JP2007274009A5 - - Google Patents
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- Publication number
- JP2007274009A5 JP2007274009A5 JP2007185865A JP2007185865A JP2007274009A5 JP 2007274009 A5 JP2007274009 A5 JP 2007274009A5 JP 2007185865 A JP2007185865 A JP 2007185865A JP 2007185865 A JP2007185865 A JP 2007185865A JP 2007274009 A5 JP2007274009 A5 JP 2007274009A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- semiconductor light
- phosphor
- emitting device
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 907
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 373
- 229920005989 resin Polymers 0.000 claims description 208
- 239000011347 resin Substances 0.000 claims description 208
- 238000007789 sealing Methods 0.000 claims description 99
- 239000000758 substrate Substances 0.000 claims description 81
- 238000002156 mixing Methods 0.000 claims description 26
- 238000009826 distribution Methods 0.000 claims description 25
- 230000003595 spectral Effects 0.000 claims description 18
- 239000003086 colorant Substances 0.000 claims description 17
- 239000004973 liquid crystal related substance Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 description 58
- 239000002184 metal Substances 0.000 description 58
- 229910052788 barium Inorganic materials 0.000 description 34
- 229910052712 strontium Inorganic materials 0.000 description 33
- 239000000463 material Substances 0.000 description 26
- 229910052693 Europium Inorganic materials 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 19
- 238000000576 coating method Methods 0.000 description 19
- 229910052791 calcium Inorganic materials 0.000 description 18
- 238000010586 diagram Methods 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 17
- 229910052950 sphalerite Inorganic materials 0.000 description 16
- 229910052984 zinc sulfide Inorganic materials 0.000 description 16
- 238000000295 emission spectrum Methods 0.000 description 14
- 229910003668 SrAl Inorganic materials 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 239000000126 substance Substances 0.000 description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 12
- 229910017639 MgSi Inorganic materials 0.000 description 11
- -1 gallium nitride compound Chemical class 0.000 description 11
- 229910052727 yttrium Inorganic materials 0.000 description 11
- 229910052748 manganese Inorganic materials 0.000 description 10
- 229910052692 Dysprosium Inorganic materials 0.000 description 9
- 229910052725 zinc Inorganic materials 0.000 description 9
- 229910005793 GeO 2 Inorganic materials 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive Effects 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 7
- 230000002411 adverse Effects 0.000 description 7
- 230000000875 corresponding Effects 0.000 description 7
- 238000000695 excitation spectrum Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 231100000989 no adverse effect Toxicity 0.000 description 6
- 229910052779 Neodymium Inorganic materials 0.000 description 5
- 229910004283 SiO 4 Inorganic materials 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 229910052746 lanthanum Inorganic materials 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- 229910052720 vanadium Inorganic materials 0.000 description 5
- 229910052688 Gadolinium Inorganic materials 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 229910052684 Cerium Inorganic materials 0.000 description 3
- 229920002803 Thermoplastic polyurethane Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052803 cobalt Inorganic materials 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910003465 moissanite Inorganic materials 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 230000000295 complement Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 240000000358 Viola adunca Species 0.000 description 1
- 235000005811 Viola adunca Nutrition 0.000 description 1
- 235000013487 Viola odorata Nutrition 0.000 description 1
- 235000002254 Viola papilionacea Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- TWXTWZIUMCFMSG-UHFFFAOYSA-N nitride(3-) Chemical compound [N-3] TWXTWZIUMCFMSG-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007185865A JP4796548B2 (ja) | 2000-09-21 | 2007-07-17 | 発光表示装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000287326 | 2000-09-21 | ||
| JP2000287326 | 2000-09-21 | ||
| JP2007185865A JP4796548B2 (ja) | 2000-09-21 | 2007-07-17 | 発光表示装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001118790A Division JP4077170B2 (ja) | 2000-09-21 | 2001-04-17 | 半導体発光装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007274009A JP2007274009A (ja) | 2007-10-18 |
| JP2007274009A5 true JP2007274009A5 (de) | 2010-05-20 |
| JP4796548B2 JP4796548B2 (ja) | 2011-10-19 |
Family
ID=38676411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007185865A Expired - Lifetime JP4796548B2 (ja) | 2000-09-21 | 2007-07-17 | 発光表示装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4796548B2 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011014697A (ja) * | 2009-07-01 | 2011-01-20 | Mitsubishi Chemicals Corp | 白色発光装置 |
| WO2011027511A1 (ja) * | 2009-09-02 | 2011-03-10 | 株式会社 東芝 | 白色ｌｅｄおよびそれを用いたバックライト並びに液晶表示装置 |
| JP2016048718A (ja) * | 2014-08-27 | 2016-04-07 | 豊田合成株式会社 | 発光装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2636338B2 (ja) * | 1988-06-06 | 1997-07-30 | 松下電器産業株式会社 | 透過形カラー画像表示装置の照明装置 |
| JPH1012925A (ja) * | 1996-06-21 | 1998-01-16 | Susumu Sato | 蛍光体付き発光ダイオード |
| JP3065258B2 (ja) * | 1996-09-30 | 2000-07-17 | 日亜化学工業株式会社 | 発光装置及びそれを用いた表示装置 |
| JPH10112557A (ja) * | 1996-10-08 | 1998-04-28 | Nichia Chem Ind Ltd | 発光装置及びそれを用いた表示装置 |
| JP3419280B2 (ja) * | 1996-11-05 | 2003-06-23 | 日亜化学工業株式会社 | 発光装置 |
| JP2914350B2 (ja) * | 1997-05-30 | 1999-06-28 | セイコーエプソン株式会社 | 液晶表示装置 |
| JPH11237631A (ja) * | 1998-02-23 | 1999-08-31 | Sanyo Electric Co Ltd | カラー表示装置 |
| JP3397141B2 (ja) * | 1998-07-28 | 2003-04-14 | 住友電気工業株式会社 | 白色ｌｅｄ |
| JP2000049380A (ja) * | 1998-07-30 | 2000-02-18 | Sony Corp | 表示装置 |
| JP3366586B2 (ja) * | 1998-12-28 | 2003-01-14 | 日亜化学工業株式会社 | 発光ダイオード |
| JP2001144331A (ja) * | 1999-09-02 | 2001-05-25 | Toyoda Gosei Co Ltd | 発光装置 |
| JP2000082849A (ja) * | 1999-09-27 | 2000-03-21 | Toshiba Corp | 半導体発光素子、半導体発光装置およびその製造方法 |
| JP2002033520A (ja) * | 2000-07-14 | 2002-01-31 | Toshiba Electronic Engineering Corp | 半導体発光装置 |
-
2007
- 2007-07-17 JP JP2007185865A patent/JP4796548B2/ja not_active Expired - Lifetime
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