JP2007190374A - Toy block set and its management method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a block and its management method expected to encourage the growth of an infant by facilitating to update and change an assemble procedure manual. <P>SOLUTION: This toy block set incorporates wireless chips in blocks and has a function allowing a storage box storing the blocks to acquire information inside the wireless chips, a function capable of sending the acquired information via Internet, and a function capable of displaying the information received via Internet. This constitution can highly efficiently manage the blocks to easily update the assemble procedure manual. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a toy block set having a block capable of wireless communication and a management method thereof.

In recent years, there has been a great interest in infant intellectual education, and various educational toys that are thought to promote infant brain development have been developed and put on the market. In particular, toy blocks (hereinafter referred to as “blocks”) and blocks are thought to be useful for cultivating the ability to recognize spaces and create things, and are thought to promote brain development by moving hands.

There are many blocks for the purpose of intellectual education of such infants (see, for example, Patent Documents 1 and 2).

In addition, a learning support system has been proposed in which an RFID tag storing an identification code for specifying a Chinese character component displayed on a block member displaying a Chinese character component is mounted (see Patent Document 3).
JP 2000-288260 A Japanese Utility Model Publication No. 6-49350 Japanese Patent Application Laid-Open No. 2002-2115012

Infants are thought to cultivate spatial awareness and creativity by imitating some form of shape, such as seeing what is actually made (for example, cars, trains, airplanes, etc.) Assemble the block by looking at the assembly instructions that come with the purchase of the block set.

The procedure manual attached to the existing block set is printed on paper, and even if a new assembly procedure manual is created by the block developer, it is not easily updated.

Further, when a block set is additionally purchased in accordance with the growth of the infant, the assembly procedure manual for the additionally purchased block set cannot be assembled using the blocks of the previously purchased block set.

Therefore, an object of the present invention is to provide a block that can be easily changed in the assembly procedure manual and can be expected to further promote the development of an infant and a management method thereof.

In view of the above problems, a wireless chip is incorporated in a block, a function capable of storing a large number of blocks incorporating the wireless chip, a function capable of acquiring information in the stored wireless chip, and sending the acquired information via the Internet By providing a storage box having a function capable of displaying the information received via the Internet, the block can be efficiently managed and the assembly procedure manual can be easily updated.

One embodiment of the present invention includes a block having a wireless chip and a storage box for the block, the storage box having a function of storing the block, and the storage box having a function of acquiring information of the wireless chip. And the storage box has a function of communicating the acquired information via the Internet, and the storage box has a display unit for displaying the information received via the Internet. It is a block set for.

In the present invention having the above configuration, it is preferable that the wireless chip is attached to the block.

In the present invention having the above structure, the wireless chip preferably includes a thin film transistor formed over an insulating substrate.

In the present invention configured as described above, the insulating substrate is preferably a film substrate.

Another embodiment of the present invention is a method for managing a toy block set including a wireless chip incorporated in a block and a storage box, wherein the wireless chip includes a resonance circuit, a power generation circuit, and a clock generation circuit. And a demodulation circuit, a readout circuit, an authentication register, an encoding circuit, and a modulation circuit, and the resonance circuit generates an AC signal by radio waves received from the storage box, and generates the power A circuit generates power from the AC signal, the clock generation circuit generates a clock signal from the AC signal, and the demodulation circuit demodulates the AC signal and transmits demodulated data to the readout circuit; The read circuit transmits an authentication number read command included in the demodulated data to the authentication register, and the authentication register transmits the authentication number read command to the encoding circuit. An authentication number unique to the wireless chip is transmitted, the encoding circuit transmits an authentication signal encoding the authentication number to the modulation circuit, and the modulation circuit transmits the modulation data obtained by modulating the authentication signal. A block management method for toys, characterized in that blocks are managed by transmission to a resonance circuit.

In the present invention configured as described above, the storage box includes a block storage unit, a display unit that displays an assembly procedure of the block, and a control device that controls the storage box, and the control device includes the wireless chip. It is preferable to have a reader unit that can transmit and receive the authentication signal.

In the present invention configured as described above, it is preferable that the control device receives and updates an assembly procedure via the Internet.

Note that in the present invention, a semiconductor device refers to a device having a semiconductor element.

Note that in the present invention, a wireless chip refers to a semiconductor device capable of wireless communication.

The block set of the present invention (also referred to as a toy block set) has at least two blocks and a storage box. Each of the two blocks has a wireless chip. The wireless chip includes a storage unit (also referred to as an authentication register) in which an authentication number is stored. The storage box includes a reader unit that acquires a wireless chip authentication number, an interface unit that transmits the wireless chip authentication number from the server and receives a procedure manual (also referred to as an assembly procedure) from the server, and a procedure. And a display unit for displaying a procedure manual.

The management method of the block set (also referred to as toy block set) according to the present invention includes the step of obtaining the authentication number of the wireless chip included in the block by the reader unit included in the storage box, and the interface unit included in the storage box. And the step of transmitting the authentication number of the wireless chip from the server and receiving the procedure manual from the server, and the step of displaying the procedure manual by the display unit included in the storage box.

The management method of the block set (also referred to as a toy block set) according to the present invention includes a step of obtaining an authentication number of a wireless chip included in the block by a reader unit included in the storage box, and an interface unit included in the storage box. The step of transmitting the wireless chip authentication number from the server and receiving the first procedure manual from the server, the step of storing the first procedure manual in the storage unit included in the storage box, and the storage box A step of displaying the first procedure manual by the display unit included, a step of transmitting the authentication number of the wireless chip to the server via the Internet by the interface unit, and receiving the second procedure manual from the server, and storage And a step of storing the second procedure manual in the unit and a step of displaying the second procedure manual on the display unit.

According to the present invention, by incorporating a wireless chip in the block, the block can be efficiently managed, and can be easily updated to a more advanced assembly procedure according to the infant's development, and the infant's brain development Can be expected.
It is.

Embodiments of the present invention will be described below with reference to the drawings. However, the present invention can be implemented in many different modes, and those skilled in the art can easily understand that the modes and details can be variously changed without departing from the spirit and scope of the present invention. Is done. Therefore, the present invention is not construed as being limited to the description of this embodiment mode. Note that in all the drawings for describing the embodiments, the same portions or portions having similar functions are denoted by the same reference numerals, and repetitive description thereof is omitted.
(Embodiment 1)

In this embodiment mode, a configuration example of a block incorporating a wireless chip of the present invention and a configuration example of a built-in wireless chip will be described. In the present embodiment, a configuration example of a storage box that manages blocks and takes in an assembly procedure, and an example of a method for taking in an assembly procedure will be described.

A structure of a block incorporating the wireless chip of this embodiment is described with reference to FIG. The block 100 includes a wireless chip 200. The wireless chip 200 may be formed by removing and pasting or embedding a part of the block 100 after the block 100 is completed. Further, the wireless chip 200 may be built in the manufacturing process of the block 100 such that the wireless chip 200 is built in the block 100. FIG. 1 shows a block 100 in which a wireless chip 200 is embedded.

In FIG. 1, a rectangular parallelepiped white block 100 incorporating a wireless chip 200 is illustrated. However, various shapes and colors are conceivable for the block incorporating the wireless chip. The block of the present invention is not limited to a specific shape or color.

Next, the structure of the wireless chip of this embodiment is described with reference to FIG. The wireless chip 200 includes a resonance circuit 201 having an antenna and a resonance capacitor, a power generation circuit 202, a clock generation circuit 203, a demodulation circuit 204, a modulation circuit 205, a readout circuit 206, an encoding circuit 207, and an authentication. And a register 208. The authentication register is also called an ID register.

The resonance circuit 201 is a circuit that can receive radio waves from the storage box 300 and generate AC signals at both ends of the antenna. The generated AC signal includes information from the storage box 300. Further, the AC signal can also be a power source for the wireless chip 200. The resonance circuit 201 is a circuit that can transmit modulation data to the storage box 300 by radio waves via an antenna.

The power generation circuit 202 can rectify an alternating current signal generated in the resonance circuit 201 by a rectifier circuit (including a diode) and smooth it using a capacitor, thereby generating power and supplying it to each circuit. Circuit. That is, the power generation circuit 202 includes a rectifier circuit.

The clock generation circuit 203 is a circuit that can generate a clock signal based on the AC signal generated in the resonance circuit 201 and supply the clock signal to each circuit.

The demodulation circuit 204 is a circuit that can demodulate an AC signal generated in the resonance circuit 201 and send demodulated data to the reading circuit 206.

The read circuit 206 is a circuit that can extract read command information from the received demodulated data and issue an authentication number read command to the authentication register 208.

The authentication register 208 includes a memory in which an authentication number unique to each wireless chip is created when the wireless chip is manufactured. When an authentication number read command is received from the reading circuit 206, the authentication register 208 is sent to the encoding circuit 207. It is a circuit that can. As the memory, an SRAM, a flash memory, a nonvolatile memory, a ROM, an FeRAM, or the like, an organic memory in which an organic material is sandwiched between a pair of electrodes, or the like can be used. That is, the present invention is not limited to a memory in which information is created as a memory in which an authentication number of a wireless chip is stored.

Note that all authentication information in this embodiment is managed by the block developer, and the block developer specifies the shape and color of the wireless chip having a unique authentication number and the block in which the wireless chip is built. I am trying to respond. Here, an example of the management method will be described with reference to FIG. FIG. 3 shows a table for managing authentication information. Authentication number 700 and block shape 1 and color 1, authentication number 701 and block shape 2 and color 2, and the like can be managed in association with each other.

The authentication information includes an authentication number 700 of the wireless chip, block shape information, block color information, and the like. In the above embodiment, the authentication chip is stored in the wireless chip. However, the present invention is not limited to this. Authentication information may be stored in the wireless chip.

When the authentication number is sent from the authentication register 208, the encoding circuit 207 is a circuit that can generate a signal in which the authentication number is encoded and output the encoded signal to the modulation circuit 205.

The modulation circuit 205 is a circuit that can modulate the encoded signal and output the modulated data to the resonance circuit 201.

Next, the structure of the storage box of this embodiment will be described with reference to FIG. The storage box 300 includes a storage unit 301 having a sufficiently large capacity for storing a large number of blocks, a display unit 302 for displaying an assembly procedure of a structure configured using the blocks stored in the main storage box, A control device 303 that controls the storage box 300, an ID acquisition button 306, and a transmission button 307 are provided.

Next, the structure of the control apparatus 303 of this Embodiment is demonstrated using FIG. The control device 303 includes a reader unit 304, an input / output interface unit 305, a network interface unit 308, a memory unit 309, and a main body control unit 310.

Below, the function of each part which the control apparatus 303 has is shown.

The memory unit 309 includes a program storage area 311 for storing a program executed by the main body control unit 310, an authentication number storage area 312 for storing the authentication number of the wireless chip of each block, and an assembly procedure storage for storing assembly procedure data. A region 313. As the memory portion 309, an SRAM, a flash memory, a nonvolatile memory, a ROM, an FeRAM, or the like, an organic memory in which an organic material is sandwiched between a pair of electrodes, or the like can be used. In particular, it is preferable to apply a nonvolatile memory in which stored data is not lost even if power is not supplied.

The authentication number storage area 312 may store authentication information including information such as an authentication number, shape, and color.

The reader unit 304 has a function of transmitting radio waves in order to acquire the authentication number of the wireless chip of each block stored in the storage box 300 according to a command from the main body control unit 310. The reader unit 304 has a function of receiving the authentication number of the wireless chip transmitted from each block and storing it in the authentication number storage area 312 of the memory unit 309.

The reader unit 304 has a resonance circuit. The resonant circuit has an antenna and a resonant capacitance. The resonant circuit receives radio waves from the wireless chip of the block.

The input / output interface unit 305 has a function of receiving, as a signal, that the ID acquisition button and the transmission button have been pressed and notifying the main body control unit 310. The input / output interface unit 305 has a function of displaying the assembly procedure data stored in the assembly procedure storage area 313 of the memory unit 309 on the display unit 302 in accordance with a command from the main body control unit 310.

The network interface unit 308 has a function of transmitting the authentication number of the wireless chip of each block stored in the authentication number storage area 312 of the memory unit 309 to the block development server via the Internet according to a command from the main body control unit 310. Have. The network interface unit 308 has a function of storing new assembly procedure data transmitted from the developer server in the assembly procedure storage area 313 of the memory unit 309.

The main body control unit 310 has a function of reading a program from the program storage area 311 of the memory unit 309 and issuing a command to each unit.

Next, a method for taking in the assembly procedure will be described. The following assembly procedure is taken in by the main body control unit 310 executing a program stored in the program storage area 311 of the memory unit 309.

First, in this embodiment, a series of operations of the wireless chip until the storage box 300 acquires the authentication number of the wireless chip necessary for block management will be described with reference to FIG.

The “standby” state in S100 indicates that the wireless chip 200 is waiting for a radio wave from the reader unit 304 of the storage box 300 and is not performing any operation. If the radio wave from the reader unit 304 is not received, the “standby” state is maintained. If a radio wave is received from the reader unit 304, the state transits to the “radio wave reception” state in S101.

In the “radio wave reception” state of S101, the wireless chip 200 receives radio waves from the reader unit 304, the resonance circuit 201 generates an AC signal based on the received radio waves, and the power generation circuit 202 outputs the generated AC signal. Based on the generated AC signal, the clock generation circuit 203 generates a clock signal for each circuit to operate synchronously, and generates power consumed by each circuit based on the generated AC signal. The generated clock signal is supplied to the circuit, the demodulating circuit 204 demodulates the AC signal generated by the resonant circuit 201, generates demodulated data, the reading circuit 206 extracts the read command information from the demodulated data, and the authentication register 208 indicates that the extracted authentication information read command is being sent. Thereafter, the state transits to the “radio wave transmission” state of S102.

In the “radio wave transmission” state of S102, after the authentication register 208 of the wireless chip 200 receives the authentication information read command, the authentication number of the wireless chip 200 is sent to the encoding circuit 207. This indicates that the modulated signal is generated, the modulation circuit 205 modulates the encoded signal, and the resonance circuit 201 transmits data modulated by radio waves to the reader via the antenna. Thereafter, the process returns to the “standby” state of S100 and waits for the next radio wave.

As described above, the reader unit 304 of the storage box 300 can receive the authentication number of the wireless chip 200 of each block, and the storage box 300 can acquire the authentication number of the wireless chip 200 of each block.

Below, in this Embodiment, when the assembly procedure is not stored in the storage box 300, the method of taking in an assembly procedure in the storage box 300 first is demonstrated using FIG.

The “start-up” state in S200 indicates that power is supplied to the storage box 300 and that the program stored in the program storage area 311 of the memory unit 309 has started to be executed by the main body control unit 310. The “start-up” state then transitions to the “display” state in S201.

In the “display” state of S201, when the assembly procedure is not stored in the storage box 300, when the first “display” state is reached, a message indicating that there is no assembly procedure is displayed on the display unit 302. The “display” state then transitions to the “standby” state in S202.

The “standby” state in S202 indicates that the storage box 300 is waiting for the ID acquisition button to be pressed. The display unit 302 does not change from that displayed in S201. If the ID acquisition button is not pressed, the “standby” state is maintained. If the ID acquisition button is pressed, the process proceeds to the “ID acquisition” state of S203.

The “ID acquisition” state in S203 indicates that the authentication number of the wireless chip 200 of each block stored in the storage box is acquired by the reader unit 304 and stored in the authentication number storage area 314 of the memory unit 309. When the storage is completed, the process transits to the “waiting for transmission” state in S204.

The “waiting to send” state in S204 indicates that a message that the authentication number of the wireless chip 200 of each block is sent to the developer server is displayed on the display unit 302, and that the send button is pressed. If the transmission button is not pressed, the “transmission waiting” state is maintained. If the transmission button is pressed, the process transits to the “transmission” state in S205.

The “transmission” state in S205 indicates that the authentication number of the wireless chip 200 is transmitted to the developer server via the Internet via the network interface unit 308. When the transmission is completed, the process transits to the “reception” state in S206.

The “reception” state in S206 indicates that the control device 303 is receiving data of the assembly procedure from the developer server via the Internet, and stores the received data in the assembly procedure storage area 313 of the memory unit 309. Indicates that When the storage is completed, the process transits to the “display” state in S201, and the fetched assembly procedure is displayed.

Incidentally, after the assembly procedure is first taken in, when the power is supplied to the storage box and the “display” state of S201 is reached, the display unit 302 stores the first stored in the assembly procedure storage area 313 of the memory unit 309. The assembly procedure is displayed based on the assembly procedure data fetched in.

In addition, when newly assembling procedure data is fetched, the newly fetched assembling procedure data is overwritten and stored in the assembling procedure storage area 313 of the memory unit 309. Therefore, when power is supplied to the storage box, a newly updated procedure is always displayed on the display unit.

The newly taken assembly procedure data may not be overwritten and stored in the assembly procedure storage area 313 of the memory unit 309. The assembly procedure storage area 313 of the memory unit 309 may store previously acquired assembly procedure data and newly imported assembly procedure data.

In the present embodiment, the assembly procedure is updated as described above.

When a block containing a wireless chip is added, the added block is stored together with the existing block in the storage box, and the new assembly procedure is imported by the method of incorporating the assembly procedure. It can be updated to the assembly procedure used.

In the present embodiment, the configuration in which the assembly procedure is first taken in has been described. However, the assembly procedure data may be stored from the beginning at the time of factory collection.

As described above, according to the present embodiment, by incorporating a wireless chip in a block, the block can be efficiently managed and the assembly procedure can be easily updated.
(Embodiment 2)

In this embodiment, a method for manufacturing a wireless chip attached to a block will be described.

In FIG. 8A, a peeling layer 601, an insulating layer 602, and a semiconductor film 603 are formed in this order over a substrate having an insulating surface (insulating substrate 600). As the insulating substrate 600, a glass substrate, a quartz substrate, a substrate made of silicon, a metal substrate, a plastic substrate, or the like can be used. The insulating substrate 600 may be thinned by polishing. By using a thin insulating substrate, the finished product can be reduced in weight and thickness.

The peeling layer 601 is mainly composed of an element selected from W, Ti, Ta, Mo, Nb, Nd, Ni, Co, Zr, Zn, Ru, Rh, Pd, Os, Ir, and Si. It can be formed from an alloy material or a compound material. For the separation layer, a single-layer structure of the above elements or a stacked structure of the above elements can be used. Such a release layer can be formed by a CVD method, a sputtering method, an electron beam, or the like. In this embodiment, W is formed by a CVD method. At this time, the treatment may be performed with plasma using O ₂ , N _2, or N ₂ O. Then, the peeling process which is a subsequent process can be easily performed. The separation layer 601 can have a single-layer structure or a stacked structure. The peeling layer 601 is not necessarily formed over the entire insulating substrate, and may be selectively formed. That is, the peeling layer 601 only needs to be able to peel off the insulating substrate 600 later, and the region where the peeling layer is formed is not limited.

For the insulating layer 602, an inorganic material such as silicon oxide or silicon nitride can be used. The insulating layer 602 can have a single-layer structure or a stacked structure. By using silicon nitride, entry of an impurity element from the insulating substrate can be prevented. When such a silicon nitride has a laminated structure, it has an effect by being in any one.

For the semiconductor film 603, a material containing silicon can be used. The semiconductor film can be formed by a CVD method or a sputtering method. The crystal structure of the semiconductor film 603 may be amorphous, crystalline, or microcrystalline. Higher crystallinity is preferable because the mobility of the thin film transistor can be increased. In addition, microcrystalline or amorphous is preferable because there is no variation in crystal state between adjacent semiconductor films.

In order to form a crystalline semiconductor film, it may be formed directly on the insulating layer 602, but it is manufactured by heating an amorphous semiconductor film formed on the insulating layer 602. For example, the amorphous semiconductor film is heated using a heating furnace or laser irradiation. As a result, a highly crystalline semiconductor film can be formed. At this time, a metal element that promotes crystallization may be used to lower the heating temperature. For example, the temperature can be lowered by adding nickel (Ni) to the surface of the amorphous semiconductor film and performing heat treatment. As a result, a crystalline semiconductor film can be formed over an insulating substrate with low heat resistance. Note that when laser irradiation is used, the semiconductor film can be selectively heated; therefore, the heating temperature is not limited by the heat resistance of the insulating substrate to be used.

As shown in FIG. 8B, the semiconductor film 603 is processed to have a predetermined shape. For the processing, etching using a mask formed by a photolithography method can be used. For the etching, a dry etching method or a wet etching method can be used.

An insulating layer functioning as the gate insulating film 604 is formed so as to cover the processed semiconductor film. The gate insulating film 604 can be formed using an inorganic material, for example, silicon nitride or silicon oxide. Plasma treatment may be performed before or after the gate insulating film 604 is formed. For the plasma treatment, oxygen plasma or hydrogen plasma can be used. By such plasma treatment, impurities on the gate insulating film formation surface or the gate insulating film surface can be removed.

After that, a conductive layer functioning as the gate electrode 605 is formed over the semiconductor film with the gate insulating film 604 interposed therebetween. The gate electrode 605 can have a single-layer structure or a stacked structure. The gate electrode 605 includes titanium (Ti), tungsten (W), tantalum (Ta), molybdenum (Mo), neodymium (Nd), cobalt (Co), zirconium (Zr), zinc (Zn), ruthenium (Ru). , Rhodium (Rh), palladium (Pd), osmium (Os), iridium (Ir), platinum (Pt), aluminum (Al), gold (Au), silver (Ag), copper (Cu), indium (In) Or an alloy material or a compound material containing the element as a main component can be used.

As shown in FIG. 8C, an insulator functioning as a sidewall 607 is formed on the side surface of the gate electrode 605. The sidewall 607 can be formed using an inorganic material or an organic material. Examples of the inorganic material include silicon oxide and silicon nitride. For example, when silicon oxide is formed so as to cover the gate electrode 605 and isotropic etching is performed, it remains only on the side surface of the gate electrode 605 and can be used as a sidewall. A dry etching method or a wet etching method can be used for the isotropic etching. When the sidewall 607 is processed, the gate insulating film 604 is also removed by etching. As a result, a part of the semiconductor film is exposed.

An impurity element is added to the semiconductor film in a self-aligning manner using the sidewall 607 and the gate electrode 605. As a result, impurity regions having different concentrations are formed in the semiconductor film. That is, a low concentration impurity region 609 provided below the sidewall 607 and a high concentration impurity region 608 formed in the exposed semiconductor film are formed. By having regions with different impurity concentrations in this way, the short channel effect can be prevented.

As shown in FIG. 8D, insulating layers 611 and 612 are formed so as to cover the semiconductor film, the gate electrode, and the like. The insulating layer covering the semiconductor film, the gate electrode, or the like may have a single layer structure, but preferably has a stacked structure as in this embodiment mode. This is because impurities can be prevented from entering by forming the insulating layer 611 using an inorganic material, and by using an inorganic material using a CVD method, dang in a semiconductor film can be formed using hydrogen in the insulating layer 611. This is because the ring bond can be terminated. After that, the insulating layer 612 is formed using an organic material, whereby planarity can be improved. As the organic material, polyimide, acrylic, polyamide, polyimide amide, resist, or benzocyclobutene can be used. In addition, siloxane or polysilazane can be used. Note that siloxane has a skeleton structure of a bond of silicon (Si) and oxygen (O). As a substituent, an organic group containing at least hydrogen (for example, an alkyl group or an aromatic hydrocarbon) is used. A fluoro group may be used as a substituent. Alternatively, an organic group containing at least hydrogen and a fluoro group may be used as a substituent. Polysilazane is formed using a polymer material having a bond of silicon (Si) and nitrogen (N) as a starting material.

After that, a wiring 613 that penetrates the insulating layers 611 and 612 and the gate insulating film 604 and is connected to the impurity region 608 is formed. The wiring 613 can have a single-layer structure or a stacked structure. Titanium (Ti), tungsten (W), tantalum (Ta), molybdenum (Mo), neodymium (Nd), cobalt (Co), zirconium (Zr) ), Zinc (Zn), ruthenium (Ru), rhodium (Rh), palladium (Pd), osmium (Os), iridium (Ir), platinum (Pt), aluminum (Al), gold (Au), silver (Ag) ), Copper (Cu), indium (In), or an alloy material containing the element as a main component. At the same time as the wiring 613, another wiring can be formed over the insulating layer 612. The other wiring corresponds to a routing wiring or the like.

In this manner, a TFT 615 (Thin Film Transistor; a thin film transistor; hereinafter referred to as a TFT) and a TFT group 616 can be formed. A TFT group refers to a collection of TFTs that constitute a circuit having a certain function.

As illustrated in FIG. 9A, the insulating layer 620 is formed over the insulating layer 612. The insulating layer 620 can be formed using an inorganic material, an organic material, or the like similarly to the insulating layers 611 and 612. An opening is formed in the insulating layer 620 and a wiring 621 is formed. The wiring 621 can be formed in a manner similar to that of the wiring 613. The wiring 621 is electrically connected to the wiring 613 in the region 622 through an opening provided in the insulating layer 620. In the region 622, a common electrode of a memory element to be formed later can be grounded. A pad 623 is formed from the same layer as the wiring 621. The pad 623 is electrically connected to the wiring 613 in the region 624 through an opening provided in the insulating layer 620.

As illustrated in FIG. 9B, the insulating layer 630 is formed over the insulating layer 620. The insulating layer 630 can be formed using an inorganic material or an organic material similarly to the insulating layers 611 and 612. Then, an opening is provided in the insulating layer 630. The insulating layer 630 is processed so that the side surface of the opening has an inclination.

An organic compound layer 631 is formed in an opening provided on the TFT 615. The organic compound layer 631 can be formed by an evaporation method or a sputtering method. Such an organic compound layer can be formed from a known electroluminescent material. After that, a wiring 632 is formed so as to cover part of the organic compound layer 631 and the insulating layer 630. The wiring 632 can be formed in a manner similar to that of the wiring 621. A region where the wiring 632 is formed becomes a memory region and a contact region. The wiring 632 serves as a common electrode of the memory element.

As shown in FIG. 9C, an antenna 640 is formed. At this time, the antenna 640 is electrically connected to the pad 623 by thermocompression bonding. In this manner, a wiring region 644 where a lead-out wiring or the like is formed, a memory region 642 where a memory element is formed, an integrated circuit region 643 where a circuit having a specific function is provided, and a pad region 645. A wireless chip having a contact region 646 is formed. The pad area and the memory area may be provided apart from each other to some extent. As a result, data can be written without the memory area being affected by stress when the antenna is crimped in the pad area. Note that the integrated circuit in the integrated circuit region 643 shown here indicates a portion of the circuit included in the wireless chip 200 described in Embodiment 1 except for the antenna of the resonance circuit 201 and the memory of the authentication register 208.

The antenna crimping is preferably performed in a state where the flexibility of the insulating substrate is low. Therefore, in this embodiment mode, a mode in which a thin film transistor is transferred to a film substrate after antenna crimping is shown.

As shown in FIG. 10A, the insulating substrate 600 is peeled by removing the peeling layer 601. The release layer 601 can be removed physically or chemically. For example, the crystal structure of the separation layer 601 can be changed by heat treatment of the semiconductor film or the like. After that, an opening is provided so that a part of the peeling layer 601 is exposed, and the exposed peeling layer 601 is irradiated with laser light. By irradiating the peeling layer 601 with laser light, a trigger for peeling can be given. Then, the insulating substrate and the thin film transistor can be physically peeled off. Furthermore, a thin film transistor or the like may be peeled off naturally from the insulating substrate without applying a special force due to the stress of the film. Alternatively, an opening reaching the peeling layer 601 can be formed, an etching agent can be introduced through the opening, and the peeling layer 601 can be removed using a chemical reaction.

Thereafter, as shown in FIG. 10B, a film substrate 650 is attached. When the surface of the film substrate 650 has adhesiveness, it can be bonded as it is. When there is no adhesiveness, the film substrate 650 can be bonded through an adhesive.

Then, a wireless chip in which a thin film transistor or the like is transferred to the film substrate can be formed. In such a wireless chip, a memory region is integrally formed, and the weight and thickness are reduced, so that the wireless chip can be easily attached to a block.

Further, after removing the release layer 601, it may be attached to the block with an adhesive. By doing so, it is possible to shorten the manufacturing process and cost of the block incorporating the wireless chip.
(Embodiment 3)

In this embodiment, unlike the above embodiment, a method for manufacturing a wireless chip formed over a glass substrate will be described.

In the above embodiment mode, a method for manufacturing a wireless chip in which the peeling layer 601 is formed and the thin film transistor is transferred to the film substrate by peeling the peeling layer 601 has been described. However, the wireless chip of the present invention can be formed directly on a glass substrate.

A wireless chip formed over a glass substrate is preferably formed using a silicon nitride film as a protective film on the top surface.

Further, when it is desired to reduce the thickness, the glass substrate may be polished. For example, the surface of the glass substrate on which the thin film transistor is not formed is polished by a CMP method or the like. As a result, in the wireless chip, it is possible to reduce the thickness of the glass substrate that is generally the thickest, and to reduce the thickness of the entire wireless chip.

Wireless chips can be manufactured on a glass substrate in this way because it is possible to crystallize at low temperatures by using metal elements that promote crystallization and laser irradiation in the manufacturing process of crystalline semiconductor films of thin film transistors. This is because it was possible to prevent the glass from being heated.
(Embodiment 4)

In this embodiment, a structure of a wireless chip having a coiled antenna is described.

FIG. 11A is a top view of a wireless chip having a coiled antenna. The wireless chip 200 includes a memory region 642 and an integrated circuit region 643 in the center of the film substrate 650, and a coiled antenna 648 is provided so as to surround them. The coiled antenna is an antenna provided in a rectangular shape and has four or more corners. Such an antenna has a state of being wound in a coil shape so that its diameter increases from the center toward the outside.

A pad 623 for connecting to the resonance capacitor of the resonance circuit 201 is preferably provided at the tip of the antenna 648. This is because data can be written without being affected by the stress when the coiled antenna is crimped.

This embodiment can be freely combined with any of the other embodiments. For example, a wireless chip can be formed by transferring a thin film transistor from an insulating substrate to a film substrate 650.

FIG. 11B is a cross-sectional view taken along line AB of such a wireless chip. In the cross-sectional view taken along the line AB, the wireless chip has antennas 648 on both sides, and a contact region 646, a memory region 642, an integrated circuit region 643, and a pad region 645 are provided in order from one antenna 648.

A TFT 615, a TFT group 616, and the like are provided over the film substrate 650 with an insulating layer 602 interposed therebetween as in the above embodiment. A memory element 633 is formed over the TFT 615, and an insulating layer 630 for partitioning the memory element 633 is provided over the memory region 642 and the integrated circuit region 643.

An opening is provided in the insulating layer, a pad 623 is formed, and an antenna 640 is provided so as to be pressure-bonded to the pad.

It is the figure which showed the block of this invention. It is the figure which showed the structure of the wireless chip which the block of this invention contains. It is the figure which showed the management table of authentication information. It is the figure which showed the storage box of this invention. It is the figure which showed the control apparatus which the storage box of this invention contains. It is the figure which showed the flowchart of this invention. It is the figure which showed the flowchart of this invention. It is the figure which showed the production method of the radio | wireless chip which the block of this invention contains. It is the figure which showed the production method of the radio | wireless chip which the block of this invention contains. It is the figure which showed the production method of the radio | wireless chip which the block of this invention contains. The figure which showed the top view and sectional drawing of the wireless chip which the block of this invention contains

Explanation of symbols

100 block 200 wireless chip 201 resonance circuit 202 power generation circuit 203 clock generation circuit 204 demodulation circuit 205 modulation circuit 206 readout circuit 207 encoding circuit 208 authentication register 300 storage box 301 storage unit 302 display unit 303 control unit 304 reader unit 305 input / output Interface unit 306 ID acquisition button 307 Send button 308 Network interface unit 309 Memory unit 310 Main body control unit 311 Program storage area 312 Authentication number storage area 313 Procedure storage area 314 Authentication number storage area 600 Insulating substrate 601 Release layer 602 Insulating layer 603 Semiconductor film 604 Gate insulating film 605 Gate electrode 607 Side wall 608 Impurity region 609 Impurity region 611 Insulating layer 612 Insulating layer 613 Wiring 615 TFT
616 TFT group 620 Insulating layer 621 Wiring 622 region 623 Pad 624 region 630 Insulating layer 631 Organic compound layer 632 Wiring 633 Memory element 640 Antenna 642 Memory region 643 Integrated circuit region 644 Wiring region 645 Pad region 646 Contact region 648 Antenna 650 Film substrate 700 Certification number 701 Certification number

Claims (7)

A block having a wireless chip and a storage box for the block;
The storage box has a function of storing the block,
The storage box has a function of acquiring information of the wireless chip,
The storage box has a function of communicating the acquired information via the Internet,
The toy block set, wherein the storage box has a display unit for displaying information received via the Internet. In claim 1,
The toy block set, wherein the wireless chip is attached to the block. In claim 1 or claim 2,
The toy block set, wherein the wireless chip includes a thin film transistor formed on an insulating substrate. In claim 3,
The toy block set, wherein the insulating substrate is a film substrate. A management method for a toy block set comprising a wireless chip built into a block and a storage box,
The wireless chip includes a resonance circuit, a power generation circuit, a clock generation circuit, a demodulation circuit, a readout circuit, an authentication register, an encoding circuit, and a modulation circuit,
The resonant circuit generates an AC signal with radio waves received from the storage box,
The power generation circuit generates power from the AC signal,
The clock generation circuit generates a clock signal from the AC signal,
The demodulation circuit demodulates the AC signal and transmits demodulated data to the readout circuit,
The read circuit transmits an authentication number read command included in the demodulated data to the authentication register,
The authentication register transmits an authentication number unique to the wireless chip to the encoding circuit by the authentication number read command,
The encoding circuit transmits an authentication signal encoding the authentication number to the modulation circuit,
The toy block set management method, wherein the modulation circuit manages the block by transmitting modulation data obtained by modulating the authentication signal to the resonance circuit. In claim 5,
The storage box includes a block storage unit, a display unit that displays an assembly procedure of the block, and a control device that controls the storage box,
The control device includes a reader unit that can transmit and receive the authentication signal to and from the wireless chip. In claim 6,
A control method for a toy block set, wherein the control device receives and updates an assembly procedure via the Internet.

Images