JP2007242784A - Lighting system, exposure equipment, and method of manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting system inhibited from getting larger and capable of well lighting a pattern with exposure light. <P>SOLUTION: The lighting system IL illuminates a pattern with the exposure light EL for exposing a substrate P. The pattern is illuminated by the exposure light EL while a predetermined space K1 on the light path of the light EL is filled with a liquid LQ. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an illumination apparatus that illuminates a pattern with exposure light for exposing a substrate, an exposure apparatus that exposes a substrate, and a device manufacturing method.

In a photolithography process when manufacturing microdevices such as semiconductor devices, a pattern is illuminated with exposure light from an illumination system, and a pattern image illuminated with the exposure light is projected onto a photosensitive substrate via a projection optical system. An exposure apparatus for projecting onto the screen is used. In the manufacture of micro devices, miniaturization of patterns formed on a substrate is required in order to increase the density of devices. In order to meet this demand, it is desired to further increase the resolution of the exposure apparatus. As one of means for realizing the high resolution, the space between the projection optical system and the substrate is filled with a liquid as disclosed in Patent Document 1 below, and the substrate is exposed through the liquid. An immersion type exposure apparatus has been devised. In order to achieve higher resolution of the exposure apparatus, it is effective to shorten the wavelength of the exposure light used or increase the numerical aperture of the projection optical system. Since the space between the optical system and the substrate is filled with a liquid whose refractive index for exposure light is larger than that of air, the wavelength of the exposure light can be substantially shortened, and the numerical aperture of the projection optical system For example, even when the value is larger than 1, exposure light can reach the substrate satisfactorily.
International Publication No. 99/49504 Pamphlet

  As the numerical aperture of the projection optical system increases, the numerical aperture of the illumination system (illumination optical system) may also increase. For example, in order to set the coherence factor, which is the ratio of the numerical aperture of the projection optical system and the numerical aperture of the illumination system, to a desired value, it is necessary to increase the numerical aperture of the illumination system according to the numerical aperture of the projection optical system. there is a possibility. However, when the numerical aperture of the illumination system is increased, the illumination system may be increased in size.

  This invention is made | formed in view of such a situation, The enlargement is suppressed and the board | substrate is favorably used using the exposure light from the illumination apparatus which can illuminate a pattern favorably with exposure light, and the illumination apparatus An object is to provide an exposure apparatus capable of exposure. It is another object of the present invention to provide a device manufacturing method using the exposure apparatus.

  In order to solve the above-described problems, the present invention employs the following configurations corresponding to the respective drawings shown in the embodiments. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  According to the first aspect of the present invention, in an illumination device that illuminates a pattern with exposure light (EL) for exposing the substrate (P), predetermined spaces (K1, K2) on the optical path of the exposure light (EL). An illumination device (IL) that illuminates a pattern with exposure light (EL) in a state where is filled with liquid (LQ) is provided.

  According to the 1st aspect of this invention, enlargement is suppressed and a pattern can be illuminated favorably.

  According to the second aspect of the present invention, an exposure apparatus (EX) provided with the illumination apparatus (IL) of the above aspect is provided.

  According to the second aspect of the present invention, the substrate can be exposed satisfactorily.

  According to the third aspect of the present invention, a device manufacturing method using the exposure apparatus (EX) of the above aspect is provided.

  According to the 3rd aspect of this invention, a device can be manufactured using the exposure apparatus which can expose a board | substrate favorably.

  ADVANTAGE OF THE INVENTION According to this invention, the illuminating device by which the enlargement was suppressed and the exposure apparatus provided with the same can be provided, and a board | substrate can be favorably exposed using the exposure apparatus. Therefore, a device having a desired performance can be manufactured.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an exposure apparatus EX that includes an illumination system IL according to the first embodiment. In FIG. 1, an exposure apparatus EX includes a mask stage 3 that is movable while holding a mask M having a pattern, a substrate stage 4 that is movable while holding a substrate P, and an exposure light EL for exposing the substrate P. The illumination system IL for illuminating the pattern of the mask M with the exposure light EL emitted from the light source device 5, and the pattern image of the mask M illuminated with the exposure light EL on the substrate P. A projection optical system PL for projecting and a control device 2 for controlling the overall operation of the exposure apparatus EX are provided.

  Here, the substrate includes a substrate such as a semiconductor wafer coated with a photosensitive material (photoresist), and the mask includes a reticle on which a device pattern to be reduced and projected is formed on the substrate. In this embodiment, a transmissive mask is used as a mask, but a reflective mask may be used.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects a pattern image of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the synchronous movement direction (scanning direction) between the mask M and the substrate P is the Y-axis direction.

  The mask M is obtained by forming a predetermined pattern on a transparent plate member such as a glass plate using a light shielding film such as chrome, and has a pattern forming surface MA on which the pattern is arranged. In the present embodiment, the mask M is a parallel plate, and the pattern formation surface MA is provided on the lower surface of the mask M. The mask stage 3 holds the mask M so that the pattern formation surface MA and the XY plane are substantially parallel. The control device 2 irradiates the mask M with the exposure light EL from the illumination system IL, and irradiates the exposure light EL that has passed through the mask M onto the substrate P through the projection optical system PL, thereby forming the pattern of the mask M. The image of the pattern arranged on the surface MA is projected onto the substrate P, and the substrate P is exposed.

  The exposure apparatus EX of the present embodiment includes an immersion system 1 that fills a predetermined space K1 on the optical path of the exposure light EL of the illumination system IL with a liquid LQ. Using the liquid immersion system 1, the control device 2 can fill the predetermined space K1 on the optical path of the exposure light EL of the illumination system IL with the liquid LQ. The illumination system IL illuminates the pattern of the mask M with the exposure light EL in a state where the predetermined space K1 on the optical path of the exposure light EL is filled with the liquid LQ.

  Further, the exposure apparatus EX of the present embodiment includes a measuring apparatus 30 that measures the optical characteristics of the liquid LQ that satisfies the optical path of the exposure light EL. The optical characteristics of the liquid LQ include at least one of the refractive index of the liquid LQ with respect to the exposure light EL and the transmittance of the liquid LQ. The measuring device 30 can measure at least one of the refractive index of the liquid LQ with respect to the exposure light EL and the transmittance of the liquid LQ. The measuring device 30 measures the liquid LQ before being supplied to the predetermined space K1 including the optical path of the exposure light EL.

First, the illumination system IL will be described. The illumination system IL has a light source device 5 that emits exposure light EL for exposing the substrate P, and illuminates the pattern of the mask M with the exposure light EL emitted from the light source device 5. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, , Vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In the present embodiment, an ArF excimer laser device is used for the light source device 5, and ArF excimer laser light is used for the exposure light EL.

  The illumination system IL can illuminate a predetermined illumination area IA on the mask M with the exposure light EL having a uniform illuminance distribution, and has a blind device 6 having an opening that defines the illumination area IA of the exposure light EL on the mask M. It has. The illumination system IL of the present embodiment is arranged on the optical path of the exposure light EL emitted from the beam shaping optical system and the beam shaping optical system that shapes the exposure light EL (laser beam) emitted from the light source device 5. The optical integrator, an aperture stop disposed on the light exit surface of the optical integrator, and various optical elements (optical members) such as a relay optical system and a condenser optical system. The beam shaping optical system includes, for example, a cylindrical lens, a beam expander, and the like, and is emitted from the light source device 5 so that the exposure light EL (laser beam) emitted from the light source device 5 is efficiently incident on the optical integrator. The cross-sectional shape of the exposure light EL (laser beam) is shaped. The optical integrator includes a fly-eye lens and forms a secondary light source on its light exit surface.

  The blind device 6 functions as a fixed blind 8 having an opening 8K for defining the illumination area IA by the exposure light EL on the mask M, and a light shielding member for preventing the substrate P from being irradiated with unnecessary exposure light EL. The movable blind 7 is provided.

  The fixed blind 8 has an opening 8K through which the exposure light EL can pass, and the illumination area IA on the mask M is defined using the opening 8K. The fixed blind 8 is arranged at a position (a slightly defocused position) away from a position optically conjugate with the pattern forming surface MA on which the pattern of the mask M is arranged. In the present embodiment, the opening 8K of the fixed blind 8 is rectangular.

  The movable blind 7 has an opening (light passage area) 7K through which the exposure light EL can pass, and is arranged at a position optically conjugate with or near the pattern formation surface MA on which the pattern of the mask M is arranged. Has been. In the present embodiment, the movable blind 7 is disposed in the vicinity of the fixed blind 8. The movable blind 7 is provided to be movable in synchronization with the movement of at least one of the mask M having a pattern and the substrate P. The movable blind 7 prevents unnecessary exposure of the substrate P by the exposure light EL by blocking irradiation of the exposure light EL to portions other than the pattern formation region of the mask M. Specifically, the movable blind 7 uses the movable blind 7 to further limit the illumination area IA before and after the start of one scanning exposure, thereby performing unnecessary exposure of the substrate P with the exposure light EL. To prevent. An example of the blind device 6 having such a movable blind 7 is disclosed in, for example, the pamphlet of International Publication No. 99/63585.

  The exposure light EL emitted from the light source device 5 enters the optical integrator after passing through the beam shaping optical system. The optical integrator forms a secondary light source on its light exit surface. The exposure light EL emitted from the secondary light source illuminates the blind device 6 in a superimposed manner after passing through the aperture stop. The exposure light EL incident on the blind device 6 passes through the opening 7K of the movable blind 7 and the opening 8K of the fixed blind 8 of the blind device 6, and then is held on the mask stage 3 via a predetermined optical element or the like. The illumination area IA on M is illuminated with a uniform illuminance distribution.

  Next, the mask stage 3 will be described. The mask stage 3 is movable in the X-axis, Y-axis, and θZ directions while holding the mask M by driving a mask stage driving device 3D including an actuator such as a linear motor. Position information of the mask stage 3 (and hence the mask M) is measured by the laser interferometer 3L. The laser interferometer 3L measures the position information of the mask stage 3 using the reflecting surface 3K of the moving mirror provided on the mask stage 3. The control device 2 drives the mask stage driving device 3D based on the measurement result of the laser interferometer 3L, and controls the position of the mask M held on the mask stage 3.

  Next, the projection optical system PL will be described. The projection optical system PL projects the pattern image of the mask M onto the substrate P at a predetermined projection magnification, and has a plurality of optical elements, and these optical elements are held by a lens barrel PK. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, 1/8 or the like. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  Next, the substrate stage 4 will be described. The substrate stage 4 has a substrate holder for holding the substrate P. The substrate stage 4 is held on the base member BP in a state where the substrate P is held by the substrate holder by driving of a substrate stage driving device 4D including an actuator such as a linear motor. , X-axis, Y-axis, Z-axis, θX, θY, and θZ directions are movable in directions of six degrees of freedom.

  The position information of the substrate stage 4 (and thus the substrate P) is measured by the laser interferometer 4L. The laser interferometer 4 </ b> L uses the reflecting surface 4 </ b> K provided on the substrate stage 4 to measure position information regarding the X-axis, Y-axis, and θZ directions of the substrate stage 4. Further, surface position information (position information regarding the Z-axis, θX, and θY directions) of the surface of the substrate P held on the substrate stage 4 is detected by a focus / leveling detection system (not shown). The control device 2 drives the substrate stage driving device 4D based on the measurement result of the laser interferometer 4L and the detection result of the focus / leveling detection system, and controls the position of the substrate P held on the substrate stage 4.

  FIG. 2 is a side sectional view showing the vicinity of the predetermined space K1 on the optical path of the exposure light EL that is filled with the liquid LQ by the liquid immersion system 1 in the illumination system IL.

  The illumination system IL has a plurality of optical elements arranged on the optical path of the exposure light EL. As shown in FIG. 2, the illumination system IL includes a first optical element G1 that is closest to the pattern formation surface MA of the mask M, a second optical element G2 that is next to the pattern formation surface MA after the first optical element G1, and a first optical element G2. The second optical element G2 has a third optical element G3 close to the pattern formation surface MA, and the third optical element G3 has a fourth optical element G4 close to the pattern formation surface MA.

  The plurality of optical elements of the illumination system IL are held by the same holding member. As shown in FIG. 2, in the present embodiment, the second, third, and fourth optical elements G2, G3, and G4 are held by a holding member (housing) 60. Although not shown, the first optical element G1 is also held by a member (not shown) different from the holding member 60. Of course, the first optical element G1 may be held by the holding member 60.

  The liquid immersion system 1 fills a predetermined space K1 near the pattern formation surface MA of the mask M on which the pattern is arranged with the liquid LQ. In the present embodiment, the immersion system 1 fills a predetermined space K1 between the first optical element G1 and the second optical element G2 in the optical path of the exposure light EL with the liquid LQ. The liquid LQ is filled in a predetermined space K1 in the vicinity of the pattern formation surface MA of the mask M and including the optical path between the first optical element LS1 and the second optical element LS2.

  Here, in the following description, the predetermined space K1 is appropriately referred to as a first space K1.

  The second optical element G2 has an incident surface T4 on which the exposure light EL is incident and a light emission surface T3 on which the exposure light EL is emitted. That is, the exposure light EL emitted from the light source device 5 and passing through the blind device 6 passes through the fourth optical element G4 and the third optical element G3, and then enters the incident surface T4 of the second optical element G2. The exposure light EL that has entered the incident surface T4 of the second optical element G2 passes through the second optical element G2, and then exits from the light exit surface T3.

  In the present embodiment, the incident surface T4 and the light exit surface T3 of the second optical element G2 are curved surfaces that are convex in a direction away from the pattern formation surface MA of the mask M. In the present embodiment, the incident surface T4 and the light exit surface T3 of the second optical element G2 are substantially concentric with each other, and the entrance surface T4 and the light exit surface T3 are away from the pattern formation surface MA of the mask M. Convex spherical surface. That is, the center of curvature of the entrance surface T4 and the center of curvature of the light exit surface T3 coincide. Note that at least one of the incident surface T4 and the light exit surface T3 of the second optical element G2 may be an aspherical surface. In the present embodiment, the first optical element G1 is a parallel plate having an upper surface T2 capable of holding the liquid LQ between the first optical element G1 and the light emission surface T3 of the second optical element G2.

  The immersion system 1 is provided in the vicinity of the first space K1 including the optical path of the exposure light EL between the upper surface T2 of the first optical element G1 and the light exit surface T3 of the second optical element G2, and the first space K1. Are provided with a supply port 12 capable of supplying the liquid LQ and a recovery port 22 capable of recovering the liquid LQ in the first space K1. In the present embodiment, the supply port 12 and the recovery port 22 are provided in the holding member 60 that holds the second optical element G2. The holding member 60 is formed in an annular shape so as to surround the optical path of the second optical element G2 and the exposure light EL, and the supply port 12 is provided on the inner surface of the holding member 60 facing the optical path of the exposure light EL, and is collected. The mouth 22 is provided on the lower surface 60A of the holding member 60 that faces the upper surface T2 of the first optical element G1. In the present embodiment, the lower surface 60A of the holding member 60 is provided below (+ Z side) the second optical element G2, and the lower surface 60A of the holding member 60 and the upper surface T2 of the first optical element G1 A predetermined gap GA1 is formed between the two. Further, the lower surface 60A of the holding member 60 and the upper surface T2 of the first optical element G1 are substantially parallel.

  The liquid immersion system 1 is connected to the supply port 12 via a supply channel 14 formed inside the supply tube 13 and the holding member 60, and is connected to the supply port 12 via the supply tube 13 and the supply channel 14. The liquid supply device 10 for supplying the liquid LQ is connected to the recovery port 22 via the recovery channel 23 formed in the recovery pipe 23 and the holding member 60, and the recovery channel 24 supplies the liquid LQ from the recovery port 22. And a liquid recovery apparatus 20 that recovers via a recovery pipe 23. For example, a titanium mesh member or a ceramic porous member can be disposed in the recovery port 22.

  The liquid supply device 10 includes a temperature adjustment device that adjusts the temperature of the liquid LQ to be supplied, a deaeration device that reduces a gas component in the liquid LQ, a filter unit that removes foreign matters in the liquid LQ, and the like. The temperature-controlled liquid LQ can be delivered. The liquid recovery apparatus 20 includes a vacuum system and the like and can recover the liquid LQ.

  The operations of the liquid supply device 10 and the liquid recovery device 20 are controlled by the control device 2. The liquid LQ delivered from the liquid supply apparatus 10 flows through the supply pipe 13 and the supply flow path 14 of the holding member 60, and then is supplied from the supply port 12 to the first space K1 including the optical path of the exposure light EL. Further, the liquid LQ recovered from the recovery port 22 by driving the liquid recovery device 20 flows through the recovery flow path 24 of the holding member 60 and is then recovered by the liquid recovery device 20 via the recovery tube 23.

  The control device 2 controls the liquid immersion system 1 and performs a liquid supply operation by the liquid supply device 10, so that the space between the light emission surface T3 of the second optical element G2 and the upper surface T2 of the first optical element G1 is reached. The first space K1 can be filled with the liquid LQ. The liquid LQ supplied from the liquid supply device 10 to the first space K1 is in close contact with each of the light emitting surface T3 of the second optical element G3 and the upper surface T2 of the first optical element G1, and the first optical element G1. It is filled between the second optical element G2.

  In addition, the control device 2 controls the liquid immersion system 1 and performs a liquid recovery operation by the liquid recovery device 20, whereby the light emission surface T3 of the second optical element G2 and the upper surface T2 of the first optical element G1 are The liquid LQ in the first space K1 can be recovered.

  Further, as shown in FIG. 2, the liquid immersion system 1 allows the first space K1 to be formed with the liquid LQ so that the liquid immersion region LR is locally formed in a partial region of the upper surface T2 of the first optical element G1. Fulfill. In the present embodiment, the liquid LQ that forms the immersion region LR on the upper surface T2 of the first optical element G1 is held between the light exit surface T3 of the second optical element G2 and the upper surface T2 of the first optical element G1. At the same time, it is held between at least a part of the lower surface 60A of the holding member 60 and the upper surface T2 of the first optical element G1. In the present embodiment, the liquid LQ fills the first space K1 including the optical path of the exposure light EL between the light exit surface T3 of the second optical element G2 and the upper surface T2 of the first optical element G1, and the immersion region LR. Is formed, the interface LG between the liquid LQ forming the liquid immersion region LR and the gas space outside the liquid LQ is formed between the lower surface 60A of the holding member 60 and the upper surface T2 of the first optical element G1 by the surface tension of the liquid LQ. It is supposed to be maintained in between.

  In the present embodiment, a predetermined gap GA2 is formed between the lower surface T1 of the first optical element G1 and the upper surface of the mask M. The lower surface T1 of the first optical element G1 and the upper surface of the mask M are substantially parallel. Further, a space between the lower surface T1 of the first optical element G1 and the upper surface of the mask M is a gas space.

  The exposure light EL emitted from the light source device 5 and passing through the blind device 6 passes through the fourth optical element G4, passes through the third optical element G3, and then enters the incident surface T4 of the second optical element G2. The exposure light EL that has entered the incident surface T4 of the second optical element G2 passes through the second optical element G2, and then exits from the light exit surface T3. The exposure light EL emitted from the light emission surface T3 of the second optical element G2 passes through the liquid LQ in the first space K1, and then enters the upper surface T2 of the first optical element G1. The exposure light EL that has entered the upper surface T2 of the first optical element G1 passes through the first optical element G1, and then is emitted from the lower surface T1, and is a gas between the lower surface T1 of the first optical element G1 and the upper surface of the mask M. After passing through the space, the mask M is irradiated. As described above, the illumination system IL of the present embodiment includes the mask M via the liquid LQ that fills the first space K1 between the light exit surface T3 of the second optical element G2 and the upper surface T2 of the first optical element G1. The predetermined illumination area IA is illuminated with the exposure light EL.

  Next, the liquid LQ and the second optical element G2 will be described. In the following description, for the sake of simplicity, the refractive index of the liquid LQ with respect to the exposure light EL is appropriately referred to as the refractive index of the liquid LQ, and the refractive index of the second optical element G2 with respect to the exposure light EL is referred to as the second optical element G2. The refractive index is referred to as appropriate.

  In the present embodiment, the refractive index of the liquid LQ with respect to the exposure light EL (ArF excimer laser light: wavelength 193 nm) is larger than the refractive index of the second optical element G2 with respect to the exposure light EL and includes the optical path of the exposure light EL. The one space K1 is filled with the liquid LQ having a refractive index larger than the refractive index of the second optical element G2. For example, when the second optical element G2 is formed of quartz (synthetic quartz), the refractive index of quartz is about 1.51, so that the liquid LQ has a refractive index larger than that of quartz, For example, those having a refractive index of 1.6 or more (about 1.6 to 2.0) are used.

  In the present embodiment, the optical path on the + Z side (the third optical element G3 side, the incident surface T4 side) of the first optical element G2 is filled with gas (for example, nitrogen), and the −Z side (the first optical element G2) The optical path on the one optical element G1 side and the light emission surface T3 side) is filled with the liquid LQ. As described above, the shape of the entrance surface T4 on the + Z side and the shape of the light exit surface T3 on the −Z side of the second optical element G2 are curved surfaces (spherical surfaces) that protrude in a direction away from the pattern formation surface MA of the mask M. In other words, all the light rays that should be incident on the pattern forming surface MA of the mask M are incident.

Examples of the liquid LQ include predetermined liquids having C—H bonds and O—H bonds such as isopropanol having a refractive index of about 1.50 and glycerol (glycerin) having a refractive index of about 1.61, hexane, heptane, and decane. And a predetermined liquid (organic solvent). Alternatively, any two or more of these predetermined liquids may be mixed, or the predetermined liquid may be added (mixed) to pure water. Alternatively, the liquid LQ may be one obtained by adding (mixing) a base or an acid such as H ⁺ , Cs ⁺ , K ⁺ , Cl ⁻ , SO ₄ ²⁻ or PO ₄ ^{2− to} pure water. Further, it may be one obtained by adding (mixing) fine particles such as Al oxide to pure water. These liquids LQ can transmit ArF excimer laser light. The liquid LQ preferably has a small light absorption coefficient and low temperature dependency.

  The second optical element G2 can be formed of, for example, quartz (silica). Alternatively, it may be formed of a single crystal material of a fluoride compound such as calcium fluoride (fluorite), barium fluoride, strontium fluoride, lithium fluoride, and sodium fluoride. Further, other optical elements G1, G3, G4 and the like can be formed of the above-described materials.

  Further, for example, the second optical element G2 may be formed of fluorite and the other optical elements G1, G3, G4, etc. may be formed of quartz, or the optical second optical element G2 may be formed of quartz, and other optical elements may be formed. The elements G1, G3, G4, etc. may be formed of fluorite, or all optical elements including the optical elements G1, G2, G3, G4 may be formed of quartz (or fluorite).

  Further, the optical element of the illumination system IL including the second optical element G2 may be formed of a material having a refractive index higher than that of quartz or fluorite (for example, 1.6 or more). For example, the optical element of the illumination system IL can be formed using sapphire, germanium dioxide, or the like as disclosed in International Publication No. 2005/059617 pamphlet. Or the optical element of illumination system IL can be formed using potassium chloride (refractive index of about 1.75) etc. which are disclosed by the international publication 2005/059618 pamphlet.

  Next, the measuring device 30 will be described. The measuring device 30 measures the optical characteristics of the liquid LQ before being supplied to the first space K1 by the liquid supply device 10, and includes the liquid supply device 10 and the holding member 60 (supply port 12). It is provided in the middle of the supply pipe 13 between.

  FIG. 3 is a schematic perspective view showing the measuring device 30, and FIG. 4 is a cross-sectional view. 3 and 4, the measuring device 30 includes a flow path forming member 33 provided in the middle of the supply pipe 13 through which the liquid LQ flows, and a light projecting device 34 that irradiates the flow path forming member 33 with the measurement light La. An optical element (condensing optical system) 35 that condenses the measurement light La that has passed through the flow path forming member 33, and an imaging element 36 that includes a CCD or the like that receives the measurement light La via the optical element 35. ing. The measurement light La emitted from the light projecting device 34 to the flow path forming member 33 is a parallel light beam having an appropriate cross-sectional area. The distance between the optical element 35 and the imaging element 36 is set to be substantially equal to the focal length of the optical element 35, and the optical element 35 places the measurement light La that has passed through the optical element 35 on the imaging element 36. Condensate. The measurement light La emitted from the light projecting device 34 has substantially the same wavelength as the exposure light EL (193 nm which is the wavelength of ArF excimer laser light).

  The flow path forming member 33 is formed of a member that can pass the measurement light La (exposure light EL), such as quartz or fluorite, and is a tubular member formed in a triangular shape in cross section. The flow path forming member 33 has a function as a prism. A flow path 37 through which the liquid LQ flows is formed inside the flow path forming member 33. One end of the flow path 37 formed by the flow path forming member 33 is connected to the liquid supply apparatus 10 via the supply pipe 13. The liquid LQ delivered from the liquid supply apparatus 10 flows into one end of the flow path 37 via the supply pipe 13. The other end of the flow path 37 formed by the flow path forming member 33 is connected to the supply port 12 via the supply pipe 13 and the supply flow path 14. The liquid LQ delivered from the liquid supply apparatus 10 and flowing into one end of the flow path 37 flows through the flow path 37, then flows out from the other end, and is supplied to the supply port 12 through the supply pipe 13 and the supply flow path 14. Is done. Thus, the liquid LQ supplied from the liquid supply apparatus 10 to the supply port 12 (first space K1) flows through the flow path 37 of the flow path forming member 33. The flow path 37 is filled with the liquid LQ supplied to the first space K1.

  When measuring the optical characteristics of the liquid LQ using the measuring device 30, the control device 2 is configured so that the flow path 37 of the flow path forming member 33 is filled with the liquid LQ. The measurement light La is irradiated onto the first surface 33A from the light projecting device 34 at an oblique incidence. Since the flow path forming member 33 can transmit the measurement light La, the measurement light La applied to the flow path forming member 33 is applied to the liquid LQ flowing through the flow path 37. Then, the measurement light La irradiated to the liquid LQ flowing through the flow path 37 passes through the liquid LQ, and then is emitted to the outside from the second surface 33B of the flow path forming member 33. The measurement light La emitted from the second surface 33B of the flow path forming member 33 is condensed on the image sensor 36 by the optical element 35.

  The condensing position of the measurement light La on the image sensor 36 changes according to the optical characteristics of the liquid LQ flowing through the flow path 37. Specifically, the incident angle and the emission angle at the interface between the flow path forming member 33 and the liquid LQ change in accordance with the refractive index of the liquid LQ filled in the flow path 37 with respect to the measurement light La, whereby the liquid Since the optical path of the measurement light La passing through the LQ varies, the condensing position of the measurement light La on the image sensor 36, that is, the light reception position of the measurement light La by the image sensor 36 changes as indicated by an arrow F1 in FIG. To do. The light reception result of the image sensor 36 is output to the control device 2. Here, the control device 2 (or a predetermined storage device connected to the control device 2) receives the measurement light La on the image sensor 36 and the measurement light La of the liquid LQ flowing through the flow path 37. The relationship with the refractive index is stored in advance. The control device 2 can obtain the refractive index of the liquid LQ flowing through the flow path 37 with respect to the measurement light La based on the light reception result of the image sensor 36 and the stored storage information.

  Further, the amount of the measurement light La received by the image sensor 36 changes according to the transmittance of the liquid LQ flowing through the flow path 37 with respect to the measurement light La. The light reception result of the image sensor 36 is output to the control device 2. Here, the control device 2 (or a predetermined storage device connected to the control device 2) receives the measurement light La on the image sensor 36 and the measurement light La of the liquid LQ flowing through the flow path 37. The relationship with the transmittance is stored in advance. The control device 2 can also determine the transmittance of the liquid LQ flowing through the flow path 37 with respect to the measurement light La based on the light reception result of the image sensor 36 and the stored storage information.

  Since the measurement light La has substantially the same wavelength as the exposure light EL, the control device 2 can obtain the refractive index and transmittance of the liquid LQ with respect to the exposure light EL. As described above, the measuring device 30 optically obtains the optical characteristics including at least one of the refractive index and the transmittance of the liquid LQ with respect to the exposure light EL using the measuring light La.

  Next, a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  In order to expose the substrate P, the control device 2 loads (loads in) the mask M onto the mask stage 3 and loads the substrate P onto the substrate stage 4 using a transport system (not shown). Further, the control device 2 controls the liquid immersion system 1 and starts an operation of filling the first space K1 including the optical path of the exposure light EL between the first optical element G1 and the second optical element G2 with the liquid LQ. To do.

  The control device 2 drives the liquid supply device 10 of the liquid immersion system 1 in order to fill the first space K1 with the liquid LQ. The liquid LQ delivered from the liquid supply apparatus 10 flows through the supply pipe 13 and the supply flow path 14 of the holding member 60 and is then supplied from the supply port 12 to the first space K1.

  Further, in the present embodiment, the control device 2 controls the liquid supply device 10 and the liquid recovery device 20 of the liquid immersion system 1 to fill the first space K1 with the liquid LQ, and the liquid for the first space K1. The supply operation and the liquid recovery operation in the first space K1 are performed in parallel. Thus, the first space K1 is filled with the clean and temperature-adjusted liquid LQ supplied from the liquid supply apparatus 10.

  Then, in order to expose the substrate P, the control device 2 controls the illumination system IL and starts illuminating the mask M with the exposure light EL. The control device 2 makes the lower surface T1 of the first optical element G1 and the upper surface of the mask M face each other, and the exposure light EL between the light exit surface T3 of the second optical element G2 and the upper surface T2 of the first optical element G1. In a state where the first space K1 including the optical path is filled with the liquid LQ, a predetermined illumination area IA of the mask M is illuminated with the exposure light EL using the illumination system IL. The illumination system IL exposes a predetermined illumination area IA of the mask M through the liquid LQ that fills the first space K1 between the light exit surface T3 of the second optical element G2 and the upper surface T2 of the first optical element G1. Illuminate with light EL. The pattern image of the mask M illuminated with the exposure light EL is projected onto the substrate P via the projection optical system PL.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus, and the control apparatus 2 controls the mask stage 3 and the substrate stage 4 so that the substrate P is moved in synchronization with the movement of the mask M in the Y-axis direction. While moving in the Y-axis direction, the mask M is illuminated with the exposure light EL, and the pattern image of the mask M is projected onto the substrate P via the projection optical system PL. The exposure apparatus EX is a pattern image of the mask M formed by the exposure light EL emitted from the illumination system IL and irradiated onto the substrate P via the mask M and the projection optical system PL. The shot area) is exposed.

  The control device 2 irradiates the mask M with the exposure light EL by the illumination system IL while performing the liquid supply operation for the first space K1 and the liquid recovery operation for the first space K1 in parallel. That is, the control device 2 controls the liquid supply device 10 and the liquid recovery device 20 of the immersion system 1 even during the exposure of the substrate P, so that the liquid supply operation to the first space K1 and the liquid recovery of the first space K1 are performed. Perform operations in parallel. Thus, even during the exposure of the substrate P, the first space K1 is filled with the clean and temperature-adjusted liquid LQ supplied from the liquid supply apparatus 10.

  In the present embodiment, the control device 2 uses the measurement device 30 to measure (monitor) the optical characteristics of the liquid LQ supplied from the liquid supply device 10 to the first space K1, while performing the first measurement. The liquid LQ is supplied to the space K1, and the mask M is irradiated with the exposure light EL through the liquid LQ. Thereby, the first space K1 can be filled with the liquid LQ whose refractive index with respect to the exposure light EL is measured.

  Further, the control device 2 can adjust the refractive index of the liquid LQ supplied from the liquid supply device 10 to the first space K1 with respect to the exposure light EL based on the measurement result of the measurement device 30. The liquid supply device 10 includes a temperature adjustment device capable of adjusting the temperature of the liquid LQ supplied to the first space K1, and the refractive index of the liquid LQ with respect to the exposure light EL is adjusted by adjusting the temperature of the liquid LQ. Can be adjusted. Here, the relationship between the temperature of the liquid LQ and the refractive index of the liquid LQ with respect to the exposure light EL is obtained in advance by, for example, experiments or simulations, and information regarding the relationship is given to the control device 2 (or the control device 2). Stored in a predetermined storage device). Based on the stored information stored and the measurement result of the measuring device 30, the control device 2 sets the temperature adjustment device to bring the optical characteristics of the liquid LQ (refractive index with respect to the exposure light EL) into a desired state. Is used to adjust the temperature of the liquid LQ. As described above, the control device 2 adjusts the temperature of the liquid LQ based on the measurement result of the measurement device 30, thereby optical properties of the liquid LQ that fills the first space K1 (refractive index with respect to the exposure light EL). Can be adjusted.

  In the present embodiment, the control device 2 moves the movable blind 7 in a direction corresponding to the scanning direction (Y-axis direction) of the mask M in synchronization with the movement of at least one of the mask M and the substrate P. . The control device 2 detects the position detection result of the movable blind 7 on the basis of the measurement result of the laser interferometer 3L before the start of the scanning exposure of the shot area on the substrate P, during the scanning exposure, and after the end of the scanning exposure. In synchronization with the movement of the mask M, the movable blind 7 is moved. The movable blind 7 blocks unnecessary exposure light EL from being irradiated on the substrate P at the start and end of scanning exposure of one shot area on the substrate P. The movable blind 7 prevents unnecessary exposure of the substrate P by the exposure light EL by blocking the exposure of the exposure light EL to the portion of the mask M other than the pattern formation region where the pattern is formed. Thereby, the board | substrate P can be exposed favorably.

  As described above, the illumination system IL of the present embodiment can illuminate the pattern of the mask M with the exposure light EL in a state where the first space K1 on the optical path of the exposure light EL is filled with the liquid LQ. As a result, it is possible to suppress an increase in the size of the illumination system IL and consequently an increase in the size of the entire exposure apparatus EX.

For example, the coherence factor (σ of the illumination system) that is the ratio of the numerical aperture NA of the projection optical system PL and the numerical aperture NAi of the illumination system IL may affect the quality of the pattern image. In order to obtain a desired value, it may be necessary to increase the numerical aperture NAi of the illumination system IL in accordance with the numerical aperture NA of the projection optical system PL. The coherence factor (σ of the illumination system) is NAr when the numerical aperture on the mask M side of the projection optical system PL is NAr, and NAi is the numerical aperture of the illumination system IL.
σ = NAi / NAr (1)
It is. Further, the numerical aperture NA of the projection optical system usually indicates the numerical aperture NAw on the substrate P side, and when the magnification of the projection optical system is β, the numerical aperture NAr on the mask M side is
NAr = NAw / β (2)
It is.

  Increasing the numerical aperture NAi of the illumination system IL may increase the size of the illumination system IL. By constructing the illumination system IL using an optical element having a large refractive index with respect to the exposure light EL, there is a possibility that an increase in the size of the illumination system IL can be suppressed while maintaining a large numerical aperture NAi. However, the material of the optical element that can pass the exposure light EL is limited, and it is difficult to reduce the size of the illumination system IL (illumination optical system) by optimizing (selecting) the material of the optical element.

  In the present embodiment, by filling the first space K1 on the optical path of the exposure light EL of the illumination system IL with, for example, the liquid LQ having a refractive index larger than the refractive index of the second optical element G2 with respect to the exposure light EL, While maintaining a large numerical aperture NAi of the illumination system IL, it is possible to suppress an increase in the size of the illumination system IL, and the pattern of the mask M can be favorably illuminated using the illumination system IL. In addition, since the illumination system IL can be reduced in size, the illumination system IL can be reduced in weight, and is allowed even if the strength required for the body of the exposure apparatus EX is relatively low. Therefore, not only the exposure apparatus EX as a whole can be downsized, but also the apparatus cost can be reduced.

  In the present embodiment, in the illumination system IL, a portion where the numerical aperture NAi is large and a strong refractive power is required, that is, the first space K1 near the pattern formation surface MA of the mask M is filled with the liquid LQ. Yes. Thereby, the enlargement of illumination system IL can be suppressed.

  In the present embodiment, since the light exit surface T3 of the second optical element G2 is a curved surface (spherical surface) that protrudes away from the pattern formation surface MA of the mask M, the refractive index of the liquid LQ with respect to the exposure light EL. Is larger than the refractive index of the second optical element G2 with respect to the exposure light EL, and the numerical aperture NAi of the illumination system IL is larger than the refractive index of the second optical element G2 with respect to the exposure light EL. It is possible to satisfactorily reach the pattern formation surface MA of the mask M.

  In the present embodiment, since the first optical element G1 is a parallel plate, the positioning accuracy of the first optical element G1 with respect to the direction (XY direction) orthogonal to the optical axis (Z axis) of the illumination system IL is relatively high. Even loose is acceptable. For this reason, it is possible to suppress the complexity of the holding mechanism for holding the first optical element G1 and reduce the apparatus cost.

  In the present embodiment, since the exposure light EL is irradiated while performing the liquid supply operation for the first space K1 and the liquid recovery operation for the first space K1, the liquid LQ that is clean and temperature-adjusted. Thus, the first space K1 can always be filled. In particular, when the transmittance of the liquid LQ to the exposure light EL is low and the temperature of the liquid LQ is likely to change (rise) due to the absorption of the exposure light EL, the liquid supply operation to the first space K1 and the liquid in the first space K1. By irradiating the exposure light EL while performing the recovery operation in parallel, the temperature of the liquid LQ filling the first space K1 can be kept substantially constant.

  In addition, the measuring device 30 of the present embodiment measures the optical characteristics of the liquid LQ flowing through the flow path 37 that is a part of the flow path from the liquid supply apparatus 10 to the first space K1. By measuring the optical characteristics of the liquid LQ while flowing the liquid LQ, it is possible to measure the optical characteristics of the liquid LQ while suppressing a large temperature change of the liquid LQ, thereby improving the measurement accuracy. can do. Further, when the substrate P is exposed, the liquid LQ is supplied from the liquid supply device 10 to the first space K1, but the measuring device 30 is configured to supply the liquid LQ flowing through the flow path from the liquid supply device 10 to the first space K1. Therefore, it is possible to always measure (monitor) the characteristics of the liquid LQ while exposing the substrate P. In other words, since the liquid LQ measurement operation can be performed while the liquid LQ supply operation is performed, the liquid LQ measurement operation can be performed without stopping the operation of the exposure apparatus EX. Therefore, it is possible to suppress a decrease in the operating rate of the exposure apparatus EX.

  Note that a temperature sensor may be disposed in the vicinity of the measuring device 30 to measure the temperature of the liquid LQ as the optical characteristic of the liquid LQ. For example, when adjusting the optical characteristic (refractive index with respect to the exposure light EL) of the liquid LQ by adjusting the temperature of the liquid LQ, the optical characteristic of the liquid LQ is set to a desired state based on the detection result of the temperature sensor. In order to achieve this, the temperature of the liquid LQ may be adjusted.

  In the first embodiment described above, the exposure light EL is irradiated while the liquid supply operation for the first space K1 and the liquid recovery operation for the first space K1 are performed in parallel, but the exposure light EL is irradiated. The liquid supply operation to the first space K1 and the liquid recovery operation in the first space K1 are stopped, and the liquid supply operation and the liquid recovery operation are performed at a predetermined timing when the irradiation of the exposure light EL is stopped. The liquid LQ in the space K1 may be replaced.

  Further, without replacing (exchange) the liquid LQ in the first space K1, the first space K1 may be a sealed space, for example, and the sealed first space K1 may be filled with the liquid LQ. In this case, the immersion system 1 can be omitted.

  In the first embodiment described above, the first optical element G1 is a parallel plate. However, the first optical element G1 has an upper surface T2 that can hold the liquid LQ with the light emission surface T3 of the second optical element G2. For example, the first optical element G1 may be an optical element (lens) having refractive power.

  In the first embodiment described above, the liquid LQ having a refractive index larger than the refractive index for the exposure light EL of the second optical element G2 is used. However, the refractive index for the exposure light EL of the second optical element G2 is used. A liquid LQ having a smaller refractive index may be used. For example, water (pure water) may be used as the liquid LQ. Here, the refractive index for water exposure light EL (ArF excimer laser light) is about 1.44, and the refractive index for quartz exposure light EL (ArF excimer laser light) is about 1.51.

Second Embodiment
Next, a second embodiment will be described. In the first embodiment described above, the liquid supply apparatus 10 adjusts the optical characteristic of the liquid LQ (refractive index with respect to the exposure light EL) by adjusting the temperature of the liquid LQ. A characteristic feature of the present embodiment, which is different from the form, is that the optical characteristics of the liquid LQ are adjusted by using a plurality of liquids of different types (materials). In the following description, the same or equivalent components as those in the first embodiment described above are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 5 is a diagram illustrating the liquid supply apparatus 10 according to the second embodiment. In FIG. 5, the liquid supply apparatus 10 sends the first liquid LQ 1 from the first liquid supplier 41, the second liquid L 42 that can send the second liquid LQ 2, and the first liquid supplier 41. A mixing device 50 that mixes the first liquid LQ1 and the second liquid LQ2 delivered from the second liquid supplier 42, and the liquid LQ generated by the mixing device 50 is converted into the first space of the illumination system IL. Supply to K1. The first liquid LQ1 and the second liquid LQ2 are liquids having different optical characteristics, and the mixing device 50 mixes two types of liquids LQ1 and LQ2 having different optical characteristics. In this embodiment, the liquid produced | generated with the mixing apparatus 50 is called the liquid LQ.

  One end of a first supply pipe 43 is connected to the first liquid supplier 41, and the other end of the first supply pipe 43 is connected to a collecting pipe 45. One end of the second supply pipe 44 is connected to the second liquid supply device 42, and the other end of the second supply pipe 44 is connected to the collecting pipe 45. The first liquid LQ1 delivered from the first liquid supply device 41 flows through the first supply pipe 43 and then is supplied to the mixing device 50 via the collecting pipe 45. The second liquid LQ <b> 2 delivered from the second liquid supplier 42 flows through the second supply pipe 44 and is then supplied to the mixing device 50 via the collecting pipe 45.

  The first and second supply pipes 43 and 44 are provided with first and second valves 43B and 44B, respectively. The operation of the first and second valves 43B and 44B is controlled by the control device 2. The control device 2 adjusts the first and second valves 43B and 44B (the opening degree of the first and second valves 43B and 44B), thereby allowing the first and second liquid supply devices 41 and 42 to The supply amounts per unit time of the first and second liquids LQ1 and LQ2 supplied to the mixing device 50 are adjusted via the second supply pipes 43 and 44 and the collecting pipe 45.

  In addition, one end of the supply pipe 13 is connected to the mixing device 50, and the other end is connected to the supply port 12 (first space K1). Further, the measuring device 30 described in the first embodiment is provided in the middle of the supply pipe 13. The liquid LQ generated by the mixing device 50 is supplied to the first space K1 through the supply pipe 13 and the supply port 12.

  As described above, the first and second liquids LQ1, LQ2 have different optical characteristics (refractive index, transmittance). In order to adjust the optical characteristics of the liquid LQ generated by the mixing device 50 to a desired state, the control device 2 specifically controls at least one of the refractive index and the transmittance of the liquid LQ generated by the mixing device 50. Is adjusted to a desired value, the mixing ratio of the first and second liquids LQ1, LQ2 mixed by the mixing device 50 is adjusted based on the measurement result of the measuring device 30. That is, the control device 2 adjusts the optical characteristics of the liquid LQ supplied to the first space K1 using the mixing device 50 based on the measurement result of the measurement device 30.

  Here, the relationship between the mixing ratio of the first and second liquids LQ1 and LQ2 and the optical characteristics of the liquid LQ generated at the mixing ratio is obtained in advance by, for example, experiments or simulations. Information is stored in advance in the control device 2 (or a predetermined storage device connected to the control device 2). The control device 2 adjusts the first and second valves 43B and 44B based on the stored information stored and the measurement result of the measurement device 30 to bring the optical characteristics of the liquid LQ into a desired state. Then, the mixing ratio of the first and second liquids LQ1, LQ2 is determined. And the control apparatus 2 mixes the 1st, 2nd liquid LQ1 and LQ2 sent out from the 1st, 2nd liquid supply devices 41 and 42 using the mixing apparatus 50 based on the determined mixing ratio. To produce liquid LQ.

  For example, when the refractive index of the first liquid LQ1 with respect to the exposure light EL is larger than the refractive index of the second liquid LQ2 with respect to the exposure light EL, the refractive index of the liquid LQ is less than a desired value based on the measurement result of the measurement device 30. Is determined to be smaller, the control device 2 controls the first and second valves 43B and 44B so that the amount of the first liquid LQ1 supplied to the mixing device 50 is larger than the amount of the second liquid LQ2. . Further, when it is determined that the refractive index of the liquid LQ is larger than the desired value based on the measurement result of the measuring device 30, the control device 2 controls the first and second valves 43B and 44B to perform mixing. The amount of the second liquid LQ2 supplied to the device 50 is made larger than the amount of the first liquid LQ1. By doing so, the refractive index of the liquid LQ can be set to a desired value.

  As described above, in the present embodiment, the optical characteristics of the liquid LQ generated by the mixing device 50 are adjusted based on the measurement result of the measuring device 30.

Examples of the first and second liquids LQ1 and LQ2 include a predetermined liquid having a C—H bond and an OH bond such as isopropanol and glycerol (glycerin), and a predetermined liquid (organic solvent) such as hexane, heptane, and decane. Alternatively, any two or more of these predetermined liquids may be mixed, or the predetermined liquid may be added (mixed) to pure water. Alternatively, as the first and second liquids LQ1 and LQ2, a base or an acid such as H ⁺ , Cs ⁺ , K ⁺ , Cl ⁻ , SO ₄ ²⁻ , PO ₄ ^2−, or the like is added (mixed) to pure water. It may be a thing. Further, it may be one obtained by adding (mixing) fine particles such as Al oxide to pure water.

  Further, in the mixing device 50, in order to adjust the refractive index with respect to the exposure light EL among the optical characteristics of the liquid LQ, a predetermined substance such as Al oxide fine particles is mixed (added) to the liquid LQ. Alternatively, a predetermined substance for adjusting the transmittance of the liquid LQ may be mixed (added) to the liquid LQ. Further, the predetermined substance to be mixed with the liquid LQ may be a solid or a slurry. Further, solid fine particles may be dispersed in the liquid LQ, or after the solid is charged into the liquid LQ, the solid may be dissolved in the liquid LQ.

  Also in the second embodiment, the liquid supply device 10 is provided with a temperature adjusting device capable of adjusting the temperature of the liquid LQ, and by adjusting the temperature of the liquid LQ generated by the mixing device 50, the liquid LQ Optical characteristics (refractive index with respect to the exposure light EL) can be adjusted. Also, a temperature sensor capable of detecting the temperature of the liquid LQ is provided, and the temperature of the liquid LQ is adjusted so that desired optical characteristics (refractive index with respect to the exposure light EL) can be obtained based on the detection result of the temperature sensor. You may make it adjust.

  The first and second liquid supply devices 41 and 42 may supply the same type (material) of liquid as the first and second liquids LQ1 and LQ2. For example, the first liquid supplier 41 supplies glycerol having a first temperature as the first liquid LQ1, and the second liquid supplier 42 uses a second liquid LQ2 that is different from the first temperature. Glycerol having a temperature of may be supplied. In this case, although the materials of the first and second liquids LQ1 and LQ2 are the same, since the temperatures are different from each other, the optical characteristics (refractive indexes) of the first and second liquids LQ1 and LQ2 are different from each other. In the mixing device 50, the liquid LQ corresponding to the first and second temperatures is generated.

  In addition, the first and second liquids LQ1 and LQ2 may be the same material and may have different properties or components (water quality when the liquid is water). Here, the properties or components of the liquid include specific resistance value of the liquid, total organic carbon (TOC) in the liquid, particles or bubbles contained in the liquid. Examples include foreign substances, dissolved gas containing dissolved oxygen (DO) and dissolved nitrogen (DN), metal ion content, silica concentration in the liquid, viable bacteria, and the like.

<Third Embodiment>
Next, a third embodiment will be described. A characteristic part of the present embodiment is that a correction member for correcting unevenness in illuminance of the exposure light EL on the substrate P caused by the liquid LQ is provided.

  FIG. 6 is a schematic diagram illustrating an example of the correction member 80 according to the third embodiment. The correction member 80 causes unevenness in illuminance of the exposure light EL on the substrate P caused by the liquid LQ that fills the first space K1 including the optical path of the exposure light EL between the first optical element G1 and the second optical element G2. It is for correction. Similar to the above-described embodiment, the incident surface T4 and the light exit surface T3 of the second optical element G2 are curved surfaces that protrude in a direction away from the pattern formation surface MA of the mask M, and the upper surface T2 and the lower surface of the first optical element G1. T1 is a parallel plate substantially parallel to the pattern formation surface MA of the mask M (substantially parallel to the XY plane). Accordingly, the distance in the Z-axis direction at each position in the XY direction of the first space K1 is different from each other. For example, the distance Z1 in the Z-axis direction between the vertex (first point through which the optical axis passes) C1 of the light exit surface T3 of the second optical element G2 and the upper surface T2 of the first optical element G1, and the second optical element The distance Z2 in the Z-axis direction between the second point C2 at the periphery of the light exit surface T3 of G2 and the upper surface T2 of the first optical element G1 is different from each other, and the distance Z1 is larger than the distance Z2. In this case, for example, the length of the optical path (first length) when the exposure light EL that enters the upper surface T2 of the first optical element G1 from the first point C1 passes through the liquid LQ in the first space K1. And the length (second length) of the optical path when the exposure light EL that enters the upper surface T2 of the first optical element G1 from the second point C2 passes through the liquid LQ in the first space K1 is: Different from each other. For example, when the first length is longer than the second length, due to the transmittance of the liquid LQ, the upper surface of the first optical element G1 from the first point C1 via the liquid LQ in the first space K1. The intensity of the exposure light EL incident on T2 is smaller than the intensity of the exposure light EL incident on the upper surface T2 of the first optical element G1 from the second point C2 via the liquid LQ in the first space K1. That is, due to the liquid LQ that fills the first space K1 having a shape corresponding to the second optical element G2, unevenness in illuminance (illuminance distribution) occurs in the exposure light EL irradiated on the upper surface T2 of the first optical element G1. there's a possibility that. Then, due to the uneven illuminance of the exposure light EL on the upper surface T2 of the first optical element G1, the uneven illuminance of the exposure light EL on the pattern formation surface MA of the mask M, and consequently the exposure light EL on the substrate P, is determined. Irradiance unevenness may occur.

  The correction member 80 corrects the illuminance unevenness of the exposure light EL on the substrate P due to the thickness of the liquid LQ. In the present embodiment, the correction member 80 is provided on the optical path of the exposure light EL between the light source device 5 and the second optical element G2, that is, on the optical path of the exposure light EL of the illumination system IL. It is formed of an optical member capable of adjusting the intensity (intensity distribution) of the light to be transmitted. The correction member 80 includes an optical member (filter member) such as an ND filter (neutral density filter) that can adjust the transmittance (transmittance distribution). For example, when the illuminance of the central area of the illumination area IA on the mask M is smaller than the illuminance of the peripheral area due to the liquid LQ, the correction member 80 that equalizes the illuminance in the illumination area IA is provided. It is arranged on the optical path of the exposure light EL. For example, as the correction member 80, a member whose transmittance corresponding to the central region of the illumination region IA is larger than the transmittance of the region corresponding to the peripheral region of the illumination region IA is used. Then, by making the illuminance in the illumination area IA on the mask M uniform, the illuminance in the projection area by the projection optical system PL on the substrate P can be made uniform.

  In the present embodiment, the correction member 80 is disposed at or near a position optically conjugate with the upper surface T2 of the first optical element G1 in the optical path of the exposure light EL of the illumination system IL. The exposure light EL emitted from the light source device 5 passes through the correction member 80, then enters the second optical element G2, passes through the liquid LQ in the first space K1, and then enters the first optical element G1. The illuminance of the exposure light EL on the upper surface T2 of the first optical element G1 is made uniform by the correction member 80. The exposure light EL that has passed through the first optical element G1 is applied to the mask M. The exposure light EL that has passed through the mask M is irradiated onto the projection area on the substrate P via the projection optical system PL.

  As described above, even when uneven illuminance occurs due to the difference in the thickness of the liquid LQ (difference in the length of the optical path), the correction member 80 for correcting the uneven illuminance is provided. Thus, the mask M can be illuminated with the exposure light EL having a uniform illuminance distribution.

  The correction member 80 is not limited to the ND filter, and may be a variable slit member, for example. For example, an interdigital (comb-like) pattern may be formed on a transparent plate member such as a glass plate using a light shielding film such as chromium, and the transmittance may be changed gradually.

  In the present embodiment, the correction member 80 is disposed at a position optically conjugate with the upper surface T2 of the first optical element G1, or in the vicinity thereof. However, the illuminance unevenness of the exposure light EL on the substrate P is changed. If it can be corrected, it can be provided at an arbitrary position. In the present embodiment, the correction member 80 is provided on the optical path of the exposure light EL of the illumination system IL. However, if the unevenness of the exposure light EL on the substrate P can be corrected, for example, projection is performed. It may be provided on the optical path of the exposure light EL of the optical system PL or in the vicinity of the substrate P.

<Fourth embodiment>
Next, a fourth embodiment will be described. A characteristic part of the present embodiment is that a predetermined space on the optical path of the exposure light EL near the opening 7K of the movable blind 7 disposed at or near a position optically conjugate with the pattern formation surface MA of the mask M. It is in the point filled with the liquid LQ.

  FIG. 7 is a side sectional view showing the vicinity of the predetermined space K2 on the optical path of the exposure light EL in the vicinity of the opening 7K of the movable blind 7 filled with the liquid LQ in the illumination system IL according to the fourth embodiment.

  The illumination system IL has a plurality of optical elements arranged on the optical path of the exposure light EL. As shown in FIG. 7, the illumination system IL includes a fifth optical element G5 closest to the opening 7K of the movable blind 7, a sixth optical element G6 closest to the opening 7K of the movable blind 7 next to the fifth optical element G5, The seventh optical element G7 is next to the opening 7K of the movable blind 7 after the sixth optical element G6, and the eighth optical element G8 is next to the opening 7K of the movable blind 7 after the seventh optical element G7. Each of the sixth, seventh, and eighth optical elements G6, G7, and G8 is held by a holding member 60, and the fifth optical element G5 is held by a predetermined holding member (not shown). Of course, the fifth optical element G5 may be held by the holding member 60.

  Each of the fifth, sixth, seventh, and eighth optical elements G5, G6, G7, and G8 includes the first, second, third, and fourth optical elements G1, G2, and the like described in the first embodiment. It has almost the same configuration as G3 and G4. That is, the sixth optical element G6 has an incident surface T4 ′ on which the exposure light EL is incident and a light emission surface T3 ′ on which the exposure light EL is emitted, and the incident surface T4 ′ and the light emission surface T3 ′ are movable. The curved surface (spherical surface) is convex in the direction away from the opening 7K of the blind 7. The exposure light EL emitted from the light source device 5 and passing through the optical integrator or the like passes through the eighth optical element G8, passes through the seventh optical element G7, and then enters the incident surface T4 ′ of the sixth optical element G6. . The exposure light EL incident on the incident surface T4 'of the sixth optical element G6 passes through the sixth optical element G6 and is then emitted from the light exit surface T3'. The fifth optical element G5 is a parallel plate having an upper surface T2 'that can hold the liquid LQ with the light emission surface T3' of the sixth optical element G6.

  Further, the exposure apparatus EX of the present embodiment includes a second immersion system 1 ′ for filling the predetermined space K <b> 2 near the position optically conjugate with the pattern formation surface MA of the mask M with the liquid LQ. The second immersion system 1 'fills the predetermined space K2 near the position optically conjugate with the pattern formation surface MA of the mask M with the liquid LQ. In the present embodiment, the second immersion system 1 'fills a predetermined space K2 between the fifth optical element G5 and the sixth optical element G6 with the liquid LQ in the optical path of the exposure light EL. The liquid LQ is near the opening 7K of the movable blind 7, and is filled in a predetermined space K2 between the fifth optical element G5 and the sixth optical element G6. Also in the present embodiment, the refractive index of the liquid LQ with respect to the exposure light EL is larger than the refractive index of the sixth optical element G6 with respect to the exposure light EL.

  Here, in the following description, the predetermined space K2 is appropriately referred to as a second space K2.

  The second immersion system 1 ′ of the present embodiment has a configuration that is substantially equivalent to the immersion system 1 of the above-described embodiment, and a supply port 12 ′ that can supply the liquid LQ to the second space K2. Liquid that supplies the liquid LQ through the recovery port 22 ′ capable of recovering the liquid LQ in the second space K 2 and the supply channel 12 ′ formed in the supply port 12 ′ inside the supply pipe 13 ′ and the holding member 60. A supply device 10 ′ and a liquid recovery device 20 ′ that recovers the liquid LQ from the recovery port 22 ′ via a recovery flow path 24 ′ formed inside the holding member 60 and a recovery pipe 23 ′ are provided. The supply port 12 'and the recovery port 22' are provided in the holding member 60 that holds the sixth optical element G6. Further, the exposure apparatus EX of the present embodiment includes a measuring device 30 ′ that measures the optical characteristics of the liquid LQ. The measurement device 30 ′ of the present embodiment has a configuration equivalent to that of the measurement device 30 of the first embodiment described above, and measures the liquid LQ before being supplied to the second space K <b> 2.

  As in the first embodiment described above, a predetermined gap GA1 'is formed between the lower surface 60A of the holding member 60 and the upper surface T2' of the fifth optical element G5. Further, the lower surface 60A of the holding member 60 and the upper surface T2 of the fifth optical element G5 are substantially parallel.

  The liquid LQ supplied to the second space K2 from the liquid supply device 10 ′ of the second immersion system 1 ′ is in contact with each of the light emission surface T3 ′ of the sixth optical element G6 and the upper surface T2 ′ of the fifth optical element G5. It fills between 5th optical element G5 and 6th optical element G6 so that it may contact | adhere. Further, as shown in FIG. 7, the second immersion system 1 ′ has the second space so as to locally form an immersion region LR ′ in a partial region of the upper surface T2 ′ of the fifth optical element G5. Fill K2 with liquid LQ. When the liquid immersion region LR ′ is formed by filling the second space K2 with the liquid LQ, the interface LG ′ of the liquid LQ forming the liquid immersion region LR ′ is the upper surface of the fifth optical element G5 due to the surface tension of the liquid LQ. It is maintained between T2 ′ and the lower surface 60A of the holding member 60.

  In order to expose the substrate P, the control device 2 controls the second immersion system 1 ′ to include the second space including the optical path of the exposure light EL between the fifth optical element G5 and the sixth optical element G6. The operation of filling K2 with the liquid LQ is started.

  Also in the present embodiment, the control device 2 controls the liquid supply device 10 ′ and the liquid recovery device 20 ′ of the second immersion system 1 ′ to fill the second space K2 with the liquid LQ, so that the second space The liquid supply operation for K2 and the liquid recovery operation for the second space K2 are performed in parallel. As a result, the second space K2 is filled with the clean and temperature-adjusted liquid LQ supplied from the liquid supply apparatus 10 '.

  Then, in order to expose the substrate P, the control device 2 controls the illumination system IL and starts illuminating the mask M with the exposure light EL. The exposure light EL emitted from the light source device 5 passes through the eighth optical element G8 provided in the vicinity of the bride device 6, passes through the seventh optical element G7, and then enters the incident surface T4 ′ of the sixth optical element G6. Incident. The exposure light EL that has entered the incident surface T4 'of the sixth optical element G6 passes through the sixth optical element G6 and is then emitted from the light exit surface T3'. The exposure light EL emitted from the light emission surface T3 'of the sixth optical element G6 passes through the liquid LQ in the second space K2, and then enters the upper surface T2' of the fifth optical element G5. The exposure light EL that has entered the upper surface T2 'of the fifth optical element G5 passes through the fifth optical element G5, is then emitted from the lower surface T1', and is irradiated onto the blind device 6. The exposure light EL that has passed through the opening 7K of the movable blind 7 and the opening 8K of the fixed blind 8 of the blind device 6 passes through a predetermined optical element, and is then applied to a predetermined illumination region IL of the mask M. That is, the illumination system IL of the present embodiment includes the mask M via the liquid LQ that fills the second space K2 between the light emission surface T3 ′ of the sixth optical element G6 and the upper surface T2 ′ of the fifth optical element G5. The predetermined illumination area IL is illuminated with the exposure light EL. The pattern image of the mask M illuminated with the exposure light EL is projected onto the substrate P via the projection optical system PL.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus, and the control apparatus 2 controls the mask stage 3 and the substrate stage 4 so that the substrate P is moved in synchronization with the movement of the mask M in the Y-axis direction. While moving in the Y-axis direction, the mask M is illuminated with the exposure light EL, and the pattern image of the mask M is projected onto the substrate P via the projection optical system PL.

  Also in the present embodiment, the control device 2 irradiates the mask M with the exposure light EL from the illumination system IL while performing the liquid supply operation for the second space K2 and the liquid recovery operation for the second space K2 in parallel. Thus, even during the exposure of the substrate P, the second space K2 is filled with the clean and temperature-adjusted liquid LQ supplied from the liquid supply apparatus 10 '.

  Also in the present embodiment, the control device 2 uses the measurement device 30 ′ to measure (monitor) the optical characteristics of the liquid LQ supplied from the liquid supply device 10 ′ to the second space K2. The liquid LQ is supplied to the second space K2, and the exposure light EL is irradiated onto the mask M through the liquid LQ.

  Further, the control device 2 moves the movable blind 7 in a direction corresponding to the scanning direction (Y-axis direction) of the mask M in synchronization with the movement of at least one of the mask M and the substrate P, thereby moving the movable blind 7 on the substrate P. At the start and end of scanning exposure of one shot area, unnecessary exposure light EL irradiation to the substrate P is blocked.

  As described above, the second space K2 on the optical path of the exposure light EL of the illumination system IL can be filled with the liquid LQ. By filling the second space K2 near the position optically conjugate with the pattern forming surface MA of the mask M with the liquid LQ, the illumination system IL has a large numerical aperture and requires a strong refractive power. An increase in the size of the system IL, and consequently an increase in the size of the entire exposure apparatus EX can be suppressed.

  In the fourth embodiment, the exposure light EL is irradiated while the liquid supply operation for the second space K2 and the liquid recovery operation for the second space K2 are performed in parallel, but during the irradiation of the exposure light EL, The liquid supply operation for the second space K2 and the liquid recovery operation for the second space K2 are stopped, and the liquid supply operation and the liquid recovery operation are performed at a predetermined timing when the irradiation of the exposure light EL is stopped. The liquid LQ may be replaced.

  Alternatively, the second space K2 may be a sealed space, for example, and the sealed second space K2 may be filled with the liquid LQ without replacing (exchange) the liquid LQ in the second space K2. In this case, the second immersion system 1 'can be omitted.

  In the fourth embodiment, the fifth optical element G5 is a parallel plate. However, if the fifth optical element G5 has an upper surface T2 ′ capable of holding the liquid LQ with the sixth optical element G6, the fifth optical element. G5 may be an optical element (lens) having refractive power.

  In the fourth embodiment, the liquid LQ having a refractive index larger than the refractive index for the exposure light EL of the sixth optical element G6 is used, but the refractive index for the exposure light EL of the sixth optical element G6 is larger. A liquid LQ having a small refractive index may be used. For example, water (pure water) may be used as the liquid LQ.

  In the fourth embodiment described above, in the blind device 6 and the fifth to eighth optical elements G5 to G8, the exposure light EL is the eighth optical element G8, the seventh optical element G7, and the sixth optical element G6. , The second space K2, and the fifth optical element G5 are passed through in this order and are incident on the blind device 6, but the blind device 6 and the fifth to fifth light beams are arranged so that the exposure light EL travels in the opposite direction. Eighth optical elements G5 to G8 may be arranged. That is, the exposure light EL from the light source device 5 passes through the blind device 6, the fifth optical element G5, the second space K2, the sixth optical element G6, the seventh optical element G7, and the eighth optical element G8 in this order. The blind device 6 and the fifth to eighth optical elements G5 to G8 may be disposed so as to face the mask M.

  In the fourth embodiment, the second space K2 may be filled with the liquid LQ, and the exposure light EL may be irradiated while the first space K1 is also filled with the liquid LQ. Of the optical path of the exposure light EL, only the second space K2 may be filled with the liquid LQ.

  In the fourth embodiment, when both the first space K1 and the second space K2 are filled with the liquid LQ, the types (materials) of the liquid LQ that fills the first space K1 and the liquid LQ that fills the second space K2. May be different. For example, one of the first space K1 and the second space K2 may be filled with glycerol and the other may be filled with water. Alternatively, the first space K1 may be filled with the liquid LQ having the first temperature, and the second space K2 may be filled with the liquid LQ having a second temperature different from the first temperature.

  Also in the fourth embodiment, the liquid supply device 10 ′ may include a mixing device that mixes a plurality of types (materials) of liquid as described with reference to FIG. 5. In the fourth embodiment, a correction member may be provided for correcting the illuminance unevenness of the exposure light EL on the substrate P caused by the liquid LQ filling the second space K2.

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the first to fourth embodiments described above, the space between the projection optical system PL and the substrate P is filled with gas, but this embodiment is different from the first to fourth embodiments described above. This is that the space between the terminal optical element FL closest to the image plane of the projection optical system PL and the substrate P among the plurality of optical elements of the projection optical system PL is also filled with the liquid LQ.

  FIG. 8 is a schematic block diagram that shows an exposure apparatus EX according to the fifth embodiment. In the exposure apparatus EX of the present embodiment, among the plurality of optical elements of the projection optical system PL, the third space that fills the space between the terminal optical element FL closest to the image plane of the projection optical system PL and the substrate P with the liquid LQ. An immersion system 101 is provided.

  The third immersion system 101 is disposed between the terminal end optical element FL of the projection optical system PL and the substrate P disposed at a position facing the terminal optical element FL and held by the substrate holder 4H of the substrate stage 4. The third space K3 including the optical path of the exposure light EL is filled with the liquid LQ. The third immersion system 101 is provided in the vicinity of the optical path of the exposure light EL between the terminal optical element FL and the substrate P, and collects the supply port 112 for supplying the liquid LQ to the optical path and the liquid LQ. A nozzle member 171 having a recovery port 122, a liquid supply device 110 for supplying the liquid LQ to the supply port 112 via a supply pipe 114 and a supply channel 114 formed inside the nozzle member 171, and a nozzle A liquid recovery device 120 that recovers the liquid LQ recovered from the recovery port 122 of the member 171 through the recovery flow path 124 formed inside the nozzle member 171 and the recovery pipe 123 is provided. In the present embodiment, the nozzle member 171 is provided in an annular shape so as to surround the optical path of the exposure light EL, and the supply port 112 for supplying the liquid LQ faces the optical path of the exposure light EL in the nozzle member 171. The recovery port 122 provided on the inner side surface for recovering the liquid LQ is provided on the lower surface of the nozzle member 171 facing the surface of the substrate P. In the present embodiment, a porous member (mesh) is disposed in the recovery port 122.

  The liquid supply device 110 includes a temperature adjustment device that adjusts the temperature of the liquid LQ to be supplied, a deaeration device that reduces gas components in the liquid LQ, a filter unit that removes foreign matters in the liquid LQ, and the like. The temperature-controlled liquid LQ can be delivered. Further, the liquid recovery apparatus 120 includes a vacuum system or the like, and can recover the liquid LQ. The operations of the liquid supply device 110 and the liquid recovery device 120 are controlled by the control device 2. The liquid LQ delivered from the liquid supply device 110 flows through the supply pipe 113 and the supply flow path 114 of the nozzle member 171, and then the exposure light EL between the terminal optical element FL and the substrate P is supplied from the supply port 112. Supplied to the optical path. Further, the liquid LQ recovered from the recovery port 122 by driving the liquid recovery device 120 flows through the recovery flow path 124 of the nozzle member 171 and then is recovered by the liquid recovery device 120 via the recovery pipe 123. The control device 2 controls the third immersion system 101 to perform the liquid supply operation by the liquid supply device 110 and the liquid recovery operation by the liquid recovery device 120 in parallel, so that the terminal optical element FL and the substrate P are An immersion region LRP for the liquid LQ is locally formed in a part of the region on the substrate P so that the optical path of the exposure light EL is filled with the liquid LQ.

  In order to expose the substrate P, the control device 2 controls the liquid immersion system 1 and includes a first optical path of the exposure light EL between the first optical element G1 and the second optical element G2 of the illumination system IL. The space K1 is filled with the liquid LQ. Further, the control device 2 controls the third immersion system 101 to fill the third space K3 including the optical path of the exposure light EL between the last optical element FL and the substrate P with the liquid LQ.

  And the control apparatus 2 controls the illumination system IL, and starts the illumination with respect to the mask M by exposure light EL. The illumination system IL exposes a predetermined illumination area IA of the mask M through the liquid LQ that fills the first space K1 between the light exit surface T2 of the second optical element G2 and the upper surface T2 of the first optical element G1. Illuminate with light EL. The pattern image of the mask M illuminated with the exposure light EL is projected onto the substrate P via the projection optical system PL and the liquid LQ in the third space K3.

  As described above, the substrate P is exposed in a state where the first space K1 of the illumination system IL is filled with the liquid LQ and the third space K3 between the projection optical system PL and the substrate P is filled with the liquid LQ. be able to.

  In the fifth embodiment, it has been described that only the first space K1 of the illumination system IL is filled with the liquid LQ. However, only the second space K2 of the illumination system IL is filled with the liquid LQ, and the projection optical system PL is filled. The substrate P may be exposed in a state where the third space K3 between the substrate P and the substrate P is filled with the liquid LQ, or both the first space K1 and the second space K2 of the illumination system IL may be exposed to the liquid LQ. And the substrate P can be exposed in a state where the third space K3 between the projection optical system PL and the substrate P is filled with the liquid LQ.

  In the fifth embodiment, when the predetermined space (K1, K2) of the illumination system IL and the third space K3 between the projection optical system PL and the substrate P are filled with the liquid LQ, the predetermined space of the illumination system IL. The types (materials) of the liquid LQ that fills (K1, K2) and the liquid LQ that fills the third space K3 may be different. For example, either one of the predetermined spaces (K1, K2) and the third space K3 of the illumination system IL may be filled with glycerol, and the other may be filled with water. Further, the predetermined space (K1, K2) of the illumination system IL is filled with the liquid LQ having the first temperature, and the third space K3 is filled with the liquid LQ having a second temperature different from the first temperature. It may be. Further, the types (materials) of the liquid LQ that fill the first, second, and third spaces K1, K2, and K3 may be different from each other, and the temperatures may be different from each other.

  In the fifth embodiment, the refractive index of the liquid LQ that fills the third space K3 with respect to the exposure light EL is larger than the refractive index of the termination optical element FL with respect to the exposure light EL, and the projection optical system PL has a numerical aperture of When the refractive index of the optical element FL is larger than the refractive index for the exposure light EL, the light exit surface of the terminal optical element FK (the lower surface facing the surface of the substrate P) is a curved surface (spherical surface) that protrudes away from the surface of the substrate P. ), The exposure light EL can reach the substrate P satisfactorily.

  Note that the projection optical system PL of the present embodiment fills the third space K3 including the optical path on the image plane side of the terminal optical element FL with the liquid LQ, but is disclosed in International Publication No. 2004/019128. In this way, a projection optical system that fills the space including the optical path on the object plane side of the last optical element FL with a liquid can also be employed.

  In the first to fifth embodiments described above, at least a part of the liquid LQ recovered by the liquid recovery apparatus (20, 20 ′, 120) is returned to the liquid supply apparatus (10, 10 ′, 110). May be. The liquid LQ returned to the liquid supply device (10, 10 ', 110) may be reused. Further, for example, in the second embodiment described above, the first and second liquids LQ1 and LQ2 sent from the first and second liquid supply devices 41 and 42 and the liquid recovery device 20 are returned to the liquid supply device 10. The liquid LQ may be mixed by the mixing device 50.

  In the above-described embodiment, in the illumination system IL, the first space K1 near the pattern formation surface MA and the second space K2 near the position optically conjugate with the pattern formation surface MA are filled with the liquid LQ. However, any space other than the first and second spaces K1, K2 on the optical path of the exposure light EL of the illumination system IL may be filled with the liquid LQ so that the illumination system IL can obtain desired optical characteristics. Good.

In each of the above-described embodiments, for example, when the light source device for the exposure light EL emits F ₂ laser light, the F ₂ laser light does not pass through water, so that the liquid LQ can pass through the F ₂ laser light. For example, a fluorinated fluid such as perfluorinated polyether (PFPE) or fluorinated oil may be used. In this case, a lyophilic treatment is performed by forming a thin film with a substance having a small molecular structure including fluorine, for example, in a portion in contact with the liquid LQ. In addition, as the liquid LQ, it is possible to use a liquid (for example, cedar oil) that is transmissive to the exposure light EL and has a refractive index as high as possible.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, as the exposure apparatus EX, a reduced image of the first pattern is projected with the first pattern and the substrate P being substantially stationary (for example, a refraction type projection optical system that does not include a reflecting element at 1/8 reduction magnification). The present invention can also be applied to an exposure apparatus that performs batch exposure on the substrate P using the above. In this case, after that, with the second pattern and the substrate P substantially stationary, a reduced image of the second pattern is collectively exposed onto the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  The present invention also relates to a multi-stage type exposure apparatus having a plurality of substrate stages as disclosed in JP-A-10-163099, JP-A-10-214783, JP-T 2000-505958, and the like. It can also be applied to.

  Further, as disclosed in JP-A-11-135400 and JP-A-2000-164504, a measurement stage equipped with a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and various photoelectric sensors. The present invention can also be applied to an exposure apparatus including the above.

  In the above-described embodiment, an exposure apparatus that locally fills the liquid between the projection optical system PL and the substrate P is employed. However, the present invention is disclosed in JP-A-6-124873 and JP-A-10. -303114, US Pat. No. 5,825,043, etc., and can be applied to an immersion exposure apparatus that performs exposure in a state where the entire surface of the substrate to be exposed is immersed in the liquid. is there.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD) ) Or an exposure apparatus for manufacturing reticles or masks.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6,778,257, an electronic mask that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed may be used.

  Further, as disclosed in International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line-and-space pattern on a substrate P by forming interference fringes on the substrate P. The present invention can also be applied.

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection, and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 9, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, substrate processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

It is a schematic block diagram which shows the exposure apparatus which concerns on 1st Embodiment. It is the sectional side view which expanded the principal part of the illumination system which concerns on 1st Embodiment. It is a schematic perspective view for demonstrating the measuring device which concerns on 1st Embodiment. It is sectional drawing of the measuring device which concerns on 1st Embodiment. It is a schematic block diagram which shows the liquid supply apparatus which concerns on 2nd Embodiment. It is a schematic diagram which shows the correction member which concerns on 3rd Embodiment. It is the sectional side view to which the principal part of the illumination system which concerns on 4th Embodiment was expanded. It is a schematic block diagram which shows the exposure apparatus which concerns on 5th Embodiment. It is a flowchart figure which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Liquid immersion system, 1 '... 2nd liquid immersion system, 2 ... Control apparatus, 3 ... Mask stage, 4 ... Substrate stage, 5 ... Light source device, 6 ... Blind device, 7 ... Moving blind, 7K ... Opening, 8 ... fixed blind, 8K ... opening, 12 ... supply port, 12 '... supply port, 22 ... collection port, 22' ... collection port, 30 ... measuring device, 80 ... correction member, EL ... exposure light, EX ... exposure device, FL ... last optical element, G1 to G8 ... optical element, IL ... illumination system, K1 ... first space, K2 ... second space, K3 ... third space, LQ ... liquid, LR ... liquid immersion region, LR '... liquid Immersion region, M ... mask, MA ... pattern formation surface, P ... substrate, PL ... projection optical system, T2 ... upper surface, T2 '... upper surface, T3 ... light exit surface, T3' ... light exit surface, T4 ... entrance surface, T4 '... Incident surface

Claims (19)

In an illumination device that illuminates a pattern with exposure light for exposing a substrate,
An illumination device that illuminates the pattern with the exposure light in a state where a predetermined space on the optical path of the exposure light is filled with a liquid. An optical element disposed on the optical path of the exposure light;
The lighting device according to claim 1, wherein the liquid fills at least one of a space near a predetermined surface where the pattern is arranged and a space near a position conjugate with the predetermined surface. A first optical element closest to the predetermined surface; and a second optical element closest to the predetermined surface next to the first optical element;
The lighting device according to claim 2, wherein the liquid fills a space between the first optical element and the second optical element. The second optical element has a first surface on which the exposure light is incident and a second surface on which the exposure light is emitted,
The lighting device according to claim 3, wherein the first surface and the second surface are curved surfaces protruding in a direction away from the predetermined surface.   The illumination device according to claim 4, wherein the first optical element is a parallel plate having a third surface capable of holding a liquid between the second optical element and the second surface.   The illumination device according to claim 3, wherein a refractive index of the liquid with respect to the exposure light is larger than a refractive index of the second optical element with respect to the exposure light.   The illumination device according to claim 6, wherein a refractive index of the liquid with respect to the exposure light is 1.6 or more. A blind device having an opening which is disposed at or near a position conjugate with the predetermined surface and defines an illumination area of the exposure light on the predetermined surface;
The lighting device according to claim 2, wherein the liquid fills a space on an optical path in the vicinity of the opening. A third optical element closest to the opening; and a fourth optical element close to the opening next to the third optical element;
The illumination device according to claim 8, wherein the liquid fills a space between the third optical element and the fourth optical element.   The illuminating device according to claim 1, further comprising a correction member for correcting illuminance unevenness of the exposure light on the substrate due to the liquid.   The lighting device according to claim 1, further comprising a supply port that supplies liquid to the predetermined space.   The lighting device according to any one of claims 1 to 11, further comprising a collection port for collecting the liquid in the predetermined space.   The illumination device according to claim 1, wherein the exposure light is irradiated while performing a liquid supply operation on the predetermined space and a liquid recovery operation on the predetermined space in parallel.   During the exposure light irradiation, the liquid supply operation to the predetermined space and the liquid recovery operation in the predetermined space are stopped, and the liquid supply operation and the liquid recovery operation are performed at a predetermined timing when the exposure light irradiation is stopped. The illuminating device according to claim 1, wherein the liquid in the predetermined space is replaced.   An exposure apparatus comprising the illumination device according to claim 1.   The exposure apparatus according to claim 15, further comprising a measurement device that measures an optical characteristic of the liquid.   The exposure apparatus according to claim 16, wherein the measurement apparatus measures a liquid before being supplied to the predetermined space. A projection optical system that projects an image of the pattern onto the substrate;
The exposure according to any one of claims 15 to 17, wherein a space between the terminal optical element closest to the image plane of the projection optical system and the substrate among the plurality of optical elements of the projection optical system is also filled with a liquid. apparatus. The device manufacturing method using the exposure apparatus as described in any one of Claims 15-18.

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