JP5538019B2 - Connector unit and electronic circuit device - Google Patents

Description

  The present invention relates to a connector unit and an electronic circuit device including the connector unit.

Some conventional electronic circuit devices are provided with a connector unit for electrical connection with other devices on a mounting surface of a surface-mount substrate such as an aluminum substrate as disclosed in Patent Document 1, for example.
As shown in FIG. 8, the connector unit includes a plurality of connection terminal pins 102 that are erected on the mounting surface of the substrate 101, and insulating terminals that fix the connection terminal pins 102 at a predetermined pitch. It is comprised with the base 103. FIG. The terminal block 103 has a leg portion 104 extending to the mounting surface of the substrate 101 and is formed in a gate shape (arch shape), and a positioning hole drilled in the mounting surface of the substrate 101 at the tip of the leg portion 104. A positioning pin 106 press-fitted into 105 protrudes.

Japanese Utility Model Publication No. 4-133362

However, the formation of the positioning hole 105 for the surface-mount type substrate 101 is not preferable because it is difficult and expensive.
In addition, as another method of fixing the connector unit to the surface mount type substrate, for example, after joining the connection terminal pins to the substrate, the joint portion of the connection terminal pins and the mounting surface of the substrate by the sealing resin or the terminal block It is conceivable to bury a part. Although this configuration can be configured at a lower cost compared with the case where the positioning hole is formed in the substrate, the upper surface of the terminal block from which the connection terminal pin protrudes is sealed in order to inhibit the electrical connection between the other device and the connection terminal pin. It cannot be covered with resin. Therefore, when an external force that pulls the connector unit away from the board is applied to the electronic circuit device, stress is concentrated only on the joint portion between the connection terminal pin and the board. As a result, the reliability of electrical connection between the connection terminal pins and the substrate may be reduced.

  The present invention has been made in view of the above-described circumstances, and provides a connector unit capable of improving the reliability of electrical connection between a connection terminal pin and a substrate at a low cost, and an electronic circuit device including the connector unit. For the purpose.

In order to solve the above problems, a connector unit of the present invention includes a connection terminal pin and a terminal block having a plate-like support portion that is fixed in a state where the connection terminal pin is inserted in at least the thickness direction, and One end of the connection terminal pin protruding from one main surface of the support portion is joined to the mounting surface of the substrate by reflow processing in a mounted state, and a joint portion between the connection terminal pin and the mounting surface is embedded with a sealing resin . the connector unit of the structure, engaging on the one main surface of said supporting portion, projecting in a direction along the one main surface, the sealing resin by being embedded in the sealing resin An engaging portion is formed, and the support portion penetrates in the thickness direction with a space from the insertion portion of the connection terminal pin, and the connection is made from the other main surface side of the support portion during the reflow process. One end of the terminal pin Wherein the through holes to melt the solder through the hot air towards the solder previously provided to the joint portion between the serial board is formed.

And the electronic circuit device of the present invention includes the connector unit, a substrate having a mounting surface that joins one end of the connection terminal pin in a mounted state, a joint portion between the connection terminal pin and the mounting surface, and the And a sealing resin for embedding the engaging portion .

According to the connector unit described above, the connection terminal pin is joined to the board mounting surface by soldering or the like with one main surface of the support portion spaced from the board mounting surface by soldering or the like. Terminal pins can be electrically connected to the substrate. In this bonded state, the connecting terminal pin and the terminal block are fixed to the substrate via the sealing resin by embedding the bonding portion between the connecting terminal pin and the mounting surface of the substrate and the engaging portion with the sealing resin. Thus, the electronic circuit device is configured. In the state where the sealing resin is provided as described above, the engaging portion is engaged with the sealing resin. Here, since the engaging portion is formed close to one main surface side in the thickness direction of the support portion, the terminal block is sealed without covering the other main surface of the support portion with the sealing resin. It can be engaged with resin.

Since the engaging portion is engaged with the sealing resin as described above, when an external force that pulls the connector unit away from the board is applied to the electronic circuit device, only the joint portion between the connection terminal pin and the board is used. without terminal block it stressed in engagement portion between the engaging portion and the sealing resin, i.e., the stress applied to the joining portion of the connecting terminal pins and the substrate can be reduced. In particular, since the stress applied to the connection portion between the connection terminal pin and the substrate can be reduced without forming a hole for fixing the terminal block to the surface mount type substrate as in the prior art, the connection terminal pin and the substrate The reliability of the electrical connection can be improved at low cost.

In addition, when the above-described connection terminal pin and the mounting surface of the board are joined by reflow processing, hot air is applied from above the connector unit to the mounting surface, and this heat causes the one end of the connection terminal pin and the board to be connected. A solder paste provided in advance in the joint portion is melted to join the connection terminal pin and the substrate.
In this reflow process, by forming a through hole in the support portion as described above, even if one end of the connection terminal pin is arranged directly below the plate-like support portion, hot air is transmitted through the through hole. Therefore, the solder paste can be surely melted in a short time.

Therefore, even if one end of the connection terminal pin is not disposed so as to overlap the outer edge portion of one main surface of the support portion, for example, even if it is disposed immediately below the center portion of one main surface of the support portion, hot air is applied to the joint portion. It can be fully delivered. That is, even if it does not restrict | limit the attachment position of the connection terminal pin with respect to a support part, joining of a connection terminal pin and a board | substrate can be ensured.
In addition, in order to allow hot air to reach one end of the connection terminal pin during the reflow process, it is not necessary to project one end of the connection terminal pin to the side of the support portion, so the mounting area of the connector unit on the board is set small. You can also Therefore, it is possible to reduce the size of the electronic circuit device.

In the connector unit, it is preferable that the engaging portion is disposed on an inner side than an outer edge of one main surface of the support portion.
In this configuration, since the engaging portion does not protrude outward from the outer edge of one main surface, the terminal block and the connector unit can be configured in a compact manner. In particular, since the substantial mounting area of the connector unit with respect to the mounting surface of the board can be kept compact, the electronic circuit device can be downsized.
Further, in the connector unit, the through hole is formed in a rectangular shape in plan view, and the engaging portion is formed in a pair so as to protrude radially inward from only the short side of the rectangular shape on the inner peripheral surface of the through hole. it may be.
In this configuration, the engaging part does not protrude outward from the outer edge of one main surface, and also does not protrude in the thickness direction with respect to the support part, so the terminal block and the connector unit are configured more compactly. It becomes possible to do.

Further, in the connector unit, one end of the connection terminal pin is bent with respect to the longitudinal direction of the connection terminal pin, and is arranged so as to overlap the through hole and the thickness direction of the support portion. preferable.
In this configuration, since the hot air can be directly applied to one end of the connection terminal pin that becomes a joint portion with the substrate during the reflow process described above, the connection terminal pin and the substrate can be more efficiently and reliably joined. it can.

  Further, in the connector unit, one end of the connection terminal pin is bent with respect to the longitudinal direction of the connection terminal pin, and the one main surface extends along the one main surface of the support portion from the bent portion. It preferably extends towards the outer edge.

In this configuration, after joining one end of the connection terminal pin to the substrate, the joining state between the connection terminal pin and the substrate can be easily confirmed visually. For example, the contact state between one end of the connection terminal pin and the mounting surface of the substrate can be easily confirmed visually. In addition, the confirmation of the contact state is to confirm whether one end of the connection terminal pin is in surface contact with the mounting surface of the board or to confirm the degree of inclination of one end of the connection terminal pin with respect to the mounting surface. Show.
For example, when the connection terminal pin and the substrate are joined by reflow processing, the wettability of the solder with respect to one end of the connection terminal pin can be easily confirmed visually.
Further, when the connector unit includes a plurality of connection terminal pins, it is necessary to fix the plurality of connection terminal pins to the support portion with a space between each other, but one end of each connection terminal pin is connected to one of the support portions. By bend | folding so that it may extend toward the outer edge of a main surface, it also becomes possible to set the space | interval of adjacent connection terminal pins small.

  According to the present invention, it is possible to reduce the stress applied to the connection portion between the connection terminal pin and the substrate without forming a hole for fixing the terminal block to the surface-mount type substrate as in the prior art. The reliability of the electrical connection between the terminal pin and the substrate can be improved at a low cost.

1 is an exploded perspective view showing an outline of an electronic circuit device according to an embodiment of the present invention. It is a top view which shows the state which looked at the electronic circuit apparatus of FIG. 1 from the mounting surface side of the board | substrate. It is AA arrow sectional drawing of FIG. It is a BB arrow sectional view of Drawing 2. It is CC sectional view taken on the line of FIG. FIG. 6 is an enlarged cross-sectional view showing a flow of hot air in a reflow process when the electronic circuit device shown in FIGS. It is an expanded sectional view showing an important section of a connector unit concerning other embodiments of the present invention. It is a schematic perspective view which shows an example of the conventional connector unit and the board | substrate which mounts this.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 to 5, an electronic circuit device 1 according to this embodiment includes a shallow case 2 that opens in a thickness direction, a substrate 3 that is placed on a bottom surface 2 a in the case 2, and a substrate 3. And the connector unit 4 mounted on the mounting surface 3a. The electronic circuit device 1 also includes a sealing resin 5 that fills the case 2 and embeds the entire substrate 3 and a part of the connector unit 4.
Various electronic components (not shown) that define the circuit of the electronic circuit device 1 are also mounted on the mounting surface 3 a of the substrate 3. This electronic component is electrically connected to the connector unit 4 via the substrate 3 and is embedded by the sealing resin 5.

  The substrate 3 is a so-called surface mount type substrate such as an aluminum nitride substrate or a ceramic substrate. A plurality of bonding pads 11 for bonding the connector unit 4 and electronic components are formed on the mounting surface 3 a of the substrate 3. The bonding pad 11 forms a circuit pattern for electrically connecting the connector unit 4 and the electronic component to each other.

The connector unit 4 is for electrically connecting the circuit of the electronic circuit device 1 to another device, and includes a plurality of connection terminal pins 6 and a terminal block 7 for fixing the plurality of connection terminal pins 6 integrally. It is roughly structured.
Each connection terminal pin 6 is formed in a strip plate shape with a conductive material, and a pair of projections 15 projecting in the width direction are formed in the middle in the longitudinal direction. Further, one end 6 a in the longitudinal direction of the connection terminal pin 6 is formed to be narrower than the other part, and is bent substantially perpendicular to the longitudinal direction of the connection terminal pin 6.

The terminal block 7 is formed in a thick plate shape, and is fixed to the periphery of the support portion 21 that is fixed in a state where each connection terminal pin 6 is inserted in the thickness direction, and the upper surface (the other main surface) 21 a of the support portion 21. The annular peripheral wall portion 22 provided is formed integrally.
A plurality of insertion holes 24 and through holes 25 penetrating in the thickness direction are formed in the support portion 21 at intervals.

  Each insertion hole 24 is formed in an elongated rectangular shape in plan view in accordance with the shape of the connection terminal pin 6 so that the individual connection terminal pin 6 can be inserted. Each insertion hole 24 has a pair of steps in the middle in the longitudinal direction so that the upper surface 21a side portion of the support portion 21 in the longitudinal direction is narrower than the lower surface (one main surface) 21b side portion. have. That is, the step surface 24 b in the insertion hole 24 faces the lower surface 21 b side of the support portion 21. Furthermore, the upper surface 21a side portion of the insertion hole 24 is set to be equal to or slightly smaller than the size of the connection terminal pin 6 so that the connection terminal pin 6 can be inserted through this portion.

  Each of the connection terminal pins 6 described above is attached to the terminal block 7 by inserting the other end 6 b in the longitudinal direction thereof into the insertion hole 24 from the lower surface 21 b side of the support portion 21. At the time of attachment, the projection 15 of the connection terminal pin 6 contacts the stepped surface 24b in the insertion hole 24, so that the connection terminal pin 6 can be easily positioned with respect to the terminal block 7. For example, the protruding length of the other end 6b of the connection terminal pin 6 protruding from the upper surface 21a of the support portion 21 and the protruding length of the one end 6a of the connection terminal pin 6 protruding from the lower surface 21b of the support portion 21 are set with high accuracy. Can do.

In this attached state, the other end 6 b of the plurality of connection terminal pins 6 protruding from the upper surface 21 a of the support portion 21 is surrounded by the peripheral wall portion 22. Further, the protruding length of the other end 6 b of the connection terminal pin 6 is set to be lower than the height of the peripheral wall portion 22. The other end 6b of the connection terminal pin 6 attached in this way forms an external terminal portion for electrical connection with other devices. In the illustrated example, the other end 6b of the connection terminal pin 6 has a male shape so that it can be inserted into a female connector that is electrically connected to the other end 6b of the connection terminal pin 6 in preparation for another device. However, for example, it may have a female shape into which a male connector provided in another device is inserted.
And the surrounding wall part 22 plays the role which positions the connector with which another apparatus is equipped with respect to the connector unit 4. FIG.

  Further, when the connection terminal pins 6 are attached to the terminal block 7, one end 6 a of each connection terminal pin 6 extends from the above-described bent portion along the lower surface 21 b of the support portion 21 toward the outer edge of the lower surface 21 b. . In other words, one end 6a of each connection terminal pin 6 is separated from the connection terminal pins 6 adjacent to each other, or one end 6a of the adjacent connection terminal pins 6 is parallel to each other. It extends along. That is, one end 6a of each connection terminal pin 6 does not extend in a direction approaching the connection terminal pins 6 adjacent to each other. Further, one end 6 a of each connection terminal pin 6 is entirely opposed to the lower surface 21 b of the support portion 21, and does not protrude outward from the side portion of the terminal block 7.

On the inner peripheral surface of each through-hole 25, an engaging portion 27 is formed that protrudes inward in the radial direction. The engaging portion 27 is disposed at the lower end of the through hole 25 that opens to the lower surface 21 b side of the support portion 21 and is formed to be flush with the lower surface 21 b of the support portion 21.
The engagement portion 27 will be described in more detail. The three through holes 25A (first through holes 25A) arranged in a row are formed in a rectangular shape in plan view, and the engagement formed in the first through holes 25A. A pair of joint portions 27A is formed so as to protrude only from the short side of the rectangle.
On the other hand, the second through hole 25B formed separately from the first through hole 25A is formed in a square shape in plan view, and the engaging portion 27B formed in the second through hole 25B has the second through hole. It protrudes from the entire circumferential direction of the inner peripheral surface of 25B, and is formed in a rectangular ring shape in plan view.

The connector unit 4 configured as described above is mounted on the mounting surface 3a of the substrate 3 by joining one end 6a of each connection terminal pin 6 to each bonding pad 11A of the substrate 3 by soldering in a mounted state. ing. Thereby, each connection terminal pin 6 is electrically connected to the circuit pattern of the substrate 3. In this mounted state, the lower surface 21 b of the support portion 21 is disposed to face the mounting surface 3 a of the substrate 3.
In addition, an electronic component (not shown) mounted on the board 3 together with the connector unit 4 is joined to the mounting surface 3a of the board 3 in a mounted state in the same manner as in the connector unit 4, Electrical connection is made to the circuit pattern of the substrate 3.

  Furthermore, in a state where the board 3 on which the connector unit 4 is mounted is housed in the case 2, the peripheral wall portion 22 of the terminal block 7 and the other end 6 b of the connection terminal pin 6 protrude upward from the opening end 2 c of the case 2. That is, it is arranged outside the case 2. Further, the upper surface 21 a of the support portion 21 is disposed above the opening end 2 c of the case 2.

The sealing resin 5 filled in the case 2 is connected to the lower end 21 b side of the support portion 21 including the one end 6 a of the connection terminal pin 6 joined to the substrate 3 and the engagement portion 27 in the connector unit 4. The part is buried. Thereby, the connection terminal pin 6 and the terminal block 7 are fixed to the substrate 3 through the sealing resin 5. Further, the engaging portion 27 is engaged with the sealing resin 5. Here, since the engaging portion 27 is formed close to the lower surface 21b side portion of the support portion 21, the terminal block 7 is sealed with the sealing resin without covering the upper surface 21a of the support portion 21 with the sealing resin 5. 5 can be engaged.

In manufacturing the electronic circuit device 1 configured as described above, the connection between the one end 6a of the connection terminal pin 6 and the bonding pad 11A of the substrate 3 is performed by a reflow process.
In the reflow process, the connector unit is configured such that solder (not shown) is attached to the one end 6a of the connection terminal pin 6 or the bonding pad 11A in advance and the one end 6a of the connection terminal pin 6 is positioned on the bonding pad 11A. 4 is placed on the mounting surface 3 a of the substrate 3. Then, as shown in FIG. 6, hot air is blown from above the connector unit 4 toward the mounting surface 3 a of the board 3, and this heat melts the solder at the joint between the connection terminal pin 6 and the joint pad 11 </ b> A. Thus, the connection terminal pin 6 and the bonding pad 11A are bonded.

Here, since the through hole 25 is formed in the support portion 21, even if the one end 6 a of the connection terminal pin 6 is arranged directly below the support portion 21, the hot air described above is connected to the connection terminal pin through the through hole 25. 6 directly reaches the joint between the one end 6a of the joint 6 and the joint pad 11A. Therefore, the solder for joining can be reliably melted in a short time.
In this reflow process, an electronic component (not shown) mounted on the board 3 is also joined to the board 3 by melting the solder at the joint with the board 3 with hot air, as in the case of the connector unit 4. Is done. Here, since the electronic component has a sufficiently small size and thermal resistance as compared with the connector unit 4, even if the through hole 25 is not formed as in the connector unit 4, the solder is melted in a short time by the reflow process. be able to.

As described above, according to the connector unit 4 and the electronic circuit device 1 according to the present embodiment, the engaging portion 27 can be engaged with the sealing resin 5, so that the external force that pulls the connector unit 4 away from the substrate 3. Is applied to the electronic circuit device 1, stress is applied not only to the connection portion between the connection terminal pin 6 and the substrate 3 but also to the engagement portion 27 between the terminal block 7 and the sealing resin 5. In other words, the stress applied to the joint portion between the connection terminal pin 6 and the substrate 3 can be reduced. In particular, since the stress applied to the joint portion between the connection terminal pin 6 and the substrate 3 can be reduced without forming a hole for fixing the terminal block 7 to the surface mount type substrate 3 as in the prior art, The reliability of electrical connection between the connection terminal pin 6 and the substrate 3 can be improved at low cost.
In addition, since the upper surface 21a of the support portion 21 is located above the opening end 2c of the case 2, even if the case 2 is filled with the sealing resin 5, the upper surface 21a of the support portion 21 remains the sealing resin 5 Can be reliably prevented from being buried.

Furthermore, by forming the through hole 25 in the support portion 21, the one end 6a of the connection terminal pin 6 is not arranged so as to overlap the outer edge portion of the lower surface 21b of the support portion 21, but for example, the central portion of the lower surface 21b of the support portion 21 Even if it arrange | positions directly under this, a hot air can fully reach the junction part of the connection terminal pin 6 and the joining pad 11A in the reflow process. That is, even if it does not restrict | limit the attachment position of the connection terminal pin 6 with respect to the support part 21, joining of the connection terminal pin 6 and the bonding pad 11A can be ensured.
Further, in order to allow hot air to reach the one end 6 a of the connection terminal pin 6 during the reflow process, there is no need to project the one end 6 a of the connection terminal pin 6 to the side of the support portion 21. The mounting area of can also be set small. Therefore, the electronic circuit device 1 can be downsized.

Further, since the engaging portion 27 does not protrude outward from the outer edge of the lower surface 21b of the support portion 21 and does not protrude downward from the lower surface 21b of the support portion 21, the terminal block 7 and the connector unit 4 including the terminal block 7 are also provided. Can be configured compactly. In particular, the substantial mounting area of the connector unit 4 with respect to the mounting surface 3a of the board 3 can be reduced to a compact size. As a result, the electronic circuit device 1 can be further reduced in size.

Further, the one end 6 a of the connection terminal pin 6 extends toward the outer edge of the lower surface 21 b along the lower surface 21 b of the support portion 21, so that the connection terminal pin 6 is joined to the substrate 3 after the connection terminal pin 6 is joined to the substrate 3. It becomes possible to easily confirm the joining state between the substrate 6 and the substrate 3 visually. For example, the contact state between the one end 6 a of the connection terminal pin 6 and the mounting surface 3 a of the substrate 3 and the wettability of the solder with respect to the one end 6 a of the connection terminal pin 6 can be easily confirmed visually. The confirmation of the contact state means whether or not the one end 6a of the connection terminal pin 6 is in surface contact with the mounting surface 3a of the substrate 3, or the one end 6a of the connection terminal pin 6 with respect to the mounting surface 3a. This means checking the degree of inclination.
Furthermore, since one end 6a of each bent connection terminal pin 6 does not extend in a direction approaching the connection terminal pins 6 adjacent to each other, the interval between the adjacent connection terminal pins 6 can be set small.

Although the electronic circuit device 1 of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, the engaging portion 27 protruding from the inner peripheral surface of the through hole 25 is formed at the lower end of the through hole 25 that opens to the lower surface 21 b side of the support portion 21 so as to be flush with the lower surface 21 b of the support portion 21. However, what is necessary is just to engage with the sealing resin 5 in a range where at least the upper surface 21 a of the support portion 21 is not embedded by the sealing resin 5. Therefore, the engaging part 27 may be formed in the middle part of the through-hole 25 in the penetrating direction, for example.

Further, the engaging portion 27 is not limited to being formed on the inner peripheral surface of the through-hole 25, and may be formed so as to protrude in a direction along the lower surface 21 b at least on the lower surface 21 b side of the support portion 21. That is, for example, as shown in FIG. 7, the engaging portion 27 may protrude in the direction along the lower surface 21 b at the tip of the extending portion 28 that extends downward from the lower surface 21 b of the support portion 21. However, it is more preferable that the engaging portion 27 is arranged on the inner side of the outer edge of the lower surface 21b of the support portion 21. With this configuration, the engaging portion 27 is the support portion 21 as in the above embodiment. Therefore, the terminal block 7 and the connector unit 4 can be made compact. In particular, since the substantial mounting area of the connector unit 4 with respect to the mounting surface 3a of the substrate 3 can be suppressed in a compact manner, the electronic circuit device 1 can be downsized.

Furthermore, the one end 6 a of the connection terminal pin 6 may be arranged so as to overlap, for example, the through hole 25 and the support portion 21 in the thickness direction. In this configuration, since the hot air can be directly applied to the one end 6a of the connection terminal pin 6 that becomes a joint portion with the substrate 3 during the reflow process, the connection terminal pin 6 and the substrate 3 are more efficiently and reliably connected. It becomes possible to join.
Moreover, the connection terminal pin 6 is not limited to being formed in a strip plate shape, and may be, for example, a rod shape.

Furthermore, although the terminal block 7 is provided with the peripheral wall part 22 surrounding the other end 6 b of the connection terminal pin 6, it is sufficient that at least the support part 21 is provided.
In the above embodiment, the upper surface 21 a of the support portion 21 is disposed above the opening end 2 c of the case 2 in a state where the board 3 on which the connector unit 4 is mounted is accommodated in the case 2. For example, it may be arranged at the same height position as the opening end 2c, or may be arranged below the opening end 2c.

DESCRIPTION OF SYMBOLS 1 Electronic circuit apparatus 3 Board | substrate 3a Mounting surface 4 Connector unit 5 Sealing resin 6 Connection terminal pin 6a One end 6b The other end 7 Terminal block 21 Support part 21a Upper surface (the other main surface)
21b Lower surface (one main surface)
25, 25A, 25B Through hole 27, 27A, 27B engaging portion

Claims (6)

A connection terminal pin; and a terminal block having a plate-like support portion that is fixed in a state where the connection terminal pin is inserted in at least the thickness direction, and the connection terminal pin protrudes from one main surface of the support portion. A connector unit having a structure in which one end is joined to the mounting surface of the substrate by a reflow process in a mounted state, and a joint portion between the connection terminal pin and the mounting surface is embedded with a sealing resin ,
Wherein on the one main surface of the support portion, projecting in a direction along the one main surface, the engaging portion engaged with the sealing resin by being embedded in the sealing resin is formed,
The support portion penetrates in the thickness direction with a space from the insertion portion of the connection terminal pin, and during the reflow process, one end of the connection terminal pin and the substrate from the other main surface side of the support portion A connector unit, wherein a through-hole for melting the solder through hot air is formed toward the solder provided in advance in the joint portion . The through hole is formed in a rectangular shape in plan view,
2. The connector unit according to claim 1 , wherein a pair of the engaging portions are formed so as to protrude radially inward from only a rectangular short side of the inner peripheral surface of the through hole. It said engaging portion, the connector unit according to claim 1 or claim 2, characterized in that disposed inside the outer edge of one main surface of the supporting portion. Wherein one end of the connecting terminal pins are bent relative to the longitudinal direction of the connecting terminal pins, claim 1, characterized in that are arranged so as to overlap in the thickness direction of the through hole and the support portion Item 4. The connector unit according to any one of Items 3 to 3 . One end of the connection terminal pin is bent with respect to the longitudinal direction of the connection terminal pin, and extends from the bent portion along the one main surface of the support portion toward the outer edge of the one main surface. The connector unit according to claim 1, wherein: The connector unit according to any one of claims 1 to 5 , a substrate having a mounting surface that joins one end of the connection terminal pin in a mounted state, and a joint portion between the connection terminal pin and the mounting surface. An electronic circuit device comprising: a sealing resin for embedding the engaging portion .

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