WO2014083605A1

WO2014083605A1 - Substrate printing device

Info

Publication number: WO2014083605A1
Application number: PCT/JP2012/080579
Authority: WO
Inventors: 毅近藤
Original assignee: 富士機械製造株式会社
Priority date: 2012-11-27
Filing date: 2012-11-27
Publication date: 2014-06-05
Also published as: JPWO2014083605A1; JP6120453B2

Abstract

When a pallet (12) whereon a plurality of individual substrates (11) are placed is transported into a working position by conveyors (13, 14) and the plurality of individual substrates (11) are positioned, the individual substrates (11) are raised to a height position of a substrate positioning plate (55) in a state where a plurality of suction nozzles (20) are raised and each of the individual substrates (11) is picked up by a respective suction nozzle (20) via an opening part (18) formed in each substrate placement space (17) of the pallet (12) and are stopped in a state in which each individual substrate (11) is inserted with clearance into a respective positioning hole (56) and the height of the upper surface of the individual substrates (11) matches the height of the upper surface of the substrate positioning plate (55). Thereafter, an XY movement mechanism (22) is operated and the suction nozzles (20) moved in a direction inclined to the positioning holes (56) to move the individual substrates (11) in an inclined direction within the positioning holes (56) and to position the same such that two side parts of each individual substrate (11) contact two side parts of the respective positioning hole (56).

Description

Substrate printing device

The present invention relates to a substrate printing apparatus that collectively prints a predetermined pattern on a plurality of individual substrates.

A known example of this type of substrate printing apparatus is described in Patent Document 1 (Japanese Patent Laid-Open No. 2009-135215). This is arranged below a conveyor for carrying a pallet on which individual substrates are placed in a plurality of substrate placement spaces to a work position and each substrate placement space of the pallet carried to the work position. A plurality of suction units and a plurality of rectangular positioning holes which are arranged above the pallet loaded into the work position and are used to loosely insert and position the plurality of individual substrates placed on the pallet. A substrate positioning plate, a suction unit holder for holding the plurality of suction units, a suction unit holder lifting mechanism for moving the suction unit holder in the vertical direction, and the suction unit holder for each individual substrate. And a dedicated drive mechanism for positioning that moves in a substantially diagonal direction. The suction unit holder is lifted and the individual substrates are held in the state in which the individual substrates are sucked by the suction units through openings formed in the substrate mounting spaces of the pallet. The individual board is loosely inserted into the positioning holes and stopped in a state where the height of the upper surface of each individual board matches the height of the upper surface of the board positioning plate. Thereafter, the positioning drive mechanism is operated to move the suction unit holder in a substantially diagonal direction of the individual substrates, thereby moving the individual substrates in the positioning holes in a substantially diagonal direction. Positioning is performed by bringing the two sides of each individual substrate into contact with the two sides of the positioning hole.

JP 2009-135215 A

However, in the configuration of Patent Document 1, it is necessary to newly provide a positioning-dedicated drive mechanism that moves each individual substrate in each positioning hole in a substantially diagonal direction when positioning a plurality of individual substrates placed on the pallet. There was a disadvantage that the cost increased accordingly. In addition, since the printing apparatus is dedicated to the individual substrate, it cannot be used for printing one circuit board at a time, and the versatility is inferior.

Therefore, the problem to be solved by the present invention is that there is no need to newly provide a drive mechanism dedicated to positioning of individual substrates, and moreover, batch printing of a plurality of individual substrates and normal printing of each circuit substrate. It is an object of the present invention to provide a substrate printing apparatus that can cope with both of the above, and can realize cost reduction and versatility improvement.

In order to solve the above-mentioned problems, the present invention is to carry a pallet on which a plurality of individual substrates are placed to a work position below a printing mask by a conveyor, position the plurality of individual substrates, and to each individual substrate. In the substrate printing apparatus that collectively prints a predetermined pattern, the substrate is placed below each substrate placement space of the pallet carried into the work position, and the opening is formed in each substrate placement space. A plurality of suction nozzles for sucking individual substrates in each substrate mounting space and a plurality of individual substrates placed on the pallet and placed above the pallet carried to the work position are loosely inserted and positioned. A substrate positioning plate having a plurality of rectangular positioning holes, an elevating mechanism that integrally lifts and lowers the plurality of suction nozzles, and the plurality of suction nozzles An XY movement mechanism that moves in the X direction and the Y direction integrally with the lowering mechanism, and a control unit that controls the elevating mechanism and the XY movement mechanism. Operate the lifting mechanism to raise the plurality of suction nozzles so that the individual substrates are sucked by the suction nozzles through the openings formed in the substrate mounting spaces of the pallet. In a state where the individual substrate is raised to the height position of the substrate positioning plate and the individual substrates are loosely inserted into the respective positioning holes so that the height of the upper surface of each individual substrate matches the height of the upper surface of the substrate positioning plate. After stopping, each piece substrate in each positioning hole is operated by operating the XY moving mechanism to move each suction nozzle in an oblique direction with respect to each positioning hole. It is characterized in that the control to position by abutting two sides of the respective pieces substrate is moved to the two sides of each of the positioning holes in the oblique direction.

In this configuration, when positioning a plurality of individual substrates placed on the pallet, an XY moving mechanism is used as means for moving each individual substrate in an oblique direction with respect to each positioning hole. There is no need to newly provide a drive mechanism. In addition, instead of a pallet on which a plurality of individual substrates are placed, if a large circuit board is put into a conveyor one by one, a normal circuit board can be printed one by one. It is possible to cope with both batch printing and ordinary printing of circuit boards one by one, and it is possible to realize cost reduction and improved versatility.

In this case, a plurality of suction nozzles may be supported by the nozzle support base so as to be rotatable and displaceable in the X and Y directions, respectively, and may be biased by the biasing means toward the center of the nozzle support base. In this way, even if the amount of deviation in the X, Y, and θ directions (horizontal rotation direction) of each individual substrate varies, the two sides of each individual substrate are surely brought into contact with the two sides of each positioning hole. The amount of deviation of each individual substrate in the X, Y, and θ directions can be corrected with high accuracy.

Furthermore, the present invention provides a plate table for placing the substrate positioning plate in a state of being restrained so as not to move in the X and Y directions, and a plate suction that is lifted and lowered by the lifting mechanism while the substrate positioning plate is sucked. And a camera that images the recognition mark on the upper surface of the substrate positioning plate or the recognition mark on the individual substrate and the recognition mark on the lower surface of the printing mask, and after the positioning operation of each individual substrate is completed, The captured image is processed to measure the amount of displacement of the substrate positioning plate with respect to the printing mask, and the substrate positioning plate is sucked by the plate suction portion and lifted from the plate table by the lifting mechanism to be detached. In this state, after correcting the positional deviation amount of the substrate positioning plate by the XY movement mechanism, The serial respective pieces substrate may be to print at once a predetermined pattern. In this way, it is possible to accurately print a predetermined pattern on each individual substrate by correcting the displacement of the substrate positioning plate with respect to the print mask.

In this case, it is preferable that at least one of the X axis and the Y axis of the XY moving mechanism is configured as two axes, and the two axes are driven in opposite directions to correct the deviation of the substrate positioning plate in the θ direction. . In this way, the XY movement mechanism also functions as a θ rotation mechanism, and the XY movement mechanism can correct not only the displacement of the substrate positioning plate in the X and Y directions but also the displacement in the θ direction.

FIG. 1 is a plan view of a substrate printing apparatus according to an embodiment of the present invention. FIG. 2 is a right side view of the substrate printing apparatus. FIG. 3 is a view corresponding to FIG. 2 for explaining the positioning operation of a plurality of individual substrates placed on the pallet. FIGS. 4A and 4B are plan views for explaining the operation of positioning the individual substrate by loosely inserting it into the positioning hole of the substrate positioning plate. FIG. 4 is a right side view for explaining the operation for loosely positioning the individual substrate into the positioning hole of the substrate positioning plate. FIG. 6 is a perspective view for explaining the arrangement of a plurality of suction nozzles. FIG. 7 is an enlarged perspective view of the suction nozzle. FIG. 8 is a plan view when a normal size circuit board is printed one by one using the substrate printing apparatus.

Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described.
First, the configuration of the substrate printing apparatus will be described.

The pallet 12 (see FIG. 2) on which the plurality of individual substrates 11 are placed is carried into a work position below the printing mask 65 (see FIG. 5) by the

conveyors

13 and 14. The

conveyors

13 and 14 are provided in parallel to the upper part of the fixed side plate 15 and the upper part of the movable side plate 16. By moving the movable side plate 16 in the Y direction (direction perpendicular to the conveying direction of the pallet 12) by a feed screw mechanism (not shown) or the like according to the width dimension of the pallet 12 to be carried in, the fixed side By adjusting the distance between the plate 15 and the movable side plate 16, the width between the

conveyors

13 and 14 that convey the pallet 12 is adjusted.

On the pallet 12, a plurality of rectangular recess-shaped substrate placement spaces 17 for storing a plurality of individual substrates 11 one by one are formed at a predetermined arrangement pitch. The clearance between the outer peripheral edges of the single substrates 11 is set in consideration of the fitting workability of the individual substrates 11 and the manufacturing variations of the external dimensions of the individual substrates 11 (that is, the most within the manufacturing variation range). The clearance necessary for fitting the large-sized individual substrate 11 is secured). An opening 18 is formed at the bottom of each substrate placement space 17, and the individual substrate 11 in the substrate placement space 17 is picked up by a suction nozzle 20, which will be described later, through this opening 18 and lifted. ing. The pallet 12 is prepared in advance with a plurality of types of pallets 12 having different sizes of the substrate placement space 17, and the pallet 12 having the substrate placement space 17 having a size corresponding to the size of the individual substrate 11 to be printed. Is used.

At the bottom of each substrate placement space 17 of the pallet 12 carried into the work position, suction nozzles 20 for suctioning the individual substrates 11 with air suction force (vacuum) are arranged. The lifting table 21 that supports the plurality of suction nozzles 20 is moved in the vertical direction (Z direction) by a lifting mechanism (not shown), and is moved by the XY moving mechanism 22 in the X direction (the conveying direction of the pallet 12). It is configured to move in the Y direction, which is a perpendicular direction.

The XY moving mechanism 22 includes one X-axis feed screw mechanism 23 and two Y-axis feed screw mechanisms 24 and 25 (see FIG. 1), and the two Y-axis

feed screw mechanisms

24 and 25 are reverse to each other. , It also functions as a θ rotation mechanism that rotates the lift table 21 in the θ direction (horizontal rotation direction), and is configured to correct the deviation of the lift table 21 in the θ direction. The elevating table 21 is supported by the X-axis feed screw mechanism 23 and the Y-axis

feed screw mechanisms

24, 25 so as to be rotatable in the θ direction (horizontally rotatable) via

shafts

26, 27, 28 (see FIG. 1), respectively. Yes.

As shown in FIGS. 6 and 7, each suction nozzle 20 is detachably mounted on the lifting table 21 via a stepped cylindrical nozzle support base 31. In this embodiment, the nozzle support base 31 is attracted and held on the upper surface of the elevating table 21 formed of a magnetic material such as an iron plate by the magnetic force of the magnet 32 fixed to the lower end thereof. A nozzle positioning plate 34 in which a plurality of positioning holes 33 for positioning a plurality of nozzle support bases 31 is formed is placed on the elevating table 21, and each nozzle is supported in each positioning hole 33 of the nozzle positioning plate 34. The nozzle support bases 31 are positioned by fitting the lower ends of the bases 31. Accordingly, a plurality of nozzle positioning plates 34 having different numbers of positioning holes 33 and different arrangement pitches are prepared in advance according to the number and arrangement pitch of the suction nozzles 20 to be mounted on the lifting table 21, and the substrate of the pallet 12 to be carried in A plurality of suction nozzles 20 may be mounted on the lifting table 21 by selecting the nozzle positioning plates 34 corresponding to the number of placement spaces 17 and the arrangement pitch. When a plurality of types of suction nozzles 20 having different outer diameter dimensions of the nozzle support base 31 are prepared, a nozzle in which a positioning hole 33 having an inner diameter dimension corresponding to the outer diameter dimension of the nozzle support base 31 to be used is formed. A positioning plate 34 may be used.

Each suction nozzle 20 is supported by a nozzle support base 31 so as to be rotatable in the θ direction (horizontal direction) and displaceable in the X and Y directions. Specifically, a flange portion 35 is formed on the outer peripheral portion of a thick cylindrical nozzle body 20a formed on the lower side of the suction nozzle 20, and the flange portion 35 is sandwiched by a plurality of hard balls 36 from both upper and lower sides. The rigid sphere 36 is sandwiched between two ring-shaped

ball receiving plates

37 and 38. The lower ball receiving plate 38 is fixed to the upper surface portion of the nozzle support base 31, and a ring-shaped elastic body 40 is interposed between the cover 39 attached to the upper portion of the nozzle support base 31 and the upper ball receiving plate 37. The upper ball receiving plate 37 is pressed against the hard sphere 36 by the elastic force of the elastic body 40. As a result, the flange portion 35 of the suction nozzle 20 is sandwiched and supported between the plurality of rigid spheres 36 supported between the two

ball receiving plates

37 and 38, and the rotational force in the θ direction acting on the suction nozzle 20 is supported. Each of the hard spheres 36 rolls according to the external force in the X and Y directions, so that the suction nozzle 20 can be rotated in the θ direction and displaced in the X and Y directions. The

ball receiving plates

37 and 38 are made of a metal-based plain bearing material such as a hardened metal in order to reduce wear on the surface on which the hard ball 36 rolls.

A plurality of magnets 43 are fixed to a lower end portion of the nozzle body 20 a of the suction nozzle 20 at a predetermined pitch (for example, 120 ° pitch), and a plurality of magnets 44 are provided to the upper end portion of the nozzle support base 31. The magnet 43 is fixed so as to face the magnet 43. The

magnets

43 and 44 function as a biasing unit that biases the suction nozzle 20 toward the center of the nozzle support base 31 by a magnetic attractive force acting between the

magnets

43 and 44, and in a state where no external force acts on the suction nozzle 20, the magnet 43. , 44 is configured so that the suction nozzle 20 is held at the center position of the nozzle support base 31 by a magnetic attraction force acting between them.

A urethane tube 46 is bonded and fixed to the inner diameter portion of the nozzle body 20a of the suction nozzle 20 in a state of protruding downward, and a rubber packing 47 (seal member) is attached to the urethane tube 46 protruding downward from the nozzle body 20a. A space 48 through which the gap between the outer peripheral surface of the urethane tube 46 and the inner peripheral surface of the nozzle support base 31 is sealed with a rubber packing 47, and a negative pressure is introduced between the rubber packing 47 and the magnet 32. Is formed.

The nozzle support base 31 is provided with a joint 49 for connecting a negative pressure introduction hose (not shown), and the joint 49 communicates with the negative pressure introduction space 48 in the nozzle support base 31. Thereby, the negative pressure supplied through the negative pressure introduction hose is introduced from the joint 49 into the negative pressure introduction space 48 in the nozzle support base 31, and the air in the suction nozzle 20 is introduced into the negative pressure introduction space 48 by the negative pressure. By sucking, a negative pressure suction force is generated at the upper end of the suction nozzle 20. The negative pressure introducing hose is connected to a negative pressure generating source (not shown) via a solenoid valve (not shown), and switching between the solenoid valves causes a negative pressure introduction (suction) and an atmosphere release (suction release). Switching is performed.

A nozzle removal auxiliary plate 51 is attached to one side of the outer peripheral portion of the nozzle support base 31 with a screw 52 or the like, and the lower end of the nozzle removal auxiliary plate 51 is in a state of approaching the nozzle positioning plate 34. As described above, since the attachment of the plurality of suction nozzles 20 on the lift table 21 is the magnetic force of the magnet 32, the plurality of suction nozzles 20 can be removed. When removing a plurality of suction nozzles 20 from the lifting table 21 at a time, the nozzle positioning plate 34 is lifted directly above the lifting table 21, so that the nozzle positioning plate 34 has a lower end of the nozzle removal auxiliary plate 51. In this state, when the nozzle positioning plate 34 is further lifted, the nozzle removal auxiliary plate 51 is lifted, so that the nozzle support base 31 is gradually tilted and the magnet 32 is gradually peeled off from the lifting table 21. Then, the nozzle support base 31 of the suction nozzle 20 is removed from the lifting table 21. Thereby, it becomes easy to remove the plurality of suction nozzles 20 from the lifting table 21 in a lump.

As shown in FIGS. 2 and 3, a substrate positioning plate 55 is disposed above the pallet 12 carried into the work position. The substrate positioning plate 55 is formed with a plurality of rectangular positioning holes 56 for loosely inserting and positioning the plurality of individual substrates 11 placed on the pallet 12. Here, “free insertion” means that a gap is formed between the outer peripheral edge of the individual substrate 11 and the inner peripheral edge of the positioning hole 56 in a state in which the individual substrate 11 is fitted into the positioning hole 56 (inserted state). It can be done.

The substrate positioning plate 55 is mounted on the mounting table 57 installed at the four corners of the work position, and fixed to the upper surface of each mounting table 57 with the fixing pins 58 fixed upward. By inserting the fitting hole 59 formed in the corner portion, the substrate positioning plate 55 is placed on the placement table 57 in a restrained state so as not to move in the X, Y, and θ directions. Note that, instead of the fixing pin 58, an adsorption hole or a magnet may be provided on the upper surface of each mounting table 57, and the substrate positioning plate 55 may be adsorbed and fixed by a negative pressure attractive force or a magnetic force.

On the other hand, suction blocks 61 and 62 (plate suction portions) for sucking and holding the substrate positioning plate 55 from the lower surface side are provided on the upper end surfaces of the fixed side plate 15 and the movable side plate 16, respectively. As shown in the drawing, when the substrate positioning plate 55 is lifted from the mounting table 57 and the positional displacement of the substrate positioning plate 55 in the X, Y, and θ directions is corrected, the substrate positioning plate 55 is sucked and held by the suction blocks 61 and 62. It is supposed to be. The side plates 15 and 16 (each suction block 61 and 62) are moved up and down (Z direction) by an elevating mechanism (not shown) separately from the elevating table 21, and X is moved by the XY moving mechanism 22. , Y, and θ directions. The side plates 15 and 16 (each suction block 61 and 62) and the lifting table 21 (suction nozzle 20) are configured so that they both move up and down separately and move together in the X, Y, and θ directions. Has been.

As shown in FIG. 5, a printing mask 65 (screen mask) is horizontally installed above the substrate positioning plate 55, and a squeegee 66 is arranged above the printing mask 65. The squeegee 66 is moved along the upper surface of the printing mask 65 by a squeegee moving device (not shown).

The printing mask 65 is provided with a mask opening (not shown) for collectively printing a printing pattern such as a solder pattern on the plurality of individual substrates 11 placed on the pallet 12. In addition, recognition marks (not shown) for recognizing reference positions in the X, Y, and θ directions are formed.

On the other hand, recognition marks (not shown) for recognizing the reference positions in the X, Y, and θ directions are formed on the top surface of the pallet 12 (or the individual substrate 11). The board printing apparatus is provided with a camera 67 that takes an image of a part to be imaged such as a recognition mark on the pallet 12 (or the individual board 11) and a recognition mark on the pallet 12. The camera 67 is moved in the X and Y directions by a camera moving device (not shown), and a prism for imaging both the pallet 12 side and the print mask 65 side on the lens side of the camera 67. 68 is installed.

During the operation of the substrate printing apparatus, the camera 67 is moved between the pallet 12 and the printing mask 65 with the gap between the pallet 12 and the printing mask 65 before screen printing, and the pallet 12 (or individual substrate). 11) The recognition mark of 11) and the recognition mark of the printing mask 65 are imaged in order and the respective reference positions are recognized, and then the positional displacement of the substrate positioning plate 55 in the X, Y, and θ directions with respect to the printing mask 65 is corrected. After the camera 67 is retracted to the outside of the pallet 12, a solder pattern is applied to the individual substrates 11 in the plurality of positioning holes 56 of the substrate positioning plate 55 with the print mask 65 superimposed on the substrate positioning plate 55. Screen printing is performed on all the printing patterns.

On the other hand, instead of the pallet 12 on which the plurality of individual substrates 11 are placed, as shown in FIG. 8, if normal size circuit boards 71 are put into the

conveyors

13 and 14 one by one, normal one by one Printing of the circuit board 71 is also possible. At this time, the plurality of suction nozzles 20 on the lifting table 21 are used as backup pins for supporting the circuit board 71 so that the downward suction of the circuit board 71 during screen printing is prevented by the plurality of suction nozzles 20. Anyway. Alternatively, a plurality of suction nozzles 20 may be removed from the lifting table 21 and a plurality of backup pins that support the circuit board 71 may be attached on the lifting table 21.

A method for collectively printing a print pattern such as a solder pattern on a plurality of individual substrates 11 placed on the pallet 12 using the substrate printing apparatus of the present embodiment described above will be described. The operation of each process described below is controlled by a control computer (control means) of the board printing apparatus.

First, as shown in FIG. 2, the pallet 12 on which the individual substrates 11 are placed in the plurality of substrate placement spaces 17 is brought into the working position by the

conveyors

13 and 14 and stopped. Each suction nozzle 20 on the lifting table 21 is positioned directly below each substrate placement space 17 of the pallet 12 stopped at this working position.

Thereafter, the movable side plate 16 is moved, and the pallet 12 is sandwiched between the fixed side plate 15 and the movable side plate 16 and fixed. The reason for fixing the pallet 12 is that when the individual substrate 11 is returned to the substrate placement space 17 of the pallet 12 after screen printing, which will be described later, the individual substrate 11 is properly placed in the substrate placement space 17. .

Thereafter, as shown in FIG. 3, the lifting table 21 is raised and the individual nozzles 11 in the substrate mounting spaces 17 are moved downward through the suction nozzles 20 through the openings 18 of the substrate mounting spaces 17 of the pallet 12. From each of the suction nozzles 20 and lifted. As a result, each individual substrate 11 is raised to the height position of the substrate positioning plate 55, and each individual substrate 11 is loosely inserted into each positioning hole 56 of the substrate positioning plate 55 so that the height of the upper surface of each individual substrate 11 is increased. The substrate positioning plate 55 is stopped in a state where it matches the height of the upper surface of the substrate positioning plate 55.

Thereafter, in order to position the individual substrate 11 in each positioning hole 56 of the substrate positioning plate 55, the XY moving mechanism 22 is operated, and each suction nozzle 20 is positioned as shown in FIG. As shown in FIG. 4B, each individual substrate 11 in each positioning hole 56 is moved in an oblique direction by moving it in an oblique direction with respect to the hole 56 (for example, substantially diagonal direction of the positioning hole 56). Then, the two sides of each individual substrate 11 are pressed against the two sides of each positioning hole 56 to correct the X, Y, and θ misalignment of each individual substrate 11, and the two sides of each individual substrate 11 are each positioned. The two sides of the hole 56 are brought into contact with each other. Thereby, each individual substrate 11 is positioned with reference to the two sides of each positioning hole 56.

In this case, each suction nozzle 20 is supported by the nozzle support base 31 so as to be rotatable in the θ direction and displaceable in the X and Y directions. Even if there is a variation, when the two sides of each individual substrate 11 are pressed against the two sides of each positioning hole 56, the pressing force forces the individual substrates 11 in the X, Y, and θ directions with respect to each positioning hole 56. The amount of deviation can be automatically corrected independently for each individual substrate 11, and the two sides of each individual substrate 11 can be reliably brought into contact with the two sides of each positioning hole 56. It is possible to position all the individual substrates 11 at the same time accurately with reference to the two sides of 56.

Thereafter, the

side plates

15 and 16 on both sides are raised integrally with the suction blocks 61 and 62, and the substrate positioning plate 55 is sucked and held by the suction blocks 61 and 62. As shown in FIG. Is lifted from the mounting table 57, and the rising of the substrate positioning plate 55 is stopped at a position where the fitting hole 59 of the substrate positioning plate 55 is removed upward from the fixing pin 58 of the mounting table 57. In this state, the print mask 65 is disposed horizontally above the substrate positioning plate 55.

Thereafter, the camera 67 is moved between the substrate positioning plate 55 and the print mask 65, and the recognition marks on the pallet 12 (or the individual substrate 11) and the recognition marks on the print mask 65 are sequentially imaged. The image is processed to recognize the reference position of the substrate positioning plate 55 and the reference position of the printing mask 65, and based on the recognition result, the amount of positional deviation of the substrate positioning plate 55 in the X, Y, and θ directions with respect to the printing mask 65 Is calculated. Thereafter, the XY moving mechanism 22 is operated to adjust the position of the substrate positioning plate 55 in the X, Y, and θ directions in accordance with the amount of positional deviation of the substrate positioning plate 55 in the X, Y, and θ directions. The displacement of the plate 55 in the X, Y, and θ directions is corrected.

Thereafter, the camera 67 is retracted to the outside of the pallet 12, and then the lifting table 21 is raised so that the substrate positioning plate 55 and the upper surface of each individual substrate 11 are in light contact with the lower surface of the printing mask 65. After stopping the ascent of 55, the squeegee 66 is moved along the upper surface of the print mask 65 to collectively print the print patterns such as solder patterns on the individual substrates 11 in the plurality of positioning holes 56 of the substrate positioning plate 55. Screen print.

At this time, each individual substrate 11 is screen-printed in a state of being sandwiched between the substrate positioning plate 55 and the print mask 65, so that it is possible to prevent the individual substrate 11 from being displaced during screen printing, and to perform a squeegee operation. The printing mask 65 on which the pressing force 66 acts can be received and supported by the substrate positioning plate 55, and the printing mask 65 can be prevented from being bent and deformed downward by the pressing force of the squeegee 66.

After the screen printing, the substrate positioning plate 55 is lowered to place the substrate positioning plate 55 on the placement table 57, and the suction nozzles 20 are lowered to place the individual substrates 11 on the substrate placement spaces 17 of the pallet 12. After the suction of each suction nozzle 20 is released, the movable side plate 16 is widened to release the pallet 12 and the

conveyors

13 and 14 are operated to print the pallet 12 on the substrate. Unload from the device. When the substrate positioning plate 55 is mounted on the mounting table 57, if the fitting hole 59 of the substrate positioning plate 55 is displaced from the fixing pin 58 of the mounting table 57, the XY moving mechanism 22 is operated. Then, the position of the substrate positioning plate 55 is adjusted in the X, Y, and θ directions to correct the positional displacement of the substrate positioning plate 55 in the X, Y, and θ directions, and then the substrate positioning plate 55 is lowered to position the substrate. The fitting hole 59 of the plate 55 is fitted to the fixing pin 58 of the mounting table 57.

According to the embodiment described above, an XY moving mechanism is provided as means for moving each individual substrate 11 in an oblique direction with respect to each positioning hole 56 when positioning the plurality of individual substrates 11 placed on the pallet 12. 22 is used, there is no need to newly provide a drive mechanism dedicated to positioning the individual substrate 11. In addition, if the large circuit boards 71 are put into the

conveyors

13 and 14 one by one instead of the pallet 12 on which the plurality of individual boards 11 are placed, the large circuit boards 71 can be printed one by one. Thus, it is possible to cope with both batch printing of a plurality of individual substrates 11 and normal printing of each circuit board 71, and cost reduction and versatility can be realized.

In addition, the plurality of suction nozzles 20 are supported by the nozzle support base 31 so as to be rotatable in the θ direction and displaceable in the X and Y directions, respectively, and the suction nozzles 20 are moved toward the center of the nozzle support base 31 by the

magnets

43 and 44. Since it is configured to be urged, the two side portions of each individual substrate 11 are surely connected to the two side portions of each positioning hole 56 even if the deviation amounts of the individual substrate 11 in the X, Y, and θ directions vary. It is possible to make contact with each other, and it is possible to accurately correct the deviation amounts of the individual substrates 11 in the X, Y, and θ directions.

In addition, this invention is not limited to the said Example, For example, it cannot be overemphasized that various changes can be implemented within the range which does not deviate from a summary, for example, you may change the support structure of the suction nozzle 20 suitably.

DESCRIPTION OF SYMBOLS 11 ... Individual board | substrate, 12 ... Pallet, 13, 14 ... Conveyor, 15 ... Fixed side plate, 16 ... Movable side plate, 17 ... Substrate mounting space, 18 ... Opening part, 20 ... Suction nozzle, 21 ... Lifting Table, 22 ... XY movement mechanism, 23 ... X-axis feed screw mechanism, 24, 25 ... Y-axis feed screw mechanism, 31 ... Nozzle support base, 32 ... Magnet, 33 ... Positioning hole, 34 ... Nozzle positioning plate, 36 ... Hard sphere , 37, 38 ... ball receiving plate, 40 ... elastic body, 43, 44 ... magnet, 48 ... negative pressure introduction space, 51 ... nozzle removal auxiliary plate, 55 ... substrate positioning plate, 56 ... positioning hole, 57 ... mounting table, 58 ... fixing pin, 59 ... fitting hole, 61 and 62 ... suction block (plate suction part), 65 ... printing mask, 66 ... squeegee, 67 ... camera, 68 ... Zum

Claims

A substrate printing apparatus for carrying a pallet on which a plurality of individual substrates are placed to a work position below a printing mask by a conveyor, positioning the plurality of individual substrates, and printing a predetermined pattern on each individual substrate in a batch. In
A plurality of substrates that are respectively arranged below the substrate placement spaces of the pallet carried into the work position and suck the individual substrates in the substrate placement spaces through openings formed in the substrate placement spaces. A suction nozzle;
A substrate positioning plate which is disposed above the pallet carried into the work position and in which a plurality of rectangular positioning holes for loosely positioning a plurality of individual substrates placed on the pallet are formed;
A lifting mechanism that integrally lifts and lowers the plurality of suction nozzles;
An XY movement mechanism for moving the plurality of suction nozzles in the X direction and the Y direction integrally with the lifting mechanism;
Control means for controlling the lifting mechanism and the XY moving mechanism,
In the positioning operation of each individual substrate, the control means operates the elevating mechanism to raise the plurality of suction nozzles and causes each suction nozzle to pass through an opening formed in each substrate placement space of the pallet. With the individual substrates being adsorbed, the individual substrates are raised to the height position of the substrate positioning plate, and the individual substrates are loosely inserted into the positioning holes, so that the height of the upper surface of the individual substrates is increased. After stopping in a state where it matches the height of the upper surface of the substrate positioning plate, the XY moving mechanism is operated to move the suction nozzles in the oblique direction with respect to the positioning holes, thereby positioning the positioning Control is performed such that each individual substrate in the hole is moved in the oblique direction so that the two sides of each individual substrate abut against the two sides of each positioning hole. Substrate printing apparatus that.
The plurality of suction nozzles are respectively supported by a nozzle support base so as to be rotatable and displaceable in the X and Y directions, and are urged by a biasing means toward the center of the nozzle support base. The substrate printing apparatus according to claim 1.
A plate rest for placing the substrate positioning plate in a constrained state so as not to move in the X and Y directions;
A plate suction portion that is lifted and lowered by the lifting mechanism in a state of sucking the substrate positioning plate;
A camera for imaging a recognition mark on the upper surface of the substrate positioning plate or a recognition mark on the individual substrate and a recognition mark on the lower surface of the printing mask;
After the positioning operation of each individual substrate is completed, the control means processes a captured image of the camera to measure a positional deviation amount of the substrate positioning plate with respect to the printing mask, and moves the substrate positioning plate to the plate adsorption unit. In the state of being picked up by the lift mechanism and lifted from the plate table by the lifting mechanism, the positional displacement amount of the substrate positioning plate is corrected by the XY movement mechanism, and then a predetermined pattern is collectively applied to the individual substrates. The substrate printing apparatus according to claim 1, wherein printing is performed.
The XY moving mechanism is configured such that at least one of the X axis and the Y axis is configured as two axes, and the two axes are driven in directions opposite to each other to correct a shift in the horizontal rotation direction of the substrate positioning plate. The board printing apparatus according to claim 1, wherein the board printing apparatus is provided.