JP2011016175A - Cutting device - Google Patents

Cutting device Download PDF

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Publication number
JP2011016175A
JP2011016175A JP2009160861A JP2009160861A JP2011016175A JP 2011016175 A JP2011016175 A JP 2011016175A JP 2009160861 A JP2009160861 A JP 2009160861A JP 2009160861 A JP2009160861 A JP 2009160861A JP 2011016175 A JP2011016175 A JP 2011016175A
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Prior art keywords
cutting
chuck
cutting blade
dressing board
feed
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JP2009160861A
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Japanese (ja)
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JP5571331B2 (en
Inventor
Hirohiko Kozai
Yuki Nomura
Hideaki Tanaka
Fumio Uchida
文雄 内田
英明 田中
優樹 野村
宏彦 香西
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Disco Abrasive Syst Ltd
株式会社ディスコ
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Abstract

PROBLEM TO BE SOLVED: To provide a cutting device which efficiently dress a first cutting blade and a second cutting blade.SOLUTION: The cutting device includes a means for machining-feeding a chuck table 34, a first cutting means 46a having the first cutting blade 463a mounted on a first rotating spindle 462a arranged movably in an indexing-feeding direction perpendicular thereto, a means for indexing-feeding it, a second cutting means 46b having the second cutting blade 463b mounted on a second rotating spindle 462b arranged on the coaxial line with the first rotating spindle, and a means for indexing-feeding it. The cutting device further includes a first dressing board supporting table 5a arranged adjacent to the chuck table movably to the side of the first cutting means, and a second dressing board supporting table 5b arranged adjacent to the chuck table movably to the side of the second cutting means.

Description

  The present invention includes a cutting device for cutting a workpiece such as a semiconductor wafer, and more specifically, a chuck table for holding the workpiece and a first cutting blade for cutting the wafer held by the chuck table. The present invention relates to a cutting apparatus including a second cutting means including a first cutting means and a second cutting blade.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and circuits such as ICs, LSIs, etc. are partitioned in these partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region where the circuit is formed to manufacture individual semiconductor chips.

  Further, there is a semiconductor wafer in which a test metal pattern called a test element group (Teg) is partially arranged on the surface of a street. When the semiconductor wafer having the Teg disposed on the street is cut with a cutting blade that cuts a semiconductor material such as silicon, the cutting blade is clogged or the semiconductor wafer is damaged.

  In order to solve the above-described problem, the semiconductor material is exposed by forming a first cutting groove that removes Teg disposed on the street by a relatively thick cutting blade, and then a thin thickness of the semiconductor material is exposed. A method of forming a second cutting groove for cutting a semiconductor material along the first cutting groove with a cutting blade is employed.

  As a cutting apparatus for performing such a cutting process, a first cutting means and a second cutting table including a chuck table for holding a workpiece, and a first cutting blade for cutting a wafer held by the chuck table. A cutting apparatus provided with a second cutting means provided with a cutting blade is disclosed in Patent Document 1 below.

  Further, the cutting blade of the cutting device is crushed by continuing the cutting operation, and the cutting ability is reduced. A dressing board is held on a chuck table in order to dress a cutting blade that has been clogged in this way, and a cutting apparatus that periodically cuts the dressing board is disclosed in Patent Document 2 below. Has been.

Japanese Patent No. 3493282 JP 2006-218571 A

  Thus, the cutting of the workpiece must be interrupted when dressing the cutting blade. In particular, in a cutting apparatus including a first cutting means and a second cutting means, a first cutting blade attached to the first cutting means and a second cutting blade attached to the second cutting means. When the types are different, after holding the first dressing board corresponding to the first cutting blade on the chuck table and performing dressing of the first cutting blade, the first dressing board is removed from the chuck table, The second dressing board corresponding to the second cutting blade must be held on the chuck table to perform dressing of the second cutting blade, and there is a problem that productivity is poor.

  The present invention has been made in view of the above-mentioned facts, and the main technical problem thereof is that the first cutting means mounted on the first cutting means in the cutting apparatus including the first cutting means and the second cutting means. Another object of the present invention is to provide a cutting apparatus capable of efficiently performing dressing of the cutting blade and the second cutting blade attached to the second cutting means.

In order to solve the above main technical problem, according to the present invention, a chuck table for holding a workpiece, a processing feed means for moving the chuck table in the processing feed direction, and an indexing feed direction orthogonal to the processing feed means And a first cutting means having a first cutting blade mounted on a first rotary spindle movably disposed along the first cutting means, and a first cutting means for moving the first cutting means in the indexing feed direction. And a second cutting blade mounted on the second rotating spindle disposed on the same axis as the first rotating spindle so as to face the first cutting blade. In a cutting apparatus comprising: cutting means; and second index feed means for moving the second cutting means in the index feed direction;
A first dressing board support table, which is disposed adjacent to the chuck table on the first cutting means side so as to be movable in the machining feed direction together with the chuck table, and holds a dressing board;
A second dressing board support table that is disposed adjacent to the chuck table on the second cutting means side so as to be movable in the processing feed direction together with the chuck table, and holds a dressing board.
A cutting device is provided.

  The first cutting blade and the second cutting blade are of different types, and the first dressing board support table holds a first dressing board corresponding to the first cutting blade, and the second dressing board A second dressing board corresponding to the second cutting blade is held on the support table.

  A cutting apparatus according to the present invention includes a first dressing board support table that is disposed adjacent to the chuck table on the first cutting means side so as to be movable in the processing feed direction together with the chuck table, and a chuck table. Since the second cutting means is provided with a second dressing board support table that is disposed so as to be movable in the machining feed direction together with the chuck table on the second cutting means side, the workpiece is placed on the chuck table. Even if it is held, dressing of the first cutting blade and the second cutting blade can be appropriately performed. Even if the types of the first cutting blade and the second cutting blade are different, the first dressing board support table and the second dressing board support table are suitable for the first cutting blade and the second cutting blade, respectively. The dressing board can be held for dressing.

The principal part perspective view of the cutting device comprised according to this invention. Explanatory drawing which simplifies and shows the 1st spindle unit and the 2nd spindle unit which comprise the cutting apparatus shown in FIG. The top view which shows the relationship between the 1st spindle unit and 2nd spindle unit which comprise the cutting apparatus shown in FIG. 1, and a 1st dressing board support table and a 2nd dressing board support table. The perspective view which shows the state by which the semiconductor wafer as a workpiece cut by the cutting apparatus shown in FIG. 1 was stuck on the surface of the dicing tape with which the cyclic | annular flame | frame was mounted | worn. Explanatory drawing of the process of forming a 1st cutting groove with the 1st cutting blade of the 1st spindle unit which comprises the cutting apparatus shown in FIG. Explanatory drawing of the process of forming a 1st cutting groove with the 1st cutting blade of the 1st spindle unit which comprises the cutting apparatus shown in FIG. Description of the step of forming the first cutting groove and the second cutting groove by the first cutting blade of the first spindle unit and the second cutting blade of the second spindle unit constituting the cutting apparatus shown in FIG. Figure. Explanatory drawing of the process of forming a 1st cutting groove with the 1st cutting blade of the 1st spindle unit which comprises the cutting apparatus shown in FIG. Explanatory drawing of the dressing process which dresses the 1st cutting blade of the 1st spindle unit which comprises the cutting apparatus shown in FIG. 1, and the 2nd cutting blade of a 2nd spindle unit.

  Hereinafter, a preferred embodiment of a cutting device configured according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a perspective view of one embodiment of a cutting device constructed in accordance with the present invention.
The cutting apparatus in the illustrated embodiment includes a stationary base 2, a chuck table mechanism 3 that is disposed on the stationary base 2 and holds a workpiece, and a workpiece held on the chuck table mechanism 3. And a cutting mechanism 4 for cutting.

  The chuck table mechanism 3 includes two guide rails 31, 31 disposed on the stationary base 2 along the machining feed direction (X-axis direction) indicated by an arrow X, and the two guide rails 31, 31. A movable base 32 slidably disposed on the upper surface, and a chuck table 34 for holding a workpiece rotatably supported on a cylindrical support member 33 disposed on the movable base 32. The cover table 35 disposed between the chuck table 34 and the cylindrical support member 33 and the movable base 32 on which the chuck table 34 is disposed are processed along the two guide rails 31, 31. And machining feed means 36 for moving in the feed direction (X-axis direction). The chuck table 34 includes a chuck table main body 341 that is rotatably supported by a cylindrical support member 33, and a suction chuck 342 disposed on the upper surface of the chuck table main body 341. The suction chuck 342 is made of porous ceramics and is connected to suction means (not shown) so that a negative pressure is appropriately applied. Therefore, the workpiece placed on the suction chuck 342 is sucked and held on the suction chuck 342 by operating a suction means (not shown). The chuck table 34 is rotated by a pulse motor (not shown) disposed in a cylindrical support member 33. The chuck table main body 341 of the chuck table 34 configured as described above is provided with a clamp 343 for fixing an annular dicing frame that supports a wafer, which will be described later, via a dicing tape as a workpiece. The cover table 35 is disposed with the chuck table 34 inserted therein, and is fixed to the upper surface of the cylindrical support member 33. The processing feed means 36 is constituted by a known ball screw mechanism.

Next, the cutting mechanism 4 will be described.
The cutting mechanism 4 includes a gate-shaped support base 41 fixed on the stationary base 2. The gate-shaped support base 41 is disposed so as to straddle the cutting work area 60. Two guide rails 411 and 411 arranged in parallel along the index feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the machining feed direction (X-axis direction) are provided on the side wall of the support base 41. In addition, the first base portion 42a and the second base portion 42b are arranged along the two guide rails 411 and 411 so as to be slidable in the indexing feed direction (Y-axis direction). The cutting mechanism 4 in the illustrated embodiment has a first base 42a and a second base 42b for moving in the indexing and feeding direction (Y-axis direction) along the two guide rails 411 and 411, respectively. An index feed unit 43a and a second index feed unit 43b are provided. The first index feed means 43a and the second index feed means 43b are each constituted by a known ball screw mechanism.

  Two guide rails 421a, 421a and 421b, 421b are provided on the first base portion 42a and the second base portion 42b, respectively, along the cutting feed direction (Z-axis direction) indicated by an arrow Z. A first suspension bracket 44a and a second suspension bracket 44b are arranged along the rails 421a, 421a and 421b, 421b so as to be slidable in the cutting feed direction (Z-axis direction), respectively. The first suspension bracket 44a and the second suspension bracket 44b are respectively provided with a first cutting feed means 45a and a second cutting feed means 45b. The first notch feed means 45a and the second notch feed means 45b are each constituted by a well-known ball screw mechanism, and the first suspension bracket 44a and the second suspension bracket 44b are respectively connected to the guide rails 421a and 421a. And 421b and 421b are moved in a cutting feed direction (Z-axis direction) perpendicular to the holding surface which is the upper surface of the chuck table 34.

  A first spindle unit 46a as a first cutting means and a second spindle unit 46b as a second cutting means are mounted on the first suspension bracket 44a and the second suspension bracket 44b. The first spindle unit 46a and the second spindle unit 46b will be described with reference to FIG. The first spindle unit 46a and the second spindle unit 46b include a first spindle housing 461a and a second spindle housing 461b fixed to the first suspension bracket 44a and the second suspension bracket 44b, respectively. A first rotary spindle 462a and a second rotary spindle 462b rotatably supported by one spindle housing 461a and a second spindle housing 461b, respectively, and the first rotary spindle 462a and the second rotary spindle 462b. The first servo motor 464a and the second servo blade 464a and the second cutting spindle 462b, and the first and second cutting blades 463a and 463b mounted on one end of the first rotating spindle 462a and the second rotating spindle 462b, respectively. It is made from one of the servo motor 464b. The first spindle unit 46a and the second spindle unit 46b configured as described above are arranged such that the first cutting blade 463a and the second cutting blade 463b face each other. That is, the first spindle unit 46a and the second spindle unit 46b are arranged in a straight line so that the shaft cores face the indexing feed direction (Y-axis direction). Note that different types of blades are used for the first cutting blade 463a and the second cutting blade 463b, and the first cutting blade 463a is used for removing a metal pattern for testing having a thickness of, for example, about 40 μm. The second cutting blade 463b is formed for cutting with a thickness of about 20 μm, for example.

  1 and 3, the cutting device in the illustrated embodiment is disposed adjacent to the chuck table 34 so as to be movable along with the chuck table 34 in the machining feed direction (X-axis direction). The first dressing board support table 5a and the second dressing board support table 5b are provided. The first dressing board support table 5a is disposed on the moving base 32 on the first spindle unit 46a side as the first cutting means. The second dressing board support table 5b is disposed on the moving base 32 on the second spindle unit 46b side as the second cutting means. The first dressing board support table 5a and the second dressing board support table 5b are respectively provided with a first suction table 51a and a second suction table 51b (see FIG. 1), and this first suction table 51a. The second suction table 51b is connected to suction means (not shown). The first dressing board 6a and the second dressing table 51b of the first dressing board support table 5a and the second dressing board support table 5b configured as described above are respectively provided on the first dressing board 6a and the second dressing board 51b. The first dressing board 6b and the second dressing board 6b are sucked and held on the first suction table 51a and the second suction table 51b by operating a suction means (not shown). The The first dressing board 6a is formed by a grindstone suitable for the first cutting blade 463a, and the second dressing board 6b is suitable for the second cutting blade 463b. It is formed by a grindstone.

The cutting apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
FIG. 4 shows a perspective view of a semiconductor wafer as a workpiece. A semiconductor wafer 10 shown in FIG. 4 has a plurality of streets 101 formed in a lattice pattern on a surface 10a, and devices 102 such as ICs and LSIs are formed in a plurality of regions partitioned by the plurality of streets 101. Yes. Note that a plurality of test metal patterns 104 called test element groups (Teg) for testing the function of the device 102 are partially disposed on the street 101 of the semiconductor wafer 10. The semiconductor wafer 10 is attached to the surface of a dicing tape T mounted on an annular dicing frame F. Thus, the semiconductor wafer 10 supported by the dicing frame F via the dicing tape T is placed on the chuck table 34 by a conveying means (not shown). When the semiconductor wafer 10 is placed on the chuck table 34, the semiconductor wafer 10 is sucked and held on the chuck table 34 via the dicing tape T by operating a suction means (not shown). The dicing frame F that supports the semiconductor wafer 10 via the dicing tape T is fixed by a clamp 343 attached to the chuck table 34.

  As described above, when the semiconductor wafer 10 is sucked and held on the chuck table 34, the processing feed means 36 is operated to move the chuck table 34 holding the semiconductor wafer 10 by suction to the processing region 60. Next, the first indexing feed means 43a and the first cutting feed means 45a are actuated to place the first cutting blade 463a of the first spindle unit 46a on the chuck table 34 as shown in FIG. In the drawing of the street of the semiconductor wafer 10 held by suction, the semiconductor wafer 10 is positioned at a position corresponding to the leftmost street 101 with a predetermined cutting depth HI. At this time, the first cutting blade 463a is positioned above the dicing tape T exposed between the outer peripheral edge of the wafer 10 and the dicing frame F on the extended line of the street 101 as shown by a solid line in FIG. . Further, the second index feeding means 43b is operated to position the second cutting blade 463b of the second spindle unit 46b on the left side of the semiconductor wafer 10 as shown in FIG. Next, the first cutting blade 463a is rotated in the direction indicated by arrow A, and the processing feed means 36 is operated to move the chuck table 34 in the direction perpendicular to the paper surface in FIG. 5A, and in FIG. As shown in FIG. 5B, a cutting groove G1 having a predetermined depth HI is formed along the leftmost street 101 in the drawing of the semiconductor wafer 10 as shown in FIG. Cutting process). Note that the machining feed is performed by the dicing tape T in which the first cutting blade 463a is exposed between the outer peripheral edge of the wafer 10 (right end in FIG. 6) and the dicing frame F as indicated by a two-dot chain line in FIG. The chuck table 34 is moved until it is positioned above. As a result, the test metal pattern (see FIG. 4) formed on the surface of the street 101 is removed. Thus, if the cutting groove G1 is formed along the leftmost street 101 in FIG. 5B of the semiconductor wafer 10, the first cutting unit 45a is operated to operate the first spindle unit 46a. The first cutting blade 463a is moved upward by a predetermined amount, and the first indexing and feeding means 43a is actuated to index and feed rightward in FIG. 5 by an amount corresponding to the street interval. By operating the chuck table 34 in the direction opposite to the direction indicated by the arrow X1 in FIG. 6, the relative position of the first cutting blade 463a and the semiconductor wafer 10 in the direction indicated by the arrow X1 is indicated by a solid line in FIG. Position it at the indicated position. Next, the first cutting feed means 45a is actuated to cut and feed the first cutting blade 463a downward by a predetermined amount, and a predetermined cutting depth HI at a position corresponding to the second street 101 from the left in FIG. Position with. Then, as described above, the first cutting blade 463a is rotated in the direction indicated by the arrow A and the processing feed means 36 is operated to cut and feed the chuck table 34 in the direction indicated by the arrow X1 in FIG. 5, a first cutting groove G1 having a predetermined depth HI is formed along the second street 101 from the left.

  As described above, if the first cutting groove G1 is formed along, for example, two streets by the first cutting blade 463a of the first spindle unit 46a, as shown in FIG. The first cutting blade 463a of one spindle unit 46a is positioned at a position corresponding to the third street 101 from the left in the drawing of the semiconductor wafer 10 with a predetermined cutting depth HI, and the second index feed means 43b and the second The position of the second cutting blade 463b of the second spindle unit 46b corresponding to the street 101 in which the leftmost first cutting groove G1 is formed in the drawing of the semiconductor wafer 10 by operating the second cutting feed means 45b. Is positioned with a cutting depth H2 reaching the dicing tape 12. Therefore, the second cutting blade 463b is positioned at the center position in the width direction of the first cutting groove G1 formed by the first cutting blade 463a as described above. At this time, the second cutting blade 463b is positioned on the dicing tape T exposed between the outer peripheral edge of the wafer 10 and the dicing frame F on the extended line of the street 101 as shown by a solid line in FIG. . As described above, the first cutting blade 463a is located above the dicing tape T exposed between the outer peripheral edge of the wafer 10 and the dicing frame F on the extended line of the street 101 as indicated by a solid line in FIG. Positioned on. Next, the first cutting blade 463a is rotated in the direction indicated by arrow A in FIG. 6 and the second cutting blade 463b is rotated in the direction indicated by arrow B in FIG. The table 34 is processed and fed in the direction perpendicular to the paper surface in FIG. 7A, and in the direction indicated by the arrow X1 in FIG. As a result, as shown in FIG. 7B, the depth H3 from the bottom of the first cutting groove G1 along the first cutting groove G1 formed in the leftmost street 101 in the drawing of the semiconductor wafer 10 is shown. The second cutting groove G2 is formed (second cutting step), and the first cutting groove G1 having a predetermined depth HI is formed along the third street 101 from the left in the drawing. Note that the cutting feed is performed so that the first cutting blade 463a is indicated by a two-dot chain line in FIG. 6 and the second cutting blade 463b is indicated by a two-dot chain line in FIG. The chuck table 34 is moved to a position reaching the dicing tape T exposed between the right end in FIGS. 6 and 8 and the dicing frame F. By repeating the above operation, the first cutting groove G 1 and the second cutting groove G 2 are formed along the street 101 formed in a predetermined direction of the semiconductor wafer 10, and the semiconductor wafer 10 is cut along the street 101. Is done.

  If the above-described cutting operation is repeated and the first cutting groove G1 and the second cutting groove G2 are formed along the street 101 formed in a predetermined direction of the semiconductor wafer 10, the semiconductor wafer 10 is sucked and held. The first cutting is performed along the street 101 formed in the direction orthogonal to the predetermined direction formed on the semiconductor wafer 10 by rotating the suction chuck 34 90 degrees and performing the same cutting operation as described above. A groove G1 and a second cutting groove G2 are formed. In this way, the first cutting groove G1 and the second cutting groove G2 are formed along the street 101 formed in a predetermined direction on the semiconductor wafer 10 and the street 101 formed in a direction orthogonal to the predetermined direction. Thus, the semiconductor wafer 10 is divided into individual devices. In addition, since the device divided | segmented separately is affixed on the dicing tape T, it does not fall apart and the form of the semiconductor wafer 10 is maintained.

  If the above-described cutting operation is continuously performed, the first cutting blade 463a and the second cutting blade 463b are crushed and the cutting ability is reduced. Therefore, if the above-described cutting operation is performed on the predetermined number of semiconductor wafers 10, a dressing process for dressing the first cutting blade 463a and the second cutting blade 463b is performed. That is, by operating the processing feed means 36, the first dressing board 6a held on the first dressing board support table 5a and the second dressing board 6b held on the second dressing board support table 5b are illustrated. As shown in FIG. Next, the first index feed means 43a is operated to position the first cutting blade 463a of the first spindle unit 46a at a position corresponding to the first dressing board 6a, and the second index feed means 43b is set. It operates to position the second cutting blade 463b of the second spindle unit 46b at a position corresponding to the second dressing board 6b. Then, by operating the first cutting feed means 45a and the second cutting feed means 45b, the first cutting blade 463a and the second cutting blade 463b are moved to the first dressing board 6a and the second dressing board 6b. It is positioned at a predetermined depth of cut from the surface. Next, the first cutting blade 463a and the second cutting blade 463b are rotated in the direction indicated by the arrow A and the direction indicated by the arrow B, respectively, and the processing feed means 36 is operated to operate the first dressing board support table 5a. The first dressing board 6a and the second dressing board 6b held by the second dressing board 6b are moved in the direction indicated by the arrow X1. Then, as shown in FIG. 9 (b), the first dressing board 6a and the second dressing board 6b move until they pass through the first cutting blade 463a and the second cutting blade 463b, respectively. The first cutting blade 463a and the second cutting blade 463b are sharpened by cutting the first dressing board 6a and the second dressing board 6b.

  As described above, the cutting apparatus in the illustrated embodiment is disposed adjacent to the chuck table 34 so as to be movable in the processing feed direction (X-axis direction) together with the chuck table 34 and holds the first dressing board 6a. Since the dressing board support table 5a and the second dressing board support table 5b holding the second dressing board 6b are provided, the first cutting blade 463a can be used even if the workpiece is held on the chuck table 34. And the dressing of the 2nd cutting blade 463b can be implemented suitably. Even when the types of the first cutting blade 463a and the second cutting blade 463b are different, the first cutting blade 463a and the second cutting blade are added to the first dressing board support table 5a and the second dressing board 6b. It is possible to perform dressing while holding dressing boards suitable for 463b.

2: stationary base 3: chuck table mechanism 32: moving base 34: chuck table 36: machining feed means 4: cutting mechanism 42a: first base 42b: second base 43a: first index feed means 43b: Second index feed means 44a: first suspension bracket 44b: second suspension bracket 45a: first cut feed means 45b: second cut feed means 46a: first spindle unit 46b: second spindle unit 462a: first rotating spindle 462b: second rotating spindle 463a: first cutting blade 463b: second cutting blade 5a: first dressing board support table 5b: second dressing board support table 6a: first Dressing board 6b: second dressing board

Claims (2)

  1. A chuck table for holding a workpiece, a machining feed means for moving the chuck table in the machining feed direction, and a first rotating spindle movably disposed along an index feed direction orthogonal to the machining feed means A first cutting means provided with a first cutting blade mounted on the first cutting means; a first index feeding means for moving the first cutting means in the index feeding direction; and the same axis as the first rotating spindle A second cutting means provided with a second cutting blade mounted on a second rotary spindle disposed opposite to the first cutting blade, and the second cutting means in the indexing feed direction. A cutting device comprising: a second indexing and feeding means for moving;
    A first dressing board support table, which is disposed adjacent to the chuck table on the first cutting means side so as to be movable in the machining feed direction together with the chuck table, and holds a dressing board;
    A second dressing board support table that is disposed adjacent to the chuck table on the second cutting means side so as to be movable in the processing feed direction together with the chuck table, and holds a dressing board.
    The cutting device characterized by the above-mentioned.
  2.   The first cutting blade and the second cutting blade are of different types, and the first dressing board support table holds the first dressing board corresponding to the first cutting blade, and the second dressing board The cutting device according to claim 1, wherein a second dressing board corresponding to the second cutting blade is held on the board support table.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013082021A (en) * 2011-10-06 2013-05-09 Disco Corp Cutting apparatus
JP2013120794A (en) * 2011-12-06 2013-06-17 Tokyo Seimitsu Co Ltd Dicing device
JP2013202740A (en) * 2012-03-28 2013-10-07 Disco Corp Cutting device
JP2014205223A (en) * 2013-04-15 2014-10-30 株式会社ディスコ Cutting device
KR20190021165A (en) 2017-08-22 2019-03-05 가부시기가이샤 디스코 Dressing board, method of using the same and cutting apparatus

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6144107B2 (en) * 2013-05-09 2017-06-07 株式会社ディスコ Wafer cutting method
CN105751391B (en) * 2015-01-05 2019-11-29 株式会社迪思科 Cutting process and cutting apparatus
JP2016213240A (en) * 2015-04-30 2016-12-15 Towa株式会社 Manufacturing device and manufacturing method
JP6541546B2 (en) * 2015-10-21 2019-07-10 株式会社ディスコ Cutting device
JP6600267B2 (en) * 2016-03-15 2019-10-30 株式会社ディスコ Workpiece cutting method
JP2018122378A (en) * 2017-01-31 2018-08-09 株式会社Kmc Processing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003103462A (en) * 2001-09-27 2003-04-08 Toyoda Mach Works Ltd Truing device in grinder having two wheel spindle stocks
JP2003173986A (en) * 2001-12-04 2003-06-20 Disco Abrasive Syst Ltd Cutting method in 2-spindle cutter
JP2006159334A (en) * 2004-12-06 2006-06-22 Seiko Epson Corp Dicing dressing table structure and dicer
JP2008300556A (en) * 2007-05-30 2008-12-11 Disco Abrasive Syst Ltd Frame clamp

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5445559A (en) * 1993-06-24 1995-08-29 Texas Instruments Incorporated Wafer-like processing after sawing DMDs
JP2000049120A (en) * 1998-07-27 2000-02-18 Disco Abrasive Syst Ltd Cutting device
TW522531B (en) * 2000-10-20 2003-03-01 Matsushita Electric Ind Co Ltd Semiconductor device, method of manufacturing the device and mehtod of mounting the device
US6561177B2 (en) * 2000-12-14 2003-05-13 Micron Technology, Inc. Wafer dicing blade consisting of multiple layers
US6756562B1 (en) * 2003-01-10 2004-06-29 Kabushiki Kaisha Toshiba Semiconductor wafer dividing apparatus and semiconductor device manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003103462A (en) * 2001-09-27 2003-04-08 Toyoda Mach Works Ltd Truing device in grinder having two wheel spindle stocks
JP2003173986A (en) * 2001-12-04 2003-06-20 Disco Abrasive Syst Ltd Cutting method in 2-spindle cutter
JP2006159334A (en) * 2004-12-06 2006-06-22 Seiko Epson Corp Dicing dressing table structure and dicer
JP2008300556A (en) * 2007-05-30 2008-12-11 Disco Abrasive Syst Ltd Frame clamp

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013082021A (en) * 2011-10-06 2013-05-09 Disco Corp Cutting apparatus
JP2013120794A (en) * 2011-12-06 2013-06-17 Tokyo Seimitsu Co Ltd Dicing device
JP2013202740A (en) * 2012-03-28 2013-10-07 Disco Corp Cutting device
JP2014205223A (en) * 2013-04-15 2014-10-30 株式会社ディスコ Cutting device
KR20190021165A (en) 2017-08-22 2019-03-05 가부시기가이샤 디스코 Dressing board, method of using the same and cutting apparatus

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