JP2007287844A - Method for manufacturing component incorporating substrate, and its manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide excellent productivity by collectively performing a holing work in forming through-holes 4 for a via hole and gaps 3 for component storage concerning a component incorporating substrate manufacturing method and its device. <P>SOLUTION: A resin 1A fills a metallic mold 2 and a resin 1B obtained by filling in the metallic mold 2 is taken out from the metallic mold 2. A film 5 is made to adhere on both the surfaces of the resin 1B and the holing work is performed in the film 5 at positions corresponding to the through-holes 4 formed in the resin 1B. The through-holes 4 are filled with a conductive material 6 and the film 5 is ripped off. Circuit substrates 7, 8 with electronic components 9, 10 previously mounted thereon are superimposed by positioning on the outer layer surface of the resin 1B so as to store the electronic components 9, 10 in the gaps 3. The resin 1B is hardened so as to adhere onto the circuit substrates 7, 8. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a component-embedded substrate in which an electronic component is embedded in a substrate, and a device for manufacturing the component-embedded substrate.

  With recent downsizing, thinning and higher functionality of electronic equipment, there is a demand for higher density mounting of electronic components mounted on printed circuit boards and higher functionality of circuit boards mounted with electronic components. It is getting stronger and stronger. Under such circumstances, a component-embedded substrate in which an electronic component is embedded in the substrate has been developed (for example, Patent Document 1).

  In a component-embedded board, active parts (for example, semiconductor elements) and passive parts (for example, capacitors) mounted on the surface of a printed circuit board are usually embedded in the board, so that the area of the board can be reduced. it can. In addition, since the degree of freedom in arranging electronic components is higher than in the case of surface mounting, improvement in high frequency characteristics can be expected by optimizing the wiring between the electronic components.

  Today, in the field of ceramic substrates, LTCC (low temperature co-fired ceramics) substrates with built-in electronic components have been put into practical use, but this is difficult to apply to large substrates because it is heavy and fragile, Since high temperature processing is required, there are significant restrictions such as the inability to incorporate semiconductor elements such as LSI. Recently, a component-embedded substrate in which components are embedded in a printed circuit board using resin, unlike an LTCC substrate, there are few restrictions on the size of the substrate, and an LSI can be incorporated. It also has the advantage.

  Next, a component built-in substrate (circuit component built-in module) disclosed in Patent Document 1 will be described with reference to FIG. In FIG. 6, 101, 107, and 108 are insulating sheets, 102, 111, and 112 are via-hole conductors, 103 is a gap, 104, 109, and 110 are wiring circuit layers, and 105 is a circuit component.

In the circuit component built-in module shown in FIG. 6, first, as shown in FIG. 6A, a soft (B-stage state) first insulating sheet 101 containing a thermosetting resin is produced. Further, in this insulating sheet 101, a through hole penetrating in the thickness direction is formed as desired, and a conductive paste containing metal powder is filled in the through hole while performing screen printing or suction treatment, so that the via hole conductor 102 is formed. Form. Further, a gap 103 for incorporating an electronic component is formed at a predetermined location of the insulating sheet 101. Next, as shown in FIGS. 6B1 to 6B4, the wiring circuit layer 104 in which the circuit component 105 is mounted in advance on the surface of the insulating sheet 101, and the circuit component 105 in the gap 103 of the insulating sheet 101. Position it so that it is mounted and housed, and stack and press. Further, the insulating sheets 107 and 108 in which the second and third via-hole conductors 111 and 112 in the softened state (B stage state) are formed on the upper and lower surfaces of the insulating sheet 101 are laminated and pressure-bonded, as shown in FIG. In this way, a multilayer wiring board in which the circuit component 105 is built in the insulating substrate is manufactured. The formation of via holes and voids in each insulating layer is performed by processing the drilling, punching, sand blasting, or irradiation with carbon dioxide laser, YAG laser, excimer laser or the like on each insulating layer.
Patent No. 3051700

  However, in the conventional method for manufacturing a component-embedded substrate, when forming a via hole and a gap, it is necessary to perform drilling for each layer, and there is a problem that productivity is extremely low. In particular, a method other than sandblasting is more noticeable because the holes are drilled for each hole.

  The present invention has been made in view of such a point, and a main object thereof is to provide a method for manufacturing a component-embedded substrate and a manufacturing apparatus therefor, which are excellent in productivity.

  The method for manufacturing a first component-embedded substrate of the present invention includes a step of filling a mold with a resin having insulating properties that can be molded, and a step of taking out the molded resin filled in the mold from the mold A step of attaching a film to at least one upper and lower surfaces of the resin taken out from the mold, and a step of punching the film at a position corresponding to a predetermined through hole formed in the resin; A step of filling the predetermined through-hole with a conductive material; a step of peeling the film; and a circuit board in which an electronic component is previously mounted on the outer surface of the resin from which the film has been peeled. A step of positioning and overlapping so as to be accommodated in a predetermined gap formed in the step, and a step of curing the resin and bonding it to the circuit board.

  In addition, the hardness of the resin is increased between the step of filling the mold with a resin having an insulating property and the step of taking out the resin filled in the mold and molded from the mold. It may further include a process.

  In addition, the moldable insulating resin may be a laminate of a plurality of resins.

  According to the first method of manufacturing a component-embedded substrate of the present invention, by filling a resin to be a substrate into a mold and molding the resin, there are through holes to be via holes and voids for accommodating electronic components in the resin. It can be formed in a lump and has excellent productivity.

  The second component-embedded substrate manufacturing method of the present invention includes a step of stacking a moldable insulating second resin on a moldable insulating first resin and filling the mold in a mold. A step of taking out the first and second resins filled and molded in the mold from the mold, and filling a predetermined through hole formed in the first and second resins with a conductive material A step of peeling the first resin, and a circuit board having electronic components mounted in advance on the outer layer surface of the second resin in a predetermined gap formed in the second resin by the electronic components. It includes a step of positioning and stacking so as to be accommodated, and a step of curing the second resin and bonding it to the circuit board.

  The step of stacking the moldable insulating second resin on the moldable insulating first resin and filling the mold with the moldable insulating first resin has the moldable insulating first resin. A step of filling the mold, a step of increasing the hardness of the first resin, and a step of filling the mold with a second resin having a moldable insulating property and overlaying the mold on the first resin It may consist of:

  Also, a step of filling a mold with a second resin having a moldable insulating property on the moldable first resin, filling the mold with the mold, and molding the mold filled with the mold. A step of increasing the hardness of the second resin may be further included between the step of taking out the first resin and the second resin from the mold.

  Further, the second resin having insulating properties that can be molded may be a laminate of a plurality of resins.

  According to the second method of manufacturing a component-embedded substrate of the present invention, by filling the mold with the second resin to be the substrate and molding it, the through holes to be via holes in the first and second resins, and Gaps for storing electronic components can be formed in a batch, and productivity is excellent.

  The third component-embedded substrate manufacturing method of the present invention includes a step of pressing a mold from the surface of the resin of a laminate formed by laminating an insulating resin moldable on a film, A circuit board in which electronic parts are mounted in advance on the outer layer surface of the resin from which the film is peeled off, a step of filling the conductive material from the film surface into the predetermined through-hole press formed on the film, a step of peeling the film, The electronic component includes a step of positioning and overlapping so that the electronic component is accommodated in a predetermined gap formed by pressing in the resin, and a step of curing the resin and bonding the resin to the circuit board.

  In addition, you may heat the said laminated body in the process of pressing a metal mold | die from the surface of the resin of a laminated body.

  In addition, the moldable insulating resin may be a laminate of a plurality of resins.

  According to the third method of manufacturing a component-embedded substrate of the present invention, by pressing a mold from the surface of the resin serving as the substrate, a through hole serving as a via hole and a gap for accommodating electronic components are collectively contained in the resin. And can be formed with excellent productivity.

  According to the fourth method of manufacturing a component-embedded substrate of the present invention, a laminate in which an insulating resin that can be molded on a film is laminated at a predetermined speed and rotated at a predetermined speed having a convex portion on the surface. Supplying to the rotating body, pressing with the rotating body from the resin surface of the laminated body, cutting the laminated body into a predetermined length, and press forming in the cut laminated body Filling a predetermined through-hole with a conductive material from the film surface, peeling the film, and mounting a circuit board on which an electronic component is previously mounted on the outer layer surface of the resin from which the film has been peeled off The method includes a step of positioning and stacking the parts so as to be accommodated in a predetermined gap formed by pressing in the resin, and a step of curing the resin and bonding the resin to the circuit board.

  In addition, you may heat the said laminated body in the process pressed with the rotary body from the surface of resin of a laminated body.

  In addition, the moldable insulating resin may be a laminate of a plurality of resins.

  The manufacturing apparatus for a component-embedded substrate of the present invention has a mechanism in which a rotating body having a convex portion on the surface is rotated at a predetermined speed and a laminated body in which an insulating resin that can be molded on a film is laminated at a predetermined speed. And a mechanism for supplying the rotating body to the rotating body.

  According to the fourth method for manufacturing a substrate with built-in components of the present invention, the through-hole serving as a via hole and the electronic component are accommodated in the resin by pressing with a rotating body having a convex portion from the surface of the resin serving as the substrate. Therefore, the voids can be formed all at once, and the productivity is excellent.

  According to the present invention, in the formation of the through hole for the via hole and the gap for storing the component, the boring process is performed collectively, so that the component built-in substrate can be manufactured with excellent productivity. .

(First embodiment)
A first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a process diagram for explaining a method of manufacturing a component-embedded substrate according to the present embodiment.

  According to FIG. 1, first, as shown in FIG. 1 (a), after injecting an uncured liquid epoxy thermosetting resin 1A into the mold 2, a heat treatment is performed at 80 ° C. for about 30 minutes. To soften (B stage) and increase the hardness of the resin 1A. Next, as shown in FIG. 1 (b), a softened thermosetting resin 1B in which a gap 3 for housing components corresponding to the mold 2 and a through hole 4 for forming a via hole is formed is molded. Take out from 2. Next, as shown in FIG.1 (c), the resin film 5 of PET material is affixed on both surfaces of the softened resin 1B. Next, as shown in FIG. 1D, the resin film 5 at both ends of the through hole 4 for forming a via hole is opened by laser irradiation to form an opening 14. Next, as shown in FIG.1 (e), from the opening part 14 of the resin film 5, the conductive resin paste 6 which added the conductive metal powder, for example, Cu powder, to the epoxy resin is subjected to screen printing or suction treatment. While filling. Next, as shown in FIG. 1F, the resin film 5 is peeled off. Finally, as shown in FIG. 1G, a mounting body in which the electronic components 9 and 10 are mounted on the surfaces of the circuit boards 7 and 8 respectively on both outer layer surfaces of the resin 1B, and the electronic components 9 and 10 have the gap 3 After being aligned and stacked so as to be housed inside, it is integrated by applying a heat press process (200 ° C., 3 MPa, 2 hours), and at the same time, connection between the circuit board 7 and the circuit board 10 via the via hole 6 I do.

  In the present embodiment, the component-embedded substrate is manufactured with one type of resin taken out from one mold, but it is also possible to stack two types of resins. Hereinafter, a method of manufacturing a component-embedded substrate by stacking two types of resins will be described with reference to the process diagram of FIG.

  According to FIG. 2, first, as shown in FIG. 2 (a), uncured liquid epoxy thermosetting resin 1A is poured into molds 2 and 12, respectively, and then heated at 80 ° C. for about 30 minutes. It is processed to be soft (B stage) to increase the hardness of the resin 1A. Next, as shown in FIG. 2 (b), each softened thermosetting resin 1B that is softened in which a gap 3 for housing components corresponding to the molds 2 and 12 and a through hole 4 for forming a via hole are formed. Is taken out from the molds 2 and 12. Next, as shown in FIG.2 (c), the resin film 5 of PET material is affixed on both surfaces of each softened resin 1B. Next, as shown in FIG. 2 (d), the resin film 5 at both ends of the through hole 4 for forming the via hole formed in each resin 1B is opened by laser irradiation to form an opening 14. Next, as shown in FIG. 2 (e), the conductive resin paste 6 obtained by adding conductive metal powder, for example, Cu powder, to the epoxy resin is subjected to screen printing or suction treatment from the opening 14 of the resin film 5. While filling. Next, as shown in FIG. 2F, the resin film 5 is peeled off. Finally, as shown in FIG. 1 (g), a mounting body in which the respective resins 1 </ b> B are overlapped so that predetermined positions overlap each other and the electronic components 9 and 10 are mounted on the surfaces of the circuit boards 7 and 8, respectively. After the electronic parts 9 and 10 are aligned and overlapped on both outer layer surfaces where the resins 1B are laminated, the heat pressing process (200 ° C., 3 MPa, 2 hours) is performed integrally. At the same time, the circuit board 7 and the circuit board 10 are connected via the via hole 6.

  In addition to the two types of resins described above, it is possible to manufacture a component-embedded board by stacking three or more types of resins.

  According to the present embodiment, the through holes 4 for forming the via holes 6 and the gaps 3 for storing the electronic components 9 and 10 can be formed in a lump, so that it is possible to provide a method for manufacturing a component built-in substrate with extremely high productivity. .

  Further, in the steps shown in FIGS. 1 (f) and 2 (f), the thickness accuracy of the resin 1B is improved by grinding the film adhesion surface, and the new surface of the resin 1B appears on the surface layer. Later adhesion is improved.

  The liquid resin 1A is injected into the molds 2 and 12 and then softened by heat treatment. However, the molds 2 and 12 may be filled with a previously softened resin. In that case, the heat treatment time can be shortened or reduced.

  In addition, the epoxy thermosetting resin 1A is used as the insulating resin that can be molded, but other materials such as thermosetting resin materials, ultraviolet curable resin materials, and thermoplastic resin materials are used. A curable resin material may be used.

  Further, as the conductive material for forming the via hole 6, a metal bulk or the like by a plating method may be used in addition to the conductive paste material.

  Further, the resin film material and the opening method thereof are not particularly defined when similar effects can be obtained. Moreover, although the resin film 5 was affixed on both surfaces of resin 1B, the resin film 5 may be affixed only on the direction of resin 1B.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a process diagram for explaining a method of manufacturing the component-embedded substrate of the present embodiment.

  According to FIG. 3, first, as shown in FIG. 3A, an uncured liquid epoxy thermosetting resin 15 </ b> A that becomes the first resin is injected into the molds 2 and 12, respectively, and then 150. A resin film 15B is formed by increasing the hardness of the resin 15A by performing heat treatment at about 30 ° C. for about 30 minutes. Next, as shown in FIG. 3 (b), the molds 2 and 12 are filled with a liquid epoxy-based cured resin 1A to be the second resin, and subjected to a heat treatment at 80 ° C. for about 30 minutes. (B stage) to increase the hardness of the resin 1A. Next, as shown in FIG. 3C, the softened thermosetting resin 1B in which the void 3 and the through hole 4 for forming the via hole are formed is taken out from the molds 2 and 12, respectively. Next, as shown in FIG.3 (d), the conductive resin which added the conductive metal powder, for example, Cu powder to the epoxy resin from the resin film 15B surface to the through-hole 4 formed in each softened resin 1B. The paste 6 is filled while performing screen printing or suction processing. Next, as shown in FIG.3 (e), after peeling each resin film 15B, each resin 1B is piled up so that a predetermined position may overlap. Finally, as shown in FIG. 3 (f), a mounting body in which the electronic components 9 and 10 are mounted on the surfaces of the circuit boards 7 and 8, respectively, and the electronic components 9 and 10 are formed on both outer layer surfaces where the resins 1B are laminated. Are stacked so as to be accommodated in the gap 3 and then integrated by applying a heat press process (200 ° C., 3 MPa, 2 hours), and at the same time, the circuit board 7 and the circuit board 10 through the via hole 6. Make a connection between.

  According to the present embodiment, in addition to the effects of the first embodiment, a process for opening a resin film is not required, and therefore, it is possible to manufacture a component-embedded substrate that is more productive and can perform fine via connection. Can do.

  Further, in the step shown in FIG. 3 (e), by grinding the film adhesion surface, the thickness accuracy of the resin 1B is improved, and the new surface of the resin 1B appears on the surface layer, thereby improving the adhesive strength after the lamination press. To do.

  The liquid resin 1A is injected into the molds 2 and 12 and then softened by heat treatment. However, the molds 2 and 12 may be filled with a previously softened resin. In that case, the heat treatment time can be shortened or reduced.

  In addition, the epoxy-type thermosetting resins 1A and 15A are used as the first and second resins having two kinds of moldable insulating properties to be filled in the molds 2 and 12, but any resin is another material. Other curable resin materials such as a thermosetting resin material, an ultraviolet curable resin material, and a thermoplastic resin material may be used.

  Further, as the conductive material for forming the via hole 6, a metal bulk or the like by a plating method may be used in addition to the conductive paste material.

  Furthermore, although the manufacturing method which laminates | stacks 2 types of resin 1A, 15A was demonstrated, the manufacturing method of laminating | stacking 3 types or more of resin in the case of only 1 type or 3 types is also possible.

(Third embodiment)
A third embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a process diagram for explaining a method of manufacturing the component-embedded substrate according to the present embodiment.

  According to FIG. 4, first, as shown in FIG. 4A, a sheet-like epoxy thermosetting resin 1 </ b> B subjected to a softening (B-stage) treatment is laminated on a resin film 15 </ b> B made of a PET material. As shown in FIG. 4 (b), the laminate is pressed with the dies 22 and 32. When pressing, the sheet-like epoxy thermosetting resin film 1B is reduced in viscosity by applying a temperature of 150 ° C. to the laminate, so that the moldability is improved. Next, as shown in FIG.4 (c), the conductive resin paste which added the conductive metal powder, for example, Cu powder, to the epoxy resin from the film 15B surface to the through-hole 4 formed in each softened resin 1B 6 is filled while performing screen printing or suction processing. Next, as shown in FIG. 4D, after the resin film 15B is peeled off, the sheet-like resins 1B are overlapped so that predetermined positions overlap each other. Finally, as shown in FIG. 4 (f), a mounting body in which the electronic components 9 and 10 are mounted on the surfaces of the circuit boards 7 and 8, respectively, and the electronic components 9 and 10 on both outer layer surfaces in which the resins 1B are laminated. 10 and the circuit board 7 and the circuit board through the via hole 6 at the same time after being stacked so as to be accommodated in the gap 3 and then integrated by applying a heat press process (200 ° C., 3 MPa, 2 hours). Connection between 10 is performed.

  According to the present invention, in addition to the effects of the first and second embodiments, the resin film sticking process is eliminated and the process is simplified, so that a component-embedded substrate with higher productivity can be manufactured.

  In the step shown in FIG. 4 (e), by grinding the film adhesion surface, the thickness accuracy of the resin is improved, and the new surface of the resin appears on the surface layer, thereby improving the adhesive force after the lamination press.

  Note that the epoxy thermosetting resin 1B is used as the sheet-like moldable insulating resin. However, any resin may be a thermosetting resin material, ultraviolet curable resin material, or thermoplastic resin of another material type. Other resin materials such as a mold resin material may be used.

  Further, as the conductive material for forming the via hole 6, a metal bulk or the like by a plating method may be used in addition to the conductive paste material.

  Furthermore, although the manufacturing method which laminates | stacks two types of resin was demonstrated, the manufacturing method of laminating | stacking three or more types of resin is also possible when only one type is laminated | stacked.

(Fourth embodiment)
A fourth embodiment of the present invention will be described with reference to the drawings. FIG. 5 is a schematic diagram for explaining the method and apparatus for manufacturing the component-embedded substrate of the present embodiment.

  As shown in FIG. 5, the sheet | seat used as the laminated body which laminated | stacked the sheet-like epoxy type thermosetting resin 1B which gave the soft (B stage) process on the resin film 5 which consists of PET materials wound around the roll 41 40 is wound up by another roll 42 so that it is fed at a constant speed. When the sheet 40 fed at a constant speed passes through the drum-shaped rotating body 44 provided with the convex portions 45 and the stage 43 having the heating mechanism, the sheet 40 is reduced in viscosity by the stage 43 in a drum-like state. Through holes 4 for forming gaps 3 and via holes 6 for housing components are formed by the convex portions 45 of the rotating body 44. That is, the convex portion 45 includes a convex portion for press-forming the gap 3 in the resin 1 </ b> B and a convex portion for pressing the through-hole 4 through the sheet 40. During this pressing, the sheet 40 is flattened to a predetermined thickness on the surface of the rotating drum 44. Thereafter, after the sheet 40 is cut to a predetermined length, conductive metal powder such as Cu powder is added to the epoxy resin from the surface of the film 5 in the same manner as in FIG. After the conductive resin paste is filled while performing screen printing or suction treatment, the resin film 5 is peeled off, and the resins 1B are overlapped with each other so that the predetermined positions overlap each other. After mounting the mounting body in which the electronic components 9 and 10 are mounted on the surfaces of the electronic components 9 and 10 on both outer layer surfaces in which the resins 1B are laminated, the electronic components 9 and 10 are aligned and stacked so that they are accommodated in the gap 3, At the same time, the circuit board 7 and the circuit board 10 are connected via the via hole 6 at the same time by performing a heat press process (200 ° C., 3 MPa, 2 hours) for integration.

  According to the present embodiment, in addition to the effects of the first to third embodiments, the sheet molding process is continued, so that a component-embedded substrate with higher productivity can be manufactured.

  In the step shown in FIG. 4 (e), by grinding the film adhesion surface, the thickness accuracy of the resin is improved, and the new surface of the resin appears on the surface layer, thereby improving the adhesive force after the lamination press.

  Note that the epoxy thermosetting resin 1B is used as the sheet-like moldable insulating resin. However, any resin may be a thermosetting resin material, ultraviolet curable resin material, or thermoplastic resin of another material type. Other resin materials such as a mold resin material may be used.

  Further, as the conductive material for forming the via hole 6, a metal bulk or the like by a plating method may be used in addition to the conductive paste material.

  Furthermore, although the manufacturing method which laminates | stacks two types of resin was demonstrated, the manufacturing method of laminating | stacking three or more types of resin is also possible when only one type is laminated | stacked.

  INDUSTRIAL APPLICABILITY The present invention can produce a small, high-density component-embedded substrate with excellent productivity, and can be used for a small, light, and thin electronic device.

Process drawing for demonstrating the manufacturing method of the component built-in board | substrate in the 1st Embodiment of this invention Process drawing for demonstrating the case where two types of resin are laminated | stacked in the manufacturing method of the component built-in board | substrate in the 1st Embodiment of this invention. Process drawing for demonstrating the manufacturing method of the component built-in board | substrate in the 2nd Embodiment of this invention. Process drawing for demonstrating the manufacturing method of the component built-in board | substrate in the 3rd Embodiment of this invention. Schematic for demonstrating the manufacturing method of the component built-in board | substrate in the 4th Embodiment of this invention, and its manufacturing apparatus. Process diagram for explaining a method of manufacturing a component-embedded substrate in a conventional example

Explanation of symbols

1A, 1B Insulating resin to be used as substrate 2,12 Mold 3 Void for accommodating built-in parts 4 Via hole for via hole 5, 15A, 15B Resin film 6 Via hole 7, 8 Circuit board 9, 10 Electronic component 22, 32 Press dies 40 Sheet (laminate)
41, 42 Roll 43 Stage with heating mechanism 44 Drum-like rotating body 45 Convex part

Claims (11)

  A step of filling a mold with a resin having an insulating property, a step of removing the resin filled in the mold and molded from the mold, and at least one of upper and lower sides of the resin taken out of the mold A step of attaching a film to the surface, a step of perforating the film at a position corresponding to a predetermined through-hole formed in the resin, and a step of filling a conductive material in the predetermined through-hole And a step of peeling the film, and positioning a circuit board having electronic components mounted in advance on the outer surface of the resin from which the film has been peeled so that the electronic components are accommodated in a predetermined gap formed in the resin. The component-embedded substrate manufacturing method includes a step of superimposing and a step of curing the resin and bonding the resin to the circuit board.   2. The method of manufacturing a component-embedded substrate according to claim 1, wherein a mold is filled with an insulating resin having a moldability and a mold is filled with the mold and the molded resin is taken out from the mold. The method for manufacturing a component-embedded substrate further comprising a step of increasing the hardness of the resin between the steps.   A step of filling a mold with a second resin having a moldable insulating property on the moldable first resin, filling the mold with the first resin, and molding the first and second molds; Removing the second resin from the mold, filling a predetermined through-hole formed in the first and second resins with a conductive material, and peeling the first resin Positioning and overlapping a circuit board having electronic components mounted in advance on the outer layer surface of the second resin so that the electronic components are housed in a predetermined gap formed in the second resin; and A method of manufacturing a component-embedded board, comprising: curing a second resin and bonding the second resin to the circuit board.   4. The method of manufacturing a component-embedded substrate according to claim 3, wherein the step of filling the mold with the second resin having the insulating property that can be molded is stacked on the first resin having the insulating property that can be molded. Filling the mold with a first resin having an insulating property, filling the mold with a step of increasing the hardness of the first resin, and filling the mold with a second resin having a moldable insulating property And a step of superimposing the first resin on the first resin.   The method of manufacturing a component-embedded substrate according to claim 3, wherein a step of filling a mold with a second resin having an insulating property that can be molded on the first resin having an insulating property that can be molded, Incorporating a component, further comprising a step of increasing the hardness of the second resin between the step of taking out the first and second resins filled and molded in the die from the die A method for manufacturing a substrate.   A step of pressing a mold from the surface of the resin of a laminate formed by laminating an insulating resin moldable on the film, and the film surface in a predetermined through-hole press-formed in the laminate A step of filling a conductive material, a step of peeling the film, and a circuit board in which the electronic component is mounted in advance on the outer surface of the resin from which the film has been peeled. A method for manufacturing a component-embedded board, comprising: a step of positioning and overlapping so as to be accommodated in a gap; and a step of curing the resin and bonding the resin to the circuit board.   7. The method for manufacturing a component built-in substrate according to claim 6, wherein the laminate is heated in a step of pressing a mold from a resin surface of the laminate.   A step of feeding a laminated body in which an insulating resin moldable on a film is laminated at a predetermined speed and supplying the laminated body to a rotating body having a convex portion on the surface and rotating at a predetermined speed; and the resin of the laminated body A step of pressing from the surface of the rotating body with the rotating body, a step of cutting the laminated body into a predetermined length, and a conductive property from the film surface into a predetermined through-hole formed in the cut laminated body. A step of filling the material, a step of peeling the film, and a circuit board in which the electronic component is mounted in advance on the outer surface of the resin from which the film has been peeled are stored in a predetermined gap formed by pressing the electronic component in the resin. A method of manufacturing a component-embedded board, comprising: a step of positioning and superimposing as described above; and a step of curing the resin and bonding it to the circuit board.   9. The method for manufacturing a component built-in substrate according to claim 8, wherein the laminate is heated in a step of pressing with a rotating body from a resin surface of the laminate.   9. The method of manufacturing a component-embedded substrate according to claim 1, claim 3, or claim 6 or claim 8, wherein the moldable insulating resin is formed by superposing a plurality of resins. A method for manufacturing a built-in substrate. A mechanism for rotating a rotating body having a convex portion on the surface at a predetermined speed; and a mechanism for feeding a laminated body in which an insulating resin that can be molded on a film is laminated at a predetermined speed and supplying the laminated body to the rotating body. An apparatus for manufacturing a component-embedded board comprising

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