JP2007245315A - Grinding method of non-conductive workpiece and device thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a grinding method of a non-conductive workpiece and a device thereof capable of highly accurately grinding the non-conductive workpiece with a grinding wheel. <P>SOLUTION: In the grinding method of the non-conductive workpiece for grinding the non-conductive workpiece W on a table 19 with the grinding wheel 15, a conductive simulated body 21 is mounted on the non-conductive workpiece, the grinding wheel having at least electrical conductivity is lowered to approach the conductive simulated body, and the conduction due to a contact between the conductive simulated body and the grinding wheel is detected. A conductive detecting position by the conduction is detected as a workpiece grinding start position on which the amount of a thickness of the conductive simulated body is added. The workpiece is raised, returned to a stand-by position, and separated from the conductive simulated body. After the conductive simulated body is taken out from the non-conductive workpiece, the grinding wheel is lowered from the stand-by position to the workpiece grinding start position to start the grinding of the non-conductive workpiece. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a grinding method and apparatus for a non-conductive workpiece useful for grinding a non-conductive workpiece such as glass, ceramic, and stone with a grindstone.

2. Description of the Related Art Conventionally, a grinding machine that performs grinding on a workpiece as a workpiece by moving a grinding wheel in a vertical direction while rotating the grinding wheel is well known. As a means for detecting the contact position between the grindstone and the workpiece in this grinder, the electric force applied to the spark and the grindstone shaft at the time of contact between the grindstone surface and the work, or the grindstone surface while moving the grindstone shaft downward There is known a method for detecting an electrical load applied to a feed motor generated when pressing against a workpiece. None of these detection methods are safe and stable detection methods.
Furthermore, as a means for detecting the contact position between the grindstone and the workpiece, a method is also known in which the conduction between the grindstone and the workpiece is detected, as is known, for example, in Patent Document 1.
By the way, in the detection method of detecting the contact position by detecting the conduction between the conventional grindstone and the workpiece described above, the workpiece, that is, the workpiece is limited to a conductive member, and the non-conductive workpiece is conductive. It is impossible to detect the contact position by means of high-precision grinding with a grindstone.
In addition, the grinding amount is appropriately set through the operation panel. However, the grinding amount may not be ground according to the set value due to the rigidity of the apparatus or the unevenness, etc. If conditions are added, grinding may not be possible according to the set value. For this reason, each workpiece is taken out of the machine, measured, reground, and brought close to the set value, and often depends on the experience and feeling of the operator. As a result, it is difficult to improve grinding efficiency.
JP 59-166461 A

  The problem to be solved is, firstly, a grinding method for a non-conductive workpiece capable of grinding the non-conductive workpiece with a high precision with a grindstone, and secondly, Furthermore, thirdly, a grinding method for a non-conductive workpiece with high grinding efficiency by confirming the grinding amount and enabling re-grinding without taking out the non-conductive workpiece outside the machine. It is another object of the present invention to provide a non-conductive workpiece grinding method and apparatus with high machining accuracy.

In order to achieve the above-described problems, the present invention is characterized in that the non-conductive workpiece grinding method has the following configuration.
1. In a non-conductive workpiece grinding method for grinding a non-conductive workpiece on a table with a grindstone, a conductive simulator is mounted on the non-conductive workpiece, and at least the conductive simulator is mounted on the conductive simulator. Grinding a workpiece with a conductive grindstone lowered and approached to detect continuity due to contact between the conductive simulator and the grindstone, and to detect the continuity detected by this continuity. After detecting the starting position, raising the grindstone and returning it to the standby position to release it from the conductive simulation body, taking out the conductive simulation body from the non-conductive workpiece, the grindstone is moved from the standby position to the workpiece. The non-conductive workpiece is started to be ground by being lowered to the grinding start position.
2. In 1 described above, the grinding wheel is lowered based on a preset grinding command amount (up and down distance) to grind the non-conductive workpiece from the workpiece grinding start position, and then the grinding stone is raised to the standby position. Return to the non-conductive workpiece, place a conductive simulation body on the non-conductive workpiece, and lower the grinding stone from the standby position to approach the conductive simulation body. Is detected as a workpiece grinding end position to which the thickness of the conductive simulated body is added, and this workpiece grinding end position is the set grinding amount. When it is outside, the non-conductive workpiece on the table is ground repeatedly by regrinding with the grinding wheel and re-detecting the workpiece grinding end position with the conductive simulator. It is characterized by.
3. In 1 or 2 described above, air is blown to the grindstone, the conductive simulator, and the non-conductive workpiece until the workpiece grinding start position is detected.
The non-conductive workpiece grinding apparatus has the following configuration.
4). Grinding means capable of grinding a non-conductive workpiece on a table with a conductive grinding wheel that can be raised and lowered, and conductivity that can be mounted on and removed from the non-conductive workpiece. Position detection means for detecting the relative position (up and down distance) of the grindstone with respect to the simulating body on the non-conductive workpiece on the non-conductive workpiece, and detection of continuity due to contact between the conductive simulating body and the grindstone Continuity detecting means for performing, and adding the simulating thickness of the workpiece grinding start position of the grindstone to the non-conductive workpiece based on the detection result of the continuity detecting means and the detection result of the position detecting means. And a grinding start position calculating means obtained in step (1).
5). In 4 described above, the grinding end position obtained by adding the continuity simulated body thickness to the workpiece grinding end position of the non-conductive workpiece based on the detection result of the continuity detection means and the detection result of the position detection means. An arithmetic means is provided.
6). In 4 or 5 described above, a conductive brush capable of supplying power to the grindstone is provided, and the conductive brush is elastically contacted with the grindstone by a spring.
7). In any one of 4 to 6 described above, the grindstone is attached to the output shaft of the motor through the insulator, and a fastener for attaching the grindstone to the insulator is formed in an unexposed state on the top surface of the insulator. It is characterized by being.
8). Any one of 4 to 7 described above is characterized by comprising air blowing means for blowing air to at least the grindstone, the conductive simulation body, and the non-conductive workpiece.

A. According to claims 1 and 4, even if the workpiece is a non-conductive material, by using the conductive simulation body, the workpiece grinding start position of the grindstone with respect to the non-conductive workpiece can be reduced in error. In addition, the non-conductive workpiece can be ground with good grinding accuracy.
B. Further, according to the second and fifth aspects, the grinding amount can be confirmed and reground without taking out the non-conductive workpiece outside the machine, so that the grinding efficiency is high.
C. According to claims 3 and 8, when the workpiece grinding start position and the workpiece grinding end position are detected, the surfaces of the non-conductive workpiece, the conductive simulation body, and the grindstone are cleaned with air, Since grinding residue etc. are removed, it is detected more accurately that the grindstone has contacted the conductive simulator, and the measurement accuracy of the workpiece grinding start position and workpiece grinding end position is high, and the machining accuracy is high. .
D. According to the sixth aspect of the present invention, power can be supplied to the grindstone through a conductive brush that elastically contacts the grindstone.
E. According to claim 7, the fastener for attaching the grindstone to the insulator is in an unexposed state on the upper surface of the insulator. Therefore, even when the insulator surface is wet with the coolant of the grindstone, the insulation through the fastener Conduction between the body surface side and the grindstone side does not occur, and an insulating state can be maintained.

  FIG. 1 and FIG. 2 illustrate an embodiment of the non-conductive workpiece grinding apparatus of the present invention, and the grinding apparatus 1 includes a standing frame 2. A plurality of guide rails 3 are laid on the upper front side (left side in FIG. 1). A flat plate-shaped Z-axis carriage 5 is provided on the guide rail 3 through a plurality of sliders 4 so as to be movable in the Z-axis direction (vertical direction in FIG. 1). A nut member 6 extending in the front-rear direction (horizontal direction in FIG. 1) is provided at the rear portion of the carriage 5, and a ball screw 7 extending in the Z-axis direction is screwed to the nut member 6. The upper part of the ball screw 7 is connected to a feed motor 8 provided on the upper part of the frame 2, and the lower part of the ball screw 7 is rotatably supported by a bearing 9 provided on the frame 2. The feed motor 8 is provided with an encoder 10 as an example of position detecting means.

  With the above configuration, when the feed motor 8 is driven, the ball screw 7 is rotated, so that the nut member 6 is moved up and down. As the nut member 6 moves up and down, the Z-axis carriage 5 is moved up and down along the guide rail 3 via the slider 4.

  A rotation motor 11 is provided at the front portion of the Z-axis carriage 5, and a cup-shaped grindstone 15 is rotatably connected to the rotation motor 11 via an insulator 13. The grindstone 15 is conductive, for example, in which abrasive grains and carbon are mixed and bonded by a binder. The grindstone 15 is attached to the insulator 13 with a fastener 16 such as a bolt. The fastener 16 is not exposed on the upper surface of the insulator 13, and the grindstone 15 side and the rotating motor 11 side pass through the insulator 13. The non-conducting state is maintained.

With the above configuration, when the rotation motor 11 is driven, the grindstone 15 is rotated in the same direction.
A box-shaped support frame 17 having an upper opening is attached to the lower front side (left side in FIG. 1) of the frame 2, and the work table 19 can be rotated via a bearing 18 on the lower frame 17 a of the support frame 17. It is supported by. A workpiece W as a non-conductive workpiece to be machined by the chuck 20 is clamped on the work table 19. A dresser may be clamped instead of the workpiece W.

  A pulley 25 is attached to the lower part of the work table 19. A motor base 26 is attached to the left side of the lower frame 17a, and a rotation motor 27 is provided on the motor base 26. A drive pulley 30 is attached to the output shaft 29 of the rotation motor 27. A belt 31 is wound around the drive pulley 30 and the pulley 25.

  With the above configuration, when the rotation motor 27 is driven, the drive pulley 30 is rotated via the output shaft 29, so that the work table 19 is rotated via the belt 31 and the pulley 25. Since the work W is clamped and attached to the work table 19 by the chuck 20, the work W is rotated in the same direction by the rotation of the work table 19.

Between the conductive simulation body 21 that can be mounted on the work W attached to the work table 19 and the grindstone 15, it is pressed by the spring 23 in the support portion 22 provided on the frame 2 and elastically contacts the grindstone 15. An electric circuit 34 having a power source 32 is formed through the carbon brush 24. The electric circuit 34 is provided with a sensor 35 such as an ammeter as an example of the continuity detecting means. In addition, the sensor 35, the feed motor 8, the rotation motors 11 and 27, and the encoder 10 are connected to the control device 36. The control device 36 includes, for example, a grinding start position calculation means 37. When the sensor 35 detects that the grindstone 15 is in contact with the conductive simulation body 21 on the workpiece W and is conductive, the control device 36 is in the conduction detection position. Further, the workpiece grinding start position is calculated by the grinding start position calculating means 37. That is, in the grinding start position calculation means 37, the workpiece grinding start position is calculated by adding the thickness of the conductive simulation body 21 to the conduction detection position.
Further, the control device 36 is provided with a grinding end position calculating means 38, and after grinding the workpiece W by the grindstone 15, the grinding wheel 15 is brought into contact with the conductive simulation body 21 mounted on the workpiece W by the sensor 35 to conduct. When this is detected, it is determined that the position is the conduction detection position, and the workpiece grinding end position is calculated by the grinding end position calculating means 38. That is, the grinding end position calculating means 38 calculates the workpiece grinding end position by adding the thickness of the conductive simulation body 21 to the conduction detection position.
The vertical distance between the workpiece grinding start position and the workpiece grinding end position is calculated by the actual grinding amount calculating means 39 in the control device 36 as the actual grinding amount actually ground.

A part of a hose 41 having an air nozzle 40 as an example of an air blowing means is attached to the tip of the Z-axis carriage 5 and an air source (not shown) is connected to the other end of the hose 41. . Therefore, when the Z-axis carriage 5 is lowered and the grindstone 15 comes into contact with the conduction simulation body 21 on the workpiece W to detect the conduction detection position by contact, the compressed air is supplied from the pressure source from the air nozzle 40 via the hose 41. Water sprayed on the insulator 13 and the grindstone 15 to remove moisture or grinding residue adhering to the surface of the insulator 13 and the grindstone 15 is blown off from the surfaces of the insulator 13 and the grindstone 15 (cleaned). )
Further, a water discharge nozzle 42 is disposed toward the grindstone 15, and cooling water is jetted from the water discharge nozzle by operating a pump (not shown), so that the grindstone 15 can be cooled and grinding debris can be eliminated. .

The embodiment of the invention according to claim 1 in which the workpiece that is a non-conductive workpiece is ground with a grindstone by the above-described grinding apparatus of FIG. 1 will be described based on the flowchart shown in FIG. First, in step S1, a conductive simulation body 21 having a thickness of, for example, 10 mm is mounted on the work W clamped by the chuck 20 on the work table 19. At this time, the work table 19 and the grindstone 15 are not rotating.
In step S2, the rotary motor 11 is driven to rotate the insulator 13 and the grindstone 15, and compressed air is jetted from the air nozzle 40 toward the insulator 13 and the grindstone 15, so that the surface of the insulator 13, the grindstone 15, etc. Blow off and remove moisture and grinding residue adhering to the surface. The rotational speed of the grindstone 15 at this time may be the rotational speed at the time of grinding, or may not be so. Further, the supply of compressed air is stopped after a lapse of time to remove moisture and grinding residue, and the grindstone 15 is also stopped at the same time.

In step S3, the feed motor 8 is driven and the Z-axis carriage 5 is lowered. The descending speed at this time is assumed to be equal to or faster than the descending speed at the time of grinding. Moreover, the work table 19 and the grindstone 15 are not rotating.
Next, in step S4, when the Z-axis carriage 5 continues to descend and the grindstone 15 comes into contact with the conductive simulation body 21 on the workpiece W and becomes conductive, the sensor 35 is turned on and a detection signal is taken into the control device 36. The Z-axis carriage 5 stops descending.
In step S5, a detection signal as a conduction detection position from the sensor 35 is taken in and calculated by the grinding start position calculating means 37 of the control device 36 to obtain a workpiece grinding start position (see FIG. 5). The workpiece grinding start position at this time is detected by the encoder 10 and taken into the control device 36.

In step S6, the Z-axis carriage 5 is raised to an extent that does not hinder the removal of the conductive simulation body 21 on the workpiece W, for example, 2 mm, and then returned to the standby position. Then, in step S7, the conduction from the workpiece W is conducted. The sex simulation body 21 is taken out.
In Step S8, the operation of the rotation motors 11 and 27 is started to rotate the grindstone 15 and the work table 19, and the grindstone 15 and the work W are rotated, and the grindstone 15 is lowered at the time of grinding or not. Descent at good speed. In addition, the pump is operated and cooling water is sprayed from the water discharge nozzle 42 toward the grindstone 15 to cool the grindstone 15 and eliminate grinding debris.
In step S9, the grindstone 15 is lowered from the standby position by a descending speed at the time of grinding or at a different speed, and the descending distance corresponding to the thickness of the conductive simulation body 21 is lowered. A total of 12 mm, which is 10 mm corresponding to the thickness of the simulation model 21, is reached to reach the workpiece grinding start position, and in step 10, the grinding command of the workpiece W by the grindstone 15 continuously descending at the grinding speed is set as a set grinding command amount For example, 5 mm is performed, and when the grinding process is completed in step 11, the Z-axis carriage 5 is raised and returned to the standby position in step 12, the grindstone 15 is separated from the workpiece W, the chuck 20 is loosened, and the grinding has been completed. The work W is taken out from the work table 19.

Thus, the non-conductive workpiece can be ground with high accuracy by detecting the workpiece grinding start position with few errors.
Further, if compressed air is continuously sprayed from the air nozzle 40 toward the insulator 13 and the grindstone 15 at least from step S1 to step S5, moisture and debris adhering to the surfaces of the insulator 13 and the grindstone 15 are removed. The surfaces of the insulator 13 and the grindstone 15 are cleaned cleanly by being blown off by the compressed air. As a result, there are no obstacles that cause a malfunction when detecting the workpiece grinding start position, the malfunction is reduced, and the workpiece grinding start position can be accurately detected. Thus, it is possible to perform grinding with good grinding accuracy during grinding. Also, the structure is very simple and can be provided at a low price.

Next, based on the flowchart shown in FIG. 4, the first embodiment according to the second aspect of the present invention is used to grind the workpiece, which is a non-conductive workpiece, with a grindstone using the grinding apparatus of FIG. If it demonstrates, since step 1 to step 10 is the same as step 1-10 in the flowchart of FIG. 3, description is abbreviate | omitted applying a code | symbol, and step 11 and after are demonstrated.
In step 11, the Z-axis carriage 5 rises by 12 mm in total, which is 10 mm of the thickness of the conductive simulator 21, and the grindstone 15 returns to the standby position.
In step S12, the rotation motor 11 is driven to rotate the grindstone 15, and compressed air is jetted from the air nozzle 40 toward the insulator 13, the grindstone 15, and the workpiece W, so that the insulator 13, the grindstone 15, and the workpiece W are ejected. Blow off and remove moisture and grinding residue adhering to the surface. The rotational speed of the grindstone 15 at this time may be the rotational speed at the time of grinding, or may not be so. Further, the supply of compressed air is stopped after a lapse of time to remove moisture and grinding residue, and the grindstone 15 is also stopped at the same time.

In step S13, the conductive simulation body 21 is mounted on the workpiece W that has been ground and clamped by the chuck 20 on the work table 19, and in step 14, the feed motor 8 is driven so that the Z-axis carriage 5 is moved. The grindstone 15 is relatively moved closer to the conductive simulator 21 by being lowered. At this time, the work table 19 and the grindstone 15 are not rotating. The descending speed is equal to or faster than the descending speed at the time of grinding.
Next, in step S 15, when the Z-axis carriage 5 continues to descend and the grindstone 15 comes into contact with the conductive simulation body 21 on the workpiece W and becomes conductive, the sensor 35 is turned on and a detection signal is taken into the control device 36. At this time, the descending amount of the Z-axis carriage 5 is a sum of 2 mm of the increment in Step 11 and the actual grinding amount (vertical distance) that the workpiece W is actually ground, and the Z-axis carriage 5 descends. Stop.

In step S16, a detection signal as a conduction detection position from the sensor 35 is taken into the grinding end position calculating means 38 of the control device 36 and is calculated to be a workpiece grinding end position. The workpiece grinding end position at this time is detected by the encoder 10 and taken into the control device 36.
In step S16, when it is confirmed through the actual grinding amount calculation means 39 that the workpiece grinding end position detected in the workpiece W matches the grinding command amount (see FIG. 6), in the next step 17, Finish the grinding process. In step S18, the Z-axis carriage 5 is raised and the grindstone 15 is returned to the standby position. Then, the conductive simulation body 21 is taken out from the workpiece W, the chuck 20 is loosened, and the grinding command amount is already ground. The work W is taken out from the work table 19.

On the other hand, if the workpiece grinding end position detected in step S16 is outside the range of the grinding command amount, for example, the actual grinding amount (distance) is insufficient and the shortage amount (distance) with respect to the grinding command amount of 5 mm. Is 1 mm (see FIGS. 7 and 8), steps 6A to 16A are repeated in accordance with the above-described steps S6 to S16, and the workpiece W is ground and finished within the range of the grinding command amount.
Specifically, the process returns to step S6A, and in step S6A, the Z-axis carriage 5 is raised by 2 mm and returned to the standby position. Then, in step S7A, the conductive simulation body 21 is taken out from the workpiece W.
In step S8A, the operation of the rotation motors 11 and 27 is started to rotate the grindstone 15 and the work table 19, and the grindstone 15 and the work W are rotated, and the grindstone 15 is lowered from the standby position at the lowering speed at the time of grinding. To do. In addition, the pump is operated and cooling water is sprayed from the water discharge nozzle 42 toward the grindstone 15 to cool the grindstone 15 and eliminate grinding debris.

Then, in step S9A, the grindstone 15 descends from the standby position, that is, 2 mm of the rise in step 6 and 10 mm for the thickness of the conductive simulation body 21 are lowered to reach the workpiece to start the grinding. At 10A, the grindstone 15 continues to lower the insufficient amount of 1 mm, which is less than the grinding command amount, and the workpiece W is reground.
In step 11A, the Z-axis carriage 5 is increased by 12 mm by adding the thickness of the conductive simulator 21, and the grindstone 15 returns to the standby position.
In step S12A, the rotation motor 11 is driven to rotate the grindstone 15, and compressed air is jetted from the air nozzle 40 toward the insulator 13, the grindstone 15, and the workpiece W, so that the insulator 13, the grindstone 15, and the workpiece W are ejected. It stops after blowing off and removing moisture or grinding residue adhering to the surface, and at the same time, the grindstone 15 is also stopped.

In step S13A, the conductive simulation body 21 is mounted on the work W which has been reground and clamped by the chuck 20 on the work table 19, and in step 14A, the feed motor 8 is driven to drive the Z-axis carriage 5. Is lowered to bring the grindstone 15 relatively closer to the conductive simulator 21. At this time, the work table 19 and the grindstone 15 are not rotating.
Next, in step S15A, when the Z-axis carriage 5 is lowered and the grindstone 15 comes into contact with the conductive simulation body 21 on the workpiece W and becomes conductive, the sensor 35 is turned on and a detection signal is taken into the control device 36. The descending amount of the Z-axis carriage 5 at this time is 3 mm in total, that is, 2 mm of the rising amount in Step 11 and 1 mm of the insufficient amount (distance).

In step S16A, a detection signal as a conduction detection position from the sensor 35 is taken into the grinding end position calculating means 38 of the control device 36 and is calculated to be a workpiece grinding end position. The workpiece grinding end position at this time is detected by the encoder 10 and taken into the control device 36.
In step S16A, when it is confirmed through the actual grinding amount calculating means 39 that the workpiece grinding end position detected in the workpiece W matches the grinding command amount (see FIG. 6), the process proceeds to the next step 17. Finish the grinding process. In step S18, the Z-axis carriage 5 is raised and the grindstone 15 is returned to the standby position. Then, the conductive simulation body 21 is taken out from the workpiece W, the chuck 20 is loosened, and the grinding command amount is already ground. The work W is taken out from the work table 19.
If the workpiece grinding end position detected in step S16A is outside the grinding command amount range, steps 6A to 16A are repeated according to the shortage amount, and the workpiece W is reground and remeasured. To finish grinding command.

  Thus, the non-conductive workpiece W can be ground with high accuracy by detecting the workpiece grinding start position with few errors, and the workpiece can be mounted on the workpiece table with the grinding amount of the workpiece. If the grinding command amount is consistent with the grinding command amount, the grinding process is terminated.If the grinding command amount does not match, grinding and measurement are repeated until the grinding command amount is reached. Can be finished with high accuracy.

  In addition, this invention is not limited to embodiment of invention mentioned above, It can implement in another aspect by making an appropriate change.

The side view which illustrates one form of implementation in the grinding device of the non-conductive work piece of the present invention. The partial expanded longitudinal cross-sectional view which shows the grindstone circumference. It is a flowchart of operation | movement which grinds to a workpiece | work as one Embodiment in the grinding method of the non-conducting workpiece of this invention. It is a flowchart of other operation | movement which grinds to a workpiece | work as one Embodiment in the grinding method of the non-conductive workpiece of this invention. Schematic of the state which detects the grinding start position of a non-conductive workpiece. Schematic of the state which detects the grinding end position of a non-conductive workpiece. Schematic showing the grinding start position, grinding end position and insufficient amount when the grinding amount of the non-conductive workpiece is insufficient Schematic of the state of detecting the grinding end position when the grinding amount of the non-conductive workpiece is insufficient

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Grinding apparatus 2 Frame 3 Guide rail 4 Slider 5 Z-axis carriage 6 Nut member 7 Ball screw 8 Feed motors 9 and 18 Bearing 10 Encoder (position detection means)
11, 27 Motor for rotation 13 Insulator 15 Grinding wheel (grinding means)
16 Fastener 17 Support frame 17a Lower frame 19 Work table (table)
20 Chuck 21 Conductive Simulated Body 22 Supporting Section 23 Spring 24 Carbon Brush (Conductive Brush)
25 pulley 26 motor base 29 output shaft 30 drive pulley 31 belt 32 power supply 34 electric circuit 35 sensor (conduction detection means)
36 Control device 37 Grinding start position calculating means 38 Grinding end position calculating means 39 Actual grinding amount calculating means 40 Air nozzle (air spraying means)
41 Hose 42 Water discharge nozzle W Workpiece (non-conductive workpiece)

Claims (8)

  In a non-conductive workpiece grinding method for grinding a non-conductive workpiece on a table with a grindstone, a conductive simulator is mounted on the non-conductive workpiece, and at least the conductive simulator is mounted on the conductive simulator. Grinding a workpiece with a conductive grindstone lowered and approached to detect continuity due to contact between the conductive simulator and the grindstone, and to detect the continuity detected by this continuity. After detecting the starting position, raising the grindstone and returning it to the standby position to release it from the conductive simulation body, taking out the conductive simulation body from the non-conductive workpiece, the grindstone is moved from the standby position to the workpiece. A non-conductive workpiece grinding method, wherein the non-conductive workpiece is ground by being lowered to a grinding start position.   After grinding the non-conductive workpiece from the workpiece grinding start position based on a preset grinding command amount and grinding the non-conductive workpiece from the workpiece grinding start position, the grinding stone is raised and returned to the standby position from the non-conductive workpiece. The conductive simulator is placed on the non-conductive workpiece, and the grindstone is lowered from the standby position to approach the conductive simulator, and conduction due to contact between the conductive simulator and the grindstone is detected. At the same time, the continuity detection position due to the continuity is detected as the workpiece grinding end position to which the thickness of the simulating conductive body is added, and when the workpiece grinding end position is outside the set grinding amount, 2. The non-working material according to claim 1, wherein the conductive workpiece is ground by repeating the regrinding by the grindstone and the redetection of the workpiece grinding end position by the conductive simulator. A method for grinding conductive workpieces.   3. The non-conductive workpiece grinding method according to claim 1, wherein air is blown onto the grindstone, the conductive simulation body, and the non-conductive workpiece until a workpiece grinding start position is detected.   Grinding means capable of grinding a non-conductive workpiece on a table with a conductive grinding wheel that can be raised and lowered, and conductivity that can be mounted on and removed from the non-conductive workpiece. A simulation body, position detection means for detecting the relative position of the grindstone with respect to the conduction simulation body on the non-conductive workpiece, and conduction detection means for detecting conduction due to contact between the conduction simulation body and the grinding stone. The grinding start position obtained by adding the conductive simulation object thickness to the workpiece grinding start position of the grindstone for the non-conductive workpiece based on the detection result of the continuity detection means and the detection result of the position detection means And a non-conducting workpiece grinding apparatus characterized by comprising: an arithmetic means;   Grinding end position calculating means for obtaining the workpiece grinding end position of the non-conductive workpiece based on the detection result of the continuity detecting means and the detection result of the position detecting means by adding the continuity simulated body thickness. The non-conductive workpiece grinding apparatus according to claim 4, wherein the non-conductive workpiece is ground.   6. A grinding process for a non-conductive workpiece according to claim 4, further comprising a conductive brush capable of supplying power to the grindstone, wherein the conductive brush is elastically contacted with the grindstone by a spring. apparatus.   5. The grindstone is attached to the output shaft of the motor through an insulator, and a fastener for attaching the grindstone to the insulator is formed in an unexposed state on the top surface of the insulator. A grinding apparatus for a non-conductive workpiece according to any one of claims 6 to 6.   The grinding of a non-conductive workpiece according to any one of claims 4 to 7, further comprising air blowing means for blowing air to at least the grindstone, the conductive simulation body, and the non-conductive workpiece. Processing equipment.

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