JP2007245589A5 - - Google Patents

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Publication number
JP2007245589A5
JP2007245589A5 JP2006073447A JP2006073447A JP2007245589A5 JP 2007245589 A5 JP2007245589 A5 JP 2007245589A5 JP 2006073447 A JP2006073447 A JP 2006073447A JP 2006073447 A JP2006073447 A JP 2006073447A JP 2007245589 A5 JP2007245589 A5 JP 2007245589A5
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JP
Japan
Prior art keywords
forming substrate
head according
liquid ejecting
ejecting head
pressure generating
Prior art date
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Granted
Application number
JP2006073447A
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Japanese (ja)
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JP2007245589A (en
JP4877481B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2006073447A priority Critical patent/JP4877481B2/en
Priority claimed from JP2006073447A external-priority patent/JP4877481B2/en
Publication of JP2007245589A publication Critical patent/JP2007245589A/en
Publication of JP2007245589A5 publication Critical patent/JP2007245589A5/ja
Application granted granted Critical
Publication of JP4877481B2 publication Critical patent/JP4877481B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (7)

ノズル開口に連通する複数の圧力発生室と前記複数の圧力発生室に連通する連通部が形成された流路形成基板と、
前記圧力発生室に圧力変化を生じさせる圧力発生手段と、
前記流路形成基板の一方面側に接着材を介して接合され前記連通部と連通して前記圧力発生室の共通の液体室の一部を構成するリザーバ部が設けられたリザーバ形成基板とを具備し、
前記リザーバ形成基板の前記流路形成基板に接合される接合領域の少なくとも前記リザーバ部の周囲には、金属又は金属酸化物からなる接着層が設けられていることを特徴とする液体噴射ヘッド。
A flow path forming substrate and the communicating portion is formed which communicates the plurality of pressure generating chambers and the plurality of pressure generating chambers communicating with nozzle openings,
A pressure generating means for generating a pressure change in the pressure generating chamber,
Are bonded through an adhesive on one surface of the passage forming substrate, and the reservoir forming substrate reservoir portion constituting a part of the common liquid chamber is provided in the pressure generating chamber communicating with the communicating portion , And
The liquid ejecting head according to claim 1, wherein an adhesive layer made of a metal or a metal oxide is provided at least around the reservoir portion of a joining region of the reservoir forming substrate that is joined to the flow path forming substrate.
前記リザーバ形成基板の表面に酸化シリコンが設けられ
前記接着層は、前記酸化シリコン上に設けられていることを特徴とする請求項1記載の液体噴射ヘッド。
Silicon oxide is provided on the surface of the reservoir forming substrate ,
The liquid ejecting head according to claim 1 , wherein the adhesive layer is provided on the silicon oxide.
前記接着層が、1μm以下の厚さで形成されていることを特徴とする請求項1又は2記載の液体噴射ヘッド。 The liquid ejecting head according to claim 1, wherein the adhesive layer is formed with a thickness of 1 μm or less. 前記接着剤が、エポキシ系接着剤からなることを特徴とする請求項1〜3の何れかに記載の液体噴射ヘッド。 The liquid ejecting head according to claim 1, wherein the adhesive is made of an epoxy adhesive. 前記接着層が、ニッケルクロム、チタン、チタンタングステン及び酸化タンタルから選択される少なくとも一種からなることを特徴とする請求項1〜4の何れかに記載の液体噴射ヘッド。 The liquid ejecting head according to claim 1, wherein the adhesive layer is made of at least one selected from nickel chrome, titanium, titanium tungsten, and tantalum oxide. 前記流路形成基板の前記リザーバ形成基板と接合される接合領域の前記連通部の周囲には、金属層が設けられていると共に、前記金属層上にも前記接着層が設けられていることを特徴とする請求項1〜5の何れかに記載の液体噴射ヘッド。 A metal layer is provided around the communication portion of the bonding region of the flow path forming substrate to be bonded to the reservoir forming substrate, and the adhesive layer is also provided on the metal layer. The liquid jet head according to claim 1, wherein the liquid jet head is a liquid jet head. 請求項1〜6の何れかに記載の液体噴射ヘッドを具備することを特徴とする液体噴射装置。 A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.
JP2006073447A 2006-03-16 2006-03-16 Liquid ejecting head and liquid ejecting apparatus Expired - Fee Related JP4877481B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006073447A JP4877481B2 (en) 2006-03-16 2006-03-16 Liquid ejecting head and liquid ejecting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006073447A JP4877481B2 (en) 2006-03-16 2006-03-16 Liquid ejecting head and liquid ejecting apparatus

Publications (3)

Publication Number Publication Date
JP2007245589A JP2007245589A (en) 2007-09-27
JP2007245589A5 true JP2007245589A5 (en) 2009-04-30
JP4877481B2 JP4877481B2 (en) 2012-02-15

Family

ID=38590365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006073447A Expired - Fee Related JP4877481B2 (en) 2006-03-16 2006-03-16 Liquid ejecting head and liquid ejecting apparatus

Country Status (1)

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JP (1) JP4877481B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8262199B2 (en) 2008-09-30 2012-09-11 Fujifilm Corporation Droplet jetting head, method of manufacturing droplet jetting head, and droplet jetting apparatus equipped with droplet jetting head
JP6024139B2 (en) * 2012-03-22 2016-11-09 株式会社リコー Droplet discharge head, ink cartridge, and image forming apparatus
JP2014073551A (en) * 2012-10-04 2014-04-24 Seiko Epson Corp Electronic apparatus and manufacturing method of the same
JP6252117B2 (en) 2013-11-08 2017-12-27 セイコーエプソン株式会社 Liquid ejecting head and liquid ejecting apparatus
WO2022070334A1 (en) * 2020-09-30 2022-04-07 コニカミノルタ株式会社 Ink-jet head, production method therefor, and image formation device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3582968B2 (en) * 1996-09-30 2004-10-27 株式会社東芝 Thin film magnetic head and magnetic recording device
JP4408582B2 (en) * 2001-03-05 2010-02-03 株式会社リコー Inkjet head and inkjet recording apparatus
JP3888421B2 (en) * 2001-03-09 2007-03-07 セイコーエプソン株式会社 Method for manufacturing ink jet recording head
JP2005153369A (en) * 2003-11-27 2005-06-16 Seiko Epson Corp Liquid emission head, liquid emission device and liquid emission head manufacturing method
JP2006044083A (en) * 2004-08-05 2006-02-16 Seiko Epson Corp Liquid jet head and manufacturing method therefor and

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