JP2007245411A - Parametric processing apparatus and parametric processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily form fine grooves on the surface of an article to be processed in a periodic pattern by cutting processing. <P>SOLUTION: This parametric processing apparatus has a turntable 3 capable of holding the article W to be processed and a spindle 7 holding a tool T, which is rotated centering around the axis CL3 parallel to the center-of-rotation axis CL1 of the turntable 3 and separated from the center-of-rotation axis CL1 by a distance d1 and cuts the article W to be processed at the position separated from the center-of-rotation axis CL3 by a distance d2, and freely moved and positioned in an approaching/separating direction with respect to the turntable 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a parametric processing apparatus and a parametric processing method, and more particularly to forming a groove such as a spirograph pattern on a workpiece.

  In recent years, various industrial products have been researched and developed to control surface functions with fine surface irregularities.

  For example, attempts have been made to form fine grooves having a periodic pattern such as a spirograph pattern on the surface of the component, reduce the frictional force between the components, and improve the retention of the lubricant.

  Also, for example, attempts have been made to form parts having functions such as water repellency and water immersion by forming fine grooves with a periodic pattern on the surface of a mold.

  In addition, for example, it is conceivable to form microchips by forming fine grooves with a periodic pattern on the surface of a hard and brittle material such as glass. A micro-analysis chip (microchip) is a chip in which a predetermined function is integrated on a small chip using a microfabrication technique in the semiconductor field, for example, a chip in which a complex chemical system such as a chemical reaction is integrated. It is. By using a microchip, it is possible to reduce the amount of reagents and samples when performing a test such as a chemical reaction.

  As a method for forming fine grooves with periodic patterns in parts, chemical processing and thin film technology are known. On the other hand, in order to efficiently generate grooves with various patterns, cutting can be performed. A method of generating a fine groove having a periodic pattern can be considered.

  By the way, in the method of forming a fine groove of a periodic pattern such as a spirograph pattern on the surface of a part using the cutting process, NC data is enormous, the processing and interpolation are complicated, and the periodic pattern There is a problem that it is difficult to form a fine groove.

  The present invention has been made in view of the above problems, and provides a parametric processing apparatus and a parametric processing method capable of easily generating fine grooves with a periodic pattern on the surface of a workpiece by cutting. The purpose is to do.

  The invention according to claim 1 is capable of holding a plate-like workpiece on a plane, and is a rotary table that rotates about an axis orthogonal to the plane and a rotation center axis of the rotary table. Rotating at a higher rotational speed than the rotary table with a second rotation center axis that is parallel to the first rotation center axis and separated from the first rotation center axis by a predetermined distance. And holding a tool for cutting the workpiece at a position away from the second rotation center axis by a second predetermined distance, and moving in a direction approaching or moving away from the rotary table. A parametric processing apparatus having a positionable spindle.

  The invention according to claim 2 is a parametric processing method in which a groove is formed in a plane in the thickness direction of a plate-shaped workpiece by cutting using a tool, in the thickness direction of the workpiece. The workpiece is rotated at a first predetermined rotation speed with the first rotation center axis extending in the direction of rotation as the rotation center, and parallel to the first rotation center axis and from the first rotation center axis. A second rotation center axis is provided at a position separated by a first predetermined distance, the tool is disposed at a position separated by a second predetermined distance from the second rotation center axis, and the second rotation is performed. This is a parametric processing method in which the cutting is performed by rotating the tool at a second predetermined rotational speed faster than the first rotational speed with a central axis as a rotational center.

  According to a third aspect of the present invention, there is provided a linear motion table that is linearly movable on a base member, and the linear motion table rotates about an axis that is orthogonal to the moving direction of the linear motion table. It is provided freely, has a plane orthogonal to the rotation center axis, holds a rotary table capable of holding a plate-like hard and brittle material on this plane, and an end mill for processing the hard and brittle material, It is a parametric processing device having a spindle that can be moved and positioned in a direction approaching and moving away from the rotary table.

  According to a fourth aspect of the present invention, in the parametric processing apparatus according to the third aspect, the rotation center axis of the end mill is inclined with respect to the plane of the rotary table.

  The invention according to claim 5 is a parametric processing method in which a groove is formed by performing a cutting process using an end mill on a plane in the thickness direction of a plate-shaped hard and brittle material, in the thickness direction of the hard and brittle material. The hard brittle material is rotated at a first predetermined rotation speed with the first rotation center axis extending in the direction of rotation as the rotation center, and the hard brittle material is perpendicular to the extending direction of the first rotation center axis. This is a parametric processing method in which a spirographic pattern groove is formed in a plane in the thickness direction of the hard and brittle material by rotating the end mill at a high speed while linearly moving.

  According to the present invention, there is an effect that a fine groove having a periodic pattern can be easily generated on the surface of a workpiece by cutting.

[First Embodiment]
FIG. 1 is a diagram showing an outline of a parametric processing apparatus 1 according to the first embodiment of the present invention.

  The parametric processing apparatus 1 includes a base member (not shown). The base member is provided with a turntable 3.

  The turntable 3 can hold a workpiece (metal or glass) W having a plate shape (for example, a disc shape or a rectangular plate shape) on a circular plane 5 and is illustrated in the figure. Under the control of the control device, it is rotated by a rotary table actuator (not shown). The rotation center axis CL1 of the turntable 3 is orthogonal to the plane 5 and passes through the center of the plane 5.

  The base member is provided with a spindle 7. The spindle 7 can hold a tool T for cutting the workpiece W. Further, the spindle 7 is located at a position away from the plane 5 of the turntable 3 and is centered on an axis CL3 that is parallel to the rotation center axis CL1 of the turntable 3 and is separated from the rotation center axis CL1 by a predetermined distance d1. Thus, under the control of a control device (not shown), the spindle actuator (not shown) is rotated at a rotational speed (angular speed) faster than that of the rotary table 3.

  The tool T is held by the spindle 7 at a position separated from the rotation center axis CL3 of the spindle 7 by a predetermined distance d2. More precisely, the tip of the cutting edge of the tool T is separated from the rotation center axis CL3 of the spindle 7 by a predetermined distance d2 in the extending direction of the plane 5 of the turntable 3. The spindle 7 can be moved and positioned in a direction in which the spindle 7 approaches and separates from the rotary table 3 by an actuator (not shown) under the control of a control device (not shown).

  Under the control of the control device, the rotational speed ω1 of the turntable 3 and the rotational speed ω2 of the spindle 7 are appropriately changed, and the distance d1 and the distance d2 are changed by a mechanism (not shown). Can be maintained.

  The form of the groove formed in the workpiece W by the parametric processing apparatus 1 will be described.

  FIG. 2 is a diagram showing one form of grooves (spirographic pattern grooves) 9 formed in the workpiece W by the parametric processing apparatus 1. Such a groove 9 is formed when the distance d1 and the distance d2 are equal to each other and the rotational speed ω2 of the spindle 7 is larger than the rotational speed ω1 of the rotary table 3.

  It is also possible to form the groove 11 as shown in FIG. 3 by controlling each actuator under the control of the control device. When the distance d1 is larger than the distance d2, the groove 13 as shown in FIG. 4A can be obtained. When the distance d1 is smaller than the distance d2, the groove 13 is shown in FIG. Such a groove 15 can be obtained.

  When the grooves shown in FIG. 2 and FIG. 4 are represented by xy coordinate axes, parameters of “x = d1 cos ω1t + d2 cos ω2t” and “y = d1 sin ω1t + d2sin ω2t” can be displayed. “T” indicates time, and ω1> ω2.

[Second Embodiment]
FIG. 5 is a diagram showing an outline of the parametric processing apparatus 21 according to the second embodiment of the present invention. In addition, FIG.5 (b) is a figure which shows the V arrow in Fig.5 (a).

  The parametric processing device 21 includes a base member 23. The base member 23 is provided with a linear motion table 25. The linear motion table 25 is directed in the direction of arrow AR1 in FIG. 5A by a linear motion table actuator (not shown) under the control of a control device (not shown). It can be reciprocated linearly.

  The linear motion table 25 is provided with a rotary table 27. The turntable 27 is rotated by a turntable actuator (not shown) under the control of a control device (not shown). The rotation center axis CL <b> 5 of the rotary table 27 is orthogonal to the moving direction of the linear motion table 25 and passes through the center of the rotary table 27. The turntable 27 includes a plane 29 that is orthogonal to the rotation center axis CL5, and can hold a plate-like glass W on the plane 29. The glass W is held such that one surface in the thickness direction is in contact with the flat surface 29.

  The parametric processing device 21 includes a spindle 31. The spindle 31 is supported by the base member 23 and holds an end mill (for example, a ball end mill) 33 for cutting the glass W. The held end mill 33 is rotated at high speed by an actuator around the axis CL7 of the end mill 33 in order to perform cutting. Further, the spindle 31 can be moved and positioned in a direction approaching / separating from the rotary table 27 (extension direction of the rotation center axis CL5) by a spindle actuator (not shown) under the control of a control device (not shown). .

  And by controlling each said actuator suitably under control of the said control apparatus, and cutting the glass W using the end mill 33, it is the plane (the surface which is contacting the rotary table 27). A periodic fine pattern such as a spirograph pattern or an inner cycloid pattern can be formed on the opposite surface.

In this case, when the grooves shown in FIGS. 2 and 4 are expressed by xy coordinate axes, “x = (− 1) ^{int (vt / 2a)} vtcosωt”, “y = (− 1) ^{int (vt / 2a)} vtsinωt”. Parameter display is possible. “Int” is a function for obtaining an integer not exceeding a specified numerical value, “v” indicates the moving speed of the linear motion table 25, “a” indicates the stroke of the linear motion table 25, and “t” “Represents time, and“ ω ”represents the rotational speed of the rotary table 27.

  The control device moves and positions the spindle 31 to a predetermined position so that a groove having a predetermined depth is formed by the end mill 33.

  By the way, the rotation center axis CL7 of the end mill 33 is inclined with respect to the plane 29 of the turntable 27. When the glass W is processed by the end mill 33, the surface (cutting edge surface) 35 formed by the rotation center axis CL7 of the end mill 33 and the cutting edge of the cutting edge of the end mill 33 formed while rotating. An intersection point 37 (a portion appearing in an arc shape in FIG. 6) exists at a position away from the surface of the glass W outside the glass W.

  That is, the rotation center axis CL7 of the end mill 33 at the time of cutting is inclined obliquely with respect to the normal line CL9 (see FIG. 6) of the surface of the glass W at the portion being cut, and the intersection point 37 is a groove. It exists in a position that does not touch.

  In FIG. 5B, the rotation center axis CL5 of the rotary table 27 appears to be located on the extension line of the rotation center axis CL7 of the end mill 33. In FIG. The axis CL7 may be offset by a predetermined distance upward or downward in FIG.

  By the way, when the end mill 33 is cut under the control of the control device, the cutting amount (cutting width) per blade of the end mill 33 at the portion where the surface of the groove is formed is ductile to the glass W. The value is such that the material can be cut into a thickness (a value at which brittle damage does not occur; for example, 1 μm or less).

  More specifically, the end mill 33 is rotated at a high speed in order to obtain a predetermined cutting speed, and at least a part of the cutting edge of the end mill 33 has a predetermined depth on the surface of the glass W (this depth is 1 μm or more). For example, it may be about 20 μm.) A groove that is bitten (see FIG. 6), moves the end mill 33 relative to the glass W at a predetermined speed, and extends at a predetermined width and a predetermined depth. Form on glass W.

  At this time, the cutting amount per blade of the end mill 33 in the vicinity (surface A and portion B in FIG. 7) of the groove surface (surface recessed from the surface before processing) cuts the glass W in a ductile manner. It is possible value.

  That is, the cut amount per blade obtained by the relative movement of the end mill 33 in the extending direction of the groove, and the cut per blade at the biting portion A and the detachment portion B of the end mill 33 on the glass W. The amount is a value that enables the glass W to be cut in a ductile manner.

  Further, ductile cutting is performed not only on the upper side of the groove but also on the biting part and the separation part on the bottom side in the depth direction of the groove.

  It should be noted that the cut amount per blade of the end mill 33 at the portion where the surface of the groove is not formed may be a cut amount that causes brittle damage.

  For example, at the surface portion (the portion of the surface of the glass W before the groove is formed) C in the feed direction (groove extending direction) of the end mill 33, one edge of the end mill 33 is more than the biting portion A and the separation portion B. There is a risk that brittle damage may occur due to an increase in the amount of per cut. However, even if brittle damage occurs, the generated part is later cut by the biting part A and the detachment part B, and is not cut off. Therefore, the shape of the groove surface is not adversely affected. .

  The cutting amount per blade is the amount per rotation of the end mill 33 when there is one cutting blade of the end mill 33, but the cutting blade of the end mill 33 is n (an integer of 2 or more). In the case of a sheet, it is the amount per 1 / n rotation of the end mill 33.

  According to the parametric processing device 21, since the cutting amount per blade of the end mill 33 at the portion where the surface of the groove is formed as described above is a value that can cut the glass in a ductile manner. Without causing brittle damage to W, it is possible to efficiently generate a spirographic pattern groove having a sufficient depth (for example, 20 μm) on the surface of the glass W by a single cut.

  According to the parametric processing apparatuses 1 and 21, it is possible to form a spirographic pattern groove by simply setting parameters such as a rotational speed without using a huge amount of data. Therefore, fine grooves having a periodic pattern can be easily formed on the surface of the glass W by cutting.

  Further, according to the parametric processing apparatus 21, the base member 23 is provided with the linear motion table 25, and the linear motion table 25 is provided with the rotary table 27. Therefore, wiring to the actuator (electric motor) of each table is performed. It is easy to do. Also, wiring to the spindle 31 is easy.

  Further, according to the parametric processing apparatuses 1 and 21, since the intersection 37 between the rotation center axis CL7 of the end mill 33 and the cutting edge surface 35 exists at a place other than a portion to be cut into the glass W by the end mill 33, the end mill The cutting speed of the glass W by 33 does not become “0”, and the groove surface can be made good.

  In the present embodiment, metal and glass have been described as examples. However, grooves may be formed in a hard brittle inorganic material (hard brittle material) such as cemented carbide ceramic or single crystal silicon.

It is a figure which shows the outline | summary of the parametric processing apparatus which concerns on the 1st Embodiment of this invention. It is a figure which shows one form of the groove | channel formed in a workpiece by a parametric processing apparatus. It is a figure which shows one form of the groove | channel formed in a workpiece by a parametric processing apparatus. It is a figure which shows one form of the groove | channel formed in a workpiece by a parametric processing apparatus. It is a figure which shows the outline | summary of the parametric processing apparatus which concerns on the 2nd Embodiment of this invention. It is an enlarged view of the site | part which is cutting glass with an end mill. It is a VII arrow line view in FIG.

Explanation of symbols

1, 21 Parametric processing device 3, 27 Rotary table 7 Spindle 9, 11, 13, 15 Groove 23 Base member 25 Linear motion table 31 Spindle 33 End mill 35 Cutting edge surface 37 Intersection point d1, d2 Distance T Tool W Glass (Workpiece) )

Claims (5)

A rotary table capable of holding a plate-like workpiece on a plane and rotating about an axis orthogonal to the plane;
The rotation center is a second rotation center axis that is parallel to the first rotation center axis that is the rotation center axis of the rotary table and that is separated from the first rotation center axis by a predetermined distance. The rotary table rotates at a higher rotational speed than the rotary table and holds a tool for cutting the workpiece at a position away from the second rotation center axis by a second predetermined distance. A spindle that can be moved and positioned in a direction approaching or moving away from the actuator;
A parametric processing apparatus characterized by comprising: In a parametric processing method for forming a groove by cutting using a tool on a plane in the thickness direction of a plate-shaped workpiece,
The workpiece is rotated at a first predetermined rotation speed around a first rotation center axis extending in the thickness direction of the workpiece, and parallel to the first rotation center axis. A second rotation center axis is provided at a first predetermined distance away from the first rotation center axis, and the tool is placed at a position away from the second rotation center axis by a second predetermined distance. The parametric machining is characterized in that the cutting is performed by rotating the tool at a second predetermined rotation speed faster than the first rotation speed with the second rotation center axis as a rotation center. Method. A linear motion table linearly movable on the base member;
The linear motion table is provided so as to be rotatable about an axis orthogonal to the moving direction of the linear motion table, and includes a plane orthogonal to the rotational central axis. A turntable capable of holding material;
A spindle provided to hold an end mill for processing the hard and brittle material and to be movable and positionable in a direction approaching and moving away from the rotary table;
A parametric processing apparatus characterized by comprising: In the parametric processing apparatus according to claim 3,
A parametric processing apparatus, wherein a rotation center axis of the end mill is inclined with respect to a plane of the rotary table. In the parametric processing method of forming a groove by cutting using an end mill on a plane in the thickness direction of a plate-like hard and brittle material,
The hard brittle material is rotated at a first predetermined rotation speed around the first rotation center axis extending in the thickness direction of the hard brittle material, and the extending direction of the first rotation center axis is A parametric processing method for processing a spirographic pattern on a plane in the thickness direction of the hard and brittle material by rotating the end mill at a high speed while linearly moving the hard and brittle material in an orthogonal direction. .

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