JP2007200009A - Non-contact data carrier and wiring board for non-contact data carrier - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To further miniaturize a non-contact data carrier for reading stored data in a non-contact state and a wiring board for a non-contact data carrier as the component. <P>SOLUTION: This non-contact data carrier is provided with an IC chip in which data can be stored and a wiring board on which the IC chip is mounted. The wiring board is provided with a plurality of wiring layers including an external wiring layer formed on one face of the wiring board, and an antenna pattern is formed in each of those plurality of wiring layers, and a minimum clearance from the terminal face of the wiring board to an antenna pattern in the external wiring layer is set to be smaller than a minimum clearance from the terminal face of the wiring board to the antenna pattern in a certain wiring layer other than the external wiring layer among a plurality of the wiring layers. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a non-contact data carrier capable of reading stored data in a non-contact manner and a wiring board for a non-contact data carrier which is a component thereof, and more particularly to a non-contact data carrier and a non-contact data carrier suitable for further miniaturization. The present invention relates to a wiring board.

  In recent years, contactless data carriers using IC chips (also referred to as IC tags, wireless tags, RFIDs, etc.) have been used as carriers for tag information of articles. The main components of the non-contact data carrier are an IC chip that holds data and an antenna connected to the IC chip. There is one in which an antenna pattern is formed on a wiring board on which an IC chip is mounted in order to configure an antenna (see, for example, Patent Document 1 below). As described in this document, when a wiring board is used, an antenna pattern can be provided in a plurality of wiring layers, and these can be connected in series with vias (interlayer connection conductors) to constitute an antenna.

Non-contact data carriers are often required to be miniaturized because of their usage characteristics. Although the disclosure of this document is considered to show the miniaturization due to the structure in which the antenna is patterned into a plurality of wiring layers, no further miniaturization is disclosed.
JP-A-2004-206736 (FIGS. 6, 7, 8, and 9)

  The present invention has been made in consideration of the above-described circumstances, and further reduces the size of a non-contact data carrier that can read stored data in a non-contact manner and a non-contact data carrier wiring board that is a component of the non-contact data carrier. An object of the present invention is to provide a non-contact data carrier and a non-contact data carrier wiring board that can be used.

  A non-contact data carrier according to an aspect of the present invention includes an IC chip capable of storing data and a wiring board on which the IC chip is mounted, and the wiring board is provided on any one surface of the wiring board. A plurality of wiring layers including an outer layer wiring layer formed on the antenna layer, and an antenna pattern is formed on each of the plurality of wiring layers, and a minimum separation distance from an end surface of the wiring board to the antenna pattern in the outer layer wiring layer is The wiring board is smaller than a minimum separation distance from the end face of the wiring board to an antenna pattern in a certain wiring layer other than the outer wiring layer among the plurality of wiring layers.

  A non-contact data carrier wiring board according to an aspect of the present invention includes an insulating substrate and an outer layer formed on one surface of the insulating substrate and having a substantially spiral first antenna pattern. A wiring layer; and a second wiring layer that exists on a surface different from a surface on which the outer wiring layer of the insulating substrate exists or as an inner layer and has a substantially spiral second antenna pattern; The entire second antenna pattern is provided so as to overlap an area enclosed by the outermost spiral of the first antenna pattern. This non-contact data carrier wiring board includes a form after being separated and a form of a plate material on which a plurality of wiring boards before being separated are formed.

  According to the present invention, it is possible to further reduce the size of a non-contact data carrier that can read stored data in a non-contact manner and a non-contact data carrier wiring board that is a component thereof.

  In the non-contact data carrier according to one aspect of the present invention, in the configuration in which the antenna pattern is formed in a plurality of wiring layers, the minimum separation distance from the end surface of the wiring substrate to the antenna pattern in the outer wiring layer is the end surface of the wiring substrate. To the antenna pattern in a certain wiring layer other than the outer wiring layer. By adopting such a configuration, an advantage is obtained when a plurality of wiring boards are cut out from the plate material on which the wiring boards are impositioned to obtain individual wiring boards as individual pieces.

  That is, when an antenna pattern is formed in each of a plurality of wiring layers, a pattern formation position shift between wiring layers cannot be avoided. Therefore, if the cutout is performed with the antenna pattern formation position in the outer wiring layer as a reference, the cutout line may overlap the antenna pattern formed in another wiring layer. In order to avoid this, it is only necessary to set the size of each piece large so that there is a margin in the pattern formation interval between the wiring boards to be separated in the plate material on which a plurality of wiring substrates are formed by imposition. However, it is against the miniaturization.

  In the non-contact data carrier described below, as a form after being cut out, the minimum separation distance from the end face of the wiring board to the antenna pattern in the outer wiring layer is an antenna pattern in a wiring layer other than the outer wiring layer from the end face of the wiring board. It is smaller than the minimum separation distance. In other words, when the cutout is performed with the antenna pattern formation position in the outer wiring layer as a reference, the possibility that the cutout line overlaps the antenna pattern formed in another wiring layer is avoided. ing. Therefore, it is not necessary to set the size of each piece large in consideration of the pattern formation position shift between the wiring layers, and the size can be reduced. The antenna pattern in a certain wiring layer other than the outer wiring layer does not include a pattern portion that does not substantially affect the function as an antenna.

  Further, the non-contact data carrier wiring board according to one aspect of the present invention is configured so that the first and second antenna patterns are formed on the outer wiring layer and the second wiring layer, respectively. Is provided so as to overlap the region enclosed by the outermost spiral of the first antenna pattern. By adopting such a configuration, an advantage is obtained when a plurality of wiring boards are cut out from the plate material on which the wiring boards are impositioned to obtain individual wiring boards as individual pieces.

  That is, when an antenna pattern is formed on each separate wiring layer, the occurrence of a pattern formation position shift between wiring layers is unavoidable. Therefore, if the cutout is performed by dividing the first antenna pattern in the outer wiring layer as a reference, the cutout line may overlap the second antenna pattern formed in the second wiring layer. is there. In order to avoid this, it is only necessary to set the size of each piece large so that there is a margin in the pattern formation interval between the wiring boards to be separated in the plate material on which a plurality of wiring substrates are formed by imposition. However, it is against the miniaturization.

  In the non-contact data carrier wiring board to be described below, the entire second antenna pattern of the second wiring layer is provided so as to overlap with a region included in the outermost spiral of the first antenna pattern of the outer wiring layer. ing. That is, there is a possibility that the cut-out line overlaps the second antenna pattern formed in the second wiring layer when the cut-out is performed by dividing the first antenna pattern in the outer wiring layer as a reference. Is a form that is avoided. Therefore, it is not necessary to set the size of each piece large in consideration of the pattern formation position shift between the wiring layers, and the size can be reduced. The second antenna pattern of the second wiring layer does not include a pattern portion that does not substantially affect the function as an antenna.

  As an embodiment of the present invention, the IC chip may not be mounted on the surface of the wiring board where the outer wiring layer exists. For example, a case in which the wiring board is mounted on the surface opposite to the surface on which the outer wiring layer exists (described below), or a form in which the wiring board is built in and mounted in the wiring board is conceivable.

  Here, the plurality of wiring layers include a second outer layer wiring layer formed on a surface of the wiring substrate opposite to a surface on which the outer layer wiring layer exists, and the IC chip is formed on the wiring substrate. The second outer wiring layer may be mounted on the surface. In this case, even if the mold resin for sealing the IC chip is formed on the entire surface, the pattern on the outer wiring layer side is not hidden by the mold resin. Therefore, the pattern (mark) by the outer wiring layer can be used as a reference for cutting.

  In view of this, there may be a mode in which a mold resin layer formed so as to cover the IC chip and the second outer wiring layer is further provided on the surface of the wiring board on which the IC chip is mounted.

  As an embodiment, the IC chip may be mounted on a surface of the wiring board where the outer wiring layer exists.

  Here, a mold resin layer formed so as to cover the IC chip may be further provided on the surface of the wiring board on which the IC chip is mounted. By doing in this way, it can avoid that the required area | region which should be used as the reference | standard of an outer wiring layer is covered with mold resin, and the pattern (mark) of the area | region can be used as the reference | standard of cutting.

  As an embodiment, the wiring board further includes a second outer layer wiring layer formed on a surface opposite to the surface on which the outer layer wiring layer exists, and an antenna pattern is formed on the second outer layer wiring layer. The minimum separation distance from the end face of the wiring board to the antenna pattern in the outer wiring layer is approximately the same as the minimum separation distance from the end face of the wiring board to the antenna pattern in the second outer wiring layer. Can be equal. This aspect is an aspect when the pattern formation of the outer wiring layer and the pattern formation of the second outer wiring layer can be performed in the same process. In the simultaneous pattern formation, the mask alignment accuracy is precise, and the minimum distance from the end surface of the wiring board to the antenna pattern in the outer layer wiring layer is inevitably from the end surface of the wiring board to the antenna pattern in the second outer layer wiring layer. It is the aspect that it is substantially equal to the minimum separation distance.

  As an embodiment, the IC chip can be mounted on the wiring board by bonding wires. It is an example of the method of mounting an IC chip on a wiring board. Relatively inexpensive as an assembly process.

  Further, as an embodiment, the IC chip can be mounted on the wiring board by flip chip connection. This is another example of a method of mounting an IC chip on a wiring board.

  Further, as an embodiment, the antenna pattern in each of the plurality of wiring layers is formed substantially in a spiral shape, and the antenna pattern in the outer wiring layer is the maximum number of turns among the antenna patterns. be able to. Since the number of turns does not have to be the same for each wiring layer, the antenna pattern of the outer wiring layer is set to the maximum number of turns in consideration of the maximum antenna pattern area in the outer wiring layer within each wiring layer. It is to set. The “maximum” includes a case where the number is the same as the number of turns in any one or more other wiring layers.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is four virtual plan views drawn to show the antenna configuration of a contactless data carrier according to an embodiment of the present invention. This non-contact data carrier is roughly one in which an antenna pattern is provided on each wiring layer of a four-layer wiring board, and further, an IC chip for data carrier is mounted connected to this antenna pattern. . In FIG. 1, illustration of the interlayer insulating material constituting the wiring board is omitted, and actually, the antenna patterns provided at the superimposed positions are arranged vertically.

  In FIG. 1, an IC chip 10 for data carrier is actually provided on the surface on which the outer layer (first layer) antenna pattern 1 is provided. The pads formed on the functional surface of the IC chip 10 and the wiring layer of the antenna pattern 1 are electrically connected by bonding wires 101. An end portion of the antenna pattern 1 connected from the IC chip 10 by the wire bonding 101 is an inner peripheral side end portion of the antenna pattern 1 formed in a spiral shape. The pattern 1 is traced from the inner peripheral side end portion to the one-layer / two-layer connection body 12 provided at the outer peripheral side end portion. For example, a well-known through-hole conductor can be used for the first-layer / two-layer connection body 12, but a so-called via may be used (a two-layer / three-layer connection body 23 described later, a three-layer / four-layer connection body 34, The same applies to the four-layer / one-layer connection body 41).

  The outer layer antenna pattern 1 is electrically connected to the outer peripheral side end portion of the inner layer (second layer) antenna pattern 2 formed in a spiral shape by the one-layer / two-layer connection body 12. The pattern 2 is traced from the outer peripheral side end portion to the two-layer / three-layer connection body 23 provided at the inner peripheral side end portion. The inner layer antenna pattern 2 is electrically connected to the inner peripheral side end of the inner layer (third layer) antenna pattern 3 formed in a spiral shape by the two-layer / three-layer connection body 23. The pattern 3 is traced from the inner peripheral side end portion to the three-layer / four-layer connection body 34 provided at the outer peripheral side end portion.

  The antenna pattern 3 is electrically connected to the outer peripheral side end portion of the outer layer (fourth layer) antenna pattern 4 formed in a spiral shape by the three-layer / four-layer connection body 34. The pattern 4 is traced from the outer peripheral side end portion to the four-layer / one-layer connection body 41 provided at the inner peripheral side end portion. The antenna pattern 4 is electrically connected to the wiring layer of the outer antenna pattern 1 by the four-layer / one-layer connection body 41, and thereby connected to the IC chip 10 through the bonding wires 101. With the above configuration, the antenna patterns 1, 2, 3, 4 are connected in series and function as a single antenna of the IC chip 10.

  The feature of this embodiment is that the entire outer layer (first layer) antenna pattern 1, the entire inner layer (second layer) antenna pattern 2, and the entire inner layer (third layer) antenna pattern 3 are the outer layer (fourth layer), respectively. Layer) It is provided so as to overlap with a region included in the outermost spiral of the antenna pattern 4. The effect of this arrangement will be described later.

  FIG. 2 is a schematic exploded perspective view showing the connection relationship of the antenna shown in FIG. 2, components corresponding to those shown in FIG. 1 are denoted by the same reference numerals. It can be understood from FIG. 2 that an antenna pattern is superimposed on each of the four wiring layers, and a single antenna pattern is formed by connecting them in a predetermined manner.

  FIG. 3 is a vertical sectional view schematically showing the configuration of the non-contact data carrier according to the embodiment of the present invention, and is a sectional view corresponding to the position A-Aa shown in FIG. In FIG. 3, the same or equivalent parts as those shown in FIG. As shown in FIG. 3, this non-contact data carrier 100 includes the above-described antenna patterns 1, 2, 3, 4 and IC chip 10 as well as interlayer insulating materials 51, 52 and 53, solder resists 54 and 55, and a mold resin 56. have.

  Each wiring layer including the antenna patterns 1, 2, 3, and 4 and the interlayer insulating materials 51, 52, and 53 constitute a wiring board. The interlayer insulating material 51 is an insulating substrate that separates the antenna pattern 1 and the antenna pattern 2, the interlayer insulating material 52 is an insulating substrate that separates the antenna pattern 2 and the antenna pattern 3, and the interlayer insulating material 53 is an antenna pattern. 3 is an insulating substrate that separates the antenna pattern 4 from the antenna substrate 4.

  Each of these interlayer insulating materials 51, 52, 53 can be made of, for example, epoxy resin containing glass cloth or BT resin, and the thickness thereof can be, for example, 0.1 mm. Each of the antenna patterns 1, 2, 3, and 4 is formed by patterning, for example, a copper foil, and has a thickness of 18 μm, for example. As a layout rule for forming the antenna patterns 1, 2, 3, 4 in this example, for example, one having a line / space of 75 μm / 75 μm can be adopted.

  The IC chip 10 is provided with a communication circuit unit (not shown) and a memory unit (not shown) as main internal components. The communication circuit unit is connected to an antenna constituted by the antenna patterns 1, 2, 3, 4 and receives a data read command signal from the outside via this antenna and is stored in the memory unit in response thereto Mediates data output.

  The solder resist 54 is formed on the surface of the interlayer insulating material 51 provided with the outer layer (first layer) antenna pattern 1 so as to include a pattern portion that does not require solder connection (thickness is, for example, 25 μm). The solder resist 55 is formed on the surface of the interlayer insulating material 53 on which the outer layer (fourth layer) antenna pattern 4 is provided, including a pattern portion that does not require solder connection (the thickness is the same as that of the solder resist 54). Similarly, for example, 25 μm). The solder resists 54 and 55 usually have transparency, and the position of the antenna pattern 1 or the antenna pattern 4 can be visually recognized through the state in which the antenna pattern 1 or the antenna pattern 4 is covered (however, the mold resin 56 further covers it). The antenna pattern 1 in the state cannot be visually recognized because the mold resin 56 is opaque.

  The mold resin 56 covers at least the IC chip 10 provided on the surface of the interlayer insulating material 51 with the functional surface facing upward, and is provided on the surface of the interlayer insulating material 51 via the solder resist 54. It is formed so as to cover the pattern 1 (thickness is, for example, 0.5 mm: in this embodiment, it is formed on the entire surface). The material of the mold resin 56 can be an epoxy resin, for example. A colorant for making the specified opaque color (mostly black) is added to the mold resin 56. The IC chip 10 is chemically and physically protected from the external environment by the mold resin 56.

  The outline of the manufacturing process of the non-contact data carrier 100 is, for example, as follows. First, a double-sided copper-clad plate including an interlayer insulating material 52 is prepared, a hole for interlayer connection is formed at a necessary position, a conductive layer is formed on the inner wall of the hole, and a two-layer / three-layer connector 23 make. Next, the copper foils on both sides are patterned by etching to form antenna patterns 2 and 3. Next, the interlayer insulating material 51 and the copper foil, the interlayer insulating material 53 and the copper foil are laminated and integrated on the respective surfaces on which the antenna patterns 2 and 3 are formed.

  Similarly to the formation of the two-layer / three-layer connector 23, a hole for interlayer connection is formed at a necessary position, and a conductive layer is formed on the inner wall of the hole, thereby forming the one-layer / two-layer connector 12 A three-layer / four-layer connection 34 and a four-layer / one-layer connection 41 are formed. Next, the copper foil on the interlayer insulating material 51 and the copper foil on the interlayer insulating material 53 are respectively patterned by etching to form antenna patterns 1 and 4. Hereinafter, the steps of forming the solder resists 54 and 55, the gold plating process, mounting the IC chip 10, and forming the mold resin 56 are performed in order.

  In addition, as a manufacturing process of the non-contact data carrier 100, the following is applied to the first-layer / second-layer connection body 12, the second-layer / third-layer connection body 23, the third-layer / fourth-layer connection body 34, and the fourth-layer / first-layer connection body 41. A method using paste can also be adopted. First, a protruding silver paste bump for interlayer connection (for two-layer three-layer connection body 23, four-layer one-layer connection body 41) is printed and formed at a required position of the copper foil, and the silver paste bump penetrates. Thus, the interlayer insulating material 52 is laminated and integrated on the copper foil. Next, another copper foil is laminated and integrated on the interlayer insulating material 52 so that the tip of the penetrating silver paste is plastically deformed. Then, the copper foils on both sides are patterned by etching to form antenna patterns 2 and 3.

  Next, protrusion-like silver paste bumps for interlayer connection (for the 1st layer 2 interlayer connection 12, the 3rd layer 4 interlayer connection 34, and the 4th layer 1 interlayer connection 41) at a required position of another copper foil Is prepared, and the interlayer insulating material 51 or 53 is laminated and integrated on the copper foil so that the silver paste bump penetrates. Then, these are laminated and integrated on both surfaces of the interlayer insulating material 52 on which the antenna patterns 2 and 3 are formed so as to plastically deform the tip of the silver paste penetrating them. Then, the copper foil on the interlayer insulating material 51 and the copper foil on the interlayer insulating material 53 are respectively patterned by etching to form antenna patterns 1 and 4. Hereinafter, the steps of forming the solder resists 54 and 55, the gold plating process, mounting the IC chip 10, and forming the mold resin 56 are performed in order.

  As described above, the non-contact data carrier 100 includes the entire outer layer (first layer) antenna pattern 1, the entire inner layer (second layer) antenna pattern 2, and the entire inner layer (third layer) antenna pattern 3. The outer layer (fourth layer) antenna pattern 4 is provided so as to overlap the region included in the outermost spiral. Therefore, as shown in FIG. 3, the minimum separation distance from the end face of the interlayer insulating materials 51, 52, 53 to the antenna pattern 4 is smaller than the minimum separation distance from the end face to the antenna patterns 1, 2, 3. It has become.

  For example, the entire spiral of the antenna pattern 4 can be accommodated in a 5 mm square region, and the entire spirals of the antenna patterns 1, 2, and 3 can each be accommodated in a 4.7 mm square region. This is because the antenna patterns 1, 2, and 3 are each formed as one spiral less than the antenna pattern 4 and the line / space forming rule is 75 μm / 75 μm, as shown in the figure.

  FIG. 4 is a schematic plan view showing a state before the non-contact data carrier 100 shown in FIG. 3 is cut out as an individual piece, and shows a surface on the side where the outer layer antenna pattern 4 is formed. As shown in FIG. 4, a plurality of non-contact data carriers 100 shown in FIG. 3 are collectively formed as one substrate (non-contact data carrier 200 before singulation) and then cut out individually. Such a production method enables efficient production.

  The non-contact data carrier 200 before separation shown in FIG. 4 is cut vertically and horizontally on the positions of the horizontal cutting reference mark 201 and the vertical cutting reference mark 202 formed near the periphery of the substrate. The horizontal cutting reference mark 201 and the vertical cutting reference mark 202 are formed by patterning, for example, by etching a copper foil simultaneously with the formation of the outer layer antenna pattern 4. Therefore, the mutual positional accuracy is high. Therefore, as is clear from the cross-sectional view shown in FIG. 3, as long as the horizontal cutting reference mark 201 and the vertical cutting reference mark 202 are used as a reference and cutting is performed so as not to overlap the region of the outer antenna pattern 4, There is no possibility that the cut line overlaps the antenna patterns 3, 2, 1.

  For comparison, if the case where the inner layer antenna patterns 2 and 3 are formed so as to substantially overlap the outer layer antenna pattern 4 is considered, the outer layer antenna pattern 4 and the inner layer antenna patterns 2 and 3 and It is necessary to consider the formation position deviation from the design value. Such a formation position shift may occur due to the manufacturing process of the multilayer wiring board. That is, as described above, the inner layer antenna patterns 2 and 3 are formed by etching separately from at least the outer layer antenna pattern 4 and the positional accuracy between them is clearer than the positional accuracy between patterns in the etching mask. Inferior to

  Therefore, when the inner layer antenna patterns 2 and 3 are formed so as to almost overlap with the outer layer antenna pattern 4 as a design value, a cutting line is set at a position somewhat larger than the position where the outer layer antenna pattern 4 is formed. It is necessary to tidy up. As a result, the non-contact data carrier 100 after being singulated must have a surplus area and become large. On the other hand, in the mutual positional relationship of the antenna patterns 1, 2, 3, and 4 as shown in FIG. 3, such an extra area is not required, so that the cutting line is brought close to the antenna pattern 4 to the limit. Can be downsized. Further, in the non-contact data carrier 200 before singulation as shown in FIG. 4, it is only necessary to minimize the interval between areas to be singulated, which can be made smaller as a whole, and efficient in terms of resource saving. Has improved.

  The configuration and effects of the embodiment of the present invention have been described above, but some points will be supplemented below. First, regarding the adjustment of the inductance values of the antenna patterns 1, 2, 3, and 4, as described above, the antenna patterns 1, 2, and 3 are the positions of the outermost spirals of the antenna pattern 4. The relationship with the formation region is limited. Therefore, in order to adjust the inductance of each antenna pattern 1, 2, 3, 4 to a predetermined value suitable for non-contact communication, the number of turns may be appropriately increased or decreased on the inner peripheral side of those spirals.

  In addition, each wiring layer on which the antenna patterns 1, 2, and 3 are formed may include a pattern that does not substantially affect the function as an antenna. For example, a pattern for plating formation connected to an antenna pattern, some dummy pattern, a land pattern for an interlayer connection, and the like. Of course, these patterns are not limited in the positional relationship with the antenna pattern 4 as described above. The same applies to a part of the interlayer connection connected to the land pattern for the interlayer connection.

  Further, the cutout for separating into pieces may be performed after the mounting of the IC chip 10 and the formation of the mold resin 56, and before the mounting and the formation thereof. In this case, the mounting of the IC chip 10 and the formation of the mold resin 56 are performed on the individual substrates.

  Next, another embodiment of the present invention will be described with reference to FIGS. FIG. 5 is four virtual plan views drawn to show the antenna configuration of a contactless data carrier according to another embodiment of the present invention. FIG. 6 is a vertical cross-sectional view schematically showing a configuration of a non-contact data carrier according to another embodiment of the present invention, and a cross-section corresponding to a position similar to the position of A-Aa shown in FIG. It is illustrated. In FIG. 5 and FIG. 6, the same parts as those already described are denoted by the same reference numerals, and the description thereof is omitted unless added.

  In the non-contact data carrier 100A of this embodiment, as shown in FIGS. 5 and 6, the outermost outer shape of the spiral pattern of the outer antenna pattern 1A substantially overlaps the outermost surface of the spiral pattern of the other outer antenna pattern 4. Antenna patterns 1A and 4 are formed. Other portions such as the inner layer antenna patterns 2 and 3 are the same as those in the above embodiment. That is, if it is drawn as a schematic plan view showing a state before the non-contact data carrier is cut out as individual pieces as shown in FIG. 4, it is the same as FIG.

  In this embodiment, the outer layer antenna pattern 1A and the outer layer antenna pattern 4 are formed at the same time. That is, the following steps are applied to etch the copper foil on the interlayer insulating material 51 and the copper foil on the interlayer insulating material 53, respectively. First, a two-layer photomask configured in a bag shape is used, and a substrate whose copper foil is covered with a resist is inserted between the two layers. The photomask configured in a bag shape has high pattern formation position accuracy between two photomasks. Next, a resist is patterned using this photomask, and each copper foil is etched and formed on the antenna patterns 1A and 4 using the patterned resist as an etching mask. Thereby, the mutual positional accuracy between the antenna patterns 1A and 4 can be formed high.

  Therefore, even when the cut-out reference mark formed on the antenna pattern 4 side is singulated, there is no possibility that the cut-out line overlaps the formation position of the antenna pattern 1A. As a result, a form in which the antenna patterns 1A and 4 on the outer layer overlap with each other in substantially the same shape as shown in FIGS. 5 and 6 can be realized while maintaining the effects described in the above embodiments.

  Also in this embodiment, the relationship between each wiring layer in which the antenna patterns 2 and 3 are formed and the antenna patterns 1A and 4 is the same as that in the embodiment described with reference to FIGS. . That is, each wiring layer on which the antenna patterns 2 and 3 are formed may include patterns that do not substantially affect the function as an antenna. Of course, there is no limitation described above in the positional relationship.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 7 is a vertical sectional view schematically showing a configuration of a non-contact data carrier according to still another embodiment of the present invention. In FIG. 7, the same parts as those already described are denoted by the same reference numerals, and the description thereof is omitted unless added.

  Compared with the embodiment shown in FIG. 3, the contactless data carrier 100B of this embodiment is different in the formation position of the antenna patterns 2B and 3B in the inner layer and the positional relationship between the formation position of the antenna pattern 4 in the outer layer and the line / space. Is moving sideways to be the opposite. As a result, the position of the outermost spiral of the antenna patterns 2B and 3B is shifted outward by one space (75 μm) of the line / space. Even in such a positional relationship, the effect obtained in the embodiment shown in FIG. 3 is not impaired. In addition, since the influence of the floating (parasitic) capacitance component formed by the antenna patterns 1 and 2B and the floating (parasitic) capacitance component formed by the antenna patterns 3B and 4 is reduced, the resonance frequency due to the shift between layers is reduced. It is possible to manufacture a non-contact data carrier having a stable communication performance.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 8 is a vertical sectional view schematically showing a configuration of a non-contact data carrier according to still another embodiment of the present invention. In FIG. 8, the same parts as those already described are denoted by the same reference numerals, and the description thereof is omitted unless added.

  Compared with the embodiment shown in FIG. 6, the non-contact data carrier 100C of this embodiment is different in the formation position of the inner layer antenna patterns 2B and 3B, the formation position of the outer layer antenna pattern 4 and the positional relationship of the line / space. Is moving sideways to be the opposite. That is, the embodiment shown in FIG. 7, which is a modification of the embodiment shown in FIG. 3, is applied to the embodiment shown in FIG. Therefore, it has the effects described in the embodiment shown in FIG. 6 and the embodiment shown in FIG.

  Next, still another embodiment of the present invention will be described with reference to FIGS. FIG. 9 is a vertical sectional view schematically showing a configuration of a non-contact data carrier according to still another embodiment of the present invention. 9 and 10, the same parts as those already described are denoted by the same reference numerals, and the description thereof is omitted unless added.

  The non-contact data carrier 100D of this embodiment is formed and provided with a mold resin 56A that covers the IC chip 10, but the mold resin 56A remains in an island shape and does not reach the end face of the non-contact data carrier 100D. . FIG. 10 is a schematic plan view showing a state before the non-contact data carrier 100D shown in FIG. 9 is cut out as a single piece. The surface on which the outer layer antenna pattern 1A is formed (that is, the IC chip 10 is mounted). Surface).

  As shown in FIG. 10, in this embodiment, the horizontal cutting reference mark 301 and the vertical cutting reference mark 302 are formed on the surface of the non-contact data carrier 300 before singulation on the side where the outer layer antenna pattern 1A is formed. is doing. This is because the mold resin 56A is not formed on the entire surface, and the horizontal cutting reference mark 301 and the vertical cutting reference mark 302 can be visually recognized through the solder resist 54. The non-contact data carrier 300 before separation is cut vertically and horizontally on the positions of the horizontal cutting reference mark 301 and the vertical cutting reference mark 302 formed near the periphery of the substrate. Effects such as downsizing of the non-contact data carrier 100D are the same as those in the above embodiments.

  The horizontal cutting reference mark 301 and the vertical cutting reference mark 302 may be formed on the surface on which the outer antenna pattern 4 is formed as in the embodiment shown in FIG. In this case, it is somewhat disadvantageous in terms of its stability in that it holds the substrate for use in the cutting process. This is because the formation site of the mold resin 56A is island-shaped and the ground contact area on the table is reduced. However, as a matter of course, the antenna patterns 1A, 2, 3, and 4 may be arranged as shown in FIGS.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 11 is a vertical sectional view schematically showing a configuration of a non-contact data carrier according to still another embodiment of the present invention. In FIG. 11, the same parts as those already described are denoted by the same reference numerals, and the description thereof is omitted unless added.

  In the non-contact data carrier 100E of this embodiment, the IC chip 10A is mounted on the surface on which the antenna pattern 1A is formed by flip chip connection. A gap between the flip-chip connected IC chip 10 </ b> A and the insulating resin material 51 is sealed with a sealing resin 57. Further, a mold resin 56A is formed so as to cover the IC chip 10A that is flip-chip connected. The mold resin 56A stays in an island shape and does not reach the end face of the non-contact data carrier 100E. That is, the embodiment is the same as the embodiment shown in FIGS. 9 and 10 except that the IC chip 10A is flip-chip connected.

  In this manner, the same effect can be obtained as an embodiment of the present invention even when the IC chip 10A is flip-chip connected. As a matter of course, the flip chip connection can be applied to the arrangement of each antenna pattern as shown in FIGS.

FIG. 4 is a virtual plan view drawn to show an antenna configuration of a non-contact data carrier according to an embodiment of the present invention. The typical disassembled perspective view which shows the connection relation of the antenna shown in FIG. 1 is a vertical sectional view schematically showing a configuration of a non-contact data carrier according to an embodiment of the present invention. The typical top view which shows the state before the non-contact data carrier shown in FIG. 3 is cut out as a piece. FIG. 4 is a virtual four plan view drawn to show the antenna configuration of a contactless data carrier according to another embodiment of the present invention. The vertical sectional view showing typically the composition of the non-contact data carrier concerning another embodiment of the present invention. The vertical sectional view showing typically the composition of the non-contact data carrier concerning another embodiment of the present invention. The vertical sectional view showing typically the composition of the non-contact data carrier concerning another embodiment of the present invention. The vertical sectional view showing typically the composition of the non-contact data carrier concerning another embodiment of the present invention. The typical top view which shows the state before the non-contact data carrier shown in FIG. 9 is cut out as a piece. The vertical sectional view showing typically the composition of the non-contact data carrier concerning another embodiment of the present invention.

Explanation of symbols

  1, 1A ... outer layer (first layer) antenna pattern, 2, 2B ... inner layer (second layer) antenna pattern, 3, 3B ... inner layer (fourth layer) antenna pattern, 4 ... outer layer (fourth layer) antenna pattern, DESCRIPTION OF SYMBOLS 10,10A ... IC chip, 12 ... 1 layer 2 interlayer connection body, 23 ... 2 layer 3 interlayer connection body, 34 ... 3 layer 4 interlayer connection body, 41 ... 4 layer 1 interlayer connection body, 51, 52, 53 ... interlayer Insulating material, 54, 55 ... Solder resist, 56, 56A ... Mold resin, 57 ... Sealing resin, 100, 100A, 100B, 100C, 100D, 100E ... Non-contact data carrier, 101 ... Bonding wire, 200, 300 ... Non-contact data carrier before separation, 201, 301 ... transverse cutting reference mark, 202, 302 ... longitudinal cutting reference mark.

Claims (11)

An IC chip capable of storing data;
A wiring board on which the IC chip is mounted;
The wiring board has a plurality of wiring layers including an outer wiring layer formed on any one surface of the wiring board, and an antenna pattern is formed on each of the plurality of wiring layers, and an end face of the wiring board To the antenna pattern in the outer wiring layer is smaller than the minimum separation distance from the end surface of the wiring board to the antenna pattern in a certain wiring layer other than the outer wiring layer of the plurality of wiring layers. A non-contact data carrier characterized by that.   2. The non-contact data carrier according to claim 1, wherein the IC chip is not mounted on a surface of the wiring substrate on which the outer wiring layer exists. The plurality of wiring layers include a second outer layer wiring layer formed on a surface of the wiring board opposite to a surface on which the outer layer wiring layer exists,
The non-contact data carrier according to claim 2, wherein the IC chip is mounted on a surface of the wiring board on which the second outer wiring layer exists.   4. The mold resin layer according to claim 3, further comprising a mold resin layer formed on the surface of the wiring board on which the IC chip is mounted so as to cover the IC chip and the second outer wiring layer. Non-contact data carrier.   2. The contactless data carrier according to claim 1, wherein the IC chip is mounted on a surface of the wiring board on which the outer wiring layer exists.   6. The non-contact data carrier according to claim 5, further comprising a mold resin layer formed on the surface of the wiring board on which the IC chip is mounted so as to cover the IC chip. The wiring board further has a second outer layer wiring layer formed on a surface opposite to the surface on which the outer layer wiring layer exists, and an antenna pattern is formed on the second outer layer wiring layer;
The minimum separation distance from the end face of the wiring board to the antenna pattern in the outer wiring layer is substantially equal to the minimum separation distance from the end face of the wiring board to the antenna pattern in the second outer wiring layer. The non-contact data carrier according to claim 1.   2. The contactless data carrier according to claim 1, wherein the IC chip is mounted on the wiring board by a bonding wire.   2. The non-contact data carrier according to claim 1, wherein the IC chip is mounted on the wiring board by flip chip connection.   2. The antenna pattern in each of the plurality of wiring layers is formed in a substantially spiral shape, and the antenna pattern in the outer wiring layer is the maximum number of turns among the antenna patterns. Non-contact data carrier. An insulating substrate;
An outer wiring layer formed on any one surface of the insulating substrate and having a substantially spiral first antenna pattern;
A second wiring layer that exists on a surface different from the surface on which the outer wiring layer of the insulating substrate exists or as an inner layer, and has a substantially spiral second antenna pattern;
The non-contact data carrier wiring board, wherein the entire second antenna pattern is provided so as to overlap an area enclosed by the outermost spiral of the first antenna pattern.

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