JP2007243052A - Lighting fixture and its manufacturing method - Google Patents

Lighting fixture and its manufacturing method Download PDF

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JP2007243052A
JP2007243052A JP2006066406A JP2006066406A JP2007243052A JP 2007243052 A JP2007243052 A JP 2007243052A JP 2006066406 A JP2006066406 A JP 2006066406A JP 2006066406 A JP2006066406 A JP 2006066406A JP 2007243052 A JP2007243052 A JP 2007243052A
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lens
substrate
led chip
outer shell
lighting fixture
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Yutaka Sugaya
豊 菅谷
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting fixture which can form a lens of a stable optical characteristic in a good yield and can easily meet a layout change of an LED chip too and to provide its manufacturing method. <P>SOLUTION: In the lighting fixture A, the LED chip 2 is mounted on a substrate 1, and an outer-shell portion 4 of the lens formed of a transparent material is fitted on the substrate 1 so as to cover the LED chip 2 and a wire 3. On the outer-shell portion 4 of lens, there are located an injection hole 7 to inject the transparent material of lens 6 into an inner space 5 and an exhaust hole 8 to exhaust a gas of the inner space 5, and the lens material 6 is injected from the injection hole 7 and the gas in the inner space 5 is exhausted from the exhaust hole 8 to form the inside lens portion 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、照明器具及びその製造方法に関するものである。   The present invention relates to a lighting fixture and a method for manufacturing the same.

従来より、基板に実装されたＬＥＤチップを覆うように透光性を備えた単一の樹脂でレンズを形成した照明器具が提供されている。この照明器具は、基板にＬＥＤチップが実装され、このＬＥＤチップの表面に設けられた２つの電極が２本のボンディングワイヤを介してそれぞれ基板上の別々の回路パターンに電気的に接続されている。そして基板全体を樹脂で封止してレンズが形成されている。このレンズには、外的要因による傷や汚れを防止するために、ある程度の硬さが必要であり、透明エポキシ樹脂が使用されている。   Conventionally, there has been provided a lighting fixture in which a lens is formed with a single resin having translucency so as to cover an LED chip mounted on a substrate. In this lighting fixture, an LED chip is mounted on a substrate, and two electrodes provided on the surface of the LED chip are electrically connected to separate circuit patterns on the substrate, respectively, via two bonding wires. . The entire substrate is sealed with resin to form a lens. This lens needs a certain degree of hardness in order to prevent scratches and dirt due to external factors, and a transparent epoxy resin is used.

しかしこの透明エポキシ樹脂は熱膨張率が高く、ＬＥＤチップの発熱により透明エポキシ樹脂が膨張又は収縮するため、ワイヤに応力がかかり、ワイヤの断線が生じる可能性がある。   However, since this transparent epoxy resin has a high coefficient of thermal expansion, the transparent epoxy resin expands or contracts due to the heat generated by the LED chip, so that stress is applied to the wire and the wire may be disconnected.

そこで、ワイヤの断線が生じないように、レンズを２種類の部材により形成した照明器具が提案されている（例えば特許文献１参照）。この照明器具は、レンズの外形を成すレンズ外殻部が、基板に実装されたＬＥＤチップと２本のボンディングワイヤを覆うように基板に取り付けられている。そしてこのレンズ外殻部には、基板とレンズ外殻部とで形成された内部空間に樹脂を注入するための注入孔が１箇所設けられており、この注入孔から透光性の透明シリコーン樹脂を注入するとともに内部空間の気体を排出して内側レンズ部を形成している。この透明シリコーン樹脂は弾性を備えており、ＬＥＤチップの発熱により、透明シリコーン樹脂が膨張して内部空間に応力が発生しても、透明シリコーン樹脂自体がこの応力を吸収するため、ワイヤにかかる応力が軽減でき、ワイヤの断線を防止することができる。
特開２００４−２０７６６０号公報（第５頁−第６頁、及び、第１，２図） In view of this, there has been proposed a lighting fixture in which a lens is formed of two types of members so that the wire is not broken (see, for example, Patent Document 1). In this luminaire, a lens outer shell that forms the outer shape of the lens is attached to the substrate so as to cover the LED chip mounted on the substrate and the two bonding wires. The lens outer shell portion is provided with one injection hole for injecting resin into the internal space formed by the substrate and the lens outer shell portion. From the injection hole, a translucent transparent silicone resin is provided. And the inner space is formed by discharging the gas in the inner space. This transparent silicone resin has elasticity, and even if the transparent silicone resin expands due to the heat generated by the LED chip and a stress is generated in the internal space, the transparent silicone resin itself absorbs this stress. Can be reduced, and wire breakage can be prevented.
JP 2004-207660 A (pages 5 to 6 and FIGS. 1 and 2)

上述した前者の照明器具では、レンズを成形する際に基板上のＬＥＤチップのレイアウトに合わせた金型を用いるため、使用するＬＥＤチップが同じであってもＬＥＤチップの配置が異なると、新たに金型を製作しなければならないという問題があった。   In the former lighting fixture described above, since a mold that matches the layout of the LED chip on the substrate is used when forming the lens, even if the LED chip to be used is the same, if the arrangement of the LED chip is different, a new one is newly added. There was a problem that the mold had to be manufactured.

また上述の特許文献１に示される照明器具では、基板とレンズ外殻部とで形成された内部空間に樹脂を注入するための注入孔がレンズ外殻部に１箇所しか設けられておらず、樹脂を充填する際には、この注入孔から樹脂を注入するとともに内部空間の気体を排出しているため、内部に気泡が残ってしまう可能性がある。そのためレンズの光学特性がばらつき、歩留まりが悪くなるという問題があった。   Further, in the lighting device shown in Patent Document 1 described above, the lens outer shell portion has only one injection hole for injecting resin into the internal space formed by the substrate and the lens outer shell portion. When filling the resin, since the resin is injected from the injection hole and the gas in the internal space is discharged, bubbles may remain inside. Therefore, there is a problem that the optical characteristics of the lenses vary and the yield deteriorates.

本発明は上記問題点に鑑みて為されたものであり、その目的とするところは、光学特性が安定したレンズを歩留まりよく形成でき、且つＬＥＤチップのレイアウト変更にも容易に対応できる照明器具及びその製造方法を提供することにある。   The present invention has been made in view of the above problems, and an object of the present invention is to provide a lighting device that can form a lens with stable optical characteristics with high yield and can easily cope with a layout change of an LED chip. It is in providing the manufacturing method.

請求項１の発明は、基板と、前記基板に実装されたＬＥＤチップと、透光性材料により形成され前記ＬＥＤチップを覆うように前記基板に取り付けられたレンズ外殻部と、前記基板と前記レンズ外殻部とで形成された内部空間に透光性のレンズ材料を充填することで形成された内側レンズ部とを備え、前記レンズ外殻部に、前記レンズ材料を注入するための注入孔と、前記内部空間の気体を排出するための排出孔とを設けたことを特徴とする。   According to a first aspect of the present invention, there is provided a substrate, an LED chip mounted on the substrate, a lens outer shell portion formed on a light-transmitting material and attached to the substrate so as to cover the LED chip, the substrate, and the substrate An inner lens part formed by filling a translucent lens material into an inner space formed by the lens outer shell part, and an injection hole for injecting the lens material into the lens outer shell part And a discharge hole for discharging the gas in the internal space.

請求項２の発明は、請求項１の発明において、前記レンズ材料が弾性を備えていることを特徴とする。   According to a second aspect of the invention, in the first aspect of the invention, the lens material has elasticity.

請求項３の発明は、請求項１又は請求項２の発明の製造方法であって、前記レンズ外殻部を治具に保持した後、前記ＬＥＤチップが実装された前記基板を前記治具に保持した状態で、前記注入孔から前記レンズ材料を注入するとともに、前記排出孔から前記内部空間の気体を排出して前記内側レンズ部を形成したことを特徴とする。   Invention of Claim 3 is a manufacturing method of invention of Claim 1 or Claim 2, Comprising: After holding | maintaining the said lens outer shell part in a jig | tool, the said board | substrate with which the said LED chip was mounted is made into the said jig | tool. While being held, the lens material is injected from the injection hole, and the gas in the internal space is discharged from the discharge hole to form the inner lens portion.

請求項１の発明によれば、基板とレンズ外殻部とで形成された内部空間にレンズ材料を注入するための注入孔と、この内部空間の気体を排出するための排出孔とをレンズ外殻部に設けることで、内部空間に気泡を残さずにレンズ材料を充填できるので、レンズの光学特性が安定した、歩留まりのよい照明器具を提供できるという効果がある。また注入孔と排出孔とを基板にではなくレンズ外殻部に設けることで、基板の面積が大きくなり、基板にレンズ材料よりも放熱性の良い材料を用いた場合には、放熱効果を上げることができるため、ＬＥＤチップの電極と基板上の回路パターンとを電気的に接続するワイヤにかかる応力が軽減でき、ワイヤの断線を防止することができるという効果がある。またレンズ外殻部は基板に実装されたＬＥＤチップに対して１対１の関係にあり、使用するＬＥＤチップが同じであればＬＥＤチップのピッチや配列が変わっても同じレンズ外殻部を用いることができるので、レンズ外殻部を成形するための金型を新たに製作しなくてもよく、ＬＥＤチップのレイアウト変更にも容易に対応できるという効果がある。さらに同じＬＥＤチップに対して複数種類のレンズ外殻部を用意しておき、目的や用途に応じて使い分けることで所望の光を得ることができるという効果がある。   According to the first aspect of the present invention, the injection hole for injecting the lens material into the internal space formed by the substrate and the lens outer shell and the exhaust hole for discharging the gas in the internal space are provided outside the lens. By providing it in the shell, it is possible to fill the lens material without leaving bubbles in the internal space. Therefore, there is an effect that it is possible to provide a lighting device with stable optical characteristics of the lens and high yield. In addition, by providing the injection hole and the discharge hole not in the substrate but in the lens outer shell, the area of the substrate becomes large, and if a material with better heat dissipation than the lens material is used for the substrate, the heat dissipation effect is improved. Therefore, the stress applied to the wire that electrically connects the electrode of the LED chip and the circuit pattern on the substrate can be reduced, and the wire can be prevented from being disconnected. Further, the lens outer shell portion has a one-to-one relationship with the LED chip mounted on the substrate. If the LED chip to be used is the same, the same lens outer shell portion is used even if the pitch and arrangement of the LED chips are changed. Therefore, there is an effect that it is not necessary to newly manufacture a mold for molding the lens outer shell, and it is possible to easily cope with a change in the layout of the LED chip. Furthermore, there is an effect that desired types of light can be obtained by preparing a plurality of types of lens outer shells for the same LED chip and using them according to the purpose and application.

請求項２の発明によれば、請求項１の効果に加えて、レンズ材料が弾性を備えているので、ＬＥＤチップの発熱により、レンズ材料が膨張して内部空間に応力が発生しても、レンズ材料がこの応力を吸収するため、ＬＥＤチップの電極と基板上の回路パターンとを電気的に接続するワイヤにかかる応力がさらに軽減でき、ワイヤの断線を防止することができるという効果がある。   According to the invention of claim 2, in addition to the effect of claim 1, since the lens material has elasticity, even if the lens material expands due to the heat generated by the LED chip and stress is generated in the internal space, Since the lens material absorbs this stress, the stress applied to the wire that electrically connects the electrode of the LED chip and the circuit pattern on the substrate can be further reduced, and the wire can be prevented from being disconnected.

請求項３の発明によれば、基板とレンズ外殻部とで形成された内部空間にレンズ材料を注入するとともにこの内部空間の気体を排出することで、内部空間に気泡を残さずにレンズ材料を充填でき、光学特性の安定したレンズを歩留まりよく製造できるという効果がある。またレンズ外殻部は基板に実装されたＬＥＤチップに対して１対１の関係にあり、使用するＬＥＤチップが同じであればＬＥＤチップのピッチや配列が変わっても同じレンズ外殻部を用いることができるので、レンズ外殻部を成形するための金型を新たに製作しなくてもよく、ＬＥＤチップのレイアウト変更にも容易に対応できるという効果がある。さらに同じＬＥＤチップに対して複数種類のレンズ外殻部を用意しておき、目的や用途に応じて使い分けることで所望の光を得ることができるという効果がある。   According to the invention of claim 3, the lens material is injected into the internal space formed by the substrate and the lens outer shell portion, and the gas in the internal space is discharged, so that the lens material is left without leaving bubbles in the internal space. And having a stable optical characteristic can be manufactured with a high yield. Further, the lens outer shell portion has a one-to-one relationship with the LED chip mounted on the substrate. If the LED chip to be used is the same, the same lens outer shell portion is used even if the pitch and arrangement of the LED chips are changed. Therefore, there is an effect that it is not necessary to newly manufacture a mold for molding the lens outer shell, and it is possible to easily cope with a change in the layout of the LED chip. Furthermore, there is an effect that desired types of light can be obtained by preparing a plurality of types of lens outer shells for the same LED chip and using them according to the purpose and application.

以下に本発明の実施の形態を図１，２に基づいて説明する。図１は本実施形態の照明器具の断面図である。   Hereinafter, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view of the lighting apparatus of the present embodiment.

本実施形態の照明器具Ａは、図１のように基板１にＬＥＤチップ２が実装され、ＬＥＤチップ２の下面の電極は基板１上の回路パターン（図示していない）と直接電気的に接続しており、ＬＥＤチップ２の表面の電極はボンディングワイヤ３を介して基板１上の別の回路パターンに電気的に接続されている。そして透光性材料（例えばアクリルなど）により形成された半球状のレンズ外殻部４がＬＥＤチップ２とワイヤ３を覆うように基板１に取り付けられている。このレンズ外殻部４には、基板１とレンズ外殻部４とで形成される内部空間５に透光性のレンズ材料６（例えば透明シリコーン樹脂など）を注入するための注入孔７と、内部空間５の気体を排出するための排出孔８とが設けられており、注入孔７からレンズ材料６を注入するとともに排出孔８から内部空間５の気体を排出して、内側レンズ部１０を形成している。   In the lighting fixture A of the present embodiment, the LED chip 2 is mounted on the substrate 1 as shown in FIG. 1, and the electrodes on the lower surface of the LED chip 2 are directly electrically connected to a circuit pattern (not shown) on the substrate 1. The electrodes on the surface of the LED chip 2 are electrically connected to another circuit pattern on the substrate 1 via bonding wires 3. A hemispherical lens outer shell 4 made of a translucent material (for example, acrylic) is attached to the substrate 1 so as to cover the LED chip 2 and the wire 3. The lens outer shell 4 has an injection hole 7 for injecting a translucent lens material 6 (for example, transparent silicone resin) into an internal space 5 formed by the substrate 1 and the lens outer shell 4. A discharge hole 8 for discharging the gas in the internal space 5 is provided. The lens material 6 is injected from the injection hole 7 and the gas in the internal space 5 is discharged from the discharge hole 8 to Forming.

このようにレンズ外殻部４に注入孔７と排出孔８とを設けることで、内部空間５に気泡を残すことなくレンズ材料６を充填できるので、レンズの光学特性が安定した、歩留まりのよい照明器具が提供できる。また、内部空間５に充填するレンズ材料６として弾性を備えた材料を用いることで、ＬＥＤチップ２の発熱により、レンズ材料６が膨張して内部空間５に応力が発生しても、レンズ材料６がこの応力を吸収するため、ワイヤ３にかかる応力が軽減し、ワイヤ３の断線を防止することができる。さらに注入孔７及び排出孔８を基板１にではなくレンズ外殻部４に設けることで、基板１の面積が大きくなり、基板１をレンズ材料６より放熱効果の大きい材料を用いた基板（例えば基板の裏面に銅パターンを張ったガラスエポキシ基板など）にした場合には、ＬＥＤチップ２から発生する熱が基板１に分散され、レンズ材料６に伝わる熱が小さくなる。そのためレンズ材料６が膨張して内部空間５に発生する応力も小さくなり、ワイヤ３にかかる応力をさらに軽減できる。またレンズ材料６及び基板１が高い放熱性を備えている場合には、レンズ材料６及び基板１がＬＥＤチップ２から発生する熱をさらに放散するため、ＬＥＤチップ２に供給する電力を大きくすることができ、高い光出力を得ることができる。   By providing the injection hole 7 and the discharge hole 8 in the lens outer shell portion 4 in this way, the lens material 6 can be filled without leaving bubbles in the internal space 5, so that the optical characteristics of the lens are stable and the yield is good. Lighting equipment can be provided. Further, by using a material having elasticity as the lens material 6 filled in the internal space 5, even if the lens material 6 expands due to heat generation of the LED chip 2 and stress is generated in the internal space 5, the lens material 6 However, since this stress is absorbed, the stress applied to the wire 3 can be reduced and the wire 3 can be prevented from being disconnected. Further, by providing the injection hole 7 and the discharge hole 8 not in the substrate 1 but in the lens outer shell 4, the area of the substrate 1 is increased, and the substrate 1 is made of a material using a material that has a larger heat dissipation effect than the lens material 6 (for example, In the case of a glass epoxy substrate having a copper pattern on the back surface of the substrate, the heat generated from the LED chip 2 is dispersed in the substrate 1, and the heat transmitted to the lens material 6 is reduced. Therefore, the stress generated in the internal space 5 due to the expansion of the lens material 6 is reduced, and the stress applied to the wire 3 can be further reduced. In addition, when the lens material 6 and the substrate 1 have high heat dissipation, the lens material 6 and the substrate 1 further dissipate heat generated from the LED chip 2, so that the power supplied to the LED chip 2 is increased. And high light output can be obtained.

次に、この照明器具Ａの製造方法を図２に基づいて説明する。治具９はレンズ外殻部４を保持するための半球状の窪みを有し、その両側に内部空間５にレンズ材料６を注入するための注入路１１と、内部空間５の気体を排出するための排出路１２とを設けてある。まず、この治具９に注入孔７と注入路１１の位置及び排出孔８と排出路１２の位置を合わせてレンズ外殻部４を保持する。次に治具９にＬＥＤチップ２が実装された基板１を保持して、レンズ外殻部４を基板１に接着する。そして注入路１１からレンズ材料６を注入するとともに排出路１２から内部空間５の気体を排出した後、熱硬化させ、内側レンズ部１０が形成される。   Next, the manufacturing method of this lighting fixture A is demonstrated based on FIG. The jig 9 has a hemispherical recess for holding the lens outer shell 4, and an injection path 11 for injecting the lens material 6 into the internal space 5 on both sides of the jig 9 and the gas in the internal space 5 are discharged. A discharge passage 12 is provided. First, the lens outer shell portion 4 is held by aligning the positions of the injection hole 7 and the injection path 11 and the positions of the discharge hole 8 and the discharge path 12 in the jig 9. Next, the substrate 1 on which the LED chip 2 is mounted is held on the jig 9, and the lens outer shell portion 4 is bonded to the substrate 1. Then, the lens material 6 is injected from the injection path 11 and the gas in the internal space 5 is discharged from the discharge path 12, and then thermally cured to form the inner lens portion 10.

このような製造方法において、レンズ外殻部４は基板１に実装されたＬＥＤチップ２に対して１対１の関係にあり、使用するＬＥＤチップ２が同じであればＬＥＤチップ２のピッチや配列が変わっても同じレンズ外殻部４が使用できるため、レンズ外殻部４を成形する金型を新たに製作しなくてもよく、ＬＥＤチップのレイアウト変更にも容易に対応できる。また同じＬＥＤチップに対して複数種類のレンズ外殻部を用意しておき、目的や用途に応じて使い分けることで所望の光を得ることができる。   In such a manufacturing method, the lens outer shell portion 4 is in a one-to-one relationship with the LED chip 2 mounted on the substrate 1. If the LED chip 2 to be used is the same, the pitch and arrangement of the LED chips 2 are the same. Since the same lens outer shell portion 4 can be used even if the change occurs, it is not necessary to newly manufacture a mold for molding the lens outer shell portion 4, and it is possible to easily cope with a change in the layout of the LED chip. In addition, a plurality of types of lens outer shell portions are prepared for the same LED chip, and desired light can be obtained by properly using them according to the purpose and application.

尚、本実施形態は基板１に実装するＬＥＤチップ２が１個の場合で説明しているが、実装するＬＥＤチップ２の数量は本実施形態に限定されるものではなく、複数であってもよい。   In addition, although this embodiment demonstrated the case where the LED chip 2 mounted in the board | substrate 1 was one, the quantity of the LED chip 2 mounted is not limited to this embodiment, Even if it is plural Good.

本実施形態の照明器具の断面図である。It is sectional drawing of the lighting fixture of this embodiment. 同上の製造方法を説明するための断面図である。It is sectional drawing for demonstrating the manufacturing method same as the above.

符号の説明Explanation of symbols

１ 基板
２ ＬＥＤチップ
３ ワイヤ
４ レンズ外殻部
６ レンズ材料
７ 注入孔
８ 排出孔
１０ 内側レンズ部
Ａ 照明器具 DESCRIPTION OF SYMBOLS 1 Board | substrate 2 LED chip 3 Wire 4 Lens outer shell part 6 Lens material 7 Injection hole 8 Discharge hole 10 Inner lens part A Lighting fixture

Claims (3)

基板と、前記基板に実装されたＬＥＤチップと、透光性材料により形成され前記ＬＥＤチップを覆うように前記基板に取り付けられたレンズ外殻部と、前記基板と前記レンズ外殻部とで形成された内部空間に透光性のレンズ材料を充填することで形成された内側レンズ部とを備え、前記レンズ外殻部に、前記レンズ材料を注入するための注入孔と、前記内部空間の気体を排出するための排出孔とを設けたことを特徴とする照明器具。   Formed by a substrate, an LED chip mounted on the substrate, a lens outer shell portion formed of a light-transmitting material and attached to the substrate so as to cover the LED chip, and the substrate and the lens outer shell portion An inner lens portion formed by filling a translucent lens material into the inner space, an injection hole for injecting the lens material into the lens outer shell portion, and a gas in the inner space The lighting fixture characterized by providing the discharge hole for discharging | emitting. 前記レンズ材料が弾性を備えていることを特徴とする請求項１記載の照明器具。   The lighting apparatus according to claim 1, wherein the lens material has elasticity. 請求項１又は請求項２記載の照明器具の製造方法であって、前記レンズ外殻部を治具に保持した後、前記ＬＥＤチップが実装された前記基板を前記治具に保持した状態で、前記注入孔から前記レンズ材料を注入するとともに、前記排出孔から前記内部空間の気体を排出して前記内側レンズ部を形成したことを特徴とする照明器具の製造方法。
It is a manufacturing method of the lighting fixture of Claim 1 or Claim 2, Comprising: After holding the lens outer shell part in a jig, in the state where the board where the LED chip was mounted was held in the jig, A method of manufacturing a lighting fixture, wherein the lens material is injected from the injection hole and the gas in the internal space is discharged from the discharge hole to form the inner lens portion.
JP2006066406A 2006-03-10 2006-03-10 Lighting fixture and its manufacturing method Withdrawn JP2007243052A (en)

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