Only the corresponding part of the third layer C can be removed in the removal process, only the corresponding part of the first layer A can be removed in the third removal process, and the first, second layers A, B can be removed. This is due to the following action. Since the positive resist layers which are the second and third layers B and C have different adhesive strengths, the removal amount of the second and third layers B and C (even if the same removal method (removal with a stripping solution) is used) In this configuration, the third layer C has a larger removal amount than the second layer B. The first layer A is a metal layer made of a different material from the second and third layers B and C, and the first layer A is removed by a removal method (metal etching) different from that of the second and third layers B and C. To do. Therefore, according to this structure, a pattern formation process and the 1st-4th removal process can be performed. In this case, the removal amount (peeling amount) can be easily set by setting one of the removal amount standards as the adhesion amount of the second and third layers B and C.

  As a fourth example, a metal layer is used for the first layer A, a metal layer whose hardness is lower than that of the first layer A is used for the second layer B, and hardness is compared with the second layer B for the third layer C. A low metal layer may be used. In this case, only the corresponding portion of the second layer B can be removed in the pattern forming step, and only the corresponding portion of the first layer A and the third layer C can be removed in the first removing step. Only the corresponding part of the third layer C can be removed in the removal process, only the corresponding part of the first layer A can be removed in the third removal process, and the first, second layers A, B can be removed. This is due to the following action. Since the metal layers of the first to third layers A, B, and C have different hardnesses, the removal amount of the first to third layers A, B, and C even when the same removal method (metal etching) is used. (Etching amount) is different, and in this configuration, the second layer B has a larger removal amount than the first layer A, and the third layer C has a larger removal amount than the second layer B. Therefore, according to this structure, a pattern formation process and the 1st-4th removal process can be performed. In this case, the removal amount (etching amount) can be easily set by setting the removal amount reference to the hardness of the first to third layers A, B, and C.

  Further, in the above-described modification of the materials of the first to third layers A, B, and C, when a metal layer is used for at least two layers, the hardness of the respective layers is varied to achieve a difference in the removal process. However, the present invention is not limited to this, and metal etching of each metal layer may be performed using a corresponding etching solution corresponding to each metal material. For example, when Cr (chromium) is used for the metal layer, metal etching of the metal layer is performed using a perchloric acid aqueous solution. When Au (gold) is used for the metal layer, an aqueous iodine solution is used to form the metal layer. Metal etching may be performed to achieve a difference in the removal process.

  Next, the crystal resonator 1 according to the second embodiment will be described with reference to the drawings. The crystal resonator 1 according to the second embodiment is different from the first embodiment in the crystal vibrating piece. Therefore, in the second embodiment, a configuration different from that of the first embodiment will be described, and a description of the same configuration will be omitted. Therefore, the operation effect and modification by the same structure have the same operation effect and modification as Example 1 mentioned above.

  As shown in FIGS. 7 and 8, the crystal vibrating piece 7 is a thickness-slip vibration type vibrating piece. In this embodiment, an AT-cut crystal piece is used. The quartz crystal resonator element 7 is composed of an AT-cut quartz crystal substrate 71 and is formed into a rectangular parallelepiped having a rectangular shape in plan view. That is, the outer shape 76 of the substrate 71 has a rectangular parallelepiped shape.

  In order to cope with the higher frequency of the quartz crystal resonator element 7 on both the main surfaces 72 of the substrate 71, for example, a groove 75 (also referred to as a recess) is formed by a technique such as etching. It is made thin. Excitation electrodes 73 are formed on both main surfaces 72 (inner bottom surfaces of the groove portions 75) of the thin quartz crystal vibrating piece 7, and these excitation electrodes 73 are connected to external electrodes (in this embodiment, base electrodes) by a conductive bonding material 62. A lead electrode 74 drawn from the excitation electrode 73 is formed for electromechanical joining with the third electrode pad 34).

  The excitation electrode 73 and the extraction electrode 74 are formed by photolithography, for example, in the order of chromium and gold (Cr—Au) from the substrate 71 side, or chromium, gold, and chromium (Cr—Au—Cr). Or in order of chromium, gold, nickel (Cr—Au—Ni), or in order of chromium, silver, chromium (Cr—Ag—Cr), or in order of chromium, nickel (Cr—Ni), or nickel, It is formed by stacking chromium (Ni—Cr) in this order.

  Of the shape of the substrate 71 of the quartz crystal resonator element 7 described above, the outer shape 76 and the groove portion 75 are formed by laminating first to third layers A, B, and C (see FIGS. 9 to 11) on both main surfaces 74. The first to third layers A, B, and C are formed.

  Then, in the step of forming the substrate 71 of the quartz crystal resonator element 7, the shape patterns of the outer pattern D and the groove pattern E are simultaneously formed by the second layer B using the above-described formation layers A, B, and C, While distinguishing between the outer pattern D and the groove pattern E by the three layers C, the substrate layer corresponding to the outer shape 76 and the groove portion 75 of the substrate 71 is exposed using the first layer A, and the outer shape 76 and the groove portion 75 of the substrate 71 are exposed. Are separately formed by etching (substrate forming step in the present invention) to form the substrate 71 of the crystal vibrating piece 7.

  The substrate forming process will be described in more detail. The artificial quartz crystal (not shown) is cut and formed into a plurality of plate-like crystal base plates 70 (substrate base plate in the present invention) (see FIG. 9A). The board | substrate 71 of the some crystal vibrating piece 7 is formed from the board 70 (refer FIG.11 (m)). 9 to 11 are partial side views of the quartz base plate 70 and the substrate 71, and correspond to the substrate 71 in the cross-sectional view taken along line B3-B3 shown in FIG. The quartz base plate 70 is a quartz Z plate, which is obtained by inclining an XY plane composed of the X axis and the Y axis in the orthogonal coordinate system around the X axis when cut out from the artificial quartz crystal.

  First, as shown in FIG. 9B, the first layer A is formed on both main surfaces 74 of the quartz base plate 70 shown in FIG. 9A (first layer forming step in the present invention). Then, on the first layer A formed as shown in FIG. 9B, a second layer B is formed as shown in FIG. 9C (second layer forming step in the present invention).

  After the second layer forming step, as shown in FIG. 10D, based on the preset shape of the substrate 71, the shape patterns of the outer shape pattern D and the groove pattern E are simultaneously formed on the second layer B (this book Pattern forming step referred to in the invention). Specifically, in order to form the outer shape 76 and the groove portion 75 of the substrate 71, the second layer B of the portion (corresponding portion) corresponding to the outer shape 76 and the groove portion 75 of the substrate 71 on the crystal base plate 70 is exposed and developed. The portion exposed by developing with a liquid is removed, and the external pattern D and the groove pattern E of the crystal vibrating piece 7 in the second layer B are formed. In this embodiment, the outer shape 76 of the substrate 71 and the shape of the groove 75 are set as the shape of the substrate 71.

  After the pattern formation step, as shown in FIG. 10E, a third layer C is formed on the exposed first layer A and second layer B (third layer formation step in the present invention).

  After the third layer forming step, the third layer C on the outer pattern D is exposed and developed in order to distinguish the outer pattern D and the groove pattern E in the second layer B, as shown in FIG. Development is performed using a liquid to remove the exposed portion, and the third layer C on the groove pattern E in the second layer is formed without being removed. In this state, as shown in FIG. 10G, the exposed first layer A is removed by metal etching (first removal step referred to in the present invention).

After the first removal step, as shown in FIGS. 10 (h) and 10 (i), the outer shape 76 is etched and the third layer C on the groove pattern E is removed (the second layer referred to in the present invention). Removal step). The second removal step according to the present embodiment will be described in detail. First, the third layer C on the groove pattern E is removed (peeled) using a stripping solution (see FIG. 10H), and then the outer shape 76 is obtained. Is formed by etching (see FIG. 10I).

  After the second removal step, as shown in FIG. 11 (j), the first layer A on the groove pattern E is removed by metal etching (third removal step in the present invention).

  After the third removal step, the second layer B is removed (peeled) from the quartz base plate 70 using a peeling liquid (see FIG. 11 (k)), and after removing the second layer B, the groove 75 is formed by etching ( After the groove 75 is formed by etching, the first layer A is etched away from the quartz base plate 70 by metal etching to form the substrate 71 of the quartz crystal resonator element 7 shown in FIG. (Groove formation step and fourth removal step) in the present invention).

In the present embodiment described above, after the first removal step, the second removal step is performed as shown in FIGS. 10 (h) and 10 (i). The third layer C on the groove pattern E may be removed by etching. For example, as shown in FIGS. 12 (h ′) and 12 (i ′), the outer shape 76 is first formed by etching ( Then, the third layer C on the groove pattern E may be removed (see FIG. 12 (i ′)).

  It should be noted that the present invention can be implemented in various other forms without departing from the spirit, gist, or main features. For this reason, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

  As a material of the piezoelectric vibrating piece according to the present invention, it is preferable to use quartz.

FIG. 1 is a schematic configuration diagram of the crystal resonator according to the first embodiment, and is a schematic plan view seen from a cross section taken along line A1-A1 of FIG. FIG. 2 is a schematic configuration diagram of the crystal resonator according to the first embodiment, and is a cross-sectional view taken along line A2-A2 of FIG. FIG. 3A to FIG. 3C are diagrams illustrating a manufacturing process of the substrate of the crystal resonator element according to the first embodiment. FIG. 4D to FIG. 4I are diagrams illustrating a manufacturing process of the crystal resonator element substrate according to the first embodiment, and are diagrams illustrating a subsequent process of the manufacturing process illustrated in FIG. 3. FIG. 5J to FIG. 5M are diagrams illustrating a manufacturing process of the quartz crystal resonator element substrate according to the first embodiment, and are diagrams illustrating a subsequent process of the manufacturing process illustrated in FIG. 4. 6 (h ′) and FIG. 6 (i ′) are diagrams showing a manufacturing process of a quartz crystal resonator element substrate according to another example of the first embodiment. FIG. 6 (h ′) and FIG. The process shown in i ′) is a modification of the process shown in FIGS. 4 (h) and 4 (i). FIG. 7 is a schematic configuration diagram of the crystal resonator according to the second embodiment, and is a schematic plan view of the inside of the crystal resonator viewed from the B1-B1 line cross section of FIG. FIG. 8 is a schematic configuration diagram of the crystal resonator according to the second embodiment, and is a cross-sectional view taken along line B2-B2 of FIG. FIG. 9A to FIG. 9C are diagrams illustrating a manufacturing process of a crystal resonator element substrate according to the ninth embodiment. FIG. 10D to FIG. 10I are diagrams showing a manufacturing process of the quartz crystal resonator element substrate according to the second embodiment, and are diagrams showing a subsequent process of the manufacturing process shown in FIG. FIG. 11J to FIG. 11M are diagrams illustrating the manufacturing process of the quartz crystal resonator element substrate according to the second embodiment, and are diagrams illustrating a subsequent process of the manufacturing process illustrated in FIG. 10. 12 (h ′) and FIG. 12 (i ′) are diagrams illustrating a manufacturing process of a quartz vibrating piece substrate according to another example of the second embodiment, and FIG. 12 (h ′) and FIG. The process shown in i ′) is a modification of the process shown in FIGS. 10 (h) and 10 (i). FIG. 13A to FIG. 13C are diagrams showing a manufacturing process of a substrate of a quartz crystal resonator element according to a conventional example. FIG. 14D to FIG. 14I are diagrams showing a manufacturing process of the quartz crystal resonator element substrate according to the conventional example, and are diagrams showing a subsequent process of the manufacturing process shown in FIG. FIGS. 15 (j) to 15 (m) are diagrams showing a manufacturing process of a quartz crystal resonator element substrate according to a conventional example, and are diagrams showing a subsequent process of the manufacturing process shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Crystal oscillator 2, 7 Crystal vibrating piece 20, 70 Crystal base plate 21, 71 Substrate 24, 72 Both main surfaces 25, 75 Groove parts 28, 76 Outer shape 3 Base 4 Lid 5 Body housing A First layer B Second layer C 3rd layer D Outline pattern E Groove pattern

Claims (17)

A plurality of forming layers are stacked on both main surfaces of the substrate base plate, and the outer shape of the substrate of the piezoelectric vibrating piece is formed using the stacked forming layers, and at least one main surface of the substrate is at least one main surface. In the method of manufacturing the piezoelectric vibrating piece for forming the groove,
As the formation layer for forming the shape of the substrate, at least a simultaneous formation layer for simultaneously forming a shape pattern of the outer shape pattern of the outer shape and the groove pattern of the groove portion, the outer shape pattern and the groove pattern, And a distinction layer for distinguishing
A method of manufacturing a piezoelectric vibrating piece, wherein after the shape pattern of the outer shape pattern and the groove pattern is simultaneously formed by the simultaneous forming layer, the outer shape pattern and the groove pattern are differentiated by the distinguishing layer. A plurality of forming layers are stacked on both main surfaces of the substrate base plate, and the outer shape of the substrate of the piezoelectric vibrating piece is formed using the stacked forming layers, and at least one main surface of the substrate is at least one main surface. In the method of manufacturing the piezoelectric vibrating piece for forming the groove,
As the forming layer for forming the shape of the substrate, at least a first layer for exposing the substrate base plate to perform etching formation of the outer shape and the groove portion, an outer shape pattern of the outer shape and the groove portion Using a second layer for simultaneously forming the shape pattern of the groove pattern and a third layer for distinguishing the outer shape pattern and the groove pattern,
After forming the outer pattern and the groove pattern simultaneously with the second layer, the outer layer and the groove pattern using the first layer while distinguishing the outer pattern and the groove pattern with the third layer. A substrate forming step of etching the outer shape and the groove portion by exposing the outer shape on the substrate base plate and a portion corresponding to the groove portion in order to form a groove portion; Production method.   3. The method of manufacturing a piezoelectric vibrating piece according to claim 2, wherein, in the substrate forming step, the outer shape and the groove are individually formed by etching. The substrate forming step includes
A first layer forming step of forming the first layer on a main surface of the substrate base plate;
A second layer forming step of forming the second layer on the first layer after the first layer forming step;
After the second layer forming step, a pattern forming step of simultaneously forming a shape pattern of the outer shape pattern and the groove pattern on the second layer based on a preset shape of the substrate;
A third layer forming step of forming the third layer on the exposed first and second layers after the pattern forming step;
A first removal step of removing the third layer on the outer shape pattern and removing the first layer in order to distinguish the outer shape pattern and the groove pattern after the third layer forming step;
After the first removal step, a second removal step of etching the outer shape and removing the third layer on the groove pattern;
A third removal step of removing the first layer on the groove pattern after the second removal step;
A groove forming step of etching the groove after the third removing step;
4. The method of manufacturing a piezoelectric vibrating piece according to claim 2, further comprising a fourth removal step of removing the first layer and the second layer from the substrate after the third removal step. 5. The first layer is a metal layer;
The second layer is a negative resist layer;
The method for manufacturing a piezoelectric vibrating piece according to claim 4, wherein the third layer is a positive resist layer. The first layer is a metal layer;
The second layer is a metal layer having a lower hardness than the first layer,
The method for manufacturing a piezoelectric vibrating piece according to claim 4, wherein the third layer is a negative resist layer. The first layer is a metal layer;
The second layer is a metal layer having a lower hardness than the first layer,
The method for manufacturing a piezoelectric vibrating piece according to claim 4, wherein the third layer is a positive resist layer. The first layer is a metal layer;
The second layer is a positive resist layer;
5. The method for manufacturing a piezoelectric vibrating piece according to claim 4, wherein the third layer is a positive resist layer having a lower adhesive strength than the second layer. The first layer is a metal layer;
The second layer is a metal layer having a lower hardness than the first layer,
The method for manufacturing a piezoelectric vibrating piece according to claim 4, wherein the third layer is a metal layer having a lower hardness than the second layer.   10. The piezoelectric vibrating piece according to claim 4, wherein, in the second removing step, the third layer on the groove pattern is removed after the outer shape is formed by etching. Production method.   10. The piezoelectric vibrating piece according to claim 4, wherein, in the second removing step, the outer shape is formed by etching after the third layer on the groove pattern is removed. Production method.   The method of manufacturing a piezoelectric vibrating piece according to claim 2, wherein the piezoelectric vibrating piece is a tuning fork type piezoelectric vibrating piece.   The method of manufacturing a piezoelectric vibrating piece according to claim 2, wherein the piezoelectric vibrating piece is a thickness-shear vibration type vibrating piece.   The method for manufacturing a piezoelectric vibrating piece according to claim 12 or 13, wherein the first layer is a metal film, and the first layer is used as at least a part of an extraction electrode. Furthermore, when forming the outer shape pattern and the groove pattern, it has an image recognition process to detect the position of these patterns,
The method for manufacturing a piezoelectric vibrating piece according to claim 12 or 13, wherein the first layer is a metal film, and the first layer is used as an image recognition unit in the image recognition step.   A piezoelectric vibrating piece manufactured by the method for manufacturing a piezoelectric vibrating piece according to claim 1.   The piezoelectric vibration device according to claim 16, wherein at least the piezoelectric vibration piece according to claim 16 is hermetically sealed on the base in the internal space of the main body casing formed by joining the lid and the base.

Images