JP2007234753A - Semiconductor module device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a double-stair power semiconductor module device which reduces the heat radiation from a power semiconductor module to a control circuit board in a simple structure. <P>SOLUTION: A heat-shield plate 3 having a low thermal conductivity is fixed to a heat-sink plate 1 and extends between an IPM 2 and a printed circuit board 5. The plate 3 has a function for pressing and fixing the IPM 2 to the heat-sink plate 1 on which stopper projections 13, 14 are fitted into recesses 21, 22 to well regulate the relative displacement of the IPM 2 in the lateral direction of the IPM 2 to the heat-sink plate 1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an improvement in a semiconductor module device including a semiconductor module having a built-in power semiconductor element.

  A power semiconductor module incorporating a power semiconductor element (hereinafter also simply referred to as a semiconductor module) normally switches a large current at a high frequency, and thus has a problem of large power loss, that is, heat generation. For this reason, it is usual to cool the semiconductor module by bringing one main surface thereof into close contact with the heat sink plate. In addition, heat sensitive circuit components such as a control circuit IC are arranged as far as possible from the semiconductor module. For example, these electronic components such as the control circuit IC are usually mounted on a control circuit printed circuit board provided separately from the power semiconductor module. However, if the printed circuit board for the control circuit and the power semiconductor module are separately arranged, the device area increases. Therefore, the device structure in which the printed circuit board is arranged above the semiconductor module is a so-called two-story method, for example, Patent Document 1 below. Patent Document 2 and the like.

  However, even in this two-story power semiconductor module device, if the power semiconductor module and the printed circuit board are brought close to each other in order to improve the mounting density, the amount of heat radiation from the high-temperature power semiconductor module to the printed circuit board increases. As a result, the circuit elements mounted on the printed circuit board may be adversely affected.

In order to improve this problem, Patent Document 3 below proposes to dispose a heat absorption / heat transfer plate between the power semiconductor module and the control board.
JP 2001-156252 A JP 2004-190547 A JP 2001-145366 A

  However, the structure in which the heat absorption / heat transfer plate is interposed between the semiconductor module and the printed circuit board proposed in Patent Document 3 is a structure that dissipates heat by heat transfer from the heat absorption / heat transfer plate to the cooling fin. The heat absorption / heat transfer plate is made of metal, and securing the electrical insulation between the heat absorption / heat transfer plate and the terminals of the printed circuit board or power semiconductor module becomes a problem. Furthermore, in order to reduce the heat radiation from the heat absorption / heat transfer plate to the printed circuit board, it is necessary to lower the temperature of the heat absorption / heat transfer plate.・ It was necessary to increase the amount of heat transfer from the heat transfer plate to the cooling fin, resulting in an increase in the size of the device.

  The present invention has been made in view of the above problems, and provides a semiconductor module device capable of reducing heat radiation from a power semiconductor module to a control circuit board with a simple structure in a power semiconductor module device having a two-story structure. Its purpose is to do.

A semiconductor module device according to a first aspect of the present invention for solving the above-mentioned problems is a semiconductor module device comprising a semiconductor module and a heat sink plate having a heat receiving surface in which one main surface of the semiconductor module adheres well to heat conduction.
It is fixed to the heat sink plate and extends between the circuit board arranged in parallel with the heat sink plate and the semiconductor module so as to be in close contact with the other main surface on the circuit board side of the semiconductor module. It is characterized by having a heat shield.

  That is, in the present invention, since the heat shield plate having a small thermal conductivity is fixed to the heat sink plate and extends between the semiconductor module device and the circuit board, the heat generated by the semiconductor module is reflected by the heat shield plate, It is shielded and thermally insulated so that it does not reach the circuit board, and the temperature rise of the circuit board can be well prevented. Further, the heat shield plate can mechanically prevent the semiconductor module from being displaced in a direction away from the heat sink plate due to vehicle vibration or the like. Furthermore, since the heat shield plate is fixed to the heat sink plate, the heat sink plate, the semiconductor module, and the heat shield plate can be manufactured integrally in advance, and the assembly work to the apparatus becomes easy. Furthermore, according to the present invention, since the distance between the semiconductor module and the circuit board can be reduced, the mounting density of the device can be improved.

  As the heat shield plate, a resin plate can be adopted, but it may be a ceramic plate. The heat shield performance may be improved by making the heat shield plate porous.

  The heat shield plate may be a flat plate shape, a gate shape, or a bottomed square tube shape. However, in the case of a flat plate shape, the heat shield plate may be fastened to the heat sink plate via a spacer having a thickness substantially equal to that of the semiconductor module, or a protruding wall having a height corresponding to this spacer from the heat sink plate A part may be provided.

  In a preferred aspect, the heat shield plate presses the semiconductor module against the heat sink plate. If it does in this way, in addition to the above-mentioned effect, while being able to prevent a semiconductor module from separating from a heat sink board by vehicle vibration etc., it can control that a semiconductor module shifts to the principal surface direction of a heat sink board.

  In a preferred embodiment, the heat shield plate is fastened to the heat sink plate and presses the semiconductor module against the heat sink plate, and a heat insulating shield that is in close contact with the main surface of the module press plate portion. And a hot plate part. In this way, even if a highly heat conductive metal plate having excellent mechanical properties is used for the module pressing plate portion that performs the function of pressing the semiconductor module against the heat sink plate, the circuit board is formed from the semiconductor module or the module pressing plate portion. Heat dissipation to the heat shielding plate can be favorably reduced.

  In a preferred aspect, the heat shield plate portion has electrical insulation and is in close contact with the main surface of the module pressing plate on the circuit board side. If it does in this way, the heat-shielding board part can also show | play together the effect which can electrically insulate a metal module press board part from a circuit board favorably.

  In a preferred aspect, the circuit board has a temperature detection element that protrudes toward the semiconductor module and contacts the surface of the semiconductor module, and the heat shield plate has a temperature detection through which a leg of the temperature detection element passes. It has an element through hole. In this way, the temperature of the semiconductor module can be easily detected on the circuit board side despite the presence of the heat shield. Furthermore, since the surface temperature of the semiconductor module approximates the internal temperature as compared with the case where there is no heat shield plate, a more accurate semiconductor module temperature can be detected.

The semiconductor module device of the second invention that solves the above-mentioned problems is a semiconductor module device comprising a semiconductor module and a heat sink plate having a heat receiving surface that adheres to the main surface of the semiconductor module with good heat conduction.
A module pressing plate that is fixed to the heat sink plate and presses the semiconductor module against the heat sink plate; the semiconductor module and the heat sink plate regulate relative displacement of the semiconductor module in a surface direction of the heat sink plate; It has an uneven part.

  That is, according to the present invention, since the semiconductor module and the heat sink plate are concavo-convexly fitted, and the semiconductor module is pressed against the heat sink plate by the module pressing plate, the semiconductor module may come out of the heat sink plate in the thickness direction. Furthermore, the semiconductor module is not displaced relative to the heat sink plate in the main surface direction of the semiconductor module, and the problem that the semiconductor module is displaced due to vehicle vibration or the like can be solved. Further, it is convenient for positioning the semiconductor module when the semiconductor module is assembled to the heat sink plate. Furthermore, since the semiconductor module itself is not fastened to the heat sink plate, a strong stress is not applied to the fastening portion of the semiconductor module that is exposed to a high-temperature cycle, and thermal deterioration does not occur.

  As the module pressing plate, a resin plate can be adopted, but a metal plate may be used. The module pressing plate may be a flat plate shape, a gate shape, or a bottomed square tube shape. However, in the case of a flat plate shape, the module pressing plate may be fastened to the heat sink plate via a spacer having a thickness substantially equal to that of the semiconductor module, or a protruding wall having a height corresponding to this spacer from the heat sink plate A part may be provided.

  A preferred embodiment of the semiconductor module device of the present invention described above will be described below. However, the present invention should not be construed as being limited to this embodiment, and it goes without saying that the technical idea of the present invention may be realized by a combination of other techniques.

(Construction)
The structure of the semiconductor module device of the embodiment will be described with reference to FIGS. FIG. 1 is a vertical sectional view of a main part of the semiconductor module device, and FIG. 2 is a schematic plan view of FIG.

  This semiconductor module device includes a heat sink plate 1, an IPM 2, and a heat shield plate 3 which are metal members having good heat conductivity. A control circuit device 4 includes a printed circuit board 5 on which a large number of electronic circuit components are mounted. Reference numeral 6 denotes a thermistor protruding from the printed circuit board 5 to the back surface side.

  The heat sink plate 1 has wall plate portions 11 and 12 that are positioned upright on both the left and right sides of the IPM 2 and are erected to a height substantially equal to the IPM 2. The heat sink plate 1 has stopper protrusions 13 and 14 that protrude toward the bottom surface of the IPM 2.

  The IPM 2 is an intelligent power module in which an IGBT and its necessary peripheral circuits are built in, and the internal structure itself is the same as that of a normal IPM, and thus description thereof is omitted. A heat radiating metal plate (not shown) is exposed on the bottom surface of the IPM 2, that is, the main surface on the heat sink plate 1 side. A heat conduction sheet for electrical insulation is interposed between the exposed surface of the heat radiating metal plate and the heat receiving surface 15 of the heat sink plate 1, but the illustration thereof is omitted. Concave grooves 21 and 22 are formed on the bottom surface of the IPM 2 so as to be located around the metal plate for heat dissipation. The stopper protrusions 13 and 14 of the heat sink plate 1 are fitted into the concave grooves 21 and 22. Yes. Of course, a concave groove may be provided in the heat sink plate 1 and a stopper protrusion may be provided in the IPM 2 instead of the above.

  The heat shield plate 3 is a metal plate-shaped module pressing plate portion 31 for pressing the IPM 2 and a resin plate heat insulating plate bonded to the surface (the main surface opposite to the IPM 2) of the module pressing plate portion 31. Part 32. The heat shield 3 has a thermistor hole 33 penetrating in the thickness direction, and the thermistor hole 33 has a main body portion of the thermistor 6 hanging from the printed circuit board 5. Reference numerals 61 and 62 denote a pair of legs that form terminals of the thermistor 6, which are soldered to the back surface of the printed circuit board 5. Holes into which the screws 7 are inserted are formed at both left and right ends of the module pressing plate portion 31, and screw holes are formed at the upper ends of the wall plate portions 11 and 12 of the heat sink plate 1. The module pressing plate portion 31 presses the IPM 2 toward the heat sink plate 1 by fastening the module pressing plate portion 31 to the wall plate portions 11 and 12 with the screws 7. In this embodiment, the electrical insulating sheet 8 is interposed between the upper surface of the IPM 2 and the lower surface of the module pressing plate portion 31, but this is not essential.

  The printed circuit board 5 is actually mounted with a control circuit for controlling a predetermined number of IPMs 2 installed on the heat sink plate 1, and the heat sink plate 1 and the printed circuit board 5 are not illustrated. It is fixed to. The heat sink plate 1 may form a part of this case. As the printed circuit board 5, various commercially available ones can be adopted. In some cases, the printed circuit board 5 may be mounted on both sides, and all components may be mounted on the heat shield plate 3 side, that is, the lower surface side.

(effect)
The effects of the semiconductor module device described above will be described below.

  First, since the heat shield plate 3 having a small thermal conductivity is fixed to the heat sink plate 1 and extends between the IPM 2 and the printed circuit board 5, the printed circuit board 5 and the printed circuit board 5 are mounted on the heat generated by the IPM 2. It is possible to prevent the circuit element from overheating. In addition, since the distance between the IPM 2 and the printed circuit board 5 can be reduced, the mounting density of the apparatus can be improved. Next, since the heat shield plate 3 presses the IPM 2 against the heat sink plate 1, the IPM 2 can be well prevented from being displaced from the heat sink plate 1 due to vehicle vibration or the like. Furthermore, since the heat shield plate portion 32 is disposed on the surface of the metal module press plate portion 31, the heat shield plate 3 can secure a necessary bending force at a low cost, The electrical insulation between the printed circuit board 5 and the printed circuit board 5 can also be improved.

  Furthermore, in this embodiment, the module pressing plate portion 31 and the heat shielding plate portion 32 of the heat shield plate 3 are used as a temperature detection element of the IPM 2 for penetrating the thermistor 6 that hangs down from the printed circuit board 5 and adheres closely to the IPM 2. Since the thermistor hole 33 is provided, the temperature of the IPM 2 can be satisfactorily detected on the printed circuit board 5 side despite the installation of the heat shield plate 3. In particular, when the heat shield plate portion 32 of the heat shield plate 3 is not present, the upper surface temperature of the IPM 2 is lowered due to the large heat radiation or the like, so that accurate temperature detection of the IPM 2 becomes difficult. By installing the thermal radiation, the thermal radiation can be greatly reduced, so that the temperature of the IPM 2 can be detected more accurately by the thermistor 6 hanging from the printed circuit board 5.

  Furthermore, in this embodiment, since the stopper protrusions 13 and 14 of the heat sink plate 1 and the concave grooves 21 and 22 of the IPM 2 are fitted, the IPM 2 is moved along the heat receiving surface 15 of the heat sink plate 1 due to vehicle vibration or the like. However, it can prevent very well displacement. Further, the IPM 2 can be accurately positioned on the heat sink plate 1 by this fitting.

(Modification)
Various modifications will be described below.

  In the above embodiment, the heat shield plate 3 is configured by bonding the metal module pressing plate portion 31 and the resin heat shield plate portion 32 together. However, the heat shield plate 3 may be made of a material having necessary heat shielding properties and bending strength. For example, it may be composed of one kind of material.

  In the above embodiment, as shown in FIG. 1, the left and right ends of the module pressing plate portion 31 protrude from the heat shielding plate portion 32 to the left and right for screw fastening, but as shown in FIG. If the part 32 is positioned on the screw and protrudes left and right, the heat shielding performance of the heat shielding plate part 32 can be further improved. On the contrary, if only a specific region of the printed circuit board 5 needs to be shielded from heat, the heat shield plate 32 may be bonded only to a predetermined region of the module pressing plate 31. In addition, the screw 7 may be fastened to the wall plate portions 11 and 12 through the heat shield plate portion 32 and the module pressing plate portion 31.

  Another modification of the module pressing plate 31 is shown in FIG. In this modification, the module pressing plate portion 31 has a substantially U-shape and is directly fastened to the heat receiving surface 15 of the heat sink plate 1. In this way, the shape of the heat sink plate 1 can be simplified.

  Another modification of the module pressing plate 31 is shown in FIG. In this modification, the module pressing plate portion 31 has a substantially U-shape and is directly fastened to the heat receiving surface 15 of the heat sink plate 1. In this way, the shape of the heat sink plate 1 can be simplified. By making the height of the left and right leg portions 311 and 312 of the module pressing plate portion 31 slightly shorter than the height of the IPM 2, the bending stress when the left and right end plate portions 313 and 314 of the module pressing plate portion 31 are bent becomes IPM2. The force is pressed against the heat sink plate 1.

  Another modification of the module pressing plate 31 is shown in FIG. In this modification, the left and right end surfaces 315 and 316 of the module pressing plate 31 are formed obliquely. The screw 7 is screwed laterally into the wall plate portions 11 and 12 of the heat sink plate 1, and the tip of the screw 7 is a slope that is in sliding contact with the diagonal left and right end surfaces 315 and 316 of the module pressing plate portion 31. . If it does in this way, the force which the module press board part 31 presses IPM2 toward the heat sink board 1 by screwing in of the screw 7 can be adjusted favorably.

It is a principal part vertical sectional view of the semiconductor module device of an embodiment. FIG. 2 is a schematic plan view of FIG. 1. It is a principal part vertical sectional view of the semiconductor module device of a modification. It is a principal part vertical sectional view of the semiconductor module device of a modification. It is a principal part vertical sectional view of the semiconductor module device of a modification.

Explanation of symbols

1 Heat sink plate 2 IPM (semiconductor module)
DESCRIPTION OF SYMBOLS 3 Heat shield board 5 Printed circuit board 6 Thermistor 7 Screw 8 Electrical insulating sheet 11, 12 Wall board part 13, 14 Stopper protrusion 15 Heat receiving surface 21, 22 Groove 31 Module press board part 32 Heat shield board part 33 Thermistor hole

Claims (6)

In a semiconductor module device comprising a semiconductor module and a heat sink plate having a heat receiving surface in which one main surface of the semiconductor module adheres well to heat conduction,
It is fixed to the heat sink plate and extends between the circuit board arranged in parallel with the heat sink plate and the semiconductor module so as to be in close contact with the other main surface on the circuit board side of the semiconductor module. A semiconductor module device comprising a heat shield. The semiconductor module device according to claim 1,
The heat shield plate is a semiconductor module device that presses the semiconductor module against the heat sink plate. The semiconductor module device according to claim 2,
The heat shield plate is
A module pressing plate portion fastened to the heat sink plate and pressing the semiconductor module against the heat sink plate;
A heat insulating plate portion with good thermal insulation that is in close contact with the main surface of the module pressing plate portion;
A semiconductor module device. The semiconductor module device according to claim 3,
The heat shield plate part is
A semiconductor module device having electrical insulation and closely contacting a main surface of the module pressing plate on the circuit board side. The semiconductor module device according to claim 1,
The circuit board has a temperature detection element that protrudes toward the semiconductor module and contacts the surface of the semiconductor module;
The said heat-shielding board is a semiconductor module apparatus which has a temperature detection element through-hole which the leg part of the said temperature detection element penetrates. In a semiconductor module device comprising a semiconductor module and a heat sink plate having a heat receiving surface with which the main surface of the semiconductor module adheres well to heat conduction,
A module pressing plate that is fixed to the heat sink plate and presses the semiconductor module against the heat sink plate;
The semiconductor module and the heat sink plate have a concavo-convex portion for restricting relative displacement of the semiconductor module in a surface direction of the heat sink plate.

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