JP2007285775A - Adapter and electronic component testing device provided with the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adapter, without leaving existing test head but effectively utilizing existing performance board. <P>SOLUTION: The adaptor for adapting the conventional performance board 30' to the test head 20A for testing the IC device, by bringing the IC device into electrical contact with the new performance board, in place of new performance board, comprises a first connection board 110 capable of electrically connecting with the test head 20A, a second connection board 120 capable of electrically connecting with the conventional performance board 30', and a third connection board 130 for electrically connecting the first connection board 110 and the second connection board 120. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention provides an electronic component test apparatus used for testing an IC device by electrically contacting various electronic components such as semiconductor integrated circuit elements (hereinafter, typically referred to as IC devices) with a performance board. The present invention relates to an adapter for adapting another performance board and an electronic component test apparatus including the adapter.

  10A is a cross-sectional view showing an old style performance board and an old style test head, FIG. 10B is a plan view showing an old style performance board, FIG. 11A is a cross section showing a new style performance board and a new style test head, and FIG. It is a top view which shows a performance board.

  In the process of manufacturing an electronic component such as an IC device, electronic component testing apparatuses 1 'and 1 "are used to test the performance and function of the IC device in a packaged state.

  The test of the IC device is performed in a state where the input / output terminal of the IC device is brought into contact with the contact pin of the socket 32 provided on the performance board 30 ′, 30 manually or using a handler or the like. The tester 10 inputs and outputs test signals to the IC device via Since the external shape of the IC device and the arrangement of the input / output terminals differ depending on the type of the IC device, the performance board 30 mounted on the test heads 20 ′ and 20 when the type of the IC device to be tested is replaced. ', 30 is also replaced with another performance board that is compatible with the IC device after the product replacement.

  As shown in FIGS. 10A to 11B, the old-type performance board 30 ′ has an outer shape of the board body 31 that is slightly larger than the new-type performance board 30. In addition, the old performance board 30 ′ has a larger terminal forming portion 33 provided on the back surface thereof so as to face the terminal 21a on the upper surface of the test head 20 ′ than the new performance board. Yes. It should be noted that the size relationship between the external shapes of the new / old performance boards 30 and 30 'varies. That is, the new performance board 30 may have a larger outer shape than the old performance board 30 ′, or the old performance board 30 ′ may have the same outer shape as the new performance board 30 ′.

  In addition, the old test head 20 ′ has a fixing hole 26 formed at a substantially central portion, and a guide pin 23 is formed so as to protrude upward, and presses the periphery of the performance board 30 ′. A pressing cover 24 is provided through a hinge 25 so as to be rotatable. The old performance board 30 ′ has a screw hole 36 at a substantially central portion and guide holes 35 at two corners. Then, the performance pins 30 'are positioned with respect to the test head 20' by inserting the guide pins 23 into the guide holes 35, and then the bolts 40 are fastened to the fixing holes 26 through the screw holes 36, and the press cover When the performance board 30 'is pressed by 24, the performance board 30' is fixed to the test head 20 '.

  On the other hand, the new test head 20 is provided with a frog ring 21 having a large number of terminals 21a arranged in an annular shape and engaging claws 21b provided so as to protrude upward on the outer periphery thereof. The new performance board 30 has a through hole 34 through which the engaging claw 21a passes. Then, a holding ring 50 is attached to the engaging claw 21a penetrating the through hole 34 of the performance board 30, and the performance board 30 is fixed to the test head 20 by its tightening force.

  Also, the new style performance board 30 may have a different number of channels than the old style performance board 30 '. Normally, the new performance board 30 has more channels than the old performance board 30 '. The test head 20 connected to the new performance board 30 generates a test pattern and supplies power, but has a higher performance than the old test head 20 '.

  As described above, the old and new performance boards 30 and 30 ′ are different in size, terminal arrangement, and number of channels, and the old performance board 30 ′ and the new test head 20 are not compatible in the mounting method. Therefore, in order to test IC devices that were supported by the old style performance board 30 ', a new performance board that can be mounted on the new style test head 20 is manufactured, and the old style test head 20' and tester are maintained and managed. It is necessary to do.

  There is a problem that it takes cost to manufacture a new performance board. In addition, in order to leave the old-style test head 20 'and the tester, there is a problem that a space for the test head 20' and a tester are required and maintenance is a burden.

  An object of the present invention is to provide an adapter that effectively utilizes an existing performance board without leaving an existing test head, and an electronic component testing apparatus including the adapter.

  In order to achieve the above object, according to the present invention, an electronic component test apparatus for testing an electronic device under test by bringing the electronic device under test into electrical contact with a first performance board is provided in the first performance board. An adapter for adapting a second performance board in place of the performance board, the first connection means electrically connectable to the electronic component test apparatus, and the electrical connection to the second performance board An adapter is provided comprising possible second connection means and third connection means for electrically connecting the first connection means and the second connection means (see claim 1). .

  In the present invention, the first connection means is electrically connected to the electronic component testing apparatus adapted to the first performance board, and the second connection is made to the second performance board not adapted to the electronic component testing apparatus. The means are electrically connected, and the first and second connection means are electrically connected by the third connection means. As a result, the second performance board can be adapted to the electronic component testing apparatus, and the existing performance board can be effectively used without leaving the existing test head.

  Although not particularly limited in the above invention, the second performance board preferably has an outer shape different from that of the first performance board (see claim 2).

  Although not particularly limited in the above invention, the second performance board is preferably different from the first performance board in the arrangement of terminals for electrical connection to the electronic component test apparatus (see claim 3). ).

  Although not particularly limited in the above invention, it is preferable that the second performance board is different from the first performance board in a fixing method to the electronic component test apparatus (see claim 4).

  Although not particularly limited in the above invention, the first performance board includes first fixing means for mounting the first performance board on the electronic component testing apparatus, and the first fixing means includes the first connection means. It is preferable to fix to an electronic component testing apparatus (refer to claim 5).

  Although not particularly limited in the above invention, the second performance board includes a second fixing means for mounting the second performance board on the electronic component testing apparatus, and the second fixing means includes the second performance board. It is preferable to fix to the 2nd connection means (refer Claim 6).

  Although not particularly limited in the above invention, it is preferable that a switching means for switching a load applied to the electronic device under test during a test is provided (see claim 7).

  Although not particularly limited in the above invention, the third connection means is provided between the first connection means and the second connection means according to the number of sockets provided in the second performance board. It is preferable to have a selection means for selecting an electrical connection.

  In order to achieve the above object, according to the present invention, there is provided an electronic component testing apparatus for testing electrical characteristics of an electronic device under test by making electrical contact with the electronic device under test. There is provided an electronic component test apparatus including two performance boards and any one of the adapters (see claim 9).

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<First Embodiment>
FIG. 1 is a sectional view showing an adapter according to the first embodiment of the present invention, FIG. 2 is an exploded perspective view showing the adapter according to the first embodiment of the present invention, and FIG. 3 is an arrow view along the III direction of FIG. 4 (plan view), FIG. 4 is an enlarged cross-sectional view of the IV part of FIG. 2, FIG. 5 is a circuit diagram of an adapter including a relay for switching a load applied to the IC device, and FIG. 6 is a first embodiment of the present invention. It is a top view which shows the other example of the pressing ring used for the adapter which concerns on.

  The electronic component testing apparatus 1A according to the first embodiment of the present invention is configured such that a performance board 30 ′ to which an IC device to be tested is electrically connected and the performance board 30 ′ to a new test head 20A are electrically connected. Test for an IC device through the adapter 100A adapted to be connectable, the test head 20A electrically connected to the tester 10 via a cable, and the performance board 30 ′, the adapter 100A and the test head 20A And a tester 10 for inputting and outputting signals.

  The performance board 30 ′ in the present embodiment has two sockets 32 having a large number of contact pins at a substantially central portion on the upper surface thereof. An annular terminal forming portion 33 is formed on the lower surface of the performance board 30 '. The terminal forming portion 33 faces a large number of pogo pins 122 provided in an annular shape on the upper surface of the second connection board 120 of the adapter 100A. Furthermore, the performance board 30 ′ in the present embodiment is an old-style performance board described with reference to FIGS. 10A and 10B, and has a screw hole 36 formed in a substantially central portion and two corners. A guide hole 35 is formed.

  On the other hand, the test head 20A in the present embodiment is the new test head 20A described with reference to FIG. 11A, and is provided so as to project a large number of annularly arranged terminals 21a and the outer periphery thereof. And a frog ring 21 having an engaging claw 21b. Although not particularly illustrated, a plurality of pin electronics cards electrically connected to the frog ring 21 are provided inside the test head 20A, and each pin electronics card is electrically connected to the tester 10 via a cable. Has been.

  The adapter 100A according to the present embodiment is a conversion adapter that converts mechanical / electrical connection conditions in order to adapt the old performance board 30 'to the new test head 20A. As shown in FIGS. 1 to 3, the adapter 100A includes a first connection board 110 that can be electrically connected to the new test head 20A and a second connection board that can be electrically connected to the old performance board 30 ′. Connection board 120, third connection board 130A for electrically connecting first connection board 110 and second connection board 120, and support members for supporting first to third connection boards 110-130A 140.

  As shown in FIG. 2 and FIG. 4, the first connection board 110 includes a board body 111 having a terminal forming portion 112 composed of a large number of terminals. The terminal forming portion 112 is formed in an annular shape on the lower surface of the board main body 121. The terminal forming portion 112 faces a large number of terminals 21a provided on the frog ring 21 of the test head 20A. Further, the board body 111 is formed with a through hole 113 into which an engaging claw 21 b provided on the outer peripheral portion of the frog ring 21 can be inserted. As shown in FIG. 4, the end portion of the cable 132 of the third connection board 130A is joined to the upper surface of the board main body 121 by soldering.

  When the first connection board 110 is fixed to the test head 20A, the engaging claws 21b of the frog ring 21 are respectively inserted into the insertion holes 113 formed in the board body 111 as shown in FIG. Later, each engaging claw 21b is inserted into the holding ring 50 and engaged. With this tightening force, the first connection board 110 is fixed to the frog ring 21, and the terminal 21 a provided in the frog ring 21 is electrically connected to the terminal forming portion 112 of the first connection board 120. .

  Further, as shown in FIG. 5, the first connection board 110 in the present embodiment includes the IC device in addition to a driver / comparator (D / C) for inputting / outputting a test signal from the tester 10 to the IC device. Is provided with a relay 114 for turning on / off a load applied to the.

  Generally, in the old test head 20 ', a relay for switching a load applied to an IC device to be tested is provided in the test head 20'. On the other hand, in the new test head 20A, no relay is provided in the test head 20A, a relay is provided on the new performance board 30 side, and the test head 20A side switches the relay. It only issues a signal for.

  In the present embodiment, the load applied to the IC device under test can be turned on / off by switching the relay 114 provided in the first connection board 120 by a signal emitted from the new test head 20A. It is possible.

  As shown in FIG. 3, the second connection board 120 includes a board body 121 having a large number of pogo pins 122. A large number of pogo pins 122 provided on the board body 121 are arranged in an annular shape so as to face the terminal forming portion 33 formed on the lower surface of the old-style performance board 30 ′. As shown in FIG. 4, each pogo pin 122 has a middle portion 122 b embedded in the board body 121. On the other hand, the upper part 122a and the lower part 122c of each pogo pin 122 protrude from the board body 121 and can be expanded and contracted along the protruding direction.

  In addition, a fixing hole 126 is formed at a substantially central portion of the board main body 121 of the second connection board 120, and faces the guide holes 35 formed at two corners of the old-style performance board 30 ′. As described above, the guide pins 123 projecting upward are formed at two corners of the board main body 121.

  The adapter 100 </ b> A according to the present embodiment may be tested under a state in which high temperature or low temperature heat stress is applied using a handler. Therefore, the board main body 121 is made of a material excellent in insulation and heat resistance such as glass epoxy resin.

  Further, a pressing lever 124 for pressing the periphery of the performance board 30 ′ is provided on the second connection board 120 so as to be rotatable by a hinge 125. In order to easily and reliably fix the performance board 30 ′ to the second connection board 120, a toggle clamp or the like may be used instead of the pressing lever 123.

  When the performance board 30 ′ is mounted on the second connection board 120, the second connection board 120 is inserted by inserting the guide pins 123 of the second connection board 120 into the guide holes 35 of the performance board 30 ′. The performance board 30 ′ is positioned with respect to 120, and then the bolt 40 is fastened to the fixing hole 126 through the screw hole 36, and the performance board 30 ′ is secondly pressed by pressing the performance board 30 ′ with the holding lever 124. The connection board 120 is fixed.

  The third connection board 130 </ b> A includes a board body 131 having terminals formed on the upper and lower surfaces, and a cable 132 having one end joined to each terminal formed on the lower surface of the board body 131. The other end of the cable 132 is joined to the upper surface of the first connection board 120. As a method for joining the end portion of the cable 132 to the terminal, for example, soldering or the like can be cited.

  On the upper surface of the board body 131, a large number of terminals 131a are provided in an annular shape. The large number of terminals 131 a are opposed to the large number of pogo pins 122 provided on the second connection board 120. A terminal is also provided on the lower surface of the board body 131, and this terminal is electrically connected to the terminal 131a on the upper surface.

  The board main body 131 of the third connection board 130 is fixed to the lower side of the second connection board 120 with bolts 133 as shown in FIG. In a state of being fixed by the bolt 133, the lower portion 122c of each pogo pin 122 is contracted and is in electrical contact with the terminal 131a with an appropriate pressing force.

  As shown in FIGS. 1 and 2, the support member 140 includes a leg portion 141 that contacts the upper surface of the test head 20 </ b> A and supports the second connection board 120, and an annular portion 142 that is fixed to the leg portion 141. The first connecting part 143 connecting the first connecting board 110 to the leg part 141 via the annular part 142, and the second connecting the first connecting board 110 and the second connecting board 120. , And a connecting portion 144. A cable 132 extending from the second connection board 120 toward the first connection board 110 passes through the inner hole of the annular portion 142.

  In this embodiment, as shown in FIG. 2, the holding ring 50 is incorporated in the support member 140 in advance so that the cable 132 and the second connecting portion 144 are positioned inside the holding ring 50. However, the present invention is not particularly limited thereto, and for example, as shown in FIG. 6, the pressing ring 50 ′ may be divided into two parts and the hinge 51 may be able to open and close between them. This makes it possible to incorporate the holding ring 50 ′ into the support member 140 immediately before fixing the first connection board 110 to the frog ring 21.

  When the old performance board 30 ′ is mounted on the new test head 20A using the adapter 100A configured as described above, first, the frog ring 21 is engaged with the insertion hole 113 of the first connection board 110. The claw 21b is inserted, and then each engaging claw 21b is inserted into the holding ring 50 and engaged. With this tightening force, the first connection board 110 is fixed to the frog ring 21, and the terminal 21 a of the frog ring 21 is electrically connected to the terminal forming portion 112 of the first connection board 110.

  Next, the performance board 30 ′ is placed on the upper surface of the second connection board 120, and the guide pins 123 are inserted into the guide holes 35 to position the performance board 30 ′ with respect to the second connection board 120. Next, the bolt 40 is screwed into the fixing hole 126 through the screw hole 32 and the performance board 30 ′ is pressed by the pressing lever 124, whereby the performance board 30 ′ is fixed to the connection board 120. By this fixing, each pogo pin 122 of the second connection board 120 is electrically connected to the terminal forming portion 33 on the lower surface of the performance board 30 '.

  Since the first connection board 110 and the second connection board 120 are electrically connected by the third connection board 130, the performance board 30 ′ and the first connection board 110 are electrically connected as described above. At the same time, the second connection board 120 and the test head 20A are electrically connected to each other, whereby the old performance board 30 ′ is electrically connected to the new test head 20A.

  When testing the electrical characteristics of the IC device, when the IC device under test is pressed against the socket 32 of the performance board 30 ′ manually or by a handler, the input / output terminals of the IC device and the contact pins of the socket 32 are in electrical contact. The test signal from the tester 10 is input to and output from the IC device under test via the test head 20A, the adapter 100A, and the performance board 30 ′.

Second Embodiment
FIG. 7 is an exploded cross-sectional view showing an adapter according to the second embodiment of the present invention, FIG. 8 is an exploded cross-sectional view showing a case where the adapter according to the second embodiment of the present invention is used for a performance board having 1 simultaneous measurement, FIG. 9 is an exploded cross-sectional view showing a case where the adapter according to the second embodiment of the present invention is used for a performance board having two simultaneous measurements.

  The adapter 100B according to the second embodiment of the present invention has the same configuration as the adapter 100A according to the first embodiment, except that the structure of the third connection board 130B is different. Only the differences between the adapter 100B according to the second embodiment and the adapter 100A according to the first embodiment will be described below.

  In the first embodiment, the number of channels (for example, 48ch) and the number of simultaneous measurements (the number of IC devices that simultaneously execute tests, for example, two simultaneous measurements) of the old-style performance board 30 ′ and the new-type test head 20A match. However, there are cases where these do not match. In the present embodiment, an adapter 100B that is compatible with 48ch performance boards 30A and 30B having different simultaneous measurement numbers by using a test head 20B with 256 channels will be described.

  Normally, when a test head with 48 channels and a single simultaneous measurement number are secured, 1 to 48 channels (that is, all channels) are assigned to one IC device under test.

  Also, when two simultaneous measurements are secured with a test head having 48 channels, 1 to 24 channels are assigned to the first IC device to be tested, and the second IC device to be tested. 25 to 48 channels are assigned.

  In contrast, when a test head with 256 channels is used to secure one simultaneous measurement, 1 to 256 channels are allocated to one IC device under test, but two simultaneous measurements are ensured. In this case, 1 to 128 ch are assigned to the first IC device under test, and 129 to 256 ch are assigned to the second IC device under test.

  Therefore, when the performance board 30A with 48 channels and one simultaneous measurement number is mounted on the test head 20B having 256 channels, the 1 to 48 channels on the performance board 30A side are connected to the 1 to 48 channels of the test head 20B. It ’s fine.

  However, when the performance board 30B with 48 channels and two simultaneous measurements is mounted on the 256ch test head 20B, the 1-24ch on the performance board 30B side is connected to the 1-24ch on the test head 20B side. In addition, it is necessary to connect the channels 25 to 48 on the performance board 30B side to the channels 129 to 152 on the test head 20B side.

  In the present embodiment, as shown in FIG. 7, the first to fifth connectors 133a to 133e are connected to the cable 132 led out from the board body 131 of the third connection board 130B toward the first connection board 110. Is provided.

  The first and second connectors 133a and 133b are provided at the ends of the cable 142 led out from the board body 131 of the third connection board 130. A cable 142 that is electrically connected to 1 to 24ch on the performance board 30A, 30B side is attached to the first connector 133a. On the other hand, a cable 142 that is electrically connected to 25-48ch on the performance board 30A, 30B side is attached to the second connector 133b.

  The third to fifth connectors 133c to 133e are provided at the ends of the cable 142 connected to the board body 110 of the first connection board 110. A cable 142 that is electrically connected to 1 to 24 ch on the test head 20B side is attached to the third connector 133c. Further, a cable 142 that is electrically connected to 25 to 48 ch on the test head 20B side is attached to the fourth connector 133d. Further, a cable 142 that is electrically connected to the 129 to 152ch on the test head 20B side is attached to the fifth connector 133e.

  When the old performance board 30A with one simultaneous measurement is mounted on the new test head 20B with 256 channels by the adapter 100B according to the present embodiment, the first connector 133a is connected to the first connector 133a as shown in FIG. 3 connector 133c and the second connector 133b is connected to the fourth connector 133d. As a result, 1 to 48 ch on the performance board 30A side and 1 to 48 ch on the test head 20B side are electrically connected via the adapter 100B, so the performance of simultaneous measurement 1 using the test head 20B of 256 ch. The board 30A can be used to test the IC device under test.

  On the other hand, when the old performance board 30B having two simultaneous measurements is mounted on the 256ch new test head 20B by the adapter 100B according to the present embodiment, as shown in FIG. The connector 133a is connected to the third connector 133c, and the second connector 133b is connected to the fifth connector 133e. Thus, the performance board 30B side 1 to 24ch is electrically connected to the test head 20B side 1 to 24ch via the adapter 100B, and the performance board 30B side 25 to 48ch is connected to the test head 20B side. Therefore, the IC device under test can be tested by the performance board 30B having two simultaneous measurements using the test head 20B having 256 channels.

  The embodiment described above is described in order to facilitate understanding of the present invention, and is not described in order to limit the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, in the above-described embodiment, an adapter (first embodiment) for adapting an old-style performance board having an outer shape different from that of a new-style performance board to a new-style test head, or changeable according to channel assignment can be made. Although the adapter (second embodiment) including the connectors 133a to 133e has been described, the present invention is not particularly limited to this, and mechanical connection conditions and electrical connection between the old performance board and the new test head are not limited thereto. If the conditions (terminal arrangement position or terminal arrangement condition) are different, the conversion adapter may be configured so that the old performance board is adapted to the new test head.

FIG. 1 is a sectional view showing an adapter according to the first embodiment of the present invention. FIG. 2 is an exploded cross-sectional view showing the adapter according to the first embodiment of the present invention. FIG. 3 is an arrow view (plan view) along the direction III in FIG. FIG. 4 is an enlarged cross-sectional view of a portion IV in FIG. FIG. 5 is a circuit diagram of an adapter including a relay for switching a load applied to the IC device. FIG. 6 is a plan view showing another example of a pressing ring used in the adapter according to the first embodiment of the present invention. FIG. 7 is an exploded cross-sectional view showing an adapter according to the second embodiment of the present invention. FIG. 8 is an exploded cross-sectional view showing a case where the adapter according to the second embodiment of the present invention is used for a performance board having 1 simultaneous measurement. FIG. 9 is an exploded sectional view showing a case where the adapter according to the second embodiment of the present invention is used for a performance board having two simultaneous measurements. FIG. 10A is an exploded sectional view showing an old style performance board and an old style test head. FIG. 10B is a plan view showing an old-style performance board. FIG. 11A is an exploded sectional view showing a new performance board and a new test head. FIG. 11B is a plan view showing a new type performance board.

Explanation of symbols

1A, 1B, 1 ', 1 "... Electronic component test apparatus 20A, 20B, 20' ... Test head 21 ... Frog ring 30, 30 ', 30A, 30B ... Performance board 32 ... Socket 50, 50' ... Presser ring 100A, DESCRIPTION OF SYMBOLS 100B ... Adapter 110 ... 1st connection board 114 ... Relay 120 ... 2nd connection board 122 ... Pogo pin 123 ... Guide pin 124 ... Holding lever 130A, 130B ... 3rd connection board 133a, 133b ... 1st, 2nd Connectors 133c-133e ... 3rd-5th connector 140 ... Support member

Claims (9)

In order to adapt the second performance board instead of the first performance board to an electronic component testing apparatus for testing the electronic device under test by bringing the electronic device under test into electrical contact with the first performance board Adapter,
First connection means electrically connectable to the electronic component testing device;
Second connection means electrically connectable to the second performance board;
An adapter comprising: third connection means for electrically connecting the first connection means and the second connection means.   The adapter according to claim 1, wherein the second performance board has an outer shape different from that of the first performance board.   2. The adapter according to claim 1, wherein the second performance board is different from the first performance board in an arrangement of terminals for electrically connecting to the electronic component test apparatus.   The adapter according to claim 1, wherein the second performance board is different from the first performance board in a fixing method to the electronic component test apparatus. A first fixing means for mounting the first performance board on the electronic component testing apparatus;
The adapter according to any one of claims 1 to 4, wherein the first fixing means fixes the first connecting means to the electronic component testing apparatus. A second fixing means for mounting the second performance board on the electronic component testing device;
The adapter according to any one of claims 1 to 5, wherein the second fixing means fixes the second performance board to the second connection means.   The adapter according to claim 1, further comprising switching means for switching a load applied to the electronic device under test during a test.   The third connection means selects an electrical connection between the first connection means and the second connection means in accordance with the number of sockets provided on the second performance board. The adapter according to any one of claims 1 to 7, further comprising: An electronic component test apparatus for testing the electrical characteristics of the electronic device under test by making electrical contact with the electronic device under test,
The second performance board;
An electronic component testing apparatus comprising: the adapter according to claim 1.

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