JP2007194516A5 - - Google Patents
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- Publication number
- JP2007194516A5 JP2007194516A5 JP2006013376A JP2006013376A JP2007194516A5 JP 2007194516 A5 JP2007194516 A5 JP 2007194516A5 JP 2006013376 A JP2006013376 A JP 2006013376A JP 2006013376 A JP2006013376 A JP 2006013376A JP 2007194516 A5 JP2007194516 A5 JP 2007194516A5
- Authority
- JP
- Japan
- Prior art keywords
- electrically insulating
- insulating substrate
- wiring board
- wiring
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 20
- 239000002131 composite material Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006013376A JP2007194516A (ja) | 2006-01-23 | 2006-01-23 | 複合配線基板およびその製造方法、ならびに電子部品の実装体および製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006013376A JP2007194516A (ja) | 2006-01-23 | 2006-01-23 | 複合配線基板およびその製造方法、ならびに電子部品の実装体および製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011149808A Division JP2011233915A (ja) | 2011-07-06 | 2011-07-06 | 複合配線基板およびその製造方法、ならびに電子部品の実装体および製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007194516A JP2007194516A (ja) | 2007-08-02 |
| JP2007194516A5 true JP2007194516A5 (https=) | 2009-02-19 |
Family
ID=38449948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006013376A Pending JP2007194516A (ja) | 2006-01-23 | 2006-01-23 | 複合配線基板およびその製造方法、ならびに電子部品の実装体および製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007194516A (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101911853B (zh) | 2008-01-18 | 2012-04-25 | 松下电器产业株式会社 | 立体布线板 |
| JP2010238821A (ja) * | 2009-03-30 | 2010-10-21 | Sony Corp | 多層配線基板、スタック構造センサパッケージおよびその製造方法 |
| US9484327B2 (en) * | 2013-03-15 | 2016-11-01 | Qualcomm Incorporated | Package-on-package structure with reduced height |
| JP6341837B2 (ja) * | 2014-11-04 | 2018-06-13 | 日本特殊陶業株式会社 | 配線基板 |
| KR102460870B1 (ko) * | 2017-10-20 | 2022-10-31 | 삼성전기주식회사 | 인쇄회로기판 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07273464A (ja) * | 1994-03-31 | 1995-10-20 | Ibiden Co Ltd | Ｉｃ搭載用プリント配線板の製造方法 |
| JPH09214088A (ja) * | 1996-01-31 | 1997-08-15 | Sumitomo Kinzoku Electro Device:Kk | セラミック基板のプリント配線基板への実装構造 |
| US6444921B1 (en) * | 2000-02-03 | 2002-09-03 | Fujitsu Limited | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like |
| JP2005045150A (ja) * | 2003-07-25 | 2005-02-17 | Matsushita Electric Ind Co Ltd | 中間接続用配線基材および多層配線基板、ならびにこれらの製造方法 |
| JP2005209904A (ja) * | 2004-01-23 | 2005-08-04 | Matsushita Electric Ind Co Ltd | 多層配線基板、多層配線基板を備えたモジュール、および、電子機器 |
-
2006
- 2006-01-23 JP JP2006013376A patent/JP2007194516A/ja active Pending
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