JP2007201503A - Development processing method and development processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To set time-process conditions at desired values without causing rear-ender of substrates on a transport path in a flat flowing-system development processing, i.e., the movement of a substrate is temporarily suspended and a developer is supplied. <P>SOLUTION: A development processor compares a lower limit moving speed operation means that finds a lower limit moving speed V<SB>low</SB>of the substrate G based on a tact time T<SB>t</SB>, a maximum suspension time T<SB>s</SB>, a substrate size D, and a desired minimum substrate distance d, a development time setting means that gives a desired set value for a development time T<SB>g</SB>, a developer supply time setting means that gives a desired set value for a development supply time T<SB>s</SB>, a speed temporarily set value operation means that finds a temporarily set value V<SB>D</SB>based on a development time set value T<SB>g</SB>, a developer supply time set value T<SB>a</SB>, a traveling distance L, and the temporarily set value of a first speed with the lower limit moving speed V<SB>low</SB>, and has a speed set value determining means that determines a normally set value if it is the lower limit moving speed V<SB>low</SB>or higher. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a development processing method and a development processing apparatus for performing processing such as development processing on a substrate to be processed by a flat flow method.

  Conventionally, in a resist coating and developing processing system in LCD (liquid crystal display) manufacturing, as a developing method or a cleaning method that can advantageously cope with an increase in size of an LCD substrate, a conveying body such as a conveying roller or a conveying belt is laid horizontally. A so-called flat-flow method is known in which development processing or cleaning processing is performed while an LCD substrate is transported on a transport path.

In general, in such a flat-flow type substrate processing system, as shown in, for example, Patent Document 1, a certain amount of time is taken for a certain substrate to be processed from an upstream carry-in section to a downstream carry-out section on a transport path. A plurality of process processing units arranged above, below or along the transfer path in the middle of the transfer process each step of processing on the moving or temporarily stopped substrate. Then, in the pipeline system, a large number of substrates are successively loaded onto the conveyance path from the carry-in section at a time interval of tact time, and each process processing section is passed one after another at a time interval of tact time. The same processing is repeated at the time interval, and the processed substrates are sequentially carried out from the carrying path at the time interval of the tact time from the carry-out section.
JP 2003-7582

  In the flat-flow type substrate processing system as described above, it is required to optimally control the substrate transport speed on the transport path in accordance with various required specifications such as processing contents, quality, throughput, footprint, and the like. For example, when trying to improve the processing content and quality, the types, number, processing time, etc. of the processing steps on the transport path increase, and the number of scenes where the substrate is temporarily stopped or the transport speed is changed on the transport path increases. However, if the conveyance speed is set incorrectly, there is a possibility that the substrate that comes later will collide with the substrate that is stopped or decelerated. Even when the tact time is shortened to improve the throughput, if the transport speed is not properly set or adjusted, there is a high possibility that a substrate rear-end collision will occur on the transport path. When a substrate rear-end collision occurs, the substrate must be damaged and discarded, and the production efficiency or product yield is reduced.

  The present invention has been made in view of the problems of the prior art, and in a flat-flow type development process in which a substrate is temporarily stopped and a developing solution is supplied, a time-lapse without causing a rear-end collision of the substrate on the conveyance path. An object of the present invention is to provide a development processing method and a development processing apparatus in which process conditions can be set to desired values.

In order to achieve the above object, the development processing method of the present invention sequentially transports a plurality of substrates to be processed on a transport path, including at least one temporary stop at a desired tact time (T _t ). A development processing method for performing development processing on the substrate on the transport path in the middle, wherein the developer is temporarily stopped at a first stop position on the transport path and the developer is supplied to the substrate. A substrate transfer step of moving the substrate at a first speed from the first stop position to a second stop position separated by a predetermined distance from the first stop position on the transfer path; and at the second stop position A development stopping step of substantially removing the developer from the substrate and stopping development; the tact time (T _t ); the maximum stop time (T _S ) during which the substrate is temporarily stopped; and the transport direction of the substrate Length size (D) and in the transport direction And lower moving speed determination step of determining a lower limit movement speed of the substrate (V _low) based on the kick desired minimum spacing between the substrates (d), the developer with respect to the substrate at the first stop position of the conveying path A development time setting step of giving a desired set value for the development time (T _g ) from the start of supply until the development is stopped at the second stop position; and at the first stop position on the transport path Developer supply time setting that gives a desired set value for the developer supply time (T _s ) from the start of the supply of the developer to the substrate to the start of the movement of the substrate toward the second stop position Based on the process, the developing time set value (T _g ), the developer supply time set value (T _a ), and the moving distance (L) from the first stop position to the second stop position. Obtain the temporary setting value (V _D ) for the first speed. And Mel velocity provisional setpoint calculation process, compared to the first provisional setpoint the lower movement speed of the speed (V _low), the normal set value when more than the lower limit movement speed (V _low) A speed setting value determining step.

In order to achieve the above-described object, the development processing apparatus of the present invention includes a transport path in which a transport body for transporting a substrate to be processed in a substantially horizontal state is laid in a horizontal direction, and the transport path on the transport path. A transport driving means for driving the transport body to move the substrate, a substrate carry-in portion for transporting the substrate onto the transport path at a predetermined tact time (T _t ), and a first stop position on the transport path A developer supply unit that temporarily stops the substrate and supplies the developer to the substrate; and a second stop position that is separated from the first stop position on the transport path by a predetermined distance downstream from the first transport position. A substrate transport unit that moves the substrate at a first speed, a development stop unit that stops the development by substantially removing the developer from the substrate at the second stop position, and has been processed from above the transport path A substrate unloading section for unloading the substrate; A stop means for said substrate, respectively with one or more stop positions set on the transport path suspended for a predetermined stop time, the tact time (T _t) and said maximum downtime substrate is stopped (T _S ), A length size (D) in the transport direction of the substrate, and a desired minimum substrate interval (d) in the transport direction, a lower limit travel speed calculation means for obtaining a lower limit travel speed (V _low ) of the substrate, Development time giving a desired set value for the development time (T _g ) from the start of supply of the developer to the substrate at the first stop position on the transport path until the development is stopped at the second stop position. Setting means and developer supply time from the start of the supply of the developer to the substrate at the first stop position on the transport path to the start of the movement of the substrate toward the second stop position (T _s ) A developer supply time setting means for providing a desired set value for the above, the development time set value (T _g ), the developer supply time set value (T _a ), and the second stop position from the first stop position. Speed temporary setting value calculating means for obtaining the temporary setting value (V _D ) of the first speed based on the moving distance (L) up to and including the temporary setting value of the first speed as the lower limit moving speed (V _low ) and a speed setting value determining means for setting a normal setting value when the speed is equal to or higher than the lower limit moving speed (V _low ).

In the development processing method or the development processing apparatus of the present invention, the substrate is stopped at the first stop position on the transport path in order to supply the developer to the substrate, and the development is substantially removed by removing the developer from the substrate. Therefore, the substrate is stopped at the second stop position on the downstream side of the second stop position on the transport path. In such a flat-flow development process, the development time (T _g ) from the start of the supply of the developer to the substrate at the first stop position until the development stops at the second stop position, the first stop While allowing the user to arbitrarily set the developer supply time (T _s ) from the start of the supply of the developer to the substrate at the position to the start of the movement of the substrate toward the second stop position A lower limit for avoiding a collision between the substrates by obtaining a speed (first speed) at which the substrate moves from the first stop position to the second stop position based on the set values and other predetermined values. Check if the movement speed is not reduced. As a result, the temporal process condition can be set to a desired value without causing a rear-end collision of the substrate on the transport path in the flat-flow type development processing in which the substrate is temporarily stopped and the developer is supplied.

According to a preferred aspect of the present invention, in the second development processing method or the development processing apparatus, the lower limit moving speed V _low is obtained by subtracting the developer supply time T _s from the tact time T _t as described below. It is obtained as a speed of moving by a distance (D + d) obtained by adding the substrate length D and the minimum substrate distance d during the time (T _t −T _s ).
V _low = (D + d) / (T _t −T _s )

  According to a preferred aspect of the development processing method of the present invention, in the developing solution supply step, the first moving at a predetermined speed along the transport path with respect to the substrate stopped at the first stop position. The developer is supplied from the nozzle. In the development stop step, the substrate is tilted at the second stop position, and the developer is caused to flow off from the substrate by gravity. In the development stop step, the rinse liquid is supplied from the second nozzle that moves at a predetermined speed along the transport path to the substrate that is stopped at the second stop position.

  In the development processing apparatus of the present invention, according to a preferred aspect, the developer supply unit moves at a predetermined speed along the transport path with respect to the substrate stopped at the first stop position. The 1st nozzle which supplies is provided. The development stopping unit includes a substrate tilting unit that tilts the substrate at the second stop position and causes the developer to flow from the substrate by gravity. The development stopping unit includes a second nozzle that supplies a rinsing liquid to the substrate stopped at the second stop position while moving at a predetermined speed along the transport path.

  According to the development processing method or the development processing apparatus of the present invention, due to the above-described configuration and operation, a substrate rear-end collision is caused on the transport path in the flat-flow type development processing in which the substrate is temporarily stopped and the developer is supplied. The temporal process condition can be set to a desired value without any change.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows a coating and developing treatment system as one configuration example to which the developing method and the developing apparatus of the present invention can be applied. The coating and developing processing system 10 is installed in a clean room, and uses, for example, an LCD substrate as a substrate to be processed, and performs various processes such as cleaning, resist coating, pre-baking, developing, and post-baking in the photolithography process in the LCD manufacturing process. Is. The exposure process is performed by an external exposure apparatus 12 installed adjacent to this system.

  In the coating and developing system 10, a horizontally long process station (P / S) 16 is disposed at the center, and a cassette station (C / S) 14 and an interface station (I / F) are disposed at both ends in the longitudinal direction (X direction). ) 18.

  The cassette station (C / S) 14 is a cassette loading / unloading port of the system 10, and can accommodate up to four cassettes C that can accommodate a plurality of substrates C in a horizontal direction, for example, in the Y direction by stacking substrates G in multiple stages. A cassette stage 20 and a transport mechanism 22 for loading and unloading the substrate G with respect to the cassette C on the stage 20. The transport mechanism 22 has a means for holding the substrate G, for example, a transport arm 22a, and can be operated with four axes of X, Y, Z, and θ, and the adjacent process station (P / S) 16 side and the substrate G Delivery is now possible.

  In the process station (P / S) 16, the processing units are arranged in the order of the process flow or process on a pair of parallel and opposite lines A and B extending in the system longitudinal direction (X direction). More specifically, the upstream process line A from the cassette station (C / S) 14 side to the interface station (I / F) 18 side includes a cleaning process unit 24, a first thermal processing unit 26, and The coating process section 28 and the second thermal processing section 30 are arranged in a horizontal row. On the other hand, in the downstream process line B from the interface station (I / F) 18 side to the cassette station (C / S) 14 side, a second thermal processing unit 30, a development processing unit 32, and a decolorization process are provided. The unit 34 and the third thermal processing unit 36 are arranged in a horizontal row. In this line configuration, the second thermal processing unit 30 is located at the end of the upstream process line A and at the beginning of the downstream process line B, and straddles between both lines A and B. ing.

  An auxiliary transfer space 38 is provided between the process lines A and B, and a shuttle 40 that can horizontally place the substrate G in units of one sheet is bidirectional in the line direction (X direction) by a drive mechanism (not shown). Can be moved to.

  In the upstream process line A, the cleaning process unit 24 includes a scrubber cleaning unit (SCR) 42, and an excimer is disposed at a location adjacent to the cassette station (C / S) 10 in the scrubber cleaning unit (SCR) 42. A UV irradiation unit (e-UV) 41 is arranged. The cleaning unit in the scrubber cleaning unit (SCR) 42 performs brushing cleaning or blow cleaning on the upper surface (surface to be processed) of the substrate G while transporting the LCD substrate G in the horizontal direction by roller transport or belt transport. It is like that.

  The first thermal processing unit 26 adjacent to the downstream side of the cleaning process unit 24 is provided with a vertical transfer mechanism 46 at the center along the process line A, and a plurality of units are arranged in multiple stages on both front and rear sides thereof. is doing. For example, as shown in FIG. 2, the upstream multi-stage unit section (TB) 44 includes a substrate passing pass unit (PASS) 50, dehydrating baking heating units (DHP) 52 and 54, and an adhesion unit. (AD) 56 are stacked in order from the bottom. Here, the pass unit (PASS) 50 is used to transfer the substrate G to the scrubber cleaning unit (SCR) 42 side. In addition, a substrate passing pass unit (PASS) 60, cooling units (CL) 62 and 64, and an adhesion unit (AD) 66 are stacked in order from the bottom on the downstream multi-stage unit section (TB) 48. Here, the pass unit (PASS) 60 is for delivering the substrate G to the coating process unit 28 side.

  As shown in FIG. 2, the transport mechanism 46 includes a lift transport body 70 that can be moved up and down along a guide rail 68 that extends in the vertical direction, and a turn that can rotate or swivel in the θ direction on the lift transport body 70. It has a transport body 72 and a transport arm or tweezers 74 that can move back and forth in the front-rear direction while supporting the substrate G on the revolving transport body 72. A drive unit 76 for driving the lifting and lowering conveyance body 70 up and down is provided on the base end side of the vertical guide rail 68, and a driving unit 78 for driving the swiveling conveyance body 72 to rotate is attached to the lifting and lowering conveyance body 70. A drive unit 80 for advancing and retracting 74 is attached to the rotary transport body 72. Each drive part 76,78,80 may be comprised by the electric motor etc., for example.

  The transport mechanism 46 configured as described above can move up and down or swivel at high speed to access any unit in the multistage unit sections (TB) 44 and 48 on both sides, and the shuttle on the auxiliary transport space 38 side. 40 can also deliver the substrate G.

  As shown in FIG. 1, the coating process unit 28 adjacent to the downstream side of the first thermal processing unit 26 includes a resist coating unit (CT) 82, a vacuum drying unit (VD) 84, and an edge remover unit (ER). 86 are arranged in a line along the process line A. Although not shown in the drawing, in the coating process section 28, a transport device is provided for loading and unloading the substrates G one by one in the order of the processes in these three units (CT) 82, (VD) 84, and (ER) 86. In each unit (CT) 82, (VD) 84, and (ER) 86, each process is performed in units of one substrate.

  The second thermal processing unit 30 adjacent to the downstream side of the coating process unit 28 has the same configuration as that of the first thermal processing unit 26, and a vertical type between the process lines A and B. , A multi-stage unit portion (TB) 88 is provided on the process line A side (last), and the other multi-stage unit portion (TB) 92 is provided on the process line B side (lead).

  Although not shown, for example, in the multi-stage unit section (TB) 88 on the process line A side, a pass unit (PASS) for substrate transfer is placed at the bottom, and a heating unit (PREBAKE) for pre-baking is placed thereon. For example, they may be stacked in three stages. In the multi-stage unit section (TB) 92 on the process line B side, a pass unit (PASS) for substrate transfer is placed at the bottom, and a cooling unit (COL) is stacked thereon, for example, one stage above it. In addition, prebaking heating units (PREBAKE) may be stacked in a two-stage stack, for example.

  The transport mechanism 90 in the second thermal processing unit 30 includes the coating process unit 28, the development process unit 32, and the substrate G through the pass units (PASS) of both the multistage unit units (TB) 88 and 92. In addition to delivering in units, the substrate G can also be delivered in units of sheets to the shuttle 40 in the auxiliary transport space 38 and the interface station (I / F) 18 described later.

  In the downstream process line B, the development process unit 32 includes a so-called flat-flow development unit (DEV) 94 that performs a series of development processing steps while transporting the substrate G in a horizontal posture.

  A third thermal processing unit 36 is disposed downstream of the development process unit 32 with the decolorization process unit 34 interposed therebetween. The decoloring process unit 34 includes an i-ray UV irradiation unit (i-UV) 96 for performing a decoloring process by irradiating the surface to be processed of the substrate G with i-line (wavelength 365 nm).

  The third thermal processing unit 36 has the same configuration as that of the first thermal processing unit 26 and the second thermal processing unit 30, and the vertical transport mechanism 100 along the process line B. A pair of multi-stage unit portions (TB) 98 and 102 are provided on both the front and rear sides.

  Although not shown in the figure, for example, in the upstream multi-stage unit section (TB) 98, a pass unit (PASS) is placed at the lowest stage, and a post-baking heating unit (POBAKE) is stacked in, for example, three stages. May be overlaid. In the downstream multi-stage unit section (TB) 102, a post-baking unit (POBAKE) is placed at the lowermost stage, and a substrate-passing / cooling unit (PASS / COL) for transferring and cooling the substrate is placed thereon. The heating unit (POBAKE) for post-baking may be stacked in two layers.

  The transport mechanism 100 in the third thermal processing section 36 includes i-line UV irradiation units (PASS) (PASS) and pass cooling units (PASS / COL) of both multi-stage unit sections (TB) 98 and 102, respectively. i-UV) 96 and cassette station (C / S) 14 and the substrate G can be transferred not only in units of one sheet, but also can be transferred in units of sheets to the shuttle 40 in the auxiliary transport space 38. .

  The interface station (I / F) 18 includes a transfer device 104 for exchanging the substrate G with the adjacent exposure device 12, and a buffer stage (BUF) 106 and an extension / cooling stage (EXT / COL) around the transfer device 104. ) 108 and peripheral device 110 are arranged. A stationary buffer cassette (not shown) is placed on the buffer stage (BUF) 106. The extension / cooling stage (EXT / COL) 108 is a stage for transferring a substrate having a cooling function, and is used when the substrate G is exchanged with the process station (P / S) 16 side. For example, the peripheral device 110 may have a configuration in which a titler (TITLER) and a peripheral exposure device (EE) are stacked vertically. The transfer device 104 has a means for holding the substrate G, for example, a transfer arm 104a, and transfers the substrate G to and from the adjacent exposure device 12, each unit (BUF) 106, (EXT / COL) 108, (TITLER / EE) 110. Can be done.

  FIG. 3 shows a processing procedure in this coating and developing processing system. First, in the cassette station (C / S) 14, the transport mechanism 22 takes out one substrate G from a predetermined cassette C on the stage 20, and the excimer of the cleaning process unit 24 of the process station (P / S) 16. It is carried into the UV irradiation unit (e-UV) 41 (step S1).

  In the excimer UV irradiation unit (e-UV) 41, the substrate G is subjected to dry cleaning by ultraviolet irradiation (step S2). This UV cleaning mainly removes organic substances on the substrate surface. After completion of the ultraviolet cleaning, the substrate G is moved to the scrubber cleaning unit (SCR) 42 of the cleaning process unit 24 by the transport mechanism 22 of the cassette station (C / S) 14.

  In the scrubber cleaning unit (SCR) 42, as described above, the substrate G is brushed or blown onto the upper surface (surface to be processed) of the substrate G while being transported in a horizontal position in the horizontal direction by roller transport or belt transport. By performing cleaning, particulate dirt is removed from the substrate surface (step S3). After the cleaning, the substrate G is rinsed while being conveyed in a flat flow, and finally the substrate G is dried using an air knife or the like.

  The substrate G that has been cleaned in the scrubber cleaning unit (SCR) 42 is carried into the pass unit (PASS) 50 in the upstream multistage unit section (TB) 44 of the first thermal processing section 26.

  In the first thermal processing unit 26, the substrate G is rotated in a predetermined unit by the transport mechanism 46 in a predetermined sequence. For example, the substrate G is first transferred from the pass unit (PASS) 50 to one of the heating units (DHP) 52 and 54, where it undergoes a dehydration process (step S4). Next, the substrate G is transferred to one of the cooling units (COL) 62 and 64, where it is cooled to a constant substrate temperature (step S5). Thereafter, the substrate G is transferred to an adhesion unit (AD) 56, where it is subjected to a hydrophobic treatment (step S6). After completion of the hydrophobic treatment, the substrate G is cooled to a constant substrate temperature by one of the cooling units (COL) 62 and 64 (step S7). Finally, the substrate G is moved to the pass unit (PASS) 60 belonging to the downstream multi-stage unit section (TB) 48.

  As described above, in the first thermal processing unit 26, the substrate G is interposed between the upstream multi-stage unit unit (TB) 44 and the downstream multi-stage unit unit (TB) 48 via the transport mechanism 46. You can come and go arbitrarily. The second and third thermal processing units 30 and 36 can perform the same substrate transfer operation.

  The substrate G that has undergone a series of thermal or thermal processing as described above in the first thermal processing section 26 is adjacent to the downstream side from the pass unit (PASS) 60 in the downstream multistage unit section (TB) 48. Is moved to a resist coating unit (CT) 82 of the coating process unit 28.

  The substrate G is coated with a resist solution on the upper surface (surface to be processed) by a resist coating unit (CT) 82, for example, by spin coating, and immediately after that, it is subjected to a drying process by a reduced pressure drying unit (VD) 84 adjacent to the downstream side. Then, the unnecessary (unnecessary) resist on the peripheral edge of the substrate is removed by the edge remover unit (ER) 86 adjacent to the downstream side (step S8).

  The substrate G that has undergone the resist coating process as described above is a pass unit (PASS) belonging to the upstream multi-stage unit section (TB) 88 of the second thermal processing section 30 adjacent to the edge remover unit (ER) 86. Is passed on.

  Within the second thermal processing unit 30, the substrate G is rotated through a predetermined unit by the transport mechanism 90 in a predetermined sequence. For example, the substrate G is first transferred from the pass unit (PASS) to one of the heating units (PREBAKE), where it is subjected to baking after resist coating (step S9). Next, the substrate G is transferred to one of the cooling units (COL), where it is cooled to a constant substrate temperature (step S10). Thereafter, the substrate G passes through the downstream side multistage unit (TB) 92 side pass unit (PASS) or without passing through the interface station (I / F) 18 side extension cooling stage (EXT COL). ) 108.

  In the interface station (I / F) 18, the substrate G is transferred from the extension / cooling stage (EXT / COL) 108 to the peripheral exposure device (EE) of the peripheral device 110, where the resist adhering to the peripheral portion of the substrate G is removed. After receiving an exposure for removal at the time of development, it is sent to the adjacent exposure apparatus 12 (step S11).

  In the exposure device 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Then, when the substrate G that has undergone pattern exposure is returned from the exposure apparatus 12 to the interface station (I / F) 18 (step S11), it is first carried into a titler (TITLER) of the peripheral device 110, where there is a predetermined on the substrate. Predetermined information is written in the part (step S12). Thereafter, the substrate G is returned to the extension / cooling stage (EXT / COL) 108. Transfer of the substrate G in the interface station (I / F) 18 and exchange of the substrate G with the exposure apparatus 12 is performed by the transfer device 104.

  In the process station (P / S) 16, the transport mechanism 90 receives the exposed substrate G from the extension / cooling stage (EXT / COL) 108 in the second thermal processing unit 30, and the multi-stage unit unit on the process line B side (TB) The image is transferred to the development process unit 32 via the pass unit (PASS) in 92.

  In the development process unit 32, the substrate G received from the pass unit (PASS) in the multi-stage unit unit (TB) 92 is carried into the development unit (DEV) 94. In the developing unit (DEV) 94, the substrate G is conveyed in a flat flow manner toward the downstream side of the process line B, and a series of development processing steps of development, rinsing, and drying are performed during the conveyance (step S13).

  The substrate G that has undergone the development process in the development process unit 32 is carried into the decolorization process unit 34 adjacent to the downstream side, where it undergoes a decolorization process by i-line irradiation (step S14). The substrate G that has been subjected to the decoloring process is transferred to the pass unit (PASS) in the upstream multistage unit section (TB) 98 of the third thermal processing section 36.

  In the third thermal processing section 36, the substrate G is first transferred from the pass unit (PASS) to one of the heating units (POBAKE), where it is subjected to post-baking (step S15). Next, the substrate G is transferred to a path cooling unit (PASS / COL) in the downstream multi-stage unit section (TB) 102, where it is cooled to a predetermined substrate temperature (step S16). The transport of the substrate G in the third thermal processing unit 36 is performed by the transport mechanism 100.

  On the cassette station (C / S) 14 side, the transport mechanism 22 receives and receives the substrate G that has completed all the steps of the coating and developing process from the pass cooling unit (PASS COL) of the third thermal processing unit 36. The substrate G is accommodated in any one cassette C (step S1).

  In the coating and developing processing system 10, the present invention can be applied to the developing unit (DEV) 94 of the developing process unit 32. Hereinafter, an embodiment in which the present invention is applied to a development unit (DEV) 94 will be described with reference to FIGS.

4 and 5 schematically show the overall configuration of the developing unit (DEV) 94 according to an embodiment of the present invention. The developing unit (DEV) 94 is continuously arranged plural e.g. ten modules M ₁ ~M ₁₀ in a line to form a continuous conveying path 112 extending in the horizontal direction (X direction) along the process line B Do it.

Among these modules M ₁ ~M _10, loading unit 114 is provided in the first module M ₁ located at the most upstream end. The second module M ₂ constitutes the introduction part 116. The third, fourth, and fifth modules M ₃ , M ₄ , and M ₅ are provided with a developing unit 118. The sixth module M ₆ is provided with a first rinse part 120, and the seventh module M ₇ is provided with a second rinse part 122. A drying unit 124 is provided in the _eighth module M ₈ . The ninth module M ₉ constitutes the sending unit 126. The last tenth module M ₁₀ is provided with a carry-out unit 128.

  The carry-in unit 114 has a plurality of lift pins 130 that can be moved up and down to receive a substrate G handed from an adjacent substrate transport mechanism (not shown) in a horizontal position and transfer it onto the transport path 112. The carry-out unit 128 also has a plurality of lift pins 132 that can be lifted and lowered to lift the substrate G in a horizontal posture and hand it over to an adjacent substrate transport mechanism (not shown).

The introduction unit 116 forms a buffer region between the carry-in unit 114 and the developing unit 118. By once conveyed at high speed from the loading section 114 to the developing unit 118 through the inlet 116 of each substrate G _i, is carried into the loading unit 114 after a time lapse of a preset tact time T _t (e.g. 60 seconds) A sufficient spatial separation (distance interval) can be ensured between the subsequent substrate G _{i + 1} coming. Further, even when the developer is scattered from the developing unit 118 to the upstream side of the conveyance, it stops at the introduction unit 116 and does not reach the carry-in unit 114 (does not contaminate).

More specifically, the developing unit 118 includes a first developer supply unit 134 and a second developer supply unit 136 in the modules M ₃ and M ₄ , respectively, and a liquid drain / rinse unit 138 in the module M ₅ . .

  The first developer supply unit 134 is used to supply (pile up) developer solution to the substrate G transported from the introduction unit 116 by a paddle method, and in the transport direction (X direction) above the transport path 112. One or a plurality of movable developer nozzles 140 are provided. In the illustrated example, the developer nozzle 140 is attached to a nozzle transport body 144 configured to be movable along a guide rail 142 extending in the transport direction, and the nozzle transport body 144 is transported in the transport direction by a drive mechanism (not shown). It is set as the structure moved to. A lifting mechanism (not shown) for moving the developer nozzle 140 up and down may be attached to the nozzle carrier 144.

  The second developer supply unit 136 is for additionally supplying or replenishing a new developer when the developer spills from the substrate G being transported, and above the transport path 112 at an appropriate position in the transport direction. One or a plurality of stationary type developer nozzles 146 are arranged.

  The developer nozzles 140 and 146 in each part have a long nozzle body that covers the substrate G from end to end in the left-right width direction (Y direction) of the transport path 112, and are formed in the nozzle body. The developer is discharged in a substantially strip shape or spray shape toward the substrate G on the transport path 112 from an infinite number of hole-shaped discharge ports or one or several slit-shaped discharge ports. If necessary, the developer nozzle 146 may be movable in the transport direction, or the second developer supply unit 136 may be omitted.

  The liquid draining / rinsing unit 138 is for removing the developing solution from the substrate G and stopping the development, and tilting the substrate G to tilt the substrate G backward or forward in the transport direction and to wash off the developing solution by gravity. A mechanism (not shown) and one or a plurality of rinse liquid nozzles 148 for spraying a rinse liquid onto the substrate G to wash away the developer are provided.

  In the illustrated example, the rinse liquid nozzle 148 is configured to be movable. More specifically, the rinsing liquid nozzle 148 is attached to the nozzle transport body 150 above the transport path 112, and the nozzle transport body 150 is moved along a guide rail 152 extending in the transport direction by a drive mechanism (not shown). It is configured. A lift mechanism (not shown) for moving the rinse liquid nozzle 148 up and down may be attached to the nozzle carrier 150. The rinsing liquid nozzle 148 has a long nozzle body that covers from the end to the end of the substrate G in the left-right width direction (Y direction) of the transport path 112, and has an infinite number of holes formed in the nozzle body. The rinsing liquid is discharged in a substantially strip shape or spray shape toward the substrate G on the transport path 112 from the discharge port or one or several slit-shaped discharge ports.

  The first rinsing section 120 and the second rinsing section 122 are for fully removing the developer, foreign matter, dirt, etc. from the substrate G, and are respectively long rinsing liquid nozzles 154 at appropriate positions in the transport direction. , 156 are arranged in a horizontal manner. Preferably, the rinse liquid nozzles 154 and 156 may be arranged above and below the conveyance path 112 so as to clean not only the upper surface (device formation surface) but also the lower surface or the back surface of the substrate G. The configuration of each of the rinse liquid nozzles 154 and 156 may be the same as or different from that of the rinse liquid nozzle 148.

  The drying unit 124 is for drying the substrate surface by wiping off the rinse liquid adhering to the substrate G after the rinsing process with a gas flow (for example, air), and is long at an appropriate position along the transport path 112. One or a plurality of air knives 158 are arranged horizontally. The air knives 158 may also be arranged above and below the conveyance path 112 so as to apply a gas flow to both the upper and lower surfaces of the substrate G. Preferably, as shown in FIG. 5, the air knife 158 is disposed so as to be inclined at an appropriate angle in the width direction (Y direction) of the transport path 112 so as to cover the substrate G from end to end. By such an oblique arrangement of the air knife 158, the rinse liquid adhering to the surface of the substrate G can be collected at the corners on the rear end side of the substrate and efficiently blown off.

The delivery unit 126 forms a buffer area between the drying unit 124 and the carry-out unit 128. By once conveyed at high speed substrate G _i which has received a series of development processing as described above from the sending unit 126 to unloading unit 128, and the substrate G _i to pause in the conveying direction for unloading at the unloading unit 128 A sufficient spatial separation (distance interval) can be ensured between the substrate G _{i + 1} and the subsequent development process after finishing the tact time T _t .

  As shown in FIG. 4, the developing unit 118 and the rinsing units 120 and 122 are provided with pans 160 and 162 for collecting liquid that has fallen under the conveyance path 112, respectively. Drainage pipes 164 and 166 are connected to drainage openings provided at the bottoms of these pans 160 and 162, respectively. The drainage pipe 164 on the developing unit 118 side communicates with a developer circulation reuse system (not shown). The drainage pipes 166 on the side of the rinse sections 120 and 122 communicate with a waste liquid treatment section (not shown).

  In the illustrated example, the boundary between the pan 160 on the developing unit 118 side and the pan 162 on the rinsing units 120 and 122 side is set below the liquid draining / rinsing unit 138 of the developing unit 118. In the vicinity of this boundary portion, the developer or rinse liquid falling from the inclined substrate G by the liquid draining / rinsing portion 138 is selectively directed to the pan 160 and the rinse liquid to the pan 162, respectively. A drainage distribution means (not shown) is provided.

  FIG. 6 schematically shows a configuration of a flat flow conveying mechanism in the developing unit (DEV) 94. In the transport path 112, transport rollers or rollers 170 on which the substrate G can be placed substantially horizontally are laid at regular intervals along the process line B (FIG. 4).

In this embodiment, the roller 170 on the conveyance path 112 is divided into a plurality of sections for each of the modules M _{1 to} M ₁₀ , for example, and is driven independently for each section. More specifically, the rollers 170 belonging to the sections of the modules M _n (n = 1 to 10) are drivingly connected to the individual transport driving units 174 (n) via the individual transmission mechanisms 172 (n). . Each conveyance drive unit 174 (n) has, for example, an electric motor as a drive source. The roller 170 is rotated through the transmission mechanism 172 (n) by the driving force of the electric motor, and is substantially horizontal on the conveyance path 112. The substrate G in the posture is moved in the direction of the process line B by roller conveyance.

  The transfer control unit 176 is composed of, for example, a microcomputer, and individually controls the transfer drive units 174 (1) to 174 (10) in all sections in order to control each unit on the transfer path 112 and the entire substrate transfer operation. Give a signal. In order to increase the accuracy of the conveyance control, preferably, at least one sensor (not shown) for detecting the position of the substrate G on the conveyance path 112 is provided, and the output of each sensor is connected to the conveyance control unit 176. Has been. Further, the transport control unit 176 is also connected to the host computer 180 (FIG. 12) as a controller.

Next, a series of processing steps carried out in the developing unit (DEV) 94 with respect to one substrate G _i in the order of processes.

[Step 1]
Loading unit 114 receives in substantially horizontal lift pins 130 of the substrate G _i from the adjacent substrate transfer mechanism (not shown) and then onto the conveying path 112 of the substrate G _i to lower the lift pins 130, i.e. the module M ₁ in the Transfer onto the roller 170. During this loading operation, the substrate G _i is stopped for a certain position by (lift pin 130 above) in a preset time that is carried time T ₁ (e.g. 15 seconds) Pauses in the conveying direction.

[Step 2]
When the substrate G _i on the transport path 112 is transferred, the module M _1, M _2, the transport mechanism of M _3, immediately substrate G _i is fed to the conveying downstream, first moving speed V which is set in advance ₁ (for example, 200 mm / s), the sheet is conveyed to the developing unit 118 through the introduction unit 116. When the substrate G _i is loaded into the first developer supply portion 134 of the developing unit 118, the transport mechanism of the module M ₃ stops the conveyance of the substrate G _i.

[Step 3]
In the first developer supply unit 134, the developer nozzle 140 is moved at a predetermined speed in the transport direction or in the opposite direction during a predetermined stop time, that is, a liquid build-up time T ₂ (for example, 13.2 seconds). while moved by ejecting a developing solution, applying a developing solution to the entire upper surface of the substrate G _i (to puddle). At this time, the developing solution spilled from the substrate G _i is collected received in the developer pan 160 is installed below the conveying path 112. Incidentally, the developer nozzle 140 to recoating the developer on the substrate G _i may be one or more times back and forth scan can be set to any scanning pattern recipe.

[Step 4]
When the liquid accumulation time T ₂ elapses in the first developer supply unit 134, the substrate G _i is immediately sent to the downstream side of the transfer by the transfer mechanism of the modules M ₃ , M ₄ , and M ₅ , and the preset second time is set. It is conveyed to the liquid drain / rinse section 138 at a moving speed V ₂ (for example, 50.5 mm / s). In the middle, when passing through the second developer supply unit 136, the developer is supplied to the moving substrate G from the developer nozzle 146. When the substrate G _i is loaded into the drainer / rinsing section 138, the transport mechanism of the module M ₅ stops movement of the substrate G _i.

[Step 5]
In the liquid drain / rinse unit 138, development stop processing is performed during a predetermined stop time, that is, a liquid drain time T ₃ (for example, 20.2 seconds). First, the substrate inclining mechanism is actuated to convert the substrate G _i from the horizontal position to the inclined position, dropping flowing developing solution on the substrate G _i by gravity. Developer flowing down from the substrate G _i is recovered in the developer pan 160 side by the drainage distributing means. On the other hand, at an appropriate timing, preferably almost at the same time when the inclination angle of the substrate G _i reaches the set value, the substrate G _{i in the} inclined state is moved while moving the rinse liquid nozzle 148 at a predetermined speed in the transport direction or in the opposite direction. supplying a rinsing liquid from the top toward the to replace the liquid on the substrate G _i the rinsing solution. At this time, the rinse liquid that has flowed down from the substrate G is collected on the rinse liquid pan 162 side by the drainage distribution means. Finally, the substrate inclining mechanism returns to the horizontal position of the substrate G _i from the inclined posture.

Incidentally, the time from the start of the puddle of the developing solution on the substrate G _i in the first developer supply unit 134 to the start of draining the liquid cutting / rinsing unit 138 and the developing time T _g, the developing time T _{g is} also set in advance.

[Step 6]
When the liquid cutting time T ₃ has elapsed at drainer / rinsing section 138, module M5, the transfer mechanism M _6, the substrate G _i is immediately fed to the conveyance downstream side, and the third movement speed V ₃ which is set in advance ( For example, it is conveyed to the adjacent first rinse section 120 at 50.5 mm / s). In this embodiment, as described later, the substrate G _i is lower preset than the third moving velocity V ₃ conveyance mechanism moving speed of the module M ₆ while passing through the first rinse section 120 Decelerate to the fourth moving speed V ₄ (for example, 36.7 mm / s). In the first rinse section 120, by spraying a rinsing liquid from the rinse liquid nozzle 154 on the upper and lower surfaces of the substrate G _i moving on a transfer path 112, wash off the developer remaining or adhered to the substrate G _i. At this time, the rinsing liquid flowing down from the substrate G _i is collected received in the rinsing liquid pan 162.

[Step 7]
Even after the substrate G _i leaves the module M ₆ , the substrate G _i passes through the second rinse unit 122 and the drying unit 124 at the fourth moving speed V ₄ by the transport mechanism of the modules M ₇ , M ₈ , and M _9. Then, it is conveyed to the sending section 126. Even second rinse section 122 performs a rinsing process similar to the above with respect to the substrate G _i moving on a transfer path 112. However, since the moving speed V ₄ of the substrate G is relatively slow, the finish cleaning can be performed more carefully than the first rinse section 120. In the drying unit 124, a liquid (mainly a rinsing liquid) attached to the substrate G _i by applying a knife-like sharp gas flow from the air knife 158 to the upper and lower surfaces of the substrate G _i moving on the transport path 112. To the back of the board. Again, since the moving speed V ₄ of the substrate G _i is set to be slow, the substrate surface can be thoroughly dried by applying a large amount of the gas flow to the substrate G _i .

[Step 8]
When the substrate G _i arrives at the delivery unit 126, the transfer mechanism of the modules M ₉ and M ₁₀ changes the moving speed of the substrate G _i from the fourth moving speed V ₄ up to the fifth moving speed V set in advance. ₅ (e.g. 200 mm / s) is switched on, once sending the substrate G _i to next unloading unit 128.

[Step 9]
In the carry-out unit 128, when the substrate G _i arrives, the lift pins 132 that have been waiting under the transfer path 112 are pushed upward to lift the substrate G _i in a horizontal posture and pass it to the next substrate transfer mechanism (not shown). . During this unloading operation, the substrate G _i stays or pauses at a predetermined position in the transfer direction (on the lift pins 132) for a predetermined time, ie, unloading time T ₄ (for example, 15 seconds).

In this developing unit (DEV) 94, a series of processing processes of the flat flow type as described above are carried out in a pipeline manner with a large number of substrates at a time interval of tact time T _t , G _i , G _{i + 1} , G _i. Repeated for ₊₂ ,. What is required here is to optimize the processing contents in the process processing section at each stage without causing a collision (recursion) between the substrates G _i and G _{i + 1} that are in succession on the transport path 112, and the entire system. Is to maximize the throughput.

In FIG. 7, in the developing unit (DEV) 94, when one substrate G _i receives the above-described series of processing steps (Steps 1 to 9), the trajectory that moves on the conveyance path 112 is shown as the front end position and the rear end of the substrate G _i. It is indicated by the end position. In the figure, the same locus is indicated by a dotted line for the subsequent substrate G _{i + 1} . The transport distance J from the carry-in position (start point) to the carry-out position (end point position) is also set to a predetermined value (for example, 16900 mm).

As described above, in step 1, the substrate G _i pauses only the conveying direction carry time T ₁ at loading unit 114 (e.g., 15 seconds). In Step 2, the substrate G _i are moved in the loading section first fast 114 through the inlet 116 from to the first developing solution supply unit 134 movement speed V ₁ (for example 200 mm / s). In Step 3, the substrate G _i is a puddle time T ₂ (e.g. 13.2 seconds) pause or stay in the first developer supplying section 134. In Step 4, to move the substrate G _i is first developer supply unit 134 from the drainer / rinsing unit second medium speed to 138 movement speed V ₂ (e.g. 50.5 mm / s). In step 5, the substrate G _i is temporarily stopped or stays at the liquid drain / rinse section 138 for the liquid drain time T ₃ (for example, 20.5 seconds). In step 6, the substrate G _i moves from the liquid draining / rinsing unit 138 to the first rinsing unit 120 at a medium third speed V ₃ (for example, 50.5 mm / s) and passes through the first rinsing unit 120. At this time, the moving speed is changed from the third moving speed V ₃ to the lower fourth moving speed V ₄ (for example, 36.7 mm / s). In step 7, the substrate G _i moves through the second rinse unit 122 and the drying unit 124 to the delivery unit 126 at the fourth movement speed V ₄ . In Step 8, the substrate G _i is a fast moving of the fifth moving speed V ₅ from the delivery unit 126 to unloading unit 128 (e.g. 200 mm / s). Finally, in step 9, the substrate G _i is unloaded from the paused just conveying direction out time T ₄ by the unloading unit 128 (e.g., 15 seconds) to the outside of the developing unit (DEV) 94.

In the transport sequence of this example, the longest stop time is the liquid draining time T ₃ (20.5 seconds) in the liquid draining / rinsing unit 138, and the lowest moving speed is the first one from the first rinse unit 120 to the delivery unit 126. 4 The moving speed is V ₄ (36.7 mm / s).

In this embodiment, there are many scenes to change the conveying speed or pause the substrate G _i at various locations on the conveying path 112 in accordance with the processing content of each process section, and has a relatively complicated transfer sequence . The problem here is that the length size (eg, 1200 mm) of the substrate G _i with respect to the moving speed in the transport direction is large, so that there is a considerable difference in moving time between the front end position and the rear end position of the substrate G _i ( 20 seconds when the moving speed is 40 mm / s), and another substrate G _{i + 1} continues on the same transport path 112 after a tact time T _t (for example, 60 seconds). If the conveyance speed is set incorrectly, there is a possibility that the substrate G _{i + 1} that comes later will collide with the substrate G _i that is stopped or decelerated.

As shown in FIG. 7, in the exemplary embodiment, the lowest fourth moving from the substrate G _i third moving speed V ₃ of the medium-speed movement speed (e.g. 50.5 mm / s) in the first rinse section 120 in Atari immediately after switching to the speed V ₄ (36.7mm / s), approaching the front end of the substrate G _{i + 1} immediately after the rear end of the substrate G _i, but the safety zone is conveying speed in accordance with the present invention Because it is controlled, it does not lead to a rear-end collision.

  Here, with reference to FIGS. 8 to 11, the basic principle of the present invention relating to the substrate transport speed in the flat flow method will be described.

[Basic Principle 1]
Assuming that the length of the substrate G in the transport direction is D and the substrate G is loaded on the transport path 112 at a time interval of tact time T _t , according to the first basic principle of the present invention, When the substrate G is transported by continuous movement without stopping, the minimum movement speed for avoiding a rear-end collision, that is, the lower limit movement speed V _low is given by the following equation (1).
V _low = D / T _t (1)

The first basic principle will be described with reference to FIG. Now, subsequent the substrate G _i in the movement is to be located at an arbitrary position P _a at time t _a, the time t _c after the elapse of the cycle time T _t from the time point t _a on the conveying path 112 since the substrate G _{i + 1} of comes moved to this position P _a, the substrate G _i between time t _c from the time point t _a is when moved forward by a distance of at least the substrate length D, and the position P _a It is possible to avoid a rear-end collision with the substrate G _{i + 1} . Therefore, the lower limit moving speed V _{low for satisfying} this condition is given by the above equation (1) as the speed of moving by the distance of the substrate length D during the tact time T _t .

However, in an ordinary flat flow system, in order to avoid the possibility of a rear-end collision as much as possible, an appropriate minimum substrate interval d is set on the transport path 112, and the subsequent substrate G _{i + 1} is set to the minimum substrate interval on the previous substrate G _i. It is kept away from d. In this case, as shown in FIG. 9, the length D ′ (D + d) obtained by adding the minimum substrate distance d to the actual substrate length D may be regarded as the substrate length on conveyance, and instead of the above equation (1) The following formula (2) may be used.
V _low = (D + d) / T _t (2)

[Basic Principle 2]
According to the second basic principle of the present invention, when the substrate G is temporarily stopped on the transport path 112 for an arbitrary time T _s , the lower limit moving speed V _low for avoiding a rear-end collision is expressed by the following equation (3). Is done.
V _low = (D + d) / (T _t −T _s ) (3)

FIG. 10 shows the minimum speed condition after the temporary stop. In order to simplify the description, the minimum substrate interval d is set to zero (d = 0). Now, it is assumed that the substrate G _i arrived at t _a at an arbitrary position P _a on the conveying path 112. When subsequent substrate G _{i + 1} is the time t _c that the course of the time t _a from the tact time T _t has come to move to the position P _a, from time t _a to time t _b after stopping time T _s since the substrate G _i is stopped at the position P _a, moving the substrate G _i during the remaining time from t _b until the time _{t c} (T t -T _s) is forward by a distance of at least the substrate length D if, it is possible to avoid collision with a subsequent substrate G _{i + 1} leaving the stop position P _a. Therefore, the lower limit moving speed V _{low for satisfying} this condition is a speed that moves by the distance of the substrate length D during the time (T _t −T _s ) obtained by subtracting the stop time T _s from the tact time T _t . It is given by the above equation (3).

FIG. 11 shows the minimum speed condition before the temporary stop. Similarly to the above, in order to simplify the description, the minimum substrate distance d is set to zero (d = 0). Now, at time t _a, the substrate G _i being moved on the conveying path 112 is located at a position P _a earlier by the substrate length D than the stop position P _b (upstream side). Since subsequent substrate G _{i + 1} at time t _c after the elapse of the cycle time T _t from the time point t _a arrives at the position P _a, the substrate G _i at this time of the substrate length D of at least the position P _a distance if moved to the front position that is the stop position P _b, it can be avoided collision. However, in this case, the substrate G _i crushes only time period T _s at the stop position P _b (stopped) because, at the latest from the time t _a arrives at the stop position P _b up to the time t _b the start stop Must be. Therefore, the lower limit moving speed V _{low for satisfying} this condition is a speed that moves by the distance of the substrate length D during the time (T _t −T _s ) obtained by subtracting the stop time T _s from the tact time T _t . It is also given by the above equation (3).

[Basic Principle 3]
According to the third basic principle of the present invention, the stop time T _s when the substrate G is temporarily stopped on the transport path 112 must be shorter than the tact time T _t . This principle is also derived from the above equation (3). That is, the lower limit moving speed V _low increases as the stop time T _s becomes longer, and when T _s approaches T _t , V _low becomes so large that it cannot be realized.

  FIG. 12 shows the configuration of the control system in this embodiment. The input unit 178 is composed of, for example, an operation panel having a keyboard, a display, and the like, and inputs various setting values related to attributes (particularly size) of the substrate G and processing conditions. The host computer 180 stores the input condition setting value and the condition setting value obtained by a predetermined calculation process and other recipe information in a built-in memory, and the developing unit (DEV) according to the predetermined program and the condition setting value or recipe information. ) Centrally controls the operation of each process processing unit in 94, particularly the operation of the carry-in unit 114, the first developer supply unit 134,. FIG. 13 shows an example of condition setting values in this embodiment.

In the flat flow system of this embodiment, the substrate G is temporarily stopped at least once on the transfer path 112 as described above, and therefore the second basic principle of the present invention is applied. In this case, the lower limit moving speed V _low obtained from the longest stop time T _s among a plurality of pauses governs the minimum speed condition of the entire system. In the above-described example (FIG. 13), temporary stop is performed at four locations of the carry-in unit 114, the first developer supply unit 134, the liquid drain / rinse unit 138, and the carry-out unit 128, and the maximum stop time T _s among them. Is a liquid draining time T ₃ (20.5 seconds) in the liquid draining / rinsing unit 138. Therefore, the lower limit moving speed V _low is obtained as follows from the above equation (3).
V _low = (D + d) / (T _t −T _s )
= (1250 + 20) / (60-20.5)
= 36.7 (mm / s) (4)

The value of the lower limit moving speed V _low (36.7 mm / s) is equal to the set value of the fourth moving speed V ₄ when moving the substrate G from the first rinse section 120 to the delivery section 126. That is, the fourth moving speed V ₄ almost satisfies the requirements of the second basic principle of the present invention. Therefore, even if the front end of the substrate G _{i + 1} to the rear end of the substrate G _i in the first rinse section 120 near the above is approaching, the approach distance is the minimum distance between the substrates d (20mm / s) It will never get smaller.

By the way, among the processing conditions in the developing unit (DEV) 94, the developing time _Tg is the condition that most affects the specifications or quality of the developing process, and frequently and widely depending on the type of developer and the number of recycling times. It is also a condition to be changed. The developing time The T _g, as described above in the description of step 5, for example, the first developer supplying portion 134 liquid from the start of the puddle of the developing solution on the substrate G _i in cutting / rinsing section 138 The time until the start of draining can be used. Therefore, when the set value of the developing time T _g is given, the temporary set value V _D of the moving speed, that the second moving speed V ₂ during development is determined from the following equation (5).
V _D = L / (T _g −T ₂ ) (5)

Here, T ₂ is the above-described liquid build-up time, and L is the distance that the substrate G moves from the liquid build-up stop position of the first developer supply unit 134 to the liquid cut-off stop position of the liquid drain / rinse unit 138.

In this developing unit (DEV) 94, when the moving distance L is assumed to be 2868mm example, in the setting example of FIG. 13, the developing time T _g is 60 seconds, because a puddle time T ₂ is 13.2 seconds, The temporary setting value V _D of the second moving speed V ₂ obtained from the above equation (5) is as follows.
V _D = 2363 / (60-13.2)
= 50.5mm / s (6)

The temporary set value V _D of the second movement speed V ₂ is larger than the lower limit movement speed V _low (36.7 mm / s) and satisfies the requirement of the second basic principle of the present invention. Therefore, the temporary setting value V _D may be registered as a normal setting value in the host computer 180 and used for actual conveyance control.

However, the longer the development time T _g, for example set to 78 seconds, the above equation (3) provisionally set value of the second moving speed V ₂ which is obtained from V _D is lower moving speed V becomes 36.5 mm / s It becomes lower than _low (36.7 mm / s), and the requirement of the second basic principle of the present invention is not satisfied. In this case, the host computer 180 warns that this set value V _D is inappropriate through the display and requests resetting of the developing time T _g , or develops time T corresponding to the lower limit moving speed V _{low. In other} words, an interlock may be applied so as not to accept an input value exceeding the upper limit developing time that satisfies the condition of the second basic principle of the present invention. Of course, the value of the upper limit development time may be displayed and output. As for the puddle time T _2, it is possible to perform the same setting input process as described above.

As described above, in this embodiment, a plurality of substrates to be processed on the transport path 112, including G _i , G _{i + 1} ,... Including at least one temporary stop at a desired tact time T _t. In the development unit (DEV) 94 that sequentially conveys and performs a series of development processing steps on the substrate G that is stopped or moving on the conveyance path 112, the tact time T _t and the stop time during which the substrate G is temporarily stopped The lower limit moving speed V _low of the substrate G is determined based on the maximum stop time T _s of the substrate, the length D of the substrate in the transport direction, and the desired minimum substrate distance d in the transport direction. Set the moving speed to a speed equal to or higher than the lower limit moving speed V _low . According to such conveyance speed control, desired values are obtained from the viewpoints of workpiece (substrate) specifications, throughput, footprint, and the like for each condition of the substrate length D, tact time T _t , minimum substrate interval d, and maximum stop time T _s. When set, the substrate G is moved at an appropriate speed according to the set values, and a rear-end collision between the adjacent substrates G _i and G _{i + 1} can be surely prevented.

Further, based on the development time T _g , the liquid build-up time T ₂ (developer supply time T _a ), and the movement distance L during development, a temporary setting value V _D of the movement speed during development, that is, the second movement speed V ₂ is obtained. Thus, when the temporary setting value V _D is equal to or higher than the lower limit moving speed V _low , this is adopted as the normal setting value, so that the desired development can be performed under the substrate moving speed that can avoid the substrate rear-end collision accident. Processing quality can be obtained.

Next, a mechanism and a transport control method for safely and efficiently decelerating the moving speed of the substrate G in this embodiment will be described. As described above, the developing unit (DEV) 94 in the module M conveying mechanism ₆ moving speed third moving velocity V ₃ while the substrate G _i passes through a first rinse section 120 (50.5mm / s) To 4th moving speed V ₄ (36.7 mm / s). At that time, not only the substrate G _{i + 1} subsequent to the substrate G _i to avoid the collision, both substrates G _i, gives the setting movement speed corresponding to each movement position on the G i _{+ 1} There must be. When the moving speed (V ₄ ) after deceleration decreases to near the lower limit moving speed V _low and the minimum substrate distance d is small, both the substrates G _i and G _{i + 1} move close to each other. _It becomes very difficult to simultaneously give _i and G _{i + 1} different moving speeds. In this embodiment, this problem is solved as shown in FIGS.

As shown in FIG. 14, in order to switch the speed of deceleration, the transport section of the module M ₆ provided with the first rinse section 120 is divided into two sections, a front section M _6a and a rear section M _6a in the transport direction. The rollers 170 belonging to both the transport sections M _6a and M _6b have the mechanism shown in FIG. 6 and are respectively transported by individual transport driving units 174 (6a) and 174 (6b) via the individual transmission mechanisms 172 (6a) and 172 (6b). It is connected to the. Preferably, the length obtained by adding both transport sections M _6a and M _6b in the transport direction, that is, the section length of the module M ₆ may be substantially the same as the substrate length D. The section lengths E _a and E _{b of the} transport sections M _6a and M _6b and the boundary position H between both sections will be described in detail later with reference to FIG.

A speed switching control method for deceleration in this embodiment will be described with reference to FIG. As shown in FIG. 14A, the substrate G _i enters the section of the module M6 at the transport speed V ₃ from the predetermined position (liquid drain stop position) P ₅ in the section of the module M ₅ on the transport path 112. come. At this time, the transport mechanism of the front section M _6a and subsequent sections M _6b of the module M _6, as shown in FIG. 14 (A), the conveying speed each section M _6a, the substrate G _i coming into M _6b sequentially greet at V _3. Thus, the substrate G _i moves at the transport speed V ₃ until it completely enters the section of the module M ₆ (M _6a , M _6b ). Then, almost as soon as the entire substrate G _i completely enters the section of the module M ₆ (M _6a , M _6b ), as shown in FIG. 14C, the transport in both transport sections M _6a , M _6b . The mechanism simultaneously switches the conveyance speed from the previous conveyance speed V ₃ to the low conveyance speed V ₄ . On the other hand, in the section of the module M ₇ , the transport speed in this section is kept at the transport speed V ₄ at this time or regularly at the latest. Thus, the module M ₆ by (M _6a, M _6b), the transport mechanism of M _7, is fed to the section of the module M ₇ at the conveying speed V ₄ from the substrate G _i is the module _{M 6 (M 6a, M 6b} ) .

Then, as shown in FIG. 14D, when the rear end of the substrate G _i exits the preceding section M _6a of the module M ₆ , the transport speed of the preceding section M _6a is changed from the transport speed V _{4 at} this time or immediately after. The transfer speed is switched to V ₃ . Thus, as shown in FIG. _14E , the subsequent substrate G _{i + 1} entering the preceding section M _6a of the module M ₆ from the section of the module M ₅ is transferred in the same manner as the previous substrate G _i. it can be welcome at a speed V _3. On the other hand, when the rear end of the substrate G _i exits the rear section M _6b of the module M ₆ , the transport speed of the rear section M _6b is switched from the fourth transport speed V ₄ to the third transport speed V ₃ at this time or immediately after. . As a result, as shown in FIG. _14E , the subsequent third substrate G _{i + 1} entering the subsequent segment M _6b from the preceding segment M _6a of the module M6 is transferred to the same third transport as the previous substrate G _i . it can be welcome at a speed V _3. Thereafter also, the same operation as for the previous substrate G _i is repeated in each unit.

As described above, in this embodiment, the transport section of the module M ₆ set to a section length substantially equal to the substrate length D is _divided into two sections, a front section M _6a and a rear section M _6b , in which speed control can be independently performed in the transport direction. By dividing and selectively switching the transport speeds of both sections M _6a and M _6b to either the third transport speed V ₃ or the fourth transport speed V _{4 at} a predetermined timing, respectively, it is efficient with a minimum transport space. It is possible to reduce the substrate transport speed to a desired value that is equal to or higher than the lower limit movement speed V _low well and without a collision.

Such upon speed control deceleration, both sections M _6a, one (usually front section M _6a) the the midst of sending a substrate G _i before in the fourth moving velocity V ₄ section M _6b It is necessary to avoid a situation where the subsequent substrate G _{i + 1} enters at the third movement speed V ₃ , that is, the simultaneous loading. Such time a situation of simultaneous rode occurs such, the subsequent substrates G _{i + 1} is the substrate front part at the same time the substrate rear is conveyed by the fourth moving velocity V ₄ is conveyed at the third traveling speed V ₃ Therefore, stable roller conveyance cannot be performed. In this embodiment, the above problem is solved by setting the boundary position H between the preceding section M _6a and the succeeding section M _6b in the module M ₆ as follows.

That is, as shown in FIG. 15, the substrate from the rear end while the substrate G _i is wholly contained within the section of the module M ₆ moves in the fourth moving velocity V ₄ exits from the preceding section M _6a modules M ₆ It is sufficient that the subsequent substrate G _{i + 1} does not yet enter the preceding section M _6a . The most severe situation where this condition is satisfied is that the fourth movement speed V ₄ after deceleration is substantially equal to the lower limit movement speed V _low , and the third movement speed V ₃ before deceleration is slightly higher than the fourth movement speed V _4. Is the case. In this case, the rear end of the substrate G _i exits from the preceding section M _6a at the fourth moving speed V ₄ , and at the same time, the front end of the substrate G _{i + 1} moves at the third moving speed V ₃ across the minimum substrate interval d. Since the section M _6a is entered, at this moment, the transport speed of the preceding section M _6a may be switched from the fourth movement speed V ₄ to the third movement speed V ₃ . The rear end position of the substrate G _i at this time is the movement of the substrate G _i approximately equal to the lower limit moving speed V _low from the current position of the subsequent substrate G _{i + 1} , that is, the substrate stop position P ₅ in the section of the module M _5. It can be obtained as the rear end position of the substrate G _i at the time of moving over the tact time T _{t by} speed, and this position can be determined as the boundary position H between both sections M _6a and M _6b . In the case of the above setting example, since the substrate length D = 1250 mm, the minimum substrate distance d = 20 mm, the tact time T _t = 60 seconds, and the lower limit moving speed V _low = 36.7 mm / s, the preceding section M of the module M ₆ The section lengths E _a and E _b of _6a and the rear section M _6b are determined as E _a = 932 mm and E _b = 318 mm.

  The configuration of each unit in the development unit (DEV) 92 according to the above-described embodiment is an example, and various modifications can be made to each process processing unit such as a developer supply unit, a rinse unit, and a drying unit. In the above-described embodiment, the conveyance path 112 is configured as a roller conveyance type. However, the conveyance path 112 may be configured as a belt conveyance type in which a pair of belts are laid in a horizontal direction with a certain interval therebetween.

  Although the above-described embodiment relates to the development unit or the development processing apparatus, the present invention can also be applied to a substrate processing apparatus other than the development processing apparatus. For example, in the coating development processing system as described above, scrubber cleaning is performed. The present invention can also be applied to a flat flow device of the unit (SCR) 42. The substrate to be processed in the present invention is not limited to an LCD substrate, and various substrates for flat panel displays, semiconductor wafers, CD substrates, glass substrates, photomasks, printed substrates, and the like are also possible.

It is a top view which shows the structure of the application | coating development processing system which can apply this invention. It is a side view which shows the structure of the thermal process part in the said application | coating development processing system. It is a flowchart which shows the process sequence in the said application | coating development processing system. It is a front view which shows the whole structure of the image development unit in the said application | coating development processing system. It is a top view which shows the whole structure of the said developing unit. It is a figure which shows typically the structure of the conveyance mechanism in the said developing unit. It is a figure which shows the locus | trajectory in which the one board | substrate moves on a conveyance path in the said developing unit. It is a figure for demonstrating the 1st basic principle regarding the conveyance speed of a board | substrate. It is a figure which shows the example which sets the minimum board | substrate space | interval between the board | substrates which follow each other on a conveyance path. It is a figure for demonstrating the 2nd basic principle (movement speed conditions after a temporary stop) regarding the conveyance speed of a board | substrate. It is a figure for demonstrating the said 2nd basic principle (movement speed conditions before a temporary stop). It is a top view which shows the system configuration | structure of the control system in the image development unit of embodiment. It is a figure which shows the example of a setting of the various setting conditions in the image development unit of embodiment. It is a figure for demonstrating the speed switching control of the deceleration in embodiment. It is a figure which shows the setting method of a deceleration area.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Application | coating development system 16 (P / S) Process station 94 (DEV) Development unit 114 Carry-in part 116 Introduction part 118 Development part 120 1st rinse part 122 2nd rinse part 124 Drying part 126 Delivery part 128 Carry-out part 134 1st Developer supply part 136 Second developer supply part 138 Liquid draining / rinsing part 140,146 Developer nozzle 148,154,156 Rinse liquid nozzle
158 Air knife 170 Roller 172 Transmission mechanism 174 Transport drive unit 176 Transport control unit 178 Input unit 180 Host computer

Claims (12)

A development processing method of sequentially transporting a plurality of substrates to be processed on a transport path at a desired tact time (T _t ), including at least one pause, and developing the substrate on the transport path in the middle of transport. There,
A developer supply step of temporarily stopping the substrate at a first stop position on the transport path and supplying the developer to the substrate;
A substrate transfer step of moving the substrate at a first speed from the first stop position to a second stop position that is a predetermined distance away from the first stop position on the transfer path;
A development stopping step of substantially stopping the development by substantially removing the developer from the substrate at the second stop position;
Based on the takt time (T _t ), the maximum stop time (T _s ) during which the substrate is temporarily stopped, the length size (D) in the transport direction of the substrate, and the desired minimum substrate interval (d) in the transport direction. A lower limit moving speed determining step for determining a lower limit moving speed (V _low ) of the substrate;
Development giving a desired set value for the development time (T _g ) from the start of supply of the developer to the substrate at the first stop position on the transport path until development is stopped at the second stop position A time setting process;
Developer supply time (T _s ) from the start of the supply of the developer to the substrate at the first stop position on the transport path to the start of the movement of the substrate toward the second stop position A developer supply time setting step for giving a desired set value for,
Based on the development time setting value (T _g ), the developer supply time setting value (T _a ), and the moving distance (L) from the first stop position to the second stop position, A temporary speed setting value calculating step for obtaining a temporary speed setting value (V _D );
A speed setting value determining step for comparing the first temporarily set value of the first speed with the lower limit moving speed (V _low ) and setting a normal set value when the lower limit moving speed (V _low ) is exceeded; Method. The development processing method according to claim 1, wherein the lower limit moving speed (V _low ) is obtained by the following formula (1).
V _low = (D + d) / (T _t −T _s ) (1) The development processing method according to claim 1, wherein the temporary setting value (V _D ) of the first speed is obtained by the following formula (2).
V _D = L / (T _D −T _a ) (2)   The developer supplying step includes a step of supplying a developer from a first nozzle that moves at a predetermined speed along the transport path to the substrate that is stopped at the first stop position. The development processing method as described in any one of 1-3.   5. The development processing according to claim 1, wherein the development stopping step includes a substrate tilting step of tilting the substrate at the second stop position and causing the developer to flow off from the substrate by gravity. Method.   2. The development stopping step includes a step of supplying a rinsing liquid from a second nozzle that moves at a predetermined speed along the transport path to the substrate that is stopped at the second stop position. The development processing method as described in any one of -5. A transport path formed by horizontally laying a transport body for transporting the substrate to be processed substantially horizontally;
Transport driving means for driving the transport body to move the substrate on the transport path;
A substrate carry-in section for carrying the substrate onto the transfer path at a predetermined tact time (T _t );
A developer supply unit that temporarily stops the substrate at a first stop position on the transport path and supplies the developer to the substrate;
A substrate transport section that moves the substrate at a first speed from the first stop position to a second stop position that is a predetermined distance away from the first stop position on the transport path;
A development stop unit that stops the development by substantially removing the developer from the substrate at the second stop position;
A substrate unloading section for unloading the processed substrate from the transport path;
Stop means for temporarily stopping the substrate for a predetermined stop time at one or a plurality of stop positions set on the transport path;
Based on the tact time (T _t ), the maximum stop time (T _S ) for stopping the substrate, the length size (D) in the transport direction of the substrate, and the desired minimum substrate interval (d) in the transport direction. A lower limit moving speed calculating means for obtaining a lower limit moving speed (V _low ) of the substrate;
Development giving a desired set value for the development time (T _g ) from the start of supply of the developer to the substrate at the first stop position on the transport path until development is stopped at the second stop position Time setting means;
Developer supply time (T _s ) from the start of the supply of the developer to the substrate at the first stop position on the transport path to the start of the movement of the substrate toward the second stop position A developer supply time setting means for giving a desired set value with respect to
Based on the development time setting value (T _g ), the developer supply time setting value (T _a ), and the moving distance (L) from the first stop position to the second stop position, A temporary speed setting value calculating means for obtaining a temporary speed setting value (V _D );
Development processing comprising: a speed setting value determining unit that compares the temporary setting value of the first speed with the lower limit moving speed (V _low ) and sets a normal setting value when the lower limit moving speed (V _low ) is exceeded. apparatus. The developing processing apparatus according to claim 7, wherein the lower limit moving speed calculating means calculates the following expression (3) to obtain the lower limit moving speed (V _low ).
V _low = (D + d) / (T _t −T _s ) (3) The development processing apparatus according to claim 7 or 8, wherein the speed temporary set value calculation means calculates the following expression (4) to obtain a temporary set value (V _D ) of the first speed.
V _D = L / (T _D −T _a ) (4)   8. The developer supply unit includes a first nozzle that supplies the developer while moving at a predetermined speed along the transport path with respect to the substrate stopped at the first stop position. The development processing apparatus as described in any one of -9.   The development processing according to any one of claims 7 to 10, wherein the development stopping unit includes a substrate tilting unit that tilts the substrate at the second stop position and causes the developer to flow down from the substrate by gravity. apparatus.   The development stop portion has a second nozzle that supplies a rinsing liquid while moving at a predetermined speed along the transport path to the substrate stopped at the second stop position. The development processing apparatus according to claim 11.

Images