JP2007182623A5 - - Google Patents

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Publication number
JP2007182623A5
JP2007182623A5 JP2006276055A JP2006276055A JP2007182623A5 JP 2007182623 A5 JP2007182623 A5 JP 2007182623A5 JP 2006276055 A JP2006276055 A JP 2006276055A JP 2006276055 A JP2006276055 A JP 2006276055A JP 2007182623 A5 JP2007182623 A5 JP 2007182623A5
Authority
JP
Japan
Prior art keywords
copper thin
metal
thin film
film
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006276055A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007182623A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006276055A priority Critical patent/JP2007182623A/ja
Priority claimed from JP2006276055A external-priority patent/JP2007182623A/ja
Priority to PCT/JP2006/324525 priority patent/WO2007066751A1/ja
Priority to US12/096,519 priority patent/US20080257746A1/en
Publication of JP2007182623A publication Critical patent/JP2007182623A/ja
Publication of JP2007182623A5 publication Critical patent/JP2007182623A5/ja
Pending legal-status Critical Current

Links

JP2006276055A 2005-12-08 2006-10-10 金属薄体の製造方法 Pending JP2007182623A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006276055A JP2007182623A (ja) 2005-12-08 2006-10-10 金属薄体の製造方法
PCT/JP2006/324525 WO2007066751A1 (ja) 2005-12-08 2006-12-08 金属薄体の製造方法
US12/096,519 US20080257746A1 (en) 2005-12-08 2006-12-08 Method for Producing Metal Thin Body

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005355354 2005-12-08
JP2006276055A JP2007182623A (ja) 2005-12-08 2006-10-10 金属薄体の製造方法

Publications (2)

Publication Number Publication Date
JP2007182623A JP2007182623A (ja) 2007-07-19
JP2007182623A5 true JP2007182623A5 (cg-RX-API-DMAC7.html) 2008-11-20

Family

ID=38122896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006276055A Pending JP2007182623A (ja) 2005-12-08 2006-10-10 金属薄体の製造方法

Country Status (3)

Country Link
US (1) US20080257746A1 (cg-RX-API-DMAC7.html)
JP (1) JP2007182623A (cg-RX-API-DMAC7.html)
WO (1) WO2007066751A1 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5387034B2 (ja) 2009-02-20 2014-01-15 大日本印刷株式会社 導電性基板
KR101318051B1 (ko) * 2010-04-30 2013-10-14 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 플렉시블 배선판용 적층체
KR20140009322A (ko) * 2011-01-26 2014-01-22 스미토모 베이클리트 컴퍼니 리미티드 프린트 배선판 및 프린트 배선판의 제조 방법
JP5346965B2 (ja) * 2011-02-08 2013-11-20 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
JP2014194522A (ja) * 2013-02-26 2014-10-09 Ricoh Co Ltd 定着ベルト用基材、定着ベルト、定着装置、および、画像形成装置
JP7283544B2 (ja) * 2019-07-04 2023-05-30 住友電気工業株式会社 プリント配線板及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10039171A1 (de) * 2000-08-10 2002-02-28 Consortium Elektrochem Ind Kathode für Elektrolysezellen
AU2002248343A1 (en) * 2001-01-12 2002-08-19 University Of Rochester Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features

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