JP2007227526A - Electronic circuit unit, and relay terminal for electronic circuit unit - Google Patents

Electronic circuit unit, and relay terminal for electronic circuit unit Download PDF

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JP2007227526A
JP2007227526A JP2006045246A JP2006045246A JP2007227526A JP 2007227526 A JP2007227526 A JP 2007227526A JP 2006045246 A JP2006045246 A JP 2006045246A JP 2006045246 A JP2006045246 A JP 2006045246A JP 2007227526 A JP2007227526 A JP 2007227526A
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plate portion
lead wire
relay terminal
circuit board
plate
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JP4591381B2 (en
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Soukai Harada
創介 原田
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Mahle Electric Drive Systems Co Ltd
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Kokusan Denki Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit unit where soldering of lead wires for connecting a relay terminal connected to a circuit board and the circuit board to an outer circuit can easily and securely be performed. <P>SOLUTION: The relay terminal 11 is arranged which integrally has a substrate 11a, an erected plate 11b erected from one end of the substrate 11a, an inclined plate 11c extending in a direction inclined to the erected plate from an end opposite to the substrate in the erected plate, a lead wire holding plate 11d extending in a direction making an angle with respect to the inclined plate from an end opposite to the erected plate in the inclined plate 11c, and an end plate 11e extending in a direction making the angle with respect to the lead wire holding plate 11d. The substrate 11a of the relay terminal is soldered to a land of the circuit board 10. A male connector 14 connected to a core wire of the lead line 13 is engaged with a through-hole 11f of the lead wire holding plate of the relay terminal in terms of snapping, and the connector 14 is soldered to a periphery of the through-hole 11f. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、所定の回路を構成するために必要な電子部品を回路基板に実装してなる電子回路ユニット及び該電子回路ユニットに用いるのに適した中継端子に関するものである。   The present invention relates to an electronic circuit unit in which electronic components necessary for constituting a predetermined circuit are mounted on a circuit board, and a relay terminal suitable for use in the electronic circuit unit.

所定の回路を構成するために必要な電子部品が回路基板に実装された電子回路ユニットにおいて、回路基板をリード線を通して外部回路に接続する場合には、回路基板に設けられたランドに中継端子を面実装して、該中継端子にリード線を半田付けすることが行われている。回路基板を外部回路に接続するリード線が複数本設けられる場合には、該複数本のリード線がまとめられてワイヤーハーネスとして外部に引き出される。   In an electronic circuit unit in which electronic components necessary for constituting a predetermined circuit are mounted on a circuit board, when connecting the circuit board to an external circuit through a lead wire, a relay terminal is connected to a land provided on the circuit board. Surface mounting is performed, and a lead wire is soldered to the relay terminal. When a plurality of lead wires for connecting the circuit board to an external circuit are provided, the plurality of lead wires are collected and pulled out as a wire harness.

この種の電子回路ユニットに用いる中継端子として、非特許文献1に示されているように、導電板をZ字形に成形したものがある。図5は、非特許文献1に示された中継端子1を示したもので、この中継端子は、平板状の基板部1aと、基板部1aの一端から斜めに立ち上がった傾斜板部1bと、傾斜板部1bの基板部と反対側の端部から折り返されて基板部1aと平行に伸びる端板部1cとを一体に有していて、基板部1aが回路基板2に設けられたランド3に半田4により接合されて面実装される。中継端子を回路基板に実装する際には、中継端子の端板部1cの外面を被吸着面として用いて、この被吸着面を部品マウンタの真空吸着具により吸着することにより中継端子を保持して所定のランドの位置まで搬送する。   As a relay terminal used in this type of electronic circuit unit, there is one in which a conductive plate is formed in a Z shape as shown in Non-Patent Document 1. FIG. 5 shows the relay terminal 1 shown in Non-Patent Document 1. The relay terminal includes a flat board portion 1a, and an inclined plate portion 1b rising obliquely from one end of the substrate portion 1a. A land 3 having an end plate portion 1c that is folded back from an end opposite to the substrate portion of the inclined plate portion 1b and extends in parallel with the substrate portion 1a, and the substrate portion 1a is provided on the circuit board 2. Are mounted by solder 4 and surface-mounted. When the relay terminal is mounted on the circuit board, the outer surface of the end plate portion 1c of the relay terminal is used as a sucked surface, and the sucked surface is sucked by the vacuum sucking tool of the component mounter to hold the relay terminal. Then transport it to a predetermined land position.

図8(A),(B)は、図5に示された中継端子を適用した電子回路ユニットの一例を示したもので、同図において、5は多数の電子部品6が面実装された回路基板である。図示の例では、回路基板5から複数のリード線7,7,…を引き出すため、回路基板の一端に並べて形成された複数のランドにそれぞれ中継端子1,1,…の基板部1a,1a,…が半田付けされ、これらの中継端子の端板部1c,1c,…にリード線7,7,…の心線7a,7a,…がそれぞれ半田付けされている。   8A and 8B show an example of an electronic circuit unit to which the relay terminal shown in FIG. 5 is applied. In FIG. 8, 5 is a circuit in which a large number of electronic components 6 are surface-mounted. It is a substrate. In the illustrated example, in order to draw out the plurality of lead wires 7, 7,... From the circuit board 5, the board portions 1a, 1a,. Are soldered, and the core wires 7a, 7a, ... of the lead wires 7, 7, ... are soldered to the end plate portions 1c, 1c, ... of these relay terminals.

図5に示されたように、Z字形に成形された中継端子は、変形させることが可能であり、周囲の部品配置の状況に応じて中継端子の高さを適宜に変更することができるため、同じ寸法の中継端子を種々の部品配置を有する回路基板に使用することができる。従って、このような中継端子を用いれば、種々の部品配置を有する電子回路ユニットに対して中継端子の標準化を図って、コストの低減を図ることができる。
発明協会公開技報(公技番号2005−500550)
As shown in FIG. 5, the relay terminal formed in a Z shape can be deformed, and the height of the relay terminal can be appropriately changed according to the situation of the surrounding component arrangement. The relay terminals having the same dimensions can be used for circuit boards having various component arrangements. Therefore, if such a relay terminal is used, it is possible to standardize the relay terminal for an electronic circuit unit having various component arrangements, thereby reducing costs.
Japan Society for Invention and Innovation Technical Report (Public Technical Number 2005-500550)

図5に示した中継端子は、リード線7の心線7aをその端板部1cに半田付けする際に、心線7aを位置決めして仮固定するための手段を備えていないため、リード線を接続する際には、各リード線の心線を位置決めする作業を手作業で行う必要があり、作業能率が悪かった。またリード線の位置決めを手作業で行いながら半田付けを行うと、作業者の熟練度により、リード線の半田付け部の品質にばらつきが生じ易いため、信頼性に不安があった。   The relay terminal shown in FIG. 5 does not include means for positioning and temporarily fixing the core wire 7a when soldering the core wire 7a of the lead wire 7 to the end plate portion 1c. When connecting the cables, it was necessary to manually perform the work of positioning the lead wires of each lead wire, and the work efficiency was poor. Further, when soldering is performed while positioning the lead wire manually, the quality of the soldered portion of the lead wire is likely to vary depending on the skill level of the operator, so there is a concern about reliability.

なおリード線の心線の半田付けを容易にするために、中継端子の端板にリード線の心線を挿入して位置決めする孔を設けておくことも考えられるが、中継端子の端板部に孔を設けると、該中継端子を回路基板に面実装する際に、部品マウンタの吸着具により中継端子を吸着して保持することができなくなる。従って、中継端子の端板部にリード線を挿入するための孔を設けることはできない。   In order to facilitate the soldering of the lead wires, it is conceivable to provide holes for inserting and positioning the lead wires into the end plate of the relay terminal. When a hole is provided in the relay terminal, the relay terminal cannot be sucked and held by the suction tool of the component mounter when the relay terminal is surface-mounted on the circuit board. Therefore, a hole for inserting a lead wire cannot be provided in the end plate portion of the relay terminal.

また図5に示された従来の中継端子は、比較的変形が容易であるため、リード線に外力が作用した場合に中継端子とランドとの接合部に生じる応力を緩和する機能を有するが、その応力緩和機能は期待したほどではなく、図6に示すように、リード線7に引っ張り力Fが作用したときに、中継端子とランドとの接合部がはく離するおそれがあることが明らかになった。また中継端子7を他の電子部品とともに樹脂でモールドした場合には、電子部品の発熱及び冷却に伴って生じるモールド樹脂の膨張収縮により、図7に示すように、中継端子7にその高さ方向の力F′が作用したときにも、中継端子とランドとの接合部がはく離するおそれがあった。   The conventional relay terminal shown in FIG. 5 has a function of relieving stress generated at the junction between the relay terminal and the land when an external force is applied to the lead wire because it is relatively easily deformed. As shown in FIG. 6, the stress relaxation function is not as expected, and it becomes clear that when the pulling force F acts on the lead wire 7, the junction between the relay terminal and the land may peel off. It was. Further, when the relay terminal 7 is molded with resin together with other electronic components, the height direction of the relay terminal 7 is increased as shown in FIG. 7 due to expansion and contraction of the mold resin caused by heat generation and cooling of the electronic component. Even when the force F ′ is applied, the junction between the relay terminal and the land may be peeled off.

本発明の目的は、電子部品とともに回路基板に実装された中継端子にリード線が半田付けされて、該リード線を通して回路基板が外部回路に接続される電子回路ユニットにおいて、中継端子へのリード線の接続を容易かつ確実に行わせること、及び中継端子に外力が作用した際に、該中継端子とランドとの接合部がはく離するおそれを少なくして、リード線引出部の信頼性を高めることにある。   An object of the present invention is to provide a lead wire to a relay terminal in an electronic circuit unit in which a lead wire is soldered to a relay terminal mounted on a circuit board together with an electronic component, and the circuit board is connected to an external circuit through the lead wire. The connection of the relay terminal and the land is less likely to peel off when an external force is applied to the relay terminal, and the reliability of the lead wire lead-out portion is improved. It is in.

本発明は、所定の回路を構成するために必要な電子部品が実装された回路基板と、回路基板に面実装された中継端子とを備え、回路基板を外部回路に接続するためのリード線が中継端子に半田付けされている電子回路ユニットを対象とする。   The present invention includes a circuit board on which electronic components necessary for constituting a predetermined circuit are mounted, and a relay terminal surface-mounted on the circuit board, and a lead wire for connecting the circuit board to an external circuit is provided. The target is an electronic circuit unit soldered to a relay terminal.

本発明においては、上記中継端子が、折り曲げが可能で弾力性を有する導電性の板材を折り曲げ加工したものからなっていて、回路基板のランドに半田付けされた基板部と、基板部の一端から起立した起立板部と、起立板部の基板部と反対側の端部から起立板部に対して傾斜した方向に伸びていて起立板部との間に形成された内角が鈍角をなす傾斜板部と、傾斜板部の起立板部と反対側の端部から傾斜板部に対して角度をなす方向に伸びるリード線保持板部と、リード線保持板部の傾斜板部と反対側の端部からリード線保持板部に対して角度をなす方向に伸びていて、板面が傾斜板部の板面に斜めに対向する平板状の端板部とを一体に有している。   In the present invention, the relay terminal is formed by bending a conductive plate material that can be bent and has elasticity, and includes a board portion soldered to a land of a circuit board, and one end of the board portion. Inclined plate that has an obtuse angle formed between the standing upright plate portion and the upright plate portion extending from the end of the upright plate portion opposite to the substrate portion in a direction inclined with respect to the upright plate portion. A lead wire holding plate portion extending in an angle with respect to the inclined plate portion from an end portion of the inclined plate portion opposite to the standing plate portion, and an end of the lead wire holding plate portion opposite to the inclined plate portion A plate-like end plate portion that extends in a direction that forms an angle with respect to the lead wire holding plate portion from the portion and that has a plate surface that obliquely opposes the plate surface of the inclined plate portion.

また上記中継端子のリード線保持板部を厚み方向に貫通して貫通孔が形成され、傾斜板部の一部が切り起こされて先端がリード線保持板部側を向いたリード状の爪部が形成されるとともに、該爪部が切り起こされた後にリード線挿入孔が形成されている。そして、リード線の心線に接続された雄形のコネクタが中継端子の貫通孔に圧入されるか、または弾撥的に嵌合されて、該コネクタが上記貫通孔の周辺部に半田付けされている。   Also, a lead-like claw portion in which a through hole is formed through the lead wire holding plate portion of the relay terminal in the thickness direction, a part of the inclined plate portion is cut and raised, and the tip faces the lead wire holding plate portion side. The lead wire insertion hole is formed after the claw portion is cut and raised. Then, the male connector connected to the lead wire core wire is press-fitted into the through hole of the relay terminal, or is repelledly fitted, and the connector is soldered to the periphery of the through hole. ing.

上記のように構成すると、中継端子の基板部と端板部との間に、起立部と傾斜部との間の曲げ部と、傾斜部とリード線保持板部との間の曲げ部との2個所の曲げ部が存在するため、中継端子を変形し易くすることができる。そのため、中継端子に外力が作用した際に中継端子と回路基板のランドとの接合部に生じる応力を、従来の中継端子を用いた場合よりも更に小さく抑えることができ、リード線に張力が作用した場合や、中継端子をモールドする樹脂モールド部が膨張収縮した場合に中継端子が回路基板のランドからはく離するおそれを少なくすることができる。   If comprised as mentioned above, between the board | substrate part and end plate part of a relay terminal, the bending part between an upright part and an inclination part, and the bending part between an inclination part and a lead wire holding | maintenance board part. Since there are two bent portions, the relay terminal can be easily deformed. Therefore, the stress generated at the junction between the relay terminal and the land of the circuit board when an external force is applied to the relay terminal can be further reduced compared to the case where the conventional relay terminal is used, and the tension acts on the lead wire. In this case, or when the resin mold part for molding the relay terminal expands and contracts, the possibility that the relay terminal peels from the land of the circuit board can be reduced.

また上記のように、リード線の心線に雄形のコネクタを接続しておいて、該コネクタを中継端子のリード線保持板部の貫通孔に圧入するかまたは該貫通孔に弾撥的に嵌合させた状態で、該コネクタをリード線保持板部に半田付けするようにすると、半田付けすべき個所を固定した状態で半田付け作業を行うことができるため、作業者の熟練度に頼ることなく、リード線を中継端子に接続するための半田付け作業を容易かつ確実に行わせることができる。   As described above, a male connector is connected to the lead wire core, and the connector is press-fitted into the through hole of the lead wire holding plate portion of the relay terminal, or elastically repelled into the through hole. If the connector is soldered to the lead wire holding plate part in the fitted state, the soldering operation can be performed in a state where the portion to be soldered is fixed, so it depends on the skill level of the operator. Therefore, the soldering operation for connecting the lead wire to the relay terminal can be performed easily and reliably.

上記の構成では、リード線の心線にコネクタを接続しておいて、このコネクタを中継端子のリード線保持板部の貫通孔に圧入または弾撥的に嵌合させて、コネクタをリード線保持板部に半田付けるようにしたが、リード線の心線を直接中継端子に半田付けするように構成することもできる。この場合には、リード線の心線の先端部を、前記中継端子の外側から貫通孔を通して、リード線挿入孔内に挿入するとともに、爪部の先端をリード線の心線に係合させて保持させ、リード線の心線の中継端子の外側に位置する部分を端板部の外面に添わせて配置して該端板部に半田付けする。   In the above configuration, a connector is connected to the core of the lead wire, and the connector is press-fitted or elastically fitted into the through hole of the lead wire holding plate portion of the relay terminal to hold the connector in the lead wire. Although it was made to solder to a board part, it can also comprise so that the core wire of a lead wire may be soldered directly to a relay terminal. In this case, the tip of the lead wire core is inserted into the lead wire insertion hole from the outside of the relay terminal through the through hole, and the tip of the claw is engaged with the lead wire core. A portion of the lead wire core wire located outside the relay terminal is placed along the outer surface of the end plate portion and soldered to the end plate portion.

上記のように、リード線の心線の先端部を、中継端子の外側から貫通孔を通して、リード線挿入孔内に挿入して爪部の先端をリード線の心線に係合させると、リード線の心線を中継端子に仮固定することができるため、リード線の心線を中継端子の端板部に半田付けする作業を容易にすることができる。   As described above, when the tip of the lead wire core is inserted into the lead wire insertion hole through the through hole from the outside of the relay terminal and the tip of the claw is engaged with the lead wire core lead, Since the core of the wire can be temporarily fixed to the relay terminal, the work of soldering the core of the lead wire to the end plate portion of the relay terminal can be facilitated.

本発明はまた、所定の回路を構成するために必要な電子部品が実装された回路基板にリード線を接続するために回路基板に面実装される電子回路ユニット用中継端子に適用される。   The present invention is also applied to a relay terminal for an electronic circuit unit that is surface-mounted on a circuit board in order to connect a lead wire to the circuit board on which electronic components necessary for constituting a predetermined circuit are mounted.

本発明に係わる中継端子は、折り曲げが可能で弾力性を有する導電性の板材を折り曲げ加工したものからなっていて、回路基板に設けられたランドに半田付けされる基板部と、該基板部の一端から直角に起立した起立板部と、起立板部の基板部と反対側の端部から起立板部に対して傾斜した方向に伸びていて起立板部との間に形成された内角が鈍角をなす傾斜板部と、傾斜板部の起立板部と反対側の端部から基板部の板面に対して直角な方向に伸びていて傾斜板部との間に形成される内角が鈍角をなすリード線保持板部と、リード線保持板部の傾斜板部と反対側の端部からリード線保持板部に対して直角な方向に伸びていて、板面が傾斜板部の板面に斜めに対向する平板状の端板部とを一体に有している。そして、リード線保持板部を厚み方向に貫通して貫通孔が形成され、傾斜板部の一部が切り起こされて先端がリード線保持板部側を向いたリード状の爪部が形成されるとともに、該爪部が切り起こされた後にリード線挿入孔が形成されている。   The relay terminal according to the present invention is formed by bending a conductive plate material that can be bent and has elasticity, and includes a board portion soldered to a land provided on a circuit board, An internal angle formed between the upright plate portion that stands upright from one end and the upright plate portion that extends from the opposite end of the upright plate portion to the upright plate portion in an inclined direction with respect to the upright plate portion. The inner angle formed between the inclined plate portion and the inclined plate portion extending in a direction perpendicular to the plate surface of the substrate portion from the opposite end portion of the inclined plate portion to the upright plate portion is an obtuse angle. The lead wire holding plate portion and the end of the lead wire holding plate portion opposite to the inclined plate portion extend in a direction perpendicular to the lead wire holding plate portion, and the plate surface is the plate surface of the inclined plate portion. It integrally has a flat plate-like end plate portion that faces diagonally. A through hole is formed through the lead wire holding plate portion in the thickness direction, a part of the inclined plate portion is cut and raised, and a lead-like claw portion with the tip facing the lead wire holding plate portion side is formed. In addition, a lead wire insertion hole is formed after the claw portion is cut and raised.

中継端子を上記のように構成すると、外力を受けたときに容易に変形して応力を緩和するため、回路基板のランドとの接合部がはく離するのを防ぐことができ、リード線の接続部の信頼性を高めることができる。また上記のように中継端子を構成すると、リード線の心線に接続されたコネクタをリード線保持板部の貫通孔に圧入または弾撥的に嵌合させて保持させるか、またはリード線の心線をリード線保持板部の貫通孔と傾斜板部のリード線挿入孔とに挿入して、リード線の心線に爪部を係合させることにより、リード線の心線を中継端子に仮固定することができるため、リード線の心線と中継端子との半田付け作業を容易にすることができる。   When the relay terminal is configured as described above, it is easily deformed when subjected to an external force to relieve the stress, so that the junction with the land of the circuit board can be prevented from being peeled off, and the lead wire connecting portion Can improve the reliability. Further, when the relay terminal is configured as described above, the connector connected to the lead wire core wire is press-fitted or elastically fitted into the through hole of the lead wire holding plate portion and held, or the lead wire core is held. The lead wire core wire is temporarily connected to the relay terminal by inserting the wire into the lead hole holding plate portion through hole and the inclined plate portion lead wire insertion hole and engaging the claw portion with the lead wire core wire. Since it can fix, the soldering operation | work of the core wire of a lead wire and a relay terminal can be made easy.

以上のように、本発明によれば、回路基板を外部回路に接続するためのリード線を接続する中継端子として、回路基板のランドに半田付けされた基板部と、該基板部の一端から起立した起立板部と、この起立板部の前記基板部と反対側の端部から起立板部に対して傾斜した方向に伸びていて起立板部との間に形成された内角が鈍角をなす傾斜板部と、傾斜板部の起立板部と反対側の端部から傾斜板部に対して角度をなす方向に伸びるリード線保持板部と、リード線保持板部の傾斜板部と反対側の端部からリード線保持板部に対して角度をなす方向に伸びていて、板面が傾斜板部の板面に斜めに対向する平板状の端板部とを一体に有するものを用い、リード線の心線に接続されたコネクタを中継端子のリード線保持板部の貫通孔に圧入または弾撥的に嵌合させて保持させた状態でコネクタをリード線保持板部に半田付けするか、またはリード線の心線をリード線保持板部の貫通孔と傾斜板部のリード線挿入孔とに挿入するとともに爪部をリード線の心線に係合させることにより、リード線の心線を中継端子に仮固定した状態でリード線の心線を中継端子の単板部に半田付けするようにしたので、リード線と中継端子とを接続するための半田付け作業を容易かつ確実に行わせて、リード線引出し部の信頼性を高めることができる。   As described above, according to the present invention, as a relay terminal for connecting a lead wire for connecting a circuit board to an external circuit, the board part soldered to the land of the circuit board and the one end of the board part are raised. The inner angle formed between the standing plate portion and the standing plate portion extending in an inclined direction with respect to the standing plate portion from the opposite end portion of the standing plate portion to the substrate portion is an obtuse angle. A plate portion, a lead wire holding plate portion extending in an angle with respect to the inclined plate portion from an end portion on the opposite side of the standing plate portion of the inclined plate portion, and an opposite side of the inclined plate portion of the lead wire holding plate portion Use a lead that extends from the end in a direction that forms an angle with respect to the lead wire holding plate, and that has a flat plate-like end plate that is diagonally opposed to the plate surface of the inclined plate. Press the connector connected to the core of the wire into the through hole in the lead wire holding plate of the relay terminal or The connector is soldered to the lead wire holding plate in a state of being fitted and held, or the lead wire core wire is connected to the through hole of the lead wire holding plate and the lead wire insertion hole of the inclined plate. By inserting and engaging the claw part with the lead wire core wire, the lead wire core wire is soldered to the single plate portion of the relay terminal while the lead wire core wire is temporarily fixed to the relay terminal. As a result, the soldering operation for connecting the lead wire and the relay terminal can be performed easily and reliably, and the reliability of the lead wire lead-out portion can be improved.

本発明によれば、中継端子の基板部と端板部との間に、起立部と傾斜部との間の曲げ部と、傾斜部とリード線保持板部との間の曲げ部との2個所の曲げ部が存在するため、中継端子を変形し易くして、中継端子に外力が作用した際に中継端子と回路基板のランドとの接合部に生じる応力を、従来の中継端子を用いた場合よりも更に小さく抑えることができ、リード線に張力が作用した場合や、中継端子をモールドする樹脂モールド部が膨張収縮した場合に中継端子が回路基板のランドからはく離するおそれを少なくして、リード線引出部の信頼性を高めることができる。   According to the present invention, between the substrate portion and the end plate portion of the relay terminal, the bent portion between the standing portion and the inclined portion, and the bent portion between the inclined portion and the lead wire holding plate portion. Because there are bent parts, the relay terminal can be easily deformed, and the stress generated at the junction between the relay terminal and the land of the circuit board when an external force is applied to the relay terminal is used with the conventional relay terminal. When the tension acts on the lead wire, or when the resin mold part that molds the relay terminal expands and contracts, the possibility that the relay terminal peels from the land of the circuit board is reduced. The reliability of the lead wire lead portion can be increased.

以下図面を参照して本発明の好ましい実施形態を詳細に説明する。
図1(A)ないし(E)は本発明の一実施形態で用いる中継端子を回路基板の一部とともに示したもので、(A)は正面図、(B)は右側面図、(C)及び(D)はそれぞれ中継端子の平面図及び底面図、(E)は(B)のE−E線断面図である。
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
1A to 1E show a relay terminal used in an embodiment of the present invention together with a part of a circuit board. FIG. 1A is a front view, FIG. 1B is a right side view, and FIG. And (D) are a plan view and a bottom view of the relay terminal, respectively, and (E) is a sectional view taken along line EE of (B).

図1(A)ないし(E)において、10はヒートシンクを兼ねる回路基板で、この回路基板は、熱伝導性が良好な金属からなる金属基板10aと、金属基板10aの上に形成された絶縁層10bと、絶縁層10bの上に形成されたランド10cとを有している。   1A to 1E, reference numeral 10 denotes a circuit board that also serves as a heat sink. The circuit board includes a metal substrate 10a made of a metal having good thermal conductivity, and an insulating layer formed on the metal substrate 10a. 10b and a land 10c formed on the insulating layer 10b.

回路基板10には、所定の回路を構成する電子部品(図1には図示せず。)とともに中継端子11が面実装されている。中継端子11は、銅やアルミニウムなどの、折り曲げが可能で弾力性を有する導電性の材料からなるほぼ長方形の板材を折り曲げ加工したものからなっていて、回路基板10のランド10cに半田付けされた矩形状の基板部11aと、基板部11aの一端から直角に起立した起立板部11bと、起立板部11bの基板部11aと反対側の端部から起立板部11bに対して基板部11a側に傾斜した方向に伸びていて起立板部11aとの間に形成された内角αが鈍角をなす傾斜板部11cと、傾斜板部11cの起立板部11bと反対側の端部から傾斜板部11cに対して角度をなす方向(図示の例では基板部11aに対して直角な方向)に伸びていて傾斜板部11cとの間に形成される内角βが鈍角をなすリード線保持板部11dと、リード線保持板部11dの傾斜板部11cと反対側の端部からリード線保持板部11dに対して角度をなす方向(図示の例ではリード線保持板部11dに対して直角な方向)に伸びていて、板面が傾斜板部11cの板面に斜めに対向する平板状の端板部11eとを一体に有している。   A relay terminal 11 is surface-mounted on the circuit board 10 together with electronic components (not shown in FIG. 1) constituting a predetermined circuit. The relay terminal 11 is formed by bending a substantially rectangular plate made of a conductive material that can be bent and is elastic, such as copper or aluminum, and is soldered to the land 10c of the circuit board 10. The rectangular substrate portion 11a, the upright plate portion 11b that stands upright from one end of the substrate portion 11a, and the end portion of the upright plate portion 11b opposite to the substrate portion 11a from the upright plate portion 11b to the upright plate portion 11b side. An inclined plate portion 11c extending in a direction inclined to the upright plate portion 11a and having an obtuse angle α formed between the upright plate portion 11a and an inclined plate portion from the end of the inclined plate portion 11c opposite to the upright plate portion 11b. The lead wire holding plate portion 11d that extends in a direction that forms an angle with respect to 11c (in the illustrated example, a direction that is perpendicular to the substrate portion 11a) and that has an internal angle β formed between the inclined plate portion 11c and an obtuse angle. Lead wire The holding plate portion 11d extends from the end opposite to the inclined plate portion 11c in a direction forming an angle with respect to the lead wire holding plate portion 11d (in the illustrated example, a direction perpendicular to the lead wire holding plate portion 11d). Thus, the plate surface integrally has a flat end plate portion 11e that obliquely opposes the plate surface of the inclined plate portion 11c.

中継端子11のリード線保持板部11dには、該保持板部を厚み方向に貫通した貫通孔11fが形成されている。また、傾斜板部11cの一部が切り起こされることにより、先端がリード線保持板部11d側を向いたリード状の爪部11gが形成され、爪部11gが切り起こされた後にリード線挿入孔11h(図1B及び図1E参照)が形成されている。図示の例では、基板部11aの他端(起立板部11bと反対側の端部)の両端の角が落とされて面取り部11a1,11a1が形成され、端板部11eのリード線保持板部11dと反対側の端部の両端の角部が落とされて面取り部11e1,11e1が形成されている。また図示の例では、中継端子11の基板を貫通させて孔11iが形成されている。   The lead wire holding plate portion 11d of the relay terminal 11 is formed with a through hole 11f penetrating the holding plate portion in the thickness direction. Further, a part of the inclined plate portion 11c is cut and raised to form a lead-like claw portion 11g whose tip faces the lead wire holding plate portion 11d side, and the lead wire is inserted after the claw portion 11g is cut and raised. A hole 11h (see FIGS. 1B and 1E) is formed. In the illustrated example, the corners at both ends of the other end of the substrate portion 11a (the end opposite to the upright plate portion 11b) are dropped to form the chamfered portions 11a1 and 11a1, and the lead wire holding plate portion of the end plate portion 11e. The corners at both ends of the end opposite to 11d are dropped to form chamfered portions 11e1 and 11e1. In the illustrated example, a hole 11 i is formed by penetrating the substrate of the relay terminal 11.

図示の中継端子11においては、端板部11eの外面がマウンタの真空吸着具により吸着される被吸着面11e2となっている。中継端子11を回路基板に実装する際には、図示しないマウンタの真空吸着具により吸着面11e2を吸着することにより中継端子11を保持して回路基板に設けられた所定のランド10cの上に搬送し、基板部11aを半田12によりランド10cに半田付けする。   In the illustrated relay terminal 11, the outer surface of the end plate portion 11 e is an attracted surface 11 e 2 that is attracted by the vacuum suction tool of the mounter. When the relay terminal 11 is mounted on the circuit board, the suction surface 11e2 is sucked by a vacuum suction tool of a mounter (not shown) to hold the relay terminal 11 and transport it onto a predetermined land 10c provided on the circuit board. Then, the substrate portion 11 a is soldered to the land 10 c with the solder 12.

中継端子を含む被実装部品のランドへの半田付けは、適宜の方法、例えば、ランドの上にリフロー半田を介して被実装部品を載せた状態で回路基板を被実装部品と共に炉内に搬入することにより半田を溶融させて半田付けを行うリフロー半田法や、被実装部品を接着剤によりランドに仮固定した状態で回路基板をフロー半田槽に通すことにより半田付け部に半田を付着させて半田付けを行うフロー半田法により行う。   Soldering of the mounted component including the relay terminal to the land is performed by an appropriate method, for example, the circuit board is carried into the furnace together with the mounted component with the mounted component mounted on the land via reflow solder. Soldering by melting the solder by soldering and soldering the soldered part by passing the circuit board through the flow solder bath with the mounted component temporarily fixed to the land with adhesive. This is done by the flow soldering method.

図示の例のように、中継端子11の基板部11aに孔11iを設けておくと、半田12の一部が孔11iの内部に入り込むため、中継端子とランド10cとの接合強度を高めることができる。   If the hole 11i is provided in the board portion 11a of the relay terminal 11 as shown in the example, a part of the solder 12 enters the hole 11i, so that the bonding strength between the relay terminal and the land 10c can be increased. it can.

本実施形態では、中継端子11に接続するリード線13に、図2(A)に示されているような雄形のコネクタ14を接続しておく。図示の雄形コネクタは、管状部14aと、管状部14aの後端部に連続するように設けられて管状部14aから離れるに従って径が大きくなっていくように形成されたテーパ部14bと、テーパ部14bの最大径部側の端部に隣接するように設けられて、テーパ部14bの最大径部の外径よりも小さい外径を有するように形成された縊れ部14cと、縊れ部14cのテーパ部14bと反対側の端部に連続するように設けられて縊れ部14cよりも大きな径を有する筒状の頭部14dとを一体に備えている。中継端子11の軸心部には、リード線13の心線13aを挿入し得る孔14eが形成され、頭部14dの周壁部の一部が切り欠かれて1対の押さえ片14d1,14d1が形成されている。図示の中継端子14は、リード線13の心線13aの先端を孔14e内に受け入れ、リード線13の絶縁被覆13bを頭部14dの内側に受け入れた状態でリード線13の端部に結合されて、その管状部14aが心線13aに対して加締められることにより心線13aに接続されるとともに、1対の押さえ片14d1,14d1がリード線13の絶縁被覆を抱え込むように該絶縁被覆側に加締められることにより、リード線13に固定される。   In the present embodiment, a male connector 14 as shown in FIG. 2A is connected to the lead wire 13 connected to the relay terminal 11. The male connector shown in the figure includes a tubular portion 14a, a tapered portion 14b that is provided so as to be continuous with the rear end portion of the tubular portion 14a, and has a diameter that increases as the distance from the tubular portion 14a increases. A bend portion 14c provided to be adjacent to the end portion on the maximum diameter portion side of the portion 14b and formed to have an outer diameter smaller than the outer diameter of the maximum diameter portion of the taper portion 14b; A cylindrical head portion 14d that is provided so as to be continuous with an end portion on the opposite side to the tapered portion 14b of 14c and has a diameter larger than that of the rounded portion 14c is integrally provided. A hole 14e into which the core wire 13a of the lead wire 13 can be inserted is formed in the axial center portion of the relay terminal 11, and a part of the peripheral wall portion of the head portion 14d is cut away to form a pair of pressing pieces 14d1, 14d1. Is formed. The illustrated relay terminal 14 is coupled to the end of the lead wire 13 with the tip of the core wire 13a of the lead wire 13 received in the hole 14e and the insulation coating 13b of the lead wire 13 received inside the head portion 14d. The tubular portion 14a is connected to the core wire 13a by being crimped with respect to the core wire 13a, and the pair of pressing pieces 14d1, 14d1 holds the insulation coating of the lead wire 13 on the side of the insulation coating. Is fixed to the lead wire 13 by crimping.

図示のコネクタ14は、テーパ部14bの最大径部の外径が中継端子11の貫通孔11fの内径より僅かに大きく設定されるとともに、縊れ部14cの外径が貫通孔11fの内径にほぼ等しく設定されて、中継端子11の貫通孔11fに弾撥的に嵌合されて保持される。   In the illustrated connector 14, the outer diameter of the maximum diameter portion of the tapered portion 14b is set slightly larger than the inner diameter of the through hole 11f of the relay terminal 11, and the outer diameter of the bent portion 14c is substantially equal to the inner diameter of the through hole 11f. They are set to be equal and are elastically fitted and held in the through hole 11f of the relay terminal 11.

上記のようにしてコネクタ14を中継端子11に仮固定した状態で、コネクタ14と貫通孔11fとの嵌合部に溶融した半田15を供給することにより、コネクタ14を貫通孔11fの周辺部に半田付けしてリード線13を中継端子11に接続する。   In the state where the connector 14 is temporarily fixed to the relay terminal 11 as described above, the molten solder 15 is supplied to the fitting portion between the connector 14 and the through hole 11f, so that the connector 14 is placed around the through hole 11f. The lead wire 13 is connected to the relay terminal 11 by soldering.

このように、本実施形態では、リード線13の心線に接続されたコネクタ14を中継端子11のリード線保持板部11dの貫通孔11fに弾撥的に嵌合させて保持させた状態でコネクタ14をリード線保持板部11dに半田付けするので、半田付けすべき個所を固定した状態で半田付け作業を行うことができる。従って、半田付けを行う作業者の熟練度に頼ることなく、リード線を中継端子に接続するための半田付け作業を容易かつ確実に行わせることができる。   Thus, in this embodiment, in a state where the connector 14 connected to the core wire of the lead wire 13 is elastically fitted and held in the through hole 11f of the lead wire holding plate portion 11d of the relay terminal 11. Since the connector 14 is soldered to the lead wire holding plate portion 11d, the soldering operation can be performed in a state where the portion to be soldered is fixed. Therefore, the soldering operation for connecting the lead wire to the relay terminal can be easily and reliably performed without depending on the skill level of the worker performing the soldering.

また上記のように中継端子11を構成すると、中継端子11の基板部11aと端板部11eとの間に、起立部11bと傾斜部11cとの間の曲げ部R1と、傾斜部11cとリード線保持板部11dとの間の曲げ部R2との2個所の曲げ部が存在し、しかも傾斜板部11c及びリード線保持板部11dにはそれぞれリード線挿入孔11h及び貫通孔11fが形成されているため、中継端子11は、外力が作用したときに容易に変形して、応力を吸収する。そのため、中継端子11に外力が作用した際に中継端子と回路基板のランドとの接合部に生じる応力を、従来の中継端子を用いた場合よりも更に小さく抑えることができ、リード線11に張力が作用した場合や、中継端子をモールドする樹脂モールド部が膨張収縮した場合に中継端子14が回路基板10のランド10cからはく離するおそれを少なくすることができる。   When the relay terminal 11 is configured as described above, the bent portion R1 between the standing portion 11b and the inclined portion 11c, the inclined portion 11c, and the lead are provided between the substrate portion 11a and the end plate portion 11e of the relay terminal 11. There are two bent portions between the bent portion R2 and the wire holding plate portion 11d, and the inclined plate portion 11c and the lead wire holding plate portion 11d are respectively formed with a lead wire insertion hole 11h and a through hole 11f. Therefore, the relay terminal 11 is easily deformed and absorbs stress when an external force is applied. Therefore, the stress generated at the junction between the relay terminal and the land of the circuit board when an external force is applied to the relay terminal 11 can be further reduced as compared with the case where the conventional relay terminal is used. The possibility that the relay terminal 14 is peeled off from the land 10c of the circuit board 10 can be reduced in the case that the relay terminal 14 is expanded or contracted.

図2に示した例では、リード線13を回路基板10の板面と平行な方向に引き出しているが、中継端子11は容易に折り曲げることができるため、中継端子11にリード線13を接続した後に中継端子11を折り曲げることにより、例えば図2(B)に示すようにリード線の引出方向を変更することができる。図2(B)に示した例では、リード線13を回路基板10の板面に対して直角な方向に引き出している。   In the example shown in FIG. 2, the lead wire 13 is drawn out in a direction parallel to the plate surface of the circuit board 10. However, since the relay terminal 11 can be easily bent, the lead wire 13 is connected to the relay terminal 11. By bending the relay terminal 11 later, the lead-out direction of the lead wire can be changed as shown in FIG. 2B, for example. In the example shown in FIG. 2B, the lead wire 13 is drawn out in a direction perpendicular to the plate surface of the circuit board 10.

図2に示した例では、コネクタ14を中継端子11の貫通孔11fに弾撥的に嵌合させるようにしたが、コネクタ14を中継端子11の貫通孔11fに圧入することによりコネクタ14を中継端子11に仮固定するようにしてもよい。   In the example shown in FIG. 2, the connector 14 is elastically fitted into the through hole 11 f of the relay terminal 11. However, the connector 14 is relayed by press-fitting the connector 14 into the through hole 11 f of the relay terminal 11. It may be temporarily fixed to the terminal 11.

上記の実施形態では、リード線13にコネクタ14を接続して、コネクタ14を中継端子11に半田付けするようにしたが、リード線13の心線13aを直接中継端子11に半田付けするようにすることもできる。この場合には、図3に示すように、リード線13の心線13aの先端部が中継端子11の外側から貫通孔11fを通して、リード線挿入孔11h内に挿入されるとともに、爪部11gの先端がリード線13の心線13aに係合されることにより、リード線13が中継端子11に仮固定されている。そして、リード線の心線13aの中継端子11の外側に位置する部分が中継端子の端板部11eの外面に添わせた状態で配置されて該端板部11eに半田15により接続されている。この場合も、リード線13を中継端子に仮固定した状態で、半田付け作業を行うことができるため、作業者の熟練度に頼ることなく、リード線と中継端子との接続部の半田付け作業を容易かつ確実に行うことができる。   In the above embodiment, the connector 14 is connected to the lead wire 13 and the connector 14 is soldered to the relay terminal 11. However, the core wire 13a of the lead wire 13 is directly soldered to the relay terminal 11. You can also In this case, as shown in FIG. 3, the tip end portion of the core wire 13a of the lead wire 13 is inserted into the lead wire insertion hole 11h from the outside of the relay terminal 11 through the through hole 11f and the claw portion 11g. The lead wire 13 is temporarily fixed to the relay terminal 11 by engaging the tip with the core wire 13 a of the lead wire 13. A portion of the lead wire core 13a located outside the relay terminal 11 is disposed along the outer surface of the end plate portion 11e of the relay terminal and is connected to the end plate portion 11e by the solder 15. . Also in this case, since the soldering operation can be performed with the lead wire 13 temporarily fixed to the relay terminal, the soldering operation of the connecting portion between the lead wire and the relay terminal can be performed without depending on the skill level of the operator. Can be easily and reliably performed.

図3に示したように、リード線13の心線13aを中継端子11に直接半田付けする構成をとる場合には、心線13aを貫通孔11fを通してリード線挿入孔11hに挿入し易くするように、心線13aを図示のような形状に予め成形しておくのが好ましい。   As shown in FIG. 3, in the case where the core wire 13a of the lead wire 13 is directly soldered to the relay terminal 11, the core wire 13a is easily inserted into the lead wire insertion hole 11h through the through hole 11f. In addition, it is preferable that the core wire 13a is previously formed into a shape as shown in the drawing.

図3に示したように、リード線の心線を直接中継端子に接続するようにすると、コネクタを用いる必要がないため、コストの低減を図ることができる。   As shown in FIG. 3, when the lead wire core wire is directly connected to the relay terminal, it is not necessary to use a connector, so that the cost can be reduced.

図4は、本発明の係わる電子回路ユニット20の要部の構成の一例を示したもので、同図において16は回路基板10に面実装された電子部品であり、回路基板10に設けられた中継端子接続用の6個のランドに6個の中継端子11,11,…が半田付けされ、これらの中継端子に6本のリード線13,13,…が接続されて外部に引き出されている。電子部品16とともに中継端子11が実装された回路基板10は、図示しないケースに収容され、6本のリード線13,13,…は、該ケースに取りつけられたグロメット21を通して外部に導出されている。図示の例では、6本のリード線13,13,…のうちの2本のリード線13,13が絶縁チューブ22内に挿入されて第1のワイヤーハーネス23が構成され、他のリード線13,13,…が絶縁チューブ24内に挿入されて第2のワイヤーハーネス25が構成されている。第1のワイヤーハーネス23を構成するリード線13,13の端末部は個別のコネクタ26,26に接続され、第2のワイヤーハーネス25を構成する複数のリード線の端末部は共通のコネクタ27に接続されている。回路基板10が収容されたケース内には絶縁樹脂が注型されて、該樹脂により回路基板10と該回路基板に実装された部品とがモールドされている。   FIG. 4 shows an example of the configuration of the main part of the electronic circuit unit 20 according to the present invention. In FIG. 4, 16 is an electronic component surface-mounted on the circuit board 10 and provided on the circuit board 10. The six relay terminals 11, 11,... Are soldered to the six lands for connecting the relay terminals, and the six lead wires 13, 13,. . The circuit board 10 on which the relay terminal 11 is mounted together with the electronic component 16 is accommodated in a case (not shown), and the six lead wires 13, 13,... Are led out through grommets 21 attached to the case. . In the illustrated example, two of the six lead wires 13, 13,... Are inserted into the insulating tube 22 to form the first wire harness 23, and the other lead wires 13. , 13,... Are inserted into the insulating tube 24 to form the second wire harness 25. Terminal portions of the lead wires 13 and 13 constituting the first wire harness 23 are connected to individual connectors 26 and 26, and terminal portions of a plurality of lead wires constituting the second wire harness 25 are connected to a common connector 27. It is connected. Insulating resin is cast in the case in which the circuit board 10 is accommodated, and the circuit board 10 and components mounted on the circuit board are molded by the resin.

上記の実施形態では、回路基板として金属基板に絶縁被覆を施したものを用いたが、本発明で用いる回路基板は金属基板に限定されない。また上記の説明では、回路基板に電子部品を面実装するとしたが、本発明において回路基板への電子部品の実装方法は任意である。   In the above embodiment, a metal substrate with an insulating coating is used as a circuit board, but the circuit board used in the present invention is not limited to a metal substrate. In the above description, the electronic component is surface-mounted on the circuit board. However, in the present invention, the method of mounting the electronic component on the circuit board is arbitrary.

(A)ないし(E)は本発明の一実施形態で用いる中継端子を回路基板の一部とともに示したもので、(A)は正面図、(B)は右側面図、(C)及び(D)はそれぞれ中継端子の平面図及び底面図、(E)は(B)のE−E線断面図である。(A) thru | or (E) show the relay terminal used by one Embodiment of this invention with a part of circuit board, (A) is a front view, (B) is a right view, (C) and (C D) is a plan view and a bottom view of the relay terminal, respectively, and (E) is a cross-sectional view taken along line EE of (B). (A)は図1に示した中継端子にコネクタを介してリード線を接続した状態を示した正面図、(B)は(A)の状態から中継端子を折り曲げることにより、リード線の引出方向を変更した状態を示した正面図である。(A) is the front view which showed the state which connected the lead wire to the relay terminal shown in FIG. 1 via the connector, (B) is the lead-out direction of the lead wire by bending the relay terminal from the state of (A). It is the front view which showed the state which changed. 中継端子とリード線との接続の仕方の他の例を示した正面図である。It is the front view which showed the other example of the connection method of a relay terminal and a lead wire. (A)は本発明に係わる電子回路ユニットの構成例の要部を、一部簡略化して示した平面図である。(B)は(A)の要部の正面図である。(A) is the top view which simplified and showed a part of principal part of the structural example of the electronic circuit unit concerning this invention. (B) is a front view of the principal part of (A). 従来の電子回路ユニットで用いられていた中継端子を示した正面図である。It is the front view which showed the relay terminal used with the conventional electronic circuit unit. 図5の中継端子に接続されたリード線に張力が働いた状態を示した正面図である。FIG. 6 is a front view showing a state in which tension is applied to a lead wire connected to the relay terminal of FIG. 5. 図5の中継端子にモールド樹脂の膨張収縮に伴って生じる力が働いた状態を示した正面図である。It is the front view which showed the state which the force produced with the expansion / contraction of mold resin acted on the relay terminal of FIG. (A)及び(B)は図5に示した中継端子を用いた従来の電子回路ユニットの要部の平面図及び正面図である。(A) And (B) is the top view and front view of the principal part of the conventional electronic circuit unit using the relay terminal shown in FIG.

符号の説明Explanation of symbols

10 回路基板
10c 中継端子接続用ランド
11 中継端子
11a 基板部
11b 起立板部
11c 傾斜板部
11d リード線保持板部
11e 端板部
13 リード線
13a リード線の心線
14 コネクタ
DESCRIPTION OF SYMBOLS 10 Circuit board 10c Relay terminal connection land 11 Relay terminal 11a Substrate part 11b Standing plate part 11c Inclined plate part 11d Lead wire holding plate part 11e End plate part 13 Lead wire 13a Lead wire core wire 14 Connector

Claims (3)

所定の回路を構成するために必要な電子部品が実装された回路基板と、前記回路基板に面実装された中継端子とを備え、前記回路基板を外部回路に接続するためのリード線が前記中継端子に半田付けされている電子回路ユニットにおいて、
前記中継端子は、折り曲げが可能で弾力性を有する導電性の板材を折り曲げ加工したものからなっていて、前記回路基板のランドに半田付けされた基板部と、前記基板部の一端から起立した起立板部と、前記起立板部の前記基板部と反対側の端部から前記起立板部に対して傾斜した方向に伸びていて前記起立板部との間に形成された内角が鈍角をなす傾斜板部と、前記傾斜板部の前記起立板部と反対側の端部から前記傾斜板部に対して角度をなす方向に伸びるリード線保持板部と、前記リード線保持板部の前記傾斜板部と反対側の端部から前記リード線保持板部に対して角度をなす方向に伸びていて、板面が前記傾斜板部の板面に斜めに対向する平板状の端板部とを一体に有し、
前記中継端子の前記リード線保持板部を厚み方向に貫通して貫通孔が形成され、
前記傾斜板部の一部が切り起こされて先端が前記リード線保持板部側を向いたリード状の爪部が形成されるとともに、該爪部が切り起こされた後にリード線挿入孔が形成され、 前記リード線の心線に接続された雄形のコネクタが前記中継端子の貫通孔に圧入されるかまたは弾撥的に嵌合されて、前記貫通孔の周辺部に半田付けされていること、
を特徴とする電子回路ユニット。
A circuit board on which electronic components necessary for constituting a predetermined circuit are mounted; and a relay terminal surface-mounted on the circuit board. A lead wire for connecting the circuit board to an external circuit is the relay. In an electronic circuit unit soldered to a terminal,
The relay terminal is formed by bending a conductive plate material that can be bent and has elasticity. An inclination in which an internal angle formed between the plate portion and the upright plate portion extending from the end of the upright plate portion on the side opposite to the substrate portion in a direction inclined with respect to the upright plate portion forms an obtuse angle A plate portion, a lead wire holding plate portion extending in an angle with respect to the inclined plate portion from an end of the inclined plate portion opposite to the upright plate portion, and the inclined plate of the lead wire holding plate portion A flat plate-like end plate portion that extends in an angle with respect to the lead wire holding plate portion from the end opposite to the plate portion and that has a plate surface obliquely opposed to the plate surface of the inclined plate portion. Have
A through hole is formed through the lead wire holding plate portion of the relay terminal in the thickness direction,
A part of the inclined plate part is cut and raised to form a lead-like claw part whose tip faces the lead wire holding plate part side, and a lead wire insertion hole is formed after the claw part is cut and raised The male connector connected to the core wire of the lead wire is press-fitted into the through hole of the relay terminal or is elastically fitted and soldered to the periphery of the through hole thing,
Electronic circuit unit characterized by
所定の回路を構成するために必要な電子部品が実装された回路基板と、前記回路基板に面実装された中継端子とを備え、前記回路基板を外部回路に接続するためのリード線が前記中継端子に半田付けされている電子回路ユニットにおいて、
前記中継端子は、折り曲げが可能で弾力性を有する導電性の板材を折り曲げ加工したものからなっていて、前記回路基板のランドに半田付けされた基板部と、前記基板部の一端から起立した起立板部と、前記起立板部の前記基板部と反対側の端部から前記起立板部に対して傾斜した方向に伸びていて前記起立板部との間に形成された内角が鈍角をなす傾斜板部と、前記傾斜板部の前記起立板部と反対側の端部から前記傾斜板部に対して角度をなす方向に伸びるリード線保持板部と、前記リード線保持板部の前記傾斜板部と反対側の端部から前記リード線保持板部に対して角度をなす方向に伸びていて、板面が前記傾斜板部の板面に斜めに対向する平板状の端板部とを一体に有し、
前記中継端子の前記リード線保持板部を厚み方向に貫通して貫通孔が形成され、
前記傾斜板部の一部が切り起こされて先端が前記リード線保持板部側を向いたリード状の爪部が形成されるとともに、該爪部が切り起こされた後にリート線挿入孔が形成され、 前記リード線の心線の先端部が前記中継端子の外側から前記貫通孔を通して、前記リード線挿入孔内に挿入されるとともに、前記爪部の先端が前記リード線の心線に係合され、 前記リード線の心線の前記中継端子の外側に位置する部分が前記端板部の外面に添わせて配置されて該端板部に半田付けされていること、
を特徴とする電子回路ユニット。
A circuit board on which electronic components necessary for constituting a predetermined circuit are mounted; and a relay terminal surface-mounted on the circuit board. A lead wire for connecting the circuit board to an external circuit is the relay. In an electronic circuit unit soldered to a terminal,
The relay terminal is formed by bending a conductive plate material that can be bent and has elasticity. An inclination in which an internal angle formed between the plate portion and the upright plate portion extending from the end of the upright plate portion on the side opposite to the substrate portion in a direction inclined with respect to the upright plate portion forms an obtuse angle A plate portion, a lead wire holding plate portion extending in an angle with respect to the inclined plate portion from an end of the inclined plate portion opposite to the upright plate portion, and the inclined plate of the lead wire holding plate portion A flat plate-like end plate portion that extends in an angle with respect to the lead wire holding plate portion from the end portion on the opposite side to the plate portion, and whose plate surface obliquely faces the plate surface of the inclined plate portion. Have
A through hole is formed through the lead wire holding plate portion of the relay terminal in the thickness direction,
A part of the inclined plate part is cut and raised to form a lead-like claw part whose tip faces the lead wire holding plate part side, and a lead wire insertion hole is formed after the claw part is cut and raised The lead wire core end is inserted into the lead wire insertion hole from the outside of the relay terminal through the through hole, and the claw tip end engages with the lead wire core. A portion of the lead wire core wire located outside the relay terminal is disposed along the outer surface of the end plate portion and soldered to the end plate portion;
Electronic circuit unit characterized by
所定の回路を構成するために必要な電子部品が実装された回路基板にリード線を接続するために前記回路基板に面実装される電子回路ユニット用中継端子において、
折り曲げが可能で弾力性を有する導電性の板材を折り曲げ加工したものからなっていて、前記回路基板に設けられたランドに半田付けされる基板部と、前記基板部の一端から直角に起立した起立板部と、前記起立板部の前記基板部と反対側の端部から前記起立板部に対して傾斜した方向に伸びていて前記起立板部との間に形成された内角が鈍角をなす傾斜板部と、前記傾斜板部の前記起立板部と反対側の端部から前記基板部の板面に対して直角な方向に伸びていて前記傾斜板部との間に形成される内角が鈍角をなすリード線保持板部と、前記リード線保持板部の前記傾斜板部と反対側の端部から前記リード線保持板部に対して直角な方向に伸びていて、板面が前記傾斜板部の板面に斜めに対向する平板状の端板部とを一体に有し、
前記リード線保持板部を厚み方向に貫通して貫通孔が形成され、
前記傾斜板部の一部が切り起こされて先端が前記リード線保持板部側を向いたリード状の爪部が形成されるとともに、該爪部が切り起こされた後にリード線挿入孔が形成されていること、
を特徴とする電子回路ユニット用中継端子。
In an electronic circuit unit relay terminal that is surface-mounted on the circuit board in order to connect a lead wire to a circuit board on which electronic components necessary for constituting a predetermined circuit are mounted,
A board part soldered to a land provided on the circuit board and an upright standing upright from one end of the board part. An inclination in which an internal angle formed between the plate portion and the upright plate portion extending from the end of the upright plate portion on the side opposite to the substrate portion in a direction inclined with respect to the upright plate portion forms an obtuse angle An internal angle formed between the plate portion and the inclined plate portion extending in a direction perpendicular to the plate surface of the substrate portion from the end of the inclined plate portion opposite to the upright plate portion is an obtuse angle. A lead wire holding plate portion extending from the end of the lead wire holding plate portion opposite to the inclined plate portion in a direction perpendicular to the lead wire holding plate portion, and the plate surface is the inclined plate A plate-like end plate portion that diagonally opposes the plate surface of the portion,
A through hole is formed through the lead wire holding plate portion in the thickness direction,
A part of the inclined plate part is cut and raised to form a lead-like claw part whose tip faces the lead wire holding plate part side, and a lead wire insertion hole is formed after the claw part is cut and raised is being done,
A relay terminal for an electronic circuit unit.
JP2006045246A 2006-02-22 2006-02-22 Electronic circuit unit and relay terminal for electronic circuit unit Active JP4591381B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067785A (en) * 2012-09-25 2014-04-17 Auto Network Gijutsu Kenkyusho:Kk Electric apparatus including substrate and manufacturing method for the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6355373U (en) * 1986-09-30 1988-04-13
JPH0375697U (en) * 1989-11-27 1991-07-30
JP2000100540A (en) * 1998-09-22 2000-04-07 Idec Izumi Corp Electric component with lead wire and conductive metal fitting and its manufacture

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6355373U (en) * 1986-09-30 1988-04-13
JPH0375697U (en) * 1989-11-27 1991-07-30
JP2000100540A (en) * 1998-09-22 2000-04-07 Idec Izumi Corp Electric component with lead wire and conductive metal fitting and its manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067785A (en) * 2012-09-25 2014-04-17 Auto Network Gijutsu Kenkyusho:Kk Electric apparatus including substrate and manufacturing method for the same

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