JP2007194516A5 - - Google Patents

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Publication number
JP2007194516A5
JP2007194516A5 JP2006013376A JP2006013376A JP2007194516A5 JP 2007194516 A5 JP2007194516 A5 JP 2007194516A5 JP 2006013376 A JP2006013376 A JP 2006013376A JP 2006013376 A JP2006013376 A JP 2006013376A JP 2007194516 A5 JP2007194516 A5 JP 2007194516A5
Authority
JP
Japan
Prior art keywords
electrically insulating
insulating substrate
wiring board
wiring
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006013376A
Other languages
Japanese (ja)
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JP2007194516A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2006013376A priority Critical patent/JP2007194516A/en
Priority claimed from JP2006013376A external-priority patent/JP2007194516A/en
Publication of JP2007194516A publication Critical patent/JP2007194516A/en
Publication of JP2007194516A5 publication Critical patent/JP2007194516A5/ja
Pending legal-status Critical Current

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Claims (5)

第一の電気絶縁性基材と前記第一の電気絶縁性基材に形成された配線パターンを有する第一の配線基板と、
第二の電気絶縁性基材と前記第二の電気絶縁性基材に形成された配線パターンを有し、かつ少なくともその一部に開口部を形成するためのキャビティを形成した第二の配線基板と、
前記第一の配線基板と第二の配線基板を厚み方向に接着し、第一の配線基板の配線パターンと前記第二の配線基板の配線パターン間を電気的に接続する導電部を備え、かつ少なくともその一部に開口部を形成するためのキャビティを形成した第三の電気絶縁性基材と、
から構成され、
前記第三の電気絶縁性基材は、前記第一の電気絶縁性基材および前記第二の電気絶縁性基材と異なる材料からなり、
前記キャビティの表面に配線パターンが設けられた
ことを特徴とする複合配線基板。 A first wiring board having a first electrically insulating substrate and a wiring pattern formed on the first electrically insulating substrate;
A second wiring board having a second electrically insulating substrate and a wiring pattern formed on the second electrically insulating substrate, and having a cavity for forming an opening in at least a part thereof When,
Bonding the first wiring board and the second wiring board in the thickness direction, and having a conductive portion that electrically connects the wiring pattern of the first wiring board and the wiring pattern of the second wiring board; and A third electrically insulating substrate formed with a cavity for forming an opening in at least a portion thereof;
Consisting of
The third electrically insulating substrate is made of a material different from the first electrically insulating substrate and the second electrically insulating substrate,
A wiring pattern was provided on the surface of the cavity.
A composite wiring board characterized by that . 第一の電気絶縁性基材と前記第一の電気絶縁性基材に形成された配線パターンを有する第一の配線基板と、
第二の電気絶縁性基材と、前記第二の電気絶縁性基材に形成された配線パターンを有し、かつ少なくともその一部に開口部を形成するためのキャビティを形成した第二の配線基板と、
前記第一の配線基板と第二の配線基板の少なくとも一つを厚み方向に接着し、第一の配線基板の配線パターンと前記第二の配線基板の配線パターン間を電気的に接続する導電部を備え、かつ少なくともその一部に開口部を形成するためのキャビティを形成した第三の電気絶縁性基材と、第三の電気絶縁性基材の少なくとも一つの面に形成された接着剤層と、
から構成され、
前記第三の電気絶縁性基材は、前記第一の電気絶縁性基材および前記第二の電気絶縁性基材と異なる材料からなり、
前記キャビティの表面に配線パターンが設けられた
ことを特徴とする複合配線基板。 A first wiring board having a first electrically insulating substrate and a wiring pattern formed on the first electrically insulating substrate;
A second wiring having a second electrically insulating substrate and a wiring pattern formed on the second electrically insulating substrate, and having a cavity for forming an opening in at least a part thereof A substrate,
A conductive portion that bonds at least one of the first wiring board and the second wiring board in the thickness direction and electrically connects the wiring pattern of the first wiring board and the wiring pattern of the second wiring board. And an adhesive layer formed on at least one surface of the third electrically insulating substrate, and a cavity for forming an opening in at least a part thereof, and a third electrically insulating substrate When,
Consisting of
The third electrically insulating substrate is made of a material different from the first electrically insulating substrate and the second electrically insulating substrate,
A wiring pattern was provided on the surface of the cavity.
A composite wiring board characterized by that . 第三の電気絶縁性基材は、無機フィラと熱硬化性樹脂を含む混合物であることを特徴とする請求項１または２に記載の複合配線基板。 The composite wiring board according to claim 1 or 2, wherein the third electrically insulating substrate is a mixture containing an inorganic filler and a thermosetting resin. 第三の電気絶縁性基材の熱膨張係数は、第一と第二の配線基板の熱膨張係数の間であることを特徴とする請求項１または２に記載の複合配線基板。 3. The composite wiring board according to claim 1, wherein a thermal expansion coefficient of the third electrically insulating base material is between the thermal expansion coefficients of the first and second wiring boards. 第三の電気絶縁性基材の弾性率は、第一と第二の配線基板の弾性率よりも小さいことを特徴とする請求項１または２に記載の複合配線基板。 The composite wiring board according to claim 1 or 2, wherein the elastic modulus of the third electrically insulating substrate is smaller than the elastic modulus of the first and second wiring boards.
JP2006013376A 2006-01-23 2006-01-23 Compound wiring board and its manufacturing method, mounted shape of electronic component, and manufacturing method Pending JP2007194516A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006013376A JP2007194516A (en) 2006-01-23 2006-01-23 Compound wiring board and its manufacturing method, mounted shape of electronic component, and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006013376A JP2007194516A (en) 2006-01-23 2006-01-23 Compound wiring board and its manufacturing method, mounted shape of electronic component, and manufacturing method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011149808A Division JP2011233915A (en) 2011-07-06 2011-07-06 Composite wiring board, manufacturing method thereof, mounting body of electronic component, and manufacturing method of electronic component

Publications (2)

Publication Number Publication Date
JP2007194516A JP2007194516A (en) 2007-08-02
JP2007194516A5 true JP2007194516A5 (en) 2009-02-19

Family

ID=38449948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006013376A Pending JP2007194516A (en) 2006-01-23 2006-01-23 Compound wiring board and its manufacturing method, mounted shape of electronic component, and manufacturing method

Country Status (1)

Country Link
JP (1) JP2007194516A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009090879A1 (en) * 2008-01-18 2009-07-23 Panasonic Corporation Three-dimensional wiring board
JP2010238821A (en) * 2009-03-30 2010-10-21 Sony Corp Multilayer wiring substrate, stack structure sensor package, and method of manufacturing the same
US9484327B2 (en) * 2013-03-15 2016-11-01 Qualcomm Incorporated Package-on-package structure with reduced height
JP6341837B2 (en) * 2014-11-04 2018-06-13 日本特殊陶業株式会社 Wiring board
KR102460870B1 (en) * 2017-10-20 2022-10-31 삼성전기주식회사 Printed circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07273464A (en) * 1994-03-31 1995-10-20 Ibiden Co Ltd Manufacturing method of ic mounting printed-wiring board
JPH09214088A (en) * 1996-01-31 1997-08-15 Sumitomo Kinzoku Electro Device:Kk Mounting structure of ceramic board to printed board
US6444921B1 (en) * 2000-02-03 2002-09-03 Fujitsu Limited Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like
JP2005045150A (en) * 2003-07-25 2005-02-17 Matsushita Electric Ind Co Ltd Wiring base material for intermediate connection, multilayer wiring board, and manufacturing methods thereof
JP2005209904A (en) * 2004-01-23 2005-08-04 Matsushita Electric Ind Co Ltd Multilayer wiring board, module equipped therewith, and electronic equipment

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