JP2006331785A - Connector for base board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To maintain performance of a soldering part stably in a connector for a base board. <P>SOLUTION: The connector for the base board is provided with a fixing part 60 to fix a housing 10 made of a synthetic resin to the base board K. The fixing part 60 is made of a metal plate, attached to the housing 10 and connected to the base board K via the soldering part 69. In the fixing part 60, between a fall-off prevention part 67 and the soldering part 69 to the housing 10, a stress relieving part 68 made deformable according to fluctuations of the housing 10 is arranged and installed in the case the housing 10 is relatively displaced to the base board K because of an external factor such as heat. The stress relieving part 68 is bent and formed so as to be protruded in the plate thickness direction of the fixing part 60. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a board connector.

In general, a board connector includes a hood-like connector housing that can be fitted with a mating connector. A terminal fitting can be passed through the inner wall of the connector housing, one end of which protrudes to the inside of the connector housing, and the other end is exposed to the outside of the connector housing and bent toward the board side. Soldered to the board.
In addition, a fixing portion is formed to protrude laterally at the lower ends of both side surfaces of the connector housing, and the connector housing is fixed to the substrate by screwing a screw into the screw hole formed in the fixing portion from the substrate side. It is like that.
Japanese Utility Model Publication No. 61-60486

  In the above case, since it is necessary to give the fixing part enough strength to withstand the screwing force of the screw, there is a discomfort to enlarge the fixing part. Therefore, a method is conceivable in which the fixing portion is made of a metal plate to enable solder connection to the substrate and avoid an increase in size of the fixing portion.

  However, for example, when a board with this connector is mounted on a vehicle for a long period of time, the connector housing repeatedly expands and contracts due to the influence of temperature changes in the surrounding environment. Stress is applied to the part. Thus, when stress is further concentrated on the soldering portion, the soldering portion is substantially broken.

  The present invention has been completed based on the above circumstances, and an object thereof is to stably maintain the performance of the soldered portion.

  As a means for achieving the above object, the invention according to claim 1 is the board connector provided with a fixing part for fixing the connector housing made of synthetic resin to the board, wherein the fixing part is constituted by a metal plate. And is fixed to the substrate by soldering via a soldering portion, and the fixing portion protects the soldering portion from external factors such as heat. This is characterized in that a solder protection means is provided.

According to a second aspect of the present invention, in the first aspect of the present invention, the solder protection means is formed between the retaining portion with respect to the connector housing and the soldering portion in the fixing portion, and is caused by the external factor. It is characterized in that the connector housing is constituted by a stress relaxation portion that can be deformed in accordance with the fluctuation of the connector housing when the connector housing is displaced relative to the substrate.
The invention of claim 3 is characterized in that, in the invention of claim 2, the stress relaxation portion is bent so as to protrude in the plate thickness direction of the fixed portion.

  According to a fourth aspect of the present invention, in the third aspect, the retaining portion for the connector housing is formed on a standing plate portion disposed along a side surface of the connector housing, while the soldering portion Is formed in a base plate portion disposed along the surface of the substrate, and the stress relaxation portion is formed in the standing plate portion.

  According to a fifth aspect of the present invention, in the method according to the fourth aspect, the stress relaxation portion is formed so as to be able to enter into a recess at a board side end portion of a side surface of the connector housing, and the floor plate is formed in the recess. It is characterized in that it is configured to be connected to one end of the part.

  A sixth aspect of the present invention is characterized in that, in the first aspect, the solder protection means is constituted by a heat insulating cover attached to the fixed portion so as to cover at least the soldered portion. Have.

  According to a seventh aspect of the present invention, in the first aspect of the present invention, a screw through hole is formed in the substrate, and the screw is screwed into an inner periphery at a position corresponding to the through hole in the soldering portion. A pre-threaded portion with a female screw cut is attached, and the solder protecting means is characterized by being constituted by the pre-threaded portion.

  According to an eighth aspect of the present invention, in the apparatus according to any one of the first to seventh aspects, a mounting groove into which the fixing portion can be inserted is formed in the connector housing, and the fixing portion is a surface of the substrate. It is characterized in that it is press-fitted into the mounting groove by being displaced in a direction substantially perpendicular to the substrate and approaching the substrate.

<Invention of Claim 1>
The fixing portion is made of a metal plate, is attached to the connector housing, and is connected to the substrate via a soldering portion. Therefore, if stress is applied to the soldering portion due to external factors such as heat, the soldering portion may be cracked. However, according to the invention of claim 1, the fixing portion is soldered from an external factor. Since the solder protection means for protecting the part is provided, the performance of the soldered part can be stably maintained.

<Invention of Claim 2>
According to the second aspect of the present invention, the stress relaxation portion is disposed between the board and the retaining portion for the connector housing in the fixed portion, and when the connector housing is relatively displaced with respect to the board due to an external factor. Since the stress relaxation portion can be deformed in accordance with the fluctuation of the connector housing, it is possible to prevent stress from concentrating on the soldering portion.
<Invention of Claim 3>
According to the third aspect of the invention, since the stress relaxation portion is bent so as to protrude in the plate thickness direction of the fixed portion, it is easily manufactured only by bending.

<Invention of Claim 4>
According to the invention of claim 4, the retaining portion for the connector housing is formed on the standing plate portion arranged along the side surface of the connector housing, and the soldering portion is formed on the floor plate portion arranged along the surface of the substrate. Furthermore, a stress relaxation part is formed in the standing plate part. Therefore, the area occupied by the soldering portion of the laying plate portion can be ensured as much as the stress relief portion is not provided in the laying plate portion, and the reliability of the solder connection can be improved.

<Invention of Claim 5>
According to the invention of claim 5, since the stress relaxation portion is bent so as to be able to enter the recess at the board side end portion of the side surface of the connector housing, and the bottom plate is connected to one end of the floor plate portion in the recess. In addition to ensuring a large occupied area of the soldering portion of the portion, the position of the laying plate portion can be entirely shifted to the recess side on the side surface of the connector housing. As a result, the projecting outer end of the floor plate portion does not protrude significantly outward from the side surface of the connector housing, and the whole can be made compact.

<Invention of Claim 6>
According to the invention of claim 6, since the heat insulating cover is attached to the fixing portion so as to cover at least the soldering portion, the performance of the soldering portion deteriorates with time due to the influence of the temperature change of the surrounding environment. Can be avoided. Moreover, since it is only necessary to cover the portion including the soldering portion with the heat insulating cover, the attachment is easy and the versatility is high. Examples of the heat insulating cover include a flexible sheet containing ceramic or silica, or a sheet formed by applying a coating containing ceramic or silica to a corresponding portion.

<Invention of Claim 7>
According to the seventh aspect of the present invention, the preliminary screwing portion having a female screw cut on the inner periphery is attached to the soldering portion at a position corresponding to the through hole of the screw formed in the substrate. Therefore, in the unlikely event that it is difficult to maintain the predetermined performance due to damage to the soldered portion, a screw is securely screwed into the auxiliary screwed portion from the substrate side so that the fixed portion with respect to the substrate can be surely secured. A fixing force can be obtained, and further performance deterioration of the soldered portion can be prevented.

<Invention of Claim 8>
According to the invention of claim 8, the fixing portion is press-fitted into the mounting groove formed in the connector housing by being displaced in a direction perpendicular to the surface of the substrate and approaching the substrate. Therefore, even if the fixing portion receives a pressing force when mating with the mating connector housing or receives a force in a direction of squeezing away from the board, the fixing portion is locked against the mounting groove of the connector housing against the force. The state can be kept stable.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. The board connector of the present embodiment includes a plurality of terminal fittings 30, a connector housing (hereinafter simply referred to as housing 10) to which each terminal fitting 30 is attached, and a pair of fixing portions 60 attached to the housing 10. Has been. The housing 10 is fixed to the substrate K by the fixing portion 60 and can be fitted to a counterpart housing (not shown). In the following, the side of the mating surface with the mating housing is defined as the front, and the vertical direction is based on each drawing excluding FIG.

The housing 10 is made of a highly heat-resistant synthetic resin such as LCP (liquid crystal polymer) or PPS (polyphenylene sulfide). As shown in FIG. 1, the housing 10 is formed in a horizontally long shape and can hold a terminal fitting 30. It consists of a part 11 and a hood part 12 protruding forward from the periphery of the terminal holding part 11.
The terminal holding portion 11 is provided with a plurality of terminal insertion holes (not shown) in which the terminal fittings 30 can be fitted from the rear by press fitting. The terminal fittings 30 are arranged in two upper and lower stages in a state of being parallel in the width direction and the height direction. Of these, the upper side metal fittings 30 are arranged separately on the left and right sides with a lock protrusion 13 to be described later, and nine lower metal fittings 30 are arranged at the same pitch in the width direction. ing. A pair of protective walls 14 for protecting the terminal fitting 30 exposed from the rear surface of the terminal holding portion 11 are formed on the left and right side portions of the terminal holding portion 11 so as to protrude rearward.

  The hood portion 12 is formed in a substantially rectangular tube shape that opens forward, and a mating housing can be fitted from the front. The upper and lower walls of the hood portion 12 are thinner than the terminal holding portion 11 in consideration of a reduction in height. A lock projection 13 is formed at the center of the upper wall of the hood portion 12 in the width direction so as to be able to hold both housings in a fitted state by engaging with a lock receiving portion of the mating housing. A pair of mounting grooves 15 on which the corresponding fixing portions 60 can be mounted individually are provided on both side walls (both sides in the width direction) of the hood portion 12. The structure of the mounting groove 15 will be described in detail later together with the fixing portion 60.

  The terminal fitting 30 is generally L-shaped as a whole, is arranged substantially horizontally in the hood portion 12 and penetrates the terminal holding portion 11, and a portion protruding rearward from the terminal holding portion 11 at a predetermined position. It is bent downward and its lower end is bent backward again. A front half portion of the terminal fitting 30 that protrudes into the hood portion 12 is a connector-side connection portion 31 that can be connected to a mating terminal disposed in the mating housing, and is exposed from the rear surface of the terminal holding portion 11. The latter half is a board-side connecting part 32 that can be solder-connected to the conductive path printed on the board K. Further, after the terminal fitting 30 is pulled out rearward, the corresponding persons in the upper and lower stages are displaced in the left-right direction, so that, as shown in FIG. They are arranged on the same straight line at the same pitch, and their rear ends are aligned at the same position in the front-rear direction.

The fixing portion 60 is made of a metal plate having a peg shape separate from the housing 10, and is formed by punching the metal plate into a predetermined shape and bending the metal plate. Specifically, as shown in FIG. 3, the fixing portion 60 includes a plate-like standing plate portion 61 along the height direction (vertical direction), and a floor plate portion 62 that protrudes laterally from a lower end portion 66 of the standing plate portion 61. And.
A substantially entire surface of the bottom surface of the floor plate portion 62 excluding a stress relieving portion 68 to be described later is a soldering portion 69 to which solder is adhered. 10 is fixed to the substrate K. Further, a slit 63 is formed in the fixed portion 60 by cutting out a substantially center in the plate width direction (front-rear direction) from the floor plate portion 62 to the middle of the standing plate portion 61 in the height direction. The laying plate portion 62 is divided and arranged in the front and rear regions with the slit 63 in between. Even if one of the front and rear regions has poor contact with the solder, the influence is exerted on the other side. It is cut off by the slit 63.

  On the other hand, the mounting groove 15 in which the fixed portion 60 is mounted extends in the height direction and is formed to open on both upper and lower surfaces of the housing 10, and both side edges of the standing plate portion 61 extend along the plate surface. The standing plate portion receiving groove 16 that can be inserted, and the floor plate portion receiving groove 17 in which the floor plate portion 62 can be inserted along a direction orthogonal to the plate surface thereof.

  The standing plate portion 61 of the fixing portion 60 is formed in a stepped shape having three width dimensions so that the width is narrowed in the order of the upper end portion 64, the intermediate portion 65, and the lower end portion 66, and the floor plate portion 62 is connected thereto. The lower end portion 66 is formed with substantially the same width. On the other hand, is the standing plate portion receiving groove 16 of the mounting groove 15 substantially the same as the upper end portion 64 of the standing plate portion 61 or the wide portion 16A having a larger width and the middle portion 65 of the standing plate portion 61? A narrower portion 16B having a larger width dimension is connected to the upper and lower sides, and the bottom plate portion receiving groove 17 has substantially the same width as the lower end portion 66 and the bottom plate portion 62 of the standing plate portion 61 or a width larger than that. Dimension is formed.

When the fixing portion 60 is inserted into the mounting groove 15, the step 64 </ b> A at the lower end of the upper end portion 64 abuts on the step portion 16 </ b> E at the lower end of the wide portion 16 </ b> A, thereby positioning the fixing portion 60 with respect to the housing 10. In this mounted state, a predetermined gap is opened between the lower end portion 66 of the upright plate portion 61 and the narrow portion 16B.
In addition, a pair of retaining portions 67 are formed on both side edges of the intermediate portion 65 of the upright plate portion 61 so as to project laterally. The retaining portion 67 bites into the groove edge of the narrow portion 16B of the standing plate portion accommodating groove 16 as it is mounted, so that the fixing portion 60 can be held from the mounting groove 15 in a retaining state. It has become. In addition, the side projection dimension of the bottom plate portion 62 is substantially the same as the depth of the bottom plate portion receiving groove 17, and in the mounted state, the protruding outer end of the bottom plate portion 62 is flush with the outer surface of the housing 10 or outside. It is set so as to protrude slightly from the side.

  Now, in the floor plate portion 62, a stress relaxation portion 68 that is bent upward and protrudes in a mountain shape or a base shape is formed at a position near the standing plate portion 61. The stress relaxation portion 68 is disposed between the retaining portion 67 and the soldering portion 69, and is continuous at substantially the same height over the entire width of the floor plate portion 62, and one end thereof is continuous with the lower end of the standing plate portion 61. ing. The stress relieving portion 68 can be expanded and contracted in the length direction of the fixing portion 60 (the direction connecting the standing plate portion 61 and the floor plate portion 62), and the entire position of the housing 10 is shifted in the lateral direction. When the housing 10 itself expands or contracts and fluctuates, the housing 10 itself expands and contracts according to the fluctuation of the housing 10, thereby reducing the stress applied to the soldering portion 69. That is, the stress relieving part 68 is configured as a solder protection means for protecting the soldering part 69.

  Next, the operation of this embodiment will be described. First, the corresponding terminal fitting 30 is inserted into each terminal insertion hole of the housing 10 from the rear. Subsequently, the fixing portion 60 is inserted into the mounting groove 15 of the housing 10 from above along the plate surface of the standing plate portion 61 so that the standing plate portion 61 enters the standing plate portion receiving groove 16 and the floor plate portion 62 is moved. It is made to enter the laying plate portion receiving groove 17. Such mounting work can be performed using a jig or the like (not shown).

  Here, if the insertion direction of the fixing portion 60 with respect to the mounting groove 15 is set to the lateral direction, the fixing portion 60 may come out of the mounting groove 15 by receiving a pressing force associated with the mating housing. There is. Further, if this insertion direction is set downward, there is a concern that the fixing portion 60 may come out of the mounting groove 15 by receiving a twisting force caused by pushing up from below. In this respect, in the present embodiment, since the insertion direction of the fixing portion 60 with respect to the mounting groove 15 is set in a direction approaching the substrate K from above, the fixing portion 60 does not accidentally come out of the mounting groove 15.

  When the intermediate portion 65 enters the narrow portion 16B, the retaining portion 67 descends while biting into the groove edge of the narrow portion 16B. Further, after the upper end portion 64 enters the wide portion 16A, the step 64A of the upper end portion 64 abuts against the step portion 16E of the wide portion 16A, so that further insertion operation is restricted. In this state, the retaining portion 67 bites into the groove edge of the narrow portion 16B, thereby preventing the retaining portion 67 from coming out. Note that the terminal metal 30 may be mounted after the fixing portion 60 is mounted first.

  Next, an operation of fixing the housing 10 with the fixing portion 60 to the substrate K is performed. For this purpose, solder is first applied in advance to the lands on the surface of the substrate K, and the board-side connection portion 32 of the terminal fitting 30 and the soldering portion 69 of the base plate portion 62 of the fixing portion 60 are respectively applied to the corresponding lands. The housing 10 is placed on the substrate K in contact therewith. In this state, the substrate K with the housing 10 is run in a reflow furnace (not shown) to melt the solder, and the substrate-side connecting portion 32 and the soldering portion 69 are attached to the corresponding lands. After that, when the solder is cooled and solidified, the terminal fitting 30 is conductively connected to the conductive path of the substrate K and the fixing portion 60 is fixed to the substrate K. The terminal fitting 30 and the fixing portion 60 may be connected or fixed to the substrate K by hand soldering instead of reflow soldering.

  Now, when the housing 10 placed and connected to the substrate K is mounted on a vehicle and used for use, the housing 10 repeats expansion and contraction as the surrounding environment changes in temperature. Then, a stress is generated on the fixed portion 60 due to the difference in expansion and contraction of the housing 10, and there is a concern that the soldering portion 69 may be cracked. However, in the present embodiment, a stress relaxation portion 68 is provided between the retaining portion 67 and the soldering portion 69 in the fixing portion 60, and the stress relaxation portion 68 has a length corresponding to the expansion and contraction of the housing 10. Since it can expand and contract in the direction, stress can be prevented from concentrating on the soldering portion 69. Note that the stress is applied to the fixing portion 60 when the relative position between the housing 10 and the substrate K shifts, which is also caused by external factors other than the above-described environmental temperature change. The case where 10 is physically displaced by an external force is also included.

  As described above, according to the present embodiment, even if the housing 10 is relatively displaced with respect to the substrate K due to external factors such as heat, and stress is applied to the fixing portion 60 due to this, the housing 10 Since the stress relieving portion 68 can be flexibly deformed according to the fluctuation, it is possible to prevent stress from concentrating on the soldering portion 69, and as a result, the soldering portion 69 can maintain a certain performance. Moreover, the stress relieving portion 68 is simply manufactured by simply bending the predetermined position of the floor plate portion 62 of the fixing portion 60 so as to push upward.

<Embodiment 2>
Next, Embodiment 2 of the present invention will be described with reference to FIG. The second embodiment is different from the first embodiment in the arrangement position and form of the stress relaxation portion 68. Others are the same as those in the first embodiment, and thus the same reference numerals are given to the same structural portions, and duplicate descriptions are omitted. 5 only shows a state in which the fixing portion 60 is in close contact with one side surface of the housing 10 (specifically, the groove surface of the mounting groove 15), but the fixing portion 60 is also provided on the other side surface opposite to this. Needless to say, the same is applied to the third embodiment (FIG. 6) and the fourth embodiment (FIG. 7) described later.

In the second embodiment, the stress relaxation portion 68 is formed not on the floor plate portion 62 but on the standing plate portion 61 side. The stress relieving portion 68 is continuous over the entire width at a height position lower than the retaining portion 67 in the standing plate portion 61, and is bent in a mountain shape or a trapezoidal shape from the housing 10 side to the side. It is a form that sticks out. Further, the upright plate portion 61 is configured to stand substantially vertically except for the stress relieving portion 68, whereas the floor plate portion 62 approaches the one side surface of the housing 10 as much as there is no stress relieving portion 68. It is connected to the lower end of the upright plate portion 61. The substantially entire lower surface of the floor plate portion 62 is a soldering portion 69.
According to the second embodiment, the area occupied by the soldering portion 69 in the floor plate portion 62 can be ensured by the amount of the stress relaxation portion 68 in the floor plate portion 62, thereby improving the reliability of solder connection. Can be achieved.

<Embodiment 3>
FIG. 6 shows Embodiment 3 of the present invention. The third embodiment is different from the second embodiment in that the disposition position of the stress relaxation portion 68 is set at the lowermost end of the standing plate portion 61. The stress relaxation portion 68 is formed by bending the lowermost end portion of the upright plate portion 61 from the outer side to the housing 10 side in a mountain shape or a trapezoidal shape. Are arranged in a state of entering the existing recess 19 at the lower end of the groove surface. In addition, one end of the floor plate portion 62 also enters the recess 19 of the housing 10, and is continuous with the bent end of the stress relaxation portion 68 in the recess 19.

  According to the third embodiment, since the stress relaxation portion 68 is formed on the upright plate portion 61 side, in addition to the fact that the occupation area of the soldering portion 69 in the floor plate portion 62 can be ensured as in the second embodiment, Since one end of the floor plate portion 62 enters the recess 19 of the housing 10, the entire position of the floor plate portion 62 can be shifted to the housing 10 side. As a result, the amount of protrusion of the other end of the floor plate 62 protruding from one side of the housing 10 can be kept small, and the entire connector can be made compact.

<Embodiment 4>
FIG. 7 shows Embodiment 4 of the present invention. In the fourth embodiment, neither the standing plate portion 61 nor the floor plate portion 62 has the stress relaxation portion 68, and the fixing portion 60 has a substantially L shape as a whole. The entire outer surface of the fixing portion 60 is covered with a heat insulating cover 70 as a solder protection means for protecting the soldering portion 69. The heat insulating cover 70 is constituted by a flexible sheet body including, for example, silica or ceramic, and has an adhesive layer on the back surface, and is attached to the fixing portion 60 via the adhesive layer.

  By the way, when this product is used, there is a concern that the soldering portion 69 formed on the lower surface of the laying plate portion 62 is thermally damaged due to a temperature rise in the surrounding environment. However, according to the fourth embodiment, since the heat transfer to the soldering portion 69 is effectively blocked by the heat insulating cover 70, the quality of the soldering portion 69 can be maintained constant. In addition, since the heat insulating cover 70 is simply covered with the fixing portion 60 from above, it is easy to mount and can flexibly respond to changes in the shape of the fixing portion 60. Rich in nature. In addition, as the heat insulation cover 70, you may use the sheet body shape | molded by apply | coating the coating material containing a silica or a ceramic to the soldering part 69 and its peripheral part.

<Embodiment 5>
FIG. 8 shows a fifth embodiment of the present invention. In the fifth embodiment, when the soldering portion 69 is damaged due to external factors such as heat, soldering is performed so that the fixing force of the fixing portion 60 to the substrate K does not further decrease. Solder protection means that complements the above is provided in the fixing portion 60 in advance.

  That is, in the fifth embodiment, a cylindrical boss portion 85 is raised and formed on the laying plate portion 62 of the fixing portion 60, and a resin resin in which an internal thread 86 </ b> A is cut on the inner periphery inside the boss portion 85. The portion 86 is embedded, thereby forming the preliminary screwing portion 80. On the substrate K side, a screw through hole (not shown) is provided in a land corresponding to the soldering portion 69, and the screw can be screwed in from the through hole to the female screw 86A. Yes.

  Here, the fixing portion 60 is first fixed to the substrate K by soldering via the soldering portion 69 in a state where the inner periphery of the resin portion 86 is aligned with the through hole of the substrate K. After a few years since the product was put into use, the soldering portion 69 was damaged by an external factor such as heat, so that only the soldering portion 69 obtained a predetermined fixing force to the substrate K. It can be difficult. In such a case, a screw is entered from below the substrate K, and this screw is screwed into the female screw 86A of the resin portion 86 through the through hole of the substrate K. If it does so, the firm adhering force of the fixing | fixed part 60 with respect to the board | substrate K can be obtained, and the further performance deterioration of the soldering part 69 can be prevented.

<Embodiment 6>
FIG. 9 shows Embodiment 6 of the present invention. The sixth embodiment has the same structure as that of the first embodiment except for the floor plate portion 62 (soldering portion 69).
First, the background on which the invention according to Embodiment 6 was devised will be described. Generally, the solder used for fixing the fixing portion 60 to the substrate K is mixed with flux so as to clean the metal surface and improve wettability. Therefore, during soldering, volatile components in the flux may be gasified and bubbles may be generated in the solder. In this case, if the soldering portion 69 of the laying plate portion 62 is closed over the entire surface, bubbles generated in the solder will stay under the soldering portion 69, and then the solder is solidified. There is a problem that voids are formed in the solder.

  Therefore, in the sixth embodiment, a gas escape hole 90 through which the gas in the solder can be ventilated is provided at least in a position corresponding to the soldering portion 69 in the fixing portion 60. Specifically, the gas escape hole 90 is constituted by a large number of through holes each having a circular shape, through which gas in the flux escapes upward and outward. In this case, if the gas escape hole 90 is opened more than necessary or the opening diameter of the gas escape hole 90 is excessively increased, the strength of the floor plate portion 62 is reduced. A sufficient strength is ensured in the region excluding the gas escape hole 90. The shape of the gas escape hole 90 is not limited to the circular shape described above, and may be, for example, a polygonal shape such as a triangle or a quadrangle, an elliptical shape such as an ellipse, and a slit shape such as a straight line or a curve.

  According to the sixth embodiment, the formation of voids due to the presence of the gas escape holes 90 in the soldering portion 69 can be prevented in advance. Further, since the solder also enters the gas escape hole 90 due to its interfacial tension, the bonding strength with the soldering portion 69 can be increased.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.
(1) According to the present invention, the stress relaxation portion may be formed by partially removing a gap between the retaining portion and the soldering portion in the fixing portion.
(2) According to the present invention, the stress relaxation portion may be formed in a bellows shape or a wave shape between the retaining portion and the soldering portion in the fixing portion.
(3) According to the present invention, the heat insulating cover only needs to cover the soldering portion, and does not need to cover the entire fixing portion.
(4) According to the present invention, the terminal fitting may be a press-fit terminal that press-fits and connects the board-side connection portion to the board, and is a straight type whose shape extends straight over the entire length. May be. Furthermore, a male terminal metal fitting may be provided in the mating housing, and the connector side connection portion may be formed in a female shape.
(5) According to the present invention, the fixed portion may be attached to the housing by insert molding. In that case, substantially the entire upright plate portion may be a retaining portion for the housing.

The front view of a housing in Embodiment 1 Top view of housing Side sectional view of the housing with the fixed part in the mounting groove Longitudinal cross section of the main part including the stress relaxation part The principal part longitudinal cross-sectional view containing the stress relaxation part in Embodiment 2 The principal part longitudinal cross-sectional view containing the stress relaxation part in Embodiment 3 The principal part longitudinal cross-sectional view containing a heat insulation cover in Embodiment 4. The perspective view of a fixing part in Embodiment 5. The perspective view of a fixing part in Embodiment 6.

Explanation of symbols

10. Housing (connector housing)
DESCRIPTION OF SYMBOLS 15 ... Mounting groove 60 ... Fixed part 61 ... Standing plate part 62 ... Laying board part 68 ... Stress relaxation part 69 ... Soldering part

Claims (8)

In the board connector having a fixing part for fixing the connector housing to the board,
The fixing part is constituted by a metal plate, is mounted on the connector housing and is fixed to the substrate by soldering via a soldering part,
The board connector according to claim 1, wherein the fixing part is provided with solder protection means for protecting the soldering part from external factors such as heat. The solder protecting means is formed between the retaining portion for the connector housing and the soldering portion in the fixing portion, and when the connector housing is relatively displaced with respect to the substrate due to the external factor, The board connector according to claim 1, wherein the board connector is configured by a stress relaxation portion that can be deformed according to a change in the connector housing. The board connector according to claim 2, wherein the stress relaxation portion is bent so as to protrude in a plate thickness direction of the fixed portion. The retaining portion for the connector housing is formed on a standing plate portion arranged along a side surface of the connector housing, while the soldering portion is formed on a floor plate portion arranged along the surface of the substrate. The board connector according to claim 3, wherein the stress relaxation portion is formed on the standing plate portion. The stress relieving part is formed so as to be able to enter a recess in a board side end of a side surface of the connector housing, and is connected to one end of the floor plate part in the recess. 5. The board connector according to 4. 2. The board connector according to claim 1, wherein the solder protection means includes a heat insulating cover attached to the fixing portion so as to cover at least the soldering portion. A screw through hole is formed in the substrate, and in the soldering portion, a position corresponding to the through hole is provided with a pre-threaded portion with a female screw into which the screw is screwed on the inner periphery, The board connector according to claim 1, wherein the solder protection means is constituted by the preliminary screwing portion. A mounting groove into which the fixing portion can be inserted is formed in the connector housing, and the fixing portion is press-fitted into the mounting groove by being displaced in a direction substantially perpendicular to the surface of the substrate and approaching the substrate. The board connector according to claim 1, wherein the board connector is a board connector.

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