JP2007271469A - Inspection tool and method for fixing probe therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection tool and a method for fixing a probe to it, allowing facilitation of probe replacement and adaptation to the miniaturization of inspection points of an object to be inspected. <P>SOLUTION: The inspection tool 100 comprises a probe-holding tool 50 which fixes primary plates 10, thorough which probe insertion holes 11 are formed at the same positions as those of secondary plates 20 and the secondary plates 20 by holding frames 30, and a probe-fixing plate 60, through which probe insertion holes 11 are formed at the same positions as those of the secondary plates 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an inspection jig used for electrical inspection of printed wiring boards and various semiconductor package substrates, and an inspection jig using a probe and a method for fixing the probe to the inspection jig.

  One of the electrical inspection jigs for printed wiring boards and various semiconductor package substrates uses a rigid probe.

An inspection method for performing electrical inspection of printed wiring boards and various semiconductor package substrates using an inspection jig using a rigid probe will be described.
FIG. 4 is a schematic configuration diagram of an inspection jig 200 showing an example of an inspection jig using a rigid probe.
First, the rigid probe 71 is inserted into the probe through hole 11 formed at a predetermined position of the primary plate 10 and the secondary plate 20 of the inspection jig 200 (see FIG. 5).

  A relay plate 81 having a terminal 82 is provided on one side of the rigid probe 71, and a cable 83 extends from one side of the terminal 82 and is connected to a measuring instrument (not shown). On the other side of the rigid probe 71, there is a test object 90. Here, the rigid probe 71 and the inspection point 91 of the test object 90 are not in contact with each other (see FIG. 6).

  From this state, the inspection jig 200 is gradually brought closer to the inspection object 90, and the inspection point 91 of the inspection object 90 and the tip of the rigid probe 71 are brought into contact with each other.

  Further, when the inspection jig 200 is moved closer to the inspection object 90, the rigid probe 71 is bent as shown in FIG. 7, and the pressure of the rigid probe 71 against the inspection point 91 is generated. Thereby, an electrically sufficiently stable contact state can be obtained between the two.

  The relay plate 81 not only performs electrical relay, but also serves as a receiving plate for generating pressure on the inspection point 91 by bending the rigid probe 71.

  In this state, a voltage is supplied from a power supply (not shown) to a predetermined rigid probe 71, and a conduction state at that time is measured by a measuring instrument (not shown), thereby inspecting a conduction state of a predetermined wiring of the object to be inspected. Can do.

However, the inspection jig described above has some problems due to having the relay plate 81.
As the structure of the relay plate 81, for example, a hole formed by drilling a predetermined position of a glass epoxy base material with a drill or the like and filling the hole with metal or press-fitting a metal member is used.

  One of the problems is the processing cost that occurs to produce the relay plate 81. Although the processing cost depends on the material and processing method to be selected, it costs about tens of thousands to tens of thousands of yen, which is a problem that occurs for each inspection jig.

  The second problem is the processing time that occurs to produce the relay plate 81. Aside from the fact that it can be processed by itself, it takes about 2 to 3 days to a week when using a processor, and it becomes a problem when dealing with products with short delivery times.

  The third problem is a limitation on the miniaturization of the inspection point 91. As can be seen from FIG. 7, in order to make the terminal 82 and the rigid probe 71 come into contact with each other reliably, the diameter of the terminal 82 must be slightly larger than the diameter of the through hole 11 for the probe. Therefore, the minimum value of the pitch of the inspection point 91 is actually determined by the diameter of the terminal 82.

  In order to solve the above problem, an inspection jig using a long rigid probe (hereinafter referred to as LR probe) has been proposed (for example, see Patent Document 1).

Hereinafter, an inspection method for performing an electrical inspection of a printed wiring board and various semiconductor package substrates using an inspection jig using an LR probe will be described.
FIG. 8 shows an inspection jig 300 in which the LR probe 72 is inserted into the probe through hole 11 of the secondary plate 20 and fixed with the adhesive 41.

  The side of the LR probe 72 that does not face the object to be inspected 90 serves as a cable, is connected to a connector 92, and is connected to a measuring instrument (not shown) by a flat cable 93 (see FIG. 9).

  On the other side of the LR probe 72, there is a test object 90. In this state, the LR probe 72 and the inspection point 91 of the test object 90 are not yet in contact (see FIG. 10).

  Further, when the inspection jig 300 is moved closer to the inspection object 90, the LR probe 72 is bent as shown in FIG. 11, and the pressure of the LR probe 72 against the inspection point 91 is generated. Thereby, an electrically sufficiently stable contact state can be obtained between the two.

  With such a structure, the above-described problems are improved, and the probability of occurrence of contact failure is greatly reduced by eliminating the contact point between the rigid probe 71 and the terminal 82.

  In the case of the inspection jig 300 using the LR probe 72, replacement of the LR probe 72 becomes a problem. As shown in FIG. 8, the LR probe 72 is fixed to the probe through hole 11 of the secondary plate 20 with an adhesive 41.

By using a thermoplastic adhesive, it is possible to remove the damaged LR probe 72 by melting the adhesive as necessary even after it is fixed once.
However, when the pitch of the LR probes 72 is small, not only the LR probes 72 that need to be replaced, but also the LR probes 72 around the LR probes 72 are removed and must be reassembled. Therefore, there is a problem that the inspection points cannot be miniaturized.
JP-A-10-170582

  SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an inspection jig capable of easily exchanging a rigid probe and corresponding to miniaturization of an inspection point of an object to be inspected, and a method of fixing the rigid probe to the inspection jig The purpose is to provide.

In order to solve the above-mentioned problems in the present invention, in claim 1, in the inspection jig for inspecting the electrical quality of the wiring of the printed wiring board and various semiconductor package substrates, at least the probe through-holes at the same position 11 is formed of a probe holding jig 50 in which a primary plate 10 and a secondary plate 20 in which the 11 is formed are fixed by a holding frame 30, and a probe fixing plate 60 in which a probe through hole 11 is formed at the same position. The inspection jig is characterized by having

  Moreover, in Claim 2, it is an inspection jig of Claim 1, Comprising: The probe through-hole 11 was formed in the same position as the secondary plate 20 on the secondary plate 20 of the said probe holding jig 50. After the fixing plate 60 is placed and the probe is inserted into the through hole 11 for each probe of the primary plate 10, the secondary plate 20, and the probe fixing plate 60, the probe is fixed by moving the probe fixing plate 60. 50, the probe is fixed to the inspection jig.

By using the inspection jig and the probe fixing method of the present invention, the probe such as the rigid probe and the LR probe can be easily exchanged. Therefore, when the probe is damaged, the time until recovery is shortened. Cost reduction is possible.
Further, it is possible to cope with miniaturization of the inspection points of the object to be inspected.

Embodiments of the present invention will be described below.
FIG. 1 is a schematic configuration diagram showing an embodiment of an inspection jig according to the present invention.
As shown in FIG. 1, the inspection jig 100 of the present invention has a probe holding in which a primary plate 10 in which a probe through hole 11 is formed at the same position as the secondary plate 20 and the secondary plate 20 are fixed by a holding frame 30. The jig 50 is composed of a probe fixing plate 60 having a probe through hole 11 formed at the same position as the secondary plate 20.
By adopting such a structure, the probe can be easily set and fixed to the inspection jig, and the inspection jig can cope with the miniaturization of the inspection points of the object to be inspected.

Hereinafter, the method of fixing the probe to the inspection jig 100 will be described by taking a rigid probe as an example, but the same applies to the case of the LR probe.
First, on the secondary plate 20 of the probe holding jig 50 of the inspection jig 100, the probe fixing plate 60 in which the probe through holes 11 are formed at the same position as the secondary plate 20 is placed, and the primary plate 10, the secondary plate 20 and the probe fixing plate 60, the rigid probe 71 is inserted into the through hole 11 for each probe (see FIG. 2).

Furthermore, the rigid probe 71 can be fixed to the probe holding jig 50 by pushing the probe fixing plate 60 laterally (see FIG. 3A).
The pushed probe fixing plate 60 is fixed to the probe holding jig 20 with screws or the like.

  Usually, one probe fixing plate 60 is sufficient. However, when the variation of the diameter of the rigid probe 71 and the diameter of the hole 4 is large, the probe fixing plate 60a is mounted by increasing the number of the probe fixing plate 60 and the probe fixing plate 60 and The rigid probe 71 can be securely fixed by pushing the 60a in different directions (see FIG. 3B).

  The material for the probe fixing plates 60 and 60a is not particularly limited, but naturally, an insulating material is good, and the same material as the secondary plate 20 is preferably selected for the convenience of drilling. The thickness is about 1 mm when the diameter of the rigid probe 71 is 100 μm and the diameter of the probe through hole 11 is 150 μm. Moreover, in order to push it after inserting the rigid probe 71, it is about 2 mm larger than the secondary plate 20.

It is a schematic block diagram which shows one Example of the inspection jig of this invention. It is explanatory drawing which shows the state which has inserted the rigid probe in the test | inspection jig | tool of this invention. (A) is explanatory drawing which shows an example of the state which has pushed the probe fixing plate and fixed the rigid probe to the probe holding jig. (B) is explanatory drawing which shows the other example of the state which has pushed the probe fixing plate and fixed the rigid probe to the probe holding jig. It is a schematic block diagram which shows an example of the conventional inspection jig. It is explanatory drawing which shows the state which has inserted the rigid probe in the conventional test | inspection jig | tool. It is explanatory drawing which shows the state which set the relay plate to the conventional inspection jig. It is explanatory drawing which shows the state which sets the relay plate and to-be-inspected object to the conventional test | inspection jig, and is performing the electrical test | inspection. It is explanatory drawing which shows the state which has set the LR probe to the conventional test | inspection jig with the adhesive agent. It is explanatory drawing which shows the state which connected the LR probe to the connector. It is explanatory drawing which shows the state which set the to-be-inspected object to the inspection jig of the state which connected the LR probe to the connector. It is explanatory drawing which shows the state in which the LR probe is curving and the LR probe is contacting electrically sufficiently stable with respect to the inspection point.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Primary plate 11 ... Probe through-hole 20 ... Secondary plate 30 ... Holding frame 41 ... Adhesive 50 ... Probe holding jig 60, 60a ... Probe fixing plate 71 ... Rigid probe 72 ... ... LR probe 81 ... relay plate 82 ... terminal 83 ... cable 90 ... inspection object 91 ... inspection point 92 ... connector 93 ... flat cable 100, 200, 300 ... inspection jig

Claims (2)

  In an inspection jig for inspecting electrical quality of wiring of a printed wiring board or various semiconductor package substrates, a primary plate (10) and a secondary plate (20) having probe through holes (11) formed at least at the same position ) Is constituted by a probe holding jig (50) fixed by a holding frame (30) and a probe fixing plate (60) in which a probe through hole (11) is formed at the same position. Characteristic inspection jig.   The probe according to claim 1, wherein a probe through hole (11) is formed on the secondary plate (20) of the probe holding jig (50) at the same position as the secondary plate (20). After the fixing plate (60) is placed and the probe is inserted into the probe through holes (11) of the primary plate (10), the secondary plate (20), and the probe fixing plate (60), the probe fixing plate (60) ) Is fixed to the probe holding jig (50), and the probe is fixed to the inspection jig.