JP2007227759A - Substrate processing apparatus, parameter management system therefor, parameter management method therefor, program, and storage medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus for which a user can easily modify parameters to be run to do processing for a substrate, to provide a parameter management system for the substrate processing apparatus, to provide a parameter management method for the substrate processing apparatus, to provide a program, and to provide storage media. <P>SOLUTION: A GPID indicative of a highly important parameter belonging to categories 0 and 1 and its parameter definition file name are recorded in a category alteration definition file of an external storage medium 117, and a parameter whose value is to be changed is specified to change the category of the specified parameter to a category 2. This will enable the user to make a change in a value of the parameter. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus that performs processing on a substrate based on a plurality of parameters, and in particular, a parameter management system for a substrate processing apparatus, a parameter management method for a substrate processing apparatus, and a program that can change these parameters. And a storage medium.

  A conventional substrate processing apparatus that performs various kinds of processing on a substrate has enormous parameters necessary for controlling the apparatus. These parameters are managed as a database in the substrate processing apparatus. In the substrate processing apparatus, each unit operates by executing software information processing based on these parameters. When a software version is upgraded to a new version in order to add or change a number of functions in the substrate processing equipment, parameters are also added or changed. Conversion processing (version upgrade processing) from the database to the new database is performed.

If the parameters of the substrate processing apparatus are not set appropriately, the apparatus does not operate correctly or fails. For this reason, depending on the type of parameter, such as a parameter indicating the effective range of processing conditions, the user cannot freely set it via the operation unit of the device, and a parameter changing tool such as dedicated software should be used. Thus, the parameter can be changed (see, for example, Patent Documents 1 and 2).
Japanese Patent Laid-Open No. 10-125587 JP 2000-228348 A

  However, in order to change a parameter using the parameter change tool described above, the parameter change tool is expanded and executed on the apparatus, and after the execution is completed, the parameter change tool is deleted and the change contents of the parameter are recorded. There must be. As described above, the substrate processing apparatus has an enormous number of parameters, and the number of parameters that can be changed by one parameter changing tool is limited. Therefore, the above-mentioned parameter changing tool is used for software upgrades. Many are needed. For this reason, the above-mentioned operation must be performed many times.

  As described above, in the conventional substrate processing apparatus, when changing the parameter indicating the effective range of the processing condition, it is necessary to repeat the same operation using a special tool, and it takes time to change the parameter. It was inefficient and prone to work errors. An operational error may cause the device to malfunction.

  An object of the present invention is to provide a substrate processing apparatus, a parameter management apparatus for the substrate processing apparatus, a parameter for the substrate processing apparatus, a program, and a storage medium that allow a user to easily change parameters for executing processing on the substrate. There are things to do.

  In order to achieve the above object, a substrate processing apparatus according to claim 1 is a substrate processing apparatus for processing a substrate, wherein parameters for controlling the processing are classified into a plurality of categories. A storage device for storing; a control device for executing the processing on the substrate based on the parameter; a parameter changing device for changing the parameter according to the category of the parameter; and changing the category of the parameter A parameter category changing device; and a category change defining device that is detachable in the substrate processing apparatus and that specifies a parameter for changing a category of the parameters. The parameter category changing device includes: The category of the designated parameter is changed.

  The substrate processing apparatus according to claim 2 is the substrate processing apparatus according to claim 1, wherein the parameter changing device is capable of changing a parameter of a predetermined category among the plurality of categories, and the parameter category changing device is The parameter category other than the predetermined category is changed to the predetermined category.

  The substrate processing apparatus according to claim 3 is the substrate processing apparatus according to claim 1 or 2, wherein the parameter category changing device changes the change when the substrate processing apparatus is restarted after the category is changed. It is characterized in that the performed category is returned to the original category.

  The substrate processing apparatus according to claim 4 is the substrate processing apparatus according to any one of claims 1 to 3, wherein the parameter category changing device changes a parameter category designated by the category change defining device. And a parameter category change prohibiting device for prohibiting a category change by the parameter category changing device.

  The substrate processing apparatus according to claim 5 is the substrate processing apparatus according to any one of claims 1 to 4, wherein the storage device includes parameter information indicating the parameters and the parameters of the plurality of categories. Category information indicating a category corresponding to each is stored, and the parameter category changing device includes a duplicate storage device, and the parameter information and the category information stored in the storage device are duplicated and stored in the duplicate storage device. The parameter information corresponding to the parameter specified by the category change defining device is searched from the copied parameter information, and the category information corresponding to the searched parameter information is changed among the copied category information. When the parameter can be changed and the substrate processing apparatus is restarted, the duplicate recording is performed. By deleting the information stored device and returning to the original category of the changed category.

  The substrate processing apparatus according to claim 6 is the substrate processing apparatus according to any one of claims 1 to 4, wherein the storage device includes parameter information indicating the parameter and each of the parameters in the plurality of categories. Category information indicating a category corresponding to, and the parameter category changing device includes a duplicate storage device, and the parameter information and the category information stored in the storage device are duplicated and stored in the duplicate storage device, The parameter information corresponding to the parameter specified by the category change defining device is searched from the parameter information stored in the storage device, and the category corresponding to the searched parameter information among the category information stored in the storage device The information is changed so that the parameter can be changed, and the substrate processing apparatus is restarted. The case, and returning the information stored in the storage device based on the category of the changed category by overwriting in the copy storage device stored in the information.

  7. The substrate processing apparatus according to claim 7, wherein the parameter changing device includes a user interface that allows a user to change the parameter. To do.

  The substrate processing apparatus according to an eighth aspect is the substrate processing apparatus according to any one of the first to seventh aspects, wherein the parameter designated by the category change defining device is changeable.

  The substrate processing apparatus management method according to claim 9, comprising: a storage device that stores parameters classified into a plurality of categories; and a control device that performs processing on the substrate based on the parameters. A parameter change defining step for specifying a parameter for changing a category of the parameters, a parameter category changing step for changing a category of the parameter specified by the category change defining step, and A parameter changing step for changing the parameter according to the category.

  The parameter management method for a substrate processing apparatus according to claim 10 is the parameter management method for a substrate processing apparatus according to claim 10, wherein the parameter changing step enables a parameter of a predetermined category among the plurality of categories to be changed, The parameter category changing step is characterized in that a category of parameters other than the predetermined category is changed to the predetermined category.

  The parameter management method for a substrate processing apparatus according to claim 11 is the parameter management method for a substrate processing apparatus according to claim 9 or 10, wherein the parameter category changing step is performed again after the category is changed. When activated, the changed category is returned to the original category.

  The parameter management method for a substrate processing apparatus according to claim 12 is the parameter management method for a substrate processing apparatus according to any one of claims 9 to 11, wherein the parameter category changing step is designated by the category change defining step. And a parameter category change prohibiting step for prohibiting the change of the category by the parameter category changing step after the parameter category is changed.

  The parameter management method for a substrate processing apparatus according to claim 13, wherein the storage device includes parameter information indicating the parameter, and the parameter processing method for a substrate processing apparatus according to any one of claims 9 to 12. The category information indicating a category corresponding to each of the parameters among a plurality of categories is stored, and the parameter category changing step duplicates the parameter information and the category information stored in the storage device, and the substrate processing apparatus The parameter information corresponding to the parameter designated by the category change definition step is retrieved from the duplicated parameter information, and the parameter information retrieved from the duplicated category information corresponds to the retrieved parameter information. The parameter can be changed by changing the category information , The substrate processing apparatus when it is restarted, and returning to the original category of the changed category by deleting the information stored in the copy storage device.

  The parameter management method for a substrate processing apparatus according to claim 14, wherein the storage device includes parameter information indicating the parameter, and the parameter management method for the substrate processing apparatus according to any one of claims 9 to 12. The category information indicating a category corresponding to each of the parameters among a plurality of categories is stored, and the parameter category changing step duplicates the parameter information and the category information stored in the storage device, and the substrate processing apparatus The parameter information corresponding to the parameter specified by the category change definition step is retrieved from the parameter information stored in the duplicate storage device and stored in the storage device, and the search among the category information stored in the storage device The category information corresponding to the parameter information The meter can be changed, and when the substrate processing apparatus is restarted, the information stored in the storage device is overwritten with the information stored in the duplicate storage device so that the changed category is restored to the original. It is characterized by returning to the category.

  15. The parameter management method for a substrate processing apparatus according to claim 15, wherein the parameter changing step is a user interface provided in the substrate processing apparatus. It is possible to change the parameter via the.

  The parameter management method for a substrate processing apparatus according to claim 16 is the parameter management method for a substrate processing apparatus according to any one of claims 9 to 15, wherein the parameter specified by the category change definition step is changeable. It is characterized by that.

  A program according to claim 17 is a computer-controlled parameter management method for a substrate processing apparatus, comprising: a storage device that stores parameters classified into a plurality of categories; and a control device that performs processing on the substrate based on the parameters. A category change definition module that specifies a parameter that changes a category of the parameters, a parameter category change module that changes a category of the parameter specified by the category change definition module, and And a parameter changing module that allows the parameter to be changed according to a category.

  A storage medium according to claim 18, wherein a storage device stores parameters classified into a plurality of categories, and a parameter management method for a substrate processing apparatus, comprising: a control device that performs processing on a substrate based on the parameters. A storage medium for storing a program for causing a computer to execute, wherein the program includes a category change definition module for specifying a parameter for changing a category of the parameters, and a category of the parameter specified by the category change definition module. A parameter category change module to be changed, and a parameter change module that enables the parameter to be changed according to the parameter category.

  20. A substrate processing apparatus parameter management system according to claim 19, comprising: a storage device that stores parameters classified into a plurality of categories; and a control device that performs processing on the substrate based on the parameters. An apparatus parameter management system, comprising: a category change definition device that is detachable from the substrate processing apparatus and that specifies a parameter for changing a category of the parameters, wherein the substrate processing apparatus includes: It is characterized by comprising a parameter changing device that makes it possible to change the parameter according to a category, and a parameter category changing device that changes the category of the parameter specified by the category change defining device.

  The substrate processing apparatus according to claim 20, wherein the substrate processing apparatus performs processing on a substrate, the storage device storing parameters for controlling the processing, which are classified into a plurality of categories, and the parameter A control device that executes the processing on the substrate based on the parameter, a parameter changing device that can change the parameter according to the category of the parameter, a parameter category changing device that changes the parameter category, and the substrate And a category return device for returning the category changed by the parameter category changing device to the original category when the processing device is restarted.

  The substrate processing apparatus according to claim 1, the management method for the substrate processing apparatus according to claim 9, the program according to claim 17, and the storage medium according to claim 18 are designated among parameters classified into a plurality of categories. The category of the specified parameter is changed, and the parameter can be changed according to the category. For this reason, by specifying a parameter of a category in which the parameter cannot be changed, the parameter can be changed by changing the category. Therefore, the user can easily change the parameter for executing the processing on the substrate by designating the parameter of the category in which the parameter cannot be changed. In addition, since the user can easily change the parameter, it is possible to reduce the occurrence of erroneous operation of changing the parameter, and to suppress malfunction of the substrate processing apparatus.

  According to the substrate processing apparatus according to claim 2 and the management method of the substrate processing apparatus according to claim 10, a parameter of a predetermined category among a plurality of categories can be changed, and a parameter category other than the predetermined category can be changed. Is changed to a predetermined category. For this reason, by designating a parameter other than the predetermined category in which the parameter cannot be changed, the parameter can be reliably changed.

  According to the substrate processing apparatus according to claim 3 and the management method of the substrate processing apparatus according to claim 11, when the substrate processing apparatus is restarted after the category is changed, the changed category is the original category. Therefore, it is possible to prevent the changed category from being forgotten. For this reason, the danger that a parameter will change can be reduced and the safety | security regarding a parameter change can be strengthened.

  According to the substrate processing apparatus of claim 4 and the substrate processing apparatus management method of claim 12, the change of the parameter category is prohibited after the designated parameter category is changed. Therefore, it is possible to prevent double execution of category change for a parameter whose category has been changed. As a result, it is possible to prevent a parameter that can be changed from being changed again.

  According to the substrate processing apparatus of claim 5 and the management method of the basic processing apparatus of claim 13, the parameter information and the category information stored in the storage device are duplicated, stored in the duplicate storage device, and duplicated. The parameter information corresponding to the specified parameter is retrieved from the parameter information. Then, when the category information corresponding to the retrieved parameter information in the copied category information is changed so that the parameter can be changed, and the substrate processing apparatus is restarted, the information stored in the duplicate storage device is The category changed by being deleted is returned to the original category. As described above, when the substrate processing apparatus is restarted after the category is changed and the parameters can be changed, the changed category is returned to the original category. Therefore, it is possible to prevent the changed category from being forgotten. For this reason, the danger that a parameter will change can be reduced and the safety | security regarding a parameter change can be strengthened.

  According to the substrate processing apparatus according to claim 6 and the management method for the basic processing apparatus according to claim 14, the parameter information and the category information stored in the storage device are duplicated and stored in the duplicate storage device. The parameter information corresponding to the designated parameter is retrieved from the parameter information stored in. Then, the category information corresponding to the retrieved parameter information among the category information stored in the storage device is changed so that the parameters can be changed, and the substrate processing apparatus is stored in the storage device when the substrate processing apparatus is restarted. The category changed by overwriting the information with the information stored in the duplicate storage device is returned to the original category. Therefore, it is possible to prevent the changed category from being forgotten. For this reason, the danger that a parameter will change can be reduced and the safety | security regarding a parameter change can be strengthened.

  According to the substrate processing apparatus of claim 7 and the management method of the substrate processing apparatus of claim 15, the user can change the parameter via the user interface. Therefore, the parameters that can be changed by changing the category can be easily changed via the user interface.

  According to the substrate processing apparatus according to the eighth aspect and the management method for the substrate processing apparatus according to the sixteenth aspect, since the designated parameter can be changed, the designated parameter can be set as a desired parameter. Therefore, the user can arbitrarily select a parameter to be changed by changing the category, and the user can easily change the parameter.

  According to the parameter management system for a substrate processing apparatus according to claim 19, the parameter for changing the category is designated by the category change defining device that is detachable from the substrate processing apparatus, and the substrate processing apparatus uses the category change defining device to The category of the designated parameter is changed, and the parameter can be changed according to the parameter category. Therefore, by designating a parameter of a category in which the parameter cannot be changed, the parameter can be changed by changing the category. In this way, by specifying a parameter of a category in which the parameter cannot be changed, the user can easily change the parameter. In addition, since the user can easily change the parameter, it is possible to reduce the occurrence of erroneous operation of changing the parameter, and to suppress malfunction of the substrate processing apparatus.

  According to the substrate processing apparatus of the twentieth aspect, when the substrate processing apparatus is restarted, the changed category is returned to the original category. Therefore, it is possible to prevent the changed category from being forgotten. For this reason, the danger that a parameter will change can be reduced and the safety | security regarding a parameter change can be strengthened.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, a substrate processing apparatus according to an embodiment of the present invention will be described.

  FIG. 1 is a plan view showing a schematic configuration of the substrate processing apparatus according to the present embodiment.

The substrate processing apparatus according to the present embodiment includes an RIE (Reactive Ion Etching) process, a COR (Chemical Oxide Removal) process, and a PHT (Post Heat Treatment) process on a wafer as a substrate.
) Execute the process. The COR process is a process of generating a product by chemically reacting an oxide film of the object to be processed and gas molecules (ammonia gas and hydrogen fluoride gas), and the PHT process is a process to be processed on which the COR process is performed. In this process, the product generated by the chemical reaction of the COR treatment is heated and vaporized and thermally oxidized (Thermal Oxidation) to be removed from the subject. As described above, the COR process and the PHT process, in particular, the COR process is a process for removing an oxide film of an object to be processed without using plasma and without using a water component. Therefore, a plasmaless etching process and a dry cleaning process are performed. Corresponds to (dry cleaning treatment). In addition, this substrate processing apparatus is applicable also as other processing apparatuses, such as CVD processing and heat processing other than an etching process.

  In FIG. 1, a substrate processing apparatus 10 performs a reactive ion etching (hereinafter referred to as “RIE”) process on a wafer (hereinafter simply referred to as “wafer”) (substrate) W for an electronic device. A ship 11, a second process ship 12 that is arranged in parallel with the first process ship 11 and performs a COR (Chemical Oxide Removal) process and a PHT (Post Heat Treatment) process, which will be described later, on the wafer W; A loader unit 13 is provided as a rectangular common transfer chamber to which the process ship 11 and the second process ship 12 are connected.

  In addition to the first process ship 11 and the second process ship 12 described above, a FOUP (Front Opening Unified Pod) 14 as a container for containing 25 wafers W is mounted on the loader unit 13 3 Two hoop mounting tables 15, an orienter 16 that pre-aligns the position of the wafer W carried out of the hoop 14, and first and second IMS (Integrated Metrology System, Therma-Wave, Inc.) that measure the surface state of the wafer W. .) 17 and 18 are connected.

  The first process ship 11 and the second process ship 12 are connected to the side wall in the longitudinal direction of the loader unit 13 and are arranged so as to face the three hoop mounting tables 15 with the loader unit 13 interposed therebetween. Is disposed at one end in the longitudinal direction of the loader unit 13, the first IMS 17 is disposed at the other end in the longitudinal direction of the loader unit 13, and the second IMS 18 is disposed in parallel with the three hoop mounting tables 15.

  The loader unit 13 serves as a loading port for the wafer W disposed on the side wall so as to correspond to the SCARA dual arm type transport arm mechanism 19 that transports the wafer W and the FOUP mounting table 15. And three load ports 20. The transfer arm mechanism 19 takes out the wafer W from the FOUP 14 placed on the FOUP placement table 15 via the load port 20, and removes the taken wafer W from the first process ship 11, the second process ship 12, and the orienter 16. , Carry in / out to the first IMS 17 and the second IMS 18.

  The first IMS 17 is an optical system monitor, and includes a mounting table 21 on which the loaded wafer W is mounted, and an optical sensor 22 directed to the wafer W mounted on the mounting table 21. The surface shape, for example, the film thickness of the surface layer, and the CD (Critical Dimension) value of the wiring trench, the gate electrode, etc. are measured. The second IMS 18 is also an optical system monitor, and has a mounting table 23 and an optical sensor 24 as in the first IMS 17, and measures the number of particles on the surface of the wafer W.

  The first process ship 11 includes a first process unit 25 as a first vacuum processing chamber that performs RIE processing on the wafer W, and a link type single pick type that delivers the wafer W to the first process unit 25. And a first load / lock unit 27 containing the first transfer arm 26.

  The first process unit 25 includes a cylindrical processing chamber container (chamber), and an upper electrode and a lower electrode disposed in the chamber, and the distance between the upper electrode and the lower electrode is RIE on the wafer W. An appropriate interval for processing is set. Further, the lower electrode has an ESC 28 at the top thereof for chucking the wafer W by Coulomb force or the like.

  In the first process unit 25, a processing gas is introduced into the chamber, and an electric field is generated between the upper electrode and the lower electrode, whereby the introduced processing gas is turned into plasma to generate ions and radicals. Thus, the RIE process is performed on the wafer W.

  In the first process ship 11, the internal pressure of the loader unit 13 is maintained at atmospheric pressure, while the internal pressure of the first process unit 25 is maintained at vacuum. Therefore, the first load / lock unit 27 includes a vacuum gate valve 29 at the connection portion with the first process unit 25 and an atmospheric gate valve 30 at the connection portion with the loader unit 13. It is configured as a vacuum pre-transfer chamber that can adjust the pressure.

  Inside the first load / lock unit 27, a first transfer arm 26 is installed at a substantially central portion, and a first buffer 31 is installed on the first process unit 25 side from the first transfer arm 26. Then, the second buffer 32 is installed on the loader unit 13 side from the first transfer arm 26. The first buffer 31 and the second buffer 32 are disposed on a trajectory on which a support portion (pick) 33 that supports the wafer W disposed at the distal end portion of the first transfer arm 26 moves, and is subjected to RIE processing. By temporarily retracting the processed wafer W above the trajectory of the support portion 33, it is possible to smoothly exchange the RIE-unprocessed wafer W and the RIE-processed wafer W in the first process unit 25. .

  The second process ship 12 is connected to a second process unit 34 as a second vacuum processing chamber that performs COR processing on the wafer W, and is connected to the second process unit 34 via a vacuum gate valve 35. A third process unit 36 as a third vacuum processing chamber for performing a PHT process on the wafer W, and a link type single pick type second for delivering the wafer W to the second process unit 34 and the third process unit 36. And a second load / lock unit 49 having a built-in transfer arm 37 therein.

  2 is a cross-sectional view of the second process unit in FIG. 1, FIG. 2 (A) is a cross-sectional view along line II-II in FIG. 1, and FIG. 2 (B) is in FIG. 2 (A). FIG.

  2A, the second process unit 34 includes a cylindrical processing chamber container (chamber) 38, an ESC 39 as a mounting table for the wafer W disposed in the chamber 38, and a chamber 38 above. APC as a variable valve that is disposed between the shower head 40, the TMP (Turbo Molecular Pump) 41 that exhausts gas in the chamber 38, and the chamber 38 and the TMP 41, and controls the pressure in the chamber 38. (Automatic Pressure Control) valve 42.

  The ESC 39 has an electrode plate (not shown) to which a DC voltage is applied, and adsorbs and holds the wafer W by a Coulomb force or a Johnson-Rahbek force generated by the DC voltage. The ESC 39 has a refrigerant chamber (not shown) as a temperature control mechanism. A coolant having a predetermined temperature, for example, cooling water or a Galden solution, is circulated and supplied to the coolant chamber, and the processing temperature of the wafer W adsorbed and held on the upper surface of the ESC 39 is controlled by the temperature of the coolant. Further, the ESC 39 has a heat transfer gas supply system (not shown) that uniformly supplies heat transfer gas (helium gas) between the upper surface of the ESC 39 and the back surface of the wafer W. During the COR process, the heat transfer gas exchanges heat between the ESC 39 maintained at a desired designated temperature by the refrigerant and the wafer W, thereby cooling the wafer W efficiently and uniformly.

  The ESC 39 has a plurality of pusher pins 56 as lift pins that can protrude from the upper surface thereof. These pusher pins 56 are accommodated in the ESC 39 when the wafer W is sucked and held on the ESC 39 and subjected to COR processing. When the wafer W is unloaded from the chamber 38, it protrudes from the upper surface of the ESC 39 and lifts the wafer W upward.

  The shower head 40 has a two-layer structure, and has a first buffer chamber 45 and a second buffer chamber 46 in each of the lower layer portion 43 and the upper layer portion 44. The first buffer chamber 45 and the second buffer chamber 46 communicate with the chamber 38 through gas vents 47 and 48, respectively. That is, the shower head 40 has two plate-like bodies (lower layers) stacked in a layered manner having internal passages into the gas chambers 38 for the gases supplied to the first buffer chamber 45 and the second buffer chamber 46, respectively. Part 43 and upper layer part 44).

When the COR process is performed on the wafer W, NH ₃ (ammonia) gas is supplied to the first buffer chamber 45 from an ammonia gas supply pipe 57 described later, and the supplied ammonia gas is supplied to the chamber through the gas vent 47. 38, and HF (hydrogen fluoride) gas is supplied to the second buffer chamber 46 from a hydrogen fluoride gas supply pipe 58, which will be described later, and the supplied hydrogen fluoride gas is supplied to the gas vent hole 48. Is supplied into the chamber 38 via

  The shower head 40 incorporates a heater (not shown), for example, a heating element. This heating element is preferably disposed on the upper layer portion 44 to control the temperature of the hydrogen fluoride gas in the second buffer chamber 46.

  In addition, as shown in FIG. 2B, the openings into the chamber 38 in the gas vent holes 47 and 48 are formed so as to expand toward the end. Thereby, ammonia gas or hydrogen fluoride gas can be efficiently diffused into the chamber 38. Further, since the gas vent holes 47 and 48 have a constricted cross section, the deposits generated in the chamber 38 are directed to the gas vent holes 47 and 48, and then to the first buffer chamber 45 and the second buffer chamber 46. Backflow can be prevented. The gas vents 47 and 48 may be spiral vents.

  The second process unit 34 performs COR processing on the wafer W by adjusting the pressure in the chamber 38 and the volume flow ratio of ammonia gas and hydrogen fluoride gas. Further, since the second process unit 34 is designed so that ammonia gas and hydrogen fluoride gas are mixed for the first time in the chamber 38 (postmix design), the above two kinds of gases are introduced into the chamber 38. Until then, the two gases are prevented from mixing and the hydrogen fluoride gas and ammonia gas are prevented from reacting before being introduced into the chamber 38.

  In the second process unit 34, the side wall of the chamber 38 incorporates a heater (not shown), for example, a heating element, and prevents the ambient temperature in the chamber 38 from being lowered. Thereby, the reproducibility of the COR processing can be improved. Further, the heating element in the side wall prevents the by-product generated in the chamber 38 from adhering to the inside of the side wall by controlling the temperature of the side wall.

  Returning to FIG. 1, the third process unit 36 includes a housing-like processing chamber container (chamber) 50, a stage heater 51 as a mounting table for the wafer W disposed in the chamber 50, and the stage heater 51. And a buffer arm 52 that lifts the wafer W placed on the stage heater 51 upward, and a PHT chamber lid (not shown) as an openable / closable lid that shuts off the atmosphere inside and outside the chamber.

  The stage heater 51 is made of aluminum having an oxide film formed on the surface, and heats the wafer W placed by a built-in heating wire or the like to a predetermined temperature. Specifically, the stage heater 51 directly heats the placed wafer W to 100 to 200 ° C., preferably about 135 ° C., for at least 1 minute.

  The PHT chamber lid is provided with a silicon rubber seat heater. A cartridge heater (not shown) is built in the side wall of the chamber 50, and the cartridge heater controls the wall surface temperature of the side wall of the chamber 50 to 25 to 80 ° C. This prevents by-products from adhering to the side walls of the chamber 50, prevents generation of particles due to the attached by-products, and extends the cleaning cycle of the chamber 50. The outer periphery of the chamber 50 is covered with a heat shield.

  As a heater for heating the wafer W from above, an ultraviolet radiation (UV radiation) heater may be provided instead of the above-described sheet heater. Examples of the ultraviolet radiation heater include an ultraviolet lamp that emits ultraviolet light having a wavelength of 190 to 400 nm.

  The buffer arm 52 temporarily retracts the wafer W on which the COR processing has been performed above the trajectory of the support portion 53 in the second transfer arm 37, whereby the second process unit 34 and the third process unit 36. The wafer W can be smoothly exchanged.

  The third process unit 36 performs a PHT process on the wafer W by adjusting the temperature of the wafer W.

  The second load / lock unit 49 includes a housing-like transfer chamber (chamber) 70 in which the second transfer arm 37 is built. The internal pressure of the loader unit 13 is maintained at atmospheric pressure, while the internal pressures of the second process unit 34 and the third process unit 36 are maintained at vacuum. Therefore, the second load / lock unit 49 includes the vacuum gate valve 54 at the connection portion with the third process unit 36 and the atmospheric door valve 55 at the connection portion with the loader unit 13. It is configured as a vacuum preliminary transfer chamber that can be adjusted.

  FIG. 3 is a perspective view showing a schematic configuration of the second process ship in FIG.

  In FIG. 3, the second process unit 34 includes an ammonia gas supply pipe 57 that supplies ammonia gas to the first buffer chamber 45 and a hydrogen fluoride gas supply that supplies hydrogen fluoride gas to the second buffer chamber 46. A pipe 58, a pressure gauge 59 for measuring the pressure in the chamber 38, and a chiller unit 60 for supplying a refrigerant to a cooling system disposed in the ESC 39 are provided.

  The ammonia gas supply pipe 57 is provided with an MFC (Mass Flow Controller) (not shown). The MFC adjusts the flow rate of the ammonia gas supplied to the first buffer chamber 45 and is connected to the hydrogen fluoride gas supply pipe 58. MFC (not shown) is also provided, and the MFC adjusts the flow rate of the hydrogen fluoride gas supplied to the second buffer chamber 46. The MFC of the ammonia gas supply pipe 57 and the MFC of the hydrogen fluoride gas supply pipe 58 cooperate to adjust the volume flow ratio of the ammonia gas and the hydrogen fluoride gas supplied to the chamber 38.

  A second process unit exhaust system 61 connected to a DP (Dry Pump) (not shown) is disposed below the second process unit 34. The second process unit exhaust system 61 includes an exhaust pipe 63 communicating with an exhaust duct 62 disposed between the chamber 38 and the APC valve 42, and an exhaust pipe 64 connected to the lower side (exhaust side) of the TMP 41. And exhausts the gas and the like in the chamber 38. The exhaust pipe 64 is connected to the exhaust pipe 63 before the DP.

The third process unit 36 exhausts the nitrogen gas supply pipe 65 that supplies nitrogen (N ₂ ) gas to the chamber 50, the pressure gauge 66 that measures the pressure in the chamber 50, the nitrogen gas in the chamber 50, and the like. And a third process unit exhaust system 67.

  The nitrogen gas supply pipe 65 is provided with an MFC (not shown), and the MFC adjusts the flow rate of the nitrogen gas supplied to the chamber 50. The third process unit exhaust system 67 includes a main exhaust pipe 68 communicating with the chamber 50 and connected to the DP, an APC valve 69 disposed in the middle of the main exhaust pipe 68, and the main exhaust pipe 68 to the APC valve. And a sub-exhaust pipe 68a that branches to avoid 69 and is connected to the main exhaust pipe 68 before the DP. The APC valve 69 controls the pressure in the chamber 50.

  The second load / lock unit 49 includes a nitrogen gas supply pipe 71 that supplies nitrogen gas to the chamber 70, a pressure gauge 72 that measures the pressure in the chamber 70, and a second gas that exhausts nitrogen gas and the like in the chamber 70. The load / lock unit exhaust system 73 and an atmosphere communication pipe 74 that opens the inside of the chamber 70 to the atmosphere.

  The nitrogen gas supply pipe 71 is provided with an MFC (not shown), and the MFC adjusts the flow rate of nitrogen gas supplied to the chamber 70. The second load / lock unit exhaust system 73 comprises one exhaust pipe, which communicates with the chamber 70 and is connected to the main exhaust pipe 68 in the third process unit exhaust system 67 before the DP. The The second load / lock unit exhaust system 73 and the atmosphere communication pipe 74 have an exhaust valve 75 and a relief valve 76 that can be opened and closed, respectively, and the exhaust valve 75 and the relief valve 76 cooperate with each other in the chamber 70. The pressure is adjusted from atmospheric pressure to any desired degree of vacuum.

  FIG. 4 is a diagram showing a schematic configuration of a unit driving dry air supply system of the second load / lock unit in FIG. 3.

In FIG. 4, the dry air supply destination of the unit drive dry air supply system 77 of the second load / lock unit 49 includes a door valve cylinder for driving the slide door of the atmospheric door valve 55, and nitrogen gas supply as the N ₂ purge unit. MFC included in the pipe 71, a relief valve 76 included in the atmosphere communication pipe 74 serving as a relief unit for opening to the atmosphere, an exhaust valve 75 included in the second load / lock unit exhaust system 73 serving as a vacuum drawing unit, and a vacuum gate valve 54 Corresponds to a gate valve cylinder for driving a slide gate.

  The unit driving dry air supply system 77 includes a sub dry air supply pipe 79 branched from the main dry air supply pipe 78 included in the second process ship 12, a first solenoid valve 80 connected to the sub dry air supply pipe 79, and A second solenoid valve 81.

  The first solenoid valve 80 is connected to the door valve cylinder, the MFC, the relief valve 76, and the gate valve cylinder via each of the dry air supply pipes 82, 83, 84, 85, and controls the amount of dry air supplied thereto. Thus, the operation of each part is controlled. The second solenoid valve 81 is connected to the exhaust valve 75 via a dry air supply pipe 86 and controls the operation of the exhaust valve 75 by controlling the amount of dry air supplied to the exhaust valve 75.

The MFC in the nitrogen gas supply pipe 71 is also connected to a nitrogen (N ₂ ) gas supply system 87.

  The second process unit 34 and the third process unit 36 also include a unit drive dry air supply system having the same configuration as the unit drive dry air supply system 77 of the second load / lock unit 49 described above.

  Returning to FIG. 1, the substrate processing apparatus 10 includes a system controller that controls the operations of the first process ship 11, the second process ship 12, and the loader unit 13, and an operation arranged at one end in the longitudinal direction of the loader unit 13. And a controller 88.

  The operation controller 88 has a display unit composed of, for example, an LCD (Liquid Crystal Display), and the display unit displays the operation status of each component of the substrate processing apparatus 10. The user can perform various operations on the substrate processing apparatus 10 via the operation controller 88.

  As shown in FIG. 5, the system controller includes an EC (Equipment Controller) 89, three MCs (Module Controllers) 90, 91, and 92, and a switching hub 93 that connects the EC 89 and each MC. The system controller is connected from the EC 89 via a LAN (Local Area Network) 170 to a PC 171 as a MES (Manufacturing Execution System) that manages the manufacturing process of the entire factory where the substrate processing apparatus 10 is installed. The MES cooperates with the system controller to feed back real-time information relating to processes in the factory to a core business system (not shown) and makes a determination relating to the process in consideration of the load of the entire factory.

  The EC 89 is a main control unit (master control unit) that controls each operation of the substrate processing apparatus 10 by controlling each MC. The EC 89 has a CPU, RAM, ROM, HDD, etc., and the CPU controls each MC according to the processing method of the wafer W designated by the user or the like in the operation controller 88, that is, a program corresponding to the recipe. By transmitting a signal, the operations of the first process ship 11, the second process ship 12, and the loader unit 13 are controlled.

  The switching hub 93 switches the MC as a connection destination of the EC 89 in accordance with a control signal from the EC 89.

  MCs 90, 91, and 92 are sub-control units (slave control units) that control the operations of the first process ship 11, the second process ship 12, and the loader unit 13, respectively. Each MC is connected to each I / O (input / output) module 97, 98, 99 via a GHOST network 95 by a DIST (Distribution) board 96. The GHOST network 95 is a network realized by an LSI called GHOST (General High-Speed Optimum Scalable Transceiver) mounted on an MC board included in the MC. A maximum of 31 I / O modules can be connected to the GHOST network 95. In the GHOST network 95, the MC corresponds to the master and the I / O module corresponds to the slave.

  The I / O module 98 includes a plurality of I / O units 100 connected to each component (hereinafter referred to as “end device”) in the second process ship 12, and includes a control signal and each of the end devices. Transmits output signals from end devices. Examples of the end device connected to the I / O unit 100 in the I / O module 98 include an MFC of the ammonia gas supply pipe 57, an MFC of the hydrogen fluoride gas supply pipe 58, and a pressure gauge 59 in the second process unit 34. And the APC valve 42, the MFC of the nitrogen gas supply pipe 65 in the third process unit 36, the pressure gauge 66, the APC valve 69, the buffer arm 52 and the stage heater 51, and the nitrogen gas supply pipe 71 in the second load / lock unit 49. And the first solenoid valve 80 and the second solenoid valve 81 in the unit driving dry air supply system 77.

  The I / O modules 97 and 99 have the same configuration as the I / O module 98 and correspond to the connection relationship between the MC 90 and the I / O module 97 corresponding to the first process ship 11 and the loader unit 13. Since the connection relationship between the MC 92 and the I / O module 99 is the same as the connection relationship between the MC 91 and the I / O module 98 described above, description thereof will be omitted.

  Each GHOST network 95 is also connected to an I / O board (not shown) that controls input / output of digital signals, analog signals, and serial signals in the I / O unit 100.

  When the COR processing is performed on the wafer W in the substrate processing apparatus 10, the CPU of the EC 89 performs the I in the switching hub 93, MC 91, GHOST network 95 and I / O module 98 according to the program corresponding to the recipe of the COR processing. The COR process is executed in the second process unit 34 by transmitting a control signal to a desired end device via the / O unit 100.

  Specifically, the CPU sends a control signal to the MFC of the ammonia gas supply pipe 57 and the MFC of the hydrogen fluoride gas supply pipe 58 to thereby set the volume flow rate ratio of ammonia gas and hydrogen fluoride gas in the chamber 38 to a desired value. The pressure in the chamber 38 is adjusted to a desired value by adjusting the value and sending a control signal to the TMP 41 and the APC valve 42. Further, at this time, the pressure gauge 59 transmits the pressure value in the chamber 38 as an output signal to the CPU of the EC 89, and the CPU, based on the transmitted pressure value in the chamber 38, the MFC of the ammonia gas supply pipe 57, Control parameters of the MFC, APC valve 42 and TMP 41 of the hydrogen fluoride gas supply pipe 58 are determined.

  When performing the PHT process on the wafer W, the CPU of the EC 89 transmits a control signal to a desired end device in accordance with a program corresponding to the recipe of the PHT process, so that the third process unit 36 performs the PHT process. Execute.

  Specifically, the CPU adjusts the pressure in the chamber 50 to a desired value by transmitting a control signal to the MFC and APC valve 69 of the nitrogen gas supply pipe 65, and transmits the control signal to the stage heater 51. Thus, the temperature of the wafer W is adjusted to a desired temperature. At this time, the pressure gauge 66 transmits the pressure value in the chamber 50 as an output signal to the CPU of the EC 89, and the CPU, based on the transmitted pressure value in the chamber 50, the APC valve 69 and the nitrogen gas supply pipe. 65 control parameters of MFC are determined.

  In the system controller of FIG. 5, the plurality of end devices are not directly connected to the EC 89, but the I / O unit 100 connected to the plurality of end devices is modularized to form an I / O module. Since the / O module is connected to the EC 89 via the MC and the switching hub 93, the communication system can be simplified.

  Further, the control signal transmitted by the CPU of the EC 89 includes the address of the I / O unit 100 connected to the desired end device and the address of the I / O module including the I / O unit 100. The switching hub 93 refers to the address of the I / O module in the control signal, and the GHOST of the MC refers to the address of the I / O unit 100 in the control signal, so that the switching hub 93 and the MC transmit the control signal to the CPU. It is possible to eliminate the necessity of making the previous inquiry, thereby realizing smooth transmission of the control signal.

  FIG. 6 is a block diagram showing a schematic configuration of the EC 89 in the system controller of FIG.

  As shown in FIG. 6, the EC 89 includes a CPU 111 that controls each component of the substrate processing apparatus 10, a RAM 112 as a work area for arithmetic processing by the CPU 111, a ROM 113 as a storage area, HD, and floppy (registered trademark). An external storage medium drive 114 that reads data from and writes data to an external storage device such as a disk, MO, or CD-ROM.

  The ROM 113 stores a program indicating recipes corresponding to various processes executed in the substrate processing apparatus 10 as described above, various control parameters for controlling each component according to the recipe, and the like. . The ROM 113 includes a parameter definition file storage area 115 for storing a parameter definition file, which will be described later, and a backup area 116 for creating a backup file. The ROM 113 stores a parameter category changing tool described later.

  In the EC 89, as described above, the CPU 111 reads out and executes a program corresponding to each process recipe from the ROM 113, searches the ROM 113 for a control parameter corresponding to the state of each component, and uses this as a control signal. It outputs to an end device, controls each end device, and performs each process.

  The ROM 113 stores a large number of control parameters for controlling each component of the substrate processing apparatus 10. The control parameters include gas supply amounts such as MFC of the ammonia gas supply pipe 57, MFC of the hydrogen fluoride gas supply pipe 58, MFC of the nitrogen gas supply pipe 65, and the like.

  The attributes of these control parameters are defined by a parameter definition file. As attribute information of each parameter, parameter ID information (hereinafter referred to as GPID) for specifying each parameter, category information indicating a category to which each parameter belongs, option information indicating options set for each parameter, and each Text information for displaying parameter item names, categories, and options on the operation controller 88 is included. The category to which the parameter belongs represents the importance of each parameter, and includes, for example, five categories of categories 0, 1, 2, 3, and 4. In the present embodiment, the lower the category, the higher the importance.

  As shown in FIG. 7, the parameter definition file stores information indicating the name of the parameter definition file (parameter definition file name), GPID, category information, text information, and option information. The parameter definition file can set attribute information corresponding to a plurality of control parameters, and is stored in the parameter definition file storage area 115 of the ROM 113. The parameter value is not recorded in the parameter definition file, but is stored in a predetermined area of the ROM 113. The parameter value and the parameter definition file are associated with each other by GPID.

  The text information and options of the parameter definition file are displayed on the operation controller 88 as shown in FIG. In the parameter definition file information display screen of the operation controller 88 in FIG. 8, the item name and category of each parameter are displayed in the item name column 121, and the options set for each parameter are displayed in the option column 122. In the item name column 121, the number displayed on the left side of the item name indicates the category to which the parameter belongs. For example, the parameter item name displayed at the top of the parameter definition file information display screen is “ARAMS state forced change”, and the category is 4. In addition, “invalid” is currently selected as the parameter value for forcibly changing the ARAMS state. Therefore, the parameter for forcibly changing the ARAMS state is currently set to invalid. Also, the parameter item name displayed in the second row of the parameter definition file information display screen is “PAC (Process Automation Control) recipe passing timeout”, and the category is 3. Also, “10 (seconds)” is currently selected as the parameter value for the PAC recipe passage timeout. PAC includes R2R and FDC.

  The EC 89 is configured so that the user can set a parameter having a high category and a low importance, that is, a parameter belonging to the categories 2, 3, and 4 to an arbitrary value via the operation controller 88 in the present embodiment. Yes. On the other hand, the EC 89 is configured such that the user cannot change the low-importance parameter of the category, that is, the parameter belonging to the categories 0 and 1 in the present embodiment. Thereby, the safety | security regarding a parameter change is ensured.

  Specifically, the parameters belonging to categories 2, 3, and 4 can be changed in their choices and parameter values on the parameter definition file information display screen shown in FIG. On the other hand, parameters belonging to categories 0 and 1 cannot change their choices and parameter values. The parameter is changed by the CPU 111 executing a parameter changing program stored in the ROM 113 by a user operation. The parameter definition file stored in the ROM 113 is linked to the parameter change program, and the CPU 111 is designated by the user with reference to the parameter definition file (FIG. 7) in the ROM 113 when executing the parameter change program. When a parameter belongs to categories 2, 3, and 4, the parameter can be changed.

  As described above, in the EC 89, the parameter values set in the categories 0 and 1 cannot be changed and the safety regarding the parameter change is ensured. The inability to change the parameters is inconvenient for the user. On the other hand, the substrate processing apparatus 10 is configured to be able to execute a parameter category changing process which will be described later with reference to FIG. Specifically, a program (parameter category changing tool) for executing parameter category changing processing is stored in the ROM 113 of the EC89.

  In order to execute parameter category change processing and change parameters belonging to categories 0 and 1, an external storage medium 117 storing a category change definition file indicating a parameter whose category is to be changed is inserted into the external storage device drive 114 Is done. In the category change definition file stored in the external storage medium 117, as shown in FIG. 9, the GPID and parameter of the parameter that the user wants to be able to arbitrarily change the parameter value through the operation controller 88 by raising the category The definition file name is stored. The category change definition file is configured so that one or more GPIDs can be registered. The CPU 111 reads a category change definition file stored in the external storage medium 117 via the external storage device drive 114 in accordance with a user operation, and stores it in the ROM 113.

  The parameter category changing process will be described in detail below.

  FIG. 10 is a flowchart of the parameter category changing process executed by the substrate processing apparatus 10.

  This parameter category changing process is executed by the CPU 111 of the EC 89 when the user performs a predetermined operation via the operation controller 88. Specifically, the process starts when the user displays the parameter category change process execution screen shown in FIG. 11 on the operation controller 88 and selects the parameter category change button 131 on the parameter category change process execution screen.

  In this parameter category change process, first, it is determined whether or not a category change definition file exists in the ROM 113 (step S1). If the category change definition file does not exist in the ROM 113, this process is terminated. If the category change definition file is not in the ROM 113, the subsequent processing is not executed as an error. On the other hand, if the category change definition file exists in the ROM 113, the process proceeds to step S2.

  In step S2, it is determined whether or not a category change definition file (hereinafter referred to as a copy category change definition file) obtained by copying the category change definition file in the ROM 113 created in step S12 described later exists in the backup file 116. To do. If the copy category change definition file exists in the backup file 116, this process is terminated. If the copy category change definition file exists in the backup file 116, the subsequent processing is not executed as an error. On the other hand, if the copy category change definition file does not exist in the backup file 116, the process proceeds to step S3.

  In step S3, the parameter definition file name not yet selected in step S3 is selected from the parameter definition file names of the category change definition file in the ROM 113.

  Next, a parameter definition file corresponding to the parameter definition file name selected in step S3 is searched from the parameter definition file storage area 115 of the ROM 113, and whether or not the corresponding parameter definition file exists in the parameter definition file storage area 115. Is discriminated (step S4). If the corresponding parameter definition file does not exist in the parameter definition file storage area 115, the process proceeds to step S11 described later. That is, the category change of the parameter definition file corresponding to the parameter definition file name selected in step S3 is skipped. In this case, the operation controller 88 displays that the parameter definition file category change corresponding to the selected parameter definition file name has been skipped.

  On the other hand, if the corresponding parameter definition file exists in the parameter definition file storage area 115, it is determined whether or not a copy of the corresponding parameter definition file has already been copied to the backup area 116 (step S5). That is, it is determined whether or not a copy of the corresponding parameter definition file (hereinafter referred to as a copy parameter definition file) exists in the backup area 116.

  If the copy parameter definition file does not exist in the backup area 116, the parameter definition file searched in step S4 is copied to the backup area 116 to create a copy parameter definition file in the backup area 116 (step S6). Transition to processing.

  On the other hand, if the copy parameter definition file exists in the backup area 116, the process proceeds to step S11. If the copy parameter definition file exists in the backup area 116 in step S5, the category of the parameter definition file that has been searched later is skipped because the category of the corresponding parameter definition file has already been changed by the processing described later. In this case, the operation panel 88 displays that the latter has been skipped.

  In step S7, a GPID that has not been selected in step S7 among the GPIDs corresponding to the parameter definition file name selected in step S3 is selected from the category change definition file read in the ROM 113 (step S7). It is determined whether or not the same GPID as that of the GPID exists in the copy parameter definition file created in the backup area 116 in step S6 (step S8).

  If the GPID selected in step S7 exists in the copy parameter definition file created in step S6, the category information of the category 0 or 1 indicated by this GPID in the copy parameter definition file is changed to category 2 (step S9), the process proceeds to step S10. At this time, the copy parameter definition file whose category information is changed to category 2 is linked to the parameter change program in place of the original parameter definition file. Thus, when the user executes the parameter change program after executing this parameter category change process, the CPU 111 changes the parameters specified by the category change definition file of the external storage medium 117 in order to refer to the copy parameter definition file. be able to. On the other hand, if the GPID selected in step S7 does not exist in the copy parameter definition file created in step S6, the process directly proceeds to step S10.

  In step S10, it is determined whether a GPID that has not been selected in step S7 among the GPIDs corresponding to the parameter definition file name selected in step S3 exists in the category change definition file in the ROM 113. If the unselected GPID exists in the category change definition file, the process returns to step S7. If the unselected GPID does not exist in the category change definition file, the parameter definition file name not yet selected in step S3 is stored in the ROM 113. It is determined whether or not it exists in the category change definition file (step S11).

  If the unselected parameter definition file name exists in the category change definition file in the ROM 113, the process returns to step S3. On the other hand, if the unselected parameter definition file name does not exist in the category change definition file of the ROM 113, the category change definition file is copied to the backup area 116 of the ROM 113 and a copy category change definition file is created in the backup area 116 (step S12), this process is terminated.

  This process is executed for each category change definition file of the external storage medium 117 read into the ROM 113 by the external storage device drive 114. Also, during the execution of the parameter category changing process, operations such as device initialization and transition to all maintenance are prohibited.

  By specifying the GPID of parameters belonging to categories 0 and 1 and the parameter change file name in the category change definition file of the external storage medium 116 by the parameter category change process described above, the category of the parameter specified in the external storage medium 116 A copy parameter definition file in which is changed to category 2 is created, and this copy parameter definition file is linked to the parameter change program in place of the original parameter definition file. Thus, when the user executes the parameter change program after executing this parameter category change process, the CPU 111 refers to the copy parameter definition file, and therefore the user specifies the parameter specified by the category change definition file of the external storage medium 117. It can be changed via the operation controller 88.

  For example, it is desired to change the category by describing the GPID and parameter definition file name of the parameter 125, 126, 127, 128 of the category 0 or 1 in the category change definition file of the external storage medium 117 among the parameters shown in FIG. The parameters 125, 126, 127, and 128 are designated as parameters, the external storage medium 117 is read into the ROM 113 by the external storage device drive 114, and the parameter category changing process shown in FIG. , 127, 128 are changed to category 2 (see FIG. 12). Therefore, the user can easily change the values of the parameters 125, 126, 127, and 128 specified through the operation controller 88 by executing a parameter change program by performing a predetermined operation in the operation controller 88. . For example, as shown in FIG. 13, the parameter 128 (see FIG. 12) whose category has been changed can be selected by the operation controller 88 and the option can be changed from “invalid” to “valid”.

  In the process of step S12 described above, the category change definition file in which the category of the parameter already specified is changed to category 2 among the category change definition files in which the parameter whose category is to be changed is specified is copied to the backup area 116. In step S2, parameter category change processing is not executed for the category change definition file that has already been copied to the backup area 116 in step S12. Therefore, the parameter category change process is prevented from being executed twice for the same category change definition file.

  Next, a parameter category return process for returning the parameter category whose category has been changed in the parameter category change process described above to the original category will be described. This parameter category return processing is performed by the CPU 111 executing the parameter category changing tool.

  FIG. 14 is a flowchart of the parameter category return process.

  This process is executed after the parameter category changing process of FIG. 10 is executed and after the substrate processing apparatus 10 is restarted.

  First, it is determined whether or not a copy category change definition file exists in the backup area 116 (step S21). If the copy category change definition file does not exist in the backup area 116, this process ends. On the other hand, if the copy category change definition file exists in the backup area 116, the process proceeds to step S22.

  In step S22, a parameter definition file name not yet selected in step S22 is selected from the parameter definition file names stored in the copy category change definition file, and the copy parameter definition file corresponding to the selected parameter definition file name is selected. Is present in the backup area 116 (step S23). If a copy parameter definition file corresponding to the selected parameter definition file name exists in the backup area 116, the corresponding copy parameter definition file is deleted (step S24), and the process proceeds to step S25. At this time, the link destination of the copy parameter parameter change program is changed from the copy parameter definition file to the parameter definition file in the original ROM 113. As a result, the category of the parameter whose value can be changed by the category being changed to the category 2 by the parameter category changing process of FIG. 10 returns to the original category 0 or 1, and the parameter cannot be changed again. On the other hand, if the copy parameter definition file corresponding to the selected parameter definition file name does not exist in the backup area 116, the process directly proceeds to step S25. In this case, the operation controller 88 displays that the category return processing of the copy parameter definition file corresponding to the selected parameter definition file name has been skipped.

  In step S25, it is determined whether or not a parameter definition file name not yet selected in step S22 exists in the copy category change definition file. If an unselected parameter definition file name exists in the copy category change definition file, the process returns to step S22. On the other hand, if the unselected parameter definition file name does not exist in the copy category change definition file, this copy category change definition file is deleted from the backup area 116 (step S26), and this process is terminated.

  By this parameter category return processing, the copy parameter definition file linked to the parameter change program by the parameter category change processing of FIG. 10 is deleted and the original parameter definition file becomes the link destination, so it is designated as the external storage medium 117. The changed parameters cannot be changed again.

  Further, since the copy category change definition file created in the backup area 116 by the parameter category change process of FIG. 10 is deleted, the parameter category change process based on this category change definition file can be executed again.

  As described above, according to the substrate processing apparatus 10 according to the embodiment of the present invention, the GPID indicating the parameters belonging to the categories 0 and 1 and the parameter definition file name thereof are recorded in the category change definition file of the external storage medium 117. By designating the parameter whose value is to be changed, the category of the designated parameter is changed to 2. Thereby, the user can change the value of the parameter. Therefore, the user can easily change the parameter via the operation controller 88 by specifying the parameter of the category in which the parameter cannot be changed by the external storage medium 117. In addition, since the user can easily change the parameter, it is possible to reduce the occurrence of erroneous operation of changing the parameter, and to suppress malfunction of the substrate processing apparatus 10.

  In the parameter category change process, a copy of the category change definition file in which the designated category is changed is created in the backup area 116, and the parameter category change process based on this category change definition file cannot be executed. Therefore, it is possible to prevent double execution of category change for a parameter whose category has been changed. As a result, it is possible to prevent a parameter that can be changed from being changed again.

  Further, according to the substrate processing apparatus 10, when the category is changed by the parameter category changing process and the substrate processing apparatus 10 is restarted, the parameter category returning process is executed and the category changed by the parameter category changing process is changed. Return to the original category. Therefore, it is possible to prevent the changed category from being forgotten. For this reason, it is possible to reduce the risk that the parameter is changed by continuing the state in which the category is changed, and it is possible to enhance the safety regarding the parameter change.

  Next, a modification of the parameter category change process and the parameter category return process will be described. FIG. 15 is a flowchart of a modification of the parameter category change process, and FIG. 16 is a flowchart of a modification of the parameter category return process. In the following description, only different parts will be described with respect to the parameter category changing process of FIG. 10 and the parameter category returning process of FIG. 14, and the same parts will be denoted by the same reference numerals and redundant description will be omitted.

  First, a modification of the parameter category changing process will be described.

  In this parameter category changing process, instead of step S8 of the parameter category changing process of FIG. 10, the same GPID as the GPID selected in step S7 exists in the parameter definition file stored in the parameter definition file storage area 115 of the ROM 113. It is determined whether or not to perform (step S31). When the same GPID as the GPID selected in step S7 does not exist in the parameter definition file stored in the parameter definition file storage area 115, the process proceeds to step S10, and the parameter definition stored in the parameter definition file storage area 115 is stored. If the same GPID as the GPID selected in step S7 exists in the file, the process proceeds to step S32 that is executed instead of step S9 of the parameter category change process of FIG. In step S32, the category information of the parameter indicated by the selected GPID is changed from category 0 or 1 to category 2 in the parameter definition file in the parameter definition file storage area 115 having the same GPID as that selected in step S7. .

  As described above, the parameter category changing process is different from the parameter category changing process of FIG. 10 in that the original parameter stored in the parameter definition file storage area 115 of the ROM 113 is used instead of the copy parameter definition file created in the backup area. It differs in that the category information in the parameter definition file is changed. Thereby, the process of changing the link destination of the parameter change program can be omitted. Further, the same effect as the parameter category changing process of FIG. 10 can be obtained.

  Next, a modification of the parameter category return process will be described.

  In this parameter category return process, instead of step S24 of the parameter category return process of FIG. 14, the corresponding copy parameter definition file in the backup area 116 is replaced with the corresponding parameter definition file in the parameter definition file storage area 115 (hereinafter referred to as the corresponding parameter). It is overwritten by the definition file) and the corresponding copy parameter definition file in the backup area 116 is deleted (step S41). Accordingly, the corresponding parameter definition file in the parameter definition file storage area 115 whose category has been changed by the parameter category changing process of FIG. 15 is a copy of the original parameter definition file before the category has been changed by the parameter category changing process. Since the copy parameter definition file is rewritten, the parameter definition data in the parameter definition file storage area 115 is restored, and the parameters of categories 0 and 1 cannot be changed.

  As described above, this parameter category return process does not immediately delete the copy parameter definition file created in the backup area, but stores it in the parameter definition file storage area 115 of the ROM 113 in contrast to the parameter category return process of FIG. The difference is that the parameter definition file in which the stored category information is changed is rewritten to the corresponding copy parameter definition file that is the original parameter definition file in which the category information has not been changed, and then the corresponding copy parameter definition file is deleted. Thereby, the process of changing the link destination of the parameter change program can be omitted. Further, the same effect as the parameter category changing process of FIG. 14 can be obtained.

  In the present invention, the structure of the substrate processing apparatus is not limited to the structure of the substrate processing apparatus 10 described above, and may be substrate processing apparatuses having various structures.

It is a top view which shows schematic structure of the substrate processing apparatus which concerns on embodiment of this invention. 2 is a cross-sectional view of a second process unit in FIG. 1, FIG. 2A is a cross-sectional view taken along line II-II in FIG. 1, and FIG. 2B is an enlarged view of portion A in FIG. FIG. It is a perspective view which shows schematic structure of the process ship in FIG. It is a figure which shows schematic structure of the unit drive dry air supply system of the load lock unit in FIG. It is a figure which shows schematic structure of the system controller in the substrate processing apparatus of FIG. FIG. 6 is a block diagram illustrating a schematic configuration of an EC in the system controller of FIG. 5. It is a figure which illustrates the parameter definition file stored in the parameter definition file storage area in FIG. It is a figure which shows the example of a display in the operation controller of the parameter definition file of FIG. It is a figure which illustrates the category change definition file stored in the external storage medium in FIG. It is a flowchart of the parameter category change process which the substrate processing apparatus of FIG. 1 performs. It is a figure explaining operation for starting the parameter category change process of FIG. It is a figure which illustrates the information of the parameter definition file changed by the parameter category change process of FIG. FIG. 11 is a diagram exemplifying a parameter changing operation in which a parameter can be changed by the parameter category changing process of FIG. 10. It is a flowchart of the parameter category return process which the substrate processing apparatus of FIG. 1 performs. It is a flowchart of the modification of a parameter category change process. It is a flowchart of the modification of a parameter category return process.

Explanation of symbols

10 Substrate processing device 88 Operation controller 89 EC
111 CPU
112 RAM
113 ROM
114 External storage device drive 115 Parameter definition file storage area 116 Backup area 117 External storage medium

Claims (20)

A substrate processing apparatus for processing a substrate,
A storage device that stores parameters for controlling the processing, which are classified into a plurality of categories;
A control device that performs the process on the substrate based on the parameters;
A parameter changing device capable of changing the parameter according to the parameter category;
A parameter category changing device for changing the category of the parameter;
A category change definition device that is detachable in the substrate processing apparatus and that specifies a parameter for changing a category of the parameters;
The substrate processing apparatus, wherein the parameter category changing device changes a category of a parameter designated by the category change defining device.   The parameter changing device makes it possible to change a parameter of a predetermined category among the plurality of categories, and the parameter category changing device changes a category of a parameter other than the predetermined category to the predetermined category. The substrate processing apparatus according to claim 1.   3. The substrate processing according to claim 1, wherein the parameter category changing device returns the changed category to the original category when the substrate processing apparatus is restarted after the category is changed. apparatus.   2. The parameter category change prohibiting device for prohibiting a change of a category by the parameter category changing device after the parameter category changing device changes a category of a parameter designated by the category change defining device. The substrate processing apparatus of any one of thru | or 3.   The storage device stores parameter information indicating the parameter and category information indicating a category corresponding to each of the parameters among the plurality of categories, and the parameter category changing device includes a duplicate storage device, The parameter information and the category information stored by the device are duplicated and stored in the duplicate storage device, and the parameter information corresponding to the parameter designated by the category change defining device is retrieved from the duplicated parameter information, The category information corresponding to the retrieved parameter information among the copied category information is changed so that the parameter can be changed, and the substrate processing apparatus stored in the duplicate storage device when the substrate processing apparatus is restarted. Return the changed category to the original category by deleting the information DOO substrate processing apparatus according to any one of claims 1 to 4, characterized in.   The storage device stores parameter information indicating the parameter and category information indicating a category corresponding to each of the parameters among the plurality of categories, and the parameter category changing device includes a duplicate storage device, The parameter information and the category information stored in the device are duplicated and stored in the duplicate storage device, and the parameter information corresponding to the parameter specified by the category change defining device is retrieved from the parameter information stored in the storage device. When the category information corresponding to the retrieved parameter information is changed among the category information stored in the storage device so that the parameter can be changed, and the substrate processing apparatus is restarted, the storage device Overwrite the information stored in the information with the information stored in the duplicate storage device The substrate processing apparatus according to any one of claims 1 to 4, characterized in that return to the changed category original category by the.   The substrate processing apparatus according to claim 1, wherein the parameter changing apparatus includes a user interface that allows a user to change the parameter.   The substrate processing apparatus according to claim 1, wherein the parameter specified by the category change definition device is changeable. A parameter management method for a substrate processing apparatus, comprising: a storage device that stores parameters classified into a plurality of categories; and a control device that performs processing on a substrate based on the parameters,
A category change defining step for specifying a parameter for changing the category of the parameters;
A parameter category changing step for changing the category of the parameter specified by the category change defining step;
A parameter management method for a substrate processing apparatus, comprising: a parameter changing step that allows the parameter to be changed according to the parameter category.   The parameter changing step makes it possible to change a parameter of a predetermined category of the plurality of categories, and the parameter category changing step changes a category of parameters other than the predetermined category to the predetermined category. 11. The parameter management method for a substrate processing apparatus according to claim 10.   11. The substrate processing according to claim 9, wherein the parameter category changing step returns the changed category to the original category when the substrate processing apparatus is restarted after the category is changed. Device parameter management method.   10. The parameter category change prohibiting step of prohibiting the change of the category by the parameter category changing step after the parameter category changing step changes the category of the parameter designated by the category change defining step. The parameter management method of the substrate processing apparatus of any one of thru | or 11.   The storage device stores parameter information indicating the parameter and category information indicating a category corresponding to each of the parameters of the plurality of categories, and the parameter category changing step includes the parameter stored in the storage device. Information and the category information are duplicated and stored in a duplicate storage device included in the substrate processing apparatus, parameter information corresponding to the parameter specified by the category change definition step is searched from the duplicated parameter information, and the duplicate The category information corresponding to the retrieved parameter information is changed among the retrieved category information so that the parameter can be changed, and the information stored in the duplicate storage device when the substrate processing apparatus is restarted By deleting the changed category to the original category Parameter management method for a substrate processing apparatus according to any one of claims 9 to 12, characterized in that return to.   The storage device stores parameter information indicating the parameter and category information indicating a category corresponding to each of the parameters of the plurality of categories, and the parameter category changing step includes the parameter stored in the storage device. The information and the category information are duplicated and stored in a duplicate storage device included in the substrate processing apparatus, and parameter information corresponding to the parameter specified by the category change definition step is retrieved from the parameter information stored in the storage device. The category information corresponding to the retrieved parameter information among the category information stored in the storage device is changed so that the parameter can be changed, and the substrate processing apparatus is restarted when the substrate processing apparatus is restarted. The stored information is replaced with the information stored in the duplicate storage device. Parameter management method for a substrate processing apparatus according to any one of claims 9 to 12, characterized in that return to the modified original category category by sake.   15. The parameter management method for a substrate processing apparatus according to claim 9, wherein in the parameter changing step, the parameter can be changed via a user interface provided in the substrate processing apparatus.   16. The parameter management method for a substrate processing apparatus according to claim 9, wherein the parameter specified by the category change definition step is changeable. A program for causing a computer to execute a parameter management method for a substrate processing apparatus, comprising: a storage device that stores parameters classified into a plurality of categories; and a control device that performs processing on a substrate based on the parameters. ,
A category change definition module for specifying a parameter for changing the category of the parameters;
A parameter category change module that changes a category of parameters specified by the category change definition module;
And a parameter changing module that allows the parameter to be changed in accordance with the parameter category. A program for causing a computer to execute a parameter management method of a substrate processing apparatus, comprising: a storage device that stores parameters classified into a plurality of categories; and a control device that performs processing on the substrate based on the parameters. A storage medium,
The program includes a category change definition module for specifying a parameter for changing a category of the parameters, a parameter category change module for changing a category of a parameter specified by the category change definition module, and a category of the parameter A storage medium comprising: a parameter changing module that enables the parameter to be changed. A parameter management system for a substrate processing apparatus, comprising: a storage device that stores parameters classified into a plurality of categories; and a control device that performs processing on the substrate based on the parameters,
A category change definition device that is detachable from the substrate processing apparatus and that specifies a parameter for changing a category of the parameter;
The substrate processing apparatus includes: a parameter changing device that can change the parameter according to the parameter category; and a parameter category changing device that changes a parameter category specified by the category change defining device. A parameter management system for substrate processing equipment. A substrate processing apparatus for processing a substrate,
A storage device that stores parameters for controlling the processing, which are classified into a plurality of categories;
A control device that performs the process on the substrate based on the parameters;
A parameter changing device capable of changing the parameter according to the parameter category;
A parameter category changing device for changing the category of the parameter;
A substrate processing apparatus comprising: a category returning device that returns a category changed by the parameter category changing device to an original category when the substrate processing device is restarted.

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