JP2007273565A - Board support apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a board support apparatus which stably and uniformly supports a circuit board without changing the erection position of support pins, even when the circuit board is replaced with another type or the irregular shape of the back face of the circuit board is changed; and supports the circuit board with a retaining force that prevents the circuit board from warping, due to a force applied to the circuit board upon mounting of an electronic component thereon. <P>SOLUTION: A number of support pins 2 support the circuit board B from its back face, and are implanted in pin implanting holes 4 so that a support base 1 are pushed up by fluid pressure. Each support pin 2 has a height changing member 16 that is fitted removably on the top of the support pin 2 to project axially. The height changing member 16 is removed from the support pin 2 at the point that the support pin 2 reaches a given elevated position where the support pin 2 comes in contact with the electronic component 3 and with the back face of the circuit board B via the height changing member 16, and that the support pin 2 is locked by a lock member 14. Through this process, the support height L1 of the support pin 2 from the pin implanting surface 1-1 of the support base 1 is reduced to a smaller height according to the projection height L2 of the height changing member 16 from the support pin 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate holding device, and more particularly, when a circuit board is mounted on a back surface side so as to prevent the circuit substrate from being warped when an electronic component is mounted after printing cream solder or the like on the circuit substrate. The present invention relates to a substrate holding device used for supporting horizontally by a large number of support pins from (lower side).

A circuit board such as a printed wiring board can be assembled by mounting various electronic components such as LSIs, ICs, resistors, or capacitors by surface mounting. Solder printing (screen printing) or application of an adhesive is performed, and then an operation of mounting (mounting) an electronic component at a location where cream solder printing or an adhesive is applied is performed.
When such an operation is performed, the circuit board may warp on the opposite side (back side) to the side (front side) on which electronic components are mounted. For example, warp or distortion is likely to occur due to heat or the like during cream solder printing or adhesive application and its curing process. If the circuit board is warped, cream solder printing, electronic component mounting, and electronic component mounting confirmation inspection cannot be performed with high accuracy. Therefore, it is necessary to stably support the circuit board so as to correct the warp from the back side. In other words, in order to manufacture the circuit board with high accuracy, it is important to correct the warping of the circuit board in the horizontal (flat) state during the above-described operation.

Therefore, when carrying out operations such as cream solder printing and mounting electronic components, a number of support pins are provided to horizontally support the circuit board from the back side (lower side) so as to prevent warping of the circuit board. A conventional substrate holding apparatus has been used (see, for example, Patent Document 1 and Patent Document 2). An example of a conventional substrate holding apparatus is shown in FIG.
As shown in FIG. 10, the conventional substrate holding device A <b> 0 has a plate-like support plate 40 having a large number of pin planting holes 41 and a lower end portion fitted into each pin planting hole 41 of the support plate 40. Thus, a large number of support pins 42 arranged upright on the support plate 40 are provided.
The support pin 42 is formed with a predetermined thickness (shaft diameter) and length (height) from a hard material such as a metal material or a synthetic resin material. The support pins 42 are configured to stand upright on the support plate 40 and support the circuit board B from the back side.
Japanese Patent Laid-Open No. 2002-319800 (see paragraph number 0007, FIGS. 2A and 2B) Japanese Patent Laid-Open No. 2004-335773 (see paragraph number 0006, FIGS. 14 to 16)

  By the way, in recent years, with the progress of surface mounting technology on circuit boards, the support area for warpage correction accompanying the increase in the density of mounting electronic components on the surface of circuit boards has been decreasing, and the circuit board has become thinner. There is a tendency that the importance of warping correction and the switching of models associated with small-lot, multi-product production are increasing.

However, the conventional device configured to fit the support pins 42 made of the hard material described in Patent Document 1 and Patent Document 2 into the respective pin planting holes 41 provided in the support plate 40 and to stand upright. Since each of the support pins 42 is formed in the same shape with the same length, from the support plate 40 when the lower end portion is fitted and inserted into each pin planting hole 41 of the support plate 40 to stand upright. The support height L0 is constant.
Therefore, in the conventional apparatus, when the circuit board B having unevenness on the back surface is supported horizontally from the back surface side because the electronic component 43 is already mounted or the like, it is shown in FIGS. 10 (a) and 10 (b). As described above, the support pins 42 are provided in the respective pin implantation holes 41 of the support plate 40 so as to avoid the mounted electronic components 43 and support the back surface of the circuit board B on which the electronic components 43 are not mounted. Must be inserted and placed by hand.

Therefore, in the conventional device, when the uneven shape on the back surface of the circuit board changes due to a change in the model of the circuit board or the layout change of the mounting arrangement of the electronic components, the support device of the support pin is changed each time according to the uneven shape. Must be manually changed. Changing the arrangement of the support pins is a very difficult task, and the setup change requires a lot of time and labor that cannot be ignored.
That is, the change in the standing arrangement of the support pins and the confirmation work thereof may be a back side that cannot be seen from the front side (upper side) of the circuit board, which is a considerably difficult work and takes a long time that cannot be ignored. For this reason, there has been a big problem that not only has been a major factor that hinders shortening of production time, but also has low follow-up capability for changing models, and is therefore unsuitable for small-scale, high-mix production of circuit boards. .

In addition, in the conventional apparatus, the backside support for correcting the warp of the circuit board corresponding to the reduction of the support area of the circuit board, which has been regarded as important by the progress of the surface mounting technology, and the thinning of the circuit board are supported. It was very difficult to reliably implement (execute) back support to correct warpage.
In other words, since the changeover such as changing the standing arrangement of the support pins is manual work and the change work is difficult, the area for supporting the circuit board from the back surface is reduced. It is not possible to evenly correct the warpage. In particular, it has been difficult to uniformly and stably support a circuit board having irregularities on the back surface due to the fact that electronic parts and the like are already mounted, avoiding convex parts such as electronic parts.

  Therefore, the present invention was devised in order to solve the above-mentioned problem, without changing the standing arrangement of the support pins even if the uneven shape of the back surface of the circuit board is changed by changing the model of the circuit board, etc. Moreover, the circuit board can be supported uniformly and stably without applying to the electronic components that do not want to apply the support pins, and furthermore, when printing solder solder or mounting electronic components, etc. An object of the present invention is to provide a substrate holding device that can support a circuit board with a holding force that does not cause the circuit board to be bent by a force applied to the circuit board.

  In order to solve the above-mentioned problems, a substrate holding apparatus according to the present invention is, in claim 1, provided with a support base having a large number of pin planting holes, and planted so as to be movable up and down in each pin planting hole of the support base. A plurality of support pins for supporting the circuit board from the back side, and the support pins are provided with a height changing member detachably at the upper end, and the circuit board and an electronic component mounted on the circuit board. At the point of contact through the height changing member, the height changing member is planted in the pin planting hole so as to be fixed so as not to move up and down by a lock member provided in the support base. Is abutted against the circuit board and the electronic component, and the support pin is removed from the support pin while being fixed by the lock member, thereby changing the support height from the support base to be low. As above the support pin And wherein the projecting axially from parts.

According to the substrate holding device of the first aspect, for example, when an electronic component or the like is already mounted and a circuit board having unevenness on the back surface is supported, the support pin corresponding to the protruding portion of the electronic component or the like is first height. The supporting pin corresponding to the concave portion corresponding to the back surface of the circuit board on which the electronic component or the like does not exist may contact the concave portion via the height changing member. Permissible. In other words, each support pin that is planted so as to be able to move up and down in each pin planting hole of the support base is allowed to have a support height from the support base in accordance with the uneven shape of the back surface of the circuit board, and the circuit board is It will be supported horizontally from the side.
Then, after each support pin comes into contact with the convex portion and the concave portion through the height changing member and is fixed (locked) to each pin installation hole by the lock member so as not to move up and down, Remove the height changing member from the upper end of each corresponding support pin. Then, the support height from the support base including each support pin corresponding to the convex portion of the electronic component or the like is lowered according to the height protruding from the upper end portion of the support pin of the height changing member. Thereby, the contact of the support pin to the convex part such as an electronic component can be avoided.
Further, the concave portion on the back surface of the circuit board that avoids the convex portion such as an electronic component is suitably supported via a height changing member by each support pin that is erected up and down from the support base correspondingly. . As a result, the concave portion of the circuit board that avoids the convex parts such as electronic components is reliably supported, and the entire circuit board can be uniformly and stably supported. Thereby, the correction which prevents the curvature of a circuit board becomes reliable, and the precision can be improved.

  Further, in the substrate holding device according to claim 2, the support pin according to claim 1 is fed into a flow path provided in the support base, and the shaft outer peripheral surface of the support pin and the pin planting hole are provided. It is characterized by being implanted in the pin planting hole so as to be raised by the fluid pressure flowing out from the gap between the hole inner peripheral surface.

  According to the substrate holding apparatus of the second aspect, in addition to the operation of the first aspect, each support pin that is planted so as to be movable up and down in each pin planting hole of the support table is provided in the support table. The circuit board is temporarily raised by the fluid resistance of the fluid pressure flowing out of the support base through the clearance between the shaft outer peripheral surface of the support pin and the inner peripheral surface of the pin implantation hole. Even if it contacts the electronic component mounted on the back surface of the electronic component, the electronic component is not damaged. Then, by stopping the feeding to the flow path, each support pin is lowered and stored in each pin installation hole of the support base.

  In the substrate holding device according to claim 3, the support pin according to claim 1 is implanted in the pin implantation hole so as to be biased in a direction of rising from the support base by a resilient member. It is characterized by being.

  According to the substrate holding apparatus of the third aspect, in addition to the operation of the first aspect, the support pin is implanted in the support base so that the height from the support base is freely lowered by the elastic member. Therefore, even if it abuts on the electronic component mounted on the back surface of the circuit board, the height of the support pin is lowered according to the height of the electronic component. This will not damage electronic components

The substrate holding device of the present invention is configured as described above, so that even when the circuit board model is changed or the uneven shape of the back surface of the circuit board is changed, the back surface unevenness is not changed without changing the standing arrangement of the support pins. The circuit board can be supported from the back side according to the form. In addition, the entire circuit board can be uniformly and stably supported from the back side while avoiding the contact of the support pins with the electronic components.
In addition, when performing work such as cream solder printing or mounting electronic components, the circuit board is firmly and stably supported from the back side by the holding force that does not bend the circuit board due to the force applied to the circuit board. Can be supported.

  Therefore, according to the substrate holding device of the present invention, the followability to the uneven shape of the back surface of the circuit board accompanying the change of the model of the circuit board or the layout change of the mounting arrangement of the electronic components is high, and as a result Numerous effects can be expected, such as being able to immediately respond to small-quantity, multi-product production.

  Hereinafter, embodiments of a substrate holding device according to the present invention will be described in detail with reference to the drawings as appropriate.

[Description of First Embodiment]
FIG. 1 is a side view in which a part of the substrate holding apparatus according to the first embodiment is broken and the length is omitted, and FIG. 2 is a sectional view taken along line II-II in FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1, and FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is a side view showing a state where the circuit board is supported from the back side.

<Configuration of substrate holding device>
The substrate holding device A1 has irregularities on the back surface due to the fact that the electronic component 3 has already been mounted, for example, by planting a large number of support pins 2 on the pin planting surface 1-1 of the support base 1 so as to be movable up and down. The circuit board B is configured to be horizontally supported from the back surface side in accordance with the uneven shape of the back surface.
By the way, on the circuit board B, after the cream solder is printed or the adhesive is applied, various electronic devices such as a plurality of LSIs, ICs, resistors or capacitors are applied to the place where the cream solder is printed or the adhesive is applied. The component 3 is mounted and mounted.

<< Composition of support stand >>
The support base 1 is configured in a block shape having a substantially rectangular shape in plan view, and includes a plurality of pin planting holes 4 on the pin planting surface 1-1, and is supported by each of the pin planting holes 4. The pin 2 is planted so as to be movable up and down.
As shown in FIGS. 1 and 2, the support base 1 includes a lower member 1a, an intermediate member 1b stacked on the lower member 1a, and an upper member 1c stacked on the intermediate member 1b. The back member 1d is assigned to the back surface of the lower member 1a.

Further, the rear surface member 1d of the support base 1 is provided with positioning convex portions or concave portions (not shown), or fixed permanent magnets or the like.
Thereby, for example, the circuit board B transported by a production line conveyor (not shown) can be supported from an appropriate position at each work place where the solder paste printing or the electronic component 3 is mounted. The substrate holding device A can be positioned and set on the table.

The lower member 1a, the intermediate member 1b, the upper member 1c, and the back member 1d are each formed in a substantially rectangular shape in plan view with a required thickness by a metal material such as stainless steel or a synthetic resin material. And each member 1a, 1b, 1c, 1d comprises the support stand 1 by being connected and integrated by connection means, such as a bolting etc. which are not shown in figure.
Further, as shown in FIG. 2, a seal member 18 made of a rubber O-ring or the like is provided at an important point between the respective laminated portions of the members 1a, 1b, 1c, and 1d that need to be sealed against air leakage or the like. Is intervened.

≪Configuration of pin planting hole≫
The pin planting holes 4 are arranged so that a large number of support pins 2 can be planted and arranged at a number and arrangement interval that can stably and stably support the entire back surface of the circuit board B. As shown in FIGS. 1 and 2, it is formed on the pin planting surface 1-1 of the support base 1 in a substantially grid pattern in a plan view of several rows in the short direction of the support base 1 and multiple rows in the longitudinal direction. The
As shown in FIG. 2, the pin planting hole 4 is coaxially formed at a depth from the upper member 1c of the support base 1 to the intermediate member 1b. The pin planting hole 4 has a hole portion of the intermediate member 1b as a lower hole portion 4a formed to have a hole diameter about two times larger than the shaft diameter (thickness) of the support pin 2, and the hole of the upper member 1c. In the portion, the intermediate hole portion 4b is formed with a larger hole diameter excluding the pin planting surface 1-1 side.
Further, the pin planting hole 4 is an upper hole portion formed such that a hole portion facing the pin planting surface 1-1 side from the intermediate hole portion 4b of the upper member 1c has a hole diameter substantially equal to the hole diameter of the lower hole portion 4a. 4c.

As shown in FIG. 2, each pin planting hole 4 has bush members 5 and 6 coaxially disposed by press fitting or the like in the lower hole portion 4 a and the upper hole portion 4 c, and the upper and lower bush members 5. , 6, the support pin 2 is implanted so as to be movable up and down on the same axis.
Further, as shown in FIG. 2, the lower hole portion 4 a of each pin planting hole 4 is connected to the first flow path 7, and the intermediate hole portion 4 b is connected to the second flow path 8. Yes.

The upper and lower bush members 5 and 6 are formed in a cylindrical shape with a flange having a hole diameter larger than the shaft diameter of the support pin 2. Thereby, the support pin 2 is inserted with a gap between the inner peripheral surfaces of the upper and lower bush members 5 and 6. The gap is a gap for compressed air and the like to pass outside when the support pin 2 is raised (floated) using fluid pressure.
Incidentally, the bush members 5 and 6 are made of a synthetic resin material excellent in lubricity or a desired metal material formed by coating the inner peripheral surface of the hole with a synthetic resin material. In the illustrated example, it is shown as having a hook, but there may be no hook depending on the place where it is arranged, and it is arbitrary.

<< Configuration of the first flow path >>
As shown in FIGS. 2 and 3, the first flow path 7 has a groove width corresponding to the hole diameter of the lower hole portion 4 a of the pin planting hole 4 and leaves the upper end portion side of the support pin 2. 2 is formed in the lower member 1a of the support base 1 in the shape of a groove having a depth that allows the 2 to be lowered into the support base 1.
And the 1st flow path 7 has all the lower hole parts of each pin planting hole 4 arranged in the longitudinal direction of the support stand 1 in the parallel direction of the pin planting hole 4 in the transversal direction of the support stand 1 4a is formed in the longitudinal direction so as to communicate with each other, and is formed so as to communicate with the first fluid supply port fitting 9 provided on one side edge of the short side of the lower member 1a.

  Although not shown, the first fluid supply port is connected to each first flow path 7 and the first fluid supply port fitting 9 that are arranged in parallel in the short direction of the support base 1. A branch passage that connects each first flow path 7 from the first fluid supply fitting 9 so that the compressed air introduced from the metal fitting 9 flows into each first flow path 7 simultaneously and at the same speed. It is preferable to change the hole diameter.

  As a result, an air supply device such as an air pump (not shown) is sent to the first flow path 7 through the air hose connected to the first fluid supply port fitting 9, and each of the communication from the first flow path 7 is performed. The compressed air sent into the lower hole portion 4a of the pin planting hole 4 passes through the lower hole portion 4a through the intermediate hole portion 4b, and from the intermediate hole portion 4b through the upper hole portion 4c to the pin planting surface of the support base 1. It flows out from 1-1. That is, the support pin 2 rises (floats) due to fluid pressure (fluid resistance) such as compressed air generated in the gap between the shaft outer peripheral surface of the support pin 2 and the hole inner peripheral surface of the pin planting hole 4. (Refer to the center support pin indicated by a two-dot chain line in FIG. 2 and FIG. 5).

Incidentally, when the support pin 2 is raised, it is preferable that the fluid pressure sent to each pin planting hole 4 through the first flow path 7 is set to about 1 g. As a result of an impact test, it has been proved that if it is about 1 g, no damage is caused even if it abuts on various electronic components 3 such as LSI, IC, resistor, or capacitor. Thereby, even if the support pin 2 is raised by the fluid pressure and contacts the electronic component 3, the electronic component 3 is not damaged.
Further, as shown in FIG. 2, a ring member 11 is provided on the lower end side of the support pin 2 located in the first flow path 7. A shock absorbing coil spring 12 is provided on the outer peripheral surface of the support pin 2 extending from the ring member 11 to the bush member 5 provided in the lower hole portion 4a of the pin planting hole 4 to further damage the electronic component 3. I try to prevent it effectively.

  The ring member 11 is provided on the support pin 2 by attaching a ring-shaped member formed separately to the support pin 2 or integrally forming the support member 2. The coil spring 12 is provided to prevent damage to the electronic component 3 when the support pin 2 is raised by the fluid pressure and contacts the electronic component 3 via the height changing member 16. Therefore, for example, it is desirable to set the spring constant to about 0.02 N / mm.

  Further, as shown in FIG. 2, a resting member 13 is disposed on the flow path bottom of the first flow path 7 that is positioned coaxially with each pin planting hole 4. The corresponding support pin 2 can be rested so as not to rise (the state of the support pin on the right side of the paper in FIG. 5C).

≪Configuration of second flow path≫
As shown in FIGS. 2 and 4, the second flow path 8 communicates the intermediate hole portions 4 b of the pin planting holes 4 arranged in parallel in the short direction of the support base 1, and the support base. 1 is formed in the upper member 1c of the support base 1 in the shape of a groove in the longitudinal direction so as to connect all the intermediate hole portions 4b of the pin planting holes 4 arranged in the longitudinal direction.
And the 2nd flow path 8 is formed so that it may connect with the 2nd fluid supply port metal fitting 10 with which the one side short side edge of the upper member 1c was equipped.

  As a result, the intermediate hole 4b is brought into contact with the intermediate hole 4b by fluid pressure such as compressed air sent to the second flow path 8 from an air generator such as an air pump (not shown) via an air hose connected to the second fluid supply port fitting 10. The lock member 14 to be described later is compressed and deformed so as to be in close contact with the outer peripheral surface of the shaft of the support pin 2, thereby fixing (locking) the support pin 2 so as not to move up and down (FIG. 4B). ) To (c)).

Incidentally, in the present embodiment, the total holding force (supporting force) of each support pin 2 in a state in which the lock member 14 is fixed so as not to move up and down is 30 kg (0.5 Mpa). Have been proven.
Accordingly, when the solder paste is printed or the electronic component 3 is mounted, the circuit board B is firmly held from the back side by the holding force that the circuit board B does not bend due to the force applied to the circuit board B and the like. It can be supported stably.

≪Configuration of resting member≫
The rest member 13 is used when, for example, the support pin 2 is not desired to be brought into contact with the electronic component 3 in the case where the circuit board B having unevenness on the back surface is horizontally supported from the back side because the electronic component 3 is already mounted. For example, the support pin 2 corresponding to the electronic component 3 is held unmovable (immovable), and is formed of a rubber material or other elastic material having a high friction coefficient and a high wear resistance coefficient.
The resting member 13 is formed in an O-ring shape having an inner diameter that can be locked by inserting a locking head 17 described later of the support pin 2, and the first flow corresponding to each pin installation hole 4. By being coaxially arranged at the flow path bottom of the path 7, the locking head 17 of the support pin 2 is pushed in and inserted, so that the support pin 2 cannot be raised (in FIG. 5C). The state of the support pin on the right side of the paper).

≪Configuration of lock member≫
The lock member 14 has a large coefficient of friction and a high elastic deformation rate. Further, the lock member 14 has an antistatic function due to the inclusion of carbon or the like. It is formed in an annular or cylindrical shape having an outer shape that fits inside, and is coaxially disposed in the intermediate hole portion 4b.
The inner diameter of the lock member 14 is formed to be larger than the shaft diameter of the support pin 2. Thereby, the support pin 2 is inserted with a gap between the inner peripheral surface of the lock member 14 (see FIG. 4). The gap is a gap for compressed air and the like to pass outside when the support pin 2 is raised (floated) using fluid pressure.

As shown in FIG. 4, the lock member 14 has an outer peripheral surface of a substantially semicircular portion on the opposite side excluding a substantially semicircular portion in the radial direction facing the second flow path 8 side of each pin implantation hole 4. The intermediate hole 4b is provided in the intermediate hole 4b in a state of being in close contact with the inner peripheral surface of the hole.
As a result, the lock member 14 is compressed and deformed so that the substantially semicircular portion side facing the second flow path 8 is crushed to the opposite side in the radial direction by the fluid pressure, and hugs the shaft outer peripheral surface of the support pin 2. That is, the lock member 14 is not compressed and deformed by the fluid pressure from the entire peripheral surface of the outer peripheral portion toward the shaft outer peripheral surface of the support pin 2, but the outer peripheral portion facing the second flow path 8 side is the support pin 2. It is compressed and deformed into a substantially flat shape so as to hug the outer peripheral surface of the shaft (from the state of FIG. 4B to the state of FIG. 4C).
If necessary, the outer peripheral surface of the substantially semicircular portion of the lock member 14 that is in close contact with the inner peripheral surface of the intermediate hole portion 4b may be fixed to the intermediate hole portion 4b by bonding or other fixing means.

≪Support pin configuration≫
The support pin 2 is formed from a hard material such as a metal material such as stainless steel or a synthetic resin material. As shown in FIG. 2, the support pin 2 is fixed to the inner peripheral surface of the pin planting hole 4, that is, the upper and lower bush members 5 and 6 disposed in the lower hole portion 4a and the upper hole portion 4c, respectively. It has a shaft diameter (outer diameter) that can secure a gap through which compressed air circulates between each inner peripheral surface of the member 14, and is predetermined from the pin planting surface 1-1 of the support base 1. It is formed in such a length that it can rise to the height of.
A mounting hole 15 is provided in the upper end surface of the support pin 2, and the height changing member 16 is detachably mounted in the mounting hole 15.

  Further, as shown in FIG. 2, a locking head 17 is formed at the lower end of the support pin 2 via a locking neck 17a that is slightly thinner than the shaft diameter of the support pin 2. The supporting pin 2 that is provided and waits at the lower limit is pushed downward further so that the locking head 17 is detachably locked to and held by the resting member 13 (FIG. 5 ( The state of the support pin on the right side of the paper in c)).

  As a result, the support pin 2 is not lifted by fluid pressure (fluid resistance) such as compressed air generated in the gap with the inner peripheral surface of the pin planting hole 4, and waiting for descent stored in the pin planting hole 4. I try to rest at the limit. For example, when the circuit board B having unevenness on the back surface is supported horizontally from the back side because the electronic component 3 is already mounted or the like, the electronic component 3 is not desired to be brought into contact with the electronic component 3. The support pins 2 arranged corresponding to 3 can be stopped.

  As shown in FIG. 2, the mounting hole 15 is coaxially formed on the upper end surface of the support pin 2 with an appropriate depth and hole diameter, and the height changing member 16 is detachably mounted by internal fitting. It is formed so that.

≪Configuration of height change member≫
The height changing member 16 has a desired anti-foaming function, such as urethane, which has an antistatic function that reduces the impact when it comes into contact with the circuit board B, the electronic component 3 and the like, and prevents dirt and the like from adhering to it. It is made of an elastic material.
As shown in FIG. 2, the height changing member 16 has a length that protrudes at an appropriate height in the axial direction from the upper end surface of the support pin 2 when mounted in the mounting hole 15 of the support pin 2. It has a solid shape (bar shape).

  As a result, each support pin 2 rises due to the fluid pressure, and reaches the required raised position that contacts the electronic component 3 and the back surface of the circuit board B on which the electronic component 3 is not mounted via the height changing member 16. In addition, the height changing member 16 is removed from the support pin 2 in a state where each support pin 2 is fixed by the lock member 14. In particular, by removing the height changing member 16 from each support pin 2 corresponding to the electronic component 3, as shown in FIGS. 5B and 5C, each support pin 2 corresponding to the electronic component 3 is included. The support height L1 from the pin planting surface 1-1 of the support base 1 is lowered in accordance with the protrusion height L2 of the height changing member 16 protruding in the axial direction from the upper end surface of the support pin 2. . As a result, it is possible to support the circuit board B while avoiding the contact of the support pins 2 with the electronic component 3 or the like (the state of the support pins on the left side in FIG. 5C).

  In addition, the cross-sectional shape of the height changing member 16 is not particularly limited, such as a round shape, a square shape, and a polygonal shape. Although not shown, the support pins 2 that are in contact with the electronic component 3 and the support pins 2 that are in contact with the circuit board B are provided by coloring the height changing member 16 as necessary. It is beneficial to obtain an effect such that it is easy to distinguish (distinguish) from each other by color.

Next, with respect to the support of the circuit board B by the board holding device A1 according to the first embodiment configured as described above, as shown in FIG. The case where the circuit board B which has is supported from the back side is demonstrated. Here, it demonstrates, referring suitably FIGS. 1-4.
FIG. 5 shows a state in which the circuit board is supported from the back surface side, (a) is a side view in which the support pins support the circuit board following the uneven shape of the back surface by electronic components and the like, (b) It is the longitudinal cross-sectional view which expands and shows a part, (c) is the same longitudinal cross-sectional view which shows the state which made the support pin in parallel with the state which removed the height change member removed from the support pin.
When cream solder is printed on the surface of the circuit board B conveyed by the production line conveyor and the operation of mounting the electronic component 3 is performed, the first fluid supply port fitting 9 passes through each first flow path 7. Inject compressed air.

The compressed air sent into each first flow path 7 shown in FIG. 2 and FIG. 3 is the inner circumference of the bush member 5 in the lower hole portion 4 a of each pin planting hole 4 communicating with each first flow path 7. Of the upper hole portion 4c of the pin implantation hole 4 passing through the clearance between the inner circumferential surface of the locking member 14 of the surface and the intermediate hole portion 4b and the shaft outer circumferential surface of the support pin 2 and facing the pin implantation surface 1-1. It flows out through the gap between the inner peripheral surface of the bush member 6 and the shaft outer peripheral surface of the support pin 2 to the pin planting surface 1-1 side of the support base 1 (see FIG. 5B).
At this time, due to the fluid pressure (fluid resistance) generated toward the pin planting surface 1-1 of the support base 1 in the gap with the shaft outer peripheral surface of the support pin 2, the first through each pin planting hole 4 The support pins 2 that have been immersed and stored in the lower limit of the flow path 7 are raised (lifted) together. This rise continues until reaching a raised position that contacts the electronic component 3 and the back surface of the circuit board B on which the electronic component 3 is not mounted via the height changing member 16. It stops when it abuts (see FIGS. 5A and 5B). That is, each support pin 2 rises to a required lift position where the support pins 2 come into contact with each other according to the uneven shape of the back surface of the circuit board B, and is stopped.

  Then, when each support pin 2 reaches the required raised position and stops, the compressed air is sent from the second fluid supply port fitting 10 into the second flow path 8. Then, the inside of the second flow path 8 is pressurized by the compressed air sent into the second flow path 8, and the lock that is disposed in each intermediate hole portion 4 b and faces the second flow path 8 by this pressurization. The member 14 is compressed and deformed into a substantially flat shape and is hugged so as to be in close contact with the shaft outer peripheral surface of each support pin 2 (from the state of FIG. 4B to the state of FIG. 4C).

  As a result, each support pin 2 is fixed (locked) to the required lift stop position so that it cannot be moved up and down, and is applied to the circuit board B when printing cream solder or mounting the electronic component 3 or the like. The circuit board B is firmly and stably supported from the back surface side by a holding force that does not cause the circuit board B to be bent by a force or the like (state shown in FIG. 5C).

In the state where each support pin 2 is fixed so as not to move up and down, the height changing member 16 is removed from each support pin 2 corresponding to the electronic component 3, for example, where the support pin 2 is not desired to be applied. Then, as shown in FIGS. 5B and 5C, the support height L <b> 1 from the pin planting surface 1-1 of the support base 1 is a height protruding in the axial direction from the upper end surface of the support pin 2. The height changing member 16 is lowered according to the protruding height L2. That is, the support height L1 is changed to the height L.
Note that the release of the fixed state in which the support pins 2 are fixed so that they cannot be moved up and down can be collectively performed by removing the compressed air sent to the second flow path 8. That is, when the compressed air is removed, each lock member 14 of the intermediate hole portion 4b of each pin planting hole 4 returns to the original state before being deformed (from the state of FIG. 4C to the state of FIG. 4B). ).

  Therefore, according to the substrate holding apparatus A1 according to the first embodiment, as shown in FIG. 5A, each support pin 2 raised from the pin planting surface 1-1 of the support base 1 by fluid pressure. The circuit board B is horizontally supported from the back surface side in accordance with the uneven shape of the back surface of the circuit board B.

In addition, the height changing member 16 is removed from each support pin 2 corresponding to the electronic component 3 that the support pin 2 is not desired to contact in the state where each support pin 2 is fixed (locked) by the lock member 14 so as not to move up and down. Therefore, the support height L1 from the pin planting surface 1-1 of the support base 1 is lowered in accordance with the protrusion height L2 of the height changing member 16 protruding in the axial direction from the upper end surface of the support pin 2. (See (b) and (c) of FIG. 5).
As a result, in the circuit board B of the same model to be supported later or the circuit board B on which the electronic component 3 is mounted and mounted in the same layout, the supporting form is changed so as to prevent the support pins 2 from coming into contact with the electronic component 3. can do.

  Further, each support pin 2 corresponding to the electronic component 3 is pushed further than the lowering waiting limit of each pin planting hole 4, and the locking head 17 of each support pin 2 is inserted into the pause member 13 and held. Thus, in the subsequent support, each support pin 2 corresponding to the electronic component 3 can be rested in a state of being housed in the first flow path 7 communicating from the pin planting hole 4 ((c) in FIG. 5). (See the support pin on the right side of the paper).

[Description of Second Embodiment]
6 is a side view in which a part of the substrate holding device according to the second embodiment is broken and the length is omitted, and FIG. 7 is a vertical sectional view taken along line VII-VII in FIG. It is.
The substrate holding device A2 according to the second embodiment changes the opening form of each pin planting hole 19 and supports each support pin 2 by the elastic member 20 in the upward direction. The lock member 14 is configured to be incorporated and arranged in each of the pin planting holes 19 of 1 and to hold the stacked structure of the support base 1 and the support pins 2 so that they cannot be moved up and down when they reach the required raised positions. In addition, since the resting member 13 and the like that cannot be lifted is basically the same as the first embodiment described above, the same components are denoted by the same reference numerals, and redundant description is omitted.

≪Configuration of pin planting hole≫
That is, as shown in FIGS. 6 and 7, the pin planting hole 19 has a depth from the upper member 1c of the support base 1 having the pin planting surface 1-1 to the lower member 1a via the intermediate member 1b. Are formed on the same axis.
The pin planting hole 19 includes a lower hole portion 19a formed so that a hole portion from the lower member 1a of the support base 1 to the intermediate member 1b is larger than the shaft diameter (thickness) of the support pin 2 by about two times. In addition, the hole portion of the upper member 1c has an intermediate hole portion 19b formed with a larger hole diameter except for the pin planting surface 1-1 side.
Further, the pin planting hole 19 is an upper hole portion in which a hole portion facing the pin planting surface 1-1 side from the intermediate hole portion 19b of the upper member 1c is formed to have a hole diameter substantially equal to the hole diameter of the lower hole portion 19a. 19c.

The bush members 5 and 6 are arranged coaxially by press fitting or the like in the hole portion of the intermediate member 1b of the support base 1 and the upper hole portion 19c in the lower hole portion 19a of each pin planting hole 19, respectively. The pin 2 is implanted so as to be movable up and down on the same axis.
Further, as shown in FIG. 7, the intermediate hole portion 19 b of each pin planting hole 19 is connected to the flow path 21 and the lock member 14 is coaxially disposed.

≪Configuration of bullet member≫
The elastic member 20 is made of a coil spring material, and as shown in FIG. 7, in the lower hole portion 19a of the pin planting hole 19, the shaft on the lower end portion side of the support pin 2 positioned above the locking neck portion 17a. Between the ring member 22 provided on the outer peripheral surface and the hole bottom of the pin planting hole 19, the support pin 2 is urged in the upward direction by being wound around the shaft outer peripheral surface of the support pin 2. Like to do.

The ring member 22 is provided on the support pin 2 so as to be received by the bush member 5 that is coaxially disposed by press fitting into the lower hole portion 19a of the pin planting hole 19 (the intermediate member 1b portion of the support base 1). Yes. Thereby, the raising height of the support pin 2 from the pin planting surface 1-1 of the support stand 1 is allowed.
The ring member 22 is provided on the support pin 2 by attaching a ring-shaped member formed separately to the support pin 2 or integrally forming the ring member 22 on the support pin 2.

  It should be noted that the spring constant and preload of the coil spring material used as the elastic member 20 are small, and the support pins 2 that have been raised to their required raised positions that contact the back surfaces of the electronic component 3 and the circuit board B are pinned on the support base 1. It is a size that allows it to descend into the installation hole 19, and is large enough to maintain the state in contact with the back surface of the electronic component 3 and the circuit board B until the support pin 2 is fixed by the lock member 14. It only has to be set.

Therefore, according to the substrate holding device A2 according to the second embodiment, the circuit board B having the irregularities on the back surface due to the mounting of the electronic component 3 or the like from the back surface side as in the first embodiment described above. When supporting, each support pin 2 corresponding to the electronic component 3 comes into contact with the electronic component 3 via the height changing member 16.
And until each support pin 2 corresponding to the back surface of the circuit board B where the electronic component 3 does not exist comes into contact with the circuit board B via the height changing member 16, the electronic component 3 contacts the electronic part 3. Each support pin 2 is lowered so as to retract into the pin planting hole 19 against the resilient member 20 (in the state of the support pin on the right side of the paper in FIG. 7B).
Thereby, like the above-mentioned 1st Embodiment, each support pin 2 currently implanted by the support stand 1 makes circuit board B horizontally from the back surface side according to the uneven | corrugated form of the back surface of circuit board B. It is something to support.

Further, when each support pin 2 reaches a required raised position and is fixed so that it cannot be moved up and down by the lock member 14 (the state of FIG. 7B), it corresponds to the electronic component 3 that does not want to apply the support pin 2 By removing the height changing member 16 from each support pin 2 to be performed, the support height L1 from the pin planting surface 1-1 of the support base 1 is set to the support pin 2 as in the first embodiment described above. The height changing member 16 that protrudes in the axial direction from the upper end surface of the lowering of the height changing member 16 falls in accordance with the protruding height L2. That is, the support height L1 is changed to the height L.
As a result, in the circuit board B of the same model to be supported later or the circuit board B on which the electronic component 3 is mounted and mounted in the same layout, the supporting form is changed so as to prevent the support pins 2 from coming into contact with the electronic component 3. can do.

  Further, as shown in FIG. 7B, each support pin 2 corresponding to the electronic component 3 is pushed toward the bottom side of each pin planting hole 19 against the resilient member 20, and each support is supported. As in the first embodiment described above, the locking head 17 of the pin 2 is inserted into the resting member 13 coaxially disposed at the bottom of each pin planting hole 19 to be locked and held. In the subsequent support, the support pin 2 corresponding to the electronic component 3 can be rested in a state of being housed in the pin planting hole 4 (the state of the central support pin in FIG. 7B).

[Description of other embodiments]
FIG. 8 is a plan view of a substrate holding device according to another embodiment of the present invention, and FIG. 9 is a longitudinal side view of the substrate holding device showing an enlarged main part.
The substrate holding device A3 according to the other embodiment is deformed in order to compress and deform the lock member 14 that is fixed (locked) so that it cannot be moved up and down when the support pins 2 reach the required raised positions. Is provided with a lock starting plate 23 so that the second structure described above is used in the laminated structure of the support base 1 and the resting member 13 that holds the support pins 2 so as not to be raised. Since it is basically the same as that of the embodiment, the same components are denoted by the same reference numerals, and redundant description is omitted.

  That is, as shown in FIG. 9, a lock activation plate 23 is provided between the intermediate member 1b and the upper member 1c of the support base 1 on which the lock member 14 is disposed. The lock activation plate 23 is slid between the intermediate member 1b and the upper member 1c so as to slide in the longitudinal direction of the support plate 1 by operation of a lock lever 24 provided on the short side of the support base 1. Placed in.

≪Configuration of lock starting plate≫
The lock starting plate 23 is formed to have a required thickness so as to have a substantially rectangular shape in a plan view by using a metal material such as stainless steel or a synthetic resin material. The lock actuating plate 23 is formed to have a width that the short side direction is accommodated between the intermediate member 1b and the upper member 1c, and is longer than the intermediate member 1b in the longitudinal direction. Yes. Thereby, as shown in FIG. 9, it protrudes outside with the upper member 1c from the short side one side of the intermediate member 1b.

  Further, as shown in FIG. 8 (a), the lock activation plate 23 includes a number of compression activation holes 25 that are arranged to be opened in accordance with the number of arranged lock members 14 and the arrangement interval thereof. In some places, guide holes 26 are provided.

As shown in FIG. 8, the compression activation hole 25 has a slightly larger hole diameter than the outer diameter of the lock member 14, and a substantially elongated hole shape in a plan view elongated in the longitudinal direction of the lock activation plate 23. Is formed.
In addition, as shown to (a) of FIG. 8, in each compression starting hole part 25 provided along the both-sides long side edge of the lock starting board 23, it is formed in the substantially C shape by planar view.
Thus, by sliding the lock starting plate 23 by operating the lock lever 24, the hole edge of the compression starting hole 25 abuts against the lock member 14, and mechanically compresses and deforms the lock member 14. (From the state shown in FIG. 8B to the state shown in FIG. 8C).

  As shown in FIG. 8A, the guide hole portion 26 is formed in a substantially long hole shape in a plan view elongated in the longitudinal direction of the lock starting plate 23, and is formed from the intermediate member 1 b of the support base 1. It is compressed and deformed so that it protrudes at an appropriate height by engaging with the guide shaft portion 27 provided in the intermediate member 1b in the longitudinal direction of the support base 1 (the lock member 14 is held by the support pin 2). The movement of the lock actuating plate 23 that slides in the direction of the movement is guided (from the solid line state in FIG. 8 to the two-dot chain line state).

As shown in FIG. 9, the lock lever 24 is supported by being pivotally supported with respect to a shaft member 28 standing upright on a back surface member 1 d formed longer than the lower member 1 a of the support base 1. It is provided in the stand 1.
Then, the lock lever 24 has a shaft member 29 mounted in an upright position at a tip portion located on the lower member 1 a side, and an upper end portion of the shaft member 29 is attached to a slide activation hole 30 provided in the lock activation plate 23. It is formed so as to be connected to the lock activation plate 23 by being inserted into the lock activation plate 23.

  As shown in FIG. 8A, the slide activation hole 30 is formed on the short side of the lock activation plate 23 at a slight inclination angle with respect to the one side edge and on the one side edge. It is formed in a long hole shape that is elongated in the direction, and is engaged so that the shaft member 29 of the lock lever 24 is inserted (see FIG. 9).

  In the substrate holding device A3 in this other embodiment, as shown in FIG. 9, the upper member 1c of the support base 1 is provided with a reference level pin 31.

According to the substrate holding device A3 in another embodiment configured as described above, as shown in FIG. 8A, the lock lever 24 is moved from the position indicated by the solid line by the two-dot chain line with the shaft member 28 as the fulcrum. Rotate to the indicated position. Then, the shaft member 29 of the lock lever 24 moves along the inclination of the slide activation hole 30 of the lock activation plate 23.
Accordingly, the lock starting plate 23 is guided by the engagement between the guide hole portion 26 and the guide shaft portion 27 and is slid in the longitudinal direction of the support base 1 (from the solid line state in FIG. 8 to the two-dot chain line state). ). By the sliding movement of the lock starting plate 23, the hole edge portion of the compression starting hole 25 of the lock starting plate 23 comes into contact with the lock member 14 and mechanically deforms the lock member 14 ((( From the state shown in b) to the state shown in (c)).
The lock activation plate 23 that fixes each support pin 2 so as not to move up and down is released by rotating the lock lever 24 from the position indicated by the two-dot chain line shown in FIG. 8A to the position indicated by the solid line. By returning to the original position, each lock member 14 returns to the original state before being deformed (from the state of FIG. 8C to the state of FIG. 8B).

The specific configuration of the embodiment of the present invention is not limited to the first embodiment, the second embodiment, and the other embodiments described above, and is described in claims 1 to 3. Even if there is a design change without departing from the gist of the present invention, it is included in the present invention.
For example, as a detachable attachment of the height changing member 16 to the upper end portion of each support pin 2, it may be changed from an internal fit to an external fit, or by a screwing method or other locking relationship between the convex portion and the concave portion. It can be changed to the detachable means constituted.

In addition, when each support pin 2 rises to a height position at a point where it abuts on the back surface of the circuit board B without the electronic component 3 or the electronic component 3, a lock member 14 that is fixed so that it cannot be moved up and down is mounted on each pin. Instead of the annular shape or the cylindrical shape individually disposed in the installation holes 4 and 19, the second flow path 8 and the entire flow path 21 communicating with the intermediate hole portions 4 b and 19 b of the pin installation holes 4 and 19 are provided. A lock member formed in the shape of a rubber bag that is inflated by fluid pressure is disposed, and the support pins 2 are collectively fixed (locked) so that they cannot be moved up and down by the inflated rubber bag-like lock member. You can also.
Thus, when the lock member is configured, a liquid such as hydraulic pressure can be used as a pressure medium for generating fluid pressure.

It is a side view which fractures | ruptures a part of board | substrate holding apparatus which concerns on the 1st Embodiment of this invention, and abbreviate | omitted length. It is the II-II line longitudinal cross-sectional view of FIG. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1 showing the first flow path. The 2nd flow path is shown, (a) is an IV-IV line transverse sectional view of Drawing 1, (b) is a sectional view expanding and showing a part of (a), (c) These are the same sectional views showing the state where the lock member was compressed and deformed by the fluid pressure sent into the 2nd channel. The state which supported the circuit board from the back surface side is shown, (a) is a side view in which each support pin supports the circuit board according to the uneven | corrugated form of the back surface by an electronic component etc., (b) is a part FIG. 5C is an enlarged vertical sectional view showing the state in which the height changing member is removed from a part of the support pins. It is a side view which fractures | ruptures a part of board | substrate holding apparatus which concerns on the 2nd Embodiment of this invention, and abbreviate | omitted length. (A) is a vertical sectional view taken along line VII-VII in FIG. 6, and (b) corresponds to an electronic component when a central support pin is held by a pause member and the circuit board is supported from the back side. It is the same longitudinal cross-sectional view which shows the state in which the support pin was lowered | hung against the elastic member. It is a top view which abbreviate | omits the length of the board | substrate holding | maintenance apparatus which concerns on other embodiment of this invention, and abbreviate | omits the upper member of a support stand. It is a vertical side view of the board | substrate holding | maintenance apparatus which concerns on other embodiment which expands and shows the principal part. The conventional board | substrate holding | maintenance apparatus is shown, (a) is a perspective view of the state which supports a circuit board from a back surface side, (b) is a side view which shows the support state.

Explanation of symbols

A1, A2, A3 Substrate holding device B Circuit board 1 Support base 1-1 Pin planting surface 2 Support pin 3 Electronic component 4, 19 Pin planting hole 7 First channel 8 Second channel 13 Resting member 14 Lock member 20 Elastic member 21 Flow path 23 Lock starting plate 24 Lock lever 25 Compression starting hole

Claims (3)

A support base having a large number of pin planting holes, and a large number of support pins that are planted so as to be movable up and down in the respective pin planting holes of the support base and support the circuit board from the back side;
The support pin is detachably provided with a height change member at an upper end portion, and when the contact is brought into contact with the circuit board and the electronic component mounted on the circuit board via the height change member, It is implanted in the pin planting hole so as to be fixed so that it cannot be moved up and down by a lock member provided in the support base,
The height changing member is in contact with the circuit board and the electronic component, and is removed from the support pin so as to change the support height from the support base to be lower. A substrate holding device that protrudes in an axial direction from the substrate.   The support pin is fed into a flow path provided in the support base and is raised by fluid pressure flowing out from a gap between the shaft outer peripheral surface of the support pin and the inner peripheral surface of the pin planting hole. The substrate holding device according to claim 1, wherein the substrate holding device is planted in the pin planting hole.   The substrate holding apparatus according to claim 1, wherein the support pin is implanted in the pin planting hole so as to be biased in a direction rising from the support base by a resilient member.

Images